Organic light-emitting device

Abstract

Organic light-emitting device, comprising - an organic functional layer stack (3) with at least one light-emitting layer which is designed to generate light during operation of the component, - a transparent first electrode (2) and a transparent second electrode (4) which are designed to inject charge carriers into the organic functional layer stack (3) during operation, and - a heat distribution layer (9) which is applied over the electrodes (2, 4) and the organic functional layer stack (3) and which has at least one plastic layer (10) and a highly thermally conductive layer (11), wherein the heat distribution layer (9) has at least one transparent partial region (91) and at least one non-transparent partial region (92), wherein the plastic layer (10) and the highly thermally conductive layer (11) are arranged at least partially laterally next to one another in the heat distribution layer (9).

Description

[0001] An organic light-emitting component and a method for producing an organic light-emitting component are specified.

[0002] Organic light-emitting diodes are used for a wide variety of lighting devices, whereby the organic light-emitting diodes must be specifically adapted to the respective requirements. For example, to achieve the required heat distribution in automotive applications, it is known to apply a heat distribution structure, also known as a heat spreader, to an organic light-emitting diode. A non-transparent aluminum foil is typically used for this purpose. If such a foil is bonded flush with the edge of the organic light-emitting diode beyond the luminous surface, it can achieve not only the heat distribution function but also a barrier effect. This creates an additional time delay, also known as "lag time", against moisture penetrating such a component from the side.

[0003] However, particularly in automotive applications, it may be desirable, for example for design reasons, for organic light-emitting diodes used for this purpose to have transparent areas, particularly transparent non-luminous areas, in addition to the luminous areas. In this regard, it is known to use structured heat-distribution films that are drawn back from the component edge, but this no longer allows the described additional barrier effect to be achieved.

[0004] Alternatively, it is known to laminate a transparent glass cover onto an organic light-emitting diode, flush with the component edge. A thermally conductive film is laminated onto the glass cover, but this results in increased material and processing costs.

[0005] Organic optoelectronic components are known from the publications DE 10 2012 109 141 A1, DE 10 2012 109 238 A1, US 2010 / 0244005 A1 and KR 1020120035329 A.

[0006] At least one object of certain embodiments is to provide an organic light-emitting component with a heat-distributing element.

[0007] This object is achieved by a subject matter according to the independent patent claim. Advantageous embodiments and further developments of the subject matter are characterized in the dependent claims and will further become apparent from the following description and the drawings.

[0008] According to at least one embodiment, an organic light-emitting component comprises an organic functional layer stack containing at least one organic light-emitting layer configured to generate light during operation of the component. Furthermore, the component comprises a first electrode and a second electrode configured to inject charge carriers into the functional layer stack during operation. In particular, one of the electrodes can be designed as an anode and the other of the electrodes as a cathode, which each inject holes or electrons, in particular from different sides, into the at least one organic light-emitting layer during operation. By recombination of holes and electrons, light can be generated in the light-emitting layer by electroluminescence.The organic light-emitting component can thus be designed, in particular, as an organic light-emitting diode (OLED), in which the organic functional layer stack is arranged between the first and second electrodes. The first and second electrodes are each transparent, so that light generated during operation of the organic light-emitting component can be emitted by both the first and second electrodes. In a switched-off state, the layer stack formed by the electrodes and the organic functional layer stack appears transparent.

[0009] "Transparent" here and below refers to a layer, which may also be a sequence of layers, that is permeable to visible light, in particular to light generated in the light-emitting layer during operation of the component. A transparent layer can be clearly translucent or at least partially light-scattering and / or partially light-absorbing, so that a layer described as transparent can, for example, also be diffusely or milkily translucent and thus translucent.

[0010] According to a further embodiment, the organic light-emitting component has a heat distribution layer applied over the electrodes and the organic functional layer stack. The heat distribution layer can in particular be provided and configured to distribute heat generated during operation of the organic functional layer stack, such that the organic functional layer stack has the most homogeneous heat distribution possible. Homogeneous heat distribution can be advantageous in particular in the case where the light emitted locally by the organic functional layer stack during operation, for example its brightness and / or color, depends on the local temperature. The heat distribution layer can in particular form a cover layer arranged over the electrodes and the organic functional layer stack, and with which the organic light-emitting component is terminated on one side.

[0011] According to a further embodiment, the heat distribution layer has at least one transparent subregion and at least one non-transparent subregion. Since the remaining layers of the organic light-emitting component are preferably at least partially or completely transparent, the appearance of the organic light-emitting component in the switched-off state can be determined with regard to its transparency via the heat distribution layer. Thus, the at least one transparent subregion and the at least one non-transparent subregion of the heat distribution layer can specify in which regions the organic light-emitting component appears transparent in the switched-off state and in which regions the component appears non-transparent.

[0012] For example, the heat distribution layer can have a transparent sub-region in an edge region, so that the organic light-emitting component is transparent in the edge region. Here and in the following, "edge region" refers to a region of the organic light-emitting component that extends to the edge of the component. This refers, in particular, to an edge that delimits the organic light-emitting component in a lateral direction, with "lateral direction" referring to a direction that extends along a main extension direction of the organic light-emitting component. Main extension directions are directions in the main extension plane of the organic light-emitting component, i.e., in the plane in which the organic light-emitting component has its largest dimensions.

[0013] The organic light-emitting component can, in particular, be planar, i.e., have a significantly larger extent in directions perpendicular to the arrangement direction of the electrodes and the organic functional layer stack than in a direction along the arrangement direction of the electrons of the organic functional layer stack. Accordingly, layers and elements of the organic light-emitting component can have main surfaces that are parallel to the main plane of extension of the component. "Main surfaces" thus refers to those surfaces of the layers or elements of the organic light-emitting component that extend along the main plane of extension of the organic light-emitting component.With respect to the arrangement direction of the electrodes and the organic functional layer stack, the main surfaces of the layers or elements of the organic light-emitting device are thus formed by the top and bottom surfaces of the individual layers or elements. In other words, the individual layers or elements of the organic light-emitting device are applied to one another with their respective main surfaces.

[0014] Furthermore, it may also be possible for the heat distribution layer to have a transparent sub-region in a central region, so that the organic light-emitting component is transparent in a central region. Here and below, a central region refers to a region that does not adjoin an edge of the organic light-emitting component, so that a transparent central region is separated from each edge of the organic light-emitting component by a non-transparent region of the heat distribution layer.

[0015] According to a further embodiment, the heat distribution layer comprises at least one plastic layer and at least one further layer formed from a material with a higher thermal conductivity than the plastic layer. In particular, the further layer with the higher thermal conductivity than the plastic layer can, for example, have a thermal conductivity of greater than or equal to 1 W / (m K) or greater than or equal to 10 W / (m K) or greater than or equal to 100 W / (m K), taking into account the thermal conductivity of the plastic layer. The further layer can also be referred to as a highly thermally conductive layer, whereby the term "highly thermally conductive" refers to the preceding information. Particularly preferably, the highly thermally conductive layer can comprise a metal layer or be formed by a metal layer.

[0016] The highly thermally conductive layer, in particular, for example, a metal layer, can be non-transparent, while the plastic layer is transparent. The heat distribution layer can, in particular, be a laminate formed from or with the at least one plastic layer and the at least one highly thermally conductive layer. The plastic layer and the highly thermally conductive layer are preferably arranged at least partially laterally adjacent to one another in the heat distribution layer. By arranging the plastic layer and the highly thermally conductive layer as parts of the heat distribution layer, transparent and non-transparent subregions of the heat distribution layer can thus be determined.For example, the highly thermally conductive layer can have a recess in at least one transparent partial region of the heat distribution layer, so that only the plastic layer is present in at least one transparent partial region. A recess can be formed by the highly thermally conductive layer being pulled back from an edge of the heat distribution layer, so that the corresponding edge of the heat distribution layer is formed by the plastic layer. Furthermore, a recess can also be formed by an opening in the highly thermally conductive layer, so that the plastic layer is arranged in the opening of the highly thermally conductive layer. Furthermore, it can also be possible for the highly thermally conductive layer to be present in separate partial regions within the heat distribution layer and for the separate partial regions to be connected to one another by partial regions of the plastic layer.

[0017] To produce the organic light-emitting component, the first and second electrodes and the organic functional layer stack can be provided in the form of a layer sequence. The heat distribution layer can be applied over them. To produce the heat distribution layer, for example, a plastic film can be provided that forms the at least one plastic layer of the heat distribution layer and into which the highly thermally conductive layer, for example a metal layer, is pressed. The highly thermally conductive layer can consist of a continuous part or of separate layer parts. Alternatively, it may also be possible to produce the heat distribution layer by extruding a plastic material onto or around a structured film, for example a metal foil.The structured film, which can be a grid, for example, which is easy to manufacture and process, then forms the highly thermally conductive layer of the heat distribution layer. Furthermore, it is also possible to coextrude a structured plastic material with a suitable material for the highly thermally conductive layer, for example, a metal material, to form the heat distribution layer.

[0018] According to a further embodiment, the highly thermally conductive layer in the finished heat distribution layer is free of the plastic layer on at least one main surface. In other words, this means that the highly thermally conductive layer is not covered with the plastic layer on at least one main surface. This can be achieved, for example, by pressing the highly thermally conductive layer into the plastic layer or by extruding the material of the plastic layer onto one side of the highly thermally conductive layer. For example, the highly thermally conductive layer is free of the plastic layer on exactly one side. In this case, one of the main surfaces of the heat distribution layer is formed by partial regions of the highly thermally conductive layer and partial regions of the plastic layer, while the other main surface of the heat distribution layer is formed only by the plastic layer.

[0019] According to a further embodiment, the highly thermally conductive layer is free of the plastic layer on both main surfaces. In other words, this means that the heat distribution layer has laterally adjacent regions formed either by a respective partial region of the highly thermally conductive layer or a respective partial region of the plastic layer. The main surfaces of the heat distribution layer are thus formed on both sides by surfaces of the highly thermally conductive layer and the plastic layer.

[0020] According to a further embodiment, the plastic layer completely encloses the highly thermally conductive layer. This can mean, in particular, that the highly thermally conductive layer is covered with the plastic layer on both main surfaces, so that the plastic layer forms the main surfaces of the heat distribution layer. Furthermore, this can mean that the highly thermally conductive layer is completely embedded in the plastic layer and thus surrounded by the plastic layer. For this purpose, the heat distribution layer can be produced, for example, by extruding the material of the plastic layer onto both sides of the highly thermally conductive layer, in particular, for example, onto a metal layer.

[0021] According to a further embodiment, the organic light-emitting component comprises an encapsulation arrangement. The encapsulation arrangement can, in particular, be arranged above the electrodes and the organic functional layer stack. The encapsulation arrangement is suitable for protecting the organic functional layer stack and the electrodes from harmful substances from the environment, for example, moisture, oxygen, and / or hydrogen sulfide. The encapsulation arrangement can, in particular, be transparent, so that light generated in the organic functional layer stack during operation can be transmitted through the encapsulation arrangement.

[0022] The heat distribution layer can preferably be applied to the encapsulation arrangement. For this purpose, the heat distribution layer can be applied to the encapsulation arrangement with a connecting layer, in particular a transparent connecting layer, wherein the connecting layer is particularly preferably in direct contact with the encapsulation arrangement and the heat distribution layer. The connecting layer can preferably be formed as an adhesive layer. For example, an optically clear adhesive (OCA), in particular a transparent pressure-sensitive adhesive (PSA), can be used for this purpose.

[0023] Furthermore, the organic light-emitting component can have a substrate on which the electrodes, the functional layer stack, and the encapsulation arrangement are arranged. In particular, the first electrode can be arranged on the substrate, the organic functional layer stack above it, the second electrode above it, and the encapsulation arrangement above it. The heat distribution layer can accordingly be arranged in particular above the encapsulation arrangement and thus on the side of the organic light-emitting component opposite the substrate.

[0024] According to a further embodiment, the encapsulation arrangement is designed as a thin-film encapsulation. In the present case, an encapsulation arrangement designed as a thin-film encapsulation is understood to mean a device that is suitable for forming a barrier against atmospheric substances, in particular against moisture and oxygen and / or against other damaging substances such as corrosive gases, for example hydrogen sulfide. In other words, the thin-film encapsulation is designed such that it cannot be penetrated by atmospheric substances at all or at most only to a very small extent. In thin-film encapsulation, this barrier effect is essentially created by encapsulation layers designed as one or more thin layers, which are part of the encapsulation arrangement or which form the encapsulation arrangement.The encapsulation layers of the encapsulation arrangement generally have a thickness of less than or equal to a few hundred nm. Preferably, the encapsulation arrangement comprises a layer sequence with a plurality of thin encapsulation layers, each of which may have a thickness of greater than or equal to one atomic layer, or greater than or equal to 1 nm, or greater than or equal to 5 nm, or less than or equal to 500 nm, or less than or equal to 200 nm, or less than or equal to 100 nm, or less than or equal to 70 nm, or less than or equal to 50 nm, or less than or equal to 20 nm, or less than or equal to 10 nm.

[0025] The encapsulation layers can be applied, for example, using an atomic layer deposition (ALD) or a molecular layer deposition (MLD) process. Suitable encapsulation materials for the encapsulation layers of the encapsulation arrangement are oxides, nitrides, or oxynitrides, such as aluminum oxide, zinc oxide, zirconium oxide, titanium oxide, hafnium oxide, lanthanum oxide, and tantalum oxide.

[0026] Alternatively or in addition to encapsulation layers produced by ALD or MLD, the encapsulation arrangement may comprise at least one or a plurality of further layers, in particular barrier layers and / or passivation layers, which are deposited by thermal vapor deposition, by means of a plasma-enhanced process, such as sputtering or plasma-enhanced chemical vapor deposition (PECVD), or by means of plasma-free vapor deposition such as chemical vapor deposition (CVD). Suitable materials for this purpose may be the materials mentioned above in connection with ALD and MLD, as well as silicon nitride, silicon oxide, silicon oxynitride, indium tin oxide, indium zinc oxide, aluminum-doped zinc oxide, and mixtures and alloys of the aforementioned materials.The one or more further layers may, for example, each have a thickness between 1 nm and 5 µm and preferably between 200 nm and 2 µm, the limits being included.

[0027] To produce the organic light-emitting component, for example, a large-area composite can be provided which has a plurality of units which, after singulation, are each part of organic light-emitting components. In particular, each of the interconnected units can have an organic functional layer stack with the first and second electrodes, which are provided on a common composite substrate. An encapsulation arrangement can be applied over a large area across the units to the electrodes and the organic functional layer stack, onto which encapsulation arrangement a composite comprising a plurality of heat distribution layers is laminated. The composite of the plurality of heat distribution layers can in particular be formed by a film produced using the production methods described above.After the heat distribution layer composite has been applied, it can be divided into individual organic light-emitting components. To expose contact areas in the individual units, partial areas of the heat distribution layer and the encapsulation arrangement can be removed. Alternatively, it may also be possible to apply a heat distribution layer to an already separated layer sequence provided with an encapsulation arrangement, including the electrodes and the organic functional layer stack. This layer may already have the desired shape, so that after the heat distribution layer has been applied, contact surfaces of the organic light-emitting component are already exposed without further structuring measures. Accordingly, the heat distribution layer can extend to the edge of the organic light-emitting component in at least one partial area.Furthermore, it may also be possible for the heat distribution layer to be withdrawn from an edge of the organic light-emitting component, so that the organic light-emitting component has an edge region which is free of the heat distribution layer.

[0028] According to a further embodiment, the heat distribution layer is designed such that, regardless of the different regions of the organic light-emitting component to which the heat distribution layer is applied, no height steps or thickness variations or morphologies occur. For example, the highly thermally conductive layer can be surrounded by the plastic layer at least on one side or even completely, as described above. Alternatively, only a lateral connection can exist between regions of the highly thermally conductive layer and the plastic layer, so that the highly thermally conductive layer is free of the plastic layer on both main surfaces.

[0029] According to a further embodiment, the heat distribution layer has a transparent barrier layer on at least one main surface. The transparent barrier layer can preferably be applied at least directly to the plastic layer. This makes it possible for the heat distribution layer to have a high degree of impermeability against harmful substances from the environment, even in those areas formed only by the plastic layer, for example, a water vapor transmission rate (WVTR) of less than or equal to 10 -3 g / (m 2 · day) or less than or equal to 10 -5 g / (m 2 · day) or less than or equal to 10 -6 g / (m 2· Day). Furthermore, the barrier layer can completely cover at least one main surface, so that the barrier layer can be applied over a large area on the heat distribution layer. Thus, the barrier layer can also extend at least partially over the highly thermally conductive layer. The barrier layer is preferably arranged on the side of the heat distribution layer facing the organic functional layer stack.

[0030] According to a further embodiment, the barrier layer comprises at least one oxide, nitride, or oxynitride, in particular one of the materials mentioned above in connection with the encapsulation arrangement. Accordingly, the barrier layer, which may also comprise a plurality of individual layers, can be produced using one or more of the methods described above in connection with the encapsulation arrangement. The barrier layer can thus particularly preferably be formed as a thin-film encapsulation layer or as a corresponding layer sequence in the form of a thin-film encapsulation.In the finished component, the organic light-emitting component can thus have, for example, on the electrons and the organic functional layer stack, the encapsulation arrangement, immediately thereafter the connection layer, immediately thereafter the barrier layer of the heat distribution layer and immediately thereafter the plastic layer and / or the highly thermally conductive layer of the heat distribution layer.

[0031] According to a further embodiment, the plastic layer of the heat distribution layer comprises a material that has a lower thermal conductivity than the highly thermally conductive layer. In particular, the plastic layer can comprise a transparent material.

[0032] The plastic layer may, for example, comprise siloxanes, epoxies, acrylates, methyl methacrylates, imides, carbonates, olefins, styrenes, urethanes, or derivatives thereof in the form of monomers, oligomers, or polymers, as well as mixtures, copolymers, or compounds thereof. For example, the plastic layer may comprise or be an epoxy resin, polymethyl methacrylate (PMMA), polystyrene, polycarbonate, polyacrylate, polyurethane, or a silicone resin such as polysiloxane, or mixtures thereof.

[0033] Furthermore, the plastic layer can contain additives, for example, to improve thermal conductivity. For this purpose, the plastic layer can, in particular, contain carbon particles mixed into a plastic material.

[0034] The highly thermally conductive layer can, for example, comprise or be made of aluminum and / or copper. In particular, the partial layer can be designed to be hermetically sealed against harmful gases from the environment.

[0035] The organic light-emitting component described here comprises a combined film for heat distribution, formed by the heat distribution layer, which comprises or consists of a highly thermally conductive layer, in particular, for example, a metal layer, and a plastic layer. The heat distribution layer can, in particular, comprise non-transparent, hermetically sealed layer regions, which can preferably be positioned over the luminous surface and component metallizations of the organic light-emitting component in order to homogenize the heat distribution in the organic light-emitting component. Furthermore, the heat distribution layer comprises transparent regions formed by plastic layer regions, which are positioned over those regions of the organic light-emitting component that are intended to remain transparent when the organic light-emitting component is switched off.To achieve the most hermetically sealed barrier against harmful environmental influences in these areas as well, an additional barrier layer can be applied at least to the plastic layer regions and preferably to the entire heat distribution layer, so that the entire heat distribution layer can be hermetically sealed at least perpendicular to its main surfaces. This enables the cost-effective realization of a cover layer of an organic light-emitting component that provides both heat distribution and a barrier effect while simultaneously maintaining transparency in desired areas. This also requires minimal design restrictions, for example, for automotive applications, such as transparent areas at the edge or within the luminous area.

[0036] Further advantages, advantageous embodiments and further developments emerge from the exemplary embodiments described below in conjunction with the figures.

[0037] They show: Fig. 1A to 1D are schematic representations of various views of an organic light-emitting component and a heat distribution layer according to an embodiment, and Fig. 2 to 4 schematic representations of heat distribution layers according to further embodiments.

[0038] In the exemplary embodiments and figures, identical, similar, or similarly functioning elements may be provided with the same reference numerals. The illustrated elements and their relative sizes are not to be considered to scale; rather, individual elements, such as layers, components, structural elements, and regions, may be exaggerated for clarity and / or clarity.

[0039] In connection with the Fig. 1A to 1C, an embodiment of an organic light-emitting device 100 is shown, which is designed as an organic light-emitting diode (OLED). Fig. 1A and Fig. 1B show sectional views of the component 100 along the Fig. 1C shown section planes AA and BB, where in Fig. 1C shows a plan view of the component 100. In Fig. 1D is a section of the heat distribution layer 9 of the Fig. 1A to 1C. The following description applies equally to the Fig. 1A to 1D.

[0040] The organic light-emitting component 100 comprises a substrate 1 on which an organic functional layer stack 3 with at least one light-emitting layer is arranged between a first electrode 2 and a second electrode 4, such that light is generated in the organic functional layer stack 3 during operation of the component 100. The substrate and the first and second electrodes 2, 4 are transparent, such that the organic light-emitting component 100 can emit light through the first electrode 2 and the substrate 1, as well as through the second electrode 3, during operation.

[0041] The substrate 1 is designed, for example, in the form of a glass plate or glass layer. Alternatively, the substrate 1 can also comprise, for example, a transparent plastic or a glass-plastic laminate. Optionally, the substrate 1 can be encapsulated with an encapsulation arrangement, which can be arranged between the substrate 1 and the first electrode 2 and / or on the side of the substrate 1 facing away from the first electrode 2.

[0042] At least one of the transparent electrodes 2, 4 can, for example, comprise a transparent conductive oxide. Transparent conductive oxides (TCO) are transparent, conductive materials, typically metal oxides, such as zinc oxide, tin oxide, cadmium oxide, titanium oxide, indium oxide, and indium tin oxide (ITO). In addition to binary metal-oxygen compounds, such as ZnO, SnO2, or In2O3, ternary metal-oxygen compounds, such as Zn2SnO4, CdSnO3, ZnSnO3, MgIn2O4, GaInO3, Zn2In2O5, or In4SnO, are also included. 12 , or mixtures of different transparent conducting oxides belong to the group of TCOs. Furthermore, TCOs do not necessarily have a stoichiometric composition and can also be p- or n-doped.

[0043] The further of the transparent electrodes 2, 4 may, for example, comprise a metal which may be selected from aluminum, barium, indium, silver, gold, magnesium, calcium and lithium as well as compounds, combinations and alloys therewith and which has a sufficiently small thickness to be translucent.

[0044] Alternatively or additionally, both electrodes 2, 4 can also comprise a TCO material. Furthermore, metallic mesh structures, conductive networks, and metallic meshes, for example with or made of silver, and / or graphene, as well as carbon-containing layers are also conceivable. Furthermore, one or both electrodes 2, 4 can comprise a layer stack with at least one TCO and at least one metal and / or one of the other materials mentioned. In the illustrated embodiment, the lower electrode 2 is designed as the anode, while the upper electrode 4 is designed as the cathode. With the appropriate choice of material, a structure with the opposite polarity is also possible.

[0045] The electrodes 2, 4 are preferably formed with a large area and are continuous, so that the OLED 100 can be designed as a light source, in particular as a surface light source. "Large area" can mean that the organic light-emitting element 100 has an area of ​​greater than or equal to a few square millimeters, preferably greater than or equal to one square centimeter, and particularly preferably greater than or equal to one square decimeter. Alternatively, it may also be possible for at least one of the electrodes 2, 4 of the light-emitting component 100 to be structured, whereby a spatially and / or temporally structured and / or variable luminous impression, for example for structured and / or multi-colored illumination or for a display device, can be enabled by means of the light-emitting component 100.

[0046] For electrical contacting of the electrodes 2, 4, as shown in Fig. 1, electrode connection pieces 5 may be provided, which extend outward from the electrodes 2, 4 through the encapsulation arrangement 7 described below. The electrode connection pieces 5, designed as electrical contact leads, may be transparent or non-transparent and, for example, comprise or consist of a TCO and / or a metal.

[0047] The organic functional layer stack 3 can comprise layers with organic polymers, organic oligomers, organic monomers, organic small, non-polymeric molecules (“small molecules”), or combinations thereof. In particular, it can be advantageous if the organic functional layer stack comprises a functional layer designed as a hole-transport layer in order to enable effective hole injection into the light-emitting layer. Tertiary amines, carbazole derivatives, conductive polyaniline, or polyethylenedioxythiophene, for example, can prove advantageous as materials for a hole-transport layer. Suitable materials for the light-emitting layer are materials that emit radiation due to fluorescence or phosphorescence, for example polyfluorene, polythiophene, or polyphenylene, or derivatives, compounds, mixtures, or copolymers thereof.Furthermore, the organic functional layer stack 3 can comprise a functional layer configured as an electron-transport layer. Furthermore, the organic functional layer stack 3 can also comprise electron and / or hole-blocking layers. The organic functional layer stack can also comprise a plurality of organic light-emitting layers arranged between the electrodes.

[0048] Furthermore, as in Fig. 1, insulator layers 6 may be present, for example, with or made of polyimide, which can, for example, electrically insulate the electrodes 2, 4 from one another. Depending on the design of the individual layers of the organic light-emitting component 100, insulator layers 6 may not be absolutely necessary and may not be present, for example, in corresponding mask processes for applying the layers.

[0049] An encapsulation arrangement 7 for protecting the organic functional layer stack 3 and the electrodes 2, 4 is arranged above the organic functional layer stack 3 and the electrodes 2, 4. The encapsulation arrangement 7 is particularly preferably embodied as a transparent thin-film encapsulation comprising at least one or a plurality of encapsulation layers made of one or more transparent encapsulation materials. The encapsulation layers can be applied, for example, using ALD or MLD methods. Suitable materials for the layers of the encapsulation arrangement 7, which can preferably have a thickness of greater than or equal to one atomic layer and less than or equal to 500 nm, are, for example, aluminum oxide, zinc oxide, zirconium oxide, titanium oxide, hafnium oxide, lanthanum oxide, and tantalum oxide.Alternatively or in addition to encapsulation layers produced by means of ALD or MLD, the encapsulation arrangement 7 can have at least one or a plurality of further layers, that is to say in particular barrier layers and / or passivation layers, which can be applied by other methods described above in the general part.

[0050] Furthermore, a heat distribution layer 9 is applied over the electrodes 2, 4 and the organic functional layer stack 3, said heat distribution layer comprising at least one plastic layer 10 and a highly thermally conductive layer 11, wherein the heat distribution layer 9 has at least one transparent partial region 91 and at least one non-transparent partial region 92. The heat distribution layer 9 thus forms a covering layer over the organic functional layer stack 3 and the electrodes 2, 4 and extends, at least in partial regions, to the edge of the organic light-emitting component 100. The heat distribution layer 9 is retracted over the electrode connection pieces 5 in the edge region of the organic light-emitting component 100, so that the electrode connection pieces 5 are exposed for external contacting.

[0051] The heat distribution layer 9 is applied to the underlying layers by means of a connecting layer 8. The connecting layer 8 can, in particular, be formed by a transparent adhesive layer, such as a transparent pressure-sensitive adhesive. This makes it possible to easily laminate the heat distribution layer 9 to the underlying layer stack.

[0052] The heat distribution layer 9 is transparent in the edge regions, which extend to the edge of the organic light-emitting component 100, and in a central region. In the corresponding transparent partial regions 91, the heat distribution layer 9 comprises only the plastic layer 10. The non-transparent partial region 92 of the heat distribution layer 9 is formed by the region of the heat distribution layer 9 in which the highly thermally conductive layer 11 is arranged. The plastic layer 10 and the highly thermally conductive layer 11 are thus arranged at least partially laterally next to one another in the heat distribution layer.

[0053] The highly thermally conductive layer 11, which comprises a non-transparent and preferably hermetically sealed material with high thermal conductivity, for example, greater than or equal to 10 W / (m·K) or greater than or equal to 100 W / (m·K), can preferably be formed with or from a metal such as aluminum and / or copper and, within the heat distribution layer 9, does not extend to the edge of the organic light-emitting component 100. Furthermore, the highly thermally conductive layer 11 has a recess in the form of an opening in a central region. Due to the illustrated formation of the highly thermally conductive layer 11 within the heat distribution layer 9 and the arrangement of the heat distribution layer 9 on the underlying layers, it is thus possible for the organic light-emitting component 100 to be transparent in a peripheral edge region and in a central region.As an alternative to the transparent and non-transparent partial areas 91, 92 shown, these can also be designed differently with regard to their position and shape.

[0054] The highly thermally conductive layer 11 provides the heat distribution layer 9 with its desired heat distribution properties, allowing for homogeneous heat distribution during operation of the organic light-emitting component 100 within the organic functional layer stack 3. At the same time, the highly thermally conductive layer 11 provides an additional barrier effect over the luminous surface of the organic light-emitting component 100.

[0055] The plastic layer 10 can comprise a plastic material mentioned above in the general section. To improve the thermal conductivity of the material of the plastic layer 10, an additive can be added to it, for example, in the form of carbon particles.

[0056] As particularly in Fig. 1D, the highly thermally conductive layer 11, which has two main surfaces 110, is free of the plastic layer 10 on one of the main surfaces 110. To produce the heat distribution layer 9, the highly thermally conductive layer 11 can, for example, be provided in the form of a structured film, such as a metal foil, onto one side of which the material of the plastic layer 10 is extruded. Furthermore, it may also be possible, for example, for the plastic layer 10 to be provided as a prefabricated plastic film, into which the highly thermally conductive layer 11 is then pressed.

[0057] The heat distribution layer 9 can, as can be seen in particular from the Fig. 1A and Fig. 1B, be designed such that no height steps or thickness variations and morphologies occur in the finished organic light-emitting device 100.

[0058] In connection with the Fig. 2 to 4 show further embodiments of the heat distribution layer 9, which instead of the heat distribution layer 9 shown in connection with the Fig. 1A to 1D can be used for the organic light-emitting component 100.

[0059] Compared to Fig. 1D, in which the plastic layer 10 forms one of the main surfaces of the heat distribution layer 9, while the other main surface of the heat distribution layer 9 is formed by the areas of the plastic layer and the areas of the highly thermally conductive layer 11, is in Fig. 2 shows a heat distribution layer 9 in which both main surfaces 110 of the highly thermally conductive layer 11 are free of the plastic layer 10. Thus, there is only a lateral connection between the regions of the plastic layer 10 and the regions of the highly thermally conductive layer 11, while the main surfaces of the heat distribution layer 9 are formed by both the regions of the plastic layer 10 and the regions of the highly thermally conductive layer 11.

[0060] In Fig. 3 shows a further embodiment of a heat distribution layer 9, in which both main surfaces 110 of the highly thermally conductive layer 11 are covered by the plastic layer 10. As a result, the highly thermally conductive layer 11 is completely enclosed by the plastic layer 10, so that the plastic layer 10 forms the main surfaces of the heat distribution layer 9. The production of the Fig. The heat distribution layer shown in Figure 3 can be produced, for example, by extruding the material of the plastic layer 10 around the highly thermally conductive layer 11.

[0061] In Fig. 4 shows a heat distribution layer 9 which, purely by way of example, in relation to the plastic layer 10 and the highly thermally conductive layer 11, Fig. 3. In addition, the structure shown in Fig. 4, the heat distribution layer 9 has a transparent barrier layer 12 on a main surface 90 of the heat distribution layer 9. The barrier layer 12 is applied directly to the main surface 90 of the heat distribution layer 9. In the exemplary embodiment shown, this means that the barrier layer 12 is applied directly to the plastic layer 10. In particular, the barrier layer 12 can, as in Fig. 4, completely cover the main surface of the heat distribution layer 9.

[0062] The barrier layer 12 can be formed by one or more layers to form a thin-film encapsulation. Accordingly, the barrier layer 12 can comprise at least one oxide, nitride, or oxynitride with one of the materials mentioned above in connection with the encapsulation arrangement 7.

[0063] Alternatively to Fig. 4, the plastic layer 10 and the highly thermally conductive layer 11 can also be formed in the case of an additional barrier layer 12 according to the embodiments of Fig. 1D and Fig. 2. When using a heat distribution layer 9 having a barrier layer 12, it may be particularly advantageous if the barrier layer 12 is arranged on the side of the heat distribution layer 9 facing the organic functional layer stack 3 in order to achieve the best possible barrier effect.

[0064] In particular, the additional barrier layer 12 can achieve a barrier function in the transparent partial regions 91 of the heat distribution layer 9 even if the material for the plastic layer 10 is not hermetically sealed, which would not be possible if a pure metal layer were used as the heat distribution structure.

[0065] The embodiments described in connection with the figures may further comprise, alternatively or additionally, features described above in the general part.

Claims

[1] Organic light-emitting device, comprising - an organic functional layer stack (3) with at least one light-emitting layer which is designed to generate light during operation of the component, - a transparent first electrode (2) and a transparent second electrode (4) which are designed to inject charge carriers into the organic functional layer stack (3) during operation, and - a heat distribution layer (9) which is applied over the electrodes (2, 4) and the organic functional layer stack (3) and which has at least one plastic layer (10) and a highly thermally conductive layer (11), wherein the heat distribution layer (9) has at least one transparent partial region (91) and at least one non-transparent partial region (92), wherein the plastic layer (10) and the highly thermally conductive layer (11) are arranged at least partially laterally next to one another in the heat distribution layer (9). [2] Component according to claim 1, wherein the highly thermally conductive layer (11) is formed by a metal layer. [3] Component according to one of the preceding claims, wherein the heat distribution layer (9) is transparent in an edge region and / or in a central region. [4] Component according to one of the preceding claims, wherein the highly thermally conductive layer (11) is non-transparent and the plastic layer (10) is transparent. [5] Component according to one of the preceding claims, wherein the highly thermally conductive layer (11) has a recess in at least one transparent partial region (91). [6] Component according to one of the preceding claims, wherein the highly thermally conductive layer (11) is free of the plastic layer (10) on at least one main surface (110). [7] Component according to one of the preceding claims, wherein the highly thermally conductive layer (11) is free of the plastic layer (10) on both main surfaces (110). [8] Component according to one of claims 1 to 6, wherein the highly thermally conductive layer (11) is covered on at least one main surface (110) by the plastic layer (10). [9] Component according to one of claims 1 to 5, wherein the plastic layer (10) completely encloses the highly thermally conductive layer (11). [10] Component according to one of the preceding claims, wherein a transparent encapsulation arrangement (7) is arranged above the electrodes (2, 4) and the functional layer stack (3), on which the heat distribution layer (9) is applied. [11] Component according to claim 10, wherein the heat distribution layer (9) is applied to the encapsulation arrangement (7) with a transparent connecting layer (8) and the connecting layer (8) is in direct contact with the encapsulation arrangement (7) and the heat distribution layer (9). [12] Component according to claim 10 or 11, wherein the encapsulation arrangement (7) is designed as a thin-film encapsulation. [13] Component according to one of the preceding claims, wherein the heat distribution layer (9) has a transparent barrier layer (12) on at least one main surface (90). [14] Component according to claim 13, wherein the barrier layer (12) is applied at least directly to the plastic layer (10). [15] Component according to claim 13 or 14, wherein the barrier layer (12) completely covers the at least one main surface (90). [16] Component according to one of claims 13 to 15, wherein the barrier layer (12) is arranged on the side of the heat distribution layer (9) facing the organic functional layer stack (3). [17] Component according to one of claims 13 to 16, wherein the barrier layer (12) comprises at least one oxide, nitride or oxynitride. [18] Component according to one of the preceding claims, wherein the heat distribution layer (9) extends at least partially to the edge of the organic light-emitting component. [19] Component according to one of the preceding claims, wherein the plastic layer (10) contains carbon particles.

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