Electromechanical heat sink (cryogenic refrigeration)
CN310019591SActive Publication Date: 2026-06-05QINGDAO LIEN HARDWARE CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- QINGDAO LIEN HARDWARE CO LTD
- Filing Date
- 2025-12-03
- Publication Date
- 2026-06-05
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Figure 000003_ABST
Abstract
1. Name of the designed product: electromechanical heat dissipation plate (low temperature refrigeration). 2. Use of the designed product: for heat dissipation of electromechanical equipment. 3. Design points of the designed product: in shape. 4. Picture or photo best showing the design points: perspective view 1.
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