Double-layer heat dissipation fin module and right front end portion of double-layer heat dissipation fin module

CN310170228SActive Publication Date: 2026-08-25DELTA ELECTRONICS INC(CN)
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202630104476.3
Authority / Receiving Office
CN · China
Patent Type
Designs(China)
Current Assignee / Owner
Priority Date
2025-10-14
Filing Date
2026-03-10
Publication Date
2026-08-25
Estimated Expiration
2041-03-10

Smart Images

  • Figure 000001_ABST
    Figure 000001_ABST
Patent Text Reader

Abstract

1. Name of the product in this design: Double-layer heat sink module and the right front end of the double-layer heat sink module. 2. Purpose of this design: This design is used for heat dissipation. 3. The key design features of this product are the shape of the solid lines. 4. The picture or photo that best illustrates the key design points: Design 1 3D diagram 1. 5. Design 1 is designated as the basic design. 6. Other situations requiring explanation: Designs 1, 3, and 5 are double-layer heat dissipation fin modules and represent the overall appearance design; Designs 2, 4, and 6 are the right front end of the double-layer heat dissipation fin module and represent partial appearance designs. The parts for which protection is requested are the solid line parts in the views, and the dashed line parts are not for protection; the dotted lines in the views of Designs 2, 4, and 6 only indicate the boundary lines between the parts for which protection is requested and other parts.
Need to check novelty before this filing date? Find Prior Art