Ceramic electronic component

Abstract

Ceramic electronic component, comprising: a ceramic sintered body (10) having upper and lower surfaces (13, 14) and at least two side surfaces (11, 12) connecting the upper and lower surfaces (13, 14), and having a plurality of ceramic dielectric layers (15, 16), internal electrically conductive layers (20) formed in the ceramic sintered body (10), and external electrodes (30) which are electrically connected to the internal electrically conductive layers (20), wherein each of the external electrodes (30) comprises: a first electrode layer (31) extending from one of the side surfaces (11, 12) of the ceramic sintered body (10) to parts of the upper and lower surfaces (13, 14), an electrically conductive resin layer (32) covering the first electrode layer (31), and a second electrode layer (33) covering the electrically conductive resin layer (32) and having a length O that is greater than the length L of the first electrode layer (31), the lengths L and O extending from one of the side surfaces (11, 12) of the ceramic sintered body (10) to the parts of the upper and lower surfaces (13, 14), wherein the distance C from the upper surface (13) or the lower surface (14) of the ceramic sintered body (10) to the next layer of the internal electrically conductive layers (20) is greater than or equal to the length L of the first electrode layer (31) from one of the side surfaces (11, 12) of the ceramic sintered body (10) to the parts of the upper and lower surfaces (13, 14), wherein the distance C from the upper and lower surfaces (13, 14) of the ceramic sintered body (10) to the next internal electrically conductive layer (20) is between 10% and 25% of the length O of the second electrode layer (33), wherein the length L of the first electrode layer (31) from one of the side surfaces (11, 12) of the ceramic sintered body (10) to the parts of the upper and lower surfaces (13, 14) is between 5% and 25% of the length O of the second electrode layer (33).

Description

The present invention relates to ceramic electronic devices, and more particularly to ceramic electronic devices which offer a high degree of reliability in thermal shock resistance and flexural strength.Generally, electronic components including ceramic materials such as capacitors, inductors, piezoelectric elements, varistors or thermistors include a ceramic sintered body made of a ceramic material, internal electrodes formed in the ceramic sintered body, and external electrodes formed on the surfaces of the ceramic sintered body to be connected to the internal electrodes.A ceramic electronic component configured as a multilayer chip capacitor (hereinafter also referred to as "MLCC") includes a plurality of dielectric layers stacked one on top of the other, internal electrodes disposed opposite to each other, one of the dielectric layers being interposed between each pair of internal electrodeslayers and external electrodes electrically connected to the internal electrodes.An MLCC offers advantages of compact construction, high capacity and ease of assembly, so that it is frequently used in mobile communication devices such as computers, PDAs and mobile phones.For use, the MLCC is mounted on a printed circuit board. More specifically, a circuit board 1 has conductive lands 2 and 3 formed thereon as shown in FIG. 1, on which solder grooves 4 and 5 are formed by soldering, respectively. External electrodes 7 and 8 of a multilayer chip capacitor 6 are electrically connected to the conductive webs 2 and 3, respectively, via the solder fillets 4 and 5.When the MLCC is mounted on the circuit board by soldering and the circuit board is cut, thermal shocks and shear loads are transmitted to the MLCC. When thermal shock and shear stress are transferred, a crack may occur in the MLCC. In addition, the external and internal electrodes of the MLCC are simply shrunk and stretched relative to the ceramic material. These shrinkage and strain stresses concentrate at the interface between the external electrodes and the ceramic layers, so that a crack may occur at this interface between the external electrodes and the ceramic layers. Further, a warp of the circuit board may cause a crack on the mounting surface of the MLCC and at the interface between the external electrodes and the ceramic layers.A circuit board on which the MLCC is mounted may be used in aviation, automotive or consumer electronics applications. When a temperature variation acts on such a circuit board, a stress caused by a warp or a thermal shock is transmitted to the interface between the external electrodes and the ceramic layers of the MLCC, so that a crack may occur.When the stress is transferred to the interface between the external electrodes and the ceramic layers, a crack occurs there and propagates in the body of the MLCC. The crack can propagate towards the internal electrodes. When the crack reaches the internal electrodes, a short circuit may occur in the MLCC, which may result in a loss of function on an electronic device.Korean Patent Application Laid-Open KR 10 2006 0 082 671 A discloses a method for improving thermal and mechanical reliability of a multilayer chip capacitor by ensuring that the length of the external electrodes is greater than a predetermined amount. However, when the MLCC manufactured using such a method is mounted on a circuit board two or more times using a reflow soldering method, a crack occurs at the interface between the external electrodes and the ceramic layers. And, when a strong external force is applied to the circuit board on which the MLCC is mounted so that the circuit board is bent by more than 2 mm, a crack occurs at the interface between the external electrodes and the ceramic layers of the MLCC, thereby reducing the electrostatic capacity.In the prior art, when external electrodes of a multilayer chip capacitor are mounted on the conductive lands of a circuit board, a separate metal terminal is used to reduce the occurrence of voltages. The use of the additional metal terminal causes difficulties in the assembly process. And the production of the additional element can also be problematic.JP H10-284 343 A discloses a ceramic electronic component comprising a ceramic sintered body, wherein external electrodes each having a first electrode layer, a conductive resin layer and a second electrode layer are provided on each of the longitudinal sides in the end direction, the first electrode layer extending on the upper and lower surfaces of the ceramic sintered body.There is a need for a method that enables greater mechanical reliability in terms of thermal shock resistance and flexural strength under the given use environment of an MLCC.An aspect of the present invention provides a ceramic electronic component having high mechanical reliability in terms of thermal shock resistance and flexural strength.According to an aspect of the present invention, there is provided a ceramic electronic component comprising: a ceramic sintered body having upper and lower surfaces and at least two side surfaces connecting the upper and lower surfaces and having a plurality of ceramic dielectric layers; internal electrically conductive layers formed in the ceramic sintered body; and external electrodes electrically connected to the internal electrically conductive layers. Each of the external electrodes may include: a first electrode layer extending from one of the side surfaces of the ceramic sintered body to portions of the upper and lower surfaces; an electrically conductive resin layer covering the first electrode layer; and a second electrode layer covering the electrically conductive resin layer and having a length greater than the length of the first electrode layer, wherein the lengths L and O extend from one of the electrically conductive resin layers.Side surfaces of the ceramic sintered body extend to the parts of the upper and lower surfaces. The distance from the upper surface or the lower surface of the ceramic sintered body to the next one of the internal electrically conductive layers is equal to or larger than the length of the first electrode layer from one of the side surfaces of the ceramic sintered body to the parts of the upper and lower surfaces. The distance from the upper and lower surfaces of the ceramic sintered body to the next internal conductive layer is between 10% to 25% of the length of the second electrode layer. The length of the first electrode layer from one of the side surfaces of the ceramic sintered body to the parts of the upper and lower surfaces is between 5% and 25% of the length of the second electrode layer. The length of the first electrode layer from one of the side surfaces of the ceramic sintered body to the parts of the upper and lower surfaces may be between 5% and 25% of the length of the second electrode layer.The length of the first electrode layer from one of the side surfaces of the ceramic sintered body to the parts of the upper and lower surfaces may be between 25 μm and 125 μm.The distance from the upper surface or the lower surface of the ceramic sintered body to the next internal electrically conductive layer may be between 40 μm and 150 μm.The ceramic electronic component can be a multilayer chip capacitor. The ceramic sintered body may be formed by laminating a plurality of ceramic dielectric layers. The internal conductive layers may include at least one pair of internal electrodes disposed opposite to each other with one of the ceramic dielectric layers therebetween and each having opposite polarities. The external electrodes may be connected to one end of one electrode of the pair of internal electrodes and to one end of the other electrode of the pair of internal electrodes, respectively.The above and other aspects and advantages of the present invention will become apparent from the following detailed description with reference to the accompanying drawings. FIG. 1 is a schematic cross-sectional view showing a prior art multilayer chip capacitor mounted on a printed circuit board. FIG. 2 is a schematic cross-sectional view showing a ceramic electronic component according to an exemplary embodiment of the present invention.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.The described embodiments serve merely to clarify the invention to the person skilled in the art. In the drawings, the shapes and dimensions may be exaggerated for clarity. Like reference numerals are used throughout to refer to identical components.The invention relates to ceramic electronic components. The ceramic electronic components may be capacitors, inductors, piezoelectric elements, varistors, or thermistors. Hereinafter, a multilayer chip capacitor (hereinafter also referred to as "MLCC") will be described as an example of such electronic devices.FIG. 2 is a schematic cross-sectional view of a multilayer chip capacitor according to an exemplary embodiment of the present invention.A multilayer chip capacitor according to an exemplary embodiment of the present invention includes a ceramic sintered body 10 having an upper surface 13, a lower surface 14, and at least two side surfaces 11 and 12 connecting the upper surface 13 to the lower surface 14, internal conductive layers formed in the ceramic sintered body 10, and external electrodes 30 electrically connected to the internal conductive layers.The ceramic sintered body 10 is formed by laminating a plurality of ceramic dielectric layers 15 and 16 and has internal electrodes 20 formed therein. In the ceramic sintered body 10, the upper and lower surfaces are formed by ceramic dielectric layers 15. The adjacent ceramic dielectric layers are integrated with each other such that no interface is visible.The internal conductive layers may include at least one pair of internal electrodes 20 having opposite polarities, respectively. The pair of internal electrodes 20 are arranged opposite to each other in the lamination direction of the ceramic dielectric layers with one of the ceramic dielectric layers 16 interposed therebetween. One end of each internal electrode 20 is exposed alternately at the side surfaces 11 and 12 of the ceramic sintered body.A pair of external electrodes 30 are connected to one end of one electrode of the pair of internal electrodes 20 and to one end of the other electrode of the pair of internal electrodes 20, respectively. The pair of external electrodes 30 has a multilayer structure including a pair of first electrode layers 31, a pair of conductive resin layers 32, and a pair of second electrode layers 33.The pair of first electrode layers 31 are electrically connected to the pair of internal electrodes 20, respectively. The first electrode layer 31 extends from one of the side surfaces 11 or 12 of the ceramic sintered body 10 to part the upper and lower surfaces 13 and 14.The pair of conductive resin layers 32 respectively cover the pair of first electrode layers. The pair of second electrode layers 33 respectively cover the pair of conductive resin layers 32. each second electrode layer 33 extends to the upper and lower surfaces 13 and 14 for a distance larger than the length of the first electrode layer 31 from one of the side surfaces 11 or 12 of the ceramic sintered body 10 to parts of the upper and lower surfaces 13 and 14. That is, the length L of the first electrode layer 31 is smaller than the length O of the second electrode layer 33, the lengths L and O extending from one of the side surfaces 11 or 12 of the ceramic sintered body 10 to portions of the upper and lower surfaces 13 and 14.Further, the distance C from the upper surface 13 or the lower surface 14 of the ceramic sintered body 10 to the lowermost electrode of the internal electrodes 20 is equal to or larger than the length L of the first electrode layer 31.The ceramic materials of the ceramic sintered body 10 can be selected in accordance with various requirements of ceramic electronic devices. The ceramic sintered body of an MLCC as an example of a ceramic electronic component is formed by laminating a plurality of ceramic dielectric layers as described above. The ceramic dielectric layers are formed of dielectric materials containing ceramic materials. The ceramic materials included in the dielectric materials may have a high dielectric constant. The ceramic materials may be BaTiO 3- based materials, Pb complex perovskite based materials, or SrTiO 3- based materials. However, the invention is not limited thereto.The internal electrodes 20 may be formed of conductive materials such as Ni or a Ni alloy. The Ni alloy may contain Mn, Cr, Co or Al together with Ni.Specifically, the ceramic sintered body can be formed by the following method.A ceramic powder containing BaTiO 3 as a main component and a binder is mixed into a slurry, from which ceramic green sheets are then produced. A conductive paste containing Ni as a main component is then applied to the prepared ceramic green sheets to form the internal electrode patterns. The ceramic green sheets on which internal electrode patterns are not formed and the ceramic green sheets on which internal electrode patterns having an electrostatic capacity are formed are laminated over each other in a thickness direction and compressed under heat to produce a ceramic laminate having internal electrodes formed therein.Such a ceramic laminate is cut to a predetermined chip size and fired at 1100°C to 1300°C in an N 2- H 2- atmosphere. The ceramic laminate is then cut to the predetermined chip size to have two opposing side surfaces and upper and lower surfaces connecting the side surfaces together.As described above, the pair of external electrodes 30, which are respectively connected to one end of one electrode among the pair of internal electrodes 20 and one end of the other electrode among the pair of internal electrodes 20, have the multilayer structure including the pair of first electrode layers 31, the pair of conductive resin layers 32, and the pair of second electrode layers 33.The pair of first electrode layers 31 each extend from one of the side surfaces 11 or 12 of the ceramic sintered body 10 to the parts of the upper and lower surfaces 13 and 14, and the pair of first electrode layers 31 is electrically and mechanically connected to the pair of internal electrodes 20. The pair of first electrode layers 31 are formed of conductive metals that make satisfactory electrical connection to the pair of internal electrodes 20. For example, Ag, Ni, Cu, or an alloy thereof may be used.The pair of first electrode layers 31 are formed by applying a conductive paste with a glass frit from the side surfaces 11 and 12 of the ceramic sintered body 10 to the parts of the upper and lower surfaces 13 and 14. The pair of first electrode layers 31 are fired at 780° C. in a nitrogen atmosphere to be mechanically and electrically connected to the pair of internal electrodes 20.The pair of conductive resin layers 32 respectively cover the pair of first electrode layers 31. The thermosetting resin may be a phenol resin or an epoxy resin. A conductive filler may be a silver-coated copper powder.The pair of electrically conductive resin layers 32 respectively cover the pair of first electrode layers 31.Because the thermosetting resin is flexible, the pair of conductive resin layers 32 with the thermosetting resin can reduce the stress.The pair of electrically conductive resin layers 32 may include a curing agent together with the thermosetting resin. The use of the curing agent helps to form the crosslinked structure of the thermosetting resin. The hardener may be a phenol resin, an amine, an acid anhydride or the like, the use of which is well known as a hardener for the thermosetting resin.The pair of second electrode layers 33 respectively cover the pair of conductive resin layers. The pair of second electrode layers 33 may be formed on the pair of conductive resin layers 32 using a wet plating technique such as electroplating.Each second electrode layer 33 may include two layers, specifically, an Ni electrode layer 33 aand an Sn electrode layer 33 b. These Ni and Sn electrode layers 33a and 33b provide satisfactory electrical connection between the external electrodes 30 and the conductive lands of the circuit board.The length L of the first electrode layer 31 is smaller than the length O of the second electrode layer 33, the lengths L and O extending from one of the side surfaces 11 or 12 of the ceramic sintered body 10 to the parts of the upper and lower surfaces 13 and 14.Because glass components react in a conductive metal paste applied to the first electrode layer 31 and the ceramic of the ceramic sintered body 10, a fragile reaction layer is formed at the boundary layer between the first electrode layer 31 and the ceramic sintered body 10. Further, the materials of the first electrode layer 31 can be easily shrunk or stretched by thermal shock in relation to ceramic materials. When a mechanical stress is applied to the interface between the first electrode layer 31 and the ceramic sintered body 10, a crack may be generated there, which propagates in the ceramic sintered body 10.For example, when the stress is transmitted due to wobbling of the circuit board on which the MLCC is mounted, a crack may propagate from the end of the first electrode layer 31 to the internal electrodes 20. When the crack reaches the internal electrodes 20, a short circuit may occur in the MLCC.However, when the length L of the first electrode layer 31 is small as in this embodiment, the interface between the first electrode layer 31 and the ceramic dielectric layers 15 becomes smaller, so that the elongation or shrinkage caused by the heat is reduced, thereby reducing the risk of cracking.And, as the length L of the first electrode layer 31 is smaller, the connection areas between the conductive resin layer 32 and the ceramic dielectric 15 layers are larger. Thereby, the conductive resin layer 32 can be made to sufficiently reduce the stress concentrated at the interface between the first electrode layer 31 and the ceramic dielectric layers 15.Further, as described above, the ceramic sintered body 10 is formed by laminating a plurality of laminated dielectric layers 15 and 16 with at least a pair of internal electrodes 20 having a ceramic layer 16 interposed therebetween, and the ceramic dielectric layers 15 are formed to form the upper and lower surfaces of the ceramic sintered body 10. That is, the upper and lower surfaces 13 and 14 of the ceramic sintered body 10 are formed by the ceramic dielectric layers 15. The distance C from the upper surface 13 or the lower surface 14 of the ceramic sintered body 20 is equal to or larger than the length L of the first electrode layer 31.When a thermal shock or a bending stress is applied to the MLCC mounted on the circuit board, the stress concentrates on the interface between the first electrode layer 31 and the ceramic dielectric layers 15, so that a crack may occur. Such a crack may propagate toward the internal electrodes. According to this embodiment, when the distance C from the upper surface 13 or the lower surface 14 of the ceramic sintered body 10 to the next electrode of the internal electrodes 20, i.e., the thickness of the ceramic dielectric layers 15 on the outer surface is equal to or larger than the length L of the first electrode layer L, propagation of a crack in the internal electrodes 20 can be prevented. Thereby, a short circuit that may be caused by a crack in the internal electrodes 20 can be prevented.Specifically, the length L of the first electrode layer 31 from one of the side surfaces 11 or 12 of the ceramic sintered body 10 to the parts of the upper and lower surfaces 13 and 14 may be between 5% and 25% of the length O of the second electrode layer 33. The length L of the first electrode layer 31 may be determined in accordance with the chip size. For example, the length L of the first electrode layer 31 from one of the side surfaces 11 or 12 of the ceramic sintered body 10 to the parts of the upper and lower surfaces 13 and 14 may be between 25 μm and 125 μm.When the length L of the first electrode layer 31 is 25 μm or more and the length O of the second electrode layer 33 is larger than the length L of the first electrode layer 31, the length L of the first electrode layer 31 to the upper and lower surfaces 13 and 14 of the ceramic sintered body 10 is small, thereby reducing expansion or shrinkage due to heat. Further, the areas where the stress can be reduced by the conductive resin layer 32 are larger, so that cracks hardly occur at the interface between the first electrode layer 31 and the ceramic dielectric layers 15. When the length L of the first electrode layer 31 is less than 25 μm, the first electrode layer 31 is not electrically and mechanically connected to the internal electrodes 20, so that the electrostatic capacity can be reduced.And, when the distance C from the upper surface 13 or the lower surface 14 of the ceramic sintered body 10 to the rearmost electrode of the internal electrodes 20 is less than 125 μm and a crack occurs at the interface between the first electrode layer 31 and the ceramic sintered body 10, the crack may propagate to the regions where the internal electrodes 20 are formed. However, when the distance C from the upper surface 13 or the lower surface 14 of the ceramic sintered body 10 to the next electrode of the internal electrodes 20 is equal to or greater than 125 μm, a crack may occur, but the crack does not propagate to the regions where the internal electrodes 20 are formed.Preferably, the distance C from the upper surface 13 or the lower surface 14 of the ceramic sintered body 10 to the next electrode of the internal electrodes may be between 40 μm and 150 μm.Examples of the invention and comparative examples are described in detail below. These examples are intended to aid in the understanding of the invention, but the invention is by no means limited to the examples described.In a first example, a ceramic powder was mixed with BaTiO 3 as a main component and a binder to form a slurry, and then raw ceramic plates were produced using a doctor blade method. A conductive paste containing Ni as a main component was applied to the prepared ceramic green sheets using a screen printing method, so that internal electrode patterns were formed. Five layers of internal electrodes were laminated and compressed under heat to form an MLCC laminate. This MLCC laminate was then cut to 1.6 mm x 0.8 mm and fired at 1250°C in an N 2- H 2- atmosphere to produce a ceramic sintered body of the MLCC. A conductive paste with a glass frit was dipped and coated from the side surfaces of the ceramic sintered body to portions of the upper and lower surfaces, so that a pair of first electrode layers were formed. The pair of first electrode layers were fired at 780° C. in a nitrogen atmosphere and mechanically connected to the inner electrodes.Then, curable compounds including epoxy resin and conductive materials were applied on the pair of first electrode layers by dipping, dried and cured to form a pair of conductive resin layers. Using an electroplating method, a pair of Ni electrode layers were formed on the pair of conductive resin layers, and then a pair of Sn electrode layers were formed thereon to form a pair of second electrode layers. The length L of the first electrode layer was between 5% and 25% (L / O) of the length O of the second electrode layer, the lengths L and O extending from one of the side surfaces of the ceramic sintered body to portions of the upper and lower surfaces. The distance C from the upper and lower surfaces of the ceramic sintered body to the corresponding next internal electrodes was between 10% and 25% (C / O) of the length O of the second electrode layer, so that it was larger than the length L of the first electrode layer.In a first comparative example prepared in the same manner as in the example of the invention, the length L of the first electrode layer was 2.5% (L / O) of the length O of the second electrode layer, and the distance C from the upper and lower surfaces of the ceramic sintered body to the corresponding next internal electrodes was 5% (C / O) of the length O of the second electrode layer.In a second comparative example prepared in the same manner as in the example of the invention, the length of the first electrode layer was 50% (L / O) of the length O of the second electrode layer, and the distance C from the upper and lower surfaces of the sintered body to the corresponding next internal electrodes was 10% to 25% (C / O) of the length O of the second electrode layer so as to be smaller than the length L of the first electrode layer.In a third comparative example prepared in the same manner as in the example of the invention, the length L of the first electrode layer was equal to the length of the conductive resin layer, and the distance C from the upper and lower surfaces of the ceramic sintered body to the corresponding next internal electrodes was 10% to 25% (C / O) of the length O of the second electrode layer so as to be smaller than the length L of the first electrode layer.Fifty MLCCs in total were prepared as Examples and Comparative Examples and mounted on a printed circuit board in accordance with IEC Standard 60068-2-21.The standard test method AECQ-200-REV. C Method-005 (plate bending test) provides a maximum plate bending of 2 mm, while the present invention evaluates the amount of plate bending with respect to 10 mm. When there were one or more samples whose electrostatic capacitance was decreased by 5% or more at a plate bending of 10 mm, it was considered that decrease in electrostatic capacitance occurred. On the other hand, when no sample whose electrostatic capacity was decreased by 5% or more was present, it was considered that no decrease in electrostatic capacity occurred. These results are summarized in Table 1. [Table 1] Table 1] [Table 1] Table 1]Examples of the invention5%10%X is X25%25%X is XComparative Example 12,5%5%O. OComparative Example 250%10%O. O50%25%O. OComparative Example 3100%10%O. O100%25%O. OAs described above, although plate bending occurs due to thermal and mechanical stresses, the MLCC is manufactured such that the length O of the second electrode layer is larger than the length L of the first electrode layer and the distance C from the upper and lower surfaces of the ceramic sintered body to the corresponding next internal electrodes is larger than the length L of the first electrode layer, so that no decrease in electrostatic capacity occurs in the MLCC and thermal and mechanical reliability is improved.As explained above, according to the exemplary embodiments of the invention, in the ceramic electronic component, the length of the first electrode layer is smaller than the length of the second electrode layer, so that the area in which the conductive resin layer can reduce the stress is larger. Thus, even if the ceramic electronic component is mounted on the circuit board and mounted in a high temperature environment, cracks hardly occur under the influence of mechanical stresses and thermal shocks. And when cracks occur, these cracks do not propagate to the internal electrodes, so that the electrostatic capacity is not lowered.

Claims

A ceramic electronic component comprising: a ceramic sintered body (10) having upper and lower surfaces (13, 14) and at least two side surfaces (11, 12) connecting the upper and lower surfaces (13, 14), and having a plurality of ceramic dielectric layers (15, 16), internal electrically conductive layers (20) formed in the ceramic sintered body (10), and external electrodes (30) electrically conductively connected to the internal electrically conductive layers (20), wherein each of the external electrodes (30) comprises: a first electrode layer (31) extending from one of the side surfaces (11, 12) of the ceramic sintered body (10) to portions of the upper and lower surfaces (13, 14), an electrically conductive resin layer (32) covering the first electrode layer (31), and a second electrode layer (33) covering the electrically conductive resin layer (32) and having a length O, which is greater than the length L of the first electrode layer (31), wherein the lengths L and O extend from one of the side surfaces (11, 12) of the ceramic sintered body (10) to the parts of the upper and lower surfaces (13, 14), wherein the distance C from the upper surface (13) or the lower surface (14) of the ceramic sintered body (10) to the next layer of the internal electrically conductive layers (20) is greater than or equal to the length L of the first electrode layer (31) from one of the side surfaces (11, 12) of the ceramic sintered body (10) to the parts of the upper and lower surfaces (13, 14), wherein the distance C from the upper and lower surfaces (13, 14) of the ceramic sintered body (10) to the next internal electrically conductive layer (20) is between 10% and 25% of the length O of the second electrode layer (33), wherein the length L of the first electrode layer (31) from one of the side surfaces (11, 12) of the ceramic sintered body (10) to the parts of the upper and lower surfaces (13, 14) is between 5% and 25% of the length O of the second electrode layer (33).Ceramic electronic component according to claim 1, characterised in that the length L of the first electrode layer (31) from one of the side surfaces (11, 12) of the ceramic sintered body (10) to the parts of the upper and lower surfaces (13, 14) is between 25 μm and 125 μm.Ceramic electronic component according to Claim 1, characterized in that the distance C from the upper surface (13) or the lower surface (14) of the ceramic sintered body (10) to the next layer of the internal electrically conductive layers (20) is between 40 μm and 150 μm.The ceramic electronic component according to claim 1, characterized in that the ceramic electronic component is a multilayer chip capacitor, wherein the ceramic sintered body (10) is formed by laminating a plurality of ceramic dielectric layers (15), the internal electrically conductive layers (20) include at least one pair of internal electrodes (20) disposed opposite to each other with one of the ceramic dielectric layers (15) therebetween and each having opposite polarities, and the external electrodes (30) are each connected to one end of one of the pair of internal electrodes (20) and to one end of the other of the pair of internal electrodes (20).

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