Locking mechanism for interconnect module components (including interconnect modules, ring sockets and their components)

CN309936200SActive Publication Date: 2026-04-21SAMTEC INC
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Designs(China)
Current Assignee / Owner
SAMTEC INC
Filing Date
2023-08-09
Publication Date
2026-04-21

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Abstract

1. Name of the product in this design: Locking mechanism for interconnect module assembly (including interconnect module, ring socket and its components). 2. Intended use of this design: The overall intended use is for interconnect module assemblies, including interconnect modules configured to mate with ring sockets, and ring sockets configured to mate with interconnect modules. Specifically, it is used for components having interconnect modules in the form of optical transceivers, module housings of interconnect modules, components of interconnect modules in the form of electrical transceivers, components of ring sockets, lockers of ring sockets, and cable locking mechanisms for interconnect modules in the form of optical transceivers. The local design is a locking mechanism for interconnecting module components. 3. The key design feature of this product is its shape. 4. The picture or photo that best illustrates the key design points: Design 1 3D diagram 1. 5. Design 1 is designated as the basic design. 6. Other situations requiring explanation: The shadow rendering section is a local design subject that requires protection. Dashed lines are not part of the design for which protection is sought.
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