Semiconductor packaging (GaN-IC)
CN309927870SActive Publication Date: 2026-04-17ZHUJI NITROGEN SILICON TECH CO
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- ZHUJI NITROGEN SILICON TECH CO
- Filing Date
- 2025-10-24
- Publication Date
- 2026-04-17
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Figure 000007_ABST
Abstract
1. Name of the product in this design: Semiconductor package (GaN-IC). 2. Application of this design: This design is used in power electronic circuits to realize power control and switching functions, and can be applied to equipment such as new energy vehicles and industrial frequency converters. 3. The key design feature of this product is its shape. 4. The picture or photo that best illustrates the key design points: Design 1 3D diagram 1. 5. Design 1 is designated as the basic design.
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