Double-layer heat dissipation fin module and right front end portion of double-layer heat dissipation fin module
CN310170228SActive Publication Date: 2026-08-25DELTA ELECTRONICS INC(CN)
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Patent Information
- Application Number
- CN202630104476.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Priority Date
- 2025-10-14
- Filing Date
- 2026-03-10
- Publication Date
- 2026-08-25
- Estimated Expiration
- 2041-03-10
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Figure 000001_ABST
Abstract
1. Name of the product in this design: Double-layer heat sink module and the right front end of the double-layer heat sink module. 2. Purpose of this design: This design is used for heat dissipation. 3. The key design features of this product are the shape of the solid lines. 4. The picture or photo that best illustrates the key design points: Design 1 3D diagram 1. 5. Design 1 is designated as the basic design. 6. Other situations requiring explanation: Designs 1, 3, and 5 are double-layer heat dissipation fin modules and represent the overall appearance design; Designs 2, 4, and 6 are the right front end of the double-layer heat dissipation fin module and represent partial appearance designs. The parts for which protection is requested are the solid line parts in the views, and the dashed line parts are not for protection; the dotted lines in the views of Designs 2, 4, and 6 only indicate the boundary lines between the parts for which protection is requested and other parts.
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