Method for manufacturing an electrical arrangement and electrical arrangement

Abstract

Method for manufacturing an electrical arrangement (20) with a housing (90), power semiconductors (50) and a printed circuit board (30; 30A, 30B, 30C), wherein the printed circuit board (30; 30A, 30B, 30C) has first electrical components (31, 32) for controlling the power semiconductors (50), wherein the housing (90) has a cooling fluid compartment (92), and wherein the method comprises the following steps: A) the circuit board (30; 30A, 30B, 30C) is heated together with the first electrical components (31, 32) attached to it, B) the printed circuit board (30; 30A, 30B, 30C) is immersed in a container (102) containing a plastic powder (110), the plastic powder (110) is swirled by a gas flowing in the container (102), and a coating (33) is produced in the area of ​​the printed circuit board (30; 30A, 30B, 30C) and the first electrical components (31, 32) by melting the plastic powder (110), C) The circuit board (30; 30A, 30B, 30C) with the first electrical components (31, 32) attached to it is removed from the container (102), D) The printed circuit board (30; 30A, 30B, 30C) with the electrical components (31, 32) and the power semiconductors (50) are positioned in the cooling fluid compartment (92). A cooling plate (60) is arranged on the side of the power semiconductors (50) facing away from the printed circuit board (30; 30A, 30B, 30C), the cooling plate (60) being in contact with the power semiconductors (50). A fluid line device (70) is arranged on the side of the cooling plate (60) facing away from the power semiconductors (50), the fluid line device being configured to deflect a cooling fluid (98) towards the cooling plate (60). A capacitor arrangement (80) is arranged in the cooling fluid compartment (92) on the side of the cooling plate (60) facing away from the power semiconductors (50), the cooling fluid compartment (92) being connected together with the printed circuit board. (30;30A, 30B, 30C) with the electrical components (31, 32) and with the power semiconductors (50) forms a fluid line arrangement (94), wherein the fluid line arrangement (94) has a first fluid line area (95) and a second fluid line area (96), wherein the first fluid line area (95) and the second fluid line area (96) are in fluid communication with the cooling fluid space (92), ; wherein at least a first sub-area of ​​the coating (33) in the area of ​​the circuit board (30; 30A, 30B, 30C) and the first electrical components (31, 32) is in fluid communication with the first fluid conduction area (95), and wherein at least a second sub-area of ​​the power semiconductor (50) is in fluid communication with the second fluid conduction area (96), to enable temperature control of the power semiconductors (50) and the circuit board (30; 30A, 30B, 30C) with the first electrical components (31, 32).

Description

[0001] The invention relates to a method for manufacturing an electrical arrangement and an electrical arrangement.

[0002] DE 29 51 063 A1 discloses a process in which a base surface of a carrier body is coated with a base layer of curable synthetic resin and a coating material in powder form is applied to this uncured, adhesive layer.

[0003] DE 40 16 953 A1 discloses an electronic component with a first electrically insulating layer and a second electrically conductive layer, wherein both layers can be applied by fluidized bed sintering.

[0004] DE 10 2014 111 421 A1 discloses a circuit arrangement which has several connecting rails for electrical connection which are provided with a coating produced by means of a fluidized bed sintering process.

[0005] The JP S59 - 123 567 A shows a printed circuit board with a fluidized bed coating.

[0006] DE 10 2021 128 947 A1 discloses a pulse inverter with a pulse inverter housing in which at least one power electronics unit is provided, wherein at least the pulse inverter housing is to be cooled by a flowing coolant via housing means, wherein the pulse inverter housing has at least one coolant inlet opening and at least one coolant outlet opening as housing means, wherein the coolant flows through the pulse inverter housing in direct contact with the power electronics.

[0007] DE 10 2022 117 066 A1 discloses a semiconductor package comprising one or more power semiconductor chips enclosed in a chip module, a first heat sink directly coupled to one or more source pads of the chip module, a second heat sink directly coupled to one or more drain pads of the chip module, a gate contact and a coating.

[0008] It is therefore an object of the invention to provide a new method for manufacturing an electrical arrangement and a new electrical arrangement.

[0009] This task is solved by the objects of the independent claims.

[0010] A method for manufacturing an electrical arrangement comprising a housing, power semiconductors and a printed circuit board, wherein the printed circuit board has first electrical components for controlling the power semiconductors, and wherein the housing has a cooling fluid compartment, comprises the following steps: A) The circuit board is heated together with the first electrical components attached to it, B) The circuit board is immersed in a container containing a plastic powder, the plastic powder is swirled by a gas flowing in the container, and a coating is created in the area of ​​the circuit board and the first electrical components by melting the plastic powder. C) The circuit board with the first electrical components attached to it is removed from the container, D) The printed circuit board with the electrical components and the power semiconductors are positioned in the cooling fluid chamber, the cooling fluid chamber together with the printed circuit board with the electrical components and with the power semiconductors forming a fluid line arrangement, the fluid line arrangement having a first fluid line area and a second fluid line area, the first fluid line area and the second fluid line area being in fluid communication with the cooling fluid chamber, at least a first sub-area of ​​the coating in the area of ​​the printed circuit board and the first electrical components being in fluid communication with the first fluid line area, and at least a second sub-area of ​​the power semiconductors being in fluid communication with the second fluid line area to enable temperature control of the power semiconductors and the printed circuit board with the first electrical components.

[0011] The power semiconductors and the circuit board with the electrical components are protected, allowing them to be used in wet environments with a cooling fluid and cooled by it. The coating ensures continued effective cooling and reduces the risk of electrical short circuits. Manufacturing cleanliness requirements can be lower than without the coating. The purity requirements for the dielectric cooling fluid can also be reduced.

[0012] According to a preferred embodiment, the printed circuit board with the electrical components is coated at least partially on both sides of the board. This increases protection against short circuits.

[0013] According to a preferred embodiment, in step B) the printed circuit board without the power semiconductors is immersed in the container with the plastic powder to prevent the power semiconductors from being coated with the plastic powder.

[0014] According to a preferred embodiment, in step B) the printed circuit board with the power semiconductors attached to it is immersed in the container with the plastic powder in order to effect at least a partial coating of the power semiconductors with the plastic powder.

[0015] According to a preferred embodiment, a cooling fluid is supplied to the cooling fluid chamber to achieve temperature control of the power semiconductors and the circuit board with the first electrical components.

[0016] According to a preferred embodiment, the cooling fluid is supplied as a dielectric cooling fluid. Dielectric cooling fluid is electrically non-conductive or poorly conductive and can therefore be used for the direct cooling of electrical components.

[0017] According to a preferred embodiment, a fluid flow of the cooling fluid is generated. This increases the cooling performance.

[0018] According to a preferred embodiment, at least one material from a group of materials consisting of the following is used as the plastic powder: - Polyamide, - Polyethylene, - Polyester, - Epoxy, and - Poly(ethylene-co-chlorotrifluoroethylene).

[0019] Epoxy or epoxy resin has proven to be particularly advantageous for forming the desired coating.

[0020] In step D), a cooling plate is placed on the side of the power semiconductors facing away from the circuit board, with the cooling plate making contact with the power semiconductors. This allows for improved cooling of the power semiconductors.

[0021] In step D), a fluid line device is arranged on the side of the cooling plate facing away from the power semiconductors. This device is designed to redirect a cooling fluid towards the cooling plate, thereby increasing the cooling capacity.

[0022] In step D), a capacitor assembly is arranged on the side of the cooling plate facing away from the power semiconductors in the cooling fluid chamber. This is advantageous for cooling the capacitor assembly and for routing the conductors between the electrical components of the electrical assembly.

[0023] According to a preferred embodiment, the coating has a layer thickness in the range of 50 µm to 1,000 µm, at least in a predetermined first region, preferably in the range of 50 µm to 700 µm, and particularly preferably in the range of 70 µm to 500 µm. The layer thickness can be influenced, in particular, by controlling the temperature during coating and the coating duration.

[0024] According to a preferred embodiment, the specified first area comprises at least 30% of the total surface area of ​​the coating, more preferably at least 50% and particularly preferably at least 70%.

[0025] According to a preferred embodiment, the printed circuit board together with the first electrical components attached to it is heated to at least 120 °C in step A).

[0026] An electrical arrangement comprises a housing, power semiconductors, and a printed circuit board, wherein the housing has a cooling fluid compartment, wherein the printed circuit board has first electrical components for controlling the power semiconductors, wherein the printed circuit board and the first electrical components have at least a partial coating with a plastic, wherein the printed circuit board with the electrical components and the power semiconductors are arranged in the cooling fluid compartment, wherein the cooling fluid compartment together with the printed circuit board with the electrical components and with the power semiconductors forms a fluid line arrangement, wherein the fluid line arrangement has a first fluid line area and a second fluid line area, wherein the first fluid line area and the second fluid line area are in fluid communication with the cooling fluid compartment.wherein at least a first sub-area of ​​the coating in the area of ​​the circuit board and in the area of ​​the first electrical components is in fluid contact with the first fluid conduction area, and wherein at least a second sub-area of ​​the power semiconductor is in fluid contact with the second fluid conduction area in order to enable temperature control of the power semiconductors and the circuit board with the first electrical components by a cooling fluid. Such an electrical arrangement enables good cooling while simultaneously reducing the risk of an electrical short circuit.

[0027] According to a preferred embodiment, the coating is designed as a fluidized bed coating. Fluidized bed coatings typically differ from other coatings in terms of surface properties and coating quality, particularly on complex contours, and are especially advantageous for this application.

[0028] According to a preferred embodiment, the electrical arrangement has at least two fluid line connections, comprising a first fluid line connection and a second fluid line connection, wherein the fluid line connections are in fluid communication with each other via the cooling fluid chamber. This advantageously enables the formation of a cooling circuit.

[0029] According to a preferred embodiment, the electrical arrangement is manufactured using such a method.

[0030] According to a preferred embodiment, a vehicle has such an electrical arrangement. This increases the safety of the vehicle and thus protects the occupants.

[0031] Further details and advantageous embodiments of the invention will become apparent from the exemplary embodiments described below and illustrated in the drawings, as well as from the dependent claims. It is understood that the features mentioned above and those to be explained below can be used not only in the combinations specified, but also in other combinations or individually. The drawings show: Fig. 1. An electrical arrangement in an exploded view, Fig. 2 the electrical arrangement of Fig. 1 in spatial representation, Fig. 3 in schematic representation a fluidized bed coating process, Fig. 4 in schematic sectional view a vehicle with the electrical arrangement of Fig. 1 and with a case, and Fig. Figure 5 shows a schematic cross-sectional view of a printed circuit board with a fluidized bed coating.

[0032] In the following, identical or similarly functioning parts are designated with the same reference symbols and are usually described only once. The description builds upon itself across figures to avoid unnecessary repetition.

[0033] Fig. Figure 1 shows an electrical arrangement 20 comprising a printed circuit board 30, power semiconductors 50, a cooling plate 60, a fluid line device 70 and a capacitor arrangement 80.

[0034] In the exemplary embodiment, the circuit board 30 has three sub-circuit boards 30A, 30B, 30C.

[0035] The circuit board 30 has electrical components 31, 32. The electrical components 32 are, for example, conductor tracks, and the electrical components 31 are, for example, resistors, capacitors, microcontrollers or transistors.

[0036] The electrical components 31 serve to control the power semiconductors 50. In the present case, the power semiconductors 50 are transistors, in particular of the MOSFET or IGBT type.

[0037] Power semiconductors are semiconductor devices designed for use in power electronics to control and switch high electrical currents of more than 1 ampere and voltages of more than 24 volts.

[0038] The power semiconductors 50 are preferably plugged into the circuit board 30 when assembled, but they can alternatively be soldered, for example.

[0039] The cooling plate 60 is arranged on the side of the power semiconductors 50 facing away from the circuit board 30, and it is preferably in contact with the power semiconductors 50. This enables good heat transfer. The cooling plate 60 is preferably made of copper or a copper alloy.

[0040] The fluid line device 70 is arranged on the side of the cooling plate 60 facing away from the power semiconductors 50 and is designed to deflect a cooling fluid towards the cooling plate 60. The fluid line device 70 has an inlet 72.

[0041] The capacitor assembly 80 is arranged on the side of the cooling plate 60 facing away from the power semiconductors 50. The capacitor assembly 80 includes capacitors 82 for filtering or smoothing.

[0042] Fig. Figure 2 shows the electrical arrangement 20 of Fig. 1 in the assembled state of the parts shown 30, 50, 60, 70 and 80.

[0043] The electrical arrangement 20 is preferably a power converter, in particular an inverter. Examples of power converters are: - AC / DC converter, - AC / AC converter, - DC / AC converter, - DC / DC converter.

[0044] The electrical arrangement 20 is particularly preferred as a vehicle inverter, i.e. a DC / AC converter in a vehicle.

[0045] Fig. Figure 3 shows a device 100 for carrying out a fluidized bed sintering process. The device 100 has a container 102, a fluid inlet 104, nozzles 108 and a plastic powder 110 provided in the container 102.

[0046] Through the fluid inlet 104, a fluid flow 106, for example compressed air or another gas 116, can be supplied to the nozzles 108 and flow into the container 102. This creates a gas flow 117 in the container 102, which swirls the plastic powder 110.

[0047] The circuit board 30 is attached to a schematically indicated transport device 112. Fig. 1 attached.

[0048] In the fluidized bed sintering process, the printed circuit board 30 is heated together with the first electrical components 31, 32 attached to it. Preferably, the printed circuit board 30 is heated to at least 120 °C.

[0049] The circuit board 30 is immersed in the container 102 containing the plastic powder 110, the plastic powder 110 is swirled by the gas 117 flowing in the container 102, and a coating 33 is produced in the area of ​​the circuit board 30 and the first electrical components 31, 32 by melting the plastic powder 110.

[0050] The electrical arrangement 20 is then removed from container 102.

[0051] The fluidized bed sintering process creates a fluidized bed coating on the circuit board 30 and on the electrical components 31, 32.

[0052] Fluidized bed coatings differ from other coatings in their surface structure and distribution, particularly in the case of non-smooth structures such as a printed circuit board with electrical components 31, 32. The surface structure may reveal that some of the plastic powder, for example, is not fully fused and therefore exhibits a certain degree of roughness. This roughness can be reduced by post-heating after the coating has been applied.

[0053] As plastic powder 110, at least one material from a material group consisting of the following is preferably used: - Polyamide, - Polyethylene, - Polyester, - Epoxy, and - Poly(ethylene-co-chlorotrifluoroethylene).

[0054] These materials are well suited as electrical insulators for the fluidized bed coating process.

[0055] Fig. Figure 4 shows the electrical arrangement 20 in its fully assembled state.

[0056] In the exemplary embodiment, the electrical arrangement 20 is advantageously provided in a vehicle 10.

[0057] The circuit board 30, provided with the swirl-sintered coating 33, is assembled with the electrical components 31, 32, the power semiconductors 50, the cooling plate 60, the fluid line device 70 and the capacitor arrangement 80 and positioned in a cooling fluid chamber 92 of a housing 90.

[0058] The cooling fluid chamber 92, together with the circuit board 30 with the electrical components 31, 32 and with the power semiconductors 50, and preferably also with the cooling plate 60, the fluid line device 70 and the capacitor arrangement 80, forms a fluid line arrangement 94, wherein the fluid line arrangement 94 has a fluid line area 95 and a fluid line area 96 and, in the exemplary embodiment, fluid line areas 121 for the cooling plate 60, 122 for the fluid line device 70 and 123 for the capacitor arrangement 80.

[0059] The fluid line function of the fluid line device 70, which deflects the cooling fluid 90 towards the cooling plate 60, is shown schematically.

[0060] The fluid line section 95 and the second fluid line section 96 are in fluid communication with the cooling fluid chamber 92.

[0061] At least a first sub-area of ​​the coating 33 in the area of ​​the circuit board 30; and of the first electrical components 31, 32 is in fluid contact with the fluid line area 95.

[0062] At least a second sub-area of ​​the power semiconductors 50 is in fluid communication with the second fluid line area 96.

[0063] Because the coating 33 of the aforementioned elements 30, 31, 32 is in fluid contact with the fluid conduit areas 95, 96 and thus also with the cooling fluid chamber 92, it can be directly temperature-controlled by a cooling fluid 98 in the cooling fluid chamber 92. The same applies to the power semiconductors 50.

[0064] The coating 33 is particularly advantageous because it reduces the risk of an electrical short circuit between the electrical components 31, 32 caused by conductive particles in the cooling fluid 98. In tests, conductive particles such as copper shavings with a size of 700 µm led to short circuits, for example, between two conductor tracks. Such conductive particles can occur as contaminants in the cooling fluid 98, or they can be present at a point in the cooling circuit as contaminants during assembly. The coating 33 can significantly reduce or even completely prevent the risk of a short circuit. The coating 33 is preferably relatively thin, since plastic is usually a poor thermal conductor than metal.

[0065] Preferably, the coating 33 has a layer thickness 34 at least in a specified first region (cf. Fig. 5) in the range of 50 µm to 1,000 µm, more preferably in the range of 50 µm to 700 µm and particularly preferably in the range of 70 µm to 500 µm. These layer thicknesses 34 enable a good reduction of the risk of short circuits and at the same time good cooling of the electrical components 31, 32 protected by the coating 33.

[0066] The specified first area does not have to be continuous; it can therefore also comprise several sub-areas.

[0067] The specified first area preferably comprises at least 30% of the total coating area, more preferably at least 50%, and particularly preferably at least 70%. This allows for a relatively greater overall increase in the effectiveness of the temperature control.

[0068] The coating of the printed circuit board 30 can be carried out without the power semiconductors 50 by electrically connecting the power semiconductors 50 to the printed circuit board 30 with the electrical components 31, 32 only after the board has been coated. This is advantageous, for example, if the power semiconductors already have a coating or potting compound. Such a pre-existing coating on the power semiconductors is usually smoother than a fluidized bed coating, and this allows for a larger contact area between the power semiconductors 50 and the cooling plate 60, and thus better heat conduction. In addition, the printed circuit board 30 with the electrical components 31, 32 can be coated from both sides with greater process reliability.

[0069] The coating of the printed circuit board 30 can alternatively be carried out with the attached power semiconductors 50 by immersing it together with the power semiconductors 50 in the container 102 containing the plastic powder 110. This results in at least partial coating of the power semiconductors 50. This variant has the advantage that no additional process steps are necessary, for example, to cover a via before coating and thus protect it from coating, or to remove the coating from certain areas of the printed circuit board 30 after coating. Such vias are used, for example, when using press-fit technology to attach the power semiconductors.

[0070] In the exemplary embodiment, the housing 90 has at least two fluid line connections 91A, 91B, which comprise at least two fluid line connections 91A, 91B, a first fluid line connection 91A and a second fluid line connection 91B, wherein the fluid line connections 91A, 91B are in fluid communication with each other via the cooling fluid chamber 92. Alternatively, only one fluid line connection 91A or no fluid line connection may be provided.

[0071] In the exemplary embodiment, the schematically indicated busbars 29 extend through the fluid line connection 91A into the cooling fluid chamber 92 and preferably also through the fluid line connection 91B. The circuit board 30, the power semiconductors 50 and / or the capacitor arrangement 80 are preferably electrically connected via the busbars 29 or other electrical conductors.

[0072] The cooling fluid 98 can also be supplied via the fluid line connections 91A, 91B, or a fluid flow 93A, 93B can be generated.

[0073] The cooling fluid 98 is preferably supplied as a dielectric cooling fluid. Dielectric cooling fluid is electrically non-conductive or poorly conductive and can be used for the direct temperature control of current-carrying or voltage-carrying components.

[0074] Examples of dielectric cooling fluids 98 are coolants based on monoethylene glycol or on a mixture of methyl nonafluoro-n-butyl ether with methyl nonafluoro-isobutyl ether, which is offered as a coolant designated R-7100, or on a hydrofluoroether basis, which is offered as a coolant designated HFE-7100.

[0075] Fig.Figure 5 schematically shows a section of the printed circuit board 30. The electrical component 31 on the left is a resistor, and the electrical component 31 on the right is a microcontroller. On the underside of the printed circuit board 30, two adjacent conductor tracks are shown as electrical components 32. The electrical components 31 and 32 are protected from electrical short circuits caused by conductive particles by the swirl-coated coating 33. The cooling fluid 98 can come into direct contact with the coating 33 and directly cool the electrical components 31 and 32.

Claims

[1] Method for manufacturing an electrical arrangement (20) comprising a housing (90), power semiconductors (50) and a printed circuit board (30; 30A, 30B, 30C), wherein the printed circuit board (30; 30A, 30B, 30C) comprises first electrical components (31, 32) for controlling the power semiconductors (50), wherein the housing (90) comprises a cooling fluid compartment (92), and wherein the method comprises the following steps: A) the circuit board (30; 30A, 30B, 30C) is heated together with the first electrical components (31, 32) attached to it, B) the printed circuit board (30; 30A, 30B, 30C) is immersed in a container (102) containing a plastic powder (110), the plastic powder (110) is swirled by a gas flowing in the container (102), and a coating (33) is produced in the area of ​​the printed circuit board (30; 30A, 30B, 30C) and the first electrical components (31, 32) by melting the plastic powder (110), C) The circuit board (30; 30A, 30B, 30C) with the first electrical components (31, 32) attached to it is removed from the container (102), D) The printed circuit board (30; 30A, 30B, 30C) with the electrical components (31, 32) and the power semiconductors (50) are positioned in the cooling fluid compartment (92). A cooling plate (60) is arranged on the side of the power semiconductors (50) facing away from the printed circuit board (30; 30A, 30B, 30C), the cooling plate (60) being in contact with the power semiconductors (50). A fluid line device (70) is arranged on the side of the cooling plate (60) facing away from the power semiconductors (50), the fluid line device being configured to deflect a cooling fluid (98) towards the cooling plate (60). A capacitor arrangement (80) is arranged in the cooling fluid compartment (92) on the side of the cooling plate (60) facing away from the power semiconductors (50), the cooling fluid compartment (92) being connected together with the printed circuit board. (30;30A, 30B, 30C) with the electrical components (31, 32) and with the power semiconductors (50) forms a fluid line arrangement (94), wherein the fluid line arrangement (94) has a first fluid line area (95) and a second fluid line area (96), wherein the first fluid line area (95) and the second fluid line area (96) are in fluid communication with the cooling fluid space (92); wherein at least a first sub-area of ​​the coating (33) in the area of ​​the circuit board (30; 30A, 30B, 30C) and the first electrical components (31, 32) is in fluid communication with the first fluid conduit area (95), and wherein at least a second sub-area of ​​the power semiconductor (50) is in fluid communication with the second fluid conduit area (96), to enable temperature control of the power semiconductors (50) and the circuit board (30; 30A, 30B, 30C) with the first electrical components (31, 32). [2] Method according to claim 1, wherein in step B) the printed circuit board (30; 30A, 30B, 30C) without the power semiconductors (50) is immersed in the container (102) with the plastic powder (110) to prevent coating (33) of the power semiconductors (50) with the plastic powder (110). [3] Method according to claim 1, wherein in step B) the printed circuit board (30; 30A, 30B, 30C) with the power semiconductors (50) attached thereto is immersed in the container (102) containing the plastic powder (110) in order to effect at least a partial coating of the power semiconductors (50) with the plastic powder (110). [4] Method according to one of the preceding claims, wherein a cooling fluid (98) is supplied to the cooling fluid chamber (92) to effect temperature control of the power semiconductors (50) and the circuit board (30; 30A, 30B, 30C) with the first electrical components (31, 32). [5] Method according to claim 4, wherein the cooling fluid (98) is supplied as a dielectric cooling fluid. [6] Method according to claim 4 or 5, wherein a fluid flow (93A, 93B) of the cooling fluid (98) is generated. [7] A method according to any of the preceding claims, wherein at least one material from a group of materials consisting of the following is used as the plastic powder (110): - Polyamide, - Polyethylene, - Polyester, - Epoxy, and - Poly(ethylene-co-chlorotrifluoroethylene). [8] Method according to one of the preceding claims, wherein the printed circuit board (30; 30A, 30B, 30C) together with the first electrical components (31, 32) attached thereto is heated to at least 120 °C in step A). [9] Method according to one of the preceding claims, wherein the coating (33) has a layer thickness (34) in the range of 50 µm to 1,000 µm at least in a predetermined first region, preferably in the range of 50 µm to 700 µm and particularly preferably in the range of 70 µm to 500 µm. [10] Method according to claim 9, wherein the specified first area comprises at least 30% of the total area of ​​the coating (33), preferably at least 50% and particularly preferably at least 70%. [11] Electrical arrangement comprising a housing (90), power semiconductors (50), a printed circuit board (30; 30A, 30B, 30C), a cooling plate (60), a fluid line device (70) and a capacitor arrangement (80), wherein the housing (90) has a cooling fluid compartment (92), wherein the printed circuit board (30; 30A, 30B, 30C) has first electrical components (31, 32) for controlling the power semiconductors (50), wherein the printed circuit board (30; 30A, 30B, 30C) and the first electrical components (31, 32) have at least a partial coating (33) with a plastic, wherein the printed circuit board (30; 30A, 30B, 30C) with the electrical components (31, 32), the power semiconductors (50), the cooling plate (60), the The fluid line device (70) and the condenser arrangement (80) are arranged in the cooling fluid chamber (92), in which the cooling plate (60) is placed on the circuit board (30;30A, 30B, 30C) is arranged on the side of the power semiconductors (50) facing away from the power semiconductors (50) and has contact with the power semiconductors (50), in which the fluid line device (70) is arranged on the side of the cooling plate (60) facing away from the power semiconductors (50) and is designed to deflect a cooling fluid (98) in the direction of the cooling plate (60), in which the capacitor arrangement (80) is arranged on the side of the cooling plate (60) facing away from the power semiconductors (50); in which the cooling fluid chamber (92) together with the circuit board (30; 30A, 30B, 30C) with the electrical components (31, 32) and with the power semiconductors (50) forms a fluid line arrangement (94), in which the fluid line arrangement (94) has a first fluid line area (95) and a second fluid line area (96), in which the first fluid line area (95) and the second fluid line area (96) are in fluid communication with the cooling fluid chamber (92), wherein at least a first sub-area of ​​the coating (33) in the area of ​​the circuit board (30; 30A, 30B, 30C) and in the area of ​​the first electrical components (31, 32) is in fluid contact with the first fluid line area (95), and wherein at least a second sub-area of ​​the power semiconductor (50) is in fluid communication with the second fluid line area (96), to enable temperature control of the power semiconductors (50) and the circuit board (30; 30A, 30B, 30C) with the first electrical components (31, 32) by means of a cooling fluid (98). [12] Electrical arrangement according to claim 11, wherein the coating (33) is designed as a fluidized bed coating. [13] Electrical arrangement according to claim 11 or 12, which has at least two fluid line connections (91A, 91B), wherein the at least two fluid line connections (91A, 91B) comprise a first fluid line connection (91A) and a second fluid line connection (91B), and wherein the fluid line connections (91A, 91B) are in fluid communication with each other via the cooling fluid space (92). [14] Electrical arrangement according to one of claims 11 to 13, which is manufactured according to a method of claims 1 to 10.

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