Heat sink (AKJ-S1)
CN309955861SActive Publication Date: 2026-05-01SHENZHEN ALMIGHTY BANG TECH CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- SHENZHEN ALMIGHTY BANG TECH CO LTD
- Filing Date
- 2025-09-11
- Publication Date
- 2026-05-01
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Figure 000007_ABST
Abstract
1. Name of the product in this design: Heat sink (AKJ-S1). 2. Purpose of this design: For heat dissipation of chips or heat-generating electronic components. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: a 3D model.
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