Module packaging (ACP-3S Plus+)
CN309753465SActive Publication Date: 2026-01-27HEFEI ARCHIMEDES ELECTRONIC TECH CO LTD
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Patent Information
- Application Number
- CN202530350836.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-18
- Publication Date
- 2026-01-27
- Estimated Expiration
- 2040-06-18
Smart Images
Figure 000007_ABST
Abstract
1. Name of the product in this design: Module Package (ACP-3S Plus+). 2. Application of this design: Power module for 1000V systems, 100 to 120kW photovoltaic inverters. 3. The key design features of this product are the combination of shape and pattern. 4. The image or photograph that best illustrates the design's key points: 3D view 1.
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