ARRAY SUBSTRATE MADE OF ORGANIC LIGHT-ILLUMINATED DIODES

Abstract

The present invention discloses an array substrate of organic light-emitting diodes (OLEDs) and a method for its production, wherein the frame of the OLED product is made narrower to reduce packaging time, improve substrate utilization, and enhance production efficiency. The OLED array substrate comprises a plurality of display fields arranged in an array, wherein at least two adjacent display fields are connected by a frame adhesive, and there is no cutting head space between at least one side of the at least two adjacent display fields.

Description

Scope of the invention

[0001] The present invention relates to the field of display and packaging technologies and in particular to an array substrate of organic light-emitting diodes and a method for packaging the same. Background of the invention

[0002] As from Fig. As can be seen in Figure 1, a prior art array substrate 10 of organic light-emitting diodes (OLEDs) comprises a plurality of display fields 11 arranged in an array, and each display field 11 comprises a display area 12, a frame adhesive 13 with a width of 0.7 mm at one edge of the display area 12, and a stepped area 14, which is an area within the display field in which an integrated circuit is fabricated. Between every two display fields 11 there is a cutting head space, wherein the cutting head space is an area without frame adhesive 13 at the locations where the array substrate 10 is cut into a single display field 11. Fig. 1. There is a width B of a cutting head space between two adjacent display fields 11 in the horizontal direction and a width A of a cutting head space between two adjacent display fields 11 in the vertical direction, and to prevent damage to the display fields to be cut, the width A or B of the cutting head space is preset to 600 to 800 micrometers in a practical manufacturing process.

[0003] In Fig. 1. Due to the cutting head space between every two display fields, each display field must be packaged by separate coating with the frame adhesive and separate laser curing of the coated adhesive. In Fig. Figure 2 shows a structural representation of a single packaged display field in a sectional view, wherein the frame adhesive 13 is arranged between an upper substrate 21 and a lower substrate 20 and is laser-cured by placing a reflective layer 22 on the lower substrate 20 to better reflect a laser beam, making the laser beam more uniform.

[0004] In summary, the width A or B of the frame adhesive is preset to 600 to 800 micrometers in state-of-the-art technology, allowing the display frame to be large rather than narrow. Furthermore, the packaging process in state-of-the-art technology can be time-consuming due to the separate coating process for the adhesive and the separate laser curing process. Each display panel must be individually coated with the frame adhesive and laser-cured, resulting in wasted time and materials and potentially underutilizing the substrates. Additionally, laser curing of the adhesive can be time-consuming, leading to inefficiency.

[0005] Patent application US 7,656,498 B2 discloses a method for manufacturing a multiple display panel, comprising applying a plurality of display elements to a substrate, covering the substrate and the display elements with a glass cover having walls to separate each of the display elements, and cutting the substrate and the glass cover along the walls and separating the display elements to form respective image units.

[0006] Patent application DE 10 2006 033 713 A1 discloses that a unit comprises a substrate and an electrode arranged on the substrate. A stack of layers is arranged on the electrode, the stack containing a layer made of an organic material for generating electromagnetic radiation. A further electrode is arranged on the stack of layers. A receiving device extracts energy from the alternating electromagnetic field, converts the energy into electrical energy, and makes the energy available to the stack of layers. An insulating layer is attached to the latter electrode, with an antenna of the receiving device being partially mounted on the insulating layer.

[0007] Patent application US 2009 / 0134786 A1 describes a manufacturing process for an organic EL indicator device. An organic EL element is covered with a resin layer. The resin film is bonded to a sealing substrate and an element substrate on which organic EL elements are formed by lamination. Laser beams are directed onto an end section formed on the element substrate to generate shock waves in the end section, thereby removing the resin film from the end section.

[0008] Patent application US 2014 / 0134763 A1 discloses a method for cutting a flexible display device. The method comprises providing a glass mother substrate with a flexible substrate and an insulating layer formed on the flexible substrate; melting the flexible substrate and the insulating layer on the mother substrate by irradiation with a first laser beam; and cutting the mother substrate exposed by the irradiation with the first laser beam using a cutting device.

[0009] Patent application US 2004 / 0141139 A1 discloses an active-matrix liquid crystal display. Pixel areas and a peripheral driver circuit are integrally packed on the display. The TFTs that form the peripheral driver circuit are located within a sealing material layer on the side of a liquid crystal material, thereby protecting the peripheral driver circuit from external moisture and contaminants. Summary of the invention

[0010] In view of this, embodiments of the present invention provide an array substrate of organic light-emitting diodes and a method for packaging the same.

[0011] One embodiment of the present invention provides an array substrate of organic light-emitting diodes comprising OLED-packaged display fields arranged in an array, wherein: at least two adjacent display fields are connected via a frame adhesive and there is no cutting head space between at least one side of at least two adjacent display fields.

[0012] An array substrate of organic light-emitting diodes according to an embodiment of the present invention exhibits at least one of the following technical effects:

[0013] In the organic light-emitting diode array substrate according to an embodiment of the present invention, at least two adjacent display fields are connected on at least one side of the at least two adjacent display fields via a frame adhesive, so that the width of the frame of the organic light-emitting diode array substrate can be reduced in order to at least make the edge narrower and improve the basic competitiveness of the product.

[0014] A method for packaging an array substrate of organic light-emitting diodes according to an embodiment of the present invention has at least one of the following technical effects:

[0015] In the method for packaging an array substrate of organic light-emitting diodes according to an embodiment of the present invention, at least two adjacent display fields can be coated with the frame adhesive at the same time, so that it is not necessary to coat each individual display field with the frame adhesive, thus at least reducing the processing time, decreasing material costs and improving the efficiency of production. Brief description of the drawings Fig. Figure 1 shows a schematic structural representation of a state-of-the-art organic light-emitting diode array substrate in a sectional view; Fig. Figure 2 shows a schematic structural representation of a display field in the state-of-the-art array substrate of organic light-emitting diodes in a sectional view; Fig. Figure 3 shows a flow chart of a process for packaging an array substrate of organic light-emitting diodes according to an embodiment of the present invention; Fig. Figure 4 shows a schematic structural representation of an array substrate of organic light-emitting diodes according to a first embodiment of the present invention as a top view; Fig. 5A and Fig. Figure 5B shows schematic structural representations of an array substrate of organic light-emitting diodes according to a second embodiment of the present invention as a top view; Fig. Figure 6 shows a schematic structural representation of part of an area of ​​the array substrate made of organic light-emitting diodes according to the first embodiment and the second embodiment of the present invention in a sectional view; Fig. Figure 7 shows a schematic structural representation of a single display field as a result of prior art cutting, in a top view; and Fig. Figure 8 shows a schematic structural representation of a single display field as a result of cutting according to the first embodiment and the second embodiment of the present invention as a top view. Detailed description of the embodiments

[0016] Embodiments of the present invention provide an array substrate of organic light-emitting diodes and a method for producing the same, wherein a frame of the organic light-emitting diode product is made narrower to reduce the time for a packaging process, to improve the use of the substrate and to improve the efficiency of production.

[0017] To make the objectives, technical solutions, and advantages of the present invention more apparent, the present invention is described in more detail below with reference to the drawings. It is obvious that the embodiments described here represent only a portion of the possible embodiments and not the entirety of the invention. All other embodiments that a person skilled in the art might encounter are considered embodiments of the present invention without any inventive step being incorporated into the scope of the present invention.

[0018] The technical solutions according to embodiments of the present invention are described in detail below.

[0019] As from Fig. As can be seen in Figure 3, a method for packaging an array substrate of organic light-emitting diodes according to an embodiment of the present invention comprises the following processes: S301 is the coating of at least two adjacent display fields with a frame adhesive such that there is no cutting head space between at least one side of the at least two adjacent display fields; S302 is the curing of the frame adhesive using a first laser beam; S303 is the removal of the frame adhesive using a second laser beam at the point where cutting is required, so that a fractured area is generated on the surface of the frame adhesive at the cut points, where the power of the first laser beam is higher than the power of the second laser beam; and S304 is the cutting of the array substrate at the interfaces into individual display fields.

[0020] One embodiment of the present invention further provides an array substrate of organic light-emitting diodes, wherein the array substrate comprises a plurality of display fields arranged in an array, wherein at least two adjacent display fields are connected via a frame adhesive and there is no cutting head space between at least one side of the at least two adjacent display fields.

[0021] The array substrate made of organic light-emitting diodes according to an embodiment of the present invention is described below with regard to Fig. 4, Fig. 5A and Fig. 5B described in detail. Initial design

[0022] The first embodiment serves for illustration purposes, but does not correspond to the invention.

[0023] As from Fig. As can be seen in Figure 4, a first embodiment of the present invention provides an array substrate 40 made of organic light-emitting diodes, wherein the array substrate comprises a plurality of display fields 41 arranged in an array, wherein at least two adjacent display fields 41 are connected via a frame adhesive 13, and there is no cutting head space between at least one side of at least two adjacent display fields. According to the first embodiment of the present invention, no stepped area is arranged in the display fields 41, and optionally, there is no cutting head space in any two adjacent display fields 41.

[0024] A method for packaging the array substrate 40 of organic light-emitting diodes according to the first embodiment of the present invention comprises: simultaneously coating all display fields 41 with a frame adhesive, such that all display fields 41 are connected by the frame adhesive 13 and there is no cutting head space between the display fields 41. Optionally, the coated frame adhesive 13 is cured using a first laser beam, which is an infrared laser beam, at a wavelength of 788 to 828 nanometers and a power of 1 to 10 watts. In particular, the first laser beam in the first embodiment of the present invention has a wavelength of 808 nanometers (nm), a power of 5 watts (W), a speed of 5 millimeters per second (mm / s), a temperature of 350 °C, and a transmission distance of 1.8 millimeters (mm).

[0025] Subsequently, the frame adhesive is ablated at the points where cutting is required using a second laser beam, which is an infrared laser beam, with a wavelength of 788 to 828 nanometers and a power of 5 to 15 watts, so that a broken-off area is generated on the surface of the frame adhesive 13 at the cut points. In particular, in the first embodiment of the present invention, the second laser beam has a wavelength of 808 nm, a power of 10 W, a speed of 20 mm / s, a temperature of 500 °C and a distance for energy transmission of 0.2 mm.

[0026] Finally, the array substrate is cut into individual display fields at the interfaces, with the directed arrow in Fig. 4 represents the interfaces, and in particular, the array substrate is cut at the interfaces according to the first embodiment of the present invention by cutting the array substrate at the interfaces in the broken area. Optionally, the locations where cutting is required are determined according to the first embodiment of the present invention using cutting marker points for alignment in an image control device, in particular alignment marker points in charge-coupled devices (CCDs), i.e., CCD image sensors.The frame adhesive can be removed at the points where cutting is required according to the first embodiment of the present invention using the second laser beam at an energy greater than that of the first laser beam, so that the surface of the frame adhesive 13 can optionally be broken off to simplify cutting for separation and subsequently the frame adhesive can be mechanically cut at the interfaces using a cutter wheel.

[0027] Fig. Figure 6 shows a schematic structural representation of a region 42 of the array substrate 40 made of organic light-emitting diodes according to the first embodiment and the second embodiment of the present invention in a sectional view, wherein the region comprises an upper substrate 61 and a lower substrate 60 and the frame adhesive 13 between the upper substrate 61 and the lower substrate 60, and the dotted lines represent the places where the frame adhesive is removed using the second laser beam and also the places where the array substrate is subsequently mechanically cut using a cutter wheel. Second version

[0028] As from Fig. 5A and Fig. As shown in Figure 5B, a second embodiment of the present invention provides an array substrate of organic light-emitting diodes 50, wherein the array substrate comprises a plurality of display fields 11 arranged in an array. At least two adjacent display fields 11 are connected via a frame adhesive 13, and there is no cutting head space between at least one side of the at least two adjacent display fields. A stepped area 14 is present, which, according to the second embodiment of the present invention, is arranged in the display fields 11. The display fields 11 are structured, and the stepped area 14 is arranged as in the prior art.

[0029] Optionally, in the second embodiment of the present invention, a display field unit comprises at least two display fields, and between at least one side of two adjacent display fields, in addition to the sides with stepped areas, as shown in Fig. 5A and Fig. 5B shows no cutting head space.

[0030] As from Fig. As can be seen in Figure 5A, in the second embodiment of the present invention, the display field unit 51 comprises each column of display fields 11, and the stepped area 14 of each column of display fields 11 is arranged on the left or right side of the column of display fields 11. A cutting head space is arranged between every two adjacent rows of display field units 51, and the width B of the cutting head space is preset to 600 to 800 micrometers in the second embodiment of the present invention, as in the prior art.

[0031] As from Fig. As can be seen in Figure 5B, in the second embodiment of the present invention, the display field unit 52 comprises two adjacent columns of display fields 11, and the stepped area 14 of one of the columns of display fields 11 is arranged on the left side of the column of display fields 11, with the stepped area 14 of the other column of display fields 11 being arranged on the right side of the column of display fields 11; and there is neither a cutting head space in the row direction between sides of two adjacent display fields 11 nor a cutting head space in the column direction between sides of two adjacent display fields 11. A cutting head space is arranged between every two adjacent rows of display field units 52, and the width B of the cutting head space is preset to 600 to 800 micrometers in the second embodiment of the present invention, as in the prior art.

[0032] A method for packaging the array substrate of organic light-emitting diodes 50 according to the second embodiment of the present invention comprises coating the display field units 51 or 52 with a frame adhesive, i.e., that the coating with the frame adhesive in the display field units 51 or 52 takes place simultaneously, so that the display fields 11 in the display field units 51 or 52 are connected via the same frame adhesive 13 and there is no cutting head gap between the display fields 11. In the second embodiment of the present invention, the coated frame adhesive 13 is cured using a first laser beam, which corresponds to the first laser beam in the first embodiment of the present invention, so that a repeated description of this is unnecessary here.

[0033] Subsequently, the frame adhesive is removed using a second laser beam at the points where cutting is required, so that a broken-off area is generated on the surface of the frame adhesive 13 at the cut points. The second laser beam in the second embodiment of the present invention corresponds to the second laser beam in the first embodiment of the present invention, so a repeated description of this is unnecessary here.

[0034] Finally, the array substrate is cut into individual display fields at the interfaces. The directed arrows in Fig. 5A and Fig. 5B represent the interfaces. In particular, according to the second embodiment of the present invention, the array substrate is cut at the interfaces by cutting the array substrate at the interfaces in the cutting head space, which is arranged between two adjacent rows of display field units, and at the interfaces in the aborted area. Optionally, according to the second embodiment of the present invention, the locations where cutting is required are determined using cutting marker points for alignment in an image control device, in particular alignment marker points in CCD image sensors.The frame adhesive can be removed at the points where cutting is required according to the second embodiment of the present invention using the second laser beam at an energy greater than that of the first laser beam, so that the surface of the frame adhesive 13 can optionally be broken off to simplify cutting for separation and subsequently the frame adhesive can be mechanically cut at the interfaces using a cutter wheel.

[0035] Fig. Figure 6 shows a schematic structural representation of an area 53 of the array substrate made of organic light-emitting diodes 50 in Fig. 5A and an area 54 of the array substrate made of organic light-emitting diodes 50 in Fig. Figure 5B shows a sectional view, the areas comprising an upper substrate 61 and a lower substrate 60, and the frame adhesive 13 between the upper substrate 61 and the lower substrate 60. The dotted lines represent the locations where the frame adhesive is removed using the second laser beam, and also the locations where the array substrate is subsequently mechanically cut using a cutter wheel.

[0036] Fig. Figure 7 shows a schematic structural representation of a single display field as a result of cutting to the state of the art, as a top view, and how from Fig. As can be seen in the 7th image, the state of the art provides a frame area 70 around the individual display field; and Fig. Figure 8 shows a schematic structural representation of a single display field as a result of cutting according to the embodiments of the present invention, as a top view. Fig.It can be seen from Figure 8 that, according to the embodiments of the present invention, there is no frame area around the individual display field, so that the frame can be made narrower and the basic competitiveness of the product according to the present invention can be improved.

[0037] In summary, according to embodiments of the present invention, there is no cutting head space between some adjacent display fields or between all two adjacent display fields, so that all display fields to be packaged can be directly coated with the frame adhesive. This allows the display area to be extended from its inner side and the frame to be narrowed by approximately 500 micrometers, thereby improving the product's competitiveness while maintaining a packaging width of 0.7 mm. Furthermore, it is not necessary to coat each display field to be packaged with the frame adhesive individually, thus reducing the process time, lowering material costs, and improving production efficiency.

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