Submicron flip chip bonder
CN309741928SActive Publication Date: 2026-01-20SHENZHEN HONGXIN MICRO GRP TECH CO LTD
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Patent Information
- Application Number
- CN202530325234.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-06
- Publication Date
- 2026-01-20
- Estimated Expiration
- 2040-06-06
Smart Images
Figure 000007_ABST
Abstract
1. The name of the design product: sub-micron flip-chip bonder. 2. The use of the design product: for mounting chips or micro devices on a substrate or package carrier and completing the bonding process. 3. The design points of the design product: in shape. 4. The picture or photo that best shows the design points: perspective view.
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