chip
CN310170962SActive Publication Date: 2026-08-25SHENZHEN BEYOND DEEP SPACE TECHNOLOGY CO LTD
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- CN202630187015.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2026-04-20
- Publication Date
- 2026-08-25
- Estimated Expiration
- 2041-04-20
Smart Images
Figure 000007_ABST
Abstract
1. Name of the design product: chip. 2. Use of the design product: the shell of packaging chip, protecting internal circuit elements. 3. Design points of the design product: in shape. 4. Picture or photo that best shows the design points: perspective view.
Need to check novelty before this filing date? Find Prior Art