Process for the deposition of metallic materials

Abstract

A method for the continuous deposition of metallic layers from a vapor phase on metallic substrates, preferably metal strips, in particular steel strips, wherein the deposition is carried out in a coating chamber (2) of a coating device (1) under vacuum by passing a substrate (9) essentially vertically through the coating chamber (2), with a deviation of the substrate from the vertical of 0 to 45°, wherein at least one support device (3) is present in the coating chamber (2), which is arranged adjacent to a surface of the substrate (9), wherein a metal to be vaporized is melted in a melting tank (14) and a liquid metal stream is introduced into the coating chamber (2) from a circulation arrangement (8) and guided over the support device (3), wherein the support device (3) is temperature-controlled,so that the liquid metal evaporates in a vacuum and is deposited on the metallic substrate (9) by condensation and / or sublimation, wherein the melting basin (14) is arranged in the circulation arrangement (9) outside the coating chamber (2).

Description

[0001] The invention relates to a method for the continuous deposition of metals and their alloys, in particular zinc and zinc-containing alloys, on metal strips, in particular steel strips according to the preamble of claim 1.

[0002] The surface coating of metallic parts and components has become increasingly important in recent years. In particular, the continuous hot-dip coating of flat products according to DIN EN 10346 has gained outstanding importance for reasons of corrosion protection as a starting material for industrial applications, such as the production of body parts in the automotive industry.

[0003] In this process, steel (e.g., strip and wire) is continuously immersed in a melt of liquid zinc or zinc alloys at temperatures ranging from approximately 450 °C to 600 °C (the melting point of zinc is 419.5 °C). The zinc melt conventionally has a zinc content of at least 99% by mass according to DIN EN 10346. Zinc alloys have correspondingly lower zinc contents. A continuously hot-dip coated steel strip surface has a layer thickness of 4 µm to 45 µm.

[0004] In electrolytic galvanizing (galvanic galvanizing), steel strips or steel plates are immersed in a zinc electrolyte rather than in a zinc melt. The steel to be galvanized serves as the cathode, and a dimensionally stable, insoluble electrode serves as the anode. A current is passed through the electrolyte solution. The zinc, which is present in ionic form (oxidation state +II), is reduced to metallic zinc and deposited on the steel surface. Compared to continuous hot-dip plating, electrolytic galvanizing allows for thinner zinc coatings to be applied. The zinc coating thickness is proportional to the strength and duration of the current flow according to Faraday's law, whereby - depending on the substrate and anode geometry - a coating thickness distribution is created across the entire workpiece.

[0005] Various PVD (physical vapor deposition) processes are also known. PVD is essentially a vacuum-based coating process in which a material to be applied is transferred into the gas phase and then deposited onto the surface to be coated by condensation / sublimation. The most common PVD processes are sputtering and evaporation.

[0006] Sputtering (also known as cathode sputtering) is a physical process in which atoms are released from a solid by bombardment with high-energy ions, primarily noble gas ions, and transferred into the gas phase. In most applications, a direct current gas discharge serves as the ion source. In simple cathode sputtering, an electric field is applied. If a magnetic field is also arranged behind the cathode plate, the process is called magnetron sputtering. In this configuration, all conductive materials can be deposited. Unlike, for example, with thermal evaporation, there is no segregation of alloys. Furthermore, the layers usually adhere better than with vapor-deposited coatings, and large surfaces, such as architectural glass, can be coated homogeneously. Sputter deposition is one of the standard coating techniques and has a wide range of applications in industry.Sputter deposition processes are mainly used to deposit high-melting metals, such as titanium, tungsten and nickel, but also alloys with nickel-aluminum and, when reactive gases are introduced into the coating chamber, also metal oxides, nitrides and carbides.

[0007] An evaporation process can be, for example, thermal evaporation, electron beam evaporation, laser beam evaporation, arc evaporation, or molecular beam epitaxy, or combinations of these. The material to be deposited is heated to temperatures close to its boiling point, for example, electrically, by laser, arc, or ion bombardment. The resulting material vapor migrates through a vacuum chamber to the substrate and condenses / sublimates on the substrate surface, forming a thin material layer. Typical materials for this process are metals, e.g., aluminum, copper, silver, gold, or other materials, such as silicon oxide, indium oxide, or various organic compounds. During evaporation in a vacuum, pressures of 10 -4Pa to 10 Pa is required. The process can also be magnetically assisted by magnetically deflecting charged material particles (e.g., ions or electrons). It is also possible to apply a negative voltage to the substrate to be coated to accelerate the positively charged particles.

[0008] Today, plasma-assisted methods such as ion plating are often used. In this process, high-value metals, in particular, are applied to another metal by cleaning the substrate to be coated using ion bombardment from the plasma and then bringing it into contact with a metal vapor. This vapor partially ionizes in the plasma and is accelerated onto the surface of the preheated substrate by a bias voltage, where it is deposited as a thin layer.

[0009] A device for the continuous galvanizing of cold-rolled steel strip is known from DE 30 35 000 A1. The device enables the optional production of double-sided or single-sided galvanized strip. For this purpose, a dip galvanizing device and a vacuum evaporation device are arranged parallel to each other. In the dip galvanizing device, the strip is galvanized on both sides, whereas for single-sided galvanizing, the dip galvanizing device is shut down and the strip is passed horizontally through the vacuum evaporation device. The zinc is evaporated from the melt. The coating degree is controlled by the evaporation rate and temperature increase of the strip. For a 1 mm thick zinc layer with a single-sided coating using PVD, for example, a temperature increase of 71 °C is set.

[0010] A method for improving a previously galvanized steel sheet is disclosed in DE 38 00 885 C1. In this method, a galvanized steel sheet is passed horizontally through an arrangement consisting of a pretreatment furnace, a gas cooler, a pressure chamber, and two vapor deposition chambers. Each sheet side is individually vapor-coated with zinc and then thermally post-treated.

[0011] A vertical belt conveyor is also known. Such a device for continuous vertical vacuum coating is described in DE 10 2011 085 789 B4. For this purpose, a transport device is arranged in a coating chamber, which moves the substrates to be coated past the coating devices in two superimposed transport paths. In this process, two substrates are coated simultaneously.

[0012] A vertical substrate alignment is described in US 2014 / 0 302 232 A1. This document discloses a coating process in which a substrate is coated on both sides. For this purpose, multiple layers are deposited onto the substrate surface using PVD or CVD. These layers are conductive materials for battery applications, such as lithium, amorphous silicon, or silicon with nanowires. The substrate to be coated is moved vertically, and the evaporated coating material is introduced using a gas distribution mechanism such that the substrate is in contact with the coating material at several points on both sides. The substrate (sheet, strip) is clamped from both sides, and its movement and thus the degree of coating are controlled using a clamping device.

[0013] The disadvantage of conventional continuous PVD processes is that throughput is low, and layer homogeneity across the strip length and width is only achievable with considerable technical effort. Scattered vapor deposition results in high material losses and high maintenance requirements, which are associated with significant costs.

[0014] A zinc evaporator is known from DD 1 60 563 A1, the purpose of which is to prevent the formation of zinc oxide as far as possible. For this purpose, an evaporator with an integrated pre-melting vessel is created. The internal pressure inside the evaporator is increased. The energy required for pre-melting is supplied as condensation heat of the zinc vapor via a partition wall installed between the evaporator and the pre-melting vessel. The vapor outlet is closed, and the liquid melt in the pre-melting vessel drains out via an overflow. The remaining zinc oxide is evaporated after the vapor outlet is opened. A new coating cycle is then started.

[0015] WO 2015 / 015237 A1 discloses a jet evaporation process for zinc. The evaporation device is arranged in the coating chamber in such a way that both processes take place in one chamber. This requires defined pressure differences between the evaporation and coating chambers. The ratio of both pressures should be set to between 2 10 -3 and 5.5·10 -2 lies.

[0016] A process in which evaporation and coating also take place in a single chamber is known from DE 44 42 733 A1. This involves the integration of an evaporator crucible and a condensation channel. The condensation channel is arranged in such a way that it is an integral part of the evaporator crucible or lid.

[0017] A disadvantage of jet evaporation is that zinc layer adhesion is often poor due to the very high local deposition rate. To avoid this, an intermediate layer or adhesion layer is required, which requires an additional evaporation source or an additional pass through the system and is associated with technical and costly effort.

[0018] The object of the invention is to create a deposition process with which metallic materials, in particular zinc-based, can be deposited on metal strips, in particular steel strips, effectively and in a resource-saving manner.

[0019] The problem is solved by the method having the features of claim 1.

[0020] Advantageous further training is indicated in the dependent subclaims.

[0021] The invention provides for a vacuum chamber or coating chamber to be arranged in a coating device. A liquid, heated metal stream, for example, a zinc stream, is generated in the coating chamber, which is then partially vaporized very close to the substrate. The substrate is coated using the resulting metal or zinc vapor. The unused molten metal or zinc is collected and returned to the circulation system. The inevitably formed zinc oxides and slag can be removed, preventing them from remaining in the circulation system.

[0022] "Molten metal" and "metal flow" can be used synonymously. "Molten metal" refers to the liquid state, while "metal flow" refers to the molten metal flowing down a support device.

[0023] The molten metal can, for example, consist of zinc and contain aluminum, magnesium, and / or silicon. It can also consist of aluminum and contain other elements.

[0024] The liquid metal melt is thermally generated from solid metal, which preferably has a melting point below 800 °C, particularly preferably below 600 °C. The metal melt is introduced into the coating chamber and carried down a support device by gravity. Excess metal melt can be collected and recirculated via pumping devices.

[0025] The downward-flowing metal stream can be thermally vaporized. Therefore, it is advantageous if the support device and / or the metal stream are heated. This can be done directly and / or indirectly.

[0026] Indirect heating is defined as heating via heating fields or direct heating of the carrying device.

[0027] Direct heating, for example, refers to conductive heating of the melt stream. Electrical contact can be made at the top and bottom of the metallic melt stream, and the passage of an electric current can further heat the liquid metal.

[0028] It is advantageous if the support device is adjustable so that the inclination and / or distance from the substrate can be adjusted as required. This allows the flow velocity of the liquid metal and the coating rate to be adjusted.

[0029] It is also advantageous if the support device has a surface finish (roughness, waviness) that allows the flow pattern (laminar, turbulent) to be adjusted. This also serves to adjust the flow velocity and the coating rate.

[0030] In one embodiment, it is advantageous to control the metal flow so that it flows over the entire width or a partial width of the support device.

[0031] In one embodiment, it is advantageous if the coating device includes a plasma coupling. By positioning the plasma coupling in the lower, middle, or upper region, or across the entire area of ​​the coating zone, the coating process can be influenced by the plasma and the additional generated evaporation current, resulting in better layer adhesion to the substrate, a finer microstructure of the layer, or a pore-free layer formation. The generated plasma can be used, for example, to adjust the following deposition characteristics: • Plasma coupling in the inlet area of ​​the substrate: application of the first atomic layers after the substrate or steel strip enters the coating zone and thus production of an adhesive layer • Fine-tuning of evaporation, fast and precise adjustment of layer thickness • Evaporation of additional materials which are, for example, in wire or strip form and are evaporated directly in the plasma coupling. • Two coating zones, 1st zone for an adhesive layer (e.g. Cu, Cr or similar) and 2nd zone for the desired layer (e.g. Zn, higher coating)

[0032] In another embodiment, the plasma source can also vaporize high-melting metals such as Ti, Cr, and Si in a plasma. These materials can be supplied in wire or strip form.

[0033] The invention thus relates to a method for the continuous deposition of metallic layers from a vapor phase on metallic substrates, preferably metal strips, in particular steel strips, wherein the deposition is carried out in a coating chamber of a coating device under vacuum by passing a substrate essentially vertically through the coating chamber, wherein at least one carrying device is present in the coating chamber, which is arranged adjacent to a surface of the substrate, wherein a liquid metal stream is guided over the carrying device in order to evaporate the liquid metal in the vacuum and to deposit it on the metallic substrate by condensation and / or sublimation.

[0034] In an advantageous embodiment, the liquid metal is guided over two carrying devices on both sides of the substrate, wherein the metal is evaporated by means of at least one of the carrying devices, so that the carrying device is designed as an evaporation device.

[0035] In a further advantageous embodiment, a carrying device is used which is designed as a net, fleece, chain net or a plate.

[0036] It is advantageous to use a support device that corresponds to or is wider than the width of the substrate.

[0037] It is also advantageous if the flow velocity of the liquid metal along the support device is influenced by the surface condition, in particular a roughness and / or a waviness.

[0038] Advantageously, a support device is used which has a concave surface towards the broad side of the substrate.

[0039] In an advantageous embodiment, the inclination and / or the distance of the support device from the substrate is adjusted by means of at least one adjusting device at the lower and / or upper end of the support device.

[0040] In a further advantageous embodiment, a plasma is coupled between the substrate and the support device.

[0041] In a particularly advantageous embodiment, the liquid metal is circulated, whereby the liquid metal stream is guided down the carrying device, the unused metal is collected and fed back into circulation.

[0042] The invention also relates to a device for carrying out a method described above, wherein a coating chamber is provided which comprises at least one support device, wherein the support device is arranged adjacent to a surface of the substrate.

[0043] It is advantageous if the support device is designed to be adjustable with regard to its inclination and / or with regard to the distance from the substrate.

[0044] It is also advantageous if at least one supply channel and one outflow channel are present on the support device.

[0045] In an advantageous embodiment, the coating chamber comprises at least one collecting container and at least one circulation arrangement for the liquid metal stream.

[0046] In a further advantageous embodiment, the supply channel and the outflow channel are arranged on the support device in such a way that the metal flow is arranged flowing on the support device following the force of gravity.

[0047] In a particularly advantageous embodiment, a plasma coupling is arranged between the substrate and the support device.

[0048] The invention is explained by way of example with reference to a drawing. It shows: Fig. 1: A coating device according to the invention; Fig. 2: A coating device with additional plasma coupling; Fig. 3: A support device with variable distance to the substrate; Fig. 4: A coating device with integrated liquid metal melt circuit.

[0049] The Fig. 1 to 4 show a coating device 1 according to the invention. The coating device 1 comprises a coating chamber 2 and at least two vacuum locks. At least one support device 3 is arranged in the coating chamber 2. At least one supply channel 4 and one discharge channel 5 are provided on the support device 3. Furthermore, the coating chamber 2 comprises at least one collecting container 6, at least one adjustment device 7, and at least one circulation arrangement for the liquid metal stream 8.

[0050] The substrate 9 is fed into and removed from the coating chamber 2 via vacuum locks. The vacuum locks are located outside the coating chamber 2. The substrate 9 is conveyed essentially vertically through the coating chamber 2 along a substrate conveying direction 10. "Essentially vertical" means that the deviation of the substrate from the vertical is 0 to 45°, preferably 0 to 10°.

[0051] It is advantageous if the substrate 9, in particular a steel strip, is passed vertically through the coating chamber 2.

[0052] In one possible embodiment, a vertically aligned support device 3 is adjustably arranged on both sides of the substrate 9. The support device 3 can be designed, for example, as a net, chain net, fleece or a plate. Furthermore, the support device 3 can be designed with concave or parabolic surfaces in the substrate direction. This can lead to a more uniform coating across the strip width. The inclination and the distance of the support device 3 to the substrate can be adjusted by means of an adjusting device 7. The adjusting device 7 can be arranged at the lower and / or upper end of the support device 3. A distance between the support device 3 and the substrate 9 reduced by means of the adjusting device 7 is in Fig. 3 shown.

[0053] The lower end of the carrying device 3 is located in a collecting container 6, which is connected to an outflow channel 5.

[0054] At the upper end of the support device 3, a supply channel 4 is arranged, in particular horizontally. The transition from horizontal to vertical is achieved via a connecting element 11. The connecting element 11 can be designed, for example, as a nozzle, a guide plate, a weir or similar ( Fig. 3).

[0055] In a further embodiment, a plasma coupling 12 can be arranged between the substrate 9 and the support device 3. It is particularly advantageous if the plasma coupling 12 is located in the lower, middle, or upper region, or the entire region of the support device 3, depending on the desired deposition feature. The following deposition features can be achieved: • Plasma coupling in the lower area: application of the first atomic layers after the substrate 9 enters the coating area and thus production of an adhesive layer (with the strip running direction from top to bottom, the plasma coupling is located at the top); • Plasma coupling over the entire area: fine-tuning of the evaporation, precise and fast adjustment of the layer thickness; • Plasma coupling where additional materials, e.g. in wire or ribbon form, are to be evaporated in a plasma.

[0056] In Fig. Figure 4 shows an exemplary coating device 1 according to the invention with a circulation arrangement for the liquid metal stream 8. The circulation arrangement 8 comprises at least one supply channel 4, at least one discharge channel 5, a collecting and melting basin 14, at least one pump 15, a line 16 for the melt, a heat source 17 for reheating the melt, and an equalizing vessel 18.

[0057] The collecting and melting basin 14 can contain a pre-melting basin 14a. Solid metal can be recharged into the pre-melting basin 14a and melted there. The pre-melting basin is separated from the collecting and melting basin 14 by a barrier wall with an opening below the surfaces of the molten metals, so that they act as communicating vessels. The advantage of the pre-melting basin is the homogenization of the molten metal and the easy separation of slag, which may be present as contaminants in the recharging blocks or granules and can be easily removed from the surface of the molten metal in the pre-melting basin 14a.

[0058] The feed channel 4 runs horizontally and connects the circulation arrangement 8 to the coating chamber 2. The feed opening 19 of the feed channel 4 is located inside 20 of the coating chamber 2. The support device 3 is arranged vertically below the feed opening 19. The transition from the horizontal to the vertical orientation takes place via the connecting element 11. The lower end of the support device 3 is located in the collecting container 6. The outflow channel 5, which connects the collecting container 6 and the collecting and melting basin 14, leads from the collecting and melting basin 14. The pump 15 is arranged inside the collecting and melting basin 14. The pump 15 is a pump for liquid metals and their alloys, e.g., a conventional zinc pump in the case of zinc. The pump 15 and the compensation vessel 18 for the liquid melt are connected by a line 16. The line 16 is insulated and the molten metal is heated by the heat source 17.

[0059] The heat source 17 may, for example, be an electromagnetic inductor.

[0060] The melt circulation is closed by the supply channel 4 extending into the interior of the compensation vessel 18. Thus, the supply channel 4 connects the interior of the compensation vessel 18 with the interior 20 of the coating chamber 2.

[0061] The inventive deposition of metallic materials occurs when the molten metal flows down the support device 3 and is heated in the process. The heating of the metal stream 21 generates a metal vapor 23. The vaporization of the metal takes place close to the substrate 9. A temperature gradient exists between the substrate surface and the metal vapor 23, so that the substrate surface has a lower temperature than the metal vapor 23. The hot metal molecules impact the substrate surface and condense / sublimate.

[0062] The adhesion of the deposited metal layer can be enhanced using plasma. An additional plasma coupling 12 improves the adhesion of the first atomic layers to the substrate surface.

[0063] The coating rate can be adjusted via the temperature of the support device 3 or the metal stream 21. Higher temperatures result in higher layer thicknesses. Lower temperatures result in thinner layer thicknesses and thus lower coating rates.

[0064] The coating rate can also be adjusted by the distance between the support device 3 and the substrate 9. A reduced distance or coupling of the plasma leads to higher coating rates. A greater distance results in lower coating rates.

[0065] The flow velocity of the metal stream 22 can be adjusted via the inclination and / or the surface condition (roughness, waviness) of the support device 3. A small inclination and / or a high surface roughness can slow the flow velocity and influence the flow pattern (turbulent or laminar) of the metal stream 21.

[0066] The unused metal stream 21 is collected at the bottom of the collecting container 6. From the collecting container 6, the collected molten metal flows through the outflow channel 5 along the circulation direction 22 into the collecting and melting container 14.

[0067] From the collecting and melting tank 14, the liquid metal is pumped upward into line 16 by a pump 15. Metal oxides and slag are removed and thus do not enter line 16. To keep the molten metal liquid, line 16 is insulated, and the melt is heated by a heat source 17, in particular an inductor.

[0068] At the end of the molten metal line 16, the liquid metal reaches the compensation vessel 18.

[0069] The circulation is closed by the molten metal flowing from the compensation vessel 18 into the feed channel 4 and then exiting at the end of the feed channel 4 through the feed opening 19. Due to the action of gravity, the metal stream 21 is conveyed downwards along the support device 3.

[0070] Accordingly, the metal stream 21 flows in the direction of circulation 22 into the vacuum or into the interior 20 of the coating chamber 2 and out of the vacuum or into the circulation arrangement 8.

[0071] The invention is explained by way of example using an embodiment with a zinc coating of a coating number Z200, according to DIN EN 10346.

[0072] A steel strip with a Z200 zinc coating, corresponding to a layer thickness of 14 µm and a strip width of 1 m, is conveyed through coating device 1. The strip speed is 3 m / s. During this process, 600 g of zinc are deposited onto the steel surface per 1 s. This results in a zinc evaporation rate of 2160 kg / h.

[0073] To ensure good wetting of the support device 3, in particular a fleece, the zinc stream 21 should have approximately ten times the mass per unit of time in relation to the evaporated mass. For this purpose, 21.6 tons of zinc (approximately 3m 3 ) per hour. This corresponds to 360 kg / min, or approximately 50.4 l / min.

[0074] The advantage of the process according to the invention is that it is resource-saving because the unused zinc is returned to the zinc cycle.

[0075] Another advantage is that the disruptive zinc oxides can be removed from the process without significant mechanical effort or expense.

[0076] The process according to the invention enables high coating rates with uniform coating across the entire strip width. The strip width can be easily varied.

[0077] Another advantage is that good layer adhesion is achieved through plasma-assisted vapor deposition of at least the first few atomic layers. Plasma-assisted means that, in addition to thermal energy, particles are transferred from the metal stream into the gas phase using a plasma. The particle energy is higher than with purely thermal vapor deposition and generally results in better adhesion of the layer to the substrate.

[0078] The method according to the invention enables an energy-efficient coating process because the arrangement according to the invention results in only minimal scattering losses.

[0079] Furthermore, it is advantageous that the coating device 1 has a simple design. There are few or no moving parts. Furthermore, the volume to be evacuated is kept small.

[0080] Of course, it is also possible to install multiple coating devices in series. A modular design is also possible, with two or more coating chambers mounted within the coating device, allowing for thicker coatings and / or the deposition of multiple layers.

Claims

[1] A method for the continuous deposition of metallic layers from a vapor phase on metallic substrates, preferably metal strips, in particular steel strips, wherein the deposition is carried out in a coating chamber (2) of a coating device (1) under vacuum by passing a substrate (9) essentially vertically through the coating chamber (2), with a deviation of the substrate from the vertical of 0 to 45°, wherein at least one support device (3) is present in the coating chamber (2), which is arranged adjacent to a surface of the substrate (9), wherein a metal to be evaporated is melted in a melting tank (14) and a liquid metal stream is introduced into the coating chamber (2) from a circulation arrangement (8) and guided over the support device (3), wherein the support device (3) is temperature-controlled,so that the liquid metal evaporates in a vacuum and is deposited on the metallic substrate (9) by condensation and / or sublimation, wherein the melting basin (14) is arranged in the circulation arrangement (9) outside the coating chamber (2). [2] Method according to claim 1, characterized by that the liquid metal is guided over two carrying devices (3) on both sides of the substrate (9), wherein the metal is evaporated by means of at least one of the carrying devices (3), so that the carrying device (3) is designed as an evaporation device. [3] Method according to one of the preceding claims, characterized by that a carrying device (3) is used which is designed as a net, fleece, chain net or a plate. [4] Method according to one of the preceding claims, characterized by that a support device (3) is used which corresponds to the width of the substrate (9) or is wider. [5] Method according to one of the preceding claims, characterized by that the flow rate of the liquid metal along the support device (3) is influenced by the surface condition, in particular a roughness and / or a waviness. [6] Method according to one of the preceding claims, characterized by that a support device (3) is used which has a concave surface towards the broad side of the substrate. [7] Method according to one of the preceding claims, characterized by that at the lower and / or upper end of the support device (3) the inclination and / or the distance of the support device (3) to the substrate (9) is adjusted by means of at least one adjusting device. [8] Method according to one of the preceding claims, characterized by that a plasma is coupled between the substrate (9) and the support device (3). [9] Method according to one of the preceding claims, characterized bythat the liquid metal is circulated, wherein the liquid metal stream (21) is guided down the carrying device (3), the unused metal is collected and fed back into circulation. [10] Device for carrying out a method according to one of the preceding claims, characterized by that a coating chamber (2) is provided which comprises at least one support device (3), wherein the support device (3) is arranged adjacent to a surface of the substrate (9), wherein a circulation arrangement for a liquid metal stream (8) is arranged outside the coating chamber (2), wherein the circulation arrangement (8) comprises a melting tank (14), wherein the coating chamber (2) is connected to the circulation arrangement (8) via a supply channel (4) and an outflow channel (5). [11] Device according to claim 10, characterized bythat the support device (3) is adjustable with respect to its inclination and / or with respect to the distance from the substrate. [12] Device according to claim 10 or 11, characterized by that at least one supply channel (4) and one outflow channel (5) are present on the support device (3). [13] Device according to one of claims 10 to 12, characterized by that the coating chamber (2) comprises at least one collecting container (6) and at least one circulation arrangement for the liquid metal stream (8). [14] Device according to one of claims 10 to 13, characterized by that the supply channel (4) and the outflow channel (5) are arranged on the support device (3) in such a way that the metal flow is arranged flowing on the support device (3) following the force of gravity. [15] Device according to one of claims 10 to 14, characterized by that a plasma coupling (12) is arranged between the substrate (9) and the support device (3).

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