LED multi-chip integrated package (HK-35CG-D)
CN309849460SActive Publication Date: 2026-03-17ANHUI ZIXIN SEMICON TECH CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-03
- Publication Date
- 2026-03-17
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Figure 000009_ABST
Abstract
1. The name of the design product: LED multi-chip integrated package (HK-35CG-D). 2. The use of the design product: for multi-chip parallel package. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: design 1 perspective view. 5. Design 1 is designated as the basic design. 6. Other circumstances that need to be explained: the bottom view, front view, rear view, left view, and right view of design 2 are the same as design 1; the bottom view, front view, rear view, left view, and right view of design 3 are the same as design 1; the bottom view, front view, rear view, left view, and right view of design 4 are the same as design 1; the bottom view, front view, rear view, left view, and right view of design 5 are the same as design 1; the bottom view, front view, rear view, left view, and right view of design 6 are the same as design 1; the bottom view, front view, rear view, left view, and right view of design 7 are the same as design 1; the bottom view, front view, rear view, left view, and right view of design 8 are the same as design 1; the bottom view, front view, rear view, left view, and right view of design 9 are the same as design 1; the bottom view, front view, rear view, left view, and right view of design 10 are the same as design 1, and the above views are omitted.
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