High-current electromigration measurement module
CN310022663SActive Publication Date: 2026-06-09SHANGHAI LIANDIAN XINCHUANG ELECTRONIC TECHNOLOGY CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- SHANGHAI LIANDIAN XINCHUANG ELECTRONIC TECHNOLOGY CO LTD
- Filing Date
- 2025-12-11
- Publication Date
- 2026-06-09
Smart Images
Figure 000005_ABST
Abstract
1. Name of the product in this design: High Current Electromigration Measurement Module. 2. Purpose of this design: To evaluate the reliability of bonding in the chip bonding process and to measure the electromigration phenomenon that occurs when a chip is subjected to a large current. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: a 3D model.
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