Optoelectronic component and method for manufacturing an optoelectronic component
Patent Information
- Application Number
- DE102014112739
- Authority / Receiving Office
- DE · DE
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2014-09-04
- Publication Date
- 2025-04-10
- Estimated Expiration
- 2034-09-04
Smart Images

Figure 00000000_0000_ABST
Abstract
Description
The present application relates to an optoelectronic component and a method for producing an optoelectronic component.The publication DE 10 2006 047 433 A1 describes a light-emitting device and a method for producing the same.The publication DE 10 2009 044 262 A1 describes an OLED and a method for producing the same.The publication DE 10 2012 203 637 A1 describes an organic optoelectronic component and a method for producing an organic optoelectronic component.The publication DE 10 2012 109 218 A1 describes a method for producing an optoelectronic assembly and an optoelectronic assembly.The document WO 2009 / 001 241 A1 discloses an organic functional component and a method for producing the same.The document WO 2005 / 106 573 A1 describes a liquid crystal display and a method for producing the same.An organic light-emitting diode (OLED) generally has an organic functional layer stack and a cover layer arranged on the layer stack. In particular in the case of diodes of large-area design, the cover layer can be bent towards the layer stack on account of its own weight or external mechanical effects, as a result of which the cover layer presses on the layer stack and damage the latter over a large area.In order to avoid such damage, a distance between the cover layer and the layer stack can be increased. However, this disadvantageously leads to an increase in the overall thickness of the diode. In addition, the stability of the diode is impaired by the increased distance and an increased cavity, which is produced as a result, between the cover layer and the layer stack. Alternatively, the publication EP 1 238 306 A1 describes components with randomly distributed spacers between the cover layer and the layer stack. However, when the cover layer is acted upon by an external force, these spacers press directly onto the layer stack and damage not only a portion of the layer stack covered by the spacers but also its surroundings, which possibly leads to damage of the layer stack over a large area and thus to non-uniformity with respect to a luminance distribution and an increased risk of short circuit.One object is to specify a particularly thin and mechanically stable optoelectronic component with a more uniform distribution of the luminance. As a further object, a simplified and reliable method for producing an optoelectronic component is specified.According to at least one embodiment of the component, the latter has a functional layer stack. The functional layer stack contains, in particular, a plurality of organic layers. For example, the organic layers are arranged one above the other. The functional layer stack has, for example, an organic active layer for generating electromagnetic radiation. In particular, the organic active layer emits electromagnetic radiation during operation of the component, in particular in the ultraviolet, visible or infrared spectral range.The functional layer stack has, for example, an organic layer embodied as a hole transport layer and an organic layer embodied as an electron transport layer. In particular, the organic active layer is arranged between the hole transport layer and the electron transport layer.According to at least one embodiment of the component, the latter has a carrier body. The functional layer stack is arranged on the carrier body. The carrier body contains, for example, glass or consists of glass. The carrier body has, in particular, a radiation exit surface of the component on a side facing away from the layer stack. In this case, the carrier body is transparent to the electromagnetic radiation generated during operation of the component. "Transparent to the generated radiation" means that in particular at least 70%, preferably at least 80%, particularly preferably at least 90%, of the generated electromagnetic radiation is transmitted.According to at least one embodiment of the component, the latter has a first electrode. For example, the first electrode is arranged directly on the carrier body. In the vertical direction, the first electrode is arranged in particular between the carrier body and the functional layer stack. A vertical direction is understood to mean a direction which is directed perpendicularly to a main plane of extent of the carrier body or of the first electrode. The first electrode serves for energizing the functional layer stack during operation of the component.The first electrode is transparent, for example, to the electromagnetic radiation generated during operation of the component. In particular, the first electrode has a first electrode layer which contains or consists of a transparent conductive oxide (TCO), for example.According to at least one embodiment of the component, the first electrode has a plurality of conductor tracks (busbars). For example, the conductor tracks comprise a metal, for example copper or silver. For example, the conductor tracks are arranged directly on a side of the first electrode layer facing away from the carrier body. In particular, the first electrode has a network of intersecting conductor tracks with branching points, wherein the conductor tracks intersect or meet at the branching points. A branching point is understood to mean a point at which at least two or three or four conductor tracks intersect or meet with different lateral orientations. A lateral direction or orientation is understood to mean a direction which is directed in particular parallel to the main extension plane of the carrier body or of the first electrode. The vertical direction and the lateral direction are thus perpendicular to each other. The conductor tracks effectively increase the electrical transverse conductivity of the first electrode. A particularly uniform current distribution on the first electrode layer can be achieved by a suitable distribution of the conductor tracks.According to at least one embodiment of the component, the latter has a plurality of spacers. The spacers are, for example, each arranged on one of the branching points and cover it at least partially or completely. The spacers are arranged in the vertical direction, for example, between the first electrode and the functional layer stack. In the lateral direction, the spacers are each spaced apart from one another. In particular, the spacers each cover only one branching point. However, it is also possible for a spacer to cover more than one branching point along a conductor track.According to at least one embodiment of the component, the latter has a cover layer. The functional layer stack is arranged in particular between the cover layer and the first electrode. In particular, the functional layer stack is arranged in regions between the cover layer and the spacers. The cover layer contains, for example, glass or consists thereof. Alternatively, the cover layer can be formed from a radiation-opaque material.The optoelectronic component has a cover layer, a first electrode, a functional layer stack arranged between the cover layer and the first electrode, and a plurality of spacers. The functional layer stack has an organic active layer for generating electromagnetic radiation. The functional layer stack is arranged in regions between the cover layer and the spacers. The first electrode has conductor tracks with branching points, wherein the spacers are each arranged on one of the branching points. For example, the device is an OLED.If external pressure is exerted on the cover layer, it can be supported on the spacers, whereby the mechanical stability of the component is significantly increased. For example, the spacers are designed to be electrically insulating. The layer stack is in particular not, or not directly, energized by the first electrode at its regions overlapping with the spacers. Even if these regions of the layer stack are damaged by the application of an external force to the cover layer, this has little or no influence on a uniform distribution of the luminance and the efficiency of the component. A risk of short circuit between the first electrode and a further electrode arranged on the spacer can also be largely ruled out.According to at least one embodiment of the component, the latter has a cavity between the covering layer and the functional layer stack. For example, the spacers are vertical protrusions in the cavity. The spacers are in particular adjacent to the first electrode. The cavity prevents the cover layer from being pressed onto at least a large part of the functional layer stack, as a result of which damage to the functional layer stack or to the further layers of the component applied to the layer stack is prevented. In addition, compared to conventional components, for example frit-encapsulated components or components with cavity glass cover layers, a total height of the component with spacers is reduced with constant stability and avoidance of possible damage to the layer stack caused by the pressing on of the cover layer.According to at least one embodiment of the component, the spacers cover a total of at most 5%, for example at most 3% or at most 1%, of a total area of the radiation exit surface, in a plan view of the carrier body. Such a distribution of the spacers on the branching points, in which the spacers cover only a small portion of the radiation exit surface, which portion is substantially already covered by the conductor tracks, in plan view of the carrier body, has no or hardly any negative influence on the efficiency of the component with respect to the radiation decoupling and thus ensures a uniform distribution of the luminance on the radiation exit surface.According to at least one embodiment of the component, the cover layer has a cavity. In particular, the cover layer has a surface facing the layer stack, which surface forms a bottom surface of the cavity. In particular, the bottom surface of the cavity of the cover layer is also a bottom surface of the cavity formed in the component.According to at least one embodiment of the component, the latter has a second electrode. In particular, the functional layer stack and the spacers are arranged between the first electrode and the second electrode. For example, the second electrode is designed to be reflective for the radiation generated during operation of the component. The second electrode serves for energizing the functional layer stack during operation of the component.According to at least one embodiment of the component, the organic active layer is formed continuously. In a plan view of the first electrode, the organic active layer covers the spacers and the branching points, for example completely. In particular, both the first electrode and the second electrode are each configured continuously.According to at least one embodiment of the device, the cover layer is free of direct physical contact with the spacers. For example, a surface of the cover layer facing the layer stack is free from direct physical contact with the spacers or with a connecting layer, for example an adhesive layer, between the cover layer and the spacers. This means that the spacers are in particular not fastened to the cover layer. It is also possible that the entire surface of the cover layer facing the layer stack is only adjacent to an air layer in the normal state of the component, and the cover layer is supported directly or indirectly on the spacers only in the event of a deformation caused by an external force effect on the cover layer.According to at least one embodiment of the component, the functional layer stack completely covers the spacers in plan view of the first electrode. In particular, the spacers are completely surrounded by the functional layer stack in lateral directions. For example, the functional layer stack simulates a contour of the spacers in regions. Simulating the contour of the spacers increases a surface area of a light-emitting layer, namely the organic active layer of the layer stack.For example, the spacer has the contour of a cuboid, a cylinder or a truncated cone. It is also possible for the spacers to have in each case the shape of adjoining geometric bodies, for example cuboids, cylinders, cones or truncated cones. To increase the stability, the spacer can have a lower cross section facing the first electrode and an upper cross section facing the cover layer, wherein the lower cross section is larger than the upper cross section. Alternatively, the lower cross section can be smaller than the upper cross section, whereby a proportion of the radiation exit surface covered by the spacers is reduced.According to at least one embodiment of the component, the spacers each have a first part and a second part. In particular, the second part has a smaller cross section compared to the first part. For example, the second part with the smaller cross section is arranged between the first part and the covering layer. Such a configuration ensures the stability of the spacers and minimizes the proportion of the layer stack between the spacers and the cover layer, which could possibly be damaged by the cover layer being pressed onto the spacers.According to at least one embodiment of the component, the first electrode comprises an electrode layer made of a transparent conductive material, for example indium tin oxide (ITO). In particular, the conductor tracks are arranged directly on the first electrode layer. The conductor tracks can form a rectangular grid, in particular a square grid, or a hexagonal grid with branching points. A rectangular or hexagonal grid of conductor tracks ensures a homogeneous distribution of the current density on the first electrode. Such a configuration of the conductor tracks with regularly distributed branching points and the spacers arranged thereon additionally ensures a particularly high mechanical stability of the component.According to the method for producing an optoelectronic component, which comprises a cover layer, a first electrode with conductor tracks and branching points, a functional layer stack and a plurality of spacers, firstly a carrier body, which in particular comprises glass or consists of glass, is provided. The first electrode is formed on the support body. The spacers are formed on the branch points of the first electrode. In particular, the spacers each cover one of the branching points. The layer stack is then applied both to the first electrode and to the spacers. This means that the layer stack is applied to the first electrode, in particular after the formation of the spacers. Finally, the cover layer is applied to the carrier body, such that the functional layer stack is arranged in regions between the cover layer and the spacers. The spacers each have a first part and a second part, wherein the second part has a smaller cross section compared to the first part and is arranged between the first part and the covering layer.According to at least one embodiment of the method, the functional layer stack is applied to the spacers in such a way that the functional layer stack simulates a contour of the spacers in regions. In particular, the layer stack can be applied layer by layer to the first electrode and to the spacers by means of a coating method, for example by vapor deposition.According to at least one embodiment of the method, an electrically insulating material, for example a lacquer layer, is applied in places to the first electrode in order to form the spacers by means of a printing method, for example a screen printing method, an inkjet printing method or a pad printing method. In particular, the electrically insulating material is applied only to the branching points at which the conductor tracks intersect or meet.Such a specific production of spacers on the branching points of the first electrode can be realized without great effort. The use of the spacers significantly increases the stability of the component. If the cover layer has a cavity, a depth of the cavity and thus a total height of the component can be reduced without the layer stack or further layers applied to the layer stack, for example the second electrode and the protective layer, being damaged by the pressing on of the cover layer.The method described in the present application is particularly suitable for producing a component described above. Features described in connection with the component can therefore also be used for the method and vice versa.Further advantages, preferred embodiments and developments of the optoelectronic component and of the method result from the exemplary embodiments explained below in connection with FIGS. 1 to 3B. The following are shown: FIG. 1 shows a schematic illustration of an exemplary embodiment of an optoelectronic component, FIGS. 2A and 2B show schematic representations of an electrode of an optoelectronic component with spacers arranged thereon, FIGS. 3A and 3B show further exemplary embodiments of an optoelectronic component in schematic sectional view.Identical, similar or identically acting elements are provided with the same reference numerals in the figures. The figures are schematic representations in each case and are therefore not necessarily true to scale. Rather, comparatively small elements and in particular layer thicknesses can be represented with exaggerated size for clarity.A first exemplary embodiment of an optoelectronic component is schematically illustrated in FIG. 1.The optoelectronic component 10 comprises a carrier body 1, a first electrode 2 arranged on the carrier body 1, a functional layer stack 6 arranged on the first electrode 2 and a cover layer 9. In the vertical direction, the functional layer stack 6 is arranged between the covering layer 9 and the first electrode 2. In particular, the layer stack 6 is encapsulated as hermetically as possible or as hermetically as possible by the cover layer 9 and the carrier body 1.The carrier body 1 is, for example, radiation-transmissive, in particular transparent to radiation generated during operation of the component 10, and has a radiation exit surface 11 of the component 10 on a side facing away from the layer stack 6. This means that the radiation generated during operation of the component 10 leaves the component 10 at the radiation exit surface 11. The cover layer 9 can also comprise a metal.The functional layer stack 6 has an organic active layer 63. The active layer 63 emits electromagnetic radiation during operation of the component, for example in the ultraviolet, visible or infrared spectral range. The layer stack 6 also includes a first charge transport layer 61 and a second charge transport layer 62, and the organic active layer 63 is disposed between the first charge transport layer 61 and the second charge transport layer 62 in the vertical direction. In particular, the organic active layer 63 directly adjoins the first and second charge transport layers. The first and second charge transport layers may be formed as an electron transport layer and a hole transport layer, respectively, for injecting holes and electrons into the organic active layer 63.In addition to the first electrode 2, the component has a second electrode 3 for electrically contacting the layer stack 6. The layer stack 6 is arranged between the first electrode 2 and the second electrode 3, wherein the first and the second electrode each adjoin one of the charge transport layers of the layer stack 6. The first electrode 2 has a first connection point 20 which is arranged laterally of the layer stack 6 in the lateral direction. In particular, the conductor tracks 22 cover the connection point 20. The second electrode 3 has a second connection point 30, wherein the second connection point 30 is likewise arranged laterally of the layer stack 6 and is laterally spaced apart from the first connection point 20. In FIG. 1, both the first connection point 20 and the second connection point 30 are arranged directly on the carrier body 1 of the component 10. The component 10 can be connected to an external current source via the first and second connection points.The first electrode 2 includes a first electrode layer 21. The first electrode layer 21 may include transparent conductive materials, which are, for example, transparent conductive oxides such as metal oxides such as zinc oxide, tin oxide, cadmium oxide, indium oxide, or indium tin oxide (ITO).The first electrode 2 has a plurality of conductor tracks 22. The conductor tracks 22 are arranged on a side of the first electrode layer 21 facing the layer stack 6. In particular, the first electrode 2 has a network of intersecting conductor tracks 22 and branching points 23, wherein the conductor tracks 22 intersect or meet at the branching points 23.The optoelectronic component 10 comprises a plurality of spacers 4. The spacers 4 are each arranged on one of the branching points 23. In a plan view of the first electrode 2, the spacers 4 each cover the corresponding branching point at least partially or completely. Outside the covering regions of the branching points 23, the component is free of the spacers 4 in particular. Such a distribution of the spacers 4 has no or hardly any negative influence on the efficiency with respect to the radiation decoupling of the optoelectronic component 10, since, in a plan view of the carrier body 1, the spacers 4 substantially only cover locations of the radiation exit surface 11 which are already covered by the conductor tracks 22.The spacers 4 are vertical elevations on the first electrode 2. To form the spacers 4, a layer of an electrically insulating material, for example a lacquer layer, can be applied in places on the first electrode 2, in particular in a targeted manner on the branching points 23, for example by means of a printing method. In the vertical direction, the spacers 4 are arranged between the first electrode 2 and the layer stack 6 with the electrode 3 arranged thereon. The first electrode 2 and the second electrode 3 are each configured, for example, continuously and are in particular free of structured sites, for example free of holes or recesses in the respective electrodes.The second electrode 3 can be applied in particular by means of a coating method, for example by physical or chemical vapor deposition, for example directly onto the layer stack 6. The second electrode 3 is designed to be reflective in particular for the radiation emitted during operation of the component 10. For example, the second electrode 3 reflects at least 70%, for example at least 80% or 90%, of the radiation impinging on the second electrode in the direction of the radiation exit surface 11.In particular, after the formation of the spacers 4, the layer stack 6 can be applied layer by layer to the first electrode 2 and to the spacers 4 by means of a coating method, for example by physical or chemical vapor deposition. In the lateral direction, the layer stack 6 may be formed between a first insulation structure 51 and a second insulation structure 52. In a plan view of the first electrode 2, the functional layer stack 6 completely covers the spacers 4. In lateral directions, the spacers 4 are completely surrounded by the functional layer stack 6.In FIG. 1, the organic active layer 63 is formed continuously and completely covers the spacers 4 and the branching points 23 in a plan view of the first electrode. The functional layer stack 6 simulates a contour of the spacers 4 in regions. Thus, the functional layer stack 6 with the organic active layer 63 likewise has vertical elevations at locations of the spacers 4. Such vertical elevations enlarge a surface of the radiation-emitting organic active layer 63, as a result of which comparatively more radiation is generated during operation of the component.The functional layer stack 6 is arranged in regions between the cover layer 9 and the spacers 4. The layer stack 6 and the second electrode 3 have regions which overlap with the spacers 4 in a plan view of the first electrode 2. At the overlapped portions, a vertical distance between the first electrode 2 and the second electrode 3 is increased. Even if the overlapped regions of the layer stack 6 and of the second electrode 3 arranged thereon are damaged by the action of an external force on the cover layer 9, a risk of short circuit due to the increased distance between the electrodes and in particular due to the electrical insulation by the spacers 4 can be largely ruled out.The component 10 also has a protective layer 7. The protective layer 7 can be formed as an encapsulation layer which prevents the penetration of air or moisture into the functional layer stack 6. The protective layer 7 can also be formed in such a way that it protects the functional layer stack 6 from external mechanical influences. In FIG. 1, the protective layer 7 is arranged between the cover layer 9 and the functional layer stack 6. The protective layer 7 directly adjoins the second electrode 3.The component 10 has a cavity 8 which is formed between the cover layer 9 and the functional layer stack. In particular, the cavity 8 is free of a material in the solid aggregate state. For example, the cavity 8 is filled with air.The cover layer 9 is formed as a cavity cover layer. This means that the cover layer 9 itself has a cavity or is designed in the form of a cavity. In FIG. 1, the cover layer 9 is arranged in such a way that the cavity of the cover layer 9 comprises the cavity 8 formed in the component 10. The cover layer has a surface 91 facing the layer stack 6, which forms both a bottom surface of the cavity of the cover layer 9 and a bottom surface of the cavity 8 of the component 10.In FIG. 1, the cover layer 9 is free from direct physical contact with the spacers 4. Further layers, in particular different from a fastening layer, are arranged in the vertical direction between the spacers 4 and the cover layer 9, namely the functional layer stack 6, the second electrode 3 and the protective layer 7.In FIG. 1, the surface 91 of the cover layer 9 facing the layer stack 6 adjoins a layer applied to the spacers 4, the protective layer 7. The cover layer 9 is thus supported in regions on the spacers 4. Such a configuration increases the mechanical stability of the optoelectronic component 10 with respect to external force effects. Possible damage to the layer stack 6 outside the regions of the spacers 4 can also be avoided to a large extent in this way.FIG. 2A shows a schematic illustration of an exemplary embodiment of a first electrode with spacers arranged thereon.The first electrode 2 has a first electrode layer 21 with conductor tracks 22 arranged thereon. The conductor tracks 22 intersect at the branching points 23 and thereby form a rectangular grid on the first electrode layer 21, The conductor tracks 22 can be applied structured to the first electrode layer 21 by means of a printing method or a coating method. Alternatively, the conductor tracks can first be applied over a large surface area and subsequently structured.The spacers 4 are laterally spaced apart from one another and each cover a single branching point 4. However, it is also possible for the spacer 4 to only partially cover the associated branching point 23. In FIG. 2A, all the branching points 23 are each covered by a spacer 4. However, it is possible that only a part of the branching points 23 is covered by the spacers 4.In particular, in a plan view of the carrier body 1, the spacers 4 cover a total of at most 5%, for example at most 3% or at most 1%, of a total area of the radiation exit surface 11.FIG. 2B shows a schematic illustration of a further first electrode with spacers arranged thereon for an optoelectronic component.This exemplary embodiment corresponds substantially to the exemplary embodiment in FIG. 2A. In contrast to this, the first electrode 2 has a hexagonal grid of conductor tracks 22 with branching points 23. By such a configuration of the conductor tracks 22 and such an arrangement of the spacers 4, a particularly stable component with a particularly uniform current distribution on the first electrode 2 can be achieved.A further exemplary embodiment of an optoelectronic component 10 is schematically illustrated in FIG. 3A in a sectional view.This exemplary embodiment corresponds substantially to the exemplary embodiment shown in FIG. 1. In contrast to this, the surface 91 of the covering layer 9 facing the layer stack 6 is free of any physical contact with the layers applied to the spacers 4 or to the first electrode 2. In particular, the component 10 has an air gap between these layers and the surface 91 of the cover layer. That is, the entire surface 91 of the cover layer is adjacent to an air layer.In FIG. 3A, the surface 91 of the covering layer 9 facing the layer stack 6 is a bottom surface of the cavity 8, and in the normal state the covering layer 9 therefore does not bear on the spacers 4, but rather only with a sufficiently large force effect on the covering layer 9. while in FIG. 1 the intrinsic weight of the covering layer 9 is already partially supported by the spacers 4 in the normal state, it is not the case according to the exemplary embodiment in FIG. 3A. Such a configuration reduces a pressure exerted on the protective layer 7, on the second electrode 2 and on the functional layer stack 6 when an external force acts on the cover layer.A further exemplary embodiment of an optoelectronic component 10 is schematically illustrated in FIG. 3B in a sectional view.This exemplary embodiment corresponds substantially to the exemplary embodiment shown in FIG. 1. In contrast, the spacer 4 has a first part 41 and a second part 42. The second part 42 has a smaller cross section compared to the first part 41, and is arranged between the first part 41 and the cover layer 9. The first part 41 and the second part 42 can be formed from the same material, for example in the form of a lacquer layer, or can comprise different materials. In FIG. 3B, the spacer 4 is formed in two pieces. In addition, it is possible for the spacer 4 to be formed in one piece or in multiple pieces. The spacer 4 can also have the shape of a cuboid, a cylinder, a cone, a truncated cone or other geometric shapes. In FIG. 3B, the functional layer stack 6, the second electrode 3 and the protective layer 7 reproduce a contour of the spacers 4 in regions.
Claims
Optoelectronic component (10) having a cover layer (9), a first electrode (2), a functional layer stack (6) arranged between the cover layer (9) and the first electrode (2) and a plurality of spacers (4), wherein - the functional layer stack (6) has an organic active layer (63) for generating electromagnetic radiation, - the first electrode (2) has conductor tracks (22) with branching points (23), - the spacers (4) are each arranged on one of the branching points (23), - the functional layer stack (6) is arranged in regions between the cover layer (9) and the spacers (4), and - the spacers (4) each have a first part (41) and a second part (42), wherein the second part (42) has a smaller cross section compared to the first part (41) and is arranged between the first part (41) and the covering layer (9).Component according to the preceding claim, which has a cavity (8) between the cover layer (9) and the functional layer stack (6), and the spacers (4) are vertical elevations in the cavity (8).The component according to any one of the preceding claims, wherein the cover layer (9) is free from direct physical contact with the spacers (4).Component according to one of the preceding claims, in which the functional layer stack (6) completely covers the spacers (4) in a plan view of the first electrode (2).Component according to one of the preceding claims, in which the functional layer stack (6) simulates a contour of the spacers (4) in regions.Component according to one of the preceding claims, in which the spacers (4) are completely surrounded by the functional layer stack (6) in lateral directions.Component according to one of the preceding claims, in which the organic active layer (63) is formed continuously and - in a plan view of the first electrode (2) - completely covers the spacers (4) and the branching points (23).Component according to one of the preceding claims, having a second electrode (3), wherein the functional layer stack (6) and the spacers (4) are arranged between the first electrode (2) and the second electrode (3), and the second electrode is designed to reflect radiation.Component according to one of the preceding claims, in which the first electrode (2) has an electrode layer (21) made of a transparent conductive material, the conductor tracks (22) being arranged directly on the electrode layer (21).Component according to one of the preceding claims, in which the conductor tracks (22) form a rectangular or a hexagonal grid.Method for producing an optoelectronic component (10) comprising a cover layer (9), a first electrode (2) having conductor tracks (22) and branching points (23), a functional layer stack (6) and a plurality of spacers (4), comprising the following steps: a) providing a carrier body (1); b) forming the first electrode (2) on the carrier body (1); c) forming the spacers (4) on the branching points (23), wherein the spacers (4) each have a first section (41) and a second section (42), and the second section (42) has a smaller cross section compared to the first section (41); d) applying the layer stack (6) both to the first electrode (2) and to the spacers (4); and e) applying the cover layer (9), wherein the functional layer stack (6) is arranged in regions between the cover layer (9) and the spacers (4), and the second part (42) is arranged between the first part (41) and the cover layer (9).Method according to the preceding claim, in which the functional layer stack (6) is applied to the spacers (4) in such a way that the functional layer stack (6) simulates a contour of the spacers (4) in regions.Method according to one of Claims 11 to 12, in which, in order to form the spacers (4), a lacquer layer is applied in places to the first electrode (2) by means of a printing method.Method according to one of Claims 11 to 13, in which the layer stack (6) is applied layer by layer to the first electrode (2) and to the spacers (4) by means of a coating method.Optoelectronic component (10) having a cover layer (9), a first electrode (2), a functional layer stack (6) arranged between the cover layer (9) and the first electrode (2), and a plurality of spacers (4), wherein - the functional layer stack (6) has an organic active layer (63) for generating electromagnetic radiation, - the first electrode (2) has conductor tracks (22) with branching points (23), - the spacers (4) are each arranged on one of the branching points (23), - the functional layer stack (6) is arranged in regions between the cover layer (9) and the spacers (4), and - the spacers (4) are laterally spaced apart from one another and each cover a single branching point (23).Component according to claim 15, wherein the spacers (4) in plan view of the first electrode (2) respectively cover the corresponding branching point (23) at least partially or completely, and the component is free of the spacers (4) outside these covering regions at the branching points (23).Component according to Claim 15, in which the spacers (4) are each formed in two pieces or in multiple pieces and each have a first part (41) and a second part (42), the second part (42) having a smaller cross section compared with the first part (41) and being arranged between the first part (41) and the covering layer (9).
Citation Information
Patent Citations
Light-emitting device and method of manufacturing the same
DE102006047433A1
Organic electroluminescent components and methods for their manufacture
DE102009044262A1
Method for manufacturing an optoelectronic assembly and optoelectronic assembly
DE102012109218A1
Organic optoelectronic device and method for fabricating an organic optoelectronic device
DE102012203637A1
Liquid crystal display and process for fabricating the same
WO2005106573A1