Cutting tape and adhesive layer for semiconductor device manufacturing adhesive tape

Abstract

1. The name of the design product: cutting tape and adhesive layer of adhesive tape for semiconductor device manufacturing. 2. The use of the design product: used as an adhesive tape used in the manufacturing process of semiconductor devices; the use of partial design is used as a cutting tape and adhesive layer of adhesive tape for semiconductor device manufacturing. 3. The design points of the design product: in shape. 4. The picture or photo that best shows the design points: design 1 perspective view. 5. Design 1 is designated as the basic design. 6. Other circumstances that need to be explained: in design 1 reference figure 1 and design 1 reference figure 2, a is the base material, b is the adhesive layer, c is the cutting tape, d is the adhesive layer, e is the PET release film, f is the product name display part; in design 1, the cutting tape is transparent; in the front view of design 1, the product is continuous on both sides; in design 2 reference figure 1 and design 2 reference figure 2, a is the base material, b is the adhesive layer, c is the cutting tape, d is the adhesive layer, e is the PET release film, f is the product name display part; in design 2, the cutting tape is transparent; in design 2, the length of the article is indicated by double-dot chain line and the drawing method is omitted.

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