Thermal insulation felt packaging box (irregular shape)
CN309924820SActive Publication Date: 2026-04-17LIAONING AOYIDA NEW MATERIALS CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- LIAONING AOYIDA NEW MATERIALS CO LTD
- Filing Date
- 2025-08-22
- Publication Date
- 2026-04-17
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Figure 000007_ABST
Abstract
1. Name of the product in this design: Thermal Insulation Felt Packaging Box (Irregular Shape). 2. Application of this design: It is mainly used in the packaging of silicon carbide semiconductor epitaxial main felt and arc-shaped thermal insulation felt. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: a 3D model.
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