Method for producing an electronic circuit arrangement with an embedded computer

Abstract

Method for producing an electronic circuit arrangement with an embedded computer, wherein a plurality of different soldering modules are produced with a computer to be embedded by equipping a module board (30) with components of the computer to be embedded, wherein a series of contact point patterns (10, 16, 20, 24) is first defined before the production of the soldering modules and a base board (44), wherein the positions of individual contact points (14) of the contact point patterns (10, 16, 20, 24) are assigned to hardware interfaces, wherein a first contact point pattern (10) of the row consists of a first contact point sub-pattern (12) and each further contact point pattern (16, 20, 24) of the row is formed by adding a further contact point sub-pattern (18, 22, 26) to the previous contact point pattern (10, 16, 20) of the row, wherein after defining the series of contact point patterns (10, 16, 20, 24), the soldering modules are manufactured, wherein, during the production of the soldering modules, first a contact point pattern (10, 16, 20, 24) is selected for the respective soldering module and, after selecting the contact point pattern (10, 16, 20, 24), the layout of the module board (30) of the respective soldering module is defined with a contact point arrangement corresponding to the selected contact point pattern (10, 16, 20, 24) for connecting the module board (30) of the respective soldering module to the base board (44), wherein the contact point patterns (10, 16, 20, 24) of the module boards (30) of the different soldering modules differ from one another, wherein, during the definition of the respective layout, the electrical connections between the respective contact point arrangement and the components of the respective computer to be embedded are designed in accordance with the assignment defined in the contact point pattern (10, 16, 20, 24), wherein one of the different Soldering modules are selected and soldered onto the base board (44).

Description

[0001] The invention relates to a method for producing an electronic circuit arrangement with an embedded computer.

[0002] Electronic circuit arrangements exist in the state of the art in a wide variety of designs and for a variety of purposes. Such electronic circuit arrangements are usually implemented by assembling printed circuit boards, also known as circuit boards, with electronic components. Assembly is carried out in such a way that the electronic components arranged on the board are usually soldered to the board. The interconnection of the components is achieved by the circuit board's conductor tracks connecting the electronic components to one another. This can result in more or less complex patterns.

[0003] When such electronic circuit arrangements contain and / or form a computer, the patterns required for the correct interconnection of the components through the circuit boards become comparatively complex. Multilayer circuit boards are particularly used in this case, enabling a three-dimensional construction of the circuit structure and thus the construction of significantly more complex circuits.

[0004] In practice, such computers are usually embedded in an electronic circuit arrangement. This has the advantage that the relatively complex design of the computer and the relatively elaborate circuit board structure required for this are only required to produce a relatively small module, which can be used for a variety of different electronic circuit arrangements in which such a computer is to be embedded.

[0005] For example, US 2003 / 0214030 A1 discloses pads arranged as the footprint of an integrated circuit (IC) and formed in a stack comprising an insulating layer and multiple signal routing layers. The footprint has a polygonal shape. There is an inner pad area, a middle pad area surrounding the inner pad area, and an outer pad area surrounding the middle pad area.

[0006] US 6,407,450 B1 discloses a semiconductor package comprising a universal substrate with inner pads, peripheral pads, and substrate tracks arranged between the inner pads and the peripheral pads. The inner pads are configured for electrical interface with a first semiconductor chip. The peripheral pads are configured for electrical interface with a second semiconductor chip that is larger than the first semiconductor chip. By providing a universal substrate that can accommodate multiple chip sizes, package design time and costs can be reduced.

[0007] In an embodiment according to US 2015 / 0 124 419 A1, a ball grid array (BGA) of a packaged semiconductor device and a corresponding landing pad array of a printed circuit board each have a layout defined by an interconnect array comprising (i) an inner subarray of locations with connectors arranged in rows and columns and separated by a specific distance, and (ii) an outer rectangular ring of locations with connectors arranged in rows and columns and separated by the specific distance.

[0008] US 6,176,709 B1 discloses an integrated circuit socket used for attaching the integrated circuit to a socket mounted on a primary wiring board with an intermediate wiring board, an integrated circuit adapter using the integrated circuit socket, and an integrated circuit assembly using the integrated circuit adapter.The integrated circuit socket includes: a package into which the integrated circuit is directly fitted; a long lead-in pin that is inserted through the intermediate wiring board and fitted into the socket of the primary wiring board; a short lead-in pin that is inserted through the intermediate wiring board but does not reach the socket of the primary wiring board; and a surface-mount pin that is connected to a surface of the intermediate wiring board opposite the package; wherein the long lead-in pin, the short lead-in pin, and the surface-mount pin are implanted in the package.

[0009] US 2019 / 0004573 A1 describes methods for manufacturing microelectronic package structures / modules and structures formed thereby. The structures formed herein may comprise a chip disposed on a substrate; a cooling solution comprising a first surface and a second surface opposite the first surface, wherein the second surface is disposed on a backside of the chip disposed on a package substrate. A lid having an outer surface is disposed on the first surface of the cooling solution, wherein the lid has a plurality of fins disposed on an inner surface of the lid. A solder is disposed between the outer surface of the lid and the first surface of the cooling solution.

[0010] Such a module, which allows a computer to be embedded into an electronic circuit, can be designed as a solder-on module. Solder-on modules are characterized by the fact that the module board, equipped with the computer components, is soldered onto a base board. The base board is typically larger than the module board. Since the base board generally has a much less complex circuit structure, a much simpler and therefore more cost-effective board material can be used for the base board than for the module board of the solder-on module.

[0011] Due to the fact that the solder-on modules themselves require a considerable amount of development effort, the practice of offering ready-made solder-on modules as series parts has become established. If such a solder-on module is to be integrated into an electronic circuit in order to embed a computer into an electronic circuit arrangement, the base board is provided with a contact point arrangement for connecting the base board to the module board. The module board accordingly also has a contact point arrangement for connecting the module board to the base board. Since solder-on modules are series products in practice, the design of the contact point arrangement of the base board is generally based on the contact point arrangement of the module board. This gives the module board manufacturers freedom in designing the contact point arrangements of the module boards.When defining the module board layout, the design of the module board's contact point arrangement is also determined, and in particular, the assignment of the contact points of the contact point arrangement to the hardware interfaces of the embedded computer is also determined. This means that the resulting contact point arrangement, and in particular the resulting assignment of the contact points to the hardware interfaces, are comparatively unique for each solder-on module.

[0012] The hardware interfaces can be, for example, synchronous and / or asynchronous serial interfaces and / or data buses, wired and / or wireless network interfaces such as LAN or WLAN, display and / or audio interfaces.

[0013] In practice, this results in baseboard manufacturers having to commit to a specific soldering module when designing the baseboard layout. This can lead to considerable difficulties, for example, because module manufacturers often do not fully disclose the exact specifications of the contact point arrangements, especially with regard to their assignment to hardware interfaces, and / or only specify them during the creation of the board layout for the module board.

[0014] The invention is based on the object of demonstrating a method for producing such a circuit arrangement which enables a flexible use of soldering modules and base boards.

[0015] The object is achieved by a method for producing an electronic circuit arrangement with an embedded computer having the features of independent claim 1. The features of the dependent claims relate to advantageous embodiments.

[0016] The electronic circuit arrangement has contact point arrangements for connecting the base board and the module board, which correspond to a contact point pattern. The contact point pattern is composed of a plurality of contact point subpatterns.

[0017] Contact point patterns composed of a plurality of contact point subpatterns can be designed modularly.

[0018] Such contact point patterns, composed of contact point subpatterns, make it possible to initially define a series of contact point patterns for the production of an electronic circuit arrangement with an embedded computer before manufacturing the solder-on module – and thus in particular before determining the layout of the solder-on module or before manufacturing and determining the layout of the base board. When defining the contact point patterns, the positions of the individual contact points in the contact point patterns are also assigned to hardware interfaces. The series of contact point patterns is then formed such that a first contact point pattern in the row consists of a first contact point subpattern. Each subsequent contact point pattern in the row is formed by adding another contact point subpattern to the previous contact point pattern in the row.

[0019] Therefore, a series of contact point patterns is created, where each contact point pattern in the series includes the previous contact point patterns in the series. This creates backward compatibility with regard to the assignment of the contact points to the hardware interfaces within the series of contact point patterns. This means that each contact point pattern provides the assignments of the contact points to the hardware interfaces, just like the contact point patterns previously defined in the series.

[0020] After defining the series of contact point patterns, a specific solder-on module is manufactured. First, a contact point pattern is selected. After selecting the contact point pattern, the layout of the module board of the solder-on module to be manufactured is defined. The module board layout contains a contact point arrangement corresponding to the selected contact point pattern for connecting the module board to the base board. When defining the layout, the electrical connections between the contact point arrangement and the components of the embedded computer are designed according to the assignment defined by the contact point pattern.

[0021] The advantage is that, with a manageable number of different, predefined contact point patterns, a multitude of different solder-on modules can be produced effectively. In contrast to the state of the art, the arrangement of the contact points, especially their assignment to the hardware interfaces, is not freely chosen when creating the module board layout, but is predetermined by selecting one of the predefined contact point patterns.It has been shown that through the described design of the contact point patterns and the resulting "backward compatibility", a series of contact point patterns with a manageable number of contact point patterns can be defined, with which the typical requirements of the vast majority of embedded computers with regard to the required hardware interfaces can be met, without requiring an unreasonable amount of space on the module board for parts of the contact point pattern that are not actually required for the respective soldering module.

[0022] Furthermore, creating the row by adding additional contact point patterns to the existing contact point patterns allows for previously developed board layouts to be fully or partially utilized in the further development of solder-on modules. The discrete spatial arrangement of the individual contact point subpatterns is particularly helpful in this context, as the respective board layouts have little influence on each other in the areas of the individual contact point subpatterns. If a suitable layout for a module board with a corresponding contact point pattern of the row already exists, it can be fully or partially reused for the development of a layout using a different contact point pattern of the row.Preferably, only those areas of the layout that are assigned to contact pad subpatterns that were not included in the old layout need to be redeveloped. This can significantly reduce the development effort for new solder modules.

[0023] Accordingly, when manufacturing a baseboard, one of the previously defined contact point patterns is first selected. This contact point pattern is preferably the same contact point pattern that was also selected for manufacturing the module board. After selecting the contact point pattern, the layout of the baseboard is defined with a contact point arrangement corresponding to the selected contact point pattern for connecting the baseboard to the module board. When defining the layout, the electrical connections between the contact point arrangement and the components with which the board is to be equipped are designed according to the assignment defined in the contact point pattern. In this way, the baseboard manufacturer only needs to know the defined contact point patterns from the series of contact point patterns and which of the contact point patterns was used for the respective module board.Since the series of contact point patterns can be defined uniformly for a large number of different soldering modules, the manufacturers of the base modules also have more freedom in selecting suitable soldering modules.

[0024] Preferably, both the contact point pattern and the contact point subpatterns each have an at least substantially rectangular basic shape. Due to the rectangular basic shapes of the contact point subpatterns, they can be arranged next to one another in such a way that the contact point pattern consisting of the contact point subpatterns arranged next to one another also has a rectangular shape. The edge lengths of the rectangular basic shapes of the contact point subpatterns are in particular coordinated with one another in such a way that the contact point subpatterns are suitable for forming a series of contact point patterns as described above, wherein the addition of the further rectangular contact point subpattern to a rectangular contact point pattern in turn creates a contact point pattern with a rectangular basic shape.It is advantageous if at least one contact point subpattern of a contact point pattern composed of a plurality of contact point subpatterns has a contact point-free region. Such a contact point-free region makes it possible to arrange electronic components in this region. A module board whose contact point arrangement corresponds to such a contact point pattern can therefore be populated on both sides in the contact point-free region. This is particularly advantageous when using powerful electronic components, in particular powerful CPUs. These regularly require that certain components be arranged on the module board with the shortest possible distance from these CPUs. The arrangement on opposite sides leads to precisely such short paths.

[0025] In particular, with the exception of one contact point subpattern, each contact point subpattern of a contact point pattern can have such a contact point-free area. This results, particularly in conjunction with the rectangular basic shapes of the contact point subpatterns described above, in the contact points being distributed relatively evenly across the surfaces of the contact point pattern. This is advantageous with regard to soldering. A very irregular distribution of the contact points increases the risk that the module will not align parallel to the baseboard during the soldering process, thus leading to contact problems.

[0026] Given the at least substantially rectangular basic shape of the contact point subpatterns, the contact point-free regions of the contact point subpatterns are to be considered, in particular, as part of the contact point subpattern. This means that a contact point pattern in which the contact points enclose a contact point-free region on three sides is also to be considered to have a rectangular basic shape if the resulting C-shaped collection of contact points can be enclosed by a rectangle such that one side of the rectangle encloses the contact point-free region on the side on which it is not surrounded by contact points.

[0027] The contact-free region of a contact-point subpattern can be arranged, in particular, in the region of the boundary of the contact-point subpattern, of which the contact-free region is a component, to another contact-point subpattern. This displaces the contact-free region into the interior of the contact-point pattern formed by the adjacent contact-point subpatterns. This also results in a more uniform arrangement of the contact points. The contact-free region is preferably arranged at the boundary of the contact-point subpattern. The contact points of the contact-point subpattern are then distributed in a C-shaped region of the contact-point subpattern, the C-shape of which is open toward an adjacent contact-point subpattern.

[0028] It is also possible to provide contact-free areas, particularly at the edges of the respective contact pattern, on the opposite side of which the module board has an antenna. It is advantageous to have no contact points compared to such antennas.

[0029] The positions of the contact points in the contact pattern are specifically aligned to a regular grid. This results in a uniform distribution of the contact points. Furthermore, the positions of the contact points can be easily expressed in rows and columns, which simplifies the assignment of the contact point positions to hardware interfaces in practice. In this way, the positions of the individual contact points in the contact pattern are assigned to a selection of points in a regular grid. Contact-free areas of the contact pattern then correspond to collections of neighboring points in the regular grid to which no contact points are assigned.

[0030] The boundaries between the contact point subpatterns of the contact point pattern can be formed by contact point-free strips. A contact point-free strip can, in particular, be formed by a series of straight, adjacent points of the dot matrix that are not assigned to a contact point.

[0031] In particular, in the area of ​​the corners and / or at locations along the long sides of rectangular contact point subpatterns, no contact point can be assigned to individual points of the dot matrix. This is particularly useful when the boards, in particular the module boards, are provided in panels during production. Boards are grouped together in such panels and connected to one another only by thin webs. The webs are severed when the boards are separated. Such webs can then be arranged in the area of ​​the corners and / or the long sides of the rectangular contact point subpatterns. Since separating the webs is associated with a certain mechanical stress and manufacturing tolerances when separating the webs, it is advantageous not to assign a contact point to a point of the dot matrix located in the respective corner and / or long side of the contact point subpattern.This creates a contact point partial pattern with a rectangular basic shape, the corners of which are “blunted” and / or individual contact points are missing on the long sides.

[0032] The module board can be a composite of a circuit board and a spacer element. The spacer element can, in particular, be a spacer element made of a printed circuit board material. The spacer element can, in particular, be pressed onto the circuit board. In this case, the contacts between the spacer element and the circuit board are produced by pressing and, more particularly, not by soldering. In this case, in particular, the contact point arrangement for connecting the module board to the base board is arranged on the spacer element, and the spacer element, in particular, has a recess. The recess results in a cavity being formed between the module board and the base board. The recess is expediently arranged in the region of a contact point-free area of ​​the underlying contact point pattern.In this way, the cavity formed between the module board and the base board due to the spacer element can be used to accommodate electronic components arranged in the contact-free area.

[0033] The solder-on module can, in particular, have a metal shield. Such metal shields serve for electromagnetic shielding. When defining the series of contact point patterns, it can be expedient to specify the properties of the metal shield at least to the extent that a metal shield with the specified properties is compatible with a solder-on module manufactured on the basis of the respective contact point pattern. In this context, before the solder-on module and the base board are manufactured, properties of the module boards relating to separating webs in panels and / or the connectability of the module boards to metal shields are specified. This is done in particular for the respective contact point patterns of the series. These properties are specified, in particular, before the layouts of the base board and / or module board are created.This ensures that, after the respective solder-on module has been manufactured, metal shields that meet the relevant compatibility requirements are compatible with the module boards. Therefore, it is no longer necessary, as was previously the case, to develop a corresponding individual metal shield for each individual type of solder-on module; instead, only the metal shield matching the respective contact point pattern needs to be selected. Since a metal shield can thus be used for a variety of different solder-on modules that use the same contact point pattern, the number of similar metal shields increases considerably. The costs of the individual metal shields decrease accordingly.

[0034] The metal shielding of the respective solder-on module can be designed in such a way that an area on the side of the module board covered by the metal shield is left out. This area is located, in particular, at the edge of the module board, which has a rectangular basic shape. This area can be used, in particular, to position an antenna at this location. It is then advantageous to locate the antenna away from the metal shielding.

[0035] In particular, the contact point arrangement of the module board can be a land grid array. A land grid array offers advantages in manufacturing and further processing. For example, a ball grid array requires at least one additional process step in the production of the embedded computer module. This is, in particular, a pre-tinned land grid array. It has been shown that a pre-tinned land grid array, especially given the high number of contact points required for a module of the type in question, offers greater reliability than a non-pre-tinned land grid array. Plug-in sockets, which may be necessary for an untinned land grid array to create a reliable solder connection even with many contact points, can therefore advantageously be dispensed with.

[0036] Further practical embodiments and advantages of the invention are described below in conjunction with the drawings. They show: Fig. 1 A schematic representation of an exemplary series of contact point patterns, Fig. 2 an exemplary representation of a contact point arrangement of a module board corresponding to the first contact point pattern of the Fig. 1 corresponds to the row of contact point patterns shown, Fig. 3 an exemplary representation of a contact point arrangement of a module board corresponding to the second contact point pattern of the Fig. 1 corresponds to the row of contact point patterns shown, Fig. 4 is an exemplary representation of a contact point arrangement of a module board corresponding to the third contact point pattern of the Fig. 1 corresponds to the row of contact point patterns shown, Fig. 5 is an exemplary representation of a contact point arrangement of a module board corresponding to the fourth contact point pattern of the Fig. 1 corresponds to the row of contact point patterns shown, Fig. 6 exemplary perspective views of a module with a spacer element and Fig. 7 an exemplary sectional view of a module attached to a base board with a spacer element.

[0037] In Fig. Figure 1 schematically illustrates how a series of contact point patterns can be formed using the method described above. The individual contact point patterns 10, 16, 20 and 24 of the series of contact point patterns are shown in Fig. 1 are marked by different frames. The first contact point pattern 10, which is enclosed by a frame only for the purpose of illustration, thus forms the first contact point pattern 10 of the series. The individual contact points 14 are in Fig. 1 is represented by circles. The first contact point pattern 10 enclosed by the frame simultaneously represents a first contact point subpattern 12.

[0038] Another frame surrounds a second contact point pattern 16. The second contact point pattern 16 of the contact point pattern series is formed by adding a second contact point subpattern 18 to the first contact point pattern 12. In other words, the second contact point pattern 16 of the series consists of the first contact point subpattern 12 and the second contact point subpattern 18.

[0039] In the example shown, a further frame comprises a third contact point pattern 20 of the series of contact point patterns. The third contact point pattern 20 is formed by adding a third contact point subpattern 22 to the second contact point pattern 16. In other words, the third contact point pattern 20 consists of the first contact point subpattern 12, the second contact point subpattern 18, and the third contact point subpattern 22.

[0040] A further frame encloses a fourth contact point pattern 24 of the series of contact point patterns. The contact point pattern 24 is formed by adding a fourth contact point subpattern 26 to the third contact point pattern 20. The fourth contact point pattern 24 subsequently consists of the first contact point subpattern 12, the second contact point subpattern 18, the third contact point subpattern 22, and the fourth contact point subpattern 26.

[0041] The Fig. 1 are used only within the scope of this description to identify the contact point sub-patterns 12, 18, 22, 26 included in the respective frame. However, the frames shown are not part of the exemplary contact point patterns 10, 16, 20, and 24 or contact point sub-patterns 12, 18, 22, 26:

[0042] In the example shown, the contact point patterns 10, 16, 20, and 24 each have a rectangular basic shape, particularly as shown. This also applies to the individual contact point subpatterns 12, 18, 22, and 26. This is made possible by the fact that, to form the next contact point pattern 16, 20, or 24, the contact point subpattern 18, 22, or 26, which is to be added correspondingly to the previous contact point pattern 10, 16, or 20, is added by attaching the contact point subpattern 18, 22, or 26 with one of its long sides to the contact point pattern 10, 16, or 20.

[0043] In the example shown, the contact point subpatterns 18, 22, and 26—that is, all contact point subpatterns except for the contact point subpattern 12—have a contact point-free region 28. The contact point-free regions 28 of the respective contact point subpatterns can be arranged, as in the example shown, at the boundary of the respective contact point subpattern 18, 22, or 26 to another contact point subpattern 12, 18, or 22. As in the example shown, the contact point-free regions 28 can have a rectangular basic shape.

[0044] As in the Fig. 1, the positions of the contact points 14 of the respective contact point pattern 10, 16, 20 and 24 can be oriented to a regular grid. In this case, the positions of the contact points 14, in particular as shown in Fig. 1, be assigned to a selection of points of a regular point grid.

[0045] As in Fig. 1, the boundaries between the contact point subpatterns 12, 18, 22 and 26 can be formed by contact point-free stripes. In Fig. 1, the positions of the stripes can be seen in the frame used as a visual aid. Fig. 2 to Fig. 5 it can be clearly seen that the boundaries between the contact point subpatterns 12, 18, 22, 26 are formed by purely straight-line adjacent points of the point grid underlying the respective contact point pattern 10, 16, 20, 24, to which no contact points 14 are assigned.

[0046] Also in Fig. 2 to Fig. 5 shows that it is possible that individual points of the point grid are not assigned contact points 14. This has an effect on the Fig. 2 to Fig. 5 are particularly advantageous because separating webs 32 can be arranged in the area of ​​the positions of the dot matrix to which no contact points 14 are assigned, which separating webs connect the individual module boards 30 to their panels.

[0047] As in the Fig. 6 and Fig. 7, the module board 30 can be a composite of a board 34 and a spacer element 36. In this case, the spacer element 36 can be pressed onto the board 34. The contact point arrangement can be a land grid array 38, as shown by way of example. The electrical connection between the board 34 and the spacer element 36 can be formed by contacts 40 pressed together on the board 34 and the spacer element 36. The spacer element 36 has, in particular, as in the example shown, a recess 42. The insulation 42 causes a cavity to form between the board 34 and the base board 44. This is particularly true in Fig. 7. The recess 42 allows contact-free areas 28 of the contact pattern 10, 16, 20 and 24 to be used to arrange electronic components 46 at the corresponding locations on the circuit board 34. In this way, as particularly shown in Fig.7 - electronic components 46, intermediate module board 30, and base board 44 are arranged. This makes it possible to use the contact-free areas 28 to arrange electronic components 46 on both sides of the module board 30 at the locations corresponding to these areas.

[0048] The features of the invention disclosed in the present description, the drawings, and the claims may be essential, both individually and in any combination, for the realization of the invention in its various embodiments. The invention is not limited to the described embodiments. It may be varied within the scope of the claims and taking into account the knowledge of the person skilled in the art. List of reference symbols 10 first contact point pattern 12 first contact point subpattern 14 Contact point 16 second contact point pattern 18 second contact point subpattern 20 third contact point pattern 22 third contact point subpattern 24 fourth contact point pattern 26 fourth contact point subpattern 28 contact-free area 30 module board 32 Divider 34 circuit boards 36 spacer element 38 pre-tinned land grid array 40 Contact 42 recess 44 Baseboard 46 Electronic component

Claims

[1] Method for producing an electronic circuit arrangement with an embedded computer, wherein a plurality of different soldering modules are produced with a computer to be embedded by equipping a module board (30) with components of the computer to be embedded, wherein a series of contact point patterns (10, 16, 20, 24) is first defined before the production of the soldering modules and a base board (44), wherein the positions of individual contact points (14) of the contact point patterns (10, 16, 20, 24) are assigned to hardware interfaces, wherein a first contact point pattern (10) of the row consists of a first contact point sub-pattern (12) and each further contact point pattern (16, 20, 24) of the row is formed by adding a further contact point sub-pattern (18, 22, 26) to the previous contact point pattern (10, 16, 20) of the row, wherein after defining the series of contact point patterns (10, 16, 20, 24), the soldering modules are manufactured, wherein, during the production of the soldering modules, first a contact point pattern (10, 16, 20, 24) is selected for the respective soldering module and, after selecting the contact point pattern (10, 16, 20, 24), the layout of the module board (30) of the respective soldering module is defined with a contact point arrangement corresponding to the selected contact point pattern (10, 16, 20, 24) for connecting the module board (30) of the respective soldering module to the base board (44), wherein the contact point patterns (10, 16, 20, 24) of the module boards (30) of the different soldering modules differ from one another, wherein, during the definition of the respective layout, the electrical connections between the respective contact point arrangement and the components of the respective computer to be embedded are designed in accordance with the assignment defined in the contact point pattern (10, 16, 20, 24), wherein one of the different Soldering modules are selected and soldered onto the base board (44). [2] Method according to claim 1, characterized by , that after determining the series of contact point patterns (10, 16, 20, 24), the base board (44) is manufactured, wherein first a contact point pattern (10, 16, 20, 24) is selected and, after selecting the contact point pattern (10, 16, 20, 24), the layout of the base board (44) is defined with a contact point arrangement corresponding to the selected contact point pattern (10, 16, 20, 24) for connecting the base board (44) to the module board (30), wherein, when defining the layout, the electrical connections between the contact point arrangement and the components with which the base board (44) is populated are designed in accordance with the assignment defined in the contact point pattern (10, 16, 20, 24). [3] Method according to claim 1 or 2, characterized bythat before the manufacture of the soldering modules and the base board (44), properties of the module boards (30) relating to separating webs in panels and / or the connectability of the module boards (30) with metal shields are determined. [4] Method according to one of the preceding claims, characterized by that both the contact point pattern (10, 16, 20, 24) and the contact point sub-patterns (12, 18, 22, 26) each have an at least substantially rectangular basic shape. [5] Method according to one of the preceding claims, characterized by that at least one contact point partial pattern (12, 18, 22, 26), in particular with the exception of one contact point partial pattern (12, 18, 22, 26), each contact point partial pattern (12, 18, 22, 26) has a contact point-free region (28), in particular wherein the contact point-free region (28) has an at least substantially rectangular basic shape. [6] Method according to claim 5, characterized bythat the contact point-free region (28) of a contact point partial pattern (12, 18, 22, 26) is arranged in the region, in particular at the boundary of the contact point partial pattern (12, 18, 22, 26), of which the contact point-free region (28) is a component, to another contact point partial pattern (12, 18, 22, 26). [7] Method according to one of the preceding claims, characterized by that the positions of the contact points (14) of the contact point pattern (10, 16, 20, 24) are oriented on a regular grid, in particular wherein the positions of the contact points (14) are assigned to a selection of points of a regular point grid. [8] Method according to one of the preceding claims, characterized bythat the boundaries between the contact point partial patterns (12, 18, 22, 26) are formed by contact point-free strips, in particular wherein the strip is formed by a series of rectilinearly arranged adjacent points of a point matrix to which no contact points (14) are assigned. [9] Method according to claim 8, characterized by that in the area of ​​the corners and / or the long sides of rectangular contact point partial patterns (12, 18, 22, 26) no contact points (14) are assigned to individual points of the point grid. [10] Method according to one of the preceding claims, characterized by that the module board (30) is a composite of a board (34) and a spacer element, wherein the contact point arrangement for connecting the module board (30) to the base board (44) is arranged on the spacer element and the spacer element has a recess, so that a cavity is formed between the module board (30) and the base board (44). [11] Method according to one of the preceding claims, characterized by that the solder-on module has a metal shield. [12] Method according to one of the preceding claims, characterized by that the contact point arrangement of the module board (30) is a land grid array, in particular a pre-tinned land grid array.

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