Component support structure, connectable by electrically conductive connecting medium in recess with cavity and surface profile

Abstract

A component carrier (100), comprising: a first component support structure (104) comprising a first stack (102) comprising at least one first electrically conductive layer structure (106) and at least one first electrically insulating layer structure (108), wherein the at least one first electrically conductive layer structure (106) comprises a first contact element (107) extending to a first contact surface (109) of the first stack (102); an electrically conductive connecting medium (118) directly connected to the first contact element (107) at the first contact surface (109) by filling at least one recess (120) of the first contact element (107), wherein the at least one recess (120) comprises a larger dimensioned cavity bounded by a smaller dimensioned surface profile and further comprising: a component trained as Bare The (140); wherein the electrically conductive connecting medium (118) connects the first contact element (107) directly to the component (140) at the first contact surface (109) by filling at least one recess (120, 120') of the first contact element (107) and the component (140).

Description

Technical field

[0001] The invention relates to a component carrier. Furthermore, the invention relates to a method for manufacturing a component carrier. Technological background

[0002] In connection with the increasing product functionalities of component carriers equipped with one or more electronic components, the increasing miniaturization of these components, and the growing number of components to be mounted on the component carriers, such as printed circuit boards (PCBs), increasingly powerful array-like components or packages (assemblies, housings) are being used. These packages contain multiple components and feature a multitude of contacts or connections with ever smaller spacing between them. Dissipating the heat generated by such components and the component carrier itself during operation is becoming increasingly difficult. At the same time, the component carriers must be mechanically robust and electrically reliable to operate even under harsh conditions.

[0003] One disadvantage of laminated component carriers is that they are susceptible to delamination, warping and / or other phenomena that can affect the reliability of the component carrier.

[0004] From JP 2003-179 321 A a printed circuit board, a multilayer printed circuit board and a method for manufacturing a printed circuit board are known.

[0005] From US 2005 / 0155792 A1, a multilayer printed circuit board, a base for multilayer printed circuit boards, a printed circuit board and their manufacturing process are known. Summary

[0006] It is an object of the invention to provide a component carrier that is easy to manufacture and offers high reliability. This object is achieved by the subject matter according to the independent claims. Further embodiments are described in the dependent claims.

[0007] According to an exemplary embodiment, a component carrier is provided comprising a first component carrier structure, which has a first stack comprising at least one first electrically conductive layer structure and at least one first electrically insulating layer structure, wherein the at least one first electrically conductive layer structure comprises a first contact element extending to a first contact surface of the first stack, and an electrically conductive connecting medium (terminal medium) that is directly connected to the first contact element at the first contact surface by filling at least one recess of the first contact element, wherein the at least one recess comprises a larger-dimensioned cavity bounded by a smaller-dimensioned surface profile, and which further comprises: a component designed as a Bare Die,wherein the electrically conductive connecting medium connects the first contact element directly to the component at the first contact surface by filling at least one recess of the first contact element and the component (see, for example, , Fig. 9) For example, a heat sink or a chip can be connected to a component carrier structure, such as a PCB. Thus, a connection between a component and a component carrier structure can also be established in the manner described. In such a configuration, the component can be surface-mounted on the component carrier structure or embedded within it.

[0008] According to a further exemplary embodiment, a method for manufacturing a component carrier is provided, wherein the method comprises forming a first component carrier structure having a first stack having at least one first electrically conductive layer structure and at least one first electrically insulating layer structure, wherein the at least one first electrically conductive layer structure has a first contact element extending to a first contact surface of the first stack, and directly connecting the first contact element at the first contact surface to an electrically conductive connecting medium by filling at least one recess of the first contact element with the electrically conductive connecting medium, wherein the at least one recess comprises a larger-dimensioned cavity bounded by a smaller-dimensioned surface profile.the method further comprises: providing a component designed as a bar, and directly connecting the first contact element at the first contact surface to the component by filling at least one recess of the first contact element and the component with the electrically conductive connecting medium. Overview of the embodiments

[0009] In the context of the present application, the term "component carrier" can, in particular, refer to any support structure capable of accommodating one or more components on and / or within it to provide both mechanical support and / or electrical connectivity. In other words, a component carrier can be configured as a mechanical and / or electronic support for components. In particular, a component carrier can be a (printed) printed circuit board (PCB), an organic interposer, or an integrated circuit (IC) substrate. A component carrier can also be a hybrid board or panel that combines several of the aforementioned component carrier types.

[0010] In the context of the present application, the term "component support structure" can, in particular, refer to a film or sheet that is processed in the manufacture of component supports, for example, a stacked layer sequence, a panel, or an array. It is also possible for a component support structure to be a printed circuit board (PCB) or a substack of a PCB to be manufactured. In particular, a component support can be manufactured by joining a plurality of component support structures.

[0011] In the context of the present application, the term "stack" can, in particular, refer to an arrangement of several planar layered structures arranged parallel to one another. The layered structures of the stack can be joined by lamination, i.e., by the application of heat and / or pressure.

[0012] In the context of the present application, the term “layer structure” may in particular refer to a continuous layer, a structured layer or a plurality of non-consecutive islands within a common plane.

[0013] In the context of the present application, the term "contact surface" may in particular refer to a main surface of a component support structure, in particular at least one contact element thereof, at which the component support structure is to be connected to a corresponding contact surface of another body (such as another component support structure or a component), in particular at least one further contact element thereof.

[0014] In the context of the present application, the term ‘contact element’ may in particular denote a section or part of at least one electrically conductive layer structure of a stack of a component support structure which is exposed on a stack surface in order to be suitable for establishing an electrically conductive connection with another contact element by means of an intermediate electrically conductive connecting medium.

[0015] In the context of the present application, the term "recess" may in particular refer to any hollow volume, depression or blind hole on a contact surface section of an electrically conductive contact element.

[0016] In the context of the present application, the term “larger-dimensioned cavity bounded by a smaller-dimensioned surface profile” may, in particular, mean (i) that the cavity has larger structural dimensions (such as the depth and width of the cavity) than the smaller structures (such as the widths and top-to-bottom spacing of alternating ridges and depressions of the surface profile) that define the surface profile. It may further mean (ii) that the structural or spatial boundaries of the cavity are defined by the surface profile, such that the walls of the cavity exhibit the surface profile. While the cavity mainly determines the shape and size of the recess, the surface profile may add a wave structure, vibrations, ripples, pronounced roughness, or unevenness to the edges of the cavity, which may be superimposed on or modulated by the cavity.The surface profile can be a regular surface profile with a repeating sequence of depressions and ridges of a specific width and height. Alternatively, the surface profile can be an irregular surface profile with a random or unordered sequence of depressions and ridges exhibiting varying widths and heights. In particular, the cavity can be concave. The surface profile can be a sequence of small hills and valleys alternating along a curved surface that bounds the cavity. In particular, the cavity can be a hollow space whose volume or characteristic dimensions are larger than (in particular, at least twice, and in particular, at least three times) the volumes or characteristic dimensions of the surface profile structures.

[0017] According to an exemplary embodiment, a component carrier is provided that comprises a stackable component carrier structure with suitable adhesion and a reliable electrical connection at a connection interface between the component carrier structure and another body (such as another component carrier structure or a component). This can be achieved by an electrically conductive connecting medium, such as a metallic paste, which bridges a hollow space between the electrically conductive contact element of the component carrier structure, exposed at its contact surface, and the body. Advantageously, one or both of the opposing contact surfaces of the contact element and the other body can be provided with a recess defined by a (more macroscopic) cavity bounded by a (more microscopic) surface profile with pronounced irregularities.During the joining of the component carrier structure and the body, one or more recesses can be filled with the electrically conductive bonding medium to establish reliable electrical coupling and a strong mechanical connection between the component carrier structure and the body. Advantageously, the component carrier can be made significantly more robust against shear forces that promote lateral movement between the joined component carrier structure and the body. This significantly reduces the tendency for delamination of components within the component carrier. In simpler terms, the described geometry of the recess(es) can be described as a highly roughened depression that improves the overall bond strength of the component carrier.

[0018] The following section describes in more detail the aforementioned effect in connection with shear forces using an example of the lateral orientation of vias between the component support structure and the body, which is designed as another component support structure (see, for example, Fig. 1 and Fig. 1A): It is highly advantageous for two opposing vias to be properly aligned to prevent the loss of via-via connections. Shear stress-induced slippage of the two stacks can lead to misaligned vias, which can impair the transmission of current and / or signals. This problem can occur particularly during lamination and describes the slippage of the connecting surfaces of opposing stacks (or the like) relative to each other. As a result, vias may not be properly aligned using conventional methods, and different layers may lose their connection to each other. By providing the cavity (which may preferably be circular), stress concentrations can be avoided and alignment improved.

[0019] An exemplary embodiment of the invention therefore provides a roughened recess at a connection interface of a component carrier structure, which is to be filled with an electrically conductive filler medium, for the creation of a reliable and short-path z-connection between the component carrier structure and the further body. In particular, the creation of a roughened via pad surface can be advantageous, which can be produced, for example, by etching using a photomask. Advantageously, this allows for very reliable adhesion between copper pads and conductive paste. In other words, the rough recess can define an inverse geometry for the encapsulation of conductive paste or other types of electrically conductive connecting media.

[0020] Further exemplary embodiments of the component carrier and the method are explained below.

[0021] In one embodiment, the component carrier comprises a further body, wherein the electrically conductive connecting medium directly connects the first contact element to the further body at the first contact surface by filling at least one recess of the first contact element and optionally of the further body. Similarly, the method can include directly connecting the first contact element to the further body at the first contact surface by filling at least one recess of the first contact element and optionally of the further body with the electrically conductive connecting medium.

[0022] In one embodiment, the further body is a second component support structure comprising a second stack, which has at least one second electrically conductive layer structure and at least one second electrically insulating layer structure, wherein the at least one second electrically conductive layer structure has a second contact element extending to a second contact surface of the second stack. The electrically conductive connecting medium can directly connect the first contact element at the first contact surface to the second contact element at the second contact surface by filling the at least one recess of the first contact element and optionally of the second contact element (see, for example, [reference]). Fig. 1 and Fig. 1A). In the context of the present application, the term “electrically conductive joining medium that directly connects contact elements” can, in particular, mean that only or substantially only the electrically conductive joining medium (for example, a metallic paste) fills a space between opposing contact surface areas of the contact elements. For example, two printed circuit boards (PCBs) can be reliably joined in the manner described without the risk of delamination caused by shear forces.

[0023] In one embodiment, the cavity has a (vertical) depth of at least 10 µm, in particular at least 15 µm. With such cavity dimensions, the component carrier can be made robust against shear forces that tend to unintentionally separate the interconnected component carrier structures. The depth of the cavity can, for example, be less than 50 µm. A (horizontal) width of the cavity can be at least 20 µm, in particular at least 30 µm. This width can be less than 80 µm.

[0024] In one embodiment, the surface profile has an average top-to-bottom distance of at least 2 µm, and in particular at least 4 µm. Specifically, the term "average top-to-bottom distance" of the surface profile can refer to an averaged vertical distance between a projection and a directly adjacent recess of the surface profile. The top-to-bottom distance can be determined by averaging several values ​​of the vertical distance of the surface profile along the cavity in a cross-sectional view of the component carrier. In particular, at least five, and in particular all, pairs of projections and adjacent recesses of the cavity can be considered for determining the average value.To put it simply, such a surface profile can create a pronounced mechanical interlock between the material of the respective contact element and the material of the electrically conductive connecting medium, which penetrates into tiny valleys of the surface profile.

[0025] In one embodiment, the surface profile has an average top-to-bottom distance of no more than 15 µm, in particular no more than 10 µm, preferably no more than 8 µm, or even no more than 6 µm. Such an upper limit on the peaks and valleys of the surface profile ensures that a sufficiently large amount of electrically conductive connecting medium can be present in the recess to create a low-resistance and mechanically robust connection.

[0026] For example, the surface profile may exhibit individual values ​​for the top-to-bottom distance between adjacent depressions and elevations of the surface profile in a range of 2 µm to 8 µm, particularly in a range of 4 µm to 6 µm. More precisely, at least 80% of the individual values ​​for the top-to-bottom distance between adjacent depressions and elevations of the surface profile may lie in a range of 2 µm to 8 µm, particularly in a range of 4 µm to 6 µm.

[0027] In one embodiment, the cavity has a substantially round shape. This can advantageously suppress stress concentration, as it prevents local stress concentration at sharp edges. A key advantage of a round shape is that the stress can be distributed evenly across the cavity's surface. Furthermore, a round cavity ensures favorable interference energy, a sufficiently large contact area, and good geometric stability. Alternatively, the cavity can also have a substantially rectangular shape, preferably with rounded corners. This can lead to good encapsulation of the electrically conductive connection medium and excellent properties with respect to electrical coupling and mechanical connection. Preferably, a rectangular cavity can be anchored deep within the via.

[0028] Preferably, the cavity should be free of sharp edges. This can prevent stress concentration. Therefore, the use of rounded surfaces or rounded corners is preferable.

[0029] In one embodiment, a first recess is formed in the first contact element and a second recess is formed in the second contact element (aligned with the first element) or in the component, with both the first and second recesses being filled with the electrically conductive connecting medium. If both contact elements are provided with recesses facing each other, a positive connection on both sides can be achieved between the electrically conductive connecting medium and the component support structures or the component. This can strengthen both the electrical coupling and the mechanical connection between the component support structures and strongly suppress a tendency toward delamination, even under shear forces. Furthermore, this can improve the alignment of the opposing contacts, thus maintaining good connections.Shear stress-induced slippage of vias and other structures can ensure a proper connection to avoid stress concentrations.

[0030] In one embodiment, the electrically conductive bonding medium is a viscous, deformable medium, such as an electrically conductive paste, particularly a silver paste or a copper paste. Generally, the electrically conductive bonding medium can be a malleable, pasty, freely formable, or even semi-flowable material. A metallic paste, especially one containing metallic particles and a solvent (which can be evaporated upon heating), is a good choice for the electrically conductive bonding medium. This enables the electrically conductive bonding medium to reliably (and preferably completely) fill the recess(s), including small gaps in the surface profile. It is also possible for the electrically conductive bonding medium to comprise an electrically conductive polymer.

[0031] In one embodiment, at least one of the first contact elements and the second contact element contributes to an electrically conductive vertical through-connection (via) for the vertical connection of the first component carrier structure and the second component carrier structure. Such an electrically conductive vertical through-connection can, for example, be an array of vertically stacked vias in one or both of the connected component carrier structures, wherein the stacked vias are connected to the electrically conductive connection medium. This allows for the creation of a short-path electrical connection between the interconnected component carrier structures. This minimizes signal losses and ensures a compact design of the component carrier.

[0032] In one embodiment, the first contact element and / or the second contact element can be a via, in particular a via with tapered sidewalls. Such a via can, for example, be a copper-filled laser via. In a preferred embodiment, the electrically conductive connecting medium can thus form an electrically conductive bridge between two opposing vias for the interconnected contact elements of the component carrier structures.

[0033] In one embodiment, the component carrier comprises a dielectric film (plate, sheet) with at least one through-hole filled with the electrically conductive connecting medium, wherein the dielectric film is arranged between the first component carrier structure and the second component carrier structure or the component. Each through-hole can correspond to a pair of aligned contact elements of the component carrier structures or to a component to be connected. The dielectric film can form a planar, electrically insulating matrix to provide an electrically conductive connecting medium precisely where it is required to create an electrically conductive Z-connection, without creating unintended electrically conductive paths elsewhere.

[0034] In one embodiment, the dielectric film comprises or consists of an adhesive material, in particular prepreg or resin. Accordingly, the method can include providing the dielectric film with a curable material and at least partially curing the curable material of the dielectric film when joining the first component support structure to the second component support structure with the intervening dielectric film. If the dielectric material of the film is adhesive, it can bond parts of the component support structures between the contact elements to be joined by the electrically conductive connecting medium.When an uncured resin material (such as that present in prepreg material before curing) of the dielectric film is cured by pressing the component support structures together with the intervening dielectric film, with or without additional heat input, the curing of the resin material can create an adhesive bond between the component support structures through lamination. Generally, such curing can be triggered by the application of mechanical pressure and / or the input of heat energy.

[0035] In one embodiment, the method comprises filling the electrically conductive connecting medium into the at least one recess when connecting the first component support structure to the second component support structure or to the component. Thus, by connecting the component support structures to one another (preferably by laminating with an intervening curable dielectric film) and introducing the preferably pasty, electrically conductive connecting medium into one or more recesses by applying mechanical pressure, a reliable mechanical and electrical connection between the connected component support structures can be established. Both the electrical and the mechanical connection can be established simultaneously, i.e., in a single process, and therefore in a simple and rapid manner.

[0036] In one embodiment, the method comprises providing the electrically conductive connecting medium in at least one through-hole of a dielectric film prior to connecting the first component support structure to the second component support structure or to the component with the intervening dielectric film (containing the electrically conductive connecting medium). Preferably, a pasty, electrically conductive connecting medium can first be introduced (for example, dispensed) into pre-formed through-holes of the dielectric film before the dielectric film filled with metal paste is inserted between the component support structures to be electrically and mechanically connected.

[0037] In one embodiment, the method comprises forming the at least one through-hole in the dielectric film by drilling, in particular by laser drilling. Laser drilling, in particular, is a simple, reliable, and precise method for defining the position of one or more through-holes in the dielectric film in alignment with an array of contact element pairs that are to be electrically connected to one another by an electrically conductive connecting medium in the one or more through-holes. As an alternative to laser drilling, mechanical drilling, punching, and etching are also possible for producing the through-hole(s).

[0038] In one embodiment, the method comprises filling the at least one through-hole of the dielectric film with an electrically conductive filling medium in the form of a paste (for example, copper paste or silver paste). Such a pasty, electrically conductive filling medium can be deformable or malleable so that it neatly fills substantially the entire recess(s), including minute gaps that form the surface profile. Electrically conductive polymers can also be used as the filling medium because they are both adhesive and electrically conductive.

[0039] In one embodiment, the method comprises forming the at least one recess by etching the first contact element at the first contact surface and / or the second contact element at the second contact surface. Thus, the cavity and the surface profile can be created by etching. Alternatively to etching, drilling (in particular mechanical drilling or laser drilling) or grinding is also possible. The recess is preferably formed by etching to achieve a high surface roughness, which promotes adhesion between the filler medium and the via surface. However, it is also possible to produce these recesses by drilling (laser and mechanical drilling) as well as by grinding the via surface with a small grinding (and / or drilling) head. With the latter methods, the adhesion between the filler medium and the via surface can be advantageously pronounced, since a roughened surface profile can also be achieved with these methods.For this purpose, wet etching and / or plasma etching can be performed, for example. Isotropic and / or anisotropic etching processes can also be carried out. Adjusting the etching parameters (e.g., etchant, additives, etching time, conditions such as etching temperature, etc.) can advantageously allow for the adaptation of the shape and dimensions of the cavity and the surface profile. For example, a more aggressive etching strategy can lead to a deeper recess and / or steeper sidewalls of the recess.

[0040] In one embodiment, the method comprises covering a portion of the first contact surface and / or a portion of the second contact surface with an etch protection structure during etching. The etch protection structure can be temporary and removed from the respective component carrier structure after etching. In other words, such an etch protection structure can be a structured mask (for example, a photomask) that defines which surface areas of the contact elements of the component carrier structures to be joined are to be etched and which other surface areas are to be protected from etching. In particular, dielectric surface areas of the opposing contact surfaces can be protected from etching.However, it is also possible to partially cover a given contact element with the etch protection structure (for example, selectively covering an outer ring section) in order to correctly define the dimensions and shape of the recess. Alternatively, a protective structure can be used that protects specific areas against drilling (especially mechanical drilling or laser drilling) or grinding.

[0041] In one embodiment, the component carrier comprises a stack of at least one electrically insulating layer structure and at least one electrically conductive layer structure. The component carrier can, for example, be a laminate of the aforementioned electrically insulating layer structure(s) and electrically conductive layer structure(s), formed in particular by the application of mechanical pressure and / or thermal energy. The stack can provide a plate-shaped component carrier that offers a large mounting surface for additional components while remaining very thin and compact. The term "layer structure" can, in particular, refer to a continuous layer, a structured layer, or a plurality of non-consecutive islands within a common plane.

[0042] In one embodiment, the component carrier is shaped like a plate. This contributes to a compact design, while still providing a large base for mounting components. Furthermore, a bare die, in particular, can be conveniently embedded in a thin plate, such as a printed circuit board, thanks to its small thickness, as an example of an embedded electronic component.

[0043] In one embodiment, the component carrier is configured as one of the group consisting of a printed circuit board, a substrate (in particular an IC substrate) and an interposer.

[0044] In the context of the present application, the term "printed circuit board" (PCB) can, in particular, refer to a plate-shaped component carrier formed by laminating several electrically conductive layer structures with several electrically insulating layer structures, for example, by applying pressure and / or by supplying thermal energy. Preferred materials for PCB technology are copper for the electrically conductive layer structures, while the electrically insulating layer structures may comprise resin and / or glass fibers, so-called prepreg or FR4 material.The various electrically conductive layer structures can be interconnected as desired by creating through-holes through the laminate, for example by laser drilling or mechanical drilling, and filling them with electrically conductive material (especially copper), thus creating vias. Apart from one or more components that may be embedded in a printed circuit board (PCB), a PCB is typically configured so that one or more components can be placed on one or both opposing surfaces of the board. They can be connected to the respective main surface by soldering. A dielectric part of a PCB may be composed of resin with reinforcing fibers (such as glass fibers).

[0045] In the context of the present application, the term "substrate" can, in particular, refer to a small component carrier. A substrate can be a component carrier that is comparatively small in relation to a printed circuit board (PCB), on which one or more components can be mounted and which can serve as a connecting medium between one or more chips and another PCB. A substrate can, for example, be essentially the same size as a component to be mounted on it (in particular an electronic component) (for example, in the case of a Chip Scale Package (CSP)). More precisely, a substrate can be understood as a carrier for electrical connections or electrical networks, as well as a component carrier, comparable to a printed circuit board (PCB), but with a significantly higher density of laterally and / or vertically arranged connections.Lateral connections include, for example, conductive traces, while vertical connections can be, for example, holes. These lateral and / or vertical connections are located within the substrate and can be used to create electrical, thermal, and / or mechanical connections between packaged or unpackaged components (such as bare dies), particularly IC chips, and a printed circuit board or intermediate circuit board. The term "substrate" therefore also includes "IC substrates." A dielectric part of a substrate can be composed of resin with reinforcing particles (such as reinforcing spheres, particularly glass spheres).

[0046] The substrate or interposer may contain or consist of at least one layer of glass, silicon (Si), or a photomitable or dry-etchable organic material such as epoxy-based build-up material (such as an epoxy-based build-up film) or polymer compounds, such as polyimide, polybenzoxazole, or benzocyclobutene-functionalized polymers.

[0047] In one embodiment, the respective at least one electrically insulating layer structure comprises a material from the group consisting of resin (such as reinforced or unreinforced resins, for example, epoxy resin or bismaleimide triazine resin), cyanate ester resin, polyphenylene derivative, glass (in particular glass fibers, multilayer glass, glass-like materials), prepreg material (such as FR-4 or FR-5), polyimide, polyamide, liquid crystal polymer (LCP), epoxy-based build-up film, polytetrafluoroethylene (PTFE, Teflon®), a ceramic, and a metal oxide. Teflon is a registered trademark of The Chemours Company FC LLC in Wilmington, Delaware, USA. Reinforcing materials such as sheets, fibers, or spheres, for example, made of glass (multilayer glass), can also be used.Although prepreg, especially FR4, is generally preferred for rigid printed circuit boards, other materials, particularly epoxy-based build-up films or photomitable dielectric materials, can also be used. For high-frequency applications, high-frequency materials such as polytetrafluoroethylene, liquid crystal polymers and / or cyanate ester resins, low-temperature ceramics (LTCC), or other materials with low, very low, or ultra-low dielectric constant (DK) can be used as an electrically insulating layer structure in the component carrier.

[0048] In one embodiment, the respective at least one electrically conductive layer structure comprises at least one material from the group consisting of copper, aluminum, nickel, silver, gold, palladium, and tungsten. Although copper is generally preferred, other materials or coated versions thereof are also possible, in particular coated with superconducting material such as graphene.

[0049] At least one component that may be embedded in the stack may be selected from a group consisting of an electrically non-conductive inlay (such as a ceramic inlay, preferably comprising aluminium nitride or aluminium oxide), an electrically conductive inlay (such as a metal inlay, preferably comprising copper or aluminium), a heat transfer unit (such as a heat pipe), a light guide element (such as an optical waveguide or light guide connection), an optical element (such as a lens), an electronic component, or combinations thereof.The component can be, for example, an active electronic component, a passive electronic component, an electronic chip, a storage device (for example, DRAM or other data storage), a filter, an integrated circuit, a signal processing component, a power management component, an optoelectronic interface element, a light-emitting diode, a photocoupler, a voltage converter (for example, a DC / DC converter or an AC / DC converter), a cryptographic component, a transmitter and / or receiver, an electromechanical transducer, a sensor, an actuator, a microelectromechanical system (MEMS), a microprocessor, a capacitor, a resistor, an inductor, a battery, a switch, a camera, an antenna, a logic chip, and a power harvesting unit. However, other components can also be embedded in the component carrier.For example, a magnetic element can be used as a component. Such a magnetic element can be a permanent magnet (for example, a ferromagnetic element, an antiferromagnetic element, a multiferroic element, or a ferrimagnetic element, such as a ferrite core) or a paramagnetic element. The component can also be a substrate, an interposer, or another component carrier, for example, in a board-in-board configuration. The component can be surface-mounted on the component carrier and / or embedded within the interior of the component carrier. Furthermore, other components can also be used as components.

[0050] In one embodiment, the component carrier is a laminate-like component carrier. In such an embodiment, the component carrier is a composite of several layered structures that are stacked and joined together by applying pressure and / or heat.

[0051] After processing the internal layer structures of the component carrier, it is possible to cover one or both opposing main surfaces of the processed layer structures symmetrically or asymmetrically with one or more further electrically insulating and / or electrically conductive layer structures (especially by lamination). In other words, the build-up can be continued until a desired number of layers is reached.

[0052] After the formation of a stack of electrically insulating layer structures and electrically conductive layer structures, surface treatment of the resulting layer structures or the component carrier can be carried out.

[0053] In particular, an electrically insulating solder resist can be applied to one or both opposing main surfaces of the layer stack or component carrier as a surface treatment. For example, it is possible to apply such a solder resist to an entire main surface and then structure the solder resist layer to expose one or more electrically conductive surface areas for electrical coupling of the component carrier to electronic peripherals. The solder resist-covered surface areas of the component carrier can be effectively protected against oxidation or corrosion, especially copper-containing surface areas.

[0054] It is also possible to selectively apply a surface coating to exposed electrically conductive surface areas of the component carrier. Such a surface coating can be an electrically conductive covering material on exposed electrically conductive layer structures (such as pads, conductor tracks, etc., particularly those comprising or consisting of copper) on the surface of a component carrier. If such exposed electrically conductive layer structures remain unprotected, the exposed electrically conductive component carrier material (especially copper) can oxidize, thereby reducing the reliability of the component carrier. A surface coating can then, for example, be formed as an interface between a surface-mounted component and the component carrier.The surface coating serves to protect the exposed electrically conductive layer structures (especially copper circuits) and to enable a connection process with one or more components, for example by soldering. Suitable materials for a surface coating include, for example, organic solderability preservative (OSP), electroless nickel immersion gold (ENIG), gold (especially hard gold), electroless tin, nickel-gold, nickel-palladium, electroless nickel immersion palladium immersion gold (ENIPIG), etc.

[0055] The aspects defined above and further aspects of the invention result from the exemplary embodiments to be described below and are explained with reference to these exemplary embodiments. Brief description of the drawings Fig. Figure 1 shows a cross-sectional view of a structure obtained by carrying out a method for manufacturing a component carrier by connecting a component carrier structure with another component carrier structure according to an exemplary embodiment. Fig. 1A shows a cross-sectional view of larger parts of component support structures of the structure according to Fig. 1. Fig. Figure 2 shows a cross-sectional view of a component carrier according to an exemplary embodiment. Fig. Figure 3 shows a cross-sectional view of a component carrier according to another exemplary embodiment. Fig. 4, Fig. 5, Fig. 6, Fig. 7 and Fig. Figure 8 shows cross-sectional views of structures obtained when carrying out methods for manufacturing component carriers according to exemplary embodiments. Fig. Figure 9 shows a cross-sectional view of a structure obtained when carrying out a method for manufacturing a component carrier by connecting a component carrier structure with a component according to an exemplary embodiment. Detailed description of the depicted embodiments

[0056] The illustrations in the drawings are schematic. Similar or identical elements in different drawings are labelled with the same reference symbols.

[0057] Before referring to the drawings, exemplary embodiments are described in more detail, summarizing some basic considerations on the basis of which exemplary embodiments of the invention have been developed.

[0058] According to an exemplary embodiment of the invention, at least one electrically conductive contact element on a contact surface of a component carrier structure, which is to be electrically and mechanically connected to another component carrier structure, can be designed as a rough recess that can be partially or completely filled with a preferably pasty, electrically conductive connecting medium to create a reliable z-connection between the component carrier structures. This allows a component carrier, such as a printed circuit board (PCB), to be obtained that has a short-path and therefore low-loss and compact vertical electrical connection and simultaneously offers reliable protection against undesired delamination of the interconnected component carrier structures, particularly when horizontal shear forces occur.The described connection technology can reduce internal stresses in the component carrier and convert shear stresses into multidirectional stresses while simultaneously ensuring proper electrical behavior.

[0059] To put it simply, a prepreg sheet can be drilled with a laser to create at least one through-hole, which can then be filled with a metallic (for example, copper) paste or similar material. One or both of the main surfaces facing each other of two or more component carrier structures (such as printed circuit boards or laminated stacks of layers) can be subjected to a selective etching process to define one or more recesses in aligned, electrically conductive contact elements of the component carrier structures to be joined. Preferably, such a recess can be defined by a concave cavity with surface profile structures on a wall bounding the cavity that are smaller in dimension compared to the dimensions of the cavity.The prepreg sheet, with one or more sections filled with metallic paste, can then be placed between the component carrier structures so that the one or more recesses are aligned with the metallic paste, which is thereby pressed into the recess(s). The component carrier structures and the intervening dielectric film can then be bonded together by lamination, i.e., by mechanical pressure, preferably at elevated temperature. The result is a component carrier (for example, a printed circuit board) with short vertical electrical connections and reliable mechanical integrity.

[0060] A major challenge in developing a Z-connection in a component carrier is overcoming delamination (i.e., separations at the interface between interconnected component carrier structures or substructures) and via slippage. It is believed that these two defects, in particular, arise mainly due to poor surface adhesion between a metallic paste and a printed circuit board via (board-to-via) surface, especially when the stress level is high.

[0061] To overcome these and / or other problems, in an exemplary embodiment of the invention, a rough depression or uneven cavity is created on the via pad(s) to be connected, in order to ensure high surface adhesion and a mechanical barrier for high stability. The creation of such a rough depression can be achieved, for example, by a photolithographic process in which an entire printed circuit board or other component carrier structure is coated with a photoresist, while only one or more Z-connection pads or other contact elements remain uncovered. Once the photolithographic process is complete, the component carrier structure can be subjected to an etching process (or another alternative such as a bonding process) to etch a portion of the contact element(s), thereby creating a rough surface profile within a cavity.A preferred outcome of such a process can be a rounded, rough recess or a rectangular or trapezoidal cavity that, after pressing, can effectively hold or accommodate metallic paste (or another electrically conductive bonding medium). Any etching process can be adapted accordingly for roughening. However, it is also possible to use other adhesion promoters, such as a bonding process, etc. Mechanical processing (for example, by drilling, especially mechanical or laser drilling, or by grinding) of the contact elements can also be carried out to produce the recess(s).

[0062] For example, embodiments of the invention are particularly suitable for large-dimensioned component carriers, such as those used in aerospace applications. Exemplary embodiments of the invention can provide component carriers that can be manufactured with high reliability and high yield.

[0063] Fig. Figure 1 shows a cross-sectional view of a structure that was created during the execution of a process for manufacturing a component carrier 100 (shown in Fig. 2) is obtained according to an exemplary embodiment. Fig. Figure 1A shows a cross-sectional view of larger parts of the component support structures 104, 112 of the structure according to Fig. 1. In other words: Fig. Figure 1 essentially shows detail 138 of Fig. 1A. More precisely, it shows Fig. 1A Two sub-plates, laminated layer stacks or even printed circuit boards (PCBs) that are to be joined together to obtain a highly reliable, high-performance vertical electrical coupling and at the same time a strong mechanical connection in the horizontal plane without the risk of delamination. Fig. Figure 1 shows details of approximately part 138 of the in Fig. 1A shown representation.

[0064] The basis for the described manufacturing process is in Fig. 1 and Fig. Figure 1A shows a first component support structure 104 comprising a first laminated layer stack 102. This stack consists of a plurality of first electrically conductive layer structures 106 and a plurality of first electrically insulating layer structures 108. The first electrically conductive layer structures 106 have a plurality of first contact elements 107 extending to a first contact surface 109 of the first stack 102. If a component 130, such as a semiconductor chip, is embedded in the first stack 102, the first component support structure 104 has extended functionality. However, the first component support structure 104 with an embedded component 130 may then be more susceptible to internal stresses (e.g., thermal stresses), which can cause undesirable phenomena such as delamination and / or distortion.In particular, delamination can be greatly suppressed by the joining technique according to an exemplary embodiment of the invention, as described in more detail below.

[0065] A further basis for the described manufacturing process is a second component carrier structure 112, which comprises a second laminated layer stack 110 having a plurality of second electrically conductive layer structures 114 and a plurality of second electrically insulating layer structures 116. The second electrically conductive layer structures 114 have second contact elements 115 that extend to a second contact surface 117 of the second stack 110. In the illustrated embodiment, each of the contact elements 107, 115 has a copper-filled laser vial with tapered sidewalls 132. In the further course of the manufacturing process, the component carrier structures 104, 112 are to be joined to one another at their mutually facing contact surfaces 109, 117.Optionally, another component 130, for example a semiconductor chip, can be embedded in the second stack 110, which can lead to the advantages described above in terms of extended functionality and the avoidance or reduction of problems relating to delamination, warping, etc.

[0066] In particular, the first component support structure 104 on the underside and the second component support structure 112 on the top side can each be configured as an integrated circuit (IC) substrate or as a printed circuit board (PCB). Thus, the first component support structure 104 can be a laminate-type plate-shaped layer stack 102, and the second component support structure 112 can be another laminate-type plate-shaped layer stack 110. The respective electrically conductive layer structures 106, 114 can, for example, comprise structured copper structures and vertical through-connections, such as copper-filled laser vias. The electrically insulating layer structures 108, 116 can contain a resin (for example, epoxy resin) and optionally reinforcing particles (for example, glass fibers or glass beads). The electrically insulating layer structures 108, 116 can, for example, be made of FR4 or ABF.

[0067] As in Fig. As can be seen best in Figure 1A, a planar dielectric film 126 can be arranged between the still separate component support structures 104, 112. The dielectric film 126 can, for example, comprise or consist of a curable material, such as an uncured epoxy resin. Reinforcing particles, such as glass fibers, can be integrated into the resin matrix. The dielectric film 126 can, for example, be an epoxy resin film or a prepreg film. The described configuration of the dielectric film 126 enables it to become flowable and adhesive when mechanically pressed between the component support structures 104, 112, preferably with the application of heat energy.Thus, mechanical pressure and / or increased temperature can trigger the hardening of the previously uncured resin material of the dielectric foil 126, so that the resin at least partially hardens and thereby causes adhesion between the component support structures 104, 112.

[0068] As in Fig. As shown in Figure 1A, a plurality of through-holes can be formed in the dielectric film 126. This can be done, for example, by drilling, in particular by laser drilling. The result is a perforated dielectric film 126. After perforation, an electrically conductive connecting medium 118 can be inserted (for example, printed or applied) into each of the drilled through-holes in the dielectric film 126 before the first component support structure 104 is connected to the second component support structure 112 with the dielectric film 126, with the electrically conductive connecting medium 118 located between them. Preferably, such an electrically conductive connecting medium 118 can be freely formable, highly viscous, or even semi-flowable, so that it reliably remains within the through-holes without falling out or dripping out.However, the electrically conductive connecting medium 118 can simultaneously be sufficiently deformable to reliably enter the space. Fig. The recesses 120, 120' shown in Figure 1, which are formed in the contact surfaces 109, 117, can be pressed as described below. Preferably, the electrically conductive connecting medium 118 is an electrically conductive paste, such as a copper paste or a silver paste.

[0069] With renewed reference to Fig. 1, a corresponding recess 120 can be formed in each of the exposed first contact elements 107. As in Fig. As shown in Figure 1, such a recess 120 comprises a larger cavity 122, which is bounded by a smaller surface profile 124. Accordingly, a corresponding recess 120' can be formed in each of the exposed second contact elements 115. The recesses 120' can also comprise a larger cavity 122, which is bounded by a smaller surface profile 124 on a wall bounding the cavity 122. The recesses 120, 120' can be formed by etching the contact elements 107, 115, whereby an adjustment of the etching parameters and conditions allows the determination of the geometric parameters, the shape and the dimensions of the cavities 122 and the surface profiles 124. As a result of such a controlled etching process, the ... shown in Figure 1 can be formed by etching the contact elements 107, 115. Fig. The vias shown in 1 with rough depressions can be obtained.

[0070] As in Fig. 1 and also in Fig. As shown in Figure 1A, the component carrier structures 104, 112 and the dielectric film 126 with the electrically conductive connecting medium 118 in their through holes can be positioned relative to each other such that each reservoir of electrically conductive connecting medium 118 in the dielectric film 126 is aligned with and positioned between two respective aligned contact elements 107, 115 of the component carrier structures 104, 112 before they are connected together.

[0071] Fig. Figure 2 shows a cross-sectional view of a component carrier 100 according to an exemplary embodiment.

[0072] To the in Fig. To obtain the component carriers 100 shown in Figure 2, the first contact elements 107 at the first contact surface 109 can be connected to the second contact elements 115 at the second contact surface 117 by filling the recesses 120, 120' with the electrically conductive connecting medium 118. This can be achieved by connecting the first component carrier structure 104 to the second component carrier structure 112 with the dielectric film 126 and its reservoirs of electrically conductive contact medium 118 between them. The component carrier structures 104, 112 and the dielectric film 126 can be mechanically pressed together. Advantageously, this pressing process can be accompanied by thermal energy. During this pressing process, the deformable, viscous, pasty, electrically conductive connecting medium 118 can be forced into the recesses 120, 120'.Simultaneously, pressing and the application of heat energy trigger the curing (for example, by becoming flowable, cross-linking, and re-solidifying) of the curable resin material of the dielectric film 126 during the creation of the press fit between the first component support structure 104 and the second component support structure 112 with the intervening dielectric film 126. Consequently, the cured epoxy resin (or another suitable curable material) will mechanically bond the component support structures 104 and 112, except in the areas where the electrical connection is established by the electrically conductive connecting medium 118.

[0073] As a result of the described manufacturing process, the in Fig. Two partially depicted component carriers 100 are obtained. This component carrier 100 comprises the first component carrier structure 104 with its first stack 102 as described above, the second component carrier structure 112 with its second stack 110 as described above, and the dielectric foil 126 described above with its through holes 128, which are filled with the electrically conductive connecting medium 118 between the interconnected component carrier structures 104, 112.

[0074] More precisely, each of the different islands of electrically conductive connecting medium 118 directly connects one of the first contact elements 107 at the first contact surface 109 to one of the second contact elements 115 at the second contact surface 117 by filling the associated recesses 120, 120' of the first contact elements 107 and the second contact elements 115. As described above, each of the recesses 120, 120' comprises a larger-dimensioned cavity 122, which is bounded by a smaller-dimensioned surface profile 124.

[0075] In the embodiment of Fig. In section 2, the cavity 122 has a round shape, for example, an essentially circular shape. This has the advantage that a favorable interference energy, a sufficiently large contact area, and good geometric stability can be achieved.

[0076] The direct electrically conductive path formed by a respective first contact element 107, a respective second contact element 115, and an intervening island of electrically conductive connecting medium 118, contributes to an electrically conductive vertical through-connection to vertically connect the first component carrier structure 104 and the second component carrier structure 112 via a short path. This minimizes the losses of the electrical signals propagating along this path and enables the fabrication of a compact component carrier 100.Even under high internal stresses (for example, caused by inhomogeneous thermal expansion within the component carrier 100 due to the different coefficients of thermal expansion of the semiconductor material of the embedded components 130 and the copper and resin material of the stacks 102, 110), the component carrier 100 shown does not exhibit a pronounced tendency to delamination or distortion. Furthermore, shear forces acting in the horizontal direction (in . Fig. 2 schematically indicated by arrows 150) due to the positive locking between the electrically conductive connecting medium 118 and the stacks 102, 110 by the described geometry of the recesses 120, 120', delamination of the component carrier 100 is prevented or even prevented.

[0077] Fig. Figure 3 shows a cross-sectional view of a component carrier 100 according to a further exemplary embodiment.

[0078] According to Fig. 3 The cavity 122 has an essentially rectangular shape, which leads to good encapsulation of the electrically conductive connecting medium 118. This shape allows for good geometric stability and a large contact area.

[0079] Still referring to Fig. 3. Each of the cavities 122 can have a depth D of, for example, 15 µm and a width L of, for example, 30 µm. This can lead to a pronounced positive fit between the electrically conductive connecting medium 118 in the cavities 122 and the stacks 104, 110, which can significantly suppress undesired delamination even when shear forces 150 occur. Furthermore, the surface profile 124 has an average top-to-bottom distance d of, for example, 5 µm. To determine the average top-to-bottom distance, the vertical distance between a projection and an adjacent depression of the surface profile 124 is measured over at least five, in particular over all, projections and directly adjacent depressions that define the surface profile 124 along the extent of the cavity 122 in the cross-section of the component carrier 100, according to the formula. Fig. 3 form, averaged. Consequently, a mechanical interlock between the material of the contact elements 107, 115, which form projections that define the surface profile 124 of the recesses 120, 120', on the one hand, and the metallic paste-filled depressions of the surface profile 124, on the other hand, can provide additional protection against delamination. The synergistic combination of the advantageous effects of the large-dimensioned cavities 122 and the smaller-dimensioned surface profile 124 can lead to a significant improvement in the joint strength.

[0080] In the Fig. 4, Fig. 5, Fig. 6, Fig. 7 to Fig. Figure 8 shows cross-sectional views of structures obtained during the execution of methods for manufacturing component carriers 100 according to exemplary embodiments.

[0081] In Fig. 4 is the first stack 102 of the first component support structure 104, which is based on Fig. 1 and Fig. 1A, which was described in detail, is shown before the formation of the recess 120. To illustrate the in Fig. To obtain the structure shown in Figure 4, the upper main surface of the first stack 102 is covered with a photoresist layer as an etch protection structure 134. The photoresist can then be structured, for example by lithography and etching. As a result, only a portion of the first contact surface 109 (and a portion of the second contact surface 117) remains covered with the etch protection structure 134, which is designed as a structured photoresist layer.

[0082] As in Fig. As shown in Figure 5, a round recess 120 is formed in the exposed window of the etch protection structure 134 by etching an exposed surface section of the first contact element 107 at the first contact surface 109.

[0083] To the in Fig. To obtain the structure shown in 6, the etch protection structure 134 is removed from the first stack 102 after etching, for example by peeling or a further etching process.

[0084] The in Fig. 7 and Fig. The structures shown in 8 can be described analogously to those in Fig. 4 to Fig. 6 structures shown, with the difference that according to Fig. 7 and Fig. 8 a rectangular (and not a round) recess 120 is formed. The different geometry of the round recess 120 according to Fig. 6 and the rectangular recess 120 after Fig. 8 results from different etching parameters. The etching process according to Fig. 7 and Fig. 8 is more aggressive and exhibits a different degree of anisotropy compared to the etching process according to Fig. 4 to Fig. 6. For example, wet etching and / or plasma etching can be used alone or in combination. Etcher composition, etcher additives, and / or etching time are examples of parameters that can be changed to adjust the properties of the cavity 122 and the surface profile 124.

[0085] Fig. Figure 9 shows a cross-sectional view of a structure obtained by carrying out a method for manufacturing a component carrier 100 by connecting a component carrier structure 104 with a component 140 according to an exemplary embodiment. The embodiment of Fig. 9 differs from the embodiment of the Fig.1 essentially by connecting a recessed component 140, rather than a second component support structure 112, to the first component support structure 104. The component 140 could, for example, be a heat sink or a semiconductor chip.

[0086] It should be noted that the terms "have" or "comprise" do not exclude other elements or steps, and that "a," "an," "one," "an," etc., do not exclude a plurality. Elements described in connection with different embodiments can also be combined.

[0087] The implementation of the invention is not limited to the embodiments shown in the figures and described above. Rather, a multitude of variants are possible, which utilize the solutions shown and the principle according to the invention, even in the case of fundamentally different embodiments.

Claims

[1] A component carrier (100), comprising: a first component support structure (104) comprising a first stack (102) comprising at least one first electrically conductive layer structure (106) and at least one first electrically insulating layer structure (108), wherein the at least one first electrically conductive layer structure (106) comprises a first contact element (107) extending to a first contact surface (109) of the first stack (102); an electrically conductive connecting medium (118) directly connected to the first contact element (107) at the first contact surface (109) by filling at least one recess (120) of the first contact element (107), wherein the at least one recess (120) comprises a larger dimensioned cavity bounded by a smaller dimensioned surface profile and further comprising: a component trained as Bare The (140); wherein the electrically conductive connecting medium (118) connects the first contact element (107) directly to the component (140) at the first contact surface (109) by filling at least one recess (120, 120') of the first contact element (107) and the component (140). [2] The component carrier (100) according to claim 1, further comprising: a second component support structure (112) comprising a second stack (110) comprising at least one second electrically conductive layer structure (114) and at least one second electrically insulating layer structure (116), wherein the at least one second electrically conductive layer structure (114) comprises a second contact element (115) extending to a second contact surface (117) of the second stack (110); wherein the electrically conductive connecting medium (118) directly connects the first contact element (107) at the first contact surface (109) to the second contact element (115) at the second contact surface (117) by filling the at least one recess (120) of the first contact element (107) and optionally of the second contact element (115). [3] The component carrier (100) according to one of claims 1 to 2, comprising at least one of the following features: wherein the cavity (122) has a depth of at least 10 µm, in particular at least 15 µm; wherein the cavity (122) has a width of at least 20 µm, in particular at least 30 µm; wherein the surface profile (124) has an average top-to-bottom distance of at least 2 µm, in particular at least 4 µm; wherein the surface profile (124) has an average top-to-bottom distance of no more than 15 µm, in particular no more than 10 µm. [4] The component carrier (100) according to one of claims 1 to 3, comprising at least one of the following features: wherein the cavity (122) has a round shape, in particular at least one of a circular shape, an oval shape or a cylindrical shape; wherein the cavity (122) has a rectangular shape, in particular with rounded corners; wherein the cavity (122) is free of sharp edges. [5] The component carrier (100) according to one of claims 2 to 4, wherein a first recess (120) is formed in the first contact element (107) and a second recess (120') is formed in the second contact element (115) or in the component (140) and wherein both the first recess (120) and the second recess (120') are filled with the electrically conductive connecting medium (118). [6] The component carrier (100) according to one of claims 1 to 5, wherein the electrically conductive connecting medium (118) is a viscous deformable medium, in particular an electrically conductive paste, in particular a silver paste or a copper paste. [7] The component carrier (100) according to any one of claims 1 to 6, wherein the electrically conductive connecting medium (118) comprises an electrically conductive polymer. [8] The component carrier (100) according to one of claims 2 to 7, wherein at least one of the first contact element (107) and the second contact element (115) contributes to an electrically conductive vertical through-connection for the vertical electrical connection of the first component carrier structure (104) and the second component carrier structure (112). [9] The component carrier (100) according to any one of claims 1 to 8, wherein at least one of the first contact element (107) and the second contact element (115) has or consists of a via, in particular a via with tapered side walls. [10] The component carrier (100) according to any one of claims 2 to 9, further comprising: a dielectric foil (126) with at least one through-hole filled with the electrically conductive connecting medium (118), wherein the dielectric foil (126) is arranged between the first component support structure (104) and the second component support structure (112) or the component (140). [11] The component carrier (100) according to claim 10, wherein the dielectric film (126) comprises or consists of an adhesive material, in particular prepreg or resin. [12] A method for manufacturing a component carrier (100), the method comprising: Forming a first component support structure (104) comprising a first stack (102) comprising at least one first electrically conductive layer structure (106) and at least one first electrically insulating layer structure (108), wherein the at least one first electrically conductive layer structure (106) comprises a first contact element (107) extending to a first contact surface (109) of the first stack (102); direct connection of the first contact element (107) at the first contact surface (109) with an electrically conductive connecting medium (118) by filling at least one recess (120) of the first contact element (107) with the electrically conductive connecting medium (118), wherein the at least one recess (120) comprises a larger dimensioned cavity (122) which is bounded by a smaller dimensioned surface profile (124); wherein the method further comprises: Providing a component trained as Bare The (140); and direct connection of the first contact element (107) at the first contact surface (109) with the component (140) by filling at least one recess (120) of the first contact element (107) and the component (140) with the electrically conductive connecting medium (118). [13] The method of claim 12, wherein the method further comprises: Forming a second component support structure (112) comprising a second stack (110) having at least one second electrically conductive layer structure (114) and at least one second electrically insulating layer structure (116), wherein the at least one second electrically conductive layer structure (114) has a second contact element (115) extending to a second contact surface (117) of the second stack (110); and direct connection of the first contact element (107) at the first contact surface (109) with the second contact element (115) at the second contact surface (117) by filling at least one recess (120) of the first contact element (107) and optionally of the second contact element (115) with the electrically conductive connecting medium (118). [14] The method according to claim 13, wherein the method comprises filling the electrically conductive connecting medium (118) into the at least one recess (120) when connecting the first component support structure (104) to the second component support structure (112) or to the component (140). [15] The method according to one of claims 13 to 14, wherein the method comprises providing the electrically conductive connecting medium (118) in at least one through-hole of a dielectric film (126) and subsequently connecting the first component support structure (104) to the second component support structure (112) or to the component (140) with the dielectric film (126) in between. [16] The method of claim 15, comprising at least one of the following features: wherein the method comprises providing the dielectric foil (126) with a curable material and at least partially curing the curable material of the dielectric foil (126) when connecting the first component support structure (104) with the second component support structure (112) or with the component (140) with the dielectric foil (126) in between; wherein the method comprises forming the at least one through hole in the dielectric foil (126) by one of the group consisting of drilling, in particular by laser drilling or mechanical drilling, punching and etching; wherein the method comprises filling the electrically conductive connecting medium (118) in the form of a paste into the at least one through-hole of the dielectric film (126). [17] The method according to any one of claims 12 to 16, wherein the method comprises forming the at least one recess (120) by etching, drilling, in particular mechanical drilling or laser drilling, or grinding at least one of the first contact elements (107) at the first contact surface (109) and of the second contact element (115) at the second contact surface (117). [18] The method according to claim 17, wherein the method comprises covering at least a part of the first contact surface (109) and a part of the second contact surface (117) with a protective structure during etching, drilling or grinding.

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