The main body of the plasma chamber with a substrate support assembly.

CN309963574SActive Publication Date: 2026-05-05LAM RES CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Designs(China)
Current Assignee / Owner
LAM RES CORP
Filing Date
2025-01-02
Publication Date
2026-05-05

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Abstract

1. Name of the product in this design: The main body of the carrier ring with substrate support assembly for a plasma chamber. 2. Application of this design: This product is used as a whole in semiconductor manufacturing equipment, and in part in the plasma chamber of semiconductor manufacturing equipment as a carrier ring with substrate support components. 3. The key design feature of this product is its shape. 4. The picture or photo that best illustrates the key design points: Design 1 combined state 3D diagram. 5. Design 1 is designated as the basic design. 6. Other situations requiring explanation: Component 1 is the carrier ring, and component 2 is the substrate support component for the carrier ring. The combined state corresponds to installing 3 substrate support components in the carrier ring; the dotted lines in the figure represent the parts that do not require protection.
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