Electronic device

Abstract

Electronic device in which an electronic component (20) mounted on a substrate (30) is sealed with a sealing resin body (50), the electronic device comprising: a heat transfer section (60) which is sealed with the sealing resin body, is arranged between the electronic component and the sealing resin body in a state in which it is in contact with both the electronic component and the sealing resin body, is deformable according to the deformation of the sealing resin body and has a higher thermal conductivity than the sealing resin body; and a stress relief section (70, 80) which is sealed with the sealing resin body, is arranged between the heat transfer section and the electronic component and / or the sealing resin body in a state in which it is in contact with the heat transfer section, and relieves a stress which is exerted on the electronic component by the sealing resin body through the heat transfer section with the deformation of the sealing resin body, wherein The stress relief section is compressed by a load exerted on the stress relief section by the heat transfer section from the sealing resin body to reduce a load exerted on the electronic component by the heat transfer section.

Description

[0001] The invention relates to an electronic device.

[0002] As an electronic device in which an electronic component mounted on a substrate is sealed with a sealing resin, for example, JP H10-294404 A (Patent Document 1) discloses an electronic device including a package body in which an electronic component mounted on a lead frame is sealed with a primary sealing resin, and a secondary sealing resin with which the package body is sealed. In the above electronic device, a coating film is provided between the primary sealing resin and the secondary sealing resin. The coating film is formed by depositing air bubbles in rubber, which is a base material, and covers the entire primary sealing resin.In Patent Document 1, when thermal stress is generated due to a mismatch of a thermal expansion coefficient between the primary sealing resin and the secondary sealing resin, the thermal stress is absorbed by the coating film, thereby relaxing the thermal stress applied to the electronic component.

[0003] However, in Patent Document 1, the package body is covered with a rubber-made coating film in which air bubbles are deposited. Thus, when heat is generated from the electronic component during driving, the coating film is believed to prevent the heat from dissipating to the outside. In this case, there is a concern that the heat generated by the electronic component will be transferred to the interior of the electronic component, causing the temperature of the electronic component to become excessively high.

[0004] Furthermore, US 2013 / 0306991 A1 discloses a semiconductor device comprising a semiconductor element substrate in which a front-side electrode pattern is formed on one surface of an insulating substrate and a back-side electrode is formed on another surface; semiconductor elements mounted on the surface of the front-side electrode pattern opposite the insulating substrate;and a sealing plastic member covering the semiconductor element and the semiconductor element substrate, wherein, at a position of the front-side electrode pattern where the position has a potential equivalent to that of the front-side electrode pattern at a position where a semiconductor element is bonded, an insulating terminal table formed with a conductive relay terminal and an insulating member insulating the relay terminal and the front-side electrode pattern from each other is provided, and wiring from the semiconductor element is led out to the outside via the relay terminal.

[0005] Furthermore, JP H10-294404 A discloses an IC package body constructed such that a silicon chip is mounted on a lead frame and electrically connected to the lead frame via a bonding wire. During manufacturing, the wire and the chip are also sealed with a primary sealing resin. Subsequently, the lead frame and the chip are sealed with a secondary sealing resin. A stress-relieving coating film is arranged between the primary and secondary sealing resins.

[0006] Furthermore, JP 2014-110249 A discloses a structure for embedding a semiconductor device, comprising: a semiconductor device having a semiconductor chip therein; a resin for embedding the semiconductor device; and a gas confining member that confines a gas and is deformable under an external force. The gas confining member is disposed between the semiconductor device and the resin. The semiconductor device may be plate-shaped, and the gas confining member may be disposed on at least one surface orthogonal to a thickness direction of the semiconductor device.

[0007] Finally, JP 2003-218251 A discloses an electronic device comprising a circuit element having a functional portion and electrodes on the bottom surface, and a housing having a cavity in which the circuit element is housed and which has electrode surfaces formed on the bottom surface. The electrodes of the circuit element and the electrode surfaces of the housing are connected by bumps, and a space between the circuit element and the cavity is sealed with a resin. A stepped portion is formed over the entire circumference of an inner wall of the cavity facing a side surface of the circuit element, so that a gap between the cavity and the side surface of the circuit element is larger on the bottom side than on the opening side.

[0008] An object of the invention is to provide an electronic device that can reduce a stress acting on an electronic component due to deformation of a sealing resin body while reducing an excessive temperature increase of the electronic component.

[0009] According to one aspect of the invention, an electronic device in which an electronic component mounted on a substrate is sealed with a sealing resin body includes a heat transfer portion and a stress relief portion. The heat transfer portion is sealed with the sealing resin body, is disposed between the electronic component and the sealing resin body in a state of contact with both the electronic component and the sealing resin body, is deformable according to the deformation of the sealing resin body, and has a higher thermal conductivity than the sealing resin body.The stress relief portion is sealed with the sealing resin body, is disposed between the heat transfer portion and the electronic component and / or the sealing resin body in a state of contact with the heat transfer portion, and relaxes a stress applied to the electronic component from the sealing resin body through the heat transfer portion with the deformation of the sealing resin body. The stress relief portion is compressed by a stress applied from the sealing resin body to the stress relief portion through the heat transfer portion to reduce a stress applied to the electronic component from the heat transfer portion.

[0010] According to the above aspect, the heat transfer portion, which has a higher thermal conductivity than the sealing resin body, is in contact with the electronic component. With the above configuration, even if heat is generated from the electronic component, since the heat is easily transferred to the heat transfer portion, the heat is less likely to remain in the electronic component. Thus, the electronic device can limit the temperature of the electronic component from becoming excessively high.

[0011] In addition, when the sealing resin body is deformed due to, for example, a temperature change, the heat transfer portion is also deformed according to the deformation of the sealing resin body. In this case, the stress-relieving portion is compressed according to the deformation of the heat transfer portion, so the electronic component is less likely to be deformed according to the deformation of the heat transfer portion. In other words, the deformation of the heat transfer portion is not transmitted to the electronic component and the stress-relieving portion to the same extent, and is less likely to be transmitted to the electronic component. Thus, stress on the electronic component is reduced.

[0012] As described above, the temperature of the electronic component can be prevented from becoming excessively high, and the stress acting on the electronic component due to the deformation of the sealing resin body can be reduced.

[0013] Additional objects and advantages of the invention will become more apparent from the following detailed description when taken in conjunction with the drawings.

[0014] They show: Fig. 1 is a plan view of an electronic device according to a first embodiment; Fig. 2 is a vertical cross-sectional view of the electronic device taken along a line II-II of Fig. 1; Fig. 3 an enlarged view of a stress relaxation section of Fig. 2; Fig. 4 is a vertical cross-sectional view of a periphery of a stress relief portion according to a second embodiment; Fig. 5 is a vertical cross-sectional view of a periphery of a stress relief portion according to a third embodiment; Fig. 6 is a vertical cross-sectional view of an electronic device according to a fourth embodiment; Fig. 7 is a vertical cross-sectional view of an electronic device according to a fifth embodiment; Fig. 8 is a vertical cross-sectional view of a periphery of a stress relief portion according to a sixth embodiment; Fig. 9 is a vertical cross-sectional view of an electronic device according to a seventh embodiment; Fig. 10 is a vertical cross-sectional view of a periphery of a stress relief portion according to an eighth embodiment; and Fig. 11 is a vertical cross-sectional view of an electronic device according to a ninth embodiment

[0015] Several embodiments will be described according to the drawings. In the several embodiments, functionally and / or structurally corresponding parts are denoted by the same reference numerals. Hereinafter, a board thickness direction of a printed circuit board is referred to as a Z direction, and a direction orthogonal to the Z direction is referred to as an X direction. A direction orthogonal to both the Z direction and the X direction is referred to as a Y direction. Unless otherwise specified, a shape along an XY plane defined by the X direction and the Y direction is a planar shape. (First embodiment)

[0016] An electronic device 10 which is in Fig. 1 and Fig. 2 includes an electronic component 20, a circuit board 30, a case body 40, and a sealing resin body 50. The electronic device 10 is mounted on a vehicle and is used, for example, as an in-vehicle electronic control device.

[0017] The electronic component 20 is formed of semiconductor components such as an IC chip and mounted on the circuit board 30. The electronic component 20 includes a component main body 22 including a semiconductor device 21 as a circuit element and lead frames 23 protruding from the component main body 22. The component main body 22 is formed in its entirety into a rectangular plate shape. The component main body 22 includes the semiconductor device 21 as the circuit element and a mold package covering the semiconductor device 21. An outer surface of the component main body 22 includes a first plate surface 22a, which is one of a pair of plate surfaces, a second plate surface 22b, which is the other plate surface, and a main body side surface 22c, which extends between the plate surfaces 22a and 22b.The lead frames 23 are electrically connected to the semiconductor device 21, for example, by bonding wires within the component main body 22. The lead frames 23 protrude from the main body side surface 22c of the component main body 22, and protruding portions of the lead frames 23 are fixed to the circuit board 30, for example, by solder. The electronic component 20 can also be referred to as a mounting member.

[0018] The printed circuit board 30 is a board made of metal material and formed in a rectangular plate shape. In the printed circuit board 30, one of the pair of board surfaces is a mounting surface 31, and the electronic component 20 is mounted on the mounting surface 31 such that the second board surface 22b faces the mounting surface 31.

[0019] The case body 40 is a flat rectangular box made of metal material and is a housing body that houses the electronic component 20 and the printed circuit board 30. The case body 40 includes a case bottom portion 41, a case wall portion 42 extending along a peripheral portion of the case bottom portion 41, and a rectangular case opening portion 43 provided at a position facing the case bottom portion 41. The case opening portion 43 is surrounded by the case wall portion 42. The printed circuit board 30 is installed within the case body 40 in a state where the mounting surface 31 faces the case opening portion 43. The case body 40 includes a case support portion 44 that supports the printed circuit board 30.The case support portion 44 protrudes from the case bottom portion 41 toward the case opening portion 43 and holds the circuit board 30 at a position separated from the case bottom portion 41.

[0020] In the electronic component 20, the circuit board 30, and the package body 40, the thickness direction is the Z direction, and one of a pair of sides adjacent to each other in a plan view extends in the X direction and the other extends in the Y direction.

[0021] The sealing resin body 50 is made of a resin material such as epoxy resin that has insulating properties. The sealing resin body 50 seals the electronic component 20 and the circuit board 30 in the case body 40 by solidifying a liquid molten resin that is filled into the case body 40. The sealing resin body 50 is a molded resin body formed by injecting a mold resin as a molten resin from the case opening portion 43 of the case body 40 by molding and then hardening the mold resin.

[0022] The sealing resin body 50 also penetrates into a space portion between the component main body 22 of the electronic component 20 and the circuit board 30 and covers the entire component main body 22. The sealing resin body 50 has a sealing surface 51 exposed to the outside from the case opening portion 43 of the case body 40. The sealing surface 51 faces the first plate surface 22a of the electronic component 20 and is provided at a position away from the electronic component 20 toward a side opposite the circuit board 30. The sealing surface 51 is included in an outer surface of the sealing resin body 50, and the remaining portion of the outer surface is housed in the case body 40.

[0023] In the electronic device 10, when the sealing resin body 50 is deformed, a stress caused by the deformation of the sealing resin body 50 is applied to the electronic component 20, and, for example, the semiconductor device 21 of the electronic component 20 may be damaged. In the electronic device 10, the sealing resin body 50 and the electronic component 20 have different linear expansion coefficients. Thus, when the sealing resin body 50 is deformed by changing a temperature of the sealing resin body 50 due to a change in the ambient temperature, a thermal stress is applied to the electronic component 20 due to a difference in the linear expansion coefficient between the resin body 50 and the electronic component 20.The deformation of the sealing resin body 50 caused by the temperature change includes a deformation when the molten resin forming the sealing resin body 50 cools and solidifies at the time of manufacturing the electronic device 10.

[0024] The electronic device 10 includes a heat transfer portion 60 to which heat generated from the electronic component 20 is likely to be transferred, and a stress relaxation portion 70 for relaxing a stress applied from the heat transfer portion 60 to the electronic component 20.

[0025] The heat transfer portion 60 is made of a heat-conducting material such as a resin material with thermal conductivity, and the heat transfer portion 60 has a higher thermal conductivity than the sealing resin body 50. The heat transfer portion 60 is formed of a flexible member with flexibility in the form of a gel, a liquid, or a cream, and the flexibility of the heat transfer portion 60 is higher than a flexibility of the sealing resin body 50. The heat transfer portion 60 is a member with low compressibility. Thus, when an external force is applied to the heat transfer portion 60, the heat transfer portion 60 is likely to be deformed, while a volume of the heat transfer portion 60 is less likely to be reduced. Furthermore, the heat transfer portion 60 is a member with adhesiveness and bonding strength.

[0026] The stress relief section 70 is a member with compressibility and flexibility. The stress relief section 70 has higher compressibility than the heat transfer section 60 and is more likely to be compressed than the heat transfer section 60. The stress relief section 70 includes a container 71 that is deformable by applying an external force, and a gas body 65 sealed in the container. The container 71 is formed of a flexible member with flexibility and is made of a synthetic resin material or a rubber material. The gas body 75 is, for example, air or gas. In the stress relief section 70, the container 71 ensures flexibility, and the gas body 75 ensures compressibility and flexibility.

[0027] The container 71 is formed from an annular member extending in a ring shape, such as a circular ring, and has a shape in which both ends of a tubular member, such as a pipe, are connected to each other to form an annular shape. The container 71 has an annular hollow portion 72, and the gas body 75 is sealed in the hollow portion 72. Vertical cross sections of the container 71 and the hollow portion 72 in a direction extending through the center line CL are rectangular, such as a square. The center line CL passes through the centers of the electronic component 20, the semiconductor device 21, the component main body 22, and the heat transfer portion 60.

[0028] As in Fig. 2 and Fig. As shown in Fig. 3, the container 71 includes an inner peripheral portion 71a forming an inner peripheral end surface of the container 71, an outer peripheral portion 71b forming an outer peripheral end surface, and a pair of connecting portions 71c and 71d connecting the inner peripheral portion 71a and the outer peripheral portion 71b. Since the inner peripheral portion 71a and the outer peripheral portion 71b extend parallel to the center line CL, and the connecting portions 71c and 71d extend in a direction orthogonal to the center line CL, a cross section of the container 71 is rectangular.

[0029] The heat transfer portion 60 and the stress relief portion 70 are sealed together with the electronic component 20 with the sealing resin body 50 in a state where they are provided on the first plate surface 22a of the electronic component 20 in the electronic device 10. In this case, the heat transfer portion 60 is in contact with the electronic component 20, the sealing resin body 50, and the stress relief portion 70, respectively, and the stress relief portion 70 is in contact with the electronic component 20, the sealing resin body 50, and the heat transfer portion 60, respectively.

[0030] The stress relief portion 70 is fixed to the first plate surface 22a of the electronic component 20, for example, by an adhesive, in a state where the center line CL extends in the Z direction, and extends along the peripheral portion of the first plate surface 22a. In the stress relief portion 70, the first connecting portion 71c of the pair of connecting portions 71c and 71d faces the sealing surface 51, and the second connecting portion 71d is fixed to the first plate surface 22a, for example, by an adhesive. The inner peripheral portion 21a of the container 71 is located outside the semiconductor device 21 in a direction orthogonal to the center line CL.

[0031] The heat transfer portion 60 is provided on the opposite side of the circuit board 30 in the Z direction, across or along the electronic component 20. Specifically, the heat transfer portion 60 is provided in a region surrounded by the inner peripheral portion 71a of the stress relief portion 70, and in the Z direction between the electronic component 20 and the sealing resin body 50. In this region, the heat transfer portion 60 is in close contact with both the first board surface 22a of the electronic component 20 and the inner peripheral portion 71a of the stress relief portion 70. The stress relief portion 70 surrounds a periphery of the heat transfer portion 60 and is provided on the first board surface 22a side by side with the heat transfer portion 60 in the direction orthogonal to the Z direction.The first plate surface 22a is the outermost surface of the outer surface of the electronic component 20, which is a surface closest to the outer surface of the sealing resin body 50. A separation distance between the first plate surface 22a and the sealing surface 51 in the Z direction is smaller than both a separation distance between the second plate surface 22b and the case bottom portion 41 of the case body 40 in the Z direction and a separation distance between the main body side surface 22c and the case wall portion 42 of the case body 40 in the direction orthogonal to the Z direction.

[0032] The dissipation of heat in the electronic device 10 is described. When heat H, which is Fig. 2, generated from the electronic component 20, the heat H is more likely to be transferred to the heat transfer portion 60 than to the sealing resin body 50. The heat H transferred to the heat transfer portion 60 passes through a portion between the heat transfer portion 60 and the sealing surface 51 in the sealing resin body 50 and is discharged to the outside from the sealing surface 51. In this case, since a thickness of a portion of the sealing resin body 50 between the electronic component 20 and the sealing surface 51 is reduced by a thickness of the heat transfer portion 60, the heat H is likely to be dissipated from the sealing surface 51 of the sealing resin body 50.

[0033] Next, stress relaxation in the electronic device 10 will be described. When the sealing resin body 50 is deformed, the heat transfer portion 60 is also deformed according to a deformation mode of the sealing resin body 50. Specifically, as shown by a two-dot chain line in Fig. 3, when the sealing resin body 50 is deformed into a shape that squeezes the heat transfer portion 60, the deformation is transmitted from the sealing resin body 50 to the heat transfer portion 60. Although the deformation is distributed among the electronic component 20 and the stress relief portion 70, since the strength of the stress relief portion 70 is significantly lower than the strength of the electronic component 20, most of the deformation is transmitted to the stress relief portion 70 and is not transmitted to the electronic component 20. Thus, the stress on the electronic component 20 is reduced.

[0034] When the sealing resin body 50 is deformed into a shape that squeezes the heat transfer portion 60, a thermal stress is applied to the stress-relieving portion 70 according to the deformation of the heat transfer portion 60, and the gas body 75 of the stress-relieving portion 70 is compressed by the thermal stress. In this case, since the thermal stress applied from the sealing resin body 50 to the heat transfer portion 60 is used to compress the gas body 75 of the stress-relieving portion 70, the thermal stress to be applied from the heat transfer portion 60 to the electronic component 20 is reduced. In the stress-relieving portion 70, since a volume of the gas body 75 is reduced by compressing the gas body 75, a volume of the stress-relieving portion 70 is reduced.

[0035] A method for manufacturing the electronic device 10 will be described. Processing for manufacturing the electronic device 10 includes a first processing for installing the circuit board 30 on the housing body 40, a second processing for mounting the electronic component 20 on the circuit board 30, and a third processing for installing the heat transfer portion 60 and the stress relief portion 70 on the electronic component. The first to third processing can be performed in any order.

[0036] In the third processing, processing for attaching the stress relief portion 70 to the first plate surface 22a of the electronic component 20 is performed, and then processing for installing the heat transfer portion 60 inside the stress relief portion 70 is performed. In this case, the shape of the heat transfer portion 60 can be maintained by the stress relief portion 70 and the electronic component 20, even if the heat transfer portion 60 is flexible enough to not retain its own shape.

[0037] After completing the first to third processing, a fourth processing is performed to provide the sealing resin body 50 inside the case body 40. In the fourth processing, the molten resin is injected into the case body 40 through the case opening portion 43 by molding, and the molten resin is cured to form the sealing resin body 50, thereby sealing the electronic component 20 and the like.

[0038] According to the above-described embodiment, the heat transfer portion 60 is in contact with the electronic component 20 in the electronic device 10. In the above configuration, since the heat generated by the electronic component 20 is transferred to the heat transfer portion 60, the heat is less likely to remain in the electronic component 20. Accordingly, the heat transfer portion 60 can prevent or limit the temperature of the electronic component 20 from becoming excessively high.

[0039] Furthermore, the stress relief portion 70 is in contact with the heat transfer portion 60. In this configuration, if the volume of the heat transfer portion 60 is not reduced, but only the volume of the stress relief portion 70 is reduced, the thermal stress exerted by the heat transfer portion 60 on the electronic component 20 is reduced. Thus, there is no need to provide the heat transfer portion 60 with a function of easy compressibility. As described above, since the degree of freedom in selecting a material used to manufacture the heat transfer portion 60 can be increased, the thermal conductivity of the heat transfer portion 60 can be increased. Accordingly, the heat transfer portion 60 can further reliably restrict the temperature of the electronic component 20 from becoming excessively high.

[0040] As described above, in the electronic device 10, while restraining the temperature of the electronic component 20 from becoming excessively high, the stress acting on the electronic component 20 due to the deformation of the sealing resin body 50 can be reduced.

[0041] According to the present embodiment, the stress relief portion 70 is in contact with the electronic component 20 in addition to the heat transfer portion 60. In the above configuration, a positional deviation of the heat transfer portion 60 from the electronic component 20 can be regulated by the stress relief portion 70. In this case, since the separation of the heat transfer portion 60 from the electronic component 20 is regulated, the configuration in which the excessive temperature rise of the electronic component 20 is reduced by the heat transfer portion 60 can be more reliably maintained.

[0042] According to the present embodiment, the stress relief portion 70 surrounds the periphery of the heat transfer portion 60 on the first plate surface 22a of the electronic component. In the above configuration, since the position and shape of the stress relief portion 70 can be maintained by the heat transfer portion 60, even if the heat transfer portion 60 is formed of a member with high flexibility to the extent that it is impossible to maintain its own shape due to its own weight, the heat transfer portion 60 can be set to a position and shape with the highest heat dissipation efficiency from the electronic component 20. Consequently, the heat radiation performance by the heat transfer portion 60 can be improved.

[0043] According to the present embodiment, the heat transfer portion 60 is in contact with the first plate surface 22a of the outer surface of the electronic component 20, which is closest to the outer surface of the sealing resin body 50. In the above configuration, when the heat transferred from the electronic component 20 to the heat transfer portion 60 is dissipated to the outside, the heat of the heat transfer portion 60 is likely to be dissipated to the outside even if the heat transfer portion 60 is sealed by the sealing resin body 50, because the heat passes through the thinnest portion of the sealing resin body 50. Thus, the heat can be restricted from remaining in the heat transfer portion 60.

[0044] In addition, since the portion of the outer surface of the sealing resin body 50 closest to the electronic component 20 is the sealing surface 51, the heat transferred from the heat transfer portion 60 to the sealing surface 51 is directly dissipated to the outside without passing through the case body 40. Accordingly, the case body 40 can be restricted from hindering the dissipation of heat from the heat transfer portion 60 and the sealing resin body 50.

[0045] According to the present embodiment, the heat transfer portion 60 and the stress relief portion 70 are provided side by side on the first plate surface 22a. With the above configuration, the heat dissipated from the heat transfer portion 60 to the outside does not need to pass through the stress relief portion 70 in the sealing resin body 50. Thus, the stress relief portion 70 can be prevented from hindering the dissipation of heat from the heat transfer portion 60 to the outside.

[0046] According to the present embodiment, the stress relief portion 70 is in contact with the electronic component 20 in addition to the heat transfer portion 60. In the above configuration, since the stress relief portion 70 is directly deformed according to the deformation of the sealing resin body 50, the thermal stress applied from the stress relief portion 70 to the electronic component 20 can be reduced.

[0047] In this case, since the thermal stress generated by the deformation of the sealing resin body 50 is dispersed in the heat transfer portion 60 and the stress relief portion 70, the thermal stress applied from the sealing resin body 50 to the heat transfer portion 60 can be reduced. Here, even in the configuration in which the thermal stress applied from the heat transfer portion 60 to the electronic component 20 can be reduced by reducing the volume of the stress relief portion 70, it is assumed that a certain degree of thermal stress is applied from the heat transfer portion 60 to the electronic component 20.Thus, in the above-described configuration in which the thermal stress applied from the heat transfer portion 60 to the electronic component 20 can be reduced by reducing the volume of the stress relaxation portion 70, reduction of the thermal stress applied from the sealing resin body 50 to the heat transfer portion 60 is effective.

[0048] According to the present embodiment, since the stress-relieving portion 70 includes the gas body 75, a configuration in which the stress-relieving portion 70 is compressed by the thermal stress from the heat transfer portion 60 can be realized by compressing the gas body 75. Furthermore, since the gas body 75 is sealed in the container 71 in the stress-relieving portion, the container 71 can perform a function of preventing the gas body 75 from leaking from the sealing resin body 50 when the electronic device 10 is manufactured. In this case, since the positional relationship and shape of the electronic component 20 and the heat transfer portion 60 are less likely to be restricted, the degree of freedom in designing the electronic component 20 and the heat transfer portion 60 can be improved.

[0049] According to the present embodiment, the sealing resin body 50 is a molded resin body in which the electronic component 20 is sealed in a filled state in the case body 40. In the above configuration, there is no need to supply the molten resin forming the sealing resin body 50 into the case body 40 at high pressure. In this case, the shape and position of the heat transfer portion 60 are less likely to change depending on the pressure of the molten resin. Thus, since the shape and position of the heat transfer portion 60 are less likely to change, a configuration in which heat is likely to be transferred from the electronic component 20 to the heat transfer portion 60 can be maintained. In this case, the stress relief portion 70 is less likely to be compressed by the pressure of the molten resin.Thus, a case can be limited in which the gas body 75 of the stress relaxation portion 70 has been compressed and the stress relaxation function of the stress relaxation portion 70 has already been reduced at the time of filling the case body 40 with the molten resin during the manufacture of the electronic device 10. (Second embodiment)

[0050] In the first embodiment, the inner peripheral portion 71a of the stress relief portion 70 extends parallel to the center line CL, but in the second embodiment, the inner peripheral portion 71a is inclined with respect to the center line CL. In the present embodiment, differences from the first embodiment will be mainly described.

[0051] As in Fig. As shown in Fig. 4, an inner peripheral portion 71a of a stress relaxation portion 70 is inclined with respect to an outer peripheral portion 71b by being inclined with respect to the center line CL, and is further inclined with respect to connecting portions 71c and 71d. An inclination angle θ of the inner peripheral portion 71a with respect to the second connecting portion 71b is an acute angle that is greater than 0 degrees and less than 90 degrees. In the present embodiment, the inclination angle θ is specifically set to an angle included in a range of 45 degrees or more and 90 degrees or less. For example, the inclination angle θ is set to 45 degrees. In the present embodiment, a range of the inclination angle θ greater than 0 degrees and less than 90 degrees is represented as 0 to 90 degrees, and a range of 45 degrees or more and less than 90 degrees is represented as 45 to 90 degrees.

[0052] When the heat generated in the electronic component 20 is transferred from the first plate surface 22a of the electronic component 20 to the sealing surface 51, the heat spreads more easily in a direction orthogonal to the center line CL toward a position farther away from the electronic component 20. In this case, in the range of 0 to 90 degrees, as the inclination angle θ is larger, the transfer of heat from the first plate surface 22a to the sealing surface 51 through the heat transfer portion 60 is likely to be blocked by the inner peripheral portion 71 of the stress relief portion 70, and the volume of the heat transfer portion 60 is further reduced.In other words, as the inclination angle θ is smaller, the heat transfer from the first plate surface 22a to the sealing surface 51 is less likely to be blocked by the inner peripheral portion 71a of the stress relief portion 70, and the volume of the heat transfer portion 60 is increased. In other words, as the inclination angle θ is smaller, the heat dissipation efficiency from the first plate surface 22a to the sealing surface 51 can be improved, and as the inclination angle θ is larger, the material requirement of the heat transfer portion 60 can be reduced further. Therefore, in the configuration where the inclination angle θ is set to approximately 45 degrees, the improvement in the heat dissipation efficiency from the first plate surface 22a to the sealing surface 51 and the reduction in the material requirement of the heat transfer portion 60 can be achieved simultaneously. (Third embodiment)

[0053] In a third embodiment, a virtual extension line L1 obtained by extending the inner peripheral end surface of the stress relaxation portion 70 in the second embodiment in a radial direction of the inner peripheral portion 71a passes the semiconductor device 21 of an electronic component 20. In the present embodiment, differences from the second embodiment will be mainly described.

[0054] As in Fig. As shown in Figure 5, the semiconductor device 21 includes a first element surface 21a facing a first plate surface 22a of the electronic component 20, a second element surface 21b facing a second plate surface 22b of the electronic component 20, and an element-side surface 21c extending between the element surfaces 21a and 21b. When the electronic component 20 operates, heat is likely to be generated particularly from the semiconductor device 21.

[0055] The extension line L1 of the inner peripheral end surface of the stress relief portion 70 intersects a peripheral portion of the first element surface 21a of an outer surface of the semiconductor device 21. The peripheral portion of the first element surface 21a is included in a corner portion, which is an intersection portion of the first element surface 21a and the element side surface 21c. Similar to the heat dissipated from the first plate surface 22a of the electronic component 20, the heat dissipated from the first element surface 21a of the semiconductor device 21 is likely to spread in a direction orthogonal to the center line CL toward a position farther away from the semiconductor device 21.

[0056] Unlike the present embodiment, a configuration is adopted in which an inner diameter of the inner peripheral portion 71a of the heat transfer portion 60 is small and the extension line L1 crosses a portion of the outer surface of the semiconductor device 21 that is inside the peripheral portion of the first element surface 21a. In the above configuration, heat dissipated from the portion of the first element surface 21a outside the extension line L1 is likely to be restricted from reaching the sealing surface 51 by the second connecting portion 71d of the heat transfer portion 70, and a volume of the heat transfer portion 60 becomes relatively small.

[0057] On the other hand, unlike the present embodiment, a configuration is adopted in which the extension line L1 intersects the element-side surface 21c of the outer surface of the semiconductor device 21, or a configuration in which the extension line L1 passes outside the semiconductor device 21 to the extent that the extension line L1 does not intersect the semiconductor device 21, because the inner diameter of the inner peripheral portion 71a in the heat transfer portion 60 is large. In these configurations, the heat dissipated from the first element surface 21a is less likely to reach the sealing surface 51 through the second connecting portion 71d of the heat transfer portion 60, and the volume of the heat transfer portion 60 becomes relatively large.

[0058] Therefore, in the configuration where the extension line L1 crosses the peripheral portion of the first element surface 21a of the outer surface of the semiconductor device 21, the improvement of the heat dissipation efficiency from the first element surface 21a to the sealing surface 51 and the reduction of the material cost of the heat transfer portion 60 can be achieved simultaneously. (Fourth embodiment)

[0059] In the first embodiment, the stress relief portion 70 is in contact with both the electronic component 20 and the heat transfer portion 60, but in a fourth embodiment, a stress relief portion 70 is provided at a position separated from an electronic component 20. In the present embodiment, differences from the first embodiment will be mainly described.

[0060] As in Fig. As shown in Fig. 6, the stress relief portion 70 is provided in a Z direction on a side opposite to the electronic component 20 above or along a heat transfer portion 60. The stress relief portion 70 is in contact with a surface of the heat transfer portion 60 near a sealing surface 51 and extends along the surface of the heat transfer portion 60. A thickness of a portion of the sealing resin body 50 covering the stress relief portion 70 is sufficiently large to protect the stress relief portion 70. In the stress relief portion 70, vertical cross sections of a container 71 and a hollow portion 72 are circular.

[0061] A method for manufacturing an electronic device 10 according to the present embodiment will be briefly described. In a third process for manufacturing the electronic device 10, the heat transfer portion 60 is provided on a first plate surface 22a of the electronic component 20, and then the stress relief portion 70 is disposed on the heat transfer portion 60. The heat transfer portion 60 can maintain its own shape against its own weight and can maintain its own shape even when the stress relief portion 70 is disposed on the heat transfer portion 60, while the heat transfer portion 60 has flexibility to the extent that deformation according to thermal stress can be performed by the sealing resin body 50.

[0062] According to the present embodiment, the stress relief portion 70 is in contact with the heat transfer portion 60 even though the stress relief portion 70 is not in contact with the electronic component 20. Thus, when the heat transfer portion 60 is deformed according to the deformation of the sealing resin body 50, the stress relief portion 70 is compressed according to the deformation of the heat transfer portion 60 as in the first embodiment, so that the thermal stress exerted by the heat transfer portion 60 on the electronic component 20 can be reduced. (Fifth embodiment)

[0063] In the first embodiment, the gas body 75 included in the stress relief section 70 is sealed in the container 71, but in a fifth embodiment, a gas body sealed between an electronic component 20 and a heat transfer section 60 functions as a stress relief section. In the present embodiment, differences from the first embodiment will be mainly described.

[0064] As in Fig. As shown in Fig. 7, the electronic component 20 has a recessed portion 25 defined by concaving a first plate surface 22a serving as an outer surface of a component main body 22. The recessed portion 25 extends along a peripheral portion of the first plate surface 22a in a notch shape. An inner surface of the recessed portion 25 includes a bottom surface 25a facing an opening of the recessed portion 25 and a pair of wall surfaces 25b protruding from the bottom surface 25a. The bottom surface 25a is provided at a position separated from the first plate surface 22a toward the second plate surface 22b and orthogonal to a center line CL. The wall surfaces 25b extend between the first plate surface 22a and the bottom surface 25a in parallel to the center line CL.A width dimension of the trench-shaped recess portion 25 is uniform in the Z direction. In the component main body 22, intersections between the first plate surface 22a and the wall surfaces 25b form external corner portions, and intersections between the wall surfaces 25b and the bottom surface 25a form internal corner portions.

[0065] The recessed portion 25 is included in a portion of the first plate surface 22a facing the heat transfer portion 60, and an opening facing the sealing surface 51 in the recessed portion 25 is closed by the heat transfer portion 60. The heat transfer portion 60 can maintain its shape so as not to enter the recessed portion 25 by its own weight and has flexibility capable of being deformed according to thermal stress from the sealing resin body 50. A gas body 80 similar to the gas body 75 of the first embodiment, such as air or gas with compressibility, is sealed in the recessed portion 25, and the gas body 80 corresponds to a stress relaxation portion.In a state where the heat transfer portion 60 closes the recess portion 25, an internal space of the recess portion 25 is a hermetically sealed space, and the gas body 80 is not discharged to the outside from the internal space of the recess portion 25.

[0066] In the present embodiment, when the heat transfer portion 60 is deformed to enter the recessed portion 25 according to the deformation of the sealing resin body 50, the gas body 80 is compressed in the recessed portion 25. In this case, as in the case of the gas body 75 of the first embodiment, the volume of the gas body 80 is reduced, whereby the thermal stress exerted by the heat transfer portion 60 on the electronic component 20 can be reduced.

[0067] According to the present embodiment, since the gas body 80 is sealed between the electronic component 20 and the heat transfer portion 60, there is no need to use a dedicated member such as the container 71 for sealing the gas body 80. Thus, the number of components configuring the electronic device 10 can be reduced. Furthermore, since the recessed portion 25 for sealing the gas body 80 is provided in the component main body 22 of the electronic component 20, the gas body 80 can be restricted from deviating positionally with respect to the heat transfer portion 60 and the electronic component 20 due to, for example, injection of molten resin into the case body 40 at the time of manufacturing the electronic device 10.Accordingly, a configuration in which the thermal stress applied from the heat transfer portion 60 to the electronic component 20 can be reliably realized in the electronic device 10 by the compression of the gas body 80. (Sixth Embodiment)

[0068] In the fifth embodiment, a width dimension of the groove-shaped recess portion 25 in the Z direction is uniform, but in a sixth embodiment, a width dimension of a groove-shaped recess portion 25 progressively increases toward a first plate surface 22a in a Z direction. In the present embodiment, differences from the fifth embodiment will be mainly described.

[0069] As in Fig. 8, since a bottom surface and wall surfaces of an inner surface of the recessed portion 25 are curved, the width dimension of the recessed portion 25 continuously increases toward the first plate surface 22a. According to Fig. 7 of the fifth embodiment, in a component main body 22, external corner portions of the first plate surface 22a and the wall surfaces 25b are not provided, and internal corner portions of the wall surfaces 25b and the bottom surface 25b are not provided. In other words, the external corner portions and the internal corner portions are chamfered.

[0070] A molded package of the component main body 22 is a molded body formed by injecting molten resin from, for example, an injection molding machine into a molding device such as a mold. A protrusion portion for molding the recessed portion 25 is provided on an inner surface of the molding device, and the protrusion portion narrows toward a tip of the molding device. The tapered shape of the protrusion portion facilitates removal of the molding device from the cured molten resin. Specifically, the outer surface of the protrusion portion of the molding device is easily detached from the inner surface of the recessed portion 25 of the component main body 22. Consequently, breakage or deformation of the recessed portion 25 when the molding device is removed from the component main body 22 can be prevented. (Seventh Embodiment)

[0071] In a seventh embodiment, an electronic device 10 includes a heat dissipation portion 90 such as a heat sink that dissipates heat from a heat transfer portion 60 to the outside. In this embodiment, differences from the first embodiment will be mainly described.

[0072] As in Fig. 9, a part of the heat dissipation portion 90 is exposed to the outside of the electronic device 10 and is in contact with the heat transfer portion 60. The heat dissipation portion 90 is made of a metal material having thermal conductivity such as copper or aluminum, and the thermal conductivity of the heat dissipation portion 90 is higher than the thermal conductivity of the sealing resin body 50. Similar to the sealing resin body 50, the heat dissipation portion 90 has sufficient strength to protect the heat transfer portion 60 and the stress relief portion 70.

[0073] The heat dissipation portion 90 includes a base portion 91 attached to the heat transfer portion 60, and protrusion portions 92 extending from the base portion 61 and protruding from the sealing resin body 50. The base portion 91 is a plate-shaped portion extending in a direction perpendicular to a center line CL and overlapping with the heat transfer portion 60 and the stress relief portion 70 from a case opening portion 43, so that the heat transfer portion 60 and the stress relief portion 70 are sandwiched between the base portion 91 and the electronic component 20. The protrusion portions 92 are fin-shaped portions extending from the base portion 91 toward the case opening portion 43, and at least tip portions of the protrusion portions 92 are exposed to the outside.

[0074] The heat dissipation portion 90 is arranged to extend across the center line CL across opposing portions facing each other in the stress relief portion 70. In the container 71 of the stress relief portion 70, the heat dissipation portion 90 is mounted on the first connecting portion 71c, and at least the inner peripheral portion 71a of the inner peripheral portion 71a and the outer peripheral portion 71b is disposed between the heat dissipation portion 90 and the component main body 22. In the stress relief portion 70, at least a part of the gas body 75 is also disposed between the heat dissipation portion 90 and the component main body 22.

[0075] Also, in the present embodiment, the heat transfer portion 60 is in contact with the sealing resin body 50. For example, the heat dissipation portion 90 does not cover the entire heat transfer portion 60 starting from the case opening portion 43, and a portion of the heat transfer portion 60 not covered with the heat dissipation portion 90 is in contact with the sealing resin body 50. Thus, similar to the first embodiment, the heat transfer portion 60 deforms with the deformation of the sealing resin body 50, and the stress relief portion 70 is compressed, so that the thermal stress applied from the heat transfer portion 60 to the electronic component 20 is reduced with the decrease in the volume of the stress relief portion 70.When the heat dissipation portion 90 is in contact with both the heat transfer portion 60 and the sealing resin body 50, the heat transfer portion 60 and the sealing resin body 50 do not necessarily need to be in contact with each other. Also, in the above configuration, when the heat transfer portion 60 is deformed, for example, due to the displacement of the heat dissipation portion 90 when the sealing resin body 50 is deformed, the heat transfer portion 60 may compress the stress relief portion 70.

[0076] A method for manufacturing the electronic device 10 according to the present embodiment will be briefly described. In manufacturing the electronic device 10, in the third processing, after the heat transfer portion 60 and the stress relief portion 70 are installed, the heat dissipation portion 90 is disposed on the heat transfer portion 60 and the stress relief portion 70. In this case, in the stress relief portion 70, the inner peripheral portion 71a and the outer peripheral portion 71b extend parallel to the center line CL, so that the stress relief portion 70 is less likely to collapse in the Z direction due to a load from the heat dissipation portion 90 and the gas body 75 is less likely to be compressed.Thus, a state in which the gas body 75 of the stress relaxation portion 70 has been compressed and the stress relaxation function of the stress relaxation portion 70 has already been reduced at the time of mounting the heat dissipation portion 90 on the stress relaxation portion 70 can be restricted.

[0077] Furthermore, in this case, since the stress relief portion 70 is unlikely to collapse in the Z direction and the heat dissipation portion 90 is less likely to shift in a direction close to the electronic component 20, a state in which the entire heat dissipation portion 90 is buried in the sealing resin body 50 can be restricted or prevented.

[0078] According to the present embodiment, since the heat dissipation portion 90 exposed from the sealing resin body 50 has a higher thermal conductivity than the sealing resin body 50, the heat transferred from the electronic component 20 at the heat transfer portion 60 is likely to be dissipated to the outside through the heat dissipation portion 90. Therefore, the heat dissipation portion 90 can further reliably restrict the temperature of the electronic component 20 from becoming excessively high. (Eighth Embodiment)

[0079] In an eighth embodiment, the container 71 of the stress relief portion 70 of the seventh embodiment has an entry portion 77 inserted between the heat dissipation portion 90 and the component main body 22. In the present embodiment, differences from the seventh embodiment will be mainly described.

[0080] As in Fig. As shown in Fig. 10, the entrance portion 77 extends from an inner peripheral portion 71a toward a center line CL. Like the inner peripheral portion 71a and an outer peripheral portion 71b, the entrance portion 77 is annularly formed by forming a circle around the center line CL. In a Z direction, a thickness dimension of the entrance portion 77 is the same as a thickness dimension of the heat transfer portion 60, and a base portion 91 of the heat dissipation portion 90 is in contact with both the entrance portion 77 and the heat transfer portion 60. A hollow portion 72 is not provided inside the entrance portion 77. Thus, the gas body 75 is not enclosed inside the entrance portion 77.

[0081] The heat dissipation portion 90 enters an inner region surrounded by the inner peripheral portion 71a of the stress relief portion 70. In this case, the inner peripheral portion 71a restricts the heat dissipation portion 90 from being displaced in a direction orthogonal to the center line CL.

[0082] According to the present embodiment, when the heat transfer portion 60 is deformed according to the deformation of the sealing resin body 50, the heat transfer portion 60 pushes the entrance portion 77 toward the opposite side with respect to the center line CL, so that the entrance portion 77 enters the interior of the hollow portion 72 and the gas body 75 is compressed. As described above, also in the present embodiment, since the gas body 75 is compressed by the deformation of the heat transfer portion 60 caused by the deformation of the sealing resin body 50, the thermal stress exerted by the heat transfer portion 60 on the electronic component 20 can be reduced by the stress relaxation portion 70. (Ninth Embodiment)

[0083] In the first embodiment, the mounting surface 31 of the circuit board 30 faces the case opening portion 43 in the case body 40, but in a ninth embodiment, a mounting surface 31 of a circuit board 30 faces a case bottom portion 41. In the present embodiment, differences from the first embodiment will be mainly described.

[0084] As in Fig.As shown in Figure 11, an electronic component 20 is provided between the circuit board 30 and the housing bottom portion 41. The heat transfer portion 60 and the stress relief portion 70 are provided between the electronic component 20 and the housing bottom portion 41 and are arranged at positions separated from the housing bottom portion 41 toward the housing opening portion 43. A sealing resin body 50 is located between the heat transfer portion 60, the stress relief portion 70, and the housing bottom portion 41.

[0085] Also, in the present embodiment, a first plate surface 22a of the component main body 22 is the outermost surface. In this case, in the Z direction, a separation distance between the first plate surface 22a and the case bottom portion 41 is set to be smaller than a separation distance between the second plate surface 22b and the sealing surface 51. The case body 40 is made of a metal material having thermal conductivity, and the thermal conductivity of the case body 40 is set to be higher than the thermal conductivity of the sealing resin body 50. Heat H generated in the electronic component 20 and transferred to the heat transfer portion 60 reaches the case bottom portion 41 through a portion between the heat transfer portion 60 and the case bottom portion 41 in the sealing resin body 50 and is dissipated to the outside of the case bottom portion 41.

[0086] In the present embodiment, the heat transfer portion 60 and / or the stress relief portion 70 may be in contact with the case bottom portion 41 as long as the heat transfer portion 60 and the sealing resin body 50 are in contact with each other. In particular, in the configuration where the heat transfer portion 60 is in contact with the case bottom portion 41, since the heat from the heat transfer portion 60 is directly transferred to the case bottom portion 41, the heat dissipation efficiency from the heat transfer portion 60 can be improved. (Other embodiments)

[0087] Although several embodiments of the invention have been described above, the invention should not be limited to the embodiments described above and can be applied to different embodiments and combinations within a scope of application that lies within the spirit of the invention.

[0088] As Modification 1, a portion of the outer surface of the electronic component 20 that is in contact with the heat transfer portion 60 does not need to be the first plate surface 22a. For example, the heat transfer portion 60 is in contact with the second plate surface 22b and the main body side surface 22c of the electronic component 20. In short, if the heat transfer portion 60 is in contact with both the electronic component 20 and the sealing resin body 50 inside the sealing resin body 50, the heat of the electronic component 20 can be dissipated to the heat transfer portion 60.

[0089] As Modification 2, the heat transfer portion 60 and the stress relief portion 70 may be in contact with different surfaces of the outer surface of the electronic component 20. For example, in the electronic component 20, the heat transfer portion 60 is in contact with the first plate surface 22a, and the stress relief portion 70 is in contact with the main body side surface 22c. In the above configuration, the heat transfer portion 60 is overlapped with the entire first plate surface 22a, and the stress relief portion 70 is attached to the main body side surface 22c in a state of extending along the respective peripheral portions of the heat transfer portion 60 and the first plate surface 22a.Thus, in the third processing for manufacturing the electronic device 10, the shape of the heat transfer portion 60 disposed on the first plate surface 22a can be held by the stress relaxation portion 70.

[0090] As Modification 3, if the heat transfer portion 60 and the stress relief portion 70 are in contact with each other, the heat transfer portion 60 does not need to be provided on the inner peripheral side of the annular stress relief portion 70. For example, in a plan view, the heat transfer portion 60 and the stress relief portion 70 are both formed in a rectangular shape, and the heat transfer portion 60 and the stress relief portion 70 are provided side by side on the first plate surface 22a. In addition, the heat transfer portion 60 is formed in an annular shape, and the stress relief portion 70 is provided on the inner peripheral side of the heat transfer portion 60.

[0091] As Modification 4, the container 71 of the stress relief portion 70 may be formed of a permeable body such as a sponge instead of being formed of a tubular member. With this configuration, the gas body 75 is contained within the permeable body. In the fifth and sixth embodiments, the recessed portion 75 of the electronic component 20 may be covered with a cover member such as an expandable film member. In the above configuration, the heat transfer portion 60 is in contact with the gas body 80 through the cover member in the recessed portion 25, and the heat transfer portion 60, to which the thermal stress is applied from the sealing resin body 50, can compress the gas body 80 together with the cover member.

[0092] As Modification 5, the stress relief portion 70 does not need to be annular. For example, in the first embodiment, the container 71 may have a flat shape extending along the first plate surface 22a. In the fifth and sixth embodiments, the recessed portion 25 provided on the first plate surface 22a may have a rectangular shape in a plan view.

[0093] As Modification 6, a plurality of stress relief portions 70 may be provided. For example, in the first embodiment, each of a plurality of containers 71 is provided in contact with the heat transfer portion 60. In the fifth and sixth embodiments, the recessed portions 25 are provided at positions spaced from each other in the first plate surface 22a. In the above configuration, the gas body 80 provided in each of the recessed portions 25 can be in a compressible state by the heat transfer portion 60. Further, in the seventh and eighth embodiments, the plurality of containers 71 are provided in a separated state from each other, and the heat transfer portion 60 and the sealing resin body 50 provided between the heat dissipation portion 90 and the component main body 22 are in contact with each other through the separation portion between the containers 71.

[0094] As Modification 7, the sealing resin body 50 does not have to be a cast resin body formed by casting, but may be a molded resin body formed using a molding device such as a mold.

Claims

[1] An electronic device in which an electronic component (20) mounted on a substrate (30) is sealed with a sealing resin body (50), the electronic device comprising: a heat transfer section (60) sealed with the sealing resin body, disposed between the electronic component and the sealing resin body in a state in which it is in contact with both the electronic component and the sealing resin body, deformable according to the deformation of the sealing resin body, and having a higher thermal conductivity than the sealing resin body; and a stress relaxation portion (70, 80) sealed with the sealing resin body, disposed between the heat transfer portion and the electronic component and / or the sealing resin body in a state in which it is in contact with the heat transfer portion, and relaxes a stress exerted on the electronic component from the sealing resin body through the heat transfer portion with the deformation of the sealing resin body, wherein the stress relief portion is compressed by a stress applied from the sealing resin body to the stress relief portion through the heat transfer portion to reduce a stress applied to the electronic component from the heat transfer portion. [2] The electronic device according to claim 1, wherein the stress relief portion is in contact with the electronic component in addition to the heat transfer portion. [3] The electronic device according to claim 2, wherein the stress relief portion is in contact with an outer surface (22a) of the electronic component and extends along the outer surface to surround the heat transfer portion. [4] The electronic device according to any one of claims 1 to 3, wherein the heat transfer portion is in contact with a nearest surface (22a) closest to an outer surface (51) of the sealing resin body of outer surfaces (22a, 22b, 22c) of the electronic component. [5] The electronic device according to claim 4, wherein the stress relaxation portion and the heat transfer portion are provided side by side on the nearest surface. [6] The electronic device according to any one of claims 1 to 5, further comprising a heat dissipation portion (90) having a higher thermal conductivity than the sealing resin body, being in contact with the heat transfer portion within the sealing resin body, and at least partially protruding to an outside of the sealing resin body for dissipating heat of the heat transfer portion. [7] The electronic device according to claim 6, wherein at least a part of the stress relief portion is provided between the electronic component and the heat dissipation portion. [8] The electronic device according to any one of claims 1 to 7, wherein the stress relief portion is in contact with the sealing resin body in addition to the heat transfer portion. [9] The electronic device according to any one of claims 1 to 8, wherein the stress relaxation portion includes a container (71) provided to be deformable by applying an external force, and a gas body (75) sealed within the container. [10] Electronic device according to one of claims 1 to 7, wherein the electronic component has a recessed portion (25) which is recessed from an outer surface (22a) of the electronic component, and the stress relief section is a gas body (80) sealed within the recessed section.

Images