High-speed die-bonding swing arm
CN309918469SActive Publication Date: 2026-04-14SHENZHEN XINYICHANG TECH CO LTD
View PDF 0 Cites 0 Cited by
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- SHENZHEN XINYICHANG TECH CO LTD
- Filing Date
- 2025-09-09
- Publication Date
- 2026-04-14
Smart Images
Figure 000007_ABST
Abstract
1. Name of the product in this design: High-speed die-bonded swing arm. 2. Purpose of this design: Used in die bonders to pick up chips and attach them to a packaging substrate for fixing, connecting, and packaging. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: 3D view 1.
Need to check novelty before this filing date? Find Prior Art