High temperature wireless temperature measurement wafer sensor
CN309866406SActive Publication Date: 2026-03-24SHANGHAI GND ETECH CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-05
- Publication Date
- 2026-03-24
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Figure 000007_ABST
Abstract
1. The name of the design product: high temperature wireless temperature measuring wafer sensor. 2. The use of the design product: measuring disc surface temperature. 3. The design points of the design product: the combination of shape and pattern. 4. The picture or photo that best shows the design points: perspective view.
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