Electroluminescence indicator device and method for its manufacture

Abstract

Electroluminescent display device comprising: multiple pixels arranged on a substrate, wherein the multiple pixels comprise subpixels of different colors arranged along a first direction and subpixels of the same color arranged along a second direction; wherein each subpixel comprises a light-emitting diode (De), wherein the light-emitting diode (De) comprises a first electrode (162), a light-emitting layer (180) and a second electrode (190); a first bank (172) that is arranged between adjacent subpixels of the same color along the second direction and overlaps with edges of the first electrode (162); a second bank (174) with an opening (174a) corresponding to the subpixels of the same color arranged along the second direction, and positioned between adjacent subpixels of different colors arranged along the first direction; and a third bank (176, 276, 376) on side surfaces of the second bank (174) facing each other along the second direction and corresponding to the opening (174a), where the first bank (172) and the third bank (176, 276, 376) have a hydrophilic property and the second bank (174) has a hydrophobic property.

Description

BACKGROUND OF THE INVENTION: Area of ​​Revelation

[0001] The present disclosure relates to an electroluminescent display device, and in particular to a large-sized, high-resolution electroluminescent display device, and to a method for manufacturing it. Discussion of the state of the art

[0002] EP 3 343 626 A1 describes an electroluminescent display device comprising a first emission layer configured to correspond to at least two of a plurality of subpixels, and a second emission layer configured to correspond to at least two of the plurality of subpixels, wherein the second emission layer is spaced apart from the first emission layer and a bank layer is provided along the boundary between the first emission layer and the second emission layer. In one example, a bank layer covers one end of a first electrode. The bank layer comprises a first bank layer and a second bank layer. The first bank layer is provided along the boundary between a first pixel and a second pixel and also along the boundary between each of the multiple subpixels contained in the respective pixels.The second bank layer is not located along the boundary between the first pixel and the second pixel, but rather at both ends of the emission layer.

[0003] EP 3 343 629 A1 describes an electroluminescent display device. A bank layer is provided along the boundaries between each of several pixels and between each of the several subpixels. The bank layer can comprise a first bank layer and a second bank layer. In one example, the second bank layer is not formed along the boundaries between two adjacent first subpixels that share a first emission layer, but rather along the boundaries between two adjacent first subpixels that do not share a first emission layer.

[0004] US 2016 / 0079323 A1 describes an OLED device comprising a substrate defined as having a first active region and a dummy region. First electrodes are formed on the substrate, and a first bank pattern is formed such that it overlaps the edges of each first electrode and exposes a portion of the top surface of each first electrode. A second bank pattern is formed on top of the first bank pattern within the first active region, and a third bank pattern is formed on top of the first bank pattern within the dummy region in the same layer as the second bank pattern.

[0005] As one of the flat-field display devices, an electroluminescent display device has wide viewing angles compared to a liquid crystal display device because it is self-illuminating, and also has advantages of low thickness, light weight and low power consumption because a backlight unit is not required.

[0006] Furthermore, the electroluminescent display device is driven by low direct current (DC) voltages and exhibits a fast response time. Additionally, the electroluminescent display device is highly resistant to external shocks and can be used in a wide temperature range because its components are solids; and, in particular, the electroluminescent display device can be manufactured at low cost.

[0007] The electroluminescent display device comprises several pixels, each of which has red, green and blue subpixels, and displays images with different colors by allowing the red, green and blue subpixels to selectively emit light.

[0008] The red, green and blue subpixels have red, green and blue light emission layers respectively, and each light emission layer is formed by a thermal vacuum evaporation process in which a luminescent material is selectively deposited using a fine metal mask (FMM).

[0009] However, the evaporation process increases manufacturing costs due to the preparation of the mask and presents a problem when applied to a large, high-resolution display device due to manufacturing variations, sinking, a shadowing effect of the mask, and the like. SUMMARY OF THE INVENTION

[0010] Consequently, the present disclosure relates to an electroluminescent display device and a method for its manufacture which substantially avoid one or more of the problems due to limitations and disadvantages of the prior art.

[0011] The object of the present disclosure is to provide a large-sized, high-resolution electroluminescence display device and a method for manufacturing it.

[0012] Further features and advantages of the present disclosure are set forth in the following description and are partly evident from the description or can be learned by carrying out the present disclosure. The objectives and other advantages of the present disclosure are realized and achieved through the structure to which specific reference is made in the written description and the claims thereto, as well as in the accompanying drawings.

[0013] These problems are solved by the subject matter of the independent claims. Further advantageous embodiments and refinements are described in the respective dependent claims.

[0014] According to one aspect of the present disclosure, an electroluminescent display device is provided comprising several subpixels arranged on a substrate along a first direction and a second direction; a light-emitting diode arranged at each subpixel and comprising a first electrode, a light-emitting layer, and a second electrode; a first bank arranged between adjacent subpixels along the second direction and overlapping with edges of the first electrode; a second bank with an opening corresponding to the subpixels arranged along the second direction and arranged between adjacent subpixels along the first direction; and a third bank on side surfaces of the second bank facing each other along the second direction.

[0015] According to one aspect of the present disclosure, an electroluminescent display device comprises: several pixels arranged on a substrate, wherein the several pixels comprise subpixels of different colors arranged along a first direction and subpixels of the same color arranged along a second direction; wherein each subpixel comprises a light-emitting diode, the light-emitting diode comprising a first electrode, a light-emitting layer, and a second electrode; a first bank arranged between adjacent subpixels of the same color along the second direction and overlapping with edges of the first electrode; a second bank with an opening corresponding to the subpixels of the same color arranged along the second direction and arranged between adjacent subpixels of different colors arranged along the first direction;and a third bank on the side surfaces of the second bank, facing each other along the second direction and corresponding to the opening.;

[0016] The first and third banks can exhibit hydrophilic properties. The second bank can exhibit hydrophobic properties.

[0017] The third bank may have a higher surface energy and / or a higher hydrophilic property than the first bank.

[0018] The third bank can be formed, at least partially, on an upper surface of the second bank.

[0019] The first bank can further comprise a section formed between adjacent subpixels of different colors, arranged along the first direction.

[0020] The section of the first bank that is formed between the adjacent subpixels arranged along the first direction can be formed below the second bank.

[0021] The light-emitting layers on the first electrodes of adjacent subpixels of the same color, arranged along the second direction, can be connected between the adjacent subpixels along the second direction on the first bank to form a body. The light-emitting layer forming this body can have a greater height at an edge section of the aperture of the second bank than in a central section of the aperture.

[0022] The first bank and the second bank can be formed through an etching mask process.

[0023] The light-emitting layer of each subpixel can be formed through a solution process. The light-emitting layer formed as a single body can also be formed through a solution process.

[0024] According to one aspect of the present disclosure, a method for manufacturing an electroluminescent display device comprises the following steps: forming a first electrode in each subpixel on a substrate on which multiple pixels are defined, wherein the multiple pixels comprise subpixels of different colors arranged along a first direction and subpixels of the same color arranged along a second direction; forming a first bank arranged between adjacent subpixels of the same color along the second direction, wherein the first bank overlaps edges of the first electrode; forming a second bank on the first bank;wherein the second bank has an opening corresponding to the subpixels of the same color arranged along the second direction and between adjacent subpixels of different colors arranged along the first direction; forming a photoresist pattern corresponding to the opening, wherein the photoresist pattern covers the first electrode and the first bank and exposes the second bank; forming a first insulation pattern and a second insulation pattern, wherein the first insulation pattern is arranged on a top surface and side surfaces of the second bank, and the second insulation pattern is arranged on top of the photoresist pattern; forming a third bank on the side surfaces of the second bank by removing the photoresist pattern and the second insulation pattern; forming a solution layer in the opening and contacting the third bank;Forming a light-emitting layer by drying the solution layer; and forming a second electrode on the light-emitting layer.

[0025] The third bank can be formed on side surfaces of the second bank that face each other along the second direction and correspond to the opening.

[0026] The process may further include the selective removal of the first isolation pattern on the upper surface of the second bank before the third bank is formed.

[0027] The first and third banks can exhibit hydrophilic properties. The second bank can exhibit hydrophobic properties.

[0028] The third bank may have a higher surface energy and / or a higher hydrophilic property than the first bank.

[0029] The light emission layer can be configured to connect adjacent subpixels of the same color on the first bank, arranged along the second direction to form a solid. The emission layer can have a greater height at an edge section of the aperture of the second bank than in a central section of the aperture.

[0030] According to a further aspect of the present disclosure, a method for manufacturing an electroluminescent display device is also provided, comprising forming a first electrode in each subpixel on a substrate on which several subpixels are defined, arranged along a first direction and a second direction; forming a first bank that is arranged between adjacent subpixels along the second direction and overlaps with edges of the first electrode; forming a second bank on the first bank, wherein the second bank has an opening corresponding to the subpixels arranged along the second direction and is arranged between adjacent subpixels along the first direction; forming a photoresist pattern corresponding to the opening, wherein the photoresist pattern covers the first electrode and the first bank and exposes the second bank;The process includes forming a first insulation pattern and a second insulation pattern, wherein the first insulation pattern is arranged on a top surface and side surfaces of the second bank, and the second insulation pattern is arranged on the photoresist pattern; forming a third bank on the side surfaces of the second bank by removing the photoresist pattern and the second insulation pattern; forming a solution layer in the opening and contacting the third bank; forming a light-emitting layer by drying the solution layer; and forming a second electrode on the light-emitting layer.

[0031] Naturally, both the preceding general description and the following detailed description are exemplary and explanatory and are intended to provide a further explanation of the present revelation, as claimed. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The accompanying drawings, which are included to provide a further understanding of the present disclosure and which are incorporated into and form part of this patent description, represent embodiments of the present disclosure and, together with the description, serve to explain the principles of the present disclosure; they show: Fig. 1 a circuit diagram of a pixel region of an electroluminescent display device according to an embodiment of the present disclosure; Fig. 2 a schematic cross-section of an electroluminescence indicator device according to the embodiment of the present disclosure; Fig. 3 a schematic top view of an electroluminescence indicator device according to a first embodiment of the present disclosure; Fig. 4 a cross-sectional view, which follows line IV-IV' of Fig. 3 corresponds to; Fig. 5 a cross-sectional view, which follows the line VV' from Fig. 3 corresponds to; Fig. 6A to 6H Cross-sectional views which schematically represent a manufacturing process of an electroluminescent display device according to the first embodiment of the present disclosure; Fig. 7 a schematic cross-sectional view of an electroluminescent display device according to a second embodiment of the present disclosure; and Fig. 8 a schematic cross-sectional view of an electroluminescence indicator device according to a third embodiment of the present disclosure. DETAILED DESCRIPTION OF THE EXECUTION FORMS

[0033] Now, specific embodiments of the disclosure will be discussed, examples of which are shown in the accompanying drawings.

[0034] An electroluminescent display device according to an embodiment of the present disclosure has a display area that shows an image and a non-display area that surrounds the display area. The display area comprises several pixels, and each of the several pixels comprises red, green, and blue subpixels, but may have other color arrangements. A pixel region corresponding to each subpixel may display a Fig. 1. Have the configuration shown.

[0035] Fig. Figure 1 is a circuit diagram of a pixel region of an electroluminescent display device according to one embodiment of the present disclosure. All components of the electroluminescent display device according to all embodiments of the present disclosure are operationally coupled and configured.

[0036] In Fig. 1 The electroluminescent display device according to the embodiment of the present disclosure comprises several gate lines and several data lines that cross each other to define several pixel regions. In particular, in the example of Fig. 1. A gate line DL and a data line DL are connected to each other to define a pixel region P. A thin-film switching transistor Ts, a thin-film drive transistor Td, a storage capacitor Cst, and a light-emitting diode De are implemented in each pixel region P.

[0037] Specifically, a gate electrode of the thin-film switching transistor Ts is connected to the gate line GL, and a source electrode of the thin-film switching transistor Ts is connected to the data line DL. A gate electrode of the thin-film driver transistor Td is connected to a drain electrode of the thin-film switching transistor Ts, and a source electrode of the thin-film driver transistor Td is connected to a high-voltage supply VDD. An anode of the LED De is connected to a drain electrode of the thin-film driver transistor Td, and a cathode of the LED De is connected to a low-voltage supply VSS. The storage capacitor Cst is connected to the gate and drain electrodes of the thin-film driver transistor Td.

[0038] The electroluminescent display device is driven to display an image. For example, when the thin-film switching transistor Ts is switched on by a gate signal applied through the gate line GL, a data signal from the data line DL is applied to the gate electrode of the thin-film drive transistor Td and to an electrode of the storage capacitor Cst through the thin-film switching transistor Ts.

[0039] When the thin-film driver transistor Td is switched on by the data signal, it controls an electric current flowing through the LED De, thus displaying an image. The LED De emits light due to the current supplied by the high-voltage supply VDD through the thin-film driver transistor Td.

[0040] The amount of current flowing through the LED De is proportional to the amplitude of the data signal, and the intensity of light emitted by the LED De is proportional to the amount of current flowing through the LED De. Consequently, the pixel regions P display different shades of gray depending on the amplitude of the data signal, and thus the electroluminescent display device shows an image.

[0041] Furthermore, the storage capacitor Cst maintains charges corresponding to the data signal for one frame when the thin-film switching transistor Ts is switched off. Consequently, even when the thin-film switching transistor Ts is switched off, the storage capacitor Cst ensures that the amount of current flowing through the LED De remains constant and that the gray level displayed by the LED De is maintained until the next frame.

[0042] Meanwhile, one or more transistors and / or capacitors can be added to the pixel region P in addition to the thin-film switching and thin-film drive transistors Ts and Td and the storage capacitor Cst.

[0043] In an electroluminescent display device, for example, the thin-film driver transistor Td is switched on for a relatively long time while the data signal is applied to its gate electrode, causing the LED to emit light and thus indicate the gray level. Due to the prolonged application of the data signal, the thin-film driver transistor Td can degrade. Consequently, the mobility and / or the threshold voltage Vth of the thin-film driver transistor Td are altered, and as a result, the pixel region P of the electroluminescent display shows a different gray level with respect to the same data signal. This causes uneven luminance, thereby reducing the image quality of the electroluminescent display.

[0044] To compensate for changes in the mobility and / or threshold voltage of the thin-film drive transistor Td, at least one thin-film sensing transistor and / or sensing capacitor can be added further into the pixel region P to detect a voltage change. The thin-film sensing transistor and / or sensing capacitor can be connected to a reference line for applying a reference voltage and outputting a sensing voltage.

[0045] Fig. Figure 2 is a schematic cross-section of an electroluminescence display device according to the embodiment of the present disclosure and shows a pixel region.

[0046] In the electroluminescent display device of Fig. Figure 2 shows a buffer layer 120 formed on a substrate 110. The buffer layer 120 is arranged essentially over the entire surface of the substrate 110. The substrate 110 can be a glass substrate or a plastic substrate. Polyimide, for example, can be used as a plastic substrate. The buffer layer 120 can be made of an inorganic material such as silicon dioxide (SiO2) or silicon nitride (SiNx) and can be a single layer or multiple layers.

[0047] A structured semiconductor layer 122 is formed on the buffer layer 120. The semiconductor layer 122 can be formed from an oxide semiconductor layer, and a light-shielding pattern can further be formed beneath the semiconductor layer 122. The light-shielding pattern can block light incident on the semiconductor layer 122 and can prevent the semiconductor layer 122 from degrading due to light exposure. Alternatively, the semiconductor layer 122 can be formed from polycrystalline silicon, and both ends of the semiconductor layer 122 can be doped with impurities.

[0048] A gate insulating layer 130 made of an insulating material is formed on the semiconductor layer 122, covering substantially the entire surface of the substrate 110. The gate insulating layer 130 can be made of an inorganic insulating material such as silicon dioxide (SiO2) or silicon nitride (SiNx). If the semiconductor layer 122 is made of an oxide semiconductor material, the gate insulating layer 130 can be made of silicon dioxide (SiO2). Alternatively, if the semiconductor layer 122 is made of polycrystalline silicon, the gate insulating layer 130 can be made of silicon dioxide (SiO2) or silicon nitride (SiNx).

[0049] A gate electrode 132, made of a conductive material such as metal, is formed on the gate insulating layer 130 corresponding to the center of the semiconductor layer 122. A gate conductor and a first capacitor electrode can also be formed on the gate insulating layer 130. The gate conductor extends in a first direction, and the first capacitor electrode is connected to the gate electrode 132.

[0050] In the embodiment of the present disclosure, the gate insulating layer 130 is formed over the entire surface of the substrate 110. However, the gate insulating layer 130 can be structured so that it has the same shape as the gate electrode 132.

[0051] An intermediate insulating layer 140, consisting of an insulating material, is formed on the gate electrode 132, covering substantially the entire surface of the substrate 110. The intermediate insulating layer 140 can be formed from an inorganic insulating material such as silicon dioxide (SiO2) or silicon nitride (SiNx). Alternatively, the intermediate insulating layer 140 can be formed from an organic insulating material such as photoacrylic or benzocyclobutene.

[0052] The interlayer insulating layer 140 has a first and a second contact hole 140a and 140b, which expose the upper surfaces of both ends of the semiconductor layer 122. The first and second contact holes 140a and 140b are located on both sides of the gate electrode 132 and spaced apart from the gate electrode 132. The first and second contact holes 140a and 140b are also formed in the gate insulating layer 130. Alternatively, if the gate insulating layer 130 is structured so that it has the same shape as the gate electrode 132, the first and second contact holes 140a and 140b are formed only in the interlayer insulating layer 140.

[0053] A source and a drain electrode 142 and 144, made of a conductive material such as metal, are formed on the intermediate insulation layer 140. Furthermore, a data line, a power supply line, and a second capacitor electrode can also be formed on the intermediate insulation layer 140.

[0054] The source and drain electrodes 142 and 144 are spaced apart, with the gate electrode 132 positioned between them, and are in contact with both ends of the semiconductor layer 122 via the first and second contact holes 140a and 140b, respectively. The data line extends in a second direction and crosses the gate line to define the pixel region. The power supply line for applying a high voltage is spaced apart from the data line. The second capacitor electrode is connected to the drain electrode 144. The second capacitor electrode overlaps the first capacitor electrode to form a storage capacitor with the intermediate insulating layer 140 acting as the dielectric. Alternatively, the first capacitor electrode can be connected to the drain electrode 144 and the second capacitor electrode can be connected to the gate electrode 132.

[0055] The semiconductor layer 122, the gate electrode 132, and the source and drain electrodes 142 and 144 form a thin-film transistor. The thin-film transistor has a coplanar structure in which the gate electrode 132 and the source and drain electrodes 142 and 144 are arranged on the same side with respect to the semiconductor layer 122.

[0056] Alternatively, the thin-film transistor can have an inverted staggered structure, in which the gate electrode and the source and drain electrodes are arranged on opposite sides with respect to the semiconductor layer. That is, the gate electrode can be located below the semiconductor layer, and the source and drain electrodes can be located above the semiconductor layer. The semiconductor layer can be made of an oxide semiconductor or amorphous silicon.

[0057] The thin-film transistor corresponds to a thin-film driver transistor, and a thin-film switching transistor with the same structure as the thin-film driver transistor can furthermore be formed in the pixel region on the substrate 110. The gate electrode 132 of the thin-film driver transistor can be connected to a drain electrode of the thin-film switching transistor, and the source electrode 142 of the thin-film driver transistor is connected to the power supply line. Furthermore, a gate electrode and a source electrode of the thin-film switching transistor can be connected to the gate line and the data line, respectively.

[0058] A thin-film detection transistor with the same structure as the thin-film drive transistor can furthermore be formed in the pixel region on the substrate 110, but the present disclosure is not limited thereto.

[0059] A coating layer 150 made of an insulating material is formed on the source and drain electrodes 142 and 144, essentially covering the entire surface of the substrate 110. The coating layer 150 can be made of an organic insulating material such as photoacrylic or benzocyclobutene. The coating layer 150 can have a flat upper surface.

[0060] Meanwhile, an insulating layer made of an inorganic insulating material such as silicon oxide (SiO2) or silicon nitride (SiNx) can also be formed under the coating layer 150.

[0061] The coating layer 150 has a drain contact hole 150a that exposes the drain electrode 144. The drain contact hole 150a can be spaced apart from the second contact hole 140b. Alternatively, the drain contact hole 150a can be located directly above the second contact hole 140b.

[0062] A first electrode 162 is formed on the coating layer 150 and is made of a conductive material with a relatively high work function. The first electrode 162 is located in the pixel region and is in contact with the drain electrode 144 via the drain contact hole 150a. The first electrode 162 can, for example, be made of a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO), but is not limited to this.

[0063] The electroluminescent display device according to the embodiment of the present disclosure is a top-emission type in which light from a light-emitting diode De is emitted in a direction opposite to the substrate 110. Consequently, the first electrode 162 may further comprise a reflective electrode or a reflective layer formed from a metallic material with a relatively high reflectance beneath the transparent conductive material. The reflective electrode or reflective layer may, for example, be formed from an aluminum-palladium-copper alloy (APC alloy) or silver (Ag). The first electrode 162 may have, but is not limited to, a triple-layer structure of ITO / APC / ITO or ITO / Ag / ITO.

[0064] A first bank 172 made of an insulating material is formed on the first electrode 162. The first bank 172 overlaps and covers edges of the first electrode 162, exposing a central section of the first electrode 162. The first bank 172 exhibits hydrophilic properties. The first bank 172 can, for example, be made of an inorganic insulating material such as silicon dioxide (SiO2) or silicon nitride (SiNx). Alternatively, the first bank 172 can be made of polyimide.

[0065] A second layer 174, made of an insulating material, is formed on top of the first layer 172. The second layer 172 is narrower than the first layer 172, is positioned on top of the first layer 172, and exposes edges of the first layer 172. The second layer 174 is hydrophobic. The thickness of the second layer 174 can be greater than the thickness of the first layer 172. The second layer 174 can be made of an organic insulating material with hydrophobic properties. Alternatively, the second layer 174 can be made of an organic insulating material with hydrophilic properties and can be subjected to a hydrophobic treatment.

[0066] Meanwhile, only the first bank 172 can be arranged on other edges of the first electrode 162. Even if the first and second banks 172 and 174 are arranged on the edges of the first electrode 162 in Fig. If 2 are formed, the first bank 172 can also be omitted and only the second bank 174 can overlap with and cover the edges of the first electrode 162.

[0067] A light emission layer 180 is formed on the first electrode 162, which is exposed by the first and second banks 172 and 174.

[0068] The light-emitting layer 180 can comprise a first charge-aid layer, a light-emitting material layer, and a second charge-aid layer, arranged sequentially over the first electrode 162. The light-emitting material layer can be formed from any of the red, green, and blue luminescent materials, but is not limited to these. The luminescent material can be an organic luminescent material, such as a phosphorescent compound or a fluorescent compound, or it can be an inorganic luminescent material, such as a quantum dot.

[0069] The first charge auxiliary layer can be a hole auxiliary layer, and the hole auxiliary layer can comprise a hole injection layer (HIL) and / or a hole transport layer (HTL). Furthermore, the second charge auxiliary layer can be an electron auxiliary layer, and the electron auxiliary layer can comprise an electron injection layer (EIL) and / or an electron transport layer (ETL). However, the present invention is not limited thereto.

[0070] The light-emitting layer 180 is formed by a solution process. Consequently, the process can be simplified, and a display device with a large size and high resolution can be created. A centrifugal process, an inkjet printing process, or a screen printing process can be used as the solution process, but the present disclosure is not limited to these. When the solution is dried, the drying rate of a solvent in a region adjacent to the second bank 174 differs from that in other regions. Therefore, the height of the light-emitting layer 180 in the region adjacent to the second bank 174 can increase as it gets closer to the second bank 174.

[0071] Meanwhile, the electron support layer can be formed beneath the layers of the light-emitting layer 180 by a vacuum evaporation process. At this time, the electron support layer can be formed essentially over the entire surface of the substrate 110.

[0072] A second electrode 190, made of a conductive material with a relatively low work function, is formed on the light-emitting layer 180, covering essentially the entire surface of the substrate 110. The second electrode 190 can be made of aluminum (Al), magnesium (Mg), silver (Ag), or an alloy thereof. The second electrode 190 has a relatively thin profile, allowing light from the light-emitting layer 180 to pass through it. Alternatively, the second electrode 190 can be made of a transparent conductive material such as indium gallium oxide (IGO), but this is not the only possible material.

[0073] The first electrode 162, the light-emitting layer 180, and the second electrode 190 form a light-emitting diode De. The first electrode 162 can serve as the anode, and the second electrode 190 can serve as the cathode, but this is not the only possible function.

[0074] As described above, the electroluminescent display device according to the embodiment of the present disclosure can be of a top-emission type, in which light from the light-emitting layer 180 of the LED De is emitted in a direction opposite to the substrate 110, that is, emitted to the outside through the second electrode 190. The top-emission display device can have a wider emission range than a bottom-emission display device of the same size, in order to improve the luminance and reduce power consumption.

[0075] The light-emitting diode De of each pixel region can have an element thickness for a micro-cavity effect that corresponds to a wavelength of the emitted light, thereby increasing the luminous efficiency.

[0076] Meanwhile, a protective layer and / or an encapsulation layer can be formed on the second electrode 190 essentially over the entire surface of the substrate 110 to block moisture or oxygen introduced from the outside, thereby protecting the light-emitting diode De. <Erste Ausführungsform>

[0077] Fig. Figure 3 is a schematic top view of an electroluminescence indicator device according to a first embodiment of the present disclosure and mainly shows a bank configuration.

[0078] In Fig. 3 The electroluminescent display device according to the first embodiment of the present disclosure comprises red, green, and blue subpixels R, G, and B. The red, green, and blue subpixels R, G, and B are arranged sequentially along a first direction, and the subpixels R, G, and B of the same color are arranged along a second direction. For example, R, G, and B subpixels are repeatedly arranged in this order along the first direction (e.g., the horizontal direction), whereas a column or row of R subpixels, a column or row of G subpixels, and a column or row of B subpixels are repeatedly and / or sequentially and / or adjacently arranged along the second direction (e.g., the vertical direction). Here, the red, green, and blue subpixels R, G, and B are shown to each have a rectangular shape, but are not limited to this.The red, green and blue subpixels R, G and B can each have different shapes, such as a rectangular shape with rounded corners, an oval shape or the like.

[0079] A first bank 172 is arranged between adjacent subpixels R, G, and B of the same color and between adjacent subpixels R, G, and B of different colors. Alternatively, the first bank 172 can be omitted between adjacent subpixels R, G, and B of different colors. That is, the first bank 172 can be formed between adjacent subpixels R, G, and B along the second direction and can extend along the first direction.

[0080] Furthermore, the first bank can enclose all subpixels R, G and B, 172.

[0081] A second bank 174 is arranged on top of the first bank 172. The second bank 174 has an opening 174a corresponding to a row of subpixels of the same color and is arranged between adjacent subpixels R, G, and B of different colors. At this time, the second bank 174 may have a narrower width than the first bank 172 between adjacent subpixels R, G, and B of different colors. A row of subpixels of the same color corresponds to subpixels of the same color arranged along the second direction.

[0082] Meanwhile, a third bank 176 is formed on each of the side surfaces of the second bank 174 facing each other along the second direction. The third bank 176 is formed on the side surface of the second bank 174 that corresponds to a short side of the opening 174a. Consequently, the third bank 176 is arranged only in one edge section of the display field.

[0083] The first and third banks, 172 and 176, exhibit hydrophilic properties, as does the second bank, 174. Here, the third bank, 176, may exhibit a higher hydrophilic property than the first bank, 172. That is, the third bank, 176, may have a higher surface energy than the first bank, 172. Alternatively, the first and second banks, 172 and 176, may exhibit the same hydrophilic property.

[0084] A cross-sectional structure of the electroluminescence indicator device of the present disclosure is shown with reference to Fig. 4 and Fig. 5 described.

[0085] Fig. 4 is a cross-sectional view corresponding to line IV-IV' of Fig. 3 corresponds to, and Fig. 5 is a cross-sectional view that follows line VV' from Fig. 3 corresponds.

[0086] In Fig. 4 and Fig. 5 A buffer layer 120, a gate insulation layer 130, an intermediate insulation layer 140, and a coating layer 150 are sequentially formed on a substrate 110, on which several pixel regions P, each corresponding to red, green, and blue subpixels R, G, and B, are defined. A first electrode 162 is formed in each pixel region P on the coating layer 150.

[0087] One or more thin-film transistors and / or capacitors with the configuration of Fig. 2 can furthermore be formed between the substrate 110 and the coating layer 150 and one or more thin-film transistors can be connected to the first electrode 162.

[0088] A first bank 172 is formed on the first electrode 162. The first bank 172 overlaps with and covers the edges of the first electrode 162. The first bank 172 is formed between adjacent subpixels R, G, and B of the same color and between adjacent subpixels R, G, and B of different colors. Alternatively, the first bank 172 can be omitted between adjacent subpixels R, G, and B of different colors and can be arranged only between adjacent subpixels R, G, and B of the same color.

[0089] The first bank 172 can be made of a material with hydrophilic properties, for example, an inorganic insulating material such as silicon dioxide (SiO2) or silicon nitride (SiNx). Alternatively, the first bank 172 can be made of polyimide.

[0090] Furthermore, a second bank 174 is formed on top of the first bank 172. The second bank 174 is thicker than the first bank 172. The second bank 174 is formed only between adjacent subpixels R, G, and B of different colors and is not formed between adjacent subpixels R, G, and B of the same color. The width of the second bank 174 is narrower than the width of the first bank 172 between adjacent subpixels R, G, and B of different colors.

[0091] The second bank 174 has an opening 174a corresponding to a subpixel row of the same color, and exposes the first electrodes 162 of the subpixel row of the same color and the first bank 172 between adjacent first electrodes 162 through the opening 174a.

[0092] If the first bank 172 between adjacent subpixels R, G and B with different colors is omitted, the second bank 174 contacts edges of each first electrode 162 of Fig. 4 and overlaps and covers the edges of each first electrode 162 of Fig. 4.

[0093] The second bank 174 can be made of an organic insulating material with hydrophobic properties. Alternatively, the second bank 174 can be made of an organic insulating material with hydrophilic properties and can be subjected to a hydrophobic treatment.

[0094] The first bank 172 and the second bank 174 can be formed by an etching mask process.

[0095] Next, a third bank 176 is formed on each of the opposite side surfaces of the second bank 174. The third bank 176 is formed at each of the two ends of the subpixel row of the same color. That is, the third bank 176 is formed on each of the short sides of the aperture 174a.

[0096] The third bank 176 can be made of a material with hydrophilic properties, for example an inorganic insulating material such as silicon dioxide (SiO2) or silicon nitride (SiNx). Alternatively, the third bank 176 can be made of polyimide.

[0097] Here, the third bank 176 can be made of a different material than the first bank 172 and can exhibit a higher hydrophilic property than the first bank 172. That is, the third bank 176 can have a higher surface energy than the first bank 172. Alternatively, the third bank 176 can be made of the same material as the first bank 172 and can exhibit the same hydrophilic property as the first bank 172.

[0098] A light emission layer 180 is formed on the first electrode 162, which is exposed through the opening 174a of the second bank 174, in each pixel region P. Here, a red light emission layer is formed in the red subpixel R, a green light emission layer is formed in the green subpixel G, and a blue light emission layer is formed in the blue subpixel B.

[0099] Furthermore, the light emission layer 180 is also formed on the first bank 172, which is exposed through the opening 174a of the second bank 174, between adjacent subpixels R, G and B of the same color. Fig. In 5, the blue light emission layer 180 is also formed on the first bank 172, which is exposed through the opening 174a of the second bank 174, between adjacent subpixels B. At this time, the light emission layer 180 on the first bank 172 is connected to the light emission layer 180 on the first electrode 162 in each pixel region P adjacent to it, in order to form a body.

[0100] The light-emitting layer 180 is formed through a solution process. The solutions, which are dripped through different nozzles into respective pixel regions P corresponding to subpixels of the same color, for example, the row of blue subpixels, are combined here, and the light-emitting layer 180 is formed by drying the solutions. Consequently, a variation in the drip volume between the nozzles is minimized, and the thickness of the light-emitting layers 180 can be uniform in the respective pixel regions P.

[0101] Since the third bank 176 exhibits hydrophilic properties on the side surfaces of the second bank 174, the force holding the solution at both ends of the subpixel row of the same color also increases, thus preventing the solution from being drawn towards the center. Consequently, it is possible to prevent the problem of the light-emitting layer 180 not forming near both ends of the subpixel row of the same color.

[0102] A second electrode 190 is formed on the light-emitting layer 180 and the second bank 174. At this time, the second electrode 190 is also formed on a top surface and a side surface of the third bank 176, and the second electrode 190 contacts the top surface and the side surface of the third bank 176.

[0103] The first electrode 162, the light emission layer 180 and the second electrode 190 form a light-emitting diode De.

[0104] As described above, in the electroluminescent display device according to the first embodiment of the present disclosure, the light emission layers 180 of the subpixels R, G and B of the same color are connected to one another and formed as a single body, thereby minimizing the variation in the droplet quantity between nozzles and ensuring that the thicknesses of the light emission layers 180 of the subpixels R, G and B are uniform. Therefore, unevenness is prevented, effectively preventing a reduction in the image quality of the display device.

[0105] Furthermore, the third bank 176 is formed with the hydrophilic property on the side surfaces of the second bank 174, thereby preventing the phenomenon of the solution being drawn to the center and the problem of the light emission layer 180 not being formed near both ends of the subpixel row of the same color.

[0106] A manufacturing process for an electroluminescent indicator device according to the first embodiment of the present disclosure is described with reference to Fig. 6A to 6H are described in detail.

[0107] Fig. Figures 6A to 6H are cross-sectional views that schematically represent a manufacturing process of an electroluminescent display device according to the first embodiment of the present disclosure.

[0108] In Fig. In 6A, a buffer layer 120, a gate insulating layer 130, an intermediate insulating layer 140, and a coating layer 150 are sequentially formed from insulating materials on a substrate 110 on which several pixel regions P, corresponding to red, green, and blue subpixels R, G, and B, respectively, are defined. Each of the buffer layer 120 and the gate insulating layer 130 can be formed by depositing an inorganic insulating material, such as silicon dioxide (SiO2) or silicon nitride (SiNx), substantially over the entire surface of the substrate 110. The intermediate insulating layer 140 can be formed by depositing an inorganic insulating material, such as silicon dioxide (SiO2) or silicon nitride (SiNx), substantially over the entire surface of the substrate 110 or by applying an organic insulating material, such as silicon dioxide (SiO2) or silicon nitride (SiNx). B. Photoacrylic or benzocyclobutene are formed essentially over an entire surface of the substrate 110.

[0109] One or more thin-film transistors and / or capacitors with the configuration of Fig. 2 can also be formed between the substrate 110 and the coating layer 150.

[0110] A first electrode 162 is formed from a conductive material in each pixel region P on the coating layer 150. The first electrode 162 can be formed by depositing a conductive material with a relatively high work function and structuring it by a photolithography process using a mask.

[0111] The first electrode 162 can, for example, be formed from a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO), but is not limited to this. Furthermore, the first electrode 162 can also include a reflective electrode or a reflective layer formed from a metallic material with a relatively high reflectance beneath the transparent conductive material. The reflective electrode or reflective layer can, for example, be formed from an aluminum-palladium-copper alloy (APC alloy) or silver (Ag). The first electrode 162 can have a triple-layer structure of ITO / APC / ITO or ITO / Ag / ITO, but is not limited to this.

[0112] A first bank 172 is formed from an insulating material on the first electrode 162. The first bank 172 can be formed by depositing an inorganic insulating material such as silicon dioxide (SiO2) or silicon nitride (SiNx) and structuring it by a photolithography process using a mask. Alternatively, the first bank 172 can be formed by applying polyimide and structuring it.

[0113] The first bank 172 is arranged between adjacent pixel regions P and covers edges of the first electrode 162. The first bank 172 can only be arranged between pixel regions P of the same color.

[0114] Then, a second bank 174 is formed from an insulating material on the first bank 172. The second bank 174 is formed by applying an organic insulating material with hydrophobic properties and structuring it using a photolithography process with a mask. Alternatively, the second bank 174 can be formed by applying an organic insulating material with hydrophilic properties, structuring it using a photolithography process with a mask, and performing a hydrophobic treatment.

[0115] The second bank 174 is arranged between adjacent pixel regions P of different colors. The second bank 174 has an opening 174a, which corresponds to a pixel row of the same color, comprising the pixel regions P of the same color, and exposes the first electrodes 162 of the pixel row of the same color and the first bank 172 between adjacent first electrodes 162 through the opening 174a.

[0116] Next, in Fig. 6B a photoresist pattern 200 was formed by applying a photoresist and developing it.

[0117] The photoresist pattern 200 is arranged in the opening 174a. The photoresist pattern 200 covers the first bank 172 between the first electrodes 162 of the pixel row of the same color and exposes the second bank 174 at both ends in relation to the figure. Furthermore, the photoresist pattern 200 can partially expose an upper surface of the first bank 172 beneath the second bank 174.

[0118] The photoresist pattern 200 can cover a top surface and a side surface of the second bank 174 between the pixel regions P with different colors.

[0119] Next, in Fig. 6C forms a first insulation pattern 176a and a second insulation pattern 176b from an insulating material. The first insulation pattern 176a is formed on a top surface and a side surface of the second bed 174, and the second insulation pattern 176b is formed on the photoresist pattern 200. The first and second insulation patterns 176a and 176b can be separate from each other. Here, the first insulation pattern 176a can also be formed on the top surface of the first bed 172, which is partially exposed.

[0120] The first and second insulation patterns 176a and 176b can be formed by depositing a material with hydrophilic properties, for example, an inorganic insulating material such as silicon dioxide (SiO2) or silicon nitride (SiNx). Alternatively, the first and second insulation patterns 176a and 176b can be formed from polyimide.

[0121] In Fig. 6D will be the first insulation pattern 176a of Fig. 6C was removed from the upper surface of the second bank 174 to form a third bank 176 on the side surface of the second bank 174.

[0122] At this time, the second isolation pattern 176b on the photoresist pattern 200 can be partially or completely removed.

[0123] Next, in Fig. 6E the photoresist pattern 200 of Fig. 6D and the second isolation pattern 176b of Fig. 6D removed. At this time, the second isolation pattern 176b of Fig. 6D together with the photoresist pattern 200 from Fig. 6D by removing the photoresist pattern 200 of Fig. 6D is removed by a lifting process. Consequently, the first electrode 162 and the first bank 172 are exposed in the opening 174a.

[0124] In Fig. 6F a solution layer 180a is formed on the first electrode 162 and the first bank 172, which are exposed through the opening 174a, by dropping a luminescent material solution using an injection device with multiple nozzles.

[0125] At this time, the second bank 174 exhibits a hydrophobic property. Even when the solution layer 180a is applied to the upper surface of the second bank 174, it prevents the solution layer 180a from migrating into an adjacent pixel region P with a different color.

[0126] Since the third bank 176 has a hydrophilic property, the third bank 176 also holds the solution layer 180a at both ends of the opening 174a and prevents the solution from being drawn into the center.

[0127] Next, in Fig. 6G a light emission layer 180 on the first electrodes 162 in the opening 174a by drying the solution layer 180a of Fig. 6F formed. At this time, solvent can be present in the solution layer 180a of Fig. 6F is evaporated by performing a vacuum drying process. When the solution is dried, the drying rate of the solvent in a region adjacent to the second bank 174 differs from that in other regions. Therefore, the height of the light emission layer 180 in the region adjacent to the second bank 174 can increase as it gets closer to the second bank 174.

[0128] Here, the light emission layer 180 is also formed on the first bank 172 in the aperture 174a. The light emission layer 180 on the first bank 172 is connected to the light emission layer 180 on the first electrode 162 of the adjacent pixel region P and is formed as a single body.

[0129] In Fig. In step 6H, a second electrode 190 is formed essentially over the entire surface of the substrate 110 by depositing a conductive material with a relatively low working conductivity onto the light-emitting layer 180 by a sputtering process or the like. The second electrode 190 can be made of aluminum (Al), magnesium (Mg), silver (Ag), or an alloy thereof. The second electrode 190 has a relatively thin thickness so that light from the light-emitting layer 180 can be transmitted through it. Alternatively, the second electrode 190 can be made of a transparent conductive material such as indium gallium oxide (IGO), but this is not the only option.

[0130] In the electroluminescence display device according to the first embodiment of the present disclosure, the light emission layer 180 is formed by the solution process and a display device with a large size and high resolution can be implemented.

[0131] Furthermore, in the electroluminescent display device according to the first embodiment of the present disclosure, the light emission layers 180 of the pixel regions P of the same color are connected to one another and formed as a single body, thereby minimizing the deviation in the droplet quantity between nozzles and ensuring that the thicknesses of the light emission layers 180 of the respective pixel regions P are uniform. Therefore, unevenness is prevented, effectively preventing a reduction in the image quality of the display device.

[0132] Furthermore, the third bank 176 with the hydrophilic property is formed on the side surfaces of the second bank 174 corresponding to short sides of the opening 174a, thereby preventing the phenomenon of the solution being drawn into the center and the defects in the formation of the light emission layer 180. <Zweite Ausführungsform>

[0133] Fig. Figure 7 is a schematic cross-sectional view of an electroluminescent display device according to a second embodiment of the present disclosure. The second embodiment has a difference in the structure of the third bank compared to the first embodiment. The same parts are designated by the same reference numerals, and descriptions of the same parts are omitted or are brief.

[0134] In Fig. In 7, a coating layer 150 is formed on a substrate 110, on which several pixel regions P, corresponding to red, green and blue subpixels R, G and B respectively, are defined. A first electrode 162 is formed in each pixel region P on the coating layer 150.

[0135] A first bank 172 with hydrophilic properties is formed on the first electrode 162. The first bank 172 overlaps with and covers edges of the first electrode 162. The first bank 172 is formed between adjacent pixel regions P of the same color. Furthermore, the first bank 172 can also be formed between adjacent pixel regions P of different colors.

[0136] A second bank 174 with hydrophobic properties is formed on the first bank 172. The second bank 174 has an opening 174a corresponding to a pixel row of the same color, which includes the pixel regions P of the same color, and exposes the first electrodes 162 of the pixel row of the same color and the first bank 172 between adjacent first electrodes 162 through the opening 174a. Furthermore, the second bank 174 is formed between adjacent pixel regions P of different colors.

[0137] A third bank 276 is formed on each of the opposite side surfaces of the second bank 174. At this time, the third bank 276 is formed at each of the two ends of the pixel row of the same color. That is, the third bank 276 is formed on each of the short sides of the opening 174a. Here, the third bank 276 is also formed on an upper surface of the second bank 174. However, the third bank 276 is not formed on an upper surface of the second bank 174 between adjacent pixel regions P of different colors.

[0138] A light-emitting layer 180 is formed on the first electrode 162, which is exposed through the opening 174a of the second bank 174, in each pixel region P. Furthermore, the light-emitting layer 180 is also formed on the first bank 172, which is exposed through the opening 174a of the second bank 174, and the light-emitting layer 180 on the first bank 172 is adjacent to the light-emitting layer 180 on the first electrode 162 of the pixel region P and is formed as a single body. The light-emitting layer 180 is formed by a solution process.

[0139] A second electrode 190 is formed on the light-emitting layer 180. At this time, the second electrode 190 is also formed on a top surface and a side surface of the third bank 276, and the second electrode 190 contacts the top surface and the side surface of the third bank 276. Furthermore, the second electrode 190 is also formed on the top surface and the side surface of the second bank 174 between adjacent pixel regions P of different colors.

[0140] As described above, in the electroluminescent display device according to the second embodiment of the present disclosure, the light emission layers 180 of the pixel regions P of the same color are connected to one another and formed as a single body, thereby minimizing the variation in the droplet quantity between nozzles and ensuring that the thicknesses of the light emission layers 180 of the respective pixel regions P are uniform. Therefore, unevenness is prevented, effectively preventing a reduction in the image quality of the display device.

[0141] Furthermore, the third bank 276 is formed with the hydrophilic property on the side surfaces of the second bank 174, thereby preventing the phenomenon of the solution being drawn to the center and the problem of the light emission layer 180 not being formed near both ends of the pixel row of the same color.

[0142] Furthermore, the electroluminescence indicator device according to the second embodiment has advantages of the simple process, since the third bank 276 can be easily formed compared to the first embodiment.

[0143] At this time, the photoresist pattern 200 is formed in the electroluminescent display device according to the second embodiment, as shown in Fig. 6B is shown, and the first and second isolation patterns 176a and 176b are formed as shown in Fig. 6C is shown. Then the photoresist pattern 200 and the second isolation pattern 176b are removed, forming the third bank 276 with the first isolation pattern 176a. <Dritte Ausführungsform>

[0144] Fig. Figure 8 is a schematic cross-sectional view of an electroluminescent display device according to a third embodiment of the present disclosure. The third embodiment has a difference in the structure of the third bank compared to the first embodiment. The same parts are designated with the same reference numerals, and descriptions of these parts are either omitted or brief.

[0145] In Fig. In 8, a coating layer 150 is formed on a substrate 110, on which several pixel regions P, corresponding to red, green and blue subpixels R, G and B respectively, are defined. A first electrode 162 is formed in each pixel region P on the coating layer 150.

[0146] A first bank 172 with hydrophilic properties is formed on the first electrode 162. The first bank 172 overlaps with and covers edges of the first electrode 162. The first bank 172 is formed between adjacent pixel regions P of the same color. Furthermore, the first bank 172 can also be formed between adjacent pixel regions P of different colors.

[0147] A second bank 174 with hydrophobic properties is formed on the first bank 172. The second bank 174 has an opening 174a corresponding to a pixel row of the same color, which includes the pixel regions P of the same color, and exposes the first electrodes 162 of the pixel row of the same color and the first bank 172 between adjacent first electrodes 162 through the opening 174a. Furthermore, the second bank 174 is formed between adjacent pixel regions P of different colors.

[0148] A third bank 376 is formed on each of the opposite side surfaces of the second bank 174. At this time, the third bank 376 is formed at each of the two ends of the pixel row of the same color. That is, the third bank 376 is formed on each of the short sides of the opening 174a. Here, the third bank 376 is also partially formed on a top surface of the second bank 174, exposing the top surface of the second bank 174. Meanwhile, the third bank 376 is not formed on a top surface of the second bank 174 between adjacent pixel regions P of different colors.

[0149] A light-emitting layer 180 is formed on the first electrode 162, which is exposed through the opening 174a of the second bank 174, in each pixel region P. Furthermore, the light-emitting layer 180 is also formed on the first bank 172, which is exposed through the opening 174a of the second bank 174, and the light-emitting layer 180 on the first bank 172 is adjacent to the light-emitting layer 180 on the first electrode 162 of the pixel region P and is formed as a single body. The light-emitting layer 180 is formed by a solution process.

[0150] A second electrode 190 is formed on the light-emitting layer 180. At this time, the second electrode 190 is also formed on a top surface and a side surface of the third bank 376, and the second electrode 190 contacts the top surface and the side surface of the third bank 376. Furthermore, the second electrode 190 is also formed on the top surface and the side surface of the second bank 174 between adjacent pixel regions P of different colors.

[0151] As described above, in the electroluminescent display device according to the third embodiment of the present disclosure, the light emission layers 180 of the pixel regions P of the same color are connected to one another and formed as a single body, thereby minimizing the variation in the droplet quantity between nozzles and ensuring that the thicknesses of the light emission layers 180 of the respective pixel regions P are uniform. Therefore, unevenness is prevented, effectively preventing a reduction in the image quality of the display device.

[0152] Furthermore, the third bank 376 is formed with the hydrophilic property on the side surfaces of the second bank 174, thereby preventing the phenomenon of the solution being drawn to the center and the problem of the light emission layer 180 not being formed near both ends of the pixel row of the same color.

[0153] Furthermore, the electroluminescent display device according to the third embodiment offers advantages of a simpler process, since the third bank 376 can be formed more easily compared to the first embodiment. Moreover, since the second bank 174 is exposed with its hydrophobic properties, the electroluminescent display device according to the third embodiment, compared to the second embodiment, can prevent the solution from overflowing into an adjacent pixel region P of a different color.

[0154] In the present disclosure, by forming the light emission layer of each subpixel through the solution process, a mask is omitted in order to reduce manufacturing costs, and a display device with a large size and high resolution can be implemented.

[0155] Furthermore, the light-emitting layers of the subpixels of the same color are interconnected and formed as a single unit, thus minimizing variations in the droplet quantity between nozzles and ensuring uniform thicknesses of the light-emitting layers of the subpixels. This prevents unevenness and effectively prevents a reduction in the image quality of the display device.

[0156] Since the hydrophilic bank is formed on the side surfaces of the hydrophobic bank, corresponding to the two ends of the subpixel row of the same color, it is also prevented that the solution is drawn into the center, and it is possible to prevent or address the problem of the light emission layer not being formed near both ends of the subpixel row of the same color.

Claims

[1] Electroluminescent display device comprising: multiple pixels arranged on a substrate, wherein the multiple pixels comprise subpixels of different colors arranged along a first direction and subpixels of the same color arranged along a second direction; wherein each subpixel comprises a light-emitting diode (De), wherein the light-emitting diode (De) comprises a first electrode (162), a light emission layer (180) and a second electrode (190); a first bank (172) that is arranged between adjacent subpixels of the same color along the second direction and overlaps with edges of the first electrode (162); a second bank (174) with an opening (174a) corresponding to the subpixels of the same color arranged along the second direction, and positioned between adjacent subpixels of different colors arranged along the first direction; and a third bank (176, 276, 376) on side surfaces of the second bank (174) facing each other along the second direction and corresponding to the opening (174a), where the first bank (172) and the third bank (176, 276, 376) have a hydrophilic property and the second bank (174) has a hydrophobic property. [2] Electroluminescent display device according to claim 1, wherein the light emission layer (180) is in contact with the third bank (176, 276, 376) in the second direction and is in contact with side surfaces of the second bank (174) which are facing each other along the first direction. [3] Electroluminescent display device according to claim 1 or 2, wherein the third bank (176, 276, 376) has a higher surface energy and / or a higher hydrophilic property than the first bank (172). [4] Electroluminescence display device according to one of the preceding claims, wherein the third bank (176, 276, 376) is further formed on an upper surface of the second bank (174). [5] Electroluminescent display device according to one of the preceding claims, wherein the first bank (172) further comprises a section formed between adjacent subpixels of different colors arranged along the first direction. [6] Electroluminescent display device according to claim 5, wherein the section of the first bank (172) formed between the adjacent subpixels arranged along the first direction is formed below the second bank (174). [7] Electroluminescent display device according to one of the preceding claims, wherein the light emission layers (180) on the first electrodes (162) of adjacent subpixels of the same color, arranged along the second direction, are connected on the first bank (172) between the adjacent subpixels along the second direction to form a body. [8] Electroluminescent display device according to claim 7, wherein the emission layer (180), which is designed as a body, has a higher height in an edge section of the opening (174a) of the second bank (174) than in a central section of the opening (174a). [9] Electroluminescence display device according to one of the preceding claims, wherein the first bank (172) and the second bank (174) are formed by an etching mask process. [10] Electroluminescent display device according to one of the preceding claims, wherein the light emission layer (180) of each subpixel is formed by a solution process. [11] Method for manufacturing an electroluminescent display device, the method comprising: Forming a first electrode (162) in each subpixel on a substrate on which multiple pixels are defined, wherein the multiple pixels comprise subpixels with different colors arranged along a first direction and subpixels with the same color arranged along a second direction; Forming a first bank (172) that is arranged between adjacent subpixels of the same color along the second direction, with the first bank (172) overlapping with edges of the first electrode (162); Forming a second bank (174) on the first bank (172), wherein the second bank (174) has an opening (174a) corresponding to the subpixels of the same color arranged along the second direction and positioned between adjacent subpixels of different colors arranged along the first direction; Forming a photoresist pattern (200) corresponding to the opening (174a), wherein the photoresist pattern (200) covers the first electrode (162) and the first bank (172) and exposes the second bank (174); Forming a first isolation pattern (176a) and a second isolation pattern (176b), wherein the first isolation pattern (176a) is arranged on a top surface and side surfaces of the second bank (174), and the second isolation pattern (176b) is arranged on the photoresist pattern (200); Forming a third bank (176, 276, 376) on the side surfaces of the second bank (174) by removing the photoresist pattern (200) and the second isolation pattern (176b); Forming a solution layer (180a) in the opening (174a) and contacting the third bank (176, 276, 376); Formation of a light-emitting layer (180) by drying the solution layer (180a); and Forming a second electrode (190) on the light emission layer (180), where the first bank (172) and the third bank (176, 276, 376) have a hydrophilic property and the second bank (174) has a hydrophobic property. [12] Method according to claim 11, further comprising the selective removal of the first isolation pattern (176a) on the upper surface of the second bank (174) prior to forming the third bank (176, 276, 376). [13] Method according to claim 11 or 12, wherein the light emission layer (180) is in contact with the third bank (176, 276, 376) in the second direction and is in contact with side surfaces of the second bank (174) which are facing each other along the first direction. [14] Method according to any one of claims 11 to 13, wherein the third bank (176, 276, 376) has a higher surface energy and / or a higher hydrophilic property than the first bank (172). [15] Method according to any one of claims 11 to 14, wherein the light emission layer (180) is configured to be connected on the first bank (172) between adjacent subpixels of the same color arranged along the second direction to form a body, and / or wherein the emission layer (180) has a higher height in an edge section of the aperture (174a) of the second bank (174) than in a central section of the aperture (174a).

Images