Processing arrangement and procedure

Abstract

Processing arrangement (100a, 100b, 200), comprising: a wall element (112w, 212w) for closing a vacuum chamber opening, wherein the wall element (112w, 212w) has a mounting area (112b) which is designed for mounting a processing source (102) of a first processing source type (102a) or of a second processing source type (102b) on the wall element (112w, 212w); wherein the first processing source type (102a) and the second processing source type (102b) differ in at least one type of media used for operation; a connection terminal (104) which has several connections for providing several different types of media and is attached to the wall element (112w, 212w); a redistribution arrangement (106) which is coupled to and set up with the connection terminal (104): • in a first configuration (1200a) to couple a first selection from the multiple ports according to the media types used to operate the first processing source type (102a) with the processing source (102) when it is attached to the mounting area (112b) and is the first processing source type (102a); and • in a second configuration (1200b) to couple a second selection from the multiple ports according to the media types used to operate the second processing source type (102b) with the processing source (102) when it is attached to the mounting area (112b) and is the second processing source type (102b).

Description

[0001] The invention relates to a processing arrangement and a method.

[0002] In general, substrates, for example a glass substrate, a metal strip and / or a semiconductor substrate, can be processed (treated), e.g. machined, coated, heated, etched and / or structurally modified. For example, a substrate can be provided with a functional layer (e.g. a layer that can change the electrical and / or optical properties of the substrate) or with a decorative layer so that the chemical and / or physical properties of the substrate can be changed or so that, for example, electronic components can be formed on the substrate. Various processing sources can be used to treat (process) a substrate. For example, a coating device can be used to deposit one or more layers on one or more substrates by means of chemical and / or physical vapor deposition.For physical vapor deposition, see also DE 20 2014 101 468 U1 and DE 10 2010 030 006 A1. For example, a heating device (heating unit) can be used to bring a substrate to a predefined temperature and / or maintain it at that temperature.

[0003] In order to efficiently realize large-area processing on correspondingly large-area substrates or a correspondingly large number of substrates in parallel, a so-called in-line system can be used, in which one or more substrates are transported, for example, through the entire system, whereby during the transport through the in-line system, the substrate or the multiple substrates can be processed in one or more processing sections of the in-line system.

[0004] These processing sections can each have a cover to which the processing technology used for processing is attached. A system is traditionally equipped with the required process technology once during its design, assembly, and configuration, so that the process sequence carried out within it – once defined – is not changed again. Subsequent configuration changes are usually not provided for or not readily possible, e.g., because the number of processing sections or their design are determined with the system's design, which makes adding additional processes or modifying them difficult.

[0005] The choice of process technology, such as magnetrons, heaters, and cooling units, determines the type and design of the lid. In other words, lids are custom-made for the process technology used. For systems with horizontal substrate transport, a distinction is also made as to which side of the substrate is to be coated. Accordingly, the intended assembly of the lids, which are mounted either from below or from above, determines their design. The lids are then removed during system operation only for maintenance of the process technology and for replacing defective process technology.

[0006] The resulting problem is solved by the subject matter of the appended claims.

[0007] According to various embodiments, it has been recognized that the conventional design of the covers only allows for limited flexibility, as they are specifically adapted to the interfaces of the process technology, such as feedthroughs for coolants, process gases, electrical power for the process technology, holders for the process technology, and holders for surrounding components. In other words, their flexibility is limited because the cover is only configured for the components required for the respective process technology. A change in the process sequence therefore requires additional conversion work in and outside the process section, which is often made difficult by the limited space at the installation site of the system. Traditionally, the limited flexibility and the associated effort are accepted because a change in the process sequence is rarely necessary.

[0008] Various embodiments have clearly demonstrated that increasing flexibility in system configuration offers economic and technological advantages, e.g., in modular vacuum coating systems. With greater flexibility, complex conversion work can be avoided and, if necessary, limited to the cover. Various embodiments allow for a quick and cost-effective conversion of the process technology. Alternatively or additionally, a system can be manufactured largely preconfigured, without having to consider the specific process sequence. This allows for cost-effective retrofitting of a system, even retrospectively, and saves inventory costs.

[0009] According to various embodiments, a processing arrangement and a method are provided that clearly provide a high degree of flexibility in the configuration of the system. Clearly, a section cover (cover) is provided that is preconfigured for operation with several different process technologies. For example, all assemblies required for operating the several different process technologies are attached directly to the cover and / or all media types used for operating the several different process technologies are provided by the cover.

[0010] According to various embodiments, a processing arrangement is configured according to the appended claim 1, comprising, inter alia: a wall element for closing a vacuum chamber opening, wherein the wall element has a fastening region configured for fastening a processing source of a first processing source type or a second processing source type to the wall element; a connection terminal (also referred to as a first connection terminal) having a plurality of connections (a plurality of first connections) for providing a plurality of mutually different media types; wherein the first processing source type and the second processing source type differ in at least one media type used for operation (of the plurality of mutually different media types) (also referred to as at least one difference media type);a redistribution arrangement coupled to the connection terminal and configured to: in a first configuration, couple a first selection of the plurality of ports (first port selection) to the processing source when attached to the mounting area and is of the first processing source type according to the media types used to operate the first processing source type; and in a second configuration, couple a second selection of the plurality of ports (second port selection) to the processing source when attached to the mounting area and is of the second processing source type according to the media types used to operate the second processing source type;

[0011] Each media type of the plurality of different media types can have a characteristic quantity which distinguishes it from the other media types of the plurality of different media types, e.g. an electrical quantity (e.g. an electrical voltage, an electrical current, an electrical power, a frequency, etc.), or a material quantity (e.g. a mass flow, a chemical composition, a temperature, a pressure, etc.).

[0012] For example, a first selection from the plurality of mutually different media types (first media type selection) for operating the first processing source type and a second selection from the plurality of mutually different media types (second media type selection) for operating the second processing source type differ in at least one media type (i.e., the at least one difference media type). For example, the first media type selection and the second media type selection may differ in at least one of the following: in the use of the at least one media type (i.e., the difference between the first media type selection and the second media type selection may include the at least one difference media type), a number of media types (e.g., the first media type selection may also be a subset of the second media type selection or vice versa); a value of the characteristic variable of the at least one media type (i.e.,of at least one difference media type).

[0013] The redistribution assembly may be configured to couple, in the first configuration, the first port selection according to the first media type selection to the processing source when it is attached to the mounting area and is the first processing source type; and, in the second configuration, to couple, in the second configuration, the second port selection according to the second media type selection to the processing source when it is attached to the mounting area and is the second processing source type.

[0014] According to various embodiments, the first selection from the plurality of ports may comprise a port of a first media type (first media type port); and the second selection from the plurality of ports may comprise a port of a second media type (second media type port). The first media type may be used to operate the first processing source type, and the second media type may be used to operate the second processing source type and may differ from the first media type. The at least one difference media type may, for example, comprise or be formed from the first media type and / or the second media type.

[0015] According to various embodiments, the first selection of the plurality of ports and the second selection of the plurality of ports may differ by at least one port of the at least one media type (ie, the at least one difference media type) by which the first processing source type and the second processing source type differ for operation.

[0016] According to various embodiments, the fastening region may have at least one through-opening (ie one through-opening or several through-openings).

[0017] According to various embodiments, the redistribution arrangement may comprise: a first redistribution element according to the media types used to operate the first processing source type; a second redistribution element according to the media types used to operate the second processing source type; and a coupling region (first coupling region) for coupling the first redistribution element or the second redistribution element between the connection terminal and the processing source (when the latter is attached to the attachment region); wherein the redistribution arrangement is in the first configuration when the first redistribution element is coupled into the coupling region, and wherein the redistribution arrangement is in the second configuration when the second redistribution element is coupled into the coupling region.

[0018] According to various embodiments, the fastening region can comprise at least one of the following: at least one through-opening for providing a liquid passage; at least one through-opening for providing an electrical passage; at least one through-opening for providing a gas passage; at least one through-opening for providing a drive passage; at least one through-opening for providing a signal passage (e.g., for an electrical, hydraulic, pneumatic, and / or optical communication signal). For example, the signal passage for transmitting optical signals can comprise or be formed from an optical fiber.

[0019] According to various embodiments, one or more through-openings of the fastening region can be electrically and / or thermally insulated.

[0020] According to various embodiments, a through-opening can be configured to provide multiple feedthroughs, ie, it can be clearly large enough to accommodate multiple feedthroughs. In other words, a through-opening can be configured to provide multiple media feedthroughs.

[0021] According to various embodiments, the redistribution arrangement can comprise a cover element configured to provide a passage for more than one medium (multiple media passages) through a passage opening of the mounting region. The cover element can be configured, in the first configuration, to provide a first selection of the passages through a passage opening of the mounting region according to the media types used for operating the first processing source type; and, in the second configuration, to provide a second selection of the passages through the passage opening of the mounting region according to the media types used for operating the second processing source type. Clearly, the redistribution arrangement can comprise a set of cover elements with the respective media passages, which can be inserted into the passage openings of the mounting region in a respective configuration.

[0022] Illustratively, the first configuration can define a first redistribution characteristic, and the second configuration can define a second redistribution characteristic. The first redistribution characteristic and the second redistribution characteristic can differ in at least one media type (e.g., the at least one difference media type), in a number of redistributed media types, and / or in the characteristic size of the at least one media type (e.g., the at least one difference media type).

[0023] According to various embodiments, the connection terminal can provide at least the following media types (in other words, the connection terminal can have multiple connections for providing the following media types): at least one liquid media type (in other words, a liquid); an electrical power; at least one gaseous media type (in other words, a gas); a communication signal. For example, the connection terminal can be configured to connect to or comprise a corresponding (external) media type supply, e.g., a liquid supply; a communication signal supply; an electrical power supply; a gas supply.

[0024] According to various embodiments, the communication signal may comprise or be formed from an electrical communication signal, a hydraulic communication signal, a pneumatic communication signal, and / or an optical communication signal. The communication signal supply may be configured to transmit an electrical communication signal, a hydraulic communication signal, a pneumatic communication signal, and / or an optical communication signal.

[0025] The liquid medium type can comprise or be formed from one or more liquid heat transfer media types (illustratively heat transfer fluid), e.g., a cooling fluid and / or a heating fluid. For example, the multiple liquid heat transfer media types can differ in at least one temperature. For example, differently tempered water circuits can be provided. The multiple connections can comprise at least one connection for each liquid heat transfer media type of the multiple liquid heat transfer media types.

[0026] The liquid supply can be configured to provide a liquid supply. The electrical power supply can be configured to provide electrical power (illustratively several kilowatts). The gas supply can be configured to provide a gas supply (e.g., an inert gas, a reactive gas, a gas mixture, a heat transfer gas, a purge gas, a precursor gas, and / or a working gas).

[0027] The heat transfer gas can comprise or be formed from one or more gaseous heat transfer media types, e.g., a cooling gas and / or a heating gas. For example, the multiple gaseous heat transfer media types can differ in at least one temperature. Illustratively, for example, gas circuits with different temperatures can be provided. The multiple connections can comprise at least one connection for each gaseous heat transfer media type of the multiple gaseous heat transfer media types.

[0028] According to various embodiments, a heat transfer fluid and / or a heat transfer gas may be configured to transfer thermal energy to a processing source (illustratively for heating) and / or may be configured to transfer thermal energy away from a processing source (illustratively for cooling).

[0029] The inert gas can, for example, comprise or be formed from a noble gas and / or nitrogen. The reactive gas can, for example, comprise or be formed from hydrogen, oxygen, water vapor, chlorine, ammonia and / or nitrogen. The nitrogen can be activated to react, for example using a plasma source. The purge gas can comprise or be formed from gas with a predefined composition and / or a predefined purity, for example a gas that is easy to pump out, such as argon. A working gas can be or become defined by the respective process and can, for example, comprise or be formed from a noble gas. A precursor gas can, for example, comprise or be formed from a complex molecule, a halide, a boride, a chloride and / or a carbon-containing molecule.

[0030] According to various embodiments, the gas may comprise at least one of the following gaseous media types: an inert gas; a reactive gas; a gas mixture; a purge gas; a heat transfer gas; a precursor gas; and a working gas. In other words, the plurality of mutually different media types may further comprise at least one of the following media types: an inert gas; a heat transfer gas; a reactive gas; a gas mixture; a purge gas; a precursor gas; and a working gas.

[0031] According to various embodiments, the connection terminal can provide at least one of the following gaseous media types (and / or be configured to connect a corresponding media type supply or comprise these): an inert gas (or an inert gas supply); a heat transfer gas (or a heat transfer gas supply); a reactive gas (or a reactive gas supply); a gas mixture (or a gas mixture supply); a purge gas (or a purge gas supply); a precursor gas (or a precursor gas supply); a working gas (or a working gas supply).

[0032] According to various embodiments, the connection terminal can provide at least one of the following electrical media types (or be configured to connect a corresponding media type supply or have this): an electrical extra-low voltage (or an electrical extra-low voltage supply), e.g., for supplying power to a control unit; an electrical low voltage (or a electrical low voltage supply); an electrical high voltage (or a electrical high voltage supply). The electrical high voltage supply can be configured to provide a supply with an electrical high voltage.

[0033] According to various embodiments, the processing arrangement may further comprise a control unit which, in at least the first configuration and / or the second configuration, is connected between the connection terminal (e.g., its communication signal connection) and the processing source when the processing source is attached to the attachment region, and is configured to process the electrical communication signals and to control the processing source (e.g., attached to the attachment region) on the basis of the electrical communication signals.

[0034] According to various embodiments, the processing arrangement may further comprise the processing source, which is a first processing source type or a second processing source type. Optionally, the first processing source type may be different from the second processing source type.

[0035] According to various embodiments, the first processing source type and / or the second processing source type may be one of the following processing source types: a coating device (coating type); a cooling device (cooling type); a heating device (heating type); an implantation device (implantation type); a cleaning device (cleaning type); an etching device (etching type); a gas separation device (gas separation type); an evacuation device (evacuation type).

[0036] According to various embodiments, the processing arrangement may further comprise at least one cantilever beam (ie one or more cantilever beams) extending away from the wall element for supporting a processing source respectively fastened to the fastening region.

[0037] According to various embodiments, the processing arrangement (e.g., the fastening region and / or the cantilever beam) may comprise at least one fastening element configured to fasten the first processing source type and the second processing source type.

[0038] According to various embodiments, each processing source type can have at least one matching fastening element (e.g., each configured identically), which can be connected to the fastening element of the processing arrangement. For example, a standardized fastening element can be provided on the cantilever beam, to which each processing source type can be mounted. The fastening element is configured, for example, such that it can accommodate each processing source type without modification.

[0039] According to various embodiments, the processing arrangement may comprise a fastening structure with a plurality of fastening elements (e.g., holes, threads, bolts, screws, hooks, eyes), e.g., provided on a cantilever beam and / or on a fastening area. For example, the fastening structure may be an integral part of the transforming element.

[0040] According to various embodiments, the redistribution arrangement may extend (at least partially) into the at least one cantilever beam.

[0041] According to various embodiments, the processing arrangement can further comprise a further connection terminal (second connection terminal), which has a plurality of further connections for providing at least a part (i.e. a part or all) of the plurality of mutually different media types; wherein the wall element has a further fastening area (second fastening area), which is configured identically to the fastening area (first fastening area) (e.g., mirrored on a plane lying between them, e.g., lying in the transport surface); wherein the redistribution arrangement is configured to be uncoupled from the connection terminal and to be coupled to the further connection terminal and is further configured: in a further first configuration, the first selection from at least a part of the plurality of further connections (i.e.,from a portion of the plurality of further connections or from the plurality of further connections) according to the media types used to operate the first processing source type to the processing source when the latter is attached to the further attachment area and is the first processing source type; and in a further second configuration, to couple the second selection from at least a portion of the plurality of further connections (ie from a portion of the plurality of further connections or from the plurality of further connections) according to the media types used to operate the second processing source type to the processing source when the latter is attached to the further attachment area and is the second processing source type.

[0042] According to various embodiments, at least a first media type (first common media type) of the media types used to operate the first processing source type in the further first configuration and / or a second media type (second common media type) of the media types used to operate the second processing source type in the further second configuration can be or will be provided by means of the first connection terminal.The redistribution arrangement can then be configured, in the further first configuration, to couple one of the plurality of connections according to the first common media type to the processing source when the processing source is attached to the further fastening region and is the first processing source type; and / or, in the further second configuration, to couple one of the plurality of connections according to the second common media type to the processing source when the processing source is attached to the further fastening region and is the second processing source type. For example, the first common media type and the second common media type can be the same media type. The redistribution arrangement can then optionally have an internal distributor which distributes the first common media type and / or the second common media type between the fastening region and the further fastening region.

[0043] Illustratively, the further first configuration can be similar to or identical to the first configuration, except that the redistribution arrangement is at least partially coupled between the further connection terminal and the processing source attached to the further attachment area. Illustratively, the further second configuration can be similar to or identical to the second configuration, except that the redistribution arrangement is at least partially coupled between the further connection terminal and the processing source attached to the further attachment area.

[0044] In other words, the redistribution arrangement can be configured such that it can be swapped between the first connection terminal and the second connection terminal, so that the processing source can be operated at both mounting areas without the need to reconfigure the redistribution arrangement. For this purpose, the connection terminal can be configured to be the same as the other connection terminal.

[0045] According to various embodiments, the processing arrangement may further comprise a further redistribution arrangement (second redistribution arrangement); wherein the further redistribution arrangement is configured for coupling to the connection terminal or to the further connection terminal and is configured to be brought into the first, second, further first, or further second configuration. The further redistribution arrangement may be configured in the same way as the redistribution arrangement.

[0046] Analogously, the processing arrangement can have a further processing source (second processing source) of the first processing source type or the second processing source type, which can be or become attached to the fastening region or to the further fastening region. The processing source (first processing source) and the second processing source can be the same or different.

[0047] Alternatively, the processing source and / or the second processing source may also be a third processing source type, wherein the third processing source type and the first processing source type differ in at least one further media type used for operation and / or wherein the third processing source type and the second processing source type differ in at least one further media type used for operation or the further media type.

[0048] The redistribution arrangement (first redistribution arrangement) and / or the further redistribution arrangement (second redistribution arrangement) can be configured to couple, in a third (or further third) configuration, a selection of the plurality of connections of the connection terminal (or the further connection terminal) to the processing source according to the media types used to operate the third processing source type when the processing source is attached to the attachment area (or the further attachment area) and this is the third processing source type.

[0049] Analogously, further processing source types and further configurations of the redistribution arrangement and / or further redistribution arrangement may be or will be provided.

[0050] According to various embodiments, a method is set up according to the appended claim 14, comprising, inter alia: providing a connection terminal having a plurality of ports for providing a plurality of different media types; providing a processing source of a first processing source type or a second processing source type, wherein the first processing source type and the second processing source type differ in at least one media type used for operation; reconfiguring a redistribution arrangement, thereby bringing the redistribution arrangement into a first configuration or into a second configuration, wherein the redistribution arrangement: in the first configuration, couples a first selection of the plurality of ports to the processing source according to the media types used for operation of the first processing source type;and in the second configuration, coupling a second selection of the plurality of ports to the processing source according to the media types used to operate the second processing source type;

[0051] According to various embodiments, the reconfiguration may comprise exchanging a first redistribution element of the redistribution arrangement for a second redistribution element of the redistribution arrangement.

[0052] According to various embodiments, the first processing source type and the second processing source type may differ and / or the first processing source and the second processing source may differ in at least one of the following: a heat source (e.g., a thermal radiation source); a working gas source, an inert gas source; a reactive gas source; a purge gas source; a precursor gas source; a material vapor source; a heat sink (e.g., a thermal radiation sink); a light source; a plasma source; a particle beam source; an etching gas source; an arc source; a glow discharge source; a heat shield; a dark field shield; a gas guide.

[0053] Alternatively or additionally, the third processing source type and the first processing source type and / or the third processing source type and the second processing source type may differ in at least one of the following: a heat source (e.g., a thermal radiation source); a working gas source, an inert gas source; a reactive gas source; a purge gas source; a precursor gas source; a material vapor source; a heat sink (e.g., a thermal radiation sink); a light source; a plasma source; a particle beam source; an etching gas source; an arc source; a glow discharge source; a heat shield; a dark field shield; a gas guide.

[0054] According to various embodiments, the first redistribution arrangement and / or the second redistribution arrangement may extend (at least partially) through the wall element.

[0055] According to various embodiments, each media type of the plurality of mutually different media types can be assigned to at least one port of the first connection terminal and / or the second connection terminal, which is then a media type port (port type) according to the assigned media type.

[0056] The first media type selection and the second media type selection may differ in at least one media type (ie, in its usage and / or a value of its characteristic quantity). Optionally, the first media type selection and the second media type selection may coincide in at least one media type (ie, have a non-empty intersection).

[0057] Alternatively or additionally, the first port selection and the second port selection may differ in at least one media type port and / or at least one port. Optionally, the first port selection and the second port selection may match in at least one media type port and / or at least one port.

[0058] The extra-low voltage electrical media type can have an alternating voltage less than or equal to approximately 50 volts and / or a direct voltage less than or equal to 120 volts. The low voltage electrical media type can have an alternating voltage less than or equal to approximately 1000 volts (V) and / or a direct voltage less than or equal to approximately 1500 volts, e.g., greater than that of the extra-low voltage electrical media type. The high voltage electrical media type can have an alternating voltage and / or direct voltage greater than that of the low voltage electrical media type, e.g., greater than approximately 2000 V, e.g., greater than approximately 5000 V. An electrical voltage media type (i.e., the extra-low voltage electrical media, the low voltage electrical media and / or the high voltage electrical media) can have an electrical current (in amperes) that is more than an order of magnitude smaller (i.e., less than 10%) than its electrical voltage (in volts), e.g.,a current-voltage ratio less than 0.1.

[0059] An electrical power media type can be configured to supply a processing source with a significantly large power requirement (of several kilowatts), e.g. with an electrical power greater than approximately 5 kW (kilowatts), e.g. greater than approximately 10 kW, e.g. greater than approximately 15 kW, e.g. greater than approximately 20 kW, e.g. greater than approximately 50 kW, e.g. in a range from approximately 10 kW to approximately 100 kW, e.g. in a range from approximately 20 kW to approximately 50 kW. A power media type (i.e. the electrical power) can have an electrical current (in amperes) which is greater than approximately 10% of its electrical voltage (in volts), e.g. a current-voltage ratio greater than 0.1 (10%), e.g. greater than approximately 20%, e.g. greater than approximately 30%, e.g. greater than approximately 50%.According to various embodiments, the electrical power medium type can be transmitted using a low voltage, an extra-low voltage, and / or a high voltage. Electrical power can be defined as the product of electrical current and electrical voltage.

[0060] According to various embodiments, a processing arrangement may comprise the following: a wall element for closing a vacuum chamber opening, wherein the wall element has a fastening region; a first processing source of the first processing source type; a second processing source of the second processing source type; a connection terminal with at least a first media type connection and a second media type connection, wherein the first media type connection is configured to provide a first media type and wherein the second media type connection is configured to provide a second media type different from the first media type; a redistribution arrangement which, in a first configuration, couples the first media type connection to the first processing source when the first processing source is fastened to the fastening region of the wall element, for operating the first processing source;and in a second configuration, coupling the second media type connector to the second processing source when the second processing source is attached to the mounting portion of the wall element to operate the second processing source.;

[0061] According to various embodiments, at least the first media type can be used to operate the first processing source and at least the second media type different from the first media type can be used to operate the second processing source.

[0062] According to various embodiments, the first fastening region and the second fastening region can be configured identically. This makes it possible to interchange the processing sources mounted in the fastening regions. Illustratively, the first fastening region and a second fastening region can be identical to one another for free configuration.

[0063] According to various embodiments, the plurality of connections of the first connection terminal (multiple first connections) may include at least one connection for each media type of the plurality of mutually different media types for supplying the first fastening area. According to various embodiments, the plurality of connections of the second connection terminal (multiple second connections) may include at least one connection for each media type of the plurality of mutually different media types for supplying the second fastening area.

[0064] The first redistribution arrangement and / or the second redistribution arrangement can each have a plurality of first redistribution connections for connection to a processing source, which is or will be attached to the first attachment area and / or to the second attachment area. The plurality of first connections and the plurality of second connections can be configured, for example, for connection to an external supply (media type supply), ie, they can be clearly external connections.

[0065] Alternatively, the plurality of first connections can be configured for connecting the first redistribution arrangement or the second redistribution arrangement, respectively, and the plurality of second connections can be configured for connecting the second redistribution arrangement or the first redistribution arrangement. Illustratively, the plurality of first connections or the plurality of second connections can then be internal connections of the processing arrangement. The first connection terminal and / or the second connection terminal can then have a plurality of external connections for connection to an external supply. Each connection of the plurality of external connections can be assigned to at least one connection of the plurality of first connections and at least one connection of the plurality of second connections, and can be coupled thereto, for example.

[0066] Optionally, the first redistribution arrangement and / or the second redistribution arrangement can be configured with a plurality of second redistribution ports for connection to the internal ports of the first connection terminal and / or second connection terminal. For example, each port of the second redistribution ports can be or become coupled to a port of the internal ports.

[0067] According to various embodiments, the wall element can have a process side (also referred to as the vacuum side) and a connection side (also referred to as the atmosphere side) opposite the process side. The first processing source and / or the second processing source can, for example, be or become attached to the process side of the wall element and / or extend away from the wall element toward the process side.

[0068] The first processing source and / or the second processing source, when attached to the wall element, can extend partially through the wall element, e.g., with their connection area. The first redistribution arrangement can be or become coupled to the connection area of ​​the processing source (first processing source) and / or the second redistribution arrangement can be or become coupled to the connection area of ​​the further processing source (second processing source).

[0069] The connection area of ​​the first processing source and / or the second processing source can be configured to connect at least one liquid supply, at least one electrical power supply, at least one electrical high-voltage supply and / or at least one gas supply.

[0070] According to various embodiments, the first redistribution arrangement and / or the second redistribution arrangement can have a plurality of redistribution elements for redistributing the plurality of mutually different media types. For example, each redistribution element can be configured (e.g., preconfigured) to redistribute one or more media types from the first media type selection and / or the second media type selection. For example, the redistribution elements can differ in pairs in at least one (distributed) media type.

[0071] According to various embodiments, the second redistribution arrangement may comprise: a further first redistribution element according to the media types used for operating the first processing source type; a further second redistribution element according to the media types used for operating the second processing source type; and a further coupling region for coupling the further first redistribution element or the further second redistribution element between the second connection terminal and the second processing source (when the latter is attached to the second attachment region); wherein the second redistribution arrangement is in the further first configuration when the further first redistribution element is coupled into the further coupling region, and wherein the second redistribution arrangement is in the further second configuration when the further second redistribution element is coupled into the coupling region.

[0072] According to various embodiments, the first coupling region and the further first coupling region can be configured identically, so that the first redistribution element and the further first redistribution element can be exchanged for one another and / or so that the second redistribution element and the further second redistribution element can be exchanged for one another.

[0073] Optionally, the first redistribution arrangement can have at least one second coupling region for coupling corresponding redistribution elements or a plurality of redistribution elements between the first connection terminal and the first processing source. Alternatively or additionally, the second redistribution arrangement can each have at least one further second coupling region for coupling corresponding redistribution elements or a plurality of redistribution elements between the second connection terminal and the second processing source. Optionally, the second coupling region and the further second coupling region can be configured identically, so that the redistribution elements provided for them can be interchanged.

[0074] The first redistribution arrangement can have a first set of redistribution elements, which in its first configuration are coupled into the coupling regions of the first redistribution arrangement (ie, connected between the first connection terminal and the first processing source). Furthermore, the first redistribution arrangement can have a second set of redistribution elements, which in its second configuration are coupled into the coupling regions of the first redistribution arrangement. The first set of redistribution elements and the second set of redistribution elements can differ from one another in at least one redistribution element.

[0075] The second redistribution arrangement can have a further first set of redistribution elements, which in their further first configuration are coupled into the further coupling regions of the second redistribution arrangement (i.e., connected between the second connection terminal and the second processing source). Furthermore, the second redistribution arrangement can have a further second set of redistribution elements, which in their further second configuration are coupled into the further coupling regions of the second redistribution arrangement. The further first set of redistribution elements and the further second set of redistribution elements can differ from one another in at least one redistribution element.

[0076] Analogously, the first redistribution arrangement and / or the second redistribution arrangement may each comprise a third (or further third) set of redistribution elements.

[0077] Optionally, the coupling regions of the first redistribution arrangement can be configured in the same way as the further coupling regions of the second redistribution arrangement, so that at least two sets of redistribution elements can be exchanged for one another.

[0078] Optionally, the first redistribution arrangement and / or the second redistribution arrangement can share, i.e., use, multiple redistribution elements. For example, the first redistribution element and the further first redistribution element can be the same redistribution element. Alternatively or additionally, the second redistribution element and the further second redistribution element can be the same redistribution element.

[0079] According to various embodiments, a processing arrangement may comprise a vacuum chamber in which one or more processing sections (also referred to as compartments) are provided, each processing section having (e.g., exactly) one vacuum chamber opening (chamber opening) which can be closed with the wall element (e.g., vacuum-tight) and which exposes (makes accessible) the processing section.

[0080] According to various embodiments, a processing unit can comprise the wall element, the connection terminal (e.g., optionally, the further connection terminal), and the redistribution arrangement (e.g., optionally, the further redistribution arrangement). Clearly, the processing unit can form a functional and coherent unit that can be decoupled from the vacuum chamber and / or removed therefrom, e.g., to move it away from the vacuum chamber and / or to replace it with another processing unit. According to various embodiments, a separate media supply can be provided for each processing unit.

[0081] According to various embodiments, a processing arrangement can comprise a plurality of processing units, each processing unit of which can be introduced into a processing section, wherein each processing unit of the plurality of processing units can comprise a wall element, at least one connection terminal and at least one redistribution arrangement.

[0082] According to various embodiments, the processing arrangement may further comprise a transport arrangement for transporting a substrate through the processing section, e.g., along a transport surface. The transport surface may extend between two processing sources if these are attached to the wall element. Thus, processing can take place on both sides. The transport surface may be oriented vertically or horizontally (i.e., transversely to the transport direction). Alternatively, the transport surface may be at any angle to the vertical.

[0083] A processing source type (e.g. the first processing source type and / or the second processing source type) may be configured to process substrates, e.g. at least for coating, irradiating, ablating, cleaning, heating, cooling, converting (e.g. chemically and / or structurally), doping (e.g. chemically) and / or polishing.

[0084] A coating device can be configured for coating and, for example, comprise or be formed from at least one of the following: a physical material vapor source (for coating by means of physical vapor deposition), such as a magnetron (also referred to as a sputtering source, optionally in conjunction with a reactive gas source for reactive sputtering and / or optionally with two magnetron cathodes in the form of a dual magnetron), a laser beam evaporator, an arc evaporator, an electron beam evaporator and / or a thermal evaporator; or a chemical material vapor source (for coating by means of chemical vapor deposition), such as a precursor gas source, optionally in conjunction with a plasma source (for coating by means of plasma-enhanced chemical vapor deposition). The coating device can optionally comprise at least one gas guiding structure, at least one gas distribution structure, at least one anode (e.g.a single anode or a double anode), and / or a diaphragm arrangement for regulating the coating (e.g. for regulating the layer thickness homogeneity).

[0085] Depending on the type of processing source, e.g. the coating device, and its components, the media types used to operate the processing source can vary. For example, precursor gas can be used to operate a chemical material vapor source. The precursor gas can provide one or more layer-forming starting materials, which are separated from the precursor gas by a chemical reaction. In contrast, electrical power can be used to operate a physical material vapor source, which clearly provides the power required to vaporize material. In contrast, at least a working gas and / or a reactive gas can be used to operate a plasma source. The working gas can, for example, be used as a plasma-forming gas. The reactive gas can, for example, be incorporated into the formed layer (e.g., through a chemical reaction with the vaporized material).

[0086] A cleaning device can be configured to remove contaminants (e.g. adsorbates) and can, for example, comprise or be formed from at least one of the following: a glow discharge device, a heating device, a plasma source, an ion beam source, a reactive gas source, a gas guide structure. To operate the glow discharge device, for example, a high electrical voltage used to generate and / or maintain a glow discharge and a working gas through which the glow discharge occurs can be used. To operate the ion beam source, for example, an inert gas can be used as an ion-forming gas. To operate the plasma source, for example, a working gas can be used that is used as a plasma-forming gas.A reactive gas can be used to operate the reactive gas source, which reacts with contaminants to remove them, forming a volatile material. High-voltage electrical energy can also be used to operate the ion beam source and / or the plasma source.

[0087] An exposure device can be configured for light exposure and, for example, can comprise or be formed from at least one light source (e.g., a flash lamp and / or a laser). Electrical power can be used to operate the exposure device. The light source can comprise an electricity-to-light converter configured to convert the electrical power into light (with a corresponding power).

[0088] A heating device can be configured for heating and, for example, comprise or be formed from at least one of the following: a heat radiation source, a gas source, or a gas-conducting structure. An inert gas can be used to operate the gas source, which, for example, provides heat transport away from the heating device by means of convection. Electrical power and, optionally, a cooling liquid can be used to operate the heat radiation source. The heat radiation source can comprise an electricity-to-heat radiation converter configured to convert the electrical power into heat radiation.

[0089] A cooling device (cooling unit) can be configured for cooling and, for example, can have or be formed from at least one of the following: a heat radiation sink, a gas source, a gas guide structure, a heat exchanger. An inert gas can be used to operate the gas source, which gas transports heat to the cooling device, for example by convection. The heat radiation sink can be configured to absorb more heat radiation than it emits. A cooling liquid can be used to operate the heat exchanger, which cools and absorbs thermal energy from the cooling device and transports it away from it. The heat exchanger can, for example, be configured to transfer thermal energy (heat) between two material flows (e.g. inert gas and cooling liquid) or between the heat radiation sink and the cooling liquid.

[0090] A heating device and / or a cooling device can be configured to bring a substrate to a predefined temperature and / or to maintain it at that temperature (e.g., to control its temperature).

[0091] An etching device can be configured to remove material and, for example, comprise or be formed from at least one of the following: a plasma source, an ion beam source, an etching gas source, or a gas guide structure. For example, an inert gas can be used to operate the ion beam source, which is used as an ion-forming gas. A high electrical voltage and an inert gas can be used to operate the plasma source. An etching gas can be used to operate the etching gas source, which is configured to etches (i.e., chemically reacts with) a material of the substrate (substrate material). The etching device can be configured similarly to a cleaning device, wherein an etching device is configured to remove substrate material itself, whereas the cleaning device leaves the substrate undamaged.

[0092] An implantation device can be configured to implant a dopant and, for example, comprise or be formed from at least one of the following: a chemical dopant source, a physical dopant source. To operate the chemical dopant source, a reactive gas and / or a precursor gas can be used, which provide the atom type to be doped (in other words, the dopant), i.e., the atom type that is incorporated into the layer. For example, the reactive gas can be formed from the dopant (e.g., nitrogen). A physical dopant source can provide an ion beam that comprises the dopant. To operate the physical dopant source, a gas can be used, wherein ions of the dopant are formed from the gas.

[0093] An evacuation device (illustratively a gas sink) can be configured to create a negative pressure, e.g., a vacuum (e.g., with a predetermined pressure and / or a predetermined composition) and, for example, can comprise or be formed from at least one of the following: a cold trap, a high-vacuum pump (e.g., a turbomolecular pump, a sublimation pump, a sorption pump, and / or a cryopump), or a rough vacuum pump. An extra-low voltage and / or a low voltage electrical system can be used to operate the evacuation device.

[0094] A vacuum can have a pressure from the rough vacuum (rough vacuum range), ie in a range from approximately 10 mbar to approximately 1 mbar, a pressure from the fine vacuum (fine vacuum range), ie in a range from approximately 1 mbar to approximately 10 -3 mbar, or a pressure from high vacuum (high vacuum range), ie in a range of approximately 10-3 mbar to approximately 10 -7 mbar. For example, the vacuum can be provided in the vacuum chamber.

[0095] A processing source type can optionally include a gas separation device, which can include one or more gas separation plates and / or a purge gas source (gas separation gas source). A purge gas (gas separation gas) can be used to operate the purge gas source.

[0096] Alternatively or in addition to one or more processing sources, one or more gas separation devices can also be attached to the wall element (e.g., to one or both attachment areas). A gas separation device can be configured to provide a gas separation effect. A gas separation device can comprise one or more gas separation plates, a gas guide structure, a gas distributor, and / or a purge gas source (gas separation gas source). A purge gas (gas separation gas) can be used to operate the purge gas source.

[0097] The plurality of different media types may comprise at least two different media types, e.g. at least three different media types, e.g. at least four different media types, e.g. at least five different media types, e.g. at least six different media types.

[0098] According to various embodiments, the first connection terminal and / or the second connection terminal can be attached to the wall element, e.g., opposite the connection side. Then, if the wall element covers the chamber opening, the first connection terminal and / or the second connection terminal can be arranged above the vacuum chamber. This can make it possible to reach the first connection terminal and / or the second connection terminal from a position on the vacuum chamber, saving space and effort.

[0099] According to various embodiments, the processing arrangement can comprise a media type channel configured to accommodate a plurality of media type lines. The plurality of media type lines can comprise at least one media type line for each of the plurality of mutually different media types for transmitting the media type to the first connection terminal and / or the second connection terminal via the media type line. Clearly, the first connection terminal and / or the second connection terminal can be connected and maintained from above the vacuum chamber, saving space and effort.

[0100] According to various embodiments, the processing arrangement can have a generator, which is carried, for example, by the wall element. The generator can be or become integrated into the processing unit. The generator can be configured to provide a high electrical voltage, a low electrical voltage, and / or an extra-low electrical voltage. This makes it possible to provide all other electrical media types (high electrical voltage, low electrical voltage, extra-low electrical voltage) within the processing arrangement by means of a (clearly uniform) electrical power supply. Thus, at least one connection for providing an electrical media type can be dispensed with, for example the connection for providing the high electrical voltage, the connection for providing the low electrical voltage, and / or the connection for providing the extra-low electrical voltage.

[0101] According to various embodiments, the generator may be configured to: in the first configuration, provide a first selection from the plurality of electrical media types according to the electrical media types used to operate the first processing source type when attached to the attachment region and is the first processing source type; and in the second configuration, provide a second selection from the plurality of electrical media types according to the electrical media types used to operate the second processing source type when attached to the attachment region and is the second processing source type.

[0102] This creates space for additional modules and / or connections. For example, modules can be integrated into the connection terminal (e.g., 19"), so that the terminal not only provides a connection and distribution function, but also allows for modification of the electrical power. This allows for a standardized interface for the electrical power supply, e.g., a magnetron, to be provided, enabling a more compact design. For example, additional generator cabinets can be omitted, resulting in less space required. Alternatively or additionally, better configurability when switching between AC and DC power (e.g., when switching between a DC magnetron and an AC magnetron) can be provided by replacing the generator.

[0103] According to various embodiments, an electrical media type (e.g., high voltage electrical, extra-low voltage electrical, low voltage electrical, and / or electrical power) may comprise at least two electrical media types that differ in an electrical frequency and / or in the polarization change (illustratively, alternating voltage or direct voltage).

[0104] Two processing source types can differ, for example, in their electrical power supply (AC, DC, three-phase). In this case, a connector that provides the electrical power supply can have an adapter that allows connection of the respective power supply to the respective configuration.

[0105] Embodiments of the invention are illustrated in the figures and are explained in more detail below. It shows Fig. 1A shows a processing arrangement according to various embodiments in a schematic view; Fig. 1B a processing arrangement according to various embodiments in a schematic cross-sectional view Fig. 2 shows a processing arrangement according to various embodiments in a schematic perspective view; Fig. 3 shows a processing arrangement according to various embodiments in a schematic perspective view; Fig. 4A and Fig. 4B shows a processing arrangement according to various embodiments in a schematic side view; Fig. 5 shows a processing arrangement according to various embodiments in a schematic front view; Fig. 6 shows a processing arrangement according to various embodiments in a schematic perspective view; Fig. 7 shows a processing arrangement according to various embodiments in a schematic perspective view; Fig. 8 shows a processing arrangement according to various embodiments in a schematic perspective view; Fig. 9 shows a processing arrangement according to various embodiments in a schematic perspective view; Fig. 10 shows a processing arrangement according to various embodiments in a schematic perspective view; Fig. 11 shows a processing arrangement according to various embodiments in a schematic perspective view; Fig. 12A and Fig. 12B each show a processing arrangement according to various embodiments in a schematic view; and Fig. 13 a processing arrangement according to various embodiments in a schematic cross-sectional view.

[0106] In the following detailed description, reference is made to the accompanying drawings, which form a part hereof, and in which is shown by way of illustration specific embodiments in which the invention may be practiced. In this regard, directional terminology such as "top," "bottom," "front," "back," "fore," "rear," etc., will be used with reference to the orientation of the described figure(s). Since components of embodiments can be positioned in a number of different orientations, the directional terminology is for purposes of illustration and is in no way limiting. It is to be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present invention.It is understood that the features of the various exemplary embodiments described herein may be combined with one another unless specifically stated otherwise. The following detailed description is therefore not to be construed in a limiting sense, and the scope of the present invention is defined by the appended claims.

[0107] Throughout this description, the terms "connected," "attached," and "coupled" are used to describe both a direct and an indirect connection, a direct or indirect connection, and a direct or indirect coupling. In the figures, identical or similar elements are provided with identical reference numerals where appropriate.

[0108] According to various embodiments, a universal concept for a cover flange is provided. The cover flange can be used to close a vacuum chamber. In other words, the wall element can be configured, for example, to match a vacuum chamber, so that the wall element covers a chamber opening of the vacuum chamber and / or closes it vacuum-tight, i.e., can be used as a cover. Clearly, at least one processing source can be or will be attached to the cover flange (wall element) (i.e., one processing source or multiple processing sources can be or will be attached thereto).

[0109] According to various embodiments, it is possible to install (i.e., for mounting and / or connecting) and / or convert different processing source types (process technology) with the least possible conversion effort. Alternatively or additionally, it is possible to arrange the processing source in such a way that processing (treatment) of both the underside and the top side of the substrate is possible. For this purpose, according to various embodiments, the components used to operate the processing source (e.g., control, electrical, drive, etc.) can be arranged on the cover flange, e.g., fastened to it. Thus, the cover flange can be replaced as a whole, without having to replace the components used to operate the processing source types.

[0110] A processing source type may comprise a heat source and / or heat sink, which are configured jointly and / or individually for controlling the temperature of the substrate (i.e., for controlling and / or regulating the substrate temperature). Alternatively or additionally, a processing source type may also comprise components for substrate pretreatment, such as a glow discharge source and / or an ion source, but also components for substrate coating, such as a sputter source (e.g., with a planar target or a tubular target).

[0111] Fig. 1A illustrates a processing arrangement 100a according to various embodiments in a schematic view.

[0112] The processing arrangement 100a can have a connection terminal 104, which has a plurality of connections for providing a plurality of different media types. The connection terminal 104 can, for example, have at least one first connection 104a of a first media type (first media type connection 104a) for providing the first media type (e.g., a gas) and can have at least one second connection 104b of a second media type (second media type connection 104b) for providing the second media type (e.g., a liquid). The first connection 104a can, for example, have or be formed from a gas connection (gaseous media type connection), and the second connection 104b can, for example, have or be formed from a liquid connection (liquid media type connection).

[0113] The processing arrangement 100a can be configured to operate a processing source 102. The processing source 102 can be a first processing source type 102a or a second processing source type 102b, which differ from one another in at least one media type used for operation. In other words, a first selection 108a of the plurality of mutually different media types (first media type selection 108a) for operating the first processing source type 102a and a second selection 108b of the plurality of mutually different media types (second media type selection 108b) for operating the second processing source type 102b can differ from one another in at least one media type. For example, the first media type selection 108a can comprise the gas that is missing from the second media type selection 108b. Alternatively or additionally, the second media type selection 108b can comprise the liquid that is missing from the first media type selection 108a.

[0114] The first media type selection 108a and / or the second media type selection 108b can have at least one additional media type, e.g., at least two additional media types, e.g., at least three additional media types, e.g., at least four additional media types, e.g., at least five additional media types, e.g., at least six additional media types. The plurality of mutually different media types can have at least the union of the media types of the first media type selection 108a and the media types of the second media type selection 108b, or can be formed therefrom.

[0115] According to various embodiments, the first media type selection 108a and the second media type selection 108b may be equally powerful (ie, have the same number of media types), as in Fig. 1A. Alternatively, the first media type selection 108a may be more powerful than the second media type selection 108b, or vice versa. For example, the first media type selection 108a may have a larger number of media types than the second media type selection 108b, or vice versa.

[0116] The processing arrangement 100a may further comprise a redistribution arrangement 106 which is coupled to the connection terminal 104.

[0117] The redistribution arrangement 106 can be configured, in a first configuration 1200a (Configuration 1, see also Fig. 12A) to couple 110 a first selection from the plurality of ports (first port selection), e.g. at least the first port 104a, to the processing source 102 according to the media types used to operate the first processing source type (the first media type selection 108a), if this is the first processing source type 102a.

[0118] The redistribution arrangement 106 may further be configured, in a second configuration 1200b (Configuration 2, see also Fig. 12B) to couple 110 a second selection from the plurality of ports (second port selection), e.g. at least the second port 104b, to the processing source 102 according to the media types used to operate the second processing source type (the second media type selection 108b), if this is the second processing source type 102b.

[0119] The processing arrangement 100a can have a plurality of areas in which the processing arrangement 100a is clearly configured for different functions. In a first area 101 of the plurality of areas (see also Fig. 2) The processing arrangement 100a can provide a transition between the connection terminal 104 (or its multiple connections 104a, 104b) and the redistribution arrangement 106 (e.g., a coupling thereto). For example, the connection terminal 104 can have the multiple connections 104a, 104b in the first region 101.

[0120] Other areas of the plurality of areas may be configured according to a configuration of the redistribution assembly 106.

[0121] In a second area 103 of the several areas (compare Fig. 2) the redistribution arrangement 106, e.g. in the first configuration 1200a, can be configured at least to distribute the first media type (e.g. the gas, illustratively a gas redistribution region 103).

[0122] In a third area 105 of the several areas (see also Fig. 2) the redistribution arrangement 106, e.g. in the second configuration 1200b, can be configured at least to distribute the second media type (e.g. the liquid, illustratively a liquid redistribution region 105).

[0123] In a fourth region 107 of the plurality of regions, the processing arrangement 100a, e.g. the redistribution arrangement 106, can be configured for coupling and / or decoupling to the processing source 102.

[0124] The redistribution arrangement 106 can be configured to be or become at least partially uncoupled and / or coupled (coupled) from the connection terminal 104 (e.g., in the first area 101). Alternatively or additionally, the redistribution arrangement 106 can be configured to be or become at least partially uncoupled and / or coupled from the processing source 102 (e.g., in the fourth area 107). Thus, the redistribution arrangement 106 can be replaced and / or reconfigured.

[0125] Fig. 1B illustrates a processing arrangement 100b according to various embodiments in a schematic cross-sectional view (e.g., cut transversely to a transport direction).

[0126] The processing arrangement 100b may include a wall element 112w having a mounting area 112b configured for mounting a processing source 102. The mounting area 112b may include one or more mounting structures, e.g., holes, threads, bolts, screws, hooks, eyelets, etc.

[0127] According to various embodiments, the processing arrangement 100b can include a vacuum chamber 114. The vacuum chamber 114 can include a vacuum chamber opening 114o configured to fit the wall element 112w. When the wall element 112w rests on the vacuum chamber opening 114o, the wall element 112w can close the vacuum chamber 114 in a vacuum-tight manner.

[0128] The processing source 102 attached to the wall element 112w can extend into the vacuum chamber 114. The processing source 102 can be arranged on a process side 114p (also referred to as the vacuum side 114p) of the wall element 112w. The process side 114p can clearly point toward the vacuum chamber 114 when the wall element 112w rests on the vacuum chamber opening 114o. The redistribution arrangement 106 can be arranged on a side 114a of the wall element 112w opposite the process side 114p (also referred to as the atmosphere side 114a). For example, the redistribution arrangement 106 can be attached to the wall element 112w.

[0129] The connection terminal 104 can be arranged on the atmosphere side 114a of the wall element 112w. For example, the connection terminal 104 can be attached to the wall element 112w.

[0130] The connection terminal 104 may be coupled 116 to the redistribution assembly 106. The redistribution assembly 106 may be coupled 118 to the processing source 102, e.g., when the processing source 102 is attached to the attachment area 114b.

[0131] For this purpose, the processing arrangement 100b, e.g. the redistribution arrangement 106, can be configured in the fourth region 107 of the plurality of regions (e.g. in the fastening region 112b), e.g. on the vacuum side 114p and / or on the atmosphere side 114a, for coupling and / or uncoupling to the processing source 102.

[0132] Fig. 2 illustrates a processing arrangement 200 according to various embodiments in a schematic perspective view According to various embodiments, the processing arrangement 200 may have two mounting areas 112b, 212b (first mounting area 112b and second mounting area 212b), each of which is configured to mount a respective processing source 102. The transport surface 111f, along which substrates can be transported, may be arranged between the two mounting areas 112b, 212b.

[0133] The two fastening areas 112b, 212b can be configured identically to one another. The two fastening areas 112b, 212b can each have at least one through-opening 112o, 212o (feedthrough), i.e., one through-opening 112o, 212o or multiple through-openings 112o, 212o. For example, the wall element 112w can have multiple standardized feedthroughs. For example, at least one through-opening 112o, 212o can be arranged on both sides of the transport surface 111f in a mirrored position and / or shape, e.g., mirrored on a plane lying between them, e.g., lying in the transport surface 111f.

[0134] According to various embodiments, the processing arrangement 200 may include two cantilever beams 120, 220 (first cantilever beam 120 and second cantilever beam 220) that are attached to the wall element 112w and extend away from the wall element 112w. The two cantilever beams 120, 220 (support arms) may be configured to support processing sources that are each attached to the two attachment areas 112b, 212b. The first cantilever beam 120 (illustratively the upper support arm) may be configured to support (hold) the first processing source (e.g., it may hang from the first cantilever beam 120). The second cantilever beam 220 (illustratively the lower support arm) may be configured to support the second processing source (e.g., it may be supported by the second cantilever beam 220). The transport surface 111f, along which substrates can be transported, can be arranged between the two cantilever beams 120, 220.

[0135] According to various embodiments, the processing arrangement 200 can have two connection terminals 104, 204 (first connection terminal 104 and second connection terminal 204), each having a plurality of connections for providing the plurality of different media types. The first connection terminal 104 can be assigned to the first fastening region 112b, i.e., can be configured to supply a first processing source (not shown) attached to the first fastening region 112b. The second connection terminal 204 can be assigned to the second fastening region 212b, i.e., can be configured to supply a second processing source (not shown) attached to the second fastening region 212b.

[0136] At least one connection of a media type of the second connection terminal 204 and at least one connection of the one media type of the first connection terminal 104 can form a connection set of the one media type for providing the one media type of the plurality of mutually different media types. The connection set can also have two connections of the first connection terminal 104 and / or two connections of the second connection terminal 204, each of the one media type.

[0137] In other words, the processing arrangement 200 can have a plurality of connection sets for providing the plurality of different media types. Illustratively, the processing arrangement 200 can have a connection set for each of the plurality of different media types.

[0138] For example, the processing arrangement 200 may include a first connection set 104a, 204a for providing a first media type (e.g., a gas, e.g., a working gas). The first connection set 104a, 204a may include a first connection 104a and a second connection 204a. For example, the processing arrangement 200 may include a second connection set 104b, 204b for providing a second media type (e.g., a liquid).

[0139] The second connection set 104b, 204b may include a first connection 104b and a second connection 204b. For example, the processing arrangement 200 may include a third connection set 104c, 204c for providing a third media type (e.g., electrical power). The third connection set 104c, 204c may include a first connection 104c and a second connection 204c. For example, the processing arrangement 200 may include a fourth connection set 104d, 204d for providing a fourth media type (e.g., a high electrical voltage). The fourth connection set 104d, 204d may include a first connection 104d and a second connection 204d.

[0140] The first port 104a, 104b, 104c, 104d of each port set of the plurality of port sets may be configured (e.g., standardized) to be the same as the second port 204a, 204b, 204c, 204d of each port set of the plurality of port sets.

[0141] According to various embodiments, the processing arrangement 200 may include two redistribution arrangements (first redistribution arrangement and second redistribution arrangement). The first redistribution arrangement may be configured according to the media types used to operate a processing source type of the processing source (not shown) to be attached to the first attachment area 112b. The second redistribution arrangement may be configured according to the media types used to operate a processing source type of the processing source (not shown) to be attached to the second attachment area 212b.

[0142] The processing arrangement 200 can have the plurality of regions. In the first region 101 (media connection region 101) of the plurality of regions (see also Fig. 1A), e.g., on the atmosphere side 114a of the wall element 112w, the processing arrangement 200, e.g., the first connection terminal 104, can provide a transition between the plurality of connections 104a, 104b, 104c, 104d of the first connection terminal 104 and the first redistribution arrangement. Furthermore, the processing arrangement 200, e.g., the second connection terminal 204, can provide a transition in the first region 101 between the plurality of connections 204a, 204b, 204c, 204d of the second connection terminal 204 and the second redistribution arrangement 106.

[0143] For example, the first connection terminal 104 and / or the second connection terminal 204 in the first region 101 can each have the plurality of connections. Clearly, the first region 101 can be used as a transition region for the uniform outer (external) media type connections (media connections, e.g., signal connections) to the individual cover regions.

[0144] In a second area 103 of the several areas (see also Fig. 1A), the first redistribution arrangement can be configured to distribute a first media type (e.g., a gas, illustratively a gas redistribution region 103). In a further second region 203 of the plurality of regions, the second redistribution arrangement can be configured to distribute the first media type (e.g., a gas, illustratively, a further gas redistribution region 203).

[0145] In a third area 105 of the several areas (see also Fig. 1A), the first redistribution arrangement and / or the second redistribution arrangement can be configured to distribute the second media type (e.g., a liquid, illustratively liquid redistribution region 105).

[0146] The processing arrangement 200, e.g., the first redistribution arrangement, can be configured in a fourth region 107 of the plurality of regions (e.g., in the first mounting region 112b), e.g., on the vacuum side 114p and / or on the atmosphere side 114a, for coupling and / or uncoupling to a processing source (e.g., a first processing source) attached to the first mounting region 112b. The processing arrangement 200, e.g., the second redistribution arrangement, can be configured in a further fourth region 207 of the plurality of regions (e.g., in the second mounting region 212b), e.g., on the vacuum side 114p and / or on the atmosphere side 114a, for coupling and / or uncoupling to a processing source (e.g., a second processing source) attached to the second mounting region 212b. Fig. 3 illustrates a processing arrangement 300 according to various embodiments in a schematic perspective view, e.g., similar to the processing arrangement 200 with mounted processing sources 102, 202.

[0147] According to various embodiments, the processing arrangement 300 may comprise two processing sources 102, 202, e.g., a first processing source 102 of a first processing source type 102a and a second processing source 202 of a second processing source type 102b. The first processing source 102 may be attached to the first attachment region 112b, and the second processing source 202 may be attached to the second attachment region 212b.

[0148] The first processing source type 102a can be a coating device and have two magnetrons, a so-called dual magnetron. The dual magnetron can have two rotatably mounted magnetron cathodes 302, each of which has or is formed from a target material and is tubular. The magnetron cathodes 302 can each be rotatably mounted by means of a bearing 302l, wherein the bearings 302l can be held by the first cantilever beam 120. Alternatively, the first processing source type can have exactly one magnetron, a so-called single magnetron, with a magnetron cathode 302.

[0149] The first media selection can comprise at least one working gas that can be used as a plasma-forming gas. Furthermore, the first media selection can comprise electrical power that can be used to form and / or maintain the plasma. The dual magnetron can be operated, for example, with direct current and / or alternating current. Optionally, the first media selection can comprise a liquid that can be used to cool at least one magnetron cathode 302.

[0150] The first processing source 102 can be supplied with the first media selection through the at least one through-opening (hidden in the view) of the first fastening region 112b. Optionally, the first processing source 102 can be supplied with at least some media types of the first media selection through the first cantilever arm 120. For this purpose, the first cantilever arm 120 can have at least one connection region to which the first processing source 102 is or can be connected. The first redistribution arrangement can extend at least partially into the first cantilever arm 120 and / or be coupled to its connection region. For example, a gaseous media type (e.g., a gas separation gas, a purge gas, or water vapor) can be guided through the first cantilever arm 120, e.g., to its connection region, to which at least one gas inlet can be coupled.

[0151] Optionally, the first processing source 102 can be supplied with drive energy through the at least one through-opening of the first fastening region 112b. For this purpose, the first processing source 102 can have at least one drive (one drive or two drives) that drives at least one magnetron cathode 302 of the first processing source 102. To operate the at least one drive, the first media selection can further have an extra-low electrical voltage and / or a low electrical voltage. The at least one drive can be provided together with a media feedthrough (through the wall element 112w) by means of an end block (also referred to as a candilever end block), which can be arranged on the atmosphere side 114a.

[0152] Alternatively, the drive can be omitted, for example if a flat magnetron cathode (a so-called planar magnetron) is used instead of the at least one rotatably mounted magnetron cathode 302.

[0153] Optionally, the first processing source 102 may have a diaphragm arrangement, which may be attached, for example, to the first cantilever beam 120 and / or to the first attachment region 112b.

[0154] Optionally, the first processing source 102 can have at least one gas inlet (not shown), which can be fastened, for example, to the first cantilever beam 120 and / or to the first fastening region 112b. The at least one gas inlet can, for example, have two gas inlets arranged on opposite sides of the dual magnetron (or single magnetron). Alternatively or additionally, the at least one gas inlet can, for example, have a gas inlet arranged between the two magnetron cathodes 302 of the dual magnetron. The at least one gas inlet can have multiple segments and / or can have multiple gas inlet openings (e.g., in each segment). For operating the at least one gas inlet, the first media selection can comprise a gas, e.g., a process gas. The process gas can comprise a working gas and, optionally, a reactive gas (e.g., in the form of a gas mixture) for reactive sputtering.Optionally, the first media selection may comprise two cooling liquids (each for one magnetron cathode 302).

[0155] Optionally, the first processing source 102 can have an anode assembly, which can be attached, for example, to the first cantilever beam 120 and / or to the first attachment region 112b. Electrical power can be applied between the anode assembly and at least one magnetron cathode 302.

[0156] The anode arrangement can have at least one anode structure (not shown) coupled to the first cantilever support 120, which extends on both sides of at least one magnetron cathode 302 of the first processing source 102 in the direction of the transport surface 111f. If two magnetron cathodes 302 are used, the anode arrangement can have two anode structures (not shown) coupled to the first cantilever support 120, each of which extends on both sides of one of the two magnetron cathodes 302 in the direction of the transport surface 111f. A gas inlet can be arranged between the two anode structures. The anode structures can guide the gas provided by the gas inlet in the direction of the transport surface 111f, i.e., act as a gas guide structure.

[0157] The second processing source type 102b can be a heating device and include at least one heat radiation source 304. The at least one heat radiation source 304 can be held by the second cantilever beam 220. For example, the at least one heat radiation source 304 can include one heat radiation source 304 or two heat radiation sources 304.

[0158] The second media selection can comprise at least one electrical power that can be converted into thermal radiation. The heating device can be operated, for example, with direct current and / or alternating current. A heating device and / or a cooling device do not necessarily require a gaseous media type for operation.

[0159] The second media selection can optionally include a liquid that can be used as a cooling liquid. The cooling liquid can be used to cool heat-sensitive components of the second processing source 202.

[0160] The second processing source 202 can be supplied with the second media selection through the at least one through-opening (hidden in the view) of the second fastening region 212b. Optionally, the second processing source 202 can be supplied with at least some media types of the second media selection through the second cantilever arm 220. For this purpose, the second cantilever arm 220 can have at least one connection region to which the second processing source 202 is or can be connected. The second redistribution arrangement can extend at least partially into the second cantilever arm 220 and / or be coupled to its connection region. For example, a gaseous media type (e.g., a gas separation gas, a purge gas, or water vapor) can be guided through the second cantilever arm 220, e.g., to its connection region, to which at least one gas inlet can be coupled.

[0161] Optionally, the second processing source 202 can have at least one gas inlet (not shown), which can be fastened, for example, to the second cantilever beam 220 and / or to the second fastening region 212b. The at least one gas inlet can, for example, have two gas inlets arranged on opposite sides of the at least one heat radiation source 304. Alternatively or additionally, the at least one gas inlet can, for example, have a gas inlet arranged between the two heat radiation sources 304 of the second processing source 202. The at least one gas inlet can have a plurality of segments and / or can have a plurality of gas inlet openings (e.g., in each segment). For operating the at least one gas inlet, the second media selection can comprise a gas, e.g., an inert gas and / or a purge gas.

[0162] The first cantilever beam 120 and the second cantilever beam 220 can be configured identically (e.g., mirrored on a plane lying between them, e.g., lying in the transport surface 111f). This allows the first processing source 102 and the second processing source 202 to be interchangeable. For example, the first cantilever beam 120 and the second cantilever beam 220 can have at least one connection region or at least one mounting region to which components of the first processing source 102 or the second processing source 202 can be connected or fastened. The first cantilever beam 120 and the second cantilever beam 220 can each have at least one connection region and / or at least one mounting region whose position and / or orientation is mirrored, e.g., on a plane lying between the two cantilever beams 120, 220, e.g., lying in the transport surface 111f.

[0163] To supply the first processing source 102 with the first media selection, the first redistribution arrangement can be in the first configuration 1200a. To supply the second processing source 202 with the second media selection, the second redistribution arrangement can be in the further second configuration 1200b. A coating device redistribution element, e.g., a magnetron redistribution element, can be coupled into the second region 103. A heating device redistribution element, e.g., a heat radiation source redistribution element, can be or become coupled into the further second region 203.

[0164] The first processing source 102 and the second processing source 202 can also be mounted interchangeably. Then, the first redistribution arrangement can be in the second configuration 1200b, and the second redistribution arrangement can be in the further first configuration 1200a. Then, the heating device redistribution element, e.g., the heat radiation source redistribution element, can be coupled into the second region 103, and the coating device redistribution element, e.g., the magnetron redistribution element, can be coupled into the further second region 203.

[0165] Analogously, optionally in the third area 105 (or a further third area 205, compare Fig. 12A and Fig. 12B) a corresponding redistribution element according to the respective configuration of the first redistribution arrangement 106 (or the second redistribution arrangement) can be coupled in. Analogously, optionally in the fifth area 109 (or a further fifth area 209, compare Fig. 12A and Fig. 12B) a corresponding redistribution element can be coupled in accordance with the respective configuration of the first redistribution arrangement 106 (or the second redistribution arrangement).

[0166] The first media selection and the second media selection may differ in at least one of the following: the working gas, the reactive gas, the inert gas, the purge gas, the electrical power value, a liquid (at least a cooling liquid).

[0167] According to various embodiments, each redistribution element of the plurality of redistribution elements may be associated with a processing source type and / or a media selection.

[0168] The first cantilever beam 120 and / or the second cantilever beam 220 can each be mounted from the vacuum side 114p. This eliminates the need for additional through-holes in the wall element 112w.

[0169] Fig. 4A and Fig. 4B illustrate a processing arrangement 400 according to various embodiments in a schematic side view, e.g., the processing arrangement 300.

[0170] According to various embodiments, the wall element 112w can be or become vertically oriented. In other words, the vacuum chamber 114 can have a chamber opening (hidden in the view) which exposes the interior of the vacuum chamber, e.g., a processing section 130 provided therein, along a horizontal direction. The wall element 112w can be moved from one side (e.g., along the horizontal direction) to a horizontally extending transport surface 111f (e.g., substrate transport plane). The transport surface 111f can be arranged approximately centrally (i.e., in the middle) on the wall element 112w, e.g., centrally between the two cantilever arms 120, 220.

[0171] The two cantilever arms 120, 220 can extend along the transport surface 111f (e.g., along the horizontal direction) and be arranged above or below the transport surface 111f. The two cantilever arms 120, 220 can have an extension along the transport surface 111f that is greater than that of the transport surface 111f. Illustratively, the two cantilever arms 120, 220 can span the entire substrate width in their longitudinal extension.

[0172] According to various embodiments, the first cantilever arm 120 may hold the process technology for the substrate top side (e.g., completely) and the second cantilever arm 120 may hold the process technology for the substrate bottom side (e.g., completely). Fig. 5 illustrates a processing arrangement 500 according to various embodiments in a schematic front view (ie, from the direction of the atmosphere side 114a), e.g., the processing arrangement 300.

[0173] The first fastening region 112b and / or the second fastening region 212b can be at least partially (i.e., partially or completely) exposed on the atmosphere side 114a. Alternatively, components of the first processing source 102 or second processing source 202, e.g., electrical components used for operation, can be or will be arranged on the atmosphere side 114a.

[0174] Fig. 6 and Fig. 7 illustrate a processing arrangement 600 according to various embodiments, each in a schematic perspective view from different directions, e.g. the processing arrangement 300.

[0175] The processing arrangement 600 may include a housing 602 for accommodating components of the first processing source 102 and / or the second processing source 202. The housing 602 may be attached to the wall element 112w, e.g., on its atmosphere side 114a.

[0176] The housing 602 may include at least one through-opening 606 that connects the interior of the housing 602 to at least one of the plurality of regions. Thus, at least one region (e.g., one, two, or all regions) of the plurality of regions may be disposed outside the housing 602.

[0177] The first processing source 102 can extend at least partially through at least one through-opening 112o of the first fastening region 112b, e.g., into the interior of the housing 602. Alternatively or additionally, the second processing source 202 can extend at least partially through at least one through-opening 212o of the second fastening region 212b, e.g., into the interior of the housing 602.

[0178] The housing 602 may have at least one movably mounted plate 602p (e.g., a mounting plate) for closing the housing 602. The plate 602p may optionally have a plurality of plate segments, e.g., two plate segments, as shown in Fig. 6 is illustrated.

[0179] In the second area 103 of the several areas (see also Fig. 1A), the first redistribution arrangement may comprise a first media type distributor for distributing the first media type (e.g., the gas). For example, the first media type distributor may comprise or be formed from a gas distributor. Optionally, the first redistribution arrangement in the second region 103 of the plurality of regions may comprise a first media type supply controller or first media type supply regulator for the controlled or regulated supply of the first media type, for example, one or more first mass flow controllers.

[0180] For example, a section can have multiple gas supply areas, each of which can be supplied with a regulated and / or controlled gas flow into the gas supply area by means of a mass flow controller, e.g., through a segmented gas channel. For example, a multi-part gas distributor can be used, which is configured to supply the multiple gas supply areas. In other words, each gas supply area can be assigned a mass flow controller, which is configured to supply the gas supply area with a (e.g., gaseous) media type (e.g., a process gas).

[0181] Illustratively, a controller can have a forward-directed control path and thus clearly implement a sequence control that converts an input variable into an output variable. However, the control path can also be part of a control loop, so that a closed-loop control is implemented. In contrast to pure forward control, the closed-loop control has a continuous influence of the output variable on the input variable, which is effected by the control loop (feedback). In the further second area 203 of the multiple areas (see also Fig. 1A), the second redistribution arrangement can comprise a further first media type distributor for distributing the first media type (e.g., the gas). For example, the further first media type distributor can comprise or be formed from a gas distributor. Optionally, the second redistribution arrangement can comprise a further first media type supply controller or further first media type supply regulator in the further second region 203 of the plurality of regions for the controlled or regulated supply of the first media type, for example, a further first mass flow controller.

[0182] In the third area 105 of the several areas (see also Fig. 1A), the first redistribution arrangement and / or the second redistribution arrangement can be configured to distribute the second media type (e.g., the liquid). For this purpose, the first redistribution arrangement and / or the second redistribution arrangement (analogous to that described above) in the third region 105 can each have a second media type distributor for distributing the second media type. For example, the second media type distributor can have a liquid distributor or can be formed therefrom. Optionally, the first redistribution arrangement and / or the second redistribution arrangement in the third region 105 of the plurality of regions can each have a second media type supply control or second media type supply regulation for the controlled or regulated supply of the first media type, for example, a second liquid flow controller and / or a flow control switch (which, for example,provides a minimum flow). For the second redistribution arrangement, a further third area 205 can also be used (see . Fig. 12A and Fig. 12B).

[0183] A media type feed controller or media type feed control may, according to various embodiments, comprise a feed monitor (e.g., a flow monitor) and / or a feed limit (e.g., a flow limit).

[0184] The fourth region 107 of the plurality of regions and a further fourth region 207 can be arranged in the interior of the housing 602. In the fourth region 107 of the plurality of regions (e.g., the first fastening region 112b), e.g., on the atmosphere side 114a, the processing arrangement 600 can be configured to couple (e.g., connect) and / or uncouple (e.g., disconnect) the first redistribution arrangement to the first processing source 102. In the further fourth region 207 of the plurality of regions (e.g., the second fastening region 212b), e.g., on the atmosphere side 114a, the processing arrangement 600 can be configured to couple and / or uncouple the second redistribution arrangement to the second processing source 202. The fourth region 107 and / or the further fourth region 207 can be electromagnetically shielded, e.g., by means of the housing 602.

[0185] According to various embodiments, the first media selection or the second media selection may comprise an electrical communication signal, a hydraulic communication signal, a pneumatic communication signal, and / or an optical communication signal (e.g., transmitted via an optical fiber). For example, a first electrical communication signal may be provided for the first processing source 102. Alternatively or additionally, a second electrical communication signal may be provided for the second processing source 202. Thus, independent communication may be provided with the two processing sources 102, 202.

[0186] According to various embodiments, an electrical communication signal may comprise a digital signal and / or an analog signal. For example, the communication signal may comprise control commands for controlling the first processing source 102 and / or the second processing source 202. Alternatively or additionally, the communication signal may comprise measurement data and / or status data of the first processing source 102 and / or the second processing source 202.

[0187] In a fifth region 109 of the plurality of regions, the processing arrangement 600 can be configured to electrically control and / or process the first electrical communication signal. For example, a control unit (not shown) can be arranged in the fifth region 109, which, in a configuration of the first redistribution arrangement according to the processing source type of the first processing source 102, is connected between the first connection terminal (hidden in the view) and the first processing source 102. The control unit can be configured to process the first electrical communication signals and to control the first processing source 102 based on the first electrical communication signals. Alternatively or additionally, the control unit can be configured to determine a status and / or measurement data of the first processing source 102 and to provide and / or transmit them for reading.

[0188] Alternatively or additionally, the processing arrangement 600 can be configured in a further fifth region 209 of the plurality of regions for electrically controlling and / or processing the second electrical communication signal. For example, a further control unit (not shown) can be arranged in the further fifth region 209, which, in a configuration of the second redistribution arrangement according to the processing source type of the second processing source 202, is connected between the second connection terminal (hidden in the view) and the second processing source 202. The further control unit can be configured to process the second communication signals and to control the second processing source 102 based on the communication signals. Alternatively or additionally, the further control unit can be configured to determine a status and / or measurement data of the second processing source 202 and to make it available for reading and / or to transmit it.

[0189] A substrate 604 can be transported between the first processing source 102 and the second processing source 202 along the transport surface 111f.

[0190] Fig. 8 illustrates a processing arrangement 800 according to various embodiments in a schematic perspective view, e.g., similar to the processing arrangement 200 with mounted processing sources 102, 202.

[0191] According to various embodiments, the processing source type of the first processing source 102 can be a cooling device and can include at least one heat radiation sink 804. The at least one heat radiation sink 804 can be held by the first cantilever beam 120. For example, the at least one heat radiation sink 804 can include one heat radiation sink 804 or two heat radiation sinks 804.

[0192] A third media selection can be used to operate the cooling device. The third media selection can comprise or be formed from at least one liquid that can be used as a cooling fluid.

[0193] Optionally, the first processing source 102 can have at least one gas inlet (not shown), which can be fastened, for example, to the first cantilever beam 120 and / or to the second fastening region 112b. The at least one gas inlet can, for example, have two gas inlets arranged on opposite sides of the at least one heat radiation sink 804. Alternatively or additionally, the at least one gas inlet can, for example, have a gas inlet arranged between the two heat radiation sinks 804 of the first processing source 102. The at least one gas inlet can have a plurality of segments and / or can have a plurality of gas inlet openings (e.g., in each segment). For operating the at least one gas inlet, the third media selection can optionally comprise a gas, e.g., an inert gas and / or a purge gas.

[0194] According to various embodiments, the processing source type of the second processing source 202 may be a coating device and may include at least one magnetron cathode 302 as described above, e.g., at least one rotatably mounted magnetron cathode 302 (may also be referred to as a tubular cathode) or alternatively (not shown) a planar magnetron cathode 302.

[0195] The first media selection can be used to operate the coating device, as described above. The first media selection can include at least one working gas, which can be used as a plasma-forming gas, and an electrical power for forming and / or maintaining the plasma. Optionally, the first media selection can include a cooling liquid for cooling the at least one magnetron cathode 302 and / or a reactive gas.

[0196] To supply the first processing source 102 with the third media selection, the first redistribution arrangement can be in the third configuration. To supply the second processing source 202 with the first media selection, the second redistribution arrangement can be in the further first configuration 1200a.

[0197] A coating device redistribution element, e.g., a magnetron redistribution element, can be or become coupled into the second region 103. A cooling device redistribution element, e.g., a heat sink redistribution element, can be or become coupled into the further second region 203.

[0198] Analogously, optionally in the third area 105 (or a further third area 205, compare Fig. 12A and Fig. 12B) a corresponding redistribution element according to the respective configuration of the first redistribution arrangement 106 (or the second redistribution arrangement) can be coupled in. Analogously, optionally in the fifth area 109 (or a further fifth area 209, compare Fig. 12A and Fig. 12B) a corresponding redistribution element can be coupled in accordance with the respective configuration of the first redistribution arrangement 106 (or the second redistribution arrangement).

[0199] The first processing source 102 and the second processing source 202 can also be mounted interchangeably. Then, the first redistribution arrangement can be in the first configuration 1200a, and the second redistribution arrangement can be in the further third configuration. Then, the cooling device redistribution element, e.g., a heat sink redistribution element, can be coupled into the second region 103, and the coating device redistribution element, e.g., a magnetron redistribution element, can be coupled into the further second region 203.

[0200] Analogously, optionally in the third area 105 (or a further third area 205, compare Fig. 12A and Fig. 12B) a corresponding redistribution element according to the respective configuration of the first redistribution arrangement 106 (or the second redistribution arrangement) can be coupled in. Analogously, optionally in the fifth area 109 (or a further fifth area 209, compare Fig. 12A and Fig. 12B) a corresponding redistribution element can be coupled in accordance with the respective configuration of the first redistribution arrangement 106 (or the second redistribution arrangement).

[0201] The first media selection and the third media selection may differ in at least one of the following: the working gas, the reactive gas, the inert gas, the purge gas, the electrical power, a liquid.

[0202] Fig. 9 illustrates a processing arrangement 900 according to various embodiments in a schematic perspective view, e.g., similar to the processing arrangement 200 with mounted processing sources 102, 202.

[0203] According to various embodiments, the first processing source type and the second processing source type may be the same. For example, the first processing source type and the second processing source type may be a cooling device, as in Fig. 9. It is understood that the first processing source type and the second processing source type may also be a different processing source type (compare Fig. 10 or Fig. 11).

[0204] The third media selection can be used to operate the first processing source 102 and the second processing source 102, respectively. The first redistribution arrangement and the second redistribution arrangement can each be in the third or further third configuration, respectively.

[0205] In the second region 103 and in the further second region 203, a cooling device redistribution element, e.g. a heat radiation sink redistribution element, can be or become coupled.

[0206] Analogously, optionally in the third area 105 (or a further third area 205, compare Fig. 12A and Fig. 12B) a corresponding redistribution element according to the respective configuration of the first redistribution arrangement 106 (or the second redistribution arrangement) can be coupled in. Analogously, optionally in the fifth area 109 (or a further fifth area 209, compare Fig. 12A and Fig. 12B) a corresponding redistribution element can be coupled in accordance with the respective configuration of the first redistribution arrangement 106 (or the second redistribution arrangement).

[0207] Fig. 10 illustrates a processing arrangement 1000 according to various embodiments in a schematic perspective view, e.g., similar to the processing arrangement 200 with mounted processing sources 102, 202.

[0208] According to various embodiments, the first processing source type and the second processing source type may be a heating device. The second media selection may be used to operate the first processing source 102 and the second processing source 102, respectively. The first redistribution arrangement and the second redistribution arrangement may each be in the second or further second configuration 1200b.

[0209] In the second region 103 and in the further second region 203, a heating device redistribution element, e.g. a heat radiation source redistribution element, can be or become coupled.

[0210] Analogously, optionally in the third area 105 (or a further third area 205, compare Fig. 12A and Fig. 12B) a corresponding redistribution element according to the respective configuration of the first redistribution arrangement 106 (or the second redistribution arrangement) can be coupled in. Analogously, optionally in the fifth area 109 (or a further fifth area 209, compare Fig. 12A and Fig. 12B) a corresponding redistribution element can be coupled in accordance with the respective configuration of the first redistribution arrangement 106 (or the second redistribution arrangement).

[0211] Fig. 11 illustrates a processing arrangement 1100 according to various embodiments in a schematic perspective view, e.g., similar to the processing arrangement 200 with mounted processing sources 102, 202.

[0212] According to various embodiments, the first processing source type and the second processing source type can be a coating device. The first media selection can be used to operate the first processing source 102 and the second processing source 102, respectively. The first redistribution arrangement and the second redistribution arrangement can each be in the first and further first configurations 1200a, respectively.

[0213] In the second region 103 and in the further second region 203, a coating device redistribution element, e.g. a magnetron redistribution element, can be coupled in. Analogously, optionally in the third region 105 (or a further third region 205, cf. Fig. 12A and Fig. 12B) a corresponding redistribution element according to the respective configuration of the first redistribution arrangement 106 (or the second redistribution arrangement) can be coupled in. Analogously, optionally in the fifth area 109 (or a further fifth area 209, compare Fig. 12A and Fig. 12B) a corresponding redistribution element can be coupled in accordance with the respective configuration of the first redistribution arrangement 106 (or the second redistribution arrangement).

[0214] Fig. 12A and Fig. 12B each illustrate a processing arrangement according to various embodiments in a schematic view, wherein the first redistribution arrangement 106 and / or the second redistribution arrangement 206 in Fig. 12A in a first configuration 1200a (or further first configuration 1200a) and in Fig. 12B in a second configuration 1200b (or further second configuration 1200b).

[0215] The plurality of different media types may comprise at least two different media types, e.g. at least three different media types, e.g. at least four different media types, as in Fig. 12 is illustrated.

[0216] For example, the first connection terminal 104 and / or the second connection terminal 204 may each have at least one connection 104t of a media type according to a media type for each of the four mutually different media types.

[0217] At least one region of the plurality of regions may be configured to receive a redistribution element of the first redistribution arrangement 106 and to couple it between the first processing source 102 and the first connection terminal 104 (also referred to as a coupling region).

[0218] For example, the second region 103 can be configured as a coupling region. The second region 103 can be configured to receive and couple a first redistribution element 106a of the first redistribution arrangement 106 according to the first configuration 1200a (e.g., a coating device redistribution element). Furthermore, the second region 103 can be configured to receive and couple a second redistribution element 106b of the first redistribution arrangement 106 according to the second configuration 1200b (e.g., a heating device redistribution element), e.g., when the first processing source 102 is the second processing source type.In other words, in the first configuration 1200a, the first redistribution element 106a can be coupled between the first processing source 102 and the first connection terminal 104, and in the second configuration 1200b, the second redistribution element 106b can be coupled between the first processing source 102 and the first connection terminal 104. For example, the first redistribution element 106a can be exchanged for the second redistribution element 106b to move the first redistribution arrangement 106 from the first configuration 1200a to the second configuration 1200b, or vice versa (also referred to as reconfiguring).

[0219] Alternatively or additionally, at least one region of the plurality of regions may be configured such that it can receive a redistribution element of the second redistribution arrangement 206 and can couple between and between the second processing source 202 and the second connection terminal 204.

[0220] For example, the further second region 203 can be configured as a coupling region. The further second region 203 can be configured to receive and couple a further first redistribution element 206b of the second redistribution arrangement 206 according to the further first configuration 1200a (for example, a further coating device redistribution element). Furthermore, the further second region 203 can be configured to receive and couple a further second redistribution element 206b of the second redistribution arrangement 206 according to the further second configuration 1200b (for example, a further heating device redistribution element).In other words, in the further first configuration 1200a, the further first redistribution element 206a can be coupled between the second processing source 202 and the second connection terminal 204, and in the further second configuration 1200b, the further second redistribution element 206b can be coupled between the second processing source 202 and the second connection terminal 204. For example, the further first redistribution element 206a can be exchanged for the further second redistribution element 206b in order to move the second redistribution arrangement 206 from the further first configuration 1200a to the further second configuration 1200b, or vice versa (also referred to as reconfiguring).

[0221] Alternatively or additionally, the second region 103 and the further second region 203 can be configured identically, so that the first redistribution element 106a, the further first redistribution element 206a, the second redistribution element 106b, and the further second redistribution element 206b each fit into both the second region 103 and the further second region 203. In other words, the interfaces of the second region 103 and the further second region 203 can be configured identically. In addition, the interfaces of the first redistribution element 106a, the further first redistribution element 206a, the second redistribution element 106b, and the further second redistribution element 206b can be configured identically and match the interfaces of the second region 103 and the further second region 203. This allows the number of different redistribution elements to be reduced.

[0222] For example, the first redistribution element 106a and the further first redistribution element 206a can be configured identically. Alternatively or additionally, the second redistribution element 106b and the further second redistribution element 206b can be configured identically. For example, the first redistribution arrangement 106 and the second redistribution arrangement 206 can be configured identically.

[0223] Optionally, the third area 105 and / or the further third area 205 can be configured analogously, or the corresponding redistribution elements of the first redistribution arrangement 106 or the second redistribution arrangement 206, so that they, coupled into the third area 105 or the further third area 205, provide a corresponding configuration of the first redistribution arrangement 106 or the second redistribution arrangement 206.

[0224] Optionally, the fifth area 109 and / or the further fifth area 209 can be configured analogously, or the corresponding redistribution elements of the first redistribution arrangement 106 or the second redistribution arrangement 206, so that they, coupled into the third area 105 or further third area 205, provide a corresponding configuration of the first redistribution arrangement 106 or the second redistribution arrangement 206.

[0225] Optionally, the fifth area 109 or the further fifth area 209 can each be configured to distribute at least two media types. For example, the fifth area 109 or the further fifth area 209 can be configured to distribute at least one of the following media types: electrical power, high-voltage electrical power, an electrical communication signal, low-voltage electrical power, or extra-low voltage electrical power.

[0226] For example, the first redistribution arrangement 106 and / or the second redistribution arrangement 206 may each have a redistribution element assigned to each media type of the plurality of mutually different media types, which can be exchanged, for example, for reconfiguration.

[0227] Fig. 13 illustrates a processing arrangement 1300 according to various embodiments in a schematic view.

[0228] The processing arrangement 1300 can have a plurality of processing sections 130, 230, each of which has a chamber opening 114o. For example, a processing section 130, 230 can be defined by its chamber opening 114o. Furthermore, the processing arrangement 1300 can have a plurality of wall elements 112w, 212w, each of which is assigned to a chamber opening 114o, which closes its assigned chamber opening 114o when placed thereon (e.g., vacuum-tight). Furthermore, the processing arrangement 1300 can have a plurality of processing sources, of which at least two processing sources 102, 202 are located in at least one media type used for operation (ieat least in the use of the at least one media type and / or a characteristic size of the at least one media type); wherein at least one first processing source 102 of the at least two processing sources 102, 202 is attached to a first wall element 112w of the plurality of wall elements 112w, 212w and at least one second processing source 202 of the at least two processing sources 102, 202 is attached to a second wall element 212w of the plurality of wall elements 112w, 212w; wherein the first wall element 112w and the second wall element 212w are configured identically. For example, the at least one first processing source 102 and the at least one second processing source 202 can differ from one another in their processing source type.

[0229] According to various embodiments, a separate media interface for the at least one processing source 102, 202 used therein may be or will be provided for each processing section 130, 230 of the processing arrangement 1300.

[0230] Optionally, the processing arrangement 1300 can comprise a plurality of first processing sources 102, which are attached to the first wall element 112w, and / or a plurality of second processing sources 202, which are attached to the second wall element 212w. Optionally, at least two processing sources 102, 202 of the plurality of first processing sources 102 can differ in at least one media type used for operation and / or their processing source type. Alternatively or additionally, at least two processing sources 102, 202 of the plurality of second processing sources 202 can differ in at least one media type used for operation and / or their processing source type.

[0231] The first wall element 112w and the second wall element 212w can each have at least one connection terminal (not shown, see Fig. 1B) for providing a plurality of different media types, wherein the at least one connection terminal (not shown) of the first wall element 112w and the at least one connection terminal (not shown) of the second wall element 212w are configured identically.

[0232] According to various embodiments, the first redistribution arrangement 106 and / or the second redistribution arrangement 206 may be reconfigured such that they are brought into the first configuration 1200a (or further first configuration 1200a) or into the second configuration 1200b (or further second configuration 1200b).

[0233] At least one redistribution element of the plurality of redistribution elements may comprise at least one of the following: a media type distributor (e.g., a gas distributor, liquid distributor, electrical distributor); a media type supply controller; a media type supply regulator; a media type supply line assembly (e.g., electrical conductors, liquid pipes, gas pipes, liquid hoses, etc.); an input interface (for receiving the media type); an output interface (for dispensing the media type); a supply limiter (for limiting the supply); a supply monitor (for monitoring the supply); a sensor assembly (e.g., for determining a characteristic variable of the media type).

[0234] Two redistribution elements of the plurality of redistribution elements may differ in at least one of the following: a media type distributor (e.g., a gas distributor, liquid distributor, electrical distributor); a media type supply controller; a media type supply regulator; a media type supply line arrangement (e.g., electrical conductors, liquid pipes, gas pipes, liquid hoses, etc.); an input interface (for receiving the media type); an output interface (for dispensing the media type); a supply limiter (for limiting the media type); a supply monitor; a sensor arrangement (e.g., for determining a characteristic value of the media type); a configuration of at least one of the aforementioned parts.

Claims

[1] Processing arrangement (100a, 100b, 200), comprising: a wall element (112w, 212w) for closing a vacuum chamber opening, wherein the wall element (112w, 212w) has a fastening region (112b) which is adapted for fastening a processing source (102) of a first processing source type (102a) or a second processing source type (102b) to the wall element (112w, 212w); wherein the first processing source type (102a) and the second processing source type (102b) differ in at least one media type used for operation; a connection terminal (104) having a plurality of connections for providing a plurality of different media types and being attached to the wall element (112w, 212w); a redistribution arrangement (106) which is coupled to the connection terminal (104) and is arranged: • in a first configuration (1200a), to couple a first selection of the plurality of ports according to the media types used to operate the first processing source type (102a) to the processing source (102) when it is attached to the mounting area (112b) and is the first processing source type (102a); and • in a second configuration (1200b), to couple a second selection of the plurality of ports to the processing source (102) when attached to the mounting area (112b) and is the second processing source type (102b) according to the media types used to operate the second processing source type (102b). [2] The processing arrangement (100a, 100b, 200) of claim 1, wherein the first selection from the plurality of ports and the second selection from the plurality of ports differ by at least one port of the at least one media type by which the first processing source type (102a) and the second processing source type (102b) differ in operation. [3] Processing arrangement (100a, 100b, 200) according to claim 1 or 2, wherein the fastening region (112b) has one or more through-openings (112o). [4] Processing arrangement (100a, 100b, 200) according to one of claims 1 to 3, the redistribution arrangement (106) comprising: • a first redistribution element (106a) according to the media types used to operate the first processing source type (102a); • a second redistribution element (106b) according to the media types used to operate the second processing source type (102b); • a coupling region for coupling the first redistribution element (106a) or the second redistribution element (106b) between the connection terminal (104) and the processing source (102); • wherein the redistribution arrangement (106) is in the first configuration (1200a) when the first redistribution element (106a) is coupled into the coupling region, and • wherein the redistribution arrangement (106) is in the second configuration (1200b) when the second redistribution element (106b) is coupled into the coupling region. [5] Processing arrangement (100a, 100b, 200) according to one of claims 1 to 4, wherein the connection terminal (104) provides at least the following media types: at least one liquid media type; an electrical power; at least one gaseous media type; a communication signal. [6] Processing arrangement (100a, 100b, 200) according to one of claims 1 to 5, wherein the connection terminal (104) provides at least one of the following gaseous media types: an inert gas; a heat transfer gas; a reactive gas; a gas mixture; a purge gas; a working gas; a precursor organ. [7] Processing arrangement (100a, 100b, 200) according to one of claims 1 to 6, wherein the connection terminal (104) provides at least one of the following electrical media types: a high electrical voltage; a low voltage electrical system; an electrical low voltage. [8] Processing arrangement (100a, 100b, 200) according to claim 7, further comprising: a control unit which, in at least the first configuration (1200a) and / or the second configuration (1200b), is connected between the connection terminal (104) and the processing source (102) when the processing source (102) is attached to the attachment area (112b), and which is configured to process the electrical communication signals and to control the processing source (102) on the basis of the electrical communication signals. [9] Processing arrangement (100a, 100b, 200) according to one of claims 1 to 8, further comprising: the processing source (102), which is a first processing source type (102a) or a second processing source type (102b), wherein a first selection from the plurality of mutually different media types for operating the first processing source type (102a) and a second selection from the plurality of mutually different media types for operating the second processing source type (102b) differ in at least one media type. [10] Processing arrangement (100a, 100b, 200) according to claim 9, wherein the first processing source type (102a) and / or the second processing source type (102b) are one of the following: a coating device; a cooling device; a heating device; an implantation device; a cleaning device; an exposure device; an etching device; a gas separation device; an evacuation device. [11] Processing arrangement (100a, 100b, 200) according to one of claims 1 to 10, further comprising: at least one cantilever beam (120, 220) extending away from the wall element (112w, 212w) for supporting a processing source (102) fastened to the fastening region (112b). [12] Processing arrangement (100a, 100b, 200) according to claim 11, wherein the redistribution arrangement (106) extends into the at least one cantilever beam (120, 220). [13] Processing arrangement (100a, 100b, 200) according to one of claims 1 to 12, further comprising: a further connection terminal (204) having a plurality of further connections for providing at least a portion of the plurality of different media types; wherein the wall element (112w, 212w) has a further fastening area (212b) which is configured identically to the fastening area (112b); wherein the redistribution arrangement (106) is arranged for uncoupling from the connection terminal (104) and coupling with the further connection terminal (204) and furthermore, it is set up: • in a further first configuration (1200a), to couple the first selection of at least a portion of the plurality of further connections according to the media types used to operate the first processing source type (102a) to the processing source (102) when it is attached to the further attachment area (212b) and is the first processing source type (102a); and • in a further second configuration (1200b), to couple the second selection of at least a portion of the plurality of further ports according to the media types used to operate the second processing source type (102b) to the processing source (102) when it is attached to the further attachment area (212b) and is the second processing source type (102b). [14] Method comprising: • Providing a connection terminal (104) which has a plurality of connections for providing a plurality of different media types and is attached to a wall element (112w, 212w); • Attaching a processing source (102) of a first processing source type (102a) or a second processing source type (102b) to the wall element (112w, 212w), wherein the first processing source type (102a) and the second processing source type (102a) differ in at least one media type used for operation; • Reconfiguring a redistribution arrangement (106), whereby the redistribution arrangement (106) is brought into a first configuration or brought into a second configuration, wherein the redistribution arrangement (106): in the first configuration (1200a), a first selection of the plurality of ports couples to the processing source (102) according to the media types used to operate the first processing source type (102a); and in the second configuration (1200b), a second selection of the plurality of ports couples to the processing source (102) according to the media types used to operate the second processing source type (102b).

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