Main body of adhesive sheet for semiconductor manufacturing

Abstract

1. Name of the design product: main body of an adhesive sheet for semiconductor manufacturing. 2. Use of the design product: used as an adhesive sheet in semiconductor manufacturing, in use, the PET release film is peeled off, and a semiconductor wafer is adhered to a bonding layer; use of the partial design: used as the main body of an adhesive sheet for fixing a semiconductor wafer, the PET release film is cut at the edge of the base material, a preformed bonding layer is placed directly on the PET release film, compared with the traditional method of cutting the bonding layer on the PET release film, waste is reduced and productivity is improved. 3. Design points of the design product: the shape shown in the partial design. 4. Picture or photograph best indicating the design points: front view. 5. Other circumstances that need to be explained: in the drawings, numbers 1-4 represent the adhesive layer, the base material, the bonding layer, and the PET release film, respectively, wherein the adhesive layer, the base material, and the PET release film are transparent components. In addition, the left and right sides of the product are continuous without a limited boundary.

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