Blister positive and negative pressure forming and high frequency heat sealing integrated machine

CN309753897SActive Publication Date: 2026-01-27丁晨
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Patent Information

Application Number
CN202530371695.3
Authority / Receiving Office
CN · China
Patent Type
Designs(China)
Current Assignee / Owner
Filing Date
2025-06-26
Publication Date
2026-01-27
Estimated Expiration
2040-06-26

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Abstract

1. Name of the product in this design: Integrated machine for positive and negative pressure molding and high-frequency heat sealing of blister packs. 2. Application of this design: Used in blister packaging machines for positive and negative pressure forming and high-frequency heat sealing and punching. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: a 3D model.
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