POWER CONTROL SYSTEM AND METHOD FOR CONTROLLING POWER TO AN INDUCTIVE LOAD

Abstract

Current control system (500) designed to supply current to an inductive load, comprising: a control unit (512) designed to provide a control signal; an A / D converter (528) which is permanently assigned to the control unit (512); a driver (516) designed to supply current based on the control signal; a feedback path (588) via which a voltage proportional to the current is supplied to the permanently assigned A / D converter (528); a sensor (526, 532) configured to provide a digital signal to the control unit (512) that is representative of the current; the digital signal bypasses the permanently assigned A / D converter (528).

Description

[0001] Several embodiments involve the repartitioning of a chip and a method for controlling current. This repartitioning can be particularly applicable to controlling current through inductive loads in the field of automotive transmissions.

[0002] Controlling a predetermined current through inductive loads is typically achieved using a pulse-width modulation (PWM) approach. The average current through the load is measured, and the duty cycle (DC) is adjusted accordingly, resulting in a mean load current I. LOAD the predetermined current setpoint I SET corresponds.

[0003] In particular, a maximum permissible error of the controlled load current I LOAD for automotive transmission applications to less than 1% of the predetermined current setpoint I SET limited.

[0004] US Patent 2006 / 0001408A1 discloses a circuit with a digital controller that drives a driver for two transistors. An inductor is connected at a circuit node between these transistors. A current at this node is fed through an amplifier and a multiplexer to an analog-to-digital converter (ADC) and digitized. A current calculation block uses the digitized signal to calculate a temperature-compensated current. A digital signal corresponding to the temperature-compensated current is modified through a voltage regulator, a summing converter, a digital compensator, and a PWM modulator and fed to the driver. A further analog-to-digital converter, bypassed by the digital signal corresponding to the temperature-compensated current, is included in the digital controller.

[0005] US patent 2009 / 0121908A1 describes a circuit with two transistors connected in a half-bridge configuration, controlled by a controller and two gate drivers. An inductor is connected to a circuit node between these transistors. A load current flowing through this inductor is detected and digitized via a resistor, a multiplexer, and an analog-to-digital converter. The resulting digitized signal is fed to the controller.

[0006] Microprocessors with one or more analog-to-digital converters are known from US 2009 / 0 141 347 A1.

[0007] DE 197 45 389 A1 discloses an electromagnetic drive circuit comprising a high-voltage selector switch, a selector switch, and a modulation switch, all controlled by an electronic control module. The electronic control module causes the switches to open and close, allowing the back EMF generated by an electromagnetic coil when the modulation switch is open to be captured by charging a capacitor. This energy can then be used to excite the electromagnetic coil.

[0008] EP 1 234 316 A1 discloses a method for influencing the switching speed of an electromagnetic switching device, in particular a contactor. The electromagnetic switching device comprises an armature that is rigidly connected to a contact carrier with movable contacts which, in conjunction with fixed contacts, serve to open and close an electrical circuit. The method involves measuring the displacement-time response of the contact carrier or a part rigidly connected to it when the switching device is switched on and controlling the current through the coil of the electromagnetic system accordingly.

[0009] One embodiment of the invention relates to a current control system according to claim 1.

[0010] Another embodiment of the invention relates to a method according to claim 15.

[0011] In the drawings, identical reference numbers generally refer to the same parts of the disclosure in the different views. The drawings are not necessarily to scale; instead, the focus is generally on illustrating the principles of the disclosure. The following description details various embodiments of the disclosure with reference to the following drawings. Fig. Figure 1 shows a software control architecture; Fig. Figure 2 shows a primarily analog software control chip; Fig. Figure 3 shows a hardware control architecture; Fig. Figure 4 shows a repartitioning for the software control architecture; Fig. Figure 5 shows an approach with improved software control chip architecture; Fig. Figure 6 shows an example of data transmission via digital I / F; Fig. Figure 7 shows a procedure for controlling electricity in the form of a flowchart; Fig. Figure 8 shows, in the form of a flowchart, a procedure for adjusting the current flowing through an inductive load; Fig. Figure 9 shows, in the form of a flowchart, a method for monitoring current flowing through an inductive load driven by a bridge power stage in pulse width modulation (PWM) mode.

[0012] The following detailed description relates to the accompanying drawings, which illustrate specific details and embodiments in which the disclosure can be carried out.

[0013] The term "exemplary" is used herein to mean "serving as an example, case, or illustration." Any embodiment or concept described herein as "exemplary" should not necessarily be considered preferred or advantageous over other embodiments or concepts.

[0014] The term "off-die," as used herein, refers to any area outside the chip package or bare chip to which reference is made. The off-die area may, for example, include another bare chip or another substrate on which the chip package or bare chip is positioned.

[0015] The term "environmentally coupled" as used herein means that a referenced object and the coupled object share the same environment. For example, in the case of temperature sensing, an environment-coupled reference object and a temperature sensor coupled to it change closely together, or in lock-step, with respect to temperature changes that include those originating from the reference object.

[0016] The term "safety signal," as used herein, refers to a signal originating from a redundant signal source and directed to a reference or primary signal. For example, a "safety signal" might be a measurement of the same parameter as the primary signal but processed through a different, i.e., redundant, signal path. More specifically, an analog signal might be provided to a control unit independently of a primary digital signal, from which the analog signal is converted. In the event of a failure in the digital signal processing, the analog signal can serve as a safety or backup. Another example of a safety signal is one that prevents a specific hazard, such as the ASIL level according to ISO 26262.

[0017] In various embodiments, a current control system is provided which includes: a control unit configured to provide a control signal, an A / D converter permanently associated with the control unit, a driver configured to supply a current based on the control signal, and a sensor configured to provide the control unit with a digital signal representative of the current, the digital signal bypassing the permanently associated A / D converter.

[0018] The low fault tolerance described above, in conjunction with, for example, automotive transmission applications, presents difficulties in the design of chips and requires new solutions for partitioning and electronic circuits to meet such stringent accuracy requirements.

[0019] For most applications, two approaches are predominantly used for partitioning. Fig. Figure 1 illustrates the first approach, the so-called “SW (software) control” approach. In system 1, two bare chips, i.e., a microcontroller (µC) bare chip 10 and a driver chip 20, were used. Fig. Figure 1 illustrates the arrangement of the bare chips on a substrate 30. The substrate 30 can be a printed circuit board (PCB). A control unit 12 and an analog-to-digital converter 14 (ADC) permanently associated with it can be positioned on the microcontroller bare chip 10 using the software control approach. A driver 16, on the other hand, can be positioned on the driver chip 20 and connected to a switch 24, which can also be positioned on the driver chip 20. The control unit 12 can provide a signal, and in particular a PWM signal, to the driver 16, which then makes the switch 24 conduct or non-conducting. The current flowing through the switch 24 can be measured using a shunt resistor 26. The shunt resistor 24 can be directly or indirectly connected by the same current flow as the switch 24 and can be inside or outside of system 1. A current determiner 18, which acts as an operational amplifier in Fig. When implemented as described in section 1, an amplified voltage proportional to the current through the shunt resistor 26 is output as an analog signal to the A / D converter 14, which is indicative of the current flowing through the switch. The current through the switch 24 can also be the current used for the current I. LOAD is provided by inductor 20. The illustrated components are either fully integrated or parts of a discrete circuit.

[0020] In the software control approach, a current control algorithm in the control unit 12, for example a proportional-integral (PI) controller, can control the external power stage on the driver chip 20 or the current I LOADby an inductor 22. In operation, the control unit 12 can provide an input signal to the driver 16, which in turn can be configured to control a gate on the switch 24. Closing the switch 24 allows current to flow and effectively to the inductor 22. Conversely, opening the switch 24 prevents the current from flowing and effectively stops the current flow to the inductor 22. In operation, the current that controls both the switch 24 and the inductor 22 (I) can LOAD The current flowing through the circuit is measured, and the measurement is digitally fed back to the control unit 12 via the A / D converter for analysis in the current control algorithm. The control unit 12 then adjusts the opening and closing accordingly, so that the resulting average load current I LOAD the (user-specified) setpoint current I SET corresponds.

[0021] The current control loop is in Fig. 1 is shown with a dotted line.

[0022] Fig. Figure 2 illustrates a software (SW) control circuit diagram in detail. In the system 200, two bare chips, i.e., a microprocessor (µC) bare chip 210 and a driver chip 220, are arranged on a substrate 230. The microprocessor bare chip 210 comprises a microprocessor core 212, an input / output (I / O) interface 213, and a microprocessor peripheral 214, which includes an analog-to-digital converter (ADC) 228 and an ADC result register 229. The microprocessor peripheral 214 can be permanently assigned to the microprocessor core 212. Two outputs of the I / O interface 213, designed to interact with the microprocessor core 212, are connected to a PWM input 266 and a hold input 268, respectively, on a CMOS logic circuit 216 on the driver chip 220. The CMOS logic circuit 216 is configured to open and close a switch 224, which provides power to the load 222.In addition, the current flowing through switch 224 can be measured remotely from a shunt resistor 226. A current detector 218, which functions as an operational amplifier Iamp in . Fig. When implemented as described in section 2, the circuit outputs an amplified voltage proportional to the current through the shunt resistor 226. The software control architecture can utilize a purely analog driver chip with a sample-and-hold (S&H) stage 232 to detect the measured differential voltage across a shunt resistor 226, either inside or outside the chip. The microprocessor 210 controls the S&H stage 232 and performs the A / D data conversion, in addition to carrying out necessary calculations such as averaging, filtering, etc.

[0023] In the SW (software) control approach of Fig. 2 can be a current control algorithm in the microprocessor core 212, for example a proportional-integral (PI) controller, the external power stage or the current ILOAD The current is controlled by an inductor 222. During operation, the microprocessor core 212 can provide an input signal, and in particular a PWM signal, to the CMOS logic circuit 216. Based on the input signal, the CMOS logic circuit 216 can then control the gate on the switch 224, either opening or closing the switch. Closing the switch 224 allows current to flow, effectively to the inductor 222. Conversely, opening the switch 224 prevents current from flowing, effectively stopping the current flow to the inductor 222. The current passing through the switch 224 and the inductor 222 (I) LOAD The current flowing through the circuit can be measured, and this measurement is fed back into the microprocessor core 212 for analysis in the current control algorithm. The microprocessor core 212 then adjusts the opening and closing accordingly, so that the resulting average load current I LOADthe (user-specified) setpoint current I SET corresponds.

[0024] Fig. Figure 3 illustrates the second approach, the so-called “HW (hardware) control” approach. Fig. Figure 3 illustrates two bare chips, i.e., a microprocessor (µC) bare chip 310 and a current control chip 320, positioned on a substrate 330. The substrate 330 can also be a printed circuit board (PCB). A current setpoint unit 312 and an associated residual analog-to-digital converter 314 can be positioned on the microprocessor bare chip 310. The current setpoint from the current setpoint unit 312 is not derived from the current control chip 320. A digital interface unit 328 can be positioned on the current control chip 320 and connected to a current control strategy and control logic unit 334. The unit 334 can be connected to a power stage control and diagnostic unit 336. Unit 336 feeds a signal into driver 316, which is positioned on the power control chip 320 and connected to a switch 324.The current flowing through switch 324 can be measured from a shunt resistor 326, which is connected upstream of the switch. A current detector 318 outputs an amplified voltage proportional to the current through the shunt resistor 326 as an analog signal to an analog-to-digital converter 332 located on the current control chip 320, which is indicative of the current flowing through the switch. The current through switch 324 can also be called the current I. LOAD through the inductor 322.

[0025] In this approach, the current control algorithm and the power stage are fully integrated into a separate chip, the current control chip 320, which is separate from the microcontroller chip 310. The current control chip 320 is supplied with a setpoint I SETThe current setpoint unit 312 on the microcontroller unit 310 supplies the current and, in return, provides status and fault information about the load. The hardware control approach delivers a current through the inductor 322 that is closer to the setpoint than the current in the microcontroller unit 310. Fig. 1 and Fig. 2 illustrated approaches.

[0026] The current control loop in Fig. 3 is indicated by a dotted line.

[0027] Approximately fifty percent of global gearbox applications use the software control approach. Currently, there is a need for new chip partitioning configured to support a software control approach.

[0028] In contrast to the approaches described above, this new partitioning can also achieve an accuracy of I LOADThis achieves performance similar to that found in hardware control architectures. Furthermore, this new partitioning can relieve the microcontroller of computationally intensive measurement tasks or enable the use of the chip infrastructure for functional safety purposes.

[0029] One disadvantage of the in the Fig. 1 and Fig. The low achievable accuracy (~5% error) of the two illustrated software control approaches is due to the limited possibility of calibration and compensation for non-ideal effects.

[0030] The below in relation to Fig. The new partitioning described in section 4 retains the flexibility of a current control algorithm used in a microprocessor such as the one in Fig. 1 illustrated microprocessor 10 runs, while a precise, controlled current I LOADis achieved, which is comparable to measurements previously only found in hardware control approaches. The use of, for example, in Fig. The partitioning shown in the 4 examples can reduce errors to < 1%.

[0031] Furthermore, it must be in the Fig. 1 and Fig. In the two illustrated software control approaches described above, the microprocessor 210 controls both the sample-and-hold stage 232 and the A / D converter 218, in addition to performing the necessary calculations such as averaging, filtering, etc. These calculations are additional tasks for the microprocessor 210 and require a larger, more powerful processor, which typically increases the cost of the microprocessor.

[0032] Accordingly, a different partitioning of functions for software control architecture can help in eliminating or reducing some of the disadvantages of software control approaches that are described in the Fig. 1 and Fig. 2 are illustrated.

[0033] Fig. Figure 4 illustrates a new approach for a power control system 400. Two bare chips, i.e., a microprocessor (µC) bare chip 410 and a driver and digital signal processing (DSP) chip 420, are illustrated, with the bare chips positioned on a substrate 430. The bare chip 410 and the chip 420 can alternatively be positioned on separate substrates (illustrated by a section line 460). The driver and DSP chip 420 can be a first bare chip. The microprocessor bare chip 410 can be a second bare chip. The microprocessor bare chip 410 can be the same as or similar to the one in Figure 4. Fig. Figure 1 illustrates a bare-chip microprocessor 10. Additionally, the bare-chip microprocessor 410 can be a bare-chip package, for example, for power control using the [missing information]. Fig. 1 illustrated SW control approach is sold. In other words, the 410 microprocessor bare chip, on which the control unit and the fixed A / D converter are positioned, can be a fixed package.

[0034] The microprocessor bare chip 410, or the second bare chip, can comprise a control unit 412 and an A / D converter 414 positioned on it. The control unit 412 can be thermally isolated from the driver 414. As used here, thermal isolation means that a temperature increase in the driver 414 does not lead to a temperature increase in the control unit 412. Likewise, a temperature increase in the control unit 412 does not lead to a temperature increase in the driver 414. The A / D converter 414 can be permanently associated with the control unit 412. In other words, the A / D converter 410 can be permanently connected to the control unit 412. The control unit 412 is connected to a power state control and diagnostics unit 436, which in turn is connected to a driver 416 and a control logic unit 438.

[0035] A power state controller and diagnostics unit 420 is connected to the driver 416, which is located on the driver and DSP chip 420 or the first bare chip. The driver 416 is connected to a switch 424. The driver 416 can be configured to supply current by pulse-width modulation of the switch 424. In other words, the driver 416 can control the opening and closing of the switch 424 by modulating pulses sent to the gate of the switch 424. The current flowing through the switch 424 can be the current I. LOAD be the one provided for the inductive load 422. LOAD can be measured remotely from a shunt resistor 426, which is connected upstream of the switch. A current detector 418, which is used as an operational amplifier in Fig. The current determiner 426, as implemented in section 4, determines the current through the shunt resistor 426 and provides an analog signal representative of the current to an analog-to-digital converter (ADC) 432 located on the driver and digital signal processing chip 420. The ADC 432 can be separate from the ADC 414 and can be a second or additional ADC. The ADC 432 can be the first of a plurality of ADCs. Together, the switch 424, the current determiner 418, and the ADC 432 can form a sensor configured to provide a digital signal representative of the current I. LOADis the current flowing through inductor 422. The digital signal output from the A / D converter 432 can be preprocessed in a digital signal processor 442, which is located on the first bare chip, before being passed on to the control unit 412. The preprocessing can include, or exclusively include, adjusting the digital signal output by the A / D converter 432, for example, to remove external factors that could interfere with the measurement of the current I. LOAD , which is provided for the inductive load 422. The digital signal processor 442 receives input from a temperature compensation circuit arrangement 440, which may be located inside or outside the processor itself. The temperature compensation circuit arrangement 440 may include a temperature sensor, which may be positioned on the first bare chip, in the case of Fig. 4 on the driver and digital signal processing chip 420. The digital signal processor 442 can be configured to preprocess the digital signal in response to temperature changes of the circuit sensed by such a temperature sensor in the temperature compensation circuit arrangement 440. In certain embodiments, the temperature compensation circuit arrangement 440 is environment-coupled to the chip or configured to sense temperature changes in the environment of the chip or any of the chip components that might interfere with an accurate representation of the current supplied to the load (I LOAD) flows. Thus, the 442 digital signal processor can remove the effects of temperature from the digital signal output of the 432 analog-to-digital converter. The 442 digital signal processor can include an E2PROM configured to contain temperature compensation data. The E2PROM can also contain calibration and compensation data written during the chip's manufacturing and end-of-line testing. This simplifies the implementation of analog circuits due to reduced accuracy and temperature stability requirements, as a digital temperature-dependent correction is able to compensate for any non-ideal and non-linear effects. As detailed in Fig. As illustrated in section 5 below, a second analog signal can be used, derived from the current flow to the inductive load I. LOADThe permanently assigned A / D converter 414 is derived from the circuit and can be independently fed. The permanently assigned A / D converter 414 can be the second of a plurality of A / D converters and can be located off-die or off-die from the driver and digital signal processing naked chip 420. The second analog signal can be a safety signal.

[0036] The control unit 412, which is in Fig. 4 Off-Die is positioned and configured to provide a control signal. The control unit 412 can provide multiple control signals. In one embodiment, the control unit 412 provides at least two control signals. The driver 416, positioned on the same bare-die chip as the A / D converter 432, is configured to supply a current based on the control signal to open and close the switch 424. A sensor, which in the case of Fig. The circuit, which may include the shunt resistor 426, the operational amplifier 418, and the A / D converter 432, is configured to provide a digital signal representative of the current to the control unit 412. This digital signal bypasses the A / D converter 414.

[0037] The shifting of the digital signal processing functions, which are provided by the microprocessor 12 in Fig. 1 must be executed, the driver and DSP chip 420 can offer some advantages.

[0038] One of the advantages of this in Fig. The new partitioning illustrated in Figure 4 improves load current accuracy. For example, balancing and calibration procedures are available for the microprocessor 412 that would otherwise be unavailable, since the microprocessor is required to handle high data levels. Therefore, signal balancing and calibration can be performed outside of the microprocessor 412, yet still utilized within it. This increases the accuracy of the control signal provided to the driver 416 and, consequently, the accuracy of the current supplied through the switch 424 for I LOAD is provided.

[0039] Another advantage of the in Fig. The advantage of the partitioning illustrated in point 4 is that no end-of-line calibration is required. This reduces the registration costs.

[0040] Another advantage of the in Fig. The advantage of the partitioning shown in section 4 is that the 412 microprocessor is not necessary to handle high data levels. Therefore, a less expensive microprocessor can be used for the same number of channels, or the number of channels can be increased without increasing the microprocessor's processing power.

[0041] Another advantage of the in Fig. The partitioning illustrated in Figure 4 shows that an additional and independent monitoring path can be implemented by using the channels of the A / D converter within the microcontroller unit. The A / D converter (or the free inputs to the existing A / D converter 14 on the microprocessor bare chip 10) can be reused for such a monitoring path or for other purposes.

[0042] Another advantage of the in Fig. The partitioning illustrated in section 4 is that existing and proven control algorithms and strategies for software control applications (for example, those in the microprocessor bare chip 10 in Fig. 1) can be reused without difficulty. This simplifies the straightforward replacement of, for example, the driver chip 30 with the driver and DSP chip 420 in Fig. 4 in existing arrangements.

[0043] A further detailed embodiment of a new software architecture is presented in Fig. 5 illustrates. Regarding Fig. Figure 5 shows two bare chips, i.e., a microprocessor (µC) bare chip 510 and a driver and digital signal processing chip 520, positioned on a substrate 530. The bare chip 510 and the chip 520 can alternatively be positioned on separate substrates (illustrated by a section line 560). The microprocessor bare chip 510 comprises a microprocessor core 512, an input / output (I / O) interface 513, and a microprocessor peripheral 514, which includes an analog-to-digital converter 528 and an analog-to-digital result register 530. The microprocessor peripheral 514 can be permanently associated with the microprocessor core 512. The I / O interface 513 is connected to a logic circuit 515 on the driver and digital signal processing chip 520. The logic circuit 515 is connected to a driver 516 which is configured to open and close a switch 524.Switch 524 provides current for output 522 (to which an inductive load can be connected). Additionally, the current flowing through switch 524 can be measured across a shunt resistor 526 and then converted into a digital signal by the A / D converter 532 before being fed into the logic circuit 515.

[0044] In the new software (SW) control approach of Fig. 5 can be a current control algorithm in the microprocessor core 512, for example a proportional-integral (PI) controller, the external power stage or the current I LOADby an inductor 522. In operation, the microprocessor core 512 can provide a control signal for the logic circuit 515, which in turn can be configured to control a gate on the switch 524. A temperature sensing circuit arrangement 584 can be coupled to the logic circuit 515. Closing the switch 524 allows current to flow and effectively to the inductor 522. Conversely, opening the switch 524 prevents the current from flowing and effectively stops the current flow to the inductor 522. The current passing through the switch 524 and the inductor 522 (I LOADThe current flowing can be measured, with the current measurement being fed back to the microprocessor 510 for analysis in the current control algorithm. The microprocessor 510 can receive digital information about the current flowing from the first bare chip to the load. The microprocessor core 512 then adjusts the opening and closing accordingly, so that the resulting average load current I LOAD the (user-specified) setpoint current I SET corresponds.

[0045] A non-volatile memory (e.g., E) 2 PROM 582 can contain calibration and compensation data written during chip production and end-of-line testing. This simplifies the implementation of analog circuits due to reduced accuracy and temperature stability requirements, as a digital temperature-dependent correction is able to compensate for any non-ideal and non-linear effects.

[0046] In Fig. 5. The preprocessed data is sent to the microprocessor via a digital interface (e.g., low-voltage differential, "LVDS") 586. In one aspect of the disclosure, data can be transmitted synchronously with the PWM frequency. This is in Fig. Figure 6 illustrates this. In addition, the digital signal can include diagnostic information about the load, which allows the control signal to be pulse-centered during the driver's duty cycle or for a subsequent pulse based on the diagnostic information.

[0047] Furthermore, as in relation to Fig. As mentioned in section 4, the microprocessor's A / D converter can also be used for applications that must meet a certain ASIL level according to ISO 26262. A second feedback path 588 is provided in the proposed chip by an analog voltage proportional to the load current. By connecting the second feedback path 588 to the A / D converter 528 of the microprocessor chip 513, an independent diagnostic path is available for monitoring the function of the current control unit.

[0048] One advantage of the in Fig. The advantage of the partitioning shown in Figure 5 is that the 512 microprocessor core does not need to process high data levels, as the 515 logic circuit has instead freed the 512 core from processing-intensive processes. Given this, a less expensive microprocessor can be used for the same number of channels, or the number of channels can be increased without increasing the microprocessor's processing power.

[0049] Fig. Figure 6 illustrates an example of data transmission via the digital I / F 586 from Fig. 5.

[0050] In Fig. 6 represent EN0, EN1 and EN2 channels of the signal that is sent from the microprocessor 510 to input 561 of the logic circuit 515. The I / F in Fig. Figure 6 represents the signal sent from the 586 digital interface to the 510 microprocessor. Cycle 601 of channel EN0 has a duration of tPWM. Similarly, cycle 602 of channel EN1 has a duration of . Fig. 6 is the time between sampling by t del This illustrates that in this aspect of the disclosure, 32 bits are transmitted on each rising edge of the enable signal of channels EN0, EN1, and EN2. These 32 bits can contain diagnostic information for the respective power stage and the calculated average load current I. LOADthe previous PWM cycle. Based on this data, the microprocessor can define the duty cycle of the subsequent 603 or the current PWM cycle.

[0051] One advantage of the in Fig. The advantage of the approach illustrated in section 6, besides relieving the microprocessor 510 of computational tasks, is that a control algorithm within the microprocessor 510 does not need to be modified, but remains flexible and easily adaptable. The control algorithm can be very complex and may only be usable by experienced technicians (mainly Tier 1 suppliers and OEMs). Fig. 5 and Fig. Figure 6 illustrates an implementation with three channels that are switched in a staggered mode.

[0052] In addition, a method for controlling electricity in Fig. Figure 7 discloses the method. The method comprises generating a control signal by a control unit to which an A / D converter 710 is permanently assigned. The method further comprises providing the control signal to a driver configured to supply a current based on the control signal 720. The method further comprises generating a digital signal representative of the current 730. The method further comprises providing the digital signal to a control unit 740. Finally, in this method, the digital signal bypasses the A / D converter.

[0053] In addition, a method for adjusting the current flowing through an inductive load is described in Fig. Disclosed in Figure 8, the method comprises injecting a signal from a microcontroller into the control current flow through an inductive load 810. The method further comprises converting the current flow through the inductive load into a representative digital signal 820 on a bare chip. The method further comprises injecting the digital signal into the microcontroller 830. The method further comprises adjusting the signal from the microcontroller based on the converted signal 840.

[0054] In addition, a method for monitoring current flowing through an inductive load controlled by a bridge power stage in pulse width modulation (PWM) mode is described in Fig.Disclosed in Section 9. The method comprises supplying a first signal from a microcontroller 910. The method further comprises controlling a switch that controls the current flowing through the inductive load using the signal 920. The method further comprises converting the current into a representative digital signal 930. The method further comprises supplying the representative digital signal to the microcontroller 940. The method further comprises setting the first signal based on the representative digital signal 950. The method further comprises permanently assigning an off-die A / D converter to the microcontroller 960.

[0055] The following examples relate to further embodiments.

[0056] In Example 1, a current control system can include a control unit configured to provide a control signal, an analog-to-digital converter (ADC) permanently assigned to the control unit, a driver configured to supply current based on the control signal, and a sensor configured to provide a digital signal representative of the current to the control unit. In this example, the digital signal can bypass the permanently assigned ADC.

[0057] Example 2 can include the current control system according to Example 1, where the current is supplied to an inductive load.

[0058] Example 3 can include the current control system according to Example 1, wherein the digital signal is a signal that has been converted from an analog signal that is representative of the current.

[0059] Example 4 can include the current control system according to Example 3, further comprising a second A / D converter for converting the analog signal.

[0060] Example 5 can include the power control system according to Example 1, with the driver positioned on a first bare chip.

[0061] Example 6 can include the current control system according to Example 5, with the control unit positioned on a second bare chip.

[0062] Example 7 can include the current control system according to Example 6, wherein the control unit and the permanently assigned A / D converter are a permanently assigned enclosure.

[0063] Example 8 can include the current control system according to Example 1, with the driver configured to supply the current by pulse width modulation.

[0064] Example 9 can include the current control system according to Example 1, wherein the control unit is thermally isolated from the driver.

[0065] Example 10 may include the power control system according to Example 1, further comprising a digital signal processor configured to preprocess the digital signal.

[0066] Example 11 can include the current control system according to Example 10, wherein the digital signal processor includes a temperature compensation circuit arrangement.

[0067] Example 12 can include the current control system according to Example 11, wherein the digital signal processor has an E 2 PROM is included, which is configured to contain temperature compensation data.

[0068] Example 13 can include the current control system according to Example 11, wherein the temperature compensation circuit arrangement includes a temperature sensor and wherein the digital signal processor is configured to preprocess the digital signal in response to temperature changes of the circuit sensed by the temperature sensor.

[0069] Example 14 can include the current control system according to Example 11, wherein the temperature compensation circuit arrangement is environment-coupled with a first bare chip.

[0070] Example 15 can include the current control system according to Example 10, wherein the digital signal processor is arranged on a first bare chip.

[0071] Example 16 can include the current control system according to Example 13, wherein the temperature sensor is arranged on a first bare chip.

[0072] Example 17 can include the current control system according to Example 1, wherein a second analog signal, derived from the current flow to the inductive load, independently feeds the permanently assigned A / D converter.

[0073] Example 18 can include the power control system according to Example 17, where the second analog signal is a safety signal.

[0074] Example 19 can include the current control system according to Example 1, wherein the digital signal includes diagnostic information.

[0075] Example 20 can include the current control system according to Example 19, wherein the control unit sets current flow to the inductive load through the driver based on the diagnostic information.

[0076] Example 21 can include the power control system according to Example 20, wherein the control unit is configured to adjust the control signal for the driver during the driver's duty cycle.

[0077] Example 22 can include the current control system according to Example 1, wherein the control unit provides the control signal via two channels.

[0078] In Example 23, a method for controlling current can include generating a control signal by a control unit to which an analog-to-digital converter (ADC) is permanently assigned, providing the control signal to a driver configured to supply current based on the control signal, generating a digital signal representative of the current, and providing the digital signal to the control unit. In this example, the digital signal can bypass the ADC.

[0079] Example 24 can include the current control system according to Example 3, further comprising a second A / D converter for converting the analog signal.

[0080] Example 25 may include the procedure according to Example 23, wherein the current is supplied to an inductive load.

[0081] Example 26 may include the procedure of Example 23, wherein the digital signal is a signal that has been converted from an analog signal that is representative of the current.

[0082] Example 27 can include the procedure according to Example 26, wherein a second A / D converter generates the digital signal.

[0083] Example 28 can include the procedure according to Example 23, wherein the driver is positioned on a first bare chip.

[0084] Example 29 can include the method according to Example 28, wherein the control unit is positioned on a second naked chip.

[0085] Example 30 may include the method according to Example 29, wherein the control unit and the permanently assigned A / D converter are a permanently assigned housing.

[0086] Example 31 may include the procedure according to Example 23, wherein the driver is configured to supply current to a switch by pulse width modulation.

[0087] Example 32 can include the procedure according to Example 29, wherein the control unit is thermally insulated.

[0088] Example 33 may include the method according to Example 23, further comprising preprocessing the digital signal in response to the temperature of the circuit sensed by the temperature compensation circuit arrangement.

[0089] Example 34 may include the procedure according to Example 33, wherein the digital signal processor includes an E2PROM configured to contain temperature compensation data.

[0090] Example 35 may include the method according to Example 33, wherein the temperature compensation circuit arrangement is environment-coupled with a first bare chip.

[0091] Example 36 may include the method of Example 33, wherein the temperature compensation circuit arrangement is placed on a first bare chip.

[0092] Example 37 may include the procedure according to Example 23, further comprising the independent injection of a second analog signal, derived from the current, into the permanently assigned A / D converter.

[0093] Example 38 may include the procedure according to Example 37, wherein the second analog signal is a safety signal.

[0094] Example 39 may include the procedure according to Example 23, wherein the digital signal includes diagnostic information.

[0095] Example 40 may include the procedure according to Example 29, wherein the control unit adjusts the current flow to the inductive load through the driver based on the diagnostic information.

[0096] Example 41 may include the procedure according to Example 23, wherein the driver sets the pulse during the duty cycle.

[0097] Example 42 can include the method according to Example 23, wherein the control signal is generated via a first and second signal.

[0098] In Example 43, a circuit for controlling current through an inductive load may include a driver configured to set current flow to the inductive load, a microcontroller configured to control the driver, a first analog-to-digital converter (ADC) located on a bare chip configured to feed a digital signal into the microcontroller representing the current flow to the inductive load, and a second ADC coupled to the microcontroller. In this example, the second ADC may be located outside the bare chip.

[0099] Example 44 can include the circuit according to Example 43, with the driver positioned on the bare chip.

[0100] Example 45 can include the circuit according to Example 43, wherein the microcontroller is located outside the bare chip.

[0101] Example 46 can include the circuit according to Example 43, wherein the driver is configured to control the current flow by pulse width modulation.

[0102] Example 47 may include the circuit of Example 43, further comprising a digital signal processor configured to preprocess the digital signal.

[0103] Example 48 may include the circuit according to Example 47, wherein the digital signal processor includes a temperature compensation circuit arrangement.

[0104] Example 49 may include the circuit of Example 48, wherein the digital signal processor includes an E2PROM configured to contain temperature compensation data.

[0105] Example 50 may include the circuit of Example 48, wherein the temperature compensation circuit arrangement includes a temperature sensor and wherein the digital signal processor is configured to preprocess the digital signal in response to temperature changes of the circuit sensed by the temperature sensor.

[0106] Example 51 can include the circuit according to Example 48, wherein the temperature compensation circuit arrangement is environment-coupled with the bare chip.

[0107] Example 52 can include the circuit according to Example 47, wherein the digital signal processor is located on the bare chip.

[0108] Example 53 can include the circuit according to Example 50, where the temperature sensor is located on the bare chip.

[0109] Example 54 can include the circuit according to Example 43, wherein an analog signal derived from the current flow to the inductive load independently feeds the second A / D converter.

[0110] Example 55 can include the circuit according to Example 54, where the analog signal is a safety signal.

[0111] Example 56 can include the circuit according to Example 43, where the digital signal includes diagnostic information.

[0112] Example 57 can include the circuit according to Example 56, wherein the microcontrol unit sets the current flow to the inductive load based on the diagnostic information.

[0113] Example 58 can include the circuit according to Example 43, where the microcontroller controls the driver via at least two channels.

[0114] In Example 59, a method for adjusting current flowing through an inductive load may include injecting a signal from a microcontroller to control current flow through an inductive load, converting on a bare chip the current flow through the inductive load into a representative digital signal, injecting the digital signal into the microcontroller, and adjusting the signal from the microcontroller based on the converted signal.

[0115] Example 60 may include the procedure according to Example 59, wherein the digital signal includes diagnostic information.

[0116] Example 61 may include the procedure according to Example 60, wherein the diagnostic information includes information about the power of the load.

[0117] Example 62 may include the procedure according to Example 60, wherein the diagnostic information includes the mean load current of the current flow to the inductive load.

[0118] Example 63 may include the method of Example 60, comprising coupling an A / D converter to the microcontroller; wherein the second A / D converter is located outside the bare chip.

[0119] Example 64 may include the method of Example 59, wherein the microcontrol unit is located outside the bare chip.

[0120] Example 65 may include the method according to Example 59, wherein the current is controlled by pulse width modulation.

[0121] Example 66 may include the method of Example 59, further comprising a digital signal processor configured to preprocess the digital signal.

[0122] Example 67 may include the method of Example 66, wherein the digital signal processor includes a temperature compensation circuit arrangement.

[0123] Example 68 may include the procedure of Example 66, wherein the digital signal processor includes an E2PROM configured to contain temperature compensation data.

[0124] Example 69 may include the method of Example 67, wherein the temperature compensation circuit arrangement includes a temperature sensor and wherein the digital signal processor is configured to preprocess the digital signal in response to temperature changes of the circuit sensed by the temperature sensor.

[0125] Example 70 may include the method according to Example 67, wherein the temperature compensation circuit arrangement is environmental-coupled with the bare chip.

[0126] Example 71 may include the method of Example 66, wherein the digital signal processor is arranged on the bare chip.

[0127] Example 72 may include the method of Example 67, wherein the temperature sensor is arranged on the bare chip.

[0128] Example 73 may include the procedure according to Example 63, further comprising the independent injection of an analog signal derived from the current flow to the inductive load into the second A / D converter.

[0129] Example 74 may include the procedure according to Example 73, wherein the analog signal is a safety signal.

[0130] Example 75 can include the method according to Example 59, wherein the microcontroller controls the current flow via at least two channels.

[0131] Example 76 provides a method for monitoring current flowing through an inductive load driven by a bridge power stage in pulse-width modulation (PWM) mode. The method may include injecting an initial signal from a microcontroller, actuating a switch that controls the current flowing through the inductive load using the signal, converting the current into a representative digital signal, injecting the representative digital signal into the microcontroller, adjusting the initial signal based on the representative digital signal, and permanently assigning an off-die analog-to-digital converter to the microcontroller.

[0132] Example 77 can include the method according to Example 76, wherein a driver positioned on the bare chip controls the switch.

[0133] Example 78 may include the method of Example 76, wherein the microcontrol unit is located outside the bare chip.

[0134] Example 79 can include the procedure according to Example 77, wherein the driver is configured to control the switch by pulse width modulation.

[0135] Example 80 may include the procedure according to Example 76, and furthermore comprehensively the preprocessing of the representative digital signal.

[0136] Example 81 may include the method of Example 80, wherein a digital signal processor preprocesses the digital signal and wherein the digital signal processor includes a temperature compensation circuit arrangement.

[0137] Example 82 may include the procedure of Example 81, wherein the digital signal processor includes an E2PROM configured to contain temperature compensation data.

[0138] Example 83 may include the method of Example 81, wherein the temperature compensation circuit arrangement includes a temperature sensor and wherein the digital signal processor is configured to preprocess the digital signal in response to temperature changes of the circuit sensed by the temperature sensor.

[0139] Example 84 may include the method of Example 81, wherein the temperature compensation circuit arrangement is environment-coupled with the bare chip.

[0140] Example 85 may include the method according to Example 81, wherein the digital signal processor is arranged on the bare chip.

[0141] Example 86 may include the method according to Example 76, further comprising the independent injection of an analog signal derived from the current flow to the inductive load into the A / D converter.

[0142] Example 87 may include the procedure according to Example 86, wherein the analog signal is a safety signal.

[0143] Example 88 may include the procedure according to Example 76, wherein the representative digital signal includes diagnostic information.

[0144] Example 89 may include the procedure according to Example 88, wherein the microcontrol unit adjusts the current flow to the inductive load based on the diagnostic information.

[0145] Example 90 can include the procedure according to Example 76, wherein the first signal is generated via at least two control channels.

[0146] Example 91 provides a circuit for controlling current through an inductive load. The circuit may include a first and a second bare chip, a switch configured to conduct current to the inductive load, a driver positioned on the first bare chip configured to drive a switch, and a microcontroller positioned on the second bare chip configured to control the driver. In this example, the microcontroller can receive digital information about the current flowing from the first bare chip to the load.

[0147] Example 92 can include the circuit according to Example 91, with the driver configured to control current flow by pulse width modulation.

[0148] Example 93 may include the circuit according to Example 91, comprising a digital signal processor positioned on the first bare chip configured to preprocess the digital signal.

[0149] Example 94 may include the circuit according to Example 93, wherein the digital signal processor includes a temperature compensation circuit arrangement.

[0150] Example 95 may include the circuit according to Example 93, wherein the digital signal processor includes an E2PROM configured to contain temperature compensation data.

[0151] Example 96 can include the circuit of Example 93, wherein the temperature compensation circuit arrangement includes a temperature sensor and wherein the digital signal processor is configured to preprocess the digital signal in response to temperature changes of the circuit sensed by the temperature sensor.

[0152] Example 97 can include the circuit according to Example 95, wherein the temperature compensation circuit arrangement is environment-coupled with the first bare chip.

[0153] Example 98 can include the circuit according to Example 93, wherein the temperature sensor is located on the first bare chip.

[0154] Example 99 can include the circuit according to Example 91, wherein an analog signal derived from the current flow to the inductive load independently feeds an A / D converter permanently assigned to the control unit.

[0155] Example 100 can include the circuit according to Example 99, where the analog signal is a safety signal.

[0156] Example 101 can include the circuit according to Example 91, where the digital information includes diagnostic information.

[0157] Example 102 can include the circuit according to Example 101, wherein the microcontroller adjusts the current flow to the inductive load based on the diagnostic information.

[0158] Example 103 can include the circuit according to Example 91, wherein the microcontroller controls the driver via at least two channels.

Claims

[1] Current control system (500) designed to supply current to an inductive load, comprising: a control unit (512) designed to provide a control signal; an A / D converter (528) which is permanently assigned to the control unit (512); a driver (516) designed to supply current based on the control signal; a feedback path (588) via which a voltage proportional to the current is supplied to the permanently assigned A / D converter (528); a sensor (526, 532) configured to provide a digital signal to the control unit (512) that is representative of the current; the digital signal bypasses the permanently assigned A / D converter (528). [2] Current control system (500) according to claim 1, where the digital signal is a signal that has been converted from an analog signal that is representative of the current; wherein the current control system (500) further comprises a second A / D converter (532) for converting the analog signal. [3] Power control system (500) according to one of claims 1 to 2, wherein the driver (516) is positioned on a first bare chip (520). [4] Current control system (500) according to claim 3, wherein the control unit (512) is positioned on a second bare chip (510). [5] Current control system (500) according to any one of claims 1 to 4, wherein the driver (516) is configured to supply the current by pulse width modulation. [6] Power control system (500) according to any one of claims 1 to 5, wherein the control unit (512) is thermally isolated from the driver (516). [7] Current control system (500) according to any one of claims 1 to 6, further comprising: a digital signal processor (536) designed to preprocess the digital signal. [8] Power control system (500) according to claim 7, wherein the digital signal processor (536) comprises a temperature compensation circuit arrangement; wherein the digital signal processor (536) optionally includes an E2PROM configured to contain temperature compensation data; or wherein the temperature compensation circuit arrangement optionally includes a temperature sensor and wherein the digital signal processor (536) is configured to preprocess the digital signal in response to temperature changes of the circuit sensed by the temperature sensor. [9] Current control system (500) according to claim 8, wherein the temperature compensation circuit arrangement is environmental-coupled with a first bare chip. [10] Current control system (500) according to claim 8 or 9, wherein the digital signal processor (536) is arranged on a first bare chip. [11] Current control system (500) according to one of claims 8 to 10, wherein the temperature sensor is arranged on a first bare chip. [12] Current control system (500) according to any one of claims 1 to 11, wherein the voltage proportional to the current is a safety signal. [13] Current control system (500) according to any one of claims 1 to 12, wherein the digital signal includes diagnostic information. [14] Current control system (500) according to claim 13, wherein the control unit (512) sets a current flow to the inductive load through the driver (516) based on the diagnostic information; wherein the control unit (512) is optionally configured to set the control signal for the driver (516) during the duty cycle of the driver (516). [15] Methods for controlling current to an inductive load, comprising: Generating a control signal by a control unit (512) to which an A / D converter (528) is permanently assigned; providing the control signal to a driver (516) which is configured to supply a current based on the control signal; generating a voltage proportional to the current; supplying the voltage proportional to the current to the permanently assigned A / D converter (528); generating a digital signal that is representative of the current; providing the digital signal to the control unit (512); the digital signal bypasses the A / D converter (528).

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