Memory module heatsink (DDR4)
CN309963329SActive Publication Date: 2026-05-05SHENZHEN AOLITONG TECHNOLOGY CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- SHENZHEN AOLITONG TECHNOLOGY CO LTD
- Filing Date
- 2025-10-24
- Publication Date
- 2026-05-05
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Figure 000007_ABST
Abstract
1. Name of this product design: Memory module heatsink (DDR4 heatsink). 2. Purpose of this design: To be installed on a memory module to assist in heat dissipation. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: a 3D model.
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