INDUCTIVE ANGLE AND / OR POSITION SENSOR

Abstract

Inductive angle and / or position sensor (100), comprising: a first sensor component (110) and a second sensor component (120) that is movable relative to it, wherein the first sensor component (110) comprises an excitation coil (111) and a receiving coil arrangement (112) with two or more individual receiving coils (112A, 112B), and wherein the second sensor component (120) comprises an inductive target (121), wherein the excitation coil (111) can be excited with an alternating current (I1) to induce an induced current in the inductive target (121), and wherein the inductive target (121) is configured to generate a magnetic field in response to the induced current, which in turn generates an induction signal (S1) in the receiving coil arrangement (112), wherein the first sensor component (110) comprises a semiconductor chip (113) with an integrated circuit configured to determine a position of the second sensor component (120) relative to the first sensor component (110) based on the induction signal (S1), and a chip package (130) in which the semiconductor chip (113) is arranged, wherein the individual receiving coils (112A, 112B) of the receiving coil arrangement (112) are designed in at least two spaced-apart structured metallization layers (200A, 200B) which are arranged inside the chip package (130) and / or outside on an outer surface (114a, 114b) of the chip package (130), wherein the semiconductor chip (113) has a plurality of integrated chip metallization layers (200A, 200B) arranged in different planes, and wherein at least one of the at least two spaced-apart structured metallization layers in which the receiving coils (112A, 112B) are formed is formed in the form of at least one of the chip metallization layers (200A, 200B).

Description

[0001] The present concept relates to an inductive angle and / or position sensor. Some embodiments relate to an inductive angle and / or position sensor with an excitation coil, an inductive target, and a receiving coil arrangement, as well as with a housing, wherein a semiconductor chip is arranged in the housing, and wherein the receiving coil arrangement is arranged inside or outside on an outer surface of the housing.

[0002] Position sensors are used to determine the position between two moving components. The position can be measured relative to or absolute from each other. The two components, which can move relative to each other, can, for example, perform a linear motion. One conceivable application would be determining the position of a sled in a track. Curved motion paths are also possible when determining position.

[0003] Angle sensors, on the other hand, are primarily used in rotary movements to determine the position between two rotating components, such as a rotor and a stator. These types of angle sensors are used, for example, to determine a steering angle or the position of a motor shaft, and similar applications.

[0004] A combination of translational and rotational motion between two moving components is also conceivable, whereby the absolute or relative position of the two components to each other can be determined.

[0005] Various methods and devices exist for determining the position or angle between two components. The concept described here deals with sensors in the technical field of inductive angle and / or position measurement.

[0006] In this system, a first sensor component, for example a stator, has an excitation coil. The excitation coil is driven by an alternating current and subsequently generates a corresponding inductive or magnetic field. A second sensor component, for example a rotor, is movable relative to the first sensor component in a translational and / or rotational direction. An inductive target is mounted on the second sensor component. This inductive target receives the inductive or magnetic field generated by the excitation coil. The inductive target is electrically conductive, so that an induced current develops in the inductive target in response to the received inductive or magnetic field. This induced current, in turn, causes a corresponding inductive or magnetic field in the target. The first sensor component, for example the stator, has a receiving coil that receives the inductive or magnetic field generated by the target.The magnetic field is received, and in response, an induction signal is generated, for example, a corresponding induced current or voltage. The signal strength of this induction signal depends primarily on the relative position of the two sensor components and thus varies depending on their position. Therefore, based on an evaluation of the signal strength of the induction signal induced in the receiving coil, the relative position of the two sensor components can be determined.

[0007] This inductive sensor principle differs from conventional magnetic field sensors, which measure the magnetic field strength of a magnetic field, particularly a permanent one. In inductive sensors, the magnetic field strength varies depending on the relative position of the two sensor components. Another difference lies, for example, in the choice of materials. While ferromagnetic materials are used in magnetic field sensors, non-ferromagnetic materials with electrical conductivity, such as aluminum, can also be used in inductive sensors.

[0008] Magnetic field sensors can be manufactured with very small dimensions. However, they are susceptible to external interference, particularly from the presence of ferromagnetic materials. Therefore, the reliability of magnetic field sensors can vary considerably in environments with many magnetic components.

[0009] Inductive angle and / or position sensors, on the other hand, are insensitive to ferromagnetic materials. The application range of inductive sensors is therefore significantly broader than that of the previously described magnetic field sensors. Furthermore, inductive sensors are essentially unaffected by external influences such as dust, dirt, or liquids.

[0010] Depending on the required sensitivity and measuring range of the inductive sensor, sometimes high currents are induced in the respective coils. To ensure the desired high sensitivity of an inductive sensor, losses and parasitic inductances should be kept as low as possible. Accordingly, the dimensions of the coil windings must be designed to handle these potentially high currents. The coils are therefore typically manufactured as structured conductive traces on printed circuit boards (PCBs). A chip package containing the necessary circuitry for operating the inductive sensor is also mounted laterally on the PCB alongside the structured conductive trace coils.

[0011] Such sensor arrangements with PCBs are described, among others, in the publications US 2019 / 0 063 956 A1, US 2014 / 0 132 253 A1, DE 101 54 710 A1, EP 0 909 955 B1, EP 3 514 559 A1, US 2019 / 0 360 839 A1 and DE 10 2019 218 399 A1.

[0012] Ideally, inductive sensors should be as small as possible. However, both the structured conductor coil on the PCB and the adjacent chip package require a certain minimum mounting area. Furthermore, the minimum conductor thickness achievable on a PCB is an additional limiting factor in the sensor's miniaturization.

[0013] It would therefore be desirable to provide an inductive angle and / or position sensor that has the smallest possible dimensions and at the same time a high sensitivity to changes in the induction signal induced in the receiving coil arrangement.

[0014] Therefore, an inductive angle and / or position sensor with the features of claim 1 is proposed. Embodiments and further advantageous aspects of this inductive angle and / or position sensor are described in the respective dependent claims.

[0015] The innovative inductive angle and / or position sensor described herein may, among other things, comprise a first sensor component and a second sensor component movable relative to it. The first sensor component may comprise an excitation coil and a receiving coil assembly with two or more individual receiving coils, and the second sensor component may comprise an inductive target. The excitation coil may be excitable with an alternating current to induce an inductive current in the inductive target. The inductive target may be configured to generate a magnetic field in response to the inductive current, which in turn generates an inductive signal in the receiving coil assembly. The first sensor component may comprise a semiconductor chip with an integrated circuit configured to determine the position of the second sensor component relative to the first sensor component based on the inductive signal.The inductive angle and / or position sensor can further comprise a housing in which the semiconductor chip is arranged. According to the innovative concept described herein, the individual receiving coils of the receiving coil assembly can be configured with at least two spaced-apart structured metallization layers. Alternatively or additionally, the excitation coil can be configured with at least one structured metallization layer. The respective metallization layers can be arranged inside the housing or outside on an outer surface of the housing. The present concept thus enables the integration of a semiconductor chip together with the receiving coils and / or the excitation coil in or on a common housing.

[0016] Some exemplary embodiments are shown in the drawing and are explained below. They show: Fig. 1A a schematic perspective view of an inductive angle and / or position sensor according to an embodiment, Fig. 1B a schematic perspective view of an inductive angle and / or position sensor according to an embodiment, Fig. 2A a schematic sectional view of a package with a receiving coil arrangement designed in a chip metallization, according to a possible embodiment, Fig. 2B a schematic sectional view of a package with a receiving coil arrangement configured in a rewiring within the chip, according to a possible embodiment, Fig. 2C a schematic sectional view of a package with a receiving coil arrangement configured in a rear-side rewiring outside the chip, according to a possible embodiment, Fig. 3A a schematic sectional view of a package with a receiving coil arrangement configured in a rewiring in the fan-in area and / or fan-out area of ​​an eWLB package, according to a possible embodiment, Fig. 3B a schematic sectional view of a package with a receiver coil arrangement configured in a rewiring within the chip, and with an additional vertical via, according to a possible embodiment, Fig. Figure 3C shows a schematic sectional view of a package with a receiving coil arrangement configured in a rear-side rewiring on the outside of the package, according to a possible embodiment. Fig. 4 A schematic sectional view of a wire bond package with a receiving coil arrangement formed in a metallization on the outside of the package, according to a possible embodiment, Fig. 5A-5D Schematic sectional views of different package types with a receiving coil arrangement located inside or on the outside of the respective package, according to a possible embodiment, Fig. 6 a schematic view of a package with a receiving coil arrangement, wherein a first receiving coil of the receiving coil arrangement is configured in a metallization on a package exterior and a second receiving coil of the receiving coil arrangement is configured in a metallization inside the package, according to a possible embodiment, Fig. 7A a schematic sectional view of a package with a receiving coil arrangement, wherein the package is arranged on a circuit board, according to a possible embodiment, Fig. 7B a schematic sectional view of a package with a receiving coil arrangement, wherein the package is designed without a conductor plate, according to a possible embodiment, Fig. 8 a schematic sectional view of two semiconductor chips integrated in a printed circuit board, and with a receiving coil arrangement designed in a metallization on a printed circuit board surface, according to an example, and Fig. 9 a schematic block diagram illustrating a method for manufacturing an enclosed inductive angle and / or position sensor, according to a possible embodiment.

[0017] The following are examples of embodiments described in more detail with reference to the figures, whereby elements with the same or similar function are provided with the same reference numerals.

[0018] Process steps depicted in a block diagram and explained with reference to it can also be executed in a different sequence than the one shown or described. Furthermore, process steps relating to a specific feature of a device are interchangeable with that very feature of the device, and vice versa.

[0019] Fig. Figure 1A shows a non-limiting embodiment of an inductive angle and / or position sensor 100 according to the innovative concept described herein.

[0020] The inductive angle and / or position sensor 100 can have a first sensor component 110 and a second sensor component 120 that is movable relative to it. The two sensor components 110, 120 can be movable relative to each other, for example, translationally (indicated by arrows 131, 132) or rotationally (indicated by arrow 133).

[0021] The first sensor component 110 can comprise an excitation coil 111 and a receiving coil assembly 112. The receiving coil assembly 112 can comprise two or more individual receiving coils 112A, 112B.

[0022] The second sensor component 120 can have an inductive target 121. The inductive target 121 can be designed as a coil or, for example, in the form of a solid sheet metal part.

[0023] The excitation coil 111 can be excited with an alternating current I1 to induce an induced current in the inductive target 121. The inductive target 121 can be configured to generate a magnetic field in response to the induced current, which in turn generates an induced signal S1 in the receiving coil arrangement 112.

[0024] The first sensor component 110 can further comprise a semiconductor chip 113 with an integrated circuit configured to determine the position of the second sensor component 120 relative to the first sensor component 110 based on the induction signal S1. The integrated circuit can, for example, comprise an ASIC (Application Specific Integrated Circuit).

[0025] The inductive angle and / or position sensor 100 can further comprise a housing 114 in which the semiconductor chip 113 is arranged. According to the invention, the housing 114, including the chip 113 housed therein, is hereinafter also referred to as a chip package 130.

[0026] According to the innovative concept described herein, the individual receiving coils 112A, 112B of the receiving coil arrangement 112 can be arranged in at least two spaced-apart structured metallization layers 200A, 200B (see Fig. 2A and following) may be designed, which may be arranged inside the housing 114 and / or outside on an outer surface of the housing 114. These at least two structured metallization layers 200A, 200B may be spaced apart vertically and / or laterally.

[0027] Alternatively or additionally, the excitation coil 111 can be in at least one structured metallization layer 200C (see Fig. 2A and following) may be designed, which may be arranged inside the housing 114 and / or outside on an outer surface of the housing 114.

[0028] Both the excitation coil 111 and the receiving coil assembly 112, or the individual receiving coils 112A, 112B of the receiving coil assembly 112, can preferably be manufactured using thin-film technology. For example, the aforementioned spaced-apart metallization layers 200A, 200B can be structured using thin-film technology for the purpose of producing the receiving coils 112A, 112B. Likewise, it would be conceivable that the aforementioned metallization layer 200C could be structured using thin-film technology for the purpose of producing the excitation coil 111.

[0029] The term thin-film technology can refer to structured metallization deposition (e.g., by sputtering or vapor deposition – with structuring by lithography). It can also fall under the term thin-film technology if a thin seed layer produced in this way is subsequently reinforced by a plating process – this can be done electrochemically or without current. Dielectric layers can be produced by spin-on technology or laminated.

[0030] The term "thick-film technology," on the other hand, would encompass subtractive techniques, such as those used in printed circuit board manufacturing (e.g., etching copper-clad layers) or the printing of conductive pastes with subsequent curing. Structurally, metallization layers produced using thin-film technology can thus be distinguished from those produced using thick-film technology.

[0031] The advantages of thin-film technology lie in the possibility of realizing smaller structures (both feature widths and feature spacings). In coils (e.g., the excitation coil 111 and / or the receiving coils 112A, 112B), this allows for more turns to be represented on the same area.

[0032] As shown in the schematic view in Fig. As can be seen from Figure 1A, at least one of the two receiving coils 112A, 112B of the receiving coil assembly 112 can be arranged inside the housing 114, as shown by solid lines. Alternatively or additionally, the excitation coil 111 can be arranged inside the housing 114, which is also shown by solid lines.

[0033] It would also be conceivable that at least one of the two receiving coils of the receiving coil arrangement could be arranged externally on an outer surface 114a, 114b of the housing 114, as indicated by dashed lines 112', 112A', 112B'. It would also be conceivable that the excitation coil could be arranged externally on an outer surface 114a, 114b of the housing 114, as also indicated by dashed lines 111'.

[0034] Both receiving coils 112A, 112B (112A', 112B') of the receiving coil assembly 112 (112') can therefore be arranged inside the housing 114 or outside on an outer surface 114a, 114b of the housing 114. It would also be conceivable that at least one of the two receiving coils 112A, 112B of the receiving coil assembly 112 is arranged inside the housing 114 and the other of the two receiving coils 112B of the receiving coil assembly 112 is arranged outside on an outer surface 114a, 114b of the housing 114.

[0035] The excitation coil 111 can be arranged inside the housing 114 or outside on an outer surface 114a, 114b of the housing 114. It would also be conceivable that a first excitation coil 111 were arranged inside the housing 114, and an optional second excitation coil 111' were arranged outside on an outer surface 114a, 114b of the housing 114.

[0036] The outer surface 114a, 114b of the housing 114 can essentially be a surface defined by the outer contours of the housing 114. For example, as in the non-limiting embodiment in Fig. Figure 1A is shown to be a top surface 114a of the housing 114. In this case, the top surface 114a would be the outer surface of the housing 114 facing away from the first sensor component 110. In other words, the top surface 114a in this example would be the outer surface of the housing 114 facing the second sensor component 120. More generally, the top surface 114a in this example would be the outer surface 114a of the housing 114 that faces away from the sensor component 110 on which the housing 114 is mounted, or the outer surface 114a of the housing 114 that faces the sensor component 120 on which the housing 114 is not mounted.

[0037] The aforementioned outer surface can also be one of the lateral side walls 114b of the housing 114. This means that at least one of the receiving coils 112A, 112B of the receiving coil arrangement 112 and / or the excitation coil 111 can be arranged on such a lateral outer surface 114b of the housing 114.

[0038] As mentioned at the outset, the individual receiving coils 112A, 112B of the receiving coil assembly 112 can be implemented in at least two spaced-apart and structured metallization layers 200A, 200B. The excitation coil 111 can also be implemented in a structured metallization layer, which may be one of the two structured metallization layers 200A, 220B in which the receiving coils 112A, 112B are also implemented. Alternatively, the excitation coil 111 can be implemented in a third, distinct metallization layer 200C. All of the structured metallization layers 200A, 200B, 200C mentioned above can be located inside the housing 114 and / or outside on an outer surface 114a, 114b of the housing 114. The structured metallization layers 200A, 200B, 200C can be produced using thin-film technology.

[0039] Fig. Figure 1B shows a further embodiment of an inductive angle and / or position sensor 100. This embodiment is similar to the one previously described with reference to Fig. In the discussed embodiment 1A, it is explained why elements with the same or similar function are provided with the same reference numerals. The example in Fig. The non-limiting embodiment shown in Figure 1B differs, among other things, in that the first sensor component 110 optionally has an additional substrate 140 (e.g., a PCB: Printed Circuit Board) on which the aforementioned housing 114 or package 130 can be arranged. Furthermore, the excitation coil 111 can optionally be arranged on the substrate 140. For this purpose, the excitation coil 111 can, for example, be designed as a conductor track on the PCB. In this case, the excitation coil 111 could therefore be implemented in a structured metallization layer of the PCB, i.e., outside the housing 114.

[0040] The in Fig. The inductive angle and / or position sensor 100 shown in Figure 1B can, among other things, comprise a first sensor component 110. In the embodiment shown here only as an example, the first sensor component 110 can, for instance, be a stator. The first sensor component 110, in this example the stator, can have a substrate 140 (e.g., PCB). The housing 114 or the package 130 can be arranged on the substrate 140.

[0041] The inductive angle and / or position sensor 100 can further comprise a second sensor component 120 that is movable relative to the first sensor component 110. The second sensor component 120 can, for example, be a rotor. Accordingly, the inductive angle and / or position sensor 100 according to this embodiment would be designed, in particular, to determine an angle between the first sensor component 110 (stator) and the second sensor component 120 (rotor). However, it would also be conceivable that the first and second sensor components 110, 120 could be movable relative to each other translationally, or in a combination of rotational and translational motion. Furthermore, it would be conceivable that the first sensor component 110 could be configured as a rotor and the second sensor component 120 as a stator.

[0042] The first sensor component 110, in the embodiment shown here the stator, can have an excitation coil 111. In Fig. Figure 1B shows different possible configurations of the excitation coil 111. For example, the excitation coil 111 can be arranged inside the housing 114 or the package 130. As mentioned earlier, the excitation coil 111 can be implemented in a thin-film structured metallization layer 200A, 200B, 200C, which is arranged inside the housing 114 or the package 130. Optionally, the excitation coil 111 can be arranged outside, i.e., on or attached to the housing 114 or the package 130, which is indicated by dashed lines 111'. In this case, too, the excitation coil 111' can be implemented in a thin-film structured metallization layer 200A, 200B, 200C, which is then arranged outside the housing 114 or the package 130. Optionally, the excitation coil 111 can be arranged outside the housing 114 or packages 130 on the substrate 140, which is indicated by dashed lines 111".As previously described, the excitation coil 111 can be implemented in the form of a conductor track on the substrate 140. In this case, too, the excitation coil 111 can be implemented in a metallization layer 200C structured using thin-film technology, with this metallization layer then being located on the substrate 140, i.e., outside the housing 114 or the package 130.

[0043] It is conceivable that the inductive angle and / or position sensor 100 described herein has more than one excitation coil 111 described previously. In this case, it would be conceivable, for example, that at least one excitation coil 111 is located inside the housing 114, optionally at least one further excitation coil 111' is located outside on an outer surface of the housing 114, and optionally at least one further excitation coil 111" is located outside the housing 114 on the substrate 140. However, whenever the term "excitation coil" is used herein, it can refer to all the embodiments 111, 111', 111" described above.

[0044] The stator 110 can further comprise a receiving coil assembly 112. The receiving coil assembly 112 can comprise two or more individual receiving coils 112A, 112B.

[0045] The second sensor component 120, in the embodiment shown here the rotor, can have an inductive target 121. The excitation coil 111 can be excited with an alternating current I1 to induce an inductive current in the inductive target 121. The inductive target 121, in turn, can be configured to generate a magnetic field in response to this induced current, which in turn generates an inductive signal S1 in the receiving coil arrangement 112.

[0046] The first sensor component 110 can further comprise a semiconductor chip 113 with an integrated circuit configured to determine the position of the second sensor component 120 relative to the first sensor component 110 based on the induction signal S1. The integrated circuit can, for example, comprise an ASIC (Application Specific Integrated Circuit).

[0047] The inductive angle and / or position sensor 100 can further comprise a housing 114 in which the semiconductor chip 113 is arranged. The housing 114 with the chip 113 contained therein can also be referred to as a chip package 130.

[0048] According to the innovative concept described herein, the individual receiving coils 112A, 112B of the receiving coil assembly 112 can be configured in at least two spaced-apart structured metallization layers 200A, 200B (for details, see the following figures), which are arranged inside the housing 114 and / or outside on an outer surface of the housing 114. These at least two structured metallization layers 200A, 200B can be spaced vertically and / or laterally apart.

[0049] Both the excitation coil 111 and the receiving coil assembly 112, or the individual receiving coils 112A and 112B of the receiving coil assembly 112, can therefore be manufactured using thin-film technology. For example, the previously mentioned, spaced-apart metallization layers 200A and 200B for producing the receiving coils 112A and 112B, as well as the at least one metallization layer 200C for producing the excitation coil 111, can be structured using thin-film technology. The term "thin-film technology" can refer to structured metallization deposition (e.g., by sputtering or vapor deposition – with structuring by lithography). It can also fall under the term "thin-film technology" if a thin seed layer produced in this way is subsequently reinforced by a plating process – this can be done galvanically or without current.Dielectric layers can be produced using spin-on technology or by laminating.

[0050] The term "thick-film technology," on the other hand, would encompass subtractive techniques, such as those used in printed circuit board manufacturing (e.g., etching copper-clad layers) or the printing of conductive pastes with subsequent curing. Structurally, metallization layers produced using thin-film technology can thus be distinguished from those produced using thick-film technology.

[0051] The advantages of thin-film technology lie in the ability to create smaller structures (both structure widths and structure spacing). This allows for more windings to be produced on the same area in coils.

[0052] As shown in the schematic view in Fig. As can be seen from Figure 1B, at least one of the individual receiving coils 112A, 112B of the receiving coil assembly 112 can be arranged inside the housing 114, as shown by solid lines. Alternatively or additionally, at least one of the individual receiving coils of the receiving coil assembly can be arranged outside on an outer surface 114a, 114b of the housing 114, as shown by dashed lines 112', 112A', 112B'. The same applies to the excitation coil 111. The excitation coil 111 can be arranged inside the housing 114, as shown by solid lines. Alternatively or additionally, the excitation coil (or optionally another excitation coil) can be arranged outside on an outer surface 114a, 114b of the housing 114, as shown by dashed lines 111'.Alternatively or additionally, the excitation coil (or optionally another excitation coil) can be arranged outside the housing 114 on the substrate 140, which is shown with dashed lines 111".

[0053] For example, both receiving coils 112A, 112B of the receiving coil assembly 112 can be arranged inside the housing 114 or outside on an outer surface 114a, 114b of the housing 114. It would also be conceivable that at least one of the two receiving coils 112A, 112B of the receiving coil assembly 112 is arranged inside the housing 114 and the other of the two receiving coils 112B of the receiving coil assembly 112 is arranged outside on an outer surface 114a, 114b of the housing 114.

[0054] The outer surface 114a, 114b of the housing 114 can essentially be a surface defined by the outer contours of the housing 114. For example, as in the non-limiting embodiment in Fig. Figure 1B shows a top surface 114a of the housing 114. In this case, the top surface 114a would be the outer surface of the housing 114 facing away from the first sensor component 110, in this example the stator. In other words, the top surface 114a in this example would be the outer surface of the housing 114 facing the second sensor component 120, in this example the rotor. More generally, the top surface 114a in this example would be the outer surface 114a of the housing 114 that faces away from the sensor component 110 on which the housing 114 is mounted, or the outer surface 114a of the housing 114 that faces the sensor component 120 on which the housing 114 is not mounted.

[0055] The aforementioned outer surface could also be one of the lateral side walls 114b of the housing 114. This means that at least one of the receiving coils 112A, 112B of the receiving coil arrangement 112 could be located on such a lateral outer surface 114b of the housing 114.

[0056] As mentioned at the outset, the individual receiving coils 112A, 112B of the receiving coil arrangement 112 can be implemented in at least two spaced-apart metallization layers 200A, 200B. Alternatively or additionally, the excitation coil 111 can be implemented in at least one metallization layer 200A, 200B, 200C. The excitation coil 111 can, for example, be implemented in one of the aforementioned at least two spaced-apart structured metallization layers 200A, 200B, in which the receiving coils 112A, 112B are also implemented. Alternatively, the excitation coil 111 can be implemented in a third, distinct structured metallization layer 200C. The structured metallization layers 200A, 200B, 200C can be located inside the housing 114 and / or outside on an outer surface 114a, 114b of the housing 114 or on the substrate 140, as discussed above.The structured metallization layers 200A, 200B, 200C can be produced using thin-film technology.

[0057] The Fig. 2A and Fig. Figure 2B shows exemplary embodiments of such metallization layers 200A, 200B, 200C, which can be produced using thin-film technology and are suitable for forming the excitation coil 111 and the receiving coils 112A, 112B.

[0058] Fig. Figure 2A shows a semiconductor chip 113 with an integrated circuit for operating the inductive angle and / or position sensor 100. The semiconductor chip 113 has a chip metallization 200 located within the chip 113. The chip metallization 200 can have a variety of integrated chip metallization layers 200A, 200B, 200C arranged in different planes.

[0059] The receiving coil arrangement 112 can, for example, be configured in the form of the chip metallization 200. Alternatively or additionally, the excitation coil 111 can be configured in the form of the chip metallization 200. According to the invention, at least one of the at least two spaced-apart structured metallization layers in which the receiving coils 112A, 112B are configured is configured in the form of one of the chip metallization layers 200A, 200B, i.e., at least one of the chip metallization layers 200A, 200B forms at least one of the receiving coils 112A, 112B.

[0060] Alternatively or additionally, according to this non-limiting embodiment, the excitation coil 111 can be configured in at least one of the chip metallization layers 200A, 200B, 200C of the chip metallization 200, i.e., at least one of the chip metallization layers 200A, 200B, 200C can form the excitation coil 111. For example, the excitation coil 111 can be implemented in chip metallization layer 200C. It would also be conceivable that the excitation coil 111 is implemented in one of the two chip metallization layers 200A, 200B in which the receiving coils 112A, 112B are also configured (not explicitly shown). Thus, the excitation coil 111 could, for example, be arranged radially around the receiving coils 112A, 112B.

[0061] The in Fig. The chip 113 shown in Figure 2A can, for example, be manufactured using wafer level packaging (WLP) technology, with the housing 114 containing the chip 113 forming a WLP package 130.

[0062] Fig. Figure 2B shows another conceivable embodiment of a WLP package 130 with a housing 114 and a chip 113 arranged therein. According to this embodiment, the WLP package 130 can have a rewiring section 203 in the fan-in area, i.e., in the area of ​​the footprint of the chip 113 or within the chip 113, which is also referred to as a redistribution layer (RDL). The receiver coil arrangement 112 can, for example, be configured in the form of the RDL 203. Alternatively or additionally, the excitation coil 111 can be configured in the form of the RDL 203.

[0063] The redistribution layer 203 can have one or more (e.g., vertically and / or laterally) spaced-apart metallization layers 200A, 200B, 200C. According to the invention, at least one of the at least two spaced-apart structured metallization layers in which the receiving coils 112A, 112B are configured is located within the housing 114 and is configured in the form of one of the metallization layers 200A, 200B of the rewiring section 203 in the fan-in area, i.e., at least one of the metallization layers 200A, 200B in the redistribution layer 203 forms at least one of the receiving coils 112A, 112B.

[0064] Alternatively or additionally, at least one structured metallization layer in which the excitation coil 111 can be configured can be located within the housing 114 and configured in the form of one of the metallization layers 200A, 200B, 200C of the rewiring section 203 in the fan-in area, i.e. at least one of the metallization layers 200A, 200B, 200C in the RDL 203 can form the excitation coil 111.

[0065] Fig. Figure 2C shows another conceivable embodiment of a WLP package 130 with a housing 114 and a chip 113 arranged therein. The chip 113 has a first chip surface 113a and an opposing second chip surface 113b. Contact sections 210 for electrically contacting the chip 113 can be arranged on the first chip surface 113a. The contact sections 210 can, for example, comprise connection pads, solder balls, and the like.

[0066] According to the embodiment shown here, at least one structured metallization layer 200A, as described above, can be arranged in the fan-in region, i.e., in the area of ​​the footprint of the chip 113 or within the chip 113. A second structured metallization layer 200B, spaced apart from this, can, for example, be arranged outside the chip 113 on the second chip surface 113b (and simultaneously in the fan-in region). According to the invention, at least one of the receiving coils 112A, 112B is configured in at least one of these structured metallization layers 200A, 200B, i.e., at least one of the metallization layers 200A, 200B forms at least one of the receiving coils 112A, 112B.

[0067] According to this embodiment, at least one of the at least two spaced-apart structured metallization layers 200A, 200B, in which the receiving coils 112A, 112B are configured according to the invention, can be arranged inside the housing 114 and outside the chip 113 on the second chip surface 113b. Alternatively, it would be conceivable that both spaced-apart structured metallization layers 200A, 200B, in which the receiving coils 112A, 112B are configured, are arranged on the second chip surface 113b.

[0068] Alternatively or additionally, at least one structured metallization layer 200C, as described above, can be arranged in the fan-in region, i.e., in the area of ​​the footprint of chip 113 or within chip 113. The excitation coil 111 can be implemented in this at least one structured chip metallization layer 200C. Alternatively, the excitation coil 111 can be implemented in a structured metallization layer 200C' that is arranged outside chip 113 on the second chip surface 113b (and simultaneously in the fan-in region).

[0069] The at least one structured metallization layer 200C, in which the excitation coil 111 may be configured, and / or at least one of the two spaced-apart structured metallization layers 200A, 200B, in which the receiving coils 112A, 112B are configured, may be galvanically connected to at least one of the contact sections 210 on the opposite first chip surface 113a by means of a through-hole 204 extending between the first chip surface 113a and the second chip surface 113b through the semiconductor chip 113. The vertical through-hole 204 may, for example, be a through silicon via (TSV).

[0070] Alternatively or additionally to the vertical via 204, at least one of the structured metallization layers 200A, 200B, 200C in which the excitation coil 111 or the receiving coils 112A, 112B are configured, can be galvanically connected to at least one of the contact sections 210 on the first chip surface 113a by means of an electrically conductive structure 205 extending laterally along the chip's outer contour 113c. The electrically conductive structure 205 can, for example, be a conductor track.

[0071] It should also be noted here that the excitation coil 111 can also be implemented in one of the at least two spaced-apart structured metallization layers 200A, 200B, in which the receiving coils 112A, 112B are also implemented.

[0072] It is also conceivable that, with reference to the Fig. 2A, Fig. 2B and Fig. The embodiments discussed in Section 2C can be combined with one another. For example, at least one of the at least two spaced-apart structured metallization layers 200A, 200B in which the receiving coils 112A, 112B are configured could be located within the housing 114 and configured as a chip metallization layer 200A, 200B and / or as a metallization layer 200A, 200B in the redistribution layer 203 and / or as a metallization layer 200A, 200B on a chip outer surface 113b. Furthermore, for example, the at least one structured metallization layer in which the excitation coil 111 can be designed could be located within the housing 114 and in the form of one of the chip metallization layers 200A, 200B, 200C and / or in the form of a metallization layer 200A, 200B, 200C in the redistribution layer 203 and / or in the form of a metallization layer 200A, 200B, 200C on a chip outer surface 113b.

[0073] Fig. Figure 3A shows another embodiment of a chip package 130 with a housing 114 and a chip 113 arranged therein. The package 130 shown here can be a WLB or eWLB package (WLB: Wafer Level Ball Grid Array; eWLB: embedded Wafer Level Ball Grid Array).

[0074] In WLB or eWLB technology, individual chips are placed at intervals and encapsulated with a potting compound. This compound can, for example, be an electrically insulating material, such as a polymer. As the potting compound cures, an artificial wafer is created, forming a mold frame around the chips. Additional solder contacts 210 can be placed on this artificial wafer, the so-called reconstitution. These solder contacts 210 can be located in the fan-in area 301, i.e., within the footprint of the chip 113. Alternatively or additionally, solder contacts 210 can be located in the fan-out area 302, i.e., outside the footprint of the chip 113. After the reconstitution is complete, electrical connections 203 can be made to the solder contacts 210, as with conventional wafer-level packages.These electrical connections 203 can be created in one or more metallization layers or connection layers, which can also be referred to as rewiring or redistribution layer (RDL), using thin-film technology.

[0075] In the Fig. As shown in the embodiment 3A, the eWLB package 130 depicted here can have a redistribution layer 203 that extends into the fan-out area 302, i.e., into an area outside the footprint of the chip 113. The excitation coil 111 and / or the receiver coil arrangement 112 can, for example, be implemented in this redistribution layer 203.

[0076] The redistribution layer 203 can have several spaced-apart structured metallization layers 200A, 200B, 200C, at least one of which also extends into the fan-out area 302 (see e.g. Fig. 3B). At least one of the receiving coils 112A, 112B and / or the excitation coil 111 may be designed in the form of one of these structured metallization layers 200A, 200B, 200C in the redistribution layer 203.

[0077] In other words, at least one of the at least two spaced-apart structured metallization layers 200A, 200B, in which at least one of the receiving coils 112A, 112B is configured according to the invention, can be located within the housing 114 and configured as at least one of the metallization layers of the rewiring section 203 in the fan-out area 302. Alternatively or additionally, the at least one structured metallization layer in which the excitation coil 111 can be implemented can be located within the housing 114 and configured as at least one of the metallization layers 200A, 200B, 200C of the rewiring section 203 in the fan-out area 302.

[0078] Alternatively or additionally, it would be conceivable that at least one of the at least two spaced-apart structured metallization layers 200A, 200B, in which at least one of the receiving coils 112A, 112B is configured, is located within the housing 114 and is configured in the form of at least one of the metallization layers of the rewiring section 203 in the fan-in area 301 (see also Fig. 2B). Alternatively or additionally, the at least one structured metallization layer in which the excitation coil 111 can be implemented can be configured within the housing 114 and in the form of at least one of the metallization layers 200A, 200B, 200C of the rewiring section 203 in the fan-in area 301 (see also Fig. 2B).

[0079] Alternatively or additionally, it would be conceivable that at least one of the at least two spaced-apart structured metallization layers 200A, 200B, in which at least one of the receiving coils 112A, 112B is configured, is located within the housing 114 and is configured as at least one of the chip metallization layers within the chip 113 (see also Fig. 2A). Alternatively or additionally, it would also be conceivable that at least one structured metallization layer, in which the excitation coil 111 can be configured, is configured within the housing 114 and in the form of at least one of the chip metallization layers 200A, 200B, 200C within the chip 113 (see also Fig. 2A).

[0080] Fig. Figure 3B shows a further embodiment of an eWLB package 130 with a housing 114 and a chip 113 arranged therein. In addition to the previously described with reference to Fig. In the embodiment discussed in 3A, the eWLB Package 130 can be made from Fig. 3B has a so-called backside redistribution layer 213. This backside RDL 213 can be arranged on an outer contour 114a of the housing 114 opposite the contact sections 210, or on a housing surface 114a. The backside RDL 213 can thus be located outside the housing 114. The backside RDL 213 can extend laterally, at least partially, into the fan-in region 301 and / or at least partially into the fan-out region 302. The receiving coil arrangement 112 and / or the excitation coil 11 can be configured within the backside RDL 213.

[0081] The backside RDL 213 can also have several spaced-apart structured metallization layers (not explicitly shown here). At least one of the two receiving coils 112A, 112B is designed as one of the structured metallization layers of the backside RDL 213. In other words, at least one of the at least two spaced-apart structured metallization layers, in which at least one of the receiving coils 112A, 112B is designed, can be located outside the housing 114 and be designed as at least one of the structured metallization layers of the rewiring section 213 on the housing surface 114a in the fan-out area 302 and / or in the fan-in area 301. Alternatively or additionally, the excitation coil 111 can be designed as one of the structured metallization layers of the backside RDL 213.In other words, at least one structured metallization layer in which the excitation coil 111 can be designed can be located outside the housing 114 and in the form of at least one of the structured metallization layers of the rewiring section 213 on the housing surface 114a in the fan-out area 302 and / or in the fan-in area 301.

[0082] It is equally conceivable that the reference to the Fig. 3A and Fig. The embodiments discussed in 3B can be combined with one another. For example, at least one of the at least two spaced-apart structured metallization layers, in which at least one of the receiving coils 112A, 112B is configured, can be located within the housing 114 and configured as one of the structured metallization layers of the rewiring section 203 in the fan-out area 302 ( Fig. 3A), and at least one of the at least two spaced-apart structured metallization layers, in which at least one of the receiving coils 112A, 112B is configured, can be configured outside the housing 114 and in the form of at least one of the metallization layers of the rewiring section 213 on the housing surface 114a in the fan-out area 302 and / or in the fan-in area 301 ( Fig. 3B). Alternatively or additionally, at least one structured metallization layer in which the excitation coil 111 can be designed can be located within the housing 114 and in the form of one of the structured metallization layers 200A, 200B, 200C of the rewiring section 203 in the fan-out area 302 ( Fig. 3A). Alternatively, the excitation coil 111, or additionally an optionally existing further excitation coil, can be configured in at least one of the spaced-apart structured metallization layers 200A, 200B, 200C in the backside RDL 213, i.e. outside the housing 114 or on the housing surface 114a in the fan-out area 302 and / or in the fan-in area 301 ( Fig. 3B).

[0083] In the Fig. In the non-limiting embodiment shown in Figure 3B, a vertical via 304 can be provided. The vertical via 304 can, for example, extend from the previously mentioned package surface 114a to an opposite side of the package 114. The vertical via 304 can, for example, extend partially or completely through the package or the package 114. The vertical via can, for example, be a through-mold via (TMV) that extends through the potting compound but not through the chip 113.

[0084] The vertical via 304 can galvanically connect the backside RDL 213 to one of the contact sections 210. Therefore, if at least one of the two receiving coils 112A, 112B is configured in one of the structured metallization layers in the backside RDL 213, the respective receiving coil 112A, 112B can be connected to an opposite contact section 210 via the vertical via 304. Similarly, if the excitation coil 111 is configured in one of the structured metallization layers 200A, 200B, 200C in the backside RDL 213, the excitation coil 111 can be connected to an opposite contact section 210 via the vertical via 304.

[0085] Fig. Figure 3C shows a further embodiment of a package 130 for an inductive angle and / or position sensor 100. This embodiment is essentially similar to the one previously described with reference to Fig. The embodiment described in 3B is therefore distinguished by the fact that elements with similar or identical functions are provided with the same reference numerals. One difference is that a metallization 200 is arranged on the housing surface 114a instead of the previously described backside RDL 213. The metallization 200 can have one or more structured and spaced-apart metallization layers (not explicitly shown here). The metallization 200 can, for example, be deposited on the housing 114 or on the potting compound by means of an electroplating process and, if necessary, structured accordingly, for example by means of a lithography process.

[0086] The receiving coil assembly 112 and / or the excitation coil 111 can, for example, be configured in the form of metallization 200. Accordingly, at least one of the at least two spaced-apart structured metallization layers in which the receiving coils 112A, 112B can be configured could be configured in the form of at least one of the structured metallization layers of metallization 200. Alternatively or additionally, the at least one structured metallization layer in which the excitation coil 111 can be configured could be configured in the form of at least one of the structured metallization layers of metallization 200.

[0087] Fig. Figure 4 shows another embodiment of a package 130 for an inductive angle and / or position sensor 100. The chip 113 can be arranged on a substrate 401 and encapsulated with a potting compound. The substrate 401 and the potting compound can together form the housing 114 in which the chip 113 is arranged. The housing 114 and the chip 113 arranged therein can in turn form a package 130. In the present, non-limiting, embodiment, this can, for example, be a wire bond (WB) package 130. Here, the chip 113 can, for example, be connected to one or more electrically conductive sections 403 on the substrate 401 by means of bond wires 402.

[0088] A metallization 200 can be arranged on an outer contour surface 114a of the housing 114, or of the potting compound, opposite the substrate 401. The metallization 200 can have one or more spaced-apart structured metallization layers (not explicitly shown here). The metallization 200 can be deposited on the housing 114, or on the potting compound, for example by means of an electroplating process and, if necessary, structured accordingly, for example by means of a lithography process.

[0089] The excitation coil 111 and / or the receiving coil assembly 112 can, for example, be configured in the form of metallization 200. Accordingly, at least one of the at least two spaced-apart structured metallization layers in which the receiving coils 112A, 112B can be configured could be configured in the form of at least one of the structured metallization layers of metallization 200. Alternatively or additionally, the at least one structured metallization layer in which the excitation coil 111 can be configured could be configured in the form of at least one of the structured metallization layers of metallization 200.

[0090] For example, it is conceivable that the metallization 200 has at least two spaced-apart structured metallization layers, and that both receiving coils 112A, 112B are each configured in one of the two metallization layers. In principle, in all embodiments described herein, it is conceivable that the two receiving coils 112A, 112B are arranged, for example, vertically one above the other or laterally next to each other. For example, one of the two receiving coils 112A, 112B could laterally surround the other receiving coil 112A, 112B, i.e., one of the two receiving coils 112A, 112B could be arranged (e.g., centrally) within the other receiving coil 112A, 112B.

[0091] As further explained in Fig. As can be seen in Figure 4, the housing 114 can have a lateral outer contour surface 114c between the substrate 401 and the outer contour surface 114a opposite the substrate 401, on which the metallization 200 is arranged. This can be a lateral side wall of the housing 114.

[0092] An electrically conductive structure 404 can be arranged on this lateral outer contour surface 114c. This could, for example, be a further metallization. This further metallization 404 can be deposited, for example, by electroplating on the housing surface or on the potting compound. At least one of the structured metallization layers of the metallization 200 arranged on the package top 114a can be galvanically connected to the substrate 401 by means of this electrically conductive structure 404. That is, the excitation coil 111 and / or at least one of the two receiving coils 112A, 112B could be galvanically connected to a terminal area on the substrate 401 by means of this electrically conductive structure 404.Alternatively or in addition to the deposited metallization, the electrically conductive structure 404 can be realized, for example, by means of bent sections of a leadframe or by means of bond wires.

[0093] The Fig. Figures 5A to 5D show schematic views of different embodiments of packages 130 for an inductive angle and / or position sensor 100 according to the innovative concept described herein. The excitation coil 111 and / or the receiving coil arrangement 120 can be configured in one of the embodiments described herein and arranged inside the housing 114 and / or outside on an outer surface 114a, 114b of the housing 114.

[0094] The package shapes can include, for example, an SMD package ( Fig. 5A), to create a WLB or eWLB package ( Fig. 5B) to create a lead frame package ( Fig. 5C) or a component package with external solder lugs, for example a THT package (THT: Through Hole Technology) ( Fig. 5D) act.

[0095] In Fig. Figure 6 shows, purely by way of example, a combined embodiment using an eWLB package 130. One of the two receiving coils 112A, 112B, here e.g. the first receiving coil 112A, can be arranged outside the housing 114 on an outer housing surface 114a (see e.g. Fig. 3B, Fig. 3C, Fig. 4A). The other of the two receiving coils 112A, 112B, here the second receiving coil 112B, can be arranged inside the housing 114 (see e.g. Fig. 2A-2C, 3A, 3B). Alternatively or additionally, the excitation coil 111 can be arranged outside the housing 114 on an outer housing surface 114a (see e.g. Fig. 3B, Fig. 3C, Fig. 4A). Alternatively, the excitation coil 111, or optionally a further excitation coil 111', can be arranged inside the housing 114 (see e.g. Fig. 2A-2C, 3A, 3B).

[0096] Fig. Figure 7A shows an example of the integration of package 130 of an inductive angle and / or position sensor 100 according to the concept described herein. Package 130 is shown here purely as an example of an eWLB package. The package 130 can be mounted on a printed circuit board 701, for example a component board or PCB, using the contact sections 210.

[0097] Fig. Figure 7B shows an alternative embodiment. Here, the package 130, i.e., the housing 114 including the chip 113 arranged therein, is designed without a printed circuit board. This means that the package 130 can be directly fitted with terminals 702 without a printed circuit board and optionally potted with a potting compound 703. This would be conceivable, for example, for leadframe packages ( Fig. 5C), for component packages with external solder tabs ( Fig. 5D) as well as in Wire Bond Packages ( Fig. 4).

[0098] Fig. Figure 8 shows an example not pertaining to the invention. One or more semiconductor chips 113 can be integrated into a printed circuit board 801. The printed circuit board 801 can have a first printed circuit board surface 801a and an opposing second printed circuit board surface 801b.

[0099] At least one of the printed circuit board surfaces 801a, 801b can have a printed circuit board metallization 200 with one or more spaced-apart structured printed circuit board metallization layers (not explicitly shown here). In the Fig. In the embodiment shown in Figure 8, a printed circuit board metallization 200 can be arranged on the first printed circuit board surface 801a and a further printed circuit board metallization 200 on the second printed circuit board surface 801b.

[0100] The printed circuit board metallization 200 can, for example, be deposited on the housing or on the printed circuit board 801 using an electroplating process and, if necessary, structured accordingly, for example using lithography processes.

[0101] The excitation coil 111 and / or the receiving coil assembly 112 can, for example, be configured in the form of the metallization 200. Accordingly, at least one of the at least two spaced-apart structured metallization layers in which the receiving coils 112A, 112B can be configured could be located outside the housing or the printed circuit board 801 and configured in the form of at least one of the printed circuit board metallization layers of the printed circuit board metallization 200. Alternatively or additionally, the at least one structured metallization layer in which the excitation coil 111 can be configured could be located outside the housing or the printed circuit board 801 and configured in the form of at least one of the printed circuit board metallization layers of the printed circuit board metallization 200.

[0102] It would therefore be conceivable, for example, that the excitation coil 111 and / or one or both receiving coils 112A, 112B of the receiving coil assembly 112 could be designed in the form of the circuit board metallization 200 arranged on the first circuit board surface 801a. Alternatively or additionally, it would be conceivable that the excitation coil 111 and / or one or both receiving coils 112A, 112B of the receiving coil assembly 112 could be designed in the form of the circuit board metallization 200 arranged on the second circuit board surface 801b.Alternatively or additionally, it would be conceivable that one of the two receiving coils 112A, 112B of the receiving coil assembly 112 could be designed as the printed circuit board metallization 200 arranged on the first printed circuit board surface 801a, and the other of the two receiving coils 112A, 112B of the receiving coil assembly 112 could be designed as the printed circuit board metallization 200 arranged on the second printed circuit board surface 801b. Furthermore, alternatively or additionally, it would be conceivable that the excitation coil 111 could be designed as the printed circuit board metallization 200 arranged on the first printed circuit board surface 801a. Alternatively, the excitation coil 111, or optionally a further excitation coil 111', could be designed as the printed circuit board metallization 200 arranged on the second printed circuit board surface 801b.

[0103] The excitation coil 111 and / or the receiving coil assembly 112 can be connected to one or more semiconductor chips 113, for example, by means of vertical vias 804. For example, the excitation coil 111 and / or one of the two receiving coils 112A, 112B of the receiving coil assembly 112 can be connected to a first semiconductor chip 113 by means of a first vertical via 804. The other of the two receiving coils 112A, 112B of the receiving coil assembly 112 can be connected to a second semiconductor chip 113 by means of a second vertical via 804. Alternatively, the excitation coil 111, or optionally a further excitation coil 111', can be connected to the second semiconductor chip 113 by means of the second vertical via 804.

[0104] Optionally, a further dielectric layer (not shown) can be arranged on one of the two printed circuit board surfaces 801a, 801b. This further dielectric layer can itself have a metallization with one or more spaced-apart structured metallization layers. At least one of the at least two spaced-apart structured metallization layers in which the receiving coils 112A, 112B are formed can be configured as at least one of these structured metallization layers of the further metallization. Alternatively or additionally, the at least one structured metallization layer in which the excitation coil 111 can be formed can be configured as at least one of these structured metallization layers of the further metallization.

[0105] Additional electrical contact pads may be provided on at least one of the two printed circuit board surfaces 801a, 801b. Furthermore, other components (not shown), for example SMD components, may be arranged on at least one of the two printed circuit board surfaces 801a, 801b.

[0106] The in Fig. The example shown in Figure 8 demonstrates the possibility of manufacturing a very compact inductive angle and / or position sensor 100, whereby, despite the production of the excitation coil 111 and / or the receiving coil arrangement 112 using thin-film technology, relatively large dimensions of the respective coils 111, 112A, 112B are achievable. This offers a cost-effective alternative to conventional fan-out wafer-level packaging (FOWLP) processes.

[0107] Furthermore, everything described herein using the receiving coils 112A and 112B of the receiving coil assembly 112 as examples can also apply in the same way to the excitation coil 111. In this case, the receiving coil assembly 112, or at least one of the two receiving coils 112A and 112B, could be replaced analogously by the excitation coil 111.

[0108] For example, it would be conceivable that the excitation coil 111 is arranged inside the housing 114 or outside on an outer surface 114a, 114b of the housing 114 and is designed in a structured metallization layer 200A, 200B, 200C by a) the excitation coil 111 is designed in the form of a metallization layer 200A, 200B, 200C integrated in the semiconductor chip 113 ( Fig. 2A to 2C), or b) the excitation coil 111 is designed in the form of a metallization layer 200A, 200B, 200C, which is arranged on a second chip surface 113b of the semiconductor chip 113, which is opposite a first chip surface 113a, which has chip contact surfaces 210 ( Fig. 2C), or c) the excitation coil 111 is designed in the form of a metallization layer 200A, 200B, 200C of a rewiring section (RDL) 203 in the fan-in area 301, provided that the housing 114 is designed as a wafer-level package (WLP) ( Fig. 2A - 2C), or d) the excitation coil 111 is designed in the form of a metallization layer 200A, 200B, 200C of a rewiring section (RDL) 203, 213 in the fan-out area, provided that the package is designed as a wafer level ball grid array (WLB) package or as an embedded wafer level ball grid array (eWLB) package, or e) the excitation coil 111 is designed in the form of a metallization layer 200, which is arranged on an outer contour surface 114a of a potting compound forming the housing 114, or f) the excitation coil 111 is designed in the form of a metallization layer 200, which is arranged on a printed circuit board surface 801a, 801b of a printed circuit board 801 forming the housing 114.

[0109] Fig. Figure 9 shows a schematic block diagram illustrating a method for manufacturing a housed inductive angle and / or position sensor 100.

[0110] In step 901, a first sensor component 110, for example a stator, and a second sensor component 120, for example a rotor, which is movable relative to it, are provided. The first sensor component 110 can have an excitation coil 111 and a receiving coil arrangement 112 with two or more individual receiving coils 112A, 112B, and the second sensor component 120 can have an inductive target 121.

[0111] Furthermore, the excitation coil 111 can be excited with an alternating current I1 to induce an induced current in the inductive target 121, and the inductive target 121 can be designed to generate a magnetic field in response to the induced current, which in turn generates an induction signal S1 in the receiving coil arrangement 112.

[0112] In step 902, a semiconductor chip 113 is arranged in, on or at the first sensor component 110, wherein the semiconductor chip 113 has an integrated circuit configured to determine a relative position of the second sensor component 120 relative to the first sensor component 110 based on the induction signal S1.

[0113] In step 903, a housing 114 is provided and the semiconductor chip 113 is placed inside the housing 114.

[0114] In step 904, the individual receiving coils 112A, 112B of the receiving coil arrangement 112 are produced by structuring at least two spaced-apart metallization layers 201, 202, which are arranged inside the housing 114 or outside on an outer surface 114a, 114b of the housing 114.

[0115] The embodiments described above merely illustrate the principles of the concept described herein. It is understood that modifications and variations of the arrangements and details described herein will be obvious to other people skilled in the art. Therefore, it is intended that the concept described herein be limited only by the scope of protection of the following patent claims and not by the specific details presented herein by way of description and explanation of the embodiments.

[0116] Although some aspects have been described in connection with a device, it is understood that these aspects also constitute a description of the corresponding process, so that a block or component of a device is also to be understood as a corresponding process step or as a feature of a process step. Similarly, aspects described in connection with or as a process step also constitute a description of a corresponding block, detail, or feature of a corresponding device.

Claims

[1] Inductive angle and / or position sensor (100), comprising: a first sensor component (110) and a second sensor component (120) that is movable relative to it, wherein the first sensor component (110) comprises an excitation coil (111) and a receiving coil arrangement (112) with two or more individual receiving coils (112A, 112B), and wherein the second sensor component (120) comprises an inductive target (121), wherein the excitation coil (111) can be excited with an alternating current (I1) to induce an induced current in the inductive target (121), and wherein the inductive target (121) is configured to generate a magnetic field in response to the induced current, which in turn generates an induction signal (S1) in the receiving coil arrangement (112), wherein the first sensor component (110) comprises a semiconductor chip (113) with an integrated circuit configured to determine a position of the second sensor component (120) relative to the first sensor component (110) based on the induction signal (S1), and a chip package (130) in which the semiconductor chip (113) is arranged, wherein the individual receiving coils (112A, 112B) of the receiving coil arrangement (112) are designed in at least two spaced-apart structured metallization layers (200A, 200B) which are arranged inside the chip package (130) and / or outside on an outer surface (114a, 114b) of the chip package (130), wherein the semiconductor chip (113) has a plurality of integrated chip metallization layers (200A, 200B) arranged in different planes, and wherein at least one of the at least two spaced-apart structured metallization layers in which the receiving coils (112A, 112B) are formed is formed in the form of at least one of the chip metallization layers (200A, 200B). [2] Inductive angle and / or position sensor (100) according to claim 1, wherein the semiconductor chip (113) has a first chip surface (113a) and an opposing second chip surface (113b), wherein contact sections (210) for electrically contacting the semiconductor chip (113) are arranged on the first chip surface (113a), and wherein at least one of the at least two spaced-apart structured metallization layers in which the receiving coils (112A, 112B) are designed is arranged within the chip package (130) and on the second chip surface (113b). [3] Inductive angle and / or position sensor (100) according to claim 2, wherein at least one of the two spaced-apart structured metallization layers in which the receiving coils (112A, 112B) are configured is galvanically connected to at least one of the contact sections (210) on the first chip surface (113a) by means of a chip via (204) which extends through the semiconductor chip (113) between the first chip surface (113a) and the second chip surface (113b). [4] Inductive angle and / or position sensor (100) according to claim 2 or 3, wherein at least one of the at least two spaced-apart structured metallization layers in which the receiving coils (112A, 112B) are configured is galvanically connected to at least one of the contact sections (210) on the first chip surface (113a) by means of an electrically conductive structure (205) extending laterally along a lateral chip outer contour (113c). [5] Inductive angle and / or position sensor (100) according to one of claims 1 to 4, wherein the chip package (130) is implemented as a wafer level (WLP) package (130), wherein the chip package (130) in the fan-in area has a rewiring section (203) with several spaced-apart metallization layers (200A, 200B), and wherein at least one of the at least two spaced-apart structured metallization layers in which the receiving coils (112A, 112B) are designed is within the chip package (130) and is designed in the form of one of the metallization layers (200A, 200B) of the rewiring section (203) in the fan-in area (301). [6] Inductive angle and / or position sensor (100) according to any one of claims 1 to 4, wherein the chip package (130) is implemented as a Wafer Level Ball Grid Array (WLB) Package (130) or as an Embedded Wafer Level Ball Grid Array (eWLB) Package (130), wherein the chip package (130) in the fan-out area (302) has a rewiring section (203) with several spaced-apart metallization layers, and wherein at least one of the at least two spaced-apart structured metallization layers in which the receiving coils (112A, 112B) are designed is within the chip package (130) and is designed in the form of one of the metallization layers of the rewiring section (203) in the fan-out area (302). [7] Inductive angle and / or position sensor (100) according to one of claims 1 to 4, wherein the chip package (130) is implemented as a Wafer Level Ball Grid Array (WLB) Package (130) or as an Embedded Wafer Level Ball Grid Array (eWLB) Package (130), wherein a rewiring section (213) with several spaced-apart structured metallization layers is arranged on a housing surface (114a) of the chip package (130), and wherein at least one of the at least two spaced-apart structured metallization layers in which the receiving coils (112A, 112B) are designed is located outside the chip package (130) and is designed in the form of one of the structured metallization layers of the rewiring section (213) on the housing surface (114a) in the fan-out area (302) and / or in the fan-in area (301). [8] Inductive angle and / or position sensor (100) according to claim 7, wherein electrical contact sections (210) are provided on one side of the chip package (130) opposite the housing surface (114a), and wherein at least one of the two spaced-apart structured metallization layers in which the receiving coils (112A, 112B) are designed is galvanically connected to at least one of the electrical connection contacts (210) by means of a vertical via (304) which extends between the housing surface (114a) and the opposite side through the chip package (130). [9] Inductive angle and / or position sensor (100) according to one of claims 1 to 4, wherein the semiconductor chip (113) is arranged on a substrate (401) and potted with a potting compound, wherein the substrate (401) and the potting compound form the chip package (130), and wherein a metallization (200) with one or more structured metallization layers is arranged on an outer contour surface (114a) of the chip package (130) opposite the substrate (401), and wherein at least one of the at least two spaced-apart structured metallization layers in which the receiving coils (112A, 112B) are designed is outside the chip package (130) and is designed in the form of one of the metallization layers of the metallization (200) arranged on the outer contour surface (114a). [10] Inductive angle and / or position sensor (100) according to claim 9, wherein the chip package (130) has a lateral outer contour surface (114c) between the substrate (401) and the outer contour surface (114a) opposite the substrate (401), wherein an electrically conductive structure (404) is arranged on the lateral outer contour surface (114c), and wherein at least one of the at least two spaced-apart structured metallization layers in which the receiving coils (112A, 112B) are designed is galvanically connected to the substrate (401) by means of this electrically conductive structure (404). [11] Inductive angle and / or position sensor (100) according to one of the preceding claims, wherein the chip package (130) is designed as a printed circuit board, wherein the chip package (130) is directly contacted with electrical terminals (702) without the presence of an additional printed circuit board. [12] Inductive angle and / or position sensor (100) according to one of the preceding claims, wherein the excitation coil (111) is arranged inside the chip package (130) or outside on an outer surface (114a, 114b) of the chip package (130) and is designed in a structured metallization layer (200A, 200B, 200C) by a) the excitation coil (111) is designed in the form of a metallization layer integrated into the semiconductor chip (113), or b) the excitation coil (111) is designed in the form of a metallization layer (200A, 200B, 200C) which is arranged on a second chip surface (113b) of the semiconductor chip (113) which is opposite a first chip surface (113a) which has electrical contact sections (210), or c) the excitation coil (111) is formed in the form of a metallization layer of a rewiring section (203, 213) in the fan-in area, provided that the chip package (130) forms a wafer-level package, or d) the excitation coil (111) is designed in the form of a metallization layer of a rewiring section (203, 213) in the fan-out area, provided that the chip package (130) is designed as a wafer level ball grid array (WLB) package or as an embedded wafer level ball grid array (eWLB) package, or e) the excitation coil (111) is designed in the form of a metallization layer which is arranged on an outer contour surface (114a) of a potting compound forming the chip package (130). [13] Method for manufacturing a housed inductive angle and / or position sensor (100), the method comprising the following steps: Providing a first sensor component (110) and a second sensor component (120) that is movable relative to it, wherein the first sensor component (110) comprises an excitation coil (111) and a receiving coil arrangement (112) with two or more individual receiving coils (112A, 112B), and wherein the second sensor component (120) comprises an inductive target (121), wherein the excitation coil (111) can be excited with an alternating current (I1) to induce an induced current in the inductive target (121), and wherein the inductive target (121) is configured to generate a magnetic field in response to the induced current, which in turn generates an induction signal (S1) in the receiving coil arrangement (112), Arranging a semiconductor chip (113) on the first sensor component (110), wherein the semiconductor chip (113) has an integrated circuit configured to determine a relative position of the second sensor component (120) relative to the first sensor component (110) based on the induction signal (S1), Providing a chip package (130) and arranging the semiconductor chip (113) within the chip package (130), and Generating the individual receiving coils (112A, 112B) of the receiving coil arrangement (112) by structuring at least two spaced-apart metallization layers (200A, 200B) which are arranged inside the chip package (130) or outside on an outer surface (114a, 114b) of the chip package (130), wherein the semiconductor chip (113) has a plurality of integrated chip metallization layers (200A, 200B) arranged in different planes, and wherein at least one of the at least two spaced-apart structured metallization layers in which the receiving coils (112A, 112B) are designed is designed in the form of at least one of the chip metallization layers (200A, 200B).

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