Chip (black ceramic surface mount 20-wire package with bent structure)
CN309832123SActive Publication Date: 2026-03-06FUJIAN CHUANGXIN MICRO-ELECTRONICS CO LTD
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Patent Information
- Application Number
- CN202530449772.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-31
- Publication Date
- 2026-03-06
- Estimated Expiration
- 2040-07-31
Smart Images
Figure 000002_ABST
Abstract
1. Name of the product in this design: Chip (Black ceramic surface mount 20-wire package with bent structure). 2. Application of this design: Chips for electronic products. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key features: the front view.
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