Device with an improved hold-down device

Abstract

Device (100) for processing a substrate (300), wherein the device (100, 101, 102) comprises a processing chamber (400), the processing chamber (400) comprising an upper chamber wall (410) extending along a first axis (910) and along a second axis (920), the second axis (920) being perpendicular to the first axis (910); and wherein, in use, the substrate (300) is arranged such that it can be processed at a first processing position (800); and wherein the device (100, 101, 102) further comprises a hold-down device (500, 501, 502) arranged to exert, in use, a hold-down force on at least a part of the substrate (300) along a third axis (930) against a support (320) at the first processing position (800); wherein the upper chamber wall (410) comprises a hold-down opening (270) for receiving at least one actuator element (520) of the hold-down device (500, 501, 502);and wherein the actuator element (520) is arranged such that, in use, a holding force received directly from outside the process chamber (400) can be exerted on at least a part of the substrate (300); and wherein the device further comprises a process head (150) for detachable attachment to a component (600), which is arranged such that it can be positioned with the component (600) at the first processing position (800).

Description

Technical area

[0001] The present invention relates to a device for processing a substrate, such as a leadframe. The invention also relates to a device for dispensing solder onto a substrate. Furthermore, the invention relates to a device for distributing solder onto a substrate. The invention also relates to a device for bonding a component to a substrate. State of the art

[0002] Various devices for processing a substrate are known from the state of the art.

[0003] DE 10 2014 116 939 A1 discloses a hold-down device for holding down substrate locations of a substrate, which comprises a plate with a central recess that makes at least one substrate location accessible for bonding semiconductor dies, and with two further recesses arranged on either side next to the center of the central recess, a hold-down plate with a recess and hold-down webs, a first and second pneumatic drive, and pressure lines for supplying a compressed gas to the pressure chambers of the pneumatic drives. Each pneumatic drive comprises a cylinder and a drive element, between which a pressure chamber is formed. The cylinder of the first pneumatic drive is fastened above one further recess, and the cylinder of the second pneumatic drive is also fastened above the other further recess.

[0004] US 5,878,939 A describes the production of separately measured portions of liquid solder, solid solder in the form of wire or a rod, which are fed through the longitudinal bore of a guide tube. A zone comprising the end of the tube is heated above the melting temperature of the solder to liquefy the solder. An adjacent zone of the guide tube, in contrast, is cooled, maintaining a positionally stable temperature transition in the tube. This controls the amount of molten solder available above a constricted outlet. A drive mechanism propels the solder incrementally so that the solid solder acts like a piston to expel portions of the liquid solder through said outlet. A suitable device for applying solder portions to a substrate can be raised and lowered.It has a semiconductor die at its base connected to the outlet, which can be deposited on the substrate and has an open mold cavity on its underside. This determines and limits the surface area of ​​the substrate wetted by the liquid solder. The main application is the bonding of semiconductor chips (components) by soft soldering.

[0005] CH 704 991 A1 describes a method in which at least one solder portion is dispensed onto the surface of a substrate, e.g. a leadframe, a pin is lowered into the solder portion until the pin touches the surface of the substrate, and a predetermined force is exerted on the pin so that the pin presses against the substrate. The pin is subjected to ultrasound in such a way that ultrasonic waves are generated in the pin that are directed perpendicular or at an angle to the substrate surface. The pin is movable along a predetermined path that runs parallel to the surface of the substrate. The pin is lifted until the pin is separated from the soldering area. A method for mounting semiconductor chips (components) on a substrate is also described.

[0006] Devices for processing a substrate within a process chamber with hold-down devices are also known from EP 3 312 871 A1, JP 2000 - 269 267 A or US 2021 / 0 143 026 A1.

[0007] In general, for reliable, repeatable, and reproducible processing of substrates, one or more operations are preferably performed in a controlled process environment. Conventional fixtures can provide this by providing the processing position during processing. Holddown fixtures (or jigs) can also be used to hold substrates to a fixture or support during at least part of a process step. However, inaccuracies or damage can occur if different parts of the holddown fixture are heated unevenly, especially when processing at a temperature much higher than the ambient temperature of the fixture.

[0008] Therefore, a portion of a hold-down device is typically integrated into a top wall of a chamber for a process environment. If this top wall is designed to be openable for offline access, for example, by including one or more lids or flaps, the hold-down force exerted during use is substantially determined or influenced by the force required to close the one or more lids, and / or a closing force of the one or more lids is greater than the hold-down force. Task

[0009] It is an object of the present invention to provide a device suitable for processing substrates, which device has an improved hold-down device with which hold-down forces can be regulated during operation. Solution to the task

[0010] To achieve this object, a technical device according to the independent claim is provided. Technically advantageous embodiments are the subject of the dependent claims, the description, and the figures. Description of the invention

[0011] According to one aspect, the object is achieved by providing a device for processing a substrate.

[0012] Such a device is, for example, a chip processing device or a device for processing semiconductor dies. Generally, in such a device, a process environment suitable for processing a substrate is provided in a process chamber, and the substrate is arranged in the process environment for processing.

[0013] For the purposes of this disclosure, processing refers to any action that can be performed on or with a substrate. Within the meaning of the invention, processing also includes individual process steps, entire processes, or sequences, such as a measurement or inspection, application of solder, dispensing of solder, forming of solder, pre-pressing of solder, bonding of a component, inspection of a component, inspection of a substrate, inspection of a previously bonded semiconductor die, inspection of a holder, inspection of an earlier process step, or inspection before a subsequent process step.

[0014] For the purposes of the invention, successive individual process steps, processes or sequences can be carried out at the same processing position, at different processing positions in the same device, at processing positions in different devices or any combination thereof.

[0015] The process chamber of the device comprises an upper chamber wall extending along a first axis and along a second axis, the second axis being perpendicular to the first axis.

[0016] In use, the substrate is arranged so that it can be processed at a first processing position.

[0017] Suitable substrates for processing are generally any object that has at least one surface to be processed. Suitable substrates for processing include, for example, metallic substrates, also referred to as leadframes, on which components are soldered to chip islands arranged one behind the other and preferably next to one another. However, the invention is not limited to leadframes—the one or more substrates are preferably any object with at least one bondable surface. The one or more substrates can also be referred to as one or more media.

[0018] The component is any object with at least one bondable surface, such as a semiconductor die, a chip, an integrated circuit, or a substrate. The components can have any shape, such as rectangular, square, or round.

[0019] The device comprises a hold-down device which, in use, exerts a hold-down force on at least a portion of the substrate along a third axis, which is perpendicular to the first axis and the second axis, against a holder by which the substrate is held at the first processing position or against a support on which the substrate lies at the first processing position.

[0020] This has the advantage that during processing the substrate is rigidly pressed against a suitable holder, preferably against a suitable support, which is arranged to receive the substrate before processing and to hold or provide the substrate during processing.

[0021] In embodiments of a device, the holder or support is essentially either a fixed holder or fixed support or a movable holder or movable support, which in both cases is preferably designed as a removable or replaceable support or holder. These holders or supports can preferably be subjected to vacuum, and the supports are preferably designed as a so-called substrate chuck.

[0022] The substrate is thus advantageously secured against slipping.

[0023] Embodiments of a device rigidly hold the substrate during contact with the holder. Preferably, the processing device comprises a holder in the form of a support arm with a, preferably fork-shaped, media carrier arranged to bring the substrate into a processing position.

[0024] Embodiments of an apparatus for processing a substrate are preferably particularly suitable for bonding a component to a substrate.

[0025] The upper chamber wall of the process chamber comprises a hold-down opening for receiving at least one actuator element of the hold-down device. The actuator element is arranged such that, in use, it exerts a hold-down force, received directly from outside the process chamber, on at least a portion of the substrate (300), thereby additionally securing the substrate against slippage.

[0026] Preferably, a portion of the upper chamber wall is arranged to be openable to provide access to at least a portion of the interior of the process chamber.

[0027] By providing a hold-down opening in the wall of a process chamber of a device for processing a substrate and an actuator element extending from the outside of the process chamber to the hold-down device, for example, the technical advantage is achieved that the hold-down force exerted in the device can be independently specified and / or precisely controlled compared to other mechanical forces in the device.

[0028] Preferably, this can also provide a high degree of thermal insulation for temperature-sensitive parts, such as an actuator.

[0029] Preferably, a portion of the upper chamber wall is arranged to be openable to provide access to at least a portion of the interior of the process chamber. For example, if at least a portion of the chamber wall is arranged as a lid or hatch that can be opened to provide physical access to the process environment, the hold-down force is largely independent of the force required to close that lid.

[0030] The part of the chamber wall to be opened is preferably arranged so that it can be opened without human intervention and / or automatically.

[0031] The ability to exert higher forces on a substrate is advantageous for firmly holding larger and heavier substrates, such as those used in high-performance and electromobility applications. Such larger and heavier substrates are impractical in conventional hold-down devices because applying higher forces would also result in the resulting force being directed against the closing direction of the lid. Additionally, if at least part of the chamber wall is arranged as a lid, the lid is opened without removing any parts of the hold-down device.

[0032] Embodiments of an apparatus include one or more process heads arranged functionally similar to a gripper, wherein the one or more process heads are arranged to move positively and negatively along the third axis, and wherein process openings are arranged to receive one or more process heads.

[0033] Embodiments of an apparatus include a process head for dispensing solder onto a substrate for a soldering process.

[0034] The advantage of this is that the process head is functionally similar to a solder dispenser to dispense solder to components for a soldering process.

[0035] Embodiments of an apparatus include a process head for forming solder on a substrate for a soldering process.

[0036] Embodiments of a device also comprise a process head for releasably attaching to a component, which is arranged such that it can be positioned with the component at the first processing position.

[0037] Embodiments of a device also comprise a process head for inspecting the substrate, for inspecting the component, for inspecting the holder or the support, for inspection after a previous process step and / or for inspection before a subsequent process step. In embodiments of a device, the upper chamber wall comprises a process opening suitable for receiving one of the process heads, several process heads or all of the process heads, wherein the process opening is arranged in such a way as to enable movement of at least one process head towards and / or away from the first processing position along a third axis, wherein the third axis is perpendicular to the first axis and perpendicular to the second axis.

[0038] In embodiments of a device, the process opening and the hold-down opening are each separate openings in the upper chamber wall.

[0039] In embodiments of a device, the hold-down device comprises one or more hold-down projections attached to the actuator element, the one or more hold-down projections being arranged to exert, in use, a hold-down force received by the actuator element directly onto at least a portion of the substrate.

[0040] In embodiments of a device, the hold-down device comprises a hold-down drive arranged outside the process chamber to exert a hold-down force on the actuator element.

[0041] By providing the hold-down drive outside the process chamber, a high degree of thermal insulation is provided between the hold-down drive and the process chamber, and the hold-down device is arranged to exert, in use, a hold-down force on at least a portion of the further substrate along the third axis at the second processing position, wherein the further hold-down force is exerted, in use, using the actuator element directly from outside the process chamber on at least a portion of the one or more further substrates.

[0042] In embodiments of a device, the hold-down device comprises a hold-down element that extends outside the process chamber along the second axis and is arranged to exert a hold-down force on the actuator element.Preferably, a first end portion of the hold-down member comprises a drive attachment for attachment to a hold-down drive positioned outside the process chamber; wherein a second end portion of the hold-down member comprises a pivot point arranged to convert, in use, at least a portion of the movement of the hold-down member due to operation of the hold-down drive into a degree of rotation about the first axis; and wherein the attachment of the hold-down member to the actuator member is arranged to convert, in use, at least a portion of the degree of rotation about the first axis into a degree of movement of the actuator element along the third axis towards the substrate at the first processing position, thereby exerting a hold-down force on the actuator element.

[0043] In embodiments of a device, the process chamber is arranged to provide one or more process environments during use. Preferably, the process opening is arranged to provide one or more gas curtains that enable a predetermined and / or controlled gas flow into and / or out of one or more process environments during use. Preferably, the hold-down opening is arranged to provide one or more gas curtains that enable a predetermined and / or controlled gas flow into and / or out of one or more process environments during use.

[0044] In embodiments of a device, the process chamber comprises a lower chamber wall extending along the first axis and along the second axis. Preferably, the lower chamber wall and the support are integrally or positively and non-positively secured to one another.

[0045] In embodiments of an apparatus, the apparatus comprises one or more heating devices and / or one or more heating elements arranged to increase a temperature of at least a portion of one or more surfaces of the substrate to be processed. Preferably, the one or more heating devices and / or the one or more heating elements are attached to the process head. Preferably, the one or more heating devices or the one or more heating elements are housed in the process chamber or attached to the process chamber.

[0046] In embodiments of an apparatus, the process chamber is arranged to receive a component, and the substrate is arranged, in use, to receive and hold the component during processing.

[0047] In embodiments of a device, a component is a semiconductor die, a semiconductor package, a chip, an integrated circuit, a substrate, or any combination thereof.

[0048] In embodiments of a device, the device comprises a media carrier arranged to move along a first axis to position the substrate at the first processing position. Preferably, the media carrier and the support are integrally connected to one another or are positively and force-fitted.

[0049] In embodiments of a device comprising a media carrier, preferably integrally connected to a support or positively and non-positively connected to one another, which is arranged to move along a first axis in order to position the substrate at the first processing position, the media carrier is preferably arranged to move the substrate along the first axis and to position the substrate at one or more further positions for loading the substrate, dispensing solder onto at least part of the processing position of the substrate, distributing solder onto at least part of the processing position of the substrate, processing the substrate and / or unloading the substrate.

[0050] In embodiments of a device comprising a media carrier, preferably integrally formed with a support or connected to one another in a form-fitting and friction-locking manner, which is arranged to move along a first axis in order to position the substrate at the first processing position, the media carrier is preferably arranged to move the substrate along the first axis and to position the substrate at one or more further positions for loading the substrate, dispensing solder onto at least part of the processing position of the substrate, distributing solder onto at least part of the processing position of the substrate, processing the substrate and / or unloading the substrate, wherein the device preferably comprises a further process head for releasably fastening to a further component, which is arrangedthat it can be positioned with the further component in a second processing position, wherein the media carrier is arranged such that it is movable along the first axis and / or along the second axis in order to position a further substrate at the second processing position.

[0051] In embodiments of a device comprising a media carrier, preferably integrally connected to a support or positively and non-positively connected to one another, which is arranged to move along a first axis in order to position the substrate at the first processing position, the media carrier is preferably arranged to move the substrate along the first axis and to position the substrate at one or more further positions for loading the substrate, dispensing solder onto at least part of the processing position of the substrate, distributing solder onto at least part of the processing position of the substrate, processing the substrate and / or unloading the substrate.

[0052] In embodiments of a device comprising a media carrier, preferably integrally connected to a support or positively and non-positively connected to one another, which is arranged to move along a first axis in order to position the substrate at the first processing position, the media carrier is preferably arranged to move the substrate along the first axis and to position the substrate at one or more further positions for loading the substrate, dispensing solder onto at least part of the processing position of the substrate, distributing solder onto at least part of the processing position of the substrate, processing the substrate and / or unloading the substrate.Such embodiments of a device preferably also comprise a further processing head for releasably attaching to a further component, which is arranged such that it can be positioned with the further component in a second processing position, wherein the media carrier is arranged such that it is movable along the first axis and / or along the second axis in order to position a further substrate at the second processing position. Character description

[0053] Further advantages and features of the invention will become apparent from the following figures, namely: Fig. 1A and Fig. 1B show cross-sections through a part of a device suitable for processing; Fig. 2A and Fig. 2B show cross-sections through a part of a device suitable for processing; Fig. 3A and Fig. 3B show cross-sections through a part of a device suitable for processing; Fig. 4 shows a perspective view of a hold-down device; Fig. Figure 5 is a perspective view of a portion of an apparatus suitable for processing; Fig. Figure 6 is a perspective view of a portion of an apparatus suitable for processing; Fig. 7A illustrates a cross-sectional view of a portion of an apparatus suitable for processing when a hold-down device does not exert a hold-down force on a substrate; Fig. 7B illustrates a cross-sectional view of a portion of an apparatus suitable for processing when a hold-down device applies a hold-down force to a substrate; and Fig. Figure 8 shows a cross-section through part of a device suitable for processing when a part of the upper chamber wall is arranged as a lid or flap and is open for access to the process environment. Detailed description

[0054] The figures show a first axis 910, a second axis 920, and a third axis 930. The first axis 910 is substantially perpendicular to the second axis 920, and the third axis 930 is substantially perpendicular to both the first axis 910 and the second axis 920.

[0055] It is convenient to consider the first axis 910 in an X direction, the second axis 920 in a Y direction, and the third axis 930 in a Z direction.

[0056] In use, the first axis 910 and the second axis 920 are substantially horizontal, and the third axis 930 is substantially vertical. To clarify the description of the various assemblies and parts, the figures depict these assemblies and parts in these conventional orientations. In addition, some relative terms, such as top, bottom, segment face, and base, have been used to conform to this convention. However, the apparatus described in this disclosure may be arranged by one skilled in the art to operate in various deviations from these conventional orientations and nominal coordinate axes.

[0057] Fig. 1A and Fig. 1B are simplified and schematic cross-sections through a part of a first embodiment 100 of an apparatus for processing.

[0058] Fig. 1A illustrates a longitudinal section lying in a plane including the first axis 910, nominally depicted as having a positive left-to-right direction, and the third axis 930, nominally depicted as having a positive bottom-to-top direction. The second axis 920 is nominally depicted as having a positive direction extending into the drawing. The longitudinal section extends through a first machining position 800.

[0059] Fig. Figure 1B illustrates a cross-section lying in the plane containing the second axis 920, nominally shown as positively oriented from left to right, and the third axis 930, nominally shown as positively oriented from bottom to top. The first axis 910 is nominally shown as having a positive direction extending into the drawing. The longitudinal section extends through the first machining position 800.

[0060] The first embodiment 100 includes an optional process head 150 for releasably attaching to a component 600, which is arranged so that it can be positioned with the component 600 at the first processing position 800.

[0061] Fig. 1A and Fig. 1B illustrates the component 600 released from the process head 150 at the first processing position 800. Prior to this illustration, the component 600 was picked up (or loaded) by the process head 150 at a pick (or load) position (not shown), moved to the first processing position 800, and deposited from the process head 150. For example, the component 600 is preferably picked up from a component handling system, such as a wafer or a tape. Preferably, the substrate 300 may have been moved to the first processing position 800 using a suitable media carrier (not shown) prior to this operation.

[0062] Fig. 1A and Fig. 1B illustrate the first embodiment 100 during processing at the first processing position 800. Fig. 1A is a simplified and schematic cross-section through a portion of the first embodiment 100 at the first processing position 800, as shown in Fig. Line 1A-1A shown in Figure 1B. Fig. 1B is a simplified and schematic cross-section through a portion of the first embodiment 100 at the first processing position 800, as shown in Fig. 1A. As shown, the component 600 is in contact with the substrate 300 so that one or more processing steps can be performed on at least a portion of the one or more processing surfaces (not shown) of the substrate 300. The process head 150 can be movable along the third axis 930 in positive and negative directions, i.e., away from the substrate 300 or toward the substrate. Preferably, the process head 150 is arranged to rotate about the third axis 930 (not shown).

[0063] The first embodiment 100 includes a processing chamber 400 arranged to receive the component 600. The process chamber 400 includes an upper chamber wall 410 extending along the first axis 910 and the second axis 920, and a lower chamber wall 420 extending along the first axis 910 and the second axis 920. Preferably, the process chamber 400 is configured to reduce the degree of oxidation of at least a portion of the substrate 300 by flooding the process chamber with an inert gas. Optionally, the first embodiment 100 includes one or more process gas inlets (not shown) for introducing an inert gas (not shown) into a processing environment 700 (or process environment 700) within the process chamber 400 during use, wherein the process environment 700 is predetermined and / or controlled to be suitable for the type of processing to be performed.The inert gas is any suitable inert gas, such as nitrogen, carbon dioxide, helium, neon, argon, krypton, or a combination thereof. The one or more inert gases are preferably miscible with one or more less inert gases. A typical combination has the ratio of 5% hydrogen to 95% nitrogen or the ratio of 10% hydrogen to 90% nitrogen. Preferably, the first embodiment 100 is arranged to displace the oxygen from the process environment 700, thereby creating a relatively oxygen-poor process environment for processing with a relatively low inert gas consumption. This is particularly advantageous when the processing includes one or more thermocompression (or TC) steps.

[0064] As in Fig. 1A and Fig. 1B, the upper chamber wall 410 includes a process opening 250 arranged to receive the process head 150 during movement of the process head 150 along the third axis 930 toward the substrate 300 at the first processing position 800. Generally, the process opening 250 is sized larger than the outer dimensions of the process head 150. Preferably, when the process head is arranged functionally similar to a gripper and when the outer dimensions of the component 600 are larger than the outer dimensions of the process head 150, the process opening 250 is sized larger than the outer dimensions of the component 600. Preferably, the process opening 250 is arranged to provide one or more gas curtains that enable a predetermined and / or controlled flow of inert gas from the process environment 700. In the Fig. 1A and Fig. 1B, the process opening 250 extends around the circumference of the process head 150. Preferably, it may also be advantageous to reduce the average distance of at least a portion of the process opening 250 by attaching a sealing lip to the upper chamber wall 410 and / or to the process head 150. Preferably, it is advantageous if the dimensions of the process environments and any process openings are predetermined and / or controllable in order to provide a relatively small installation volume for the required process environment for processing in order to reduce gas consumption. Preferably, a portion of the upper chamber wall is arranged such that it can be opened to allow access to at least a portion of the interior of the processing.Preferably, the process opening 250 is covered by a cover that is connected to the process head 150 and is movable with the process head along the first axis 910 and / or along the second axis 920. The cover is configured to cover at least a portion of the process opening 250.

[0065] The first embodiment 100 includes a hold-down device 500 (or a first variant 500 of a hold-down device) arranged to exert, in use, a hold-down force on at least a portion of the substrate 300 along the third axis 930 against the support 320 at the first processing position 800. The upper chamber wall 410 includes a hold-down opening 270 to receive at least one actuator element 520 of the hold-down device 500 and, in use, to allow the actuator element 520 of the hold-down device 500 to direct the hold-down force directly from outside the process chamber 400 onto at least a portion of the substrate 300. In the prior art solutions, the hold-down force generates a counterforce acting against the upper chamber wall of the process chamber.However, due to the arrangement of the device 100, in particular the arrangement of the pivot points of the hold-down device 500 and the upper chamber wall 410, the influence of the hold-down force on the upper chamber wall 410 is less than 10%, less than 5%, or less than 1%. Preferably, the hold-down opening 270 is arranged to provide one or more gas curtains that allow a predetermined and / or controlled gas flow from the process environment 700 during use.

[0066] In the Fig. 1A and Fig. 1B, the hold-down device 500 includes a hold-down element 510 that extends outside the processing chamber 400 along the second axis 920 and is arranged to apply the hold-down force directly to an actuator element 520 of the hold-down device 500. The actuator element 520 of the hold-down device 500 is preferably any element or elements that can be arranged to apply the hold-down force from outside the processing chamber 400 directly to at least a portion of the substrate 300. The actuator element 520 of the hold-down device 500 includes one or more sub-elements that are rigidly attached to one another.The illustrated hold-down device 500 includes one or more hold-down projections 541, 542 attached to the actuator element 520 of the hold-down device 500, the one or more hold-down projections 541, 542 being arranged to, in use, directly apply the hold-down force transmitted by the actuator element 520 of the hold-down device 500 to at least a portion of the component 600. In particular, in the illustrated example, the one or more hold-down projections 541, 542 are two elongated projections, each arranged to be positionable along the first axis 910 proximate an edge of the component 600.

[0067] In the Fig. 1A and Fig. 1B, the actuator element 520 extends along the third axis 930 and along the second axis 920. The actuator element 520 is attached to the one or more hold-down projections 541, 542 and arranged to transfer a hold-down force received by the actuator element 520 to the one or more hold-down projections 541, 542. In some arrangements, it is advantageous if the actuator element 520 includes a plurality of hold-down elements 510 that are fixedly connected to one another to enable efficient force transfer. In some arrangements, it is advantageous if the hold-down element 510 is attached to the actuator element 520 and arranged to transfer a hold-down force received by the hold-down element 510 to the actuator element 520.

[0068] By providing a hold-down opening 270 in the upper chamber wall 410 of the process chamber 400 and an actuator element 520 extending from the exterior of the process chamber 400 to at least a portion of the component 600, the applied hold-down force is independently predetermined and / or controlled to a high degree compared to other mechanical forces in the device. For example, the applied hold-down force is highly independent of any other forces applied by one or more walls of the process chamber 400. Preferably, a portion of the upper chamber wall is arranged to be openable to provide access to at least a portion of the interior of the process chamber.For example, even if at least a portion of the upper chamber wall 410 is arranged as a lid or hatch that can be opened to gain access to the process environment 700, the hold-down force exerted by the actuator element 520 is largely independent of the force required to close this lid. The hold-down device 500 is thus highly mechanically isolated, i.e., decoupled, by providing one or more gaps, i.e., distances, between the walls of the hold-down opening 270 and the portion of the actuator element 520 that extends through the hold-down opening 270. For example, the hold-down force exerted on the substrate 300 at the first processing position is 800 to 75 Newtons (N). The ability to exert higher forces is advantageous for rigidly holding larger and heavier components, such as those used for high-performance and electromobility applications.These larger and heavier substrates are disadvantageous in conventional hold-down devices because applying higher forces would also result in the resulting force being directed against the closing direction on the lid.

[0069] Additionally or alternatively, a high degree of thermal insulation is provided. For example, temperature-sensitive parts of the hold-down device 500, such as drives, are positioned outside the process environment 700, which can enable a high degree of thermal insulation of these temperature-sensitive parts, particularly when the process chamber is heated to a temperature between 250 and 500 degrees Celsius, which is determined by the materials to be processed. Preferably, a high degree of thermal insulation is provided by one or more air gaps between the walls of the process chamber 400 and the temperature-sensitive parts.

[0070] Preferably, a portion of the upper chamber wall 410 is arranged to be openable to provide access to at least a portion of the interior of the process chamber 400. If at least a portion of the upper chamber wall 410 is arranged as a lid that can be opened for physical access, it is advantageous to arrange the portions of the hold-down device 500 outside the process chamber 400 so that they are easily removable or easily movable out of the way of a lid.

[0071] Preferably, the first embodiment 100 comprises one or more heaters and / or one or more heating elements (neither shown) arranged to, in use, warm or heat at least a portion of one or more surfaces to be processed of a substrate 300 for processing. Preferably, the process head 150 comprises the one or more heaters or the one or more heating elements. Additionally or alternatively, the process chamber 400 comprises the one or more heaters and / or the one or more heating elements. The one or more heaters and / or the one or more heating elements may provide heat to the one or more surfaces to be processed for processing by conduction, convection, radiation, or a combination thereof.The use of one or more heating devices is advantageous when the first embodiment 100 of the device is used for processing that includes one or more heating processes during processing, such as a thermocompression (TC) process. For example, it is necessary to heat at least a portion of one or more processing surfaces to temperatures between 250 and 500 degrees Celsius, which are determined by the materials to be processed. To achieve this, one or more heating devices and / or one or more heating elements are provided, which are included in the process head 150 and have a heating output of 500 degrees Celsius or more. Alternatively or additionally, one or more heating devices and / or one or more heating elements are included in the lower chamber wall 420 with a heating output of up to 550 to 600 degrees Celsius.

[0072] Preferably, it is also advantageous to create and / or maintain a processing environment for processing while the one or more components are being processed. Preferably, the first embodiment 100 is arranged to apply a bonding pressure to at least a portion of one or more surfaces of the substrate 300 for processing in use. For example, for bonding, a force of up to 500 N (Newtons) is applied to exert such pressure.

[0073] As in Fig. 1A and Fig. 1B, the process opening 250 and the hold-down opening 270 may preferably overlap at least partially. Thus, the process opening 250 and the hold-down opening 270 are contiguous or combined openings in the upper chamber wall 410.

[0074] Fig. 2A and Fig. 2B are simplified and schematic cross-sections through a portion of a second embodiment 101 of a processing apparatus. The second embodiment 101 includes the same functionalities as described above for the first embodiment 100 and may similarly include the optional functions and features described above. The second embodiment 101 includes the same features as described above for the first embodiment 100, except for the following differences A01 to A03: • A01: The process opening 250 and the hold-down opening 270 are separate openings in the upper chamber wall 410. In the Fig. 2A and Fig. In the example illustrated in Figure 2B, the process opening 250 and the hold-down opening 270 are separated along the first axis 910. Additionally or alternatively, the process opening 250 and the hold-down opening 270 are separated from each other along the second axis 920. • A02: The second embodiment 101 includes a second variant 501 of a hold-down device. The second variant 501 corresponds to the first variant 500 of a hold-down device, with the exception that the actuator element 520 extends substantially further along the first axis 910 in the negative direction so that the hold-down force absorbed by the hold-down element 510 can be transmitted to the one or more hold-down projections 541, 542. This is advantageous for thermal insulation because it can reduce the number and size of the openings in the upper chamber wall 410, which is located directly above the first processing position 800. • A03: Fig. Figure 2A is a simplified and schematic cross-section through a portion of the second embodiment 101 at the first processing position 800, as shown in Fig. Line 2A-2A shown in Figure 2B. Fig. Figure 2B is a simplified and schematic cross-section through a portion of the second embodiment 101 at the first processing position 800, as shown in Fig. Line 2B-2B shown in Figure 2A.

[0075] Fig. 3A and Fig. 3B are simplified and schematic cross-sections through a portion of a third embodiment 102 of a processing device. The third embodiment 102 includes the same functionalities as described above for the first embodiment 100 and the second embodiment 101 and may preferably include the optional functions and optional features described above. The third embodiment 101 includes the same functions as described above for the second embodiment 102, except for the following differences B01 to B07: • B01: The third embodiment 102 includes a second machining position 805. In the illustrated example, the second machining position 805 is separated from the first machining position 800 along the first axis 910, and the functionality provided at the second machining position 805 is analogous to the functions and features provided at the first machining position 800. Additionally or alternatively, the first machining position 800 and the second machining position 805 are separated from each other along the second axis 920. The operations provided at the second machining position 805 are identical, the same, similar, or different to the operations provided at the first machining position 800. • B02: In the example shown, the third embodiment 102 of the processing also comprises a further process head 1150. The functionality of the further process head 1150 is analogous to that of the process head 150. Additionally or alternatively, the third embodiment 102 is arranged such that the process head 150 is movable between the first processing position 800 and the second processing position 805, so that the same process head 150 can be used in one or more processing positions 800, 805. • B03: In the illustrated example, the second processing position 805 is arranged to process another substrate 1300 while being rigidly held against another support 1320. Additionally or alternatively, the second processing position 805 is arranged to process the other component 1600 in parallel with the processing at the first processing position 800. • B04: The third embodiment 102 further includes a further process opening 1250 in the upper chamber wall 410, which is separated from the process opening 250 and the holding opening 270. In the illustrated example, the further process opening 1250 and the process opening 250 are separated along the first axis 910. Additionally or alternatively, the further process opening 1250 and the process opening 250 are separated from each other along the second axis 920. • B05: The third embodiment 102 comprises a third variant 502 of a hold-down device. It corresponds to the second variant 501, with the exception that the actuator element 520 extends substantially further along the first axis 910 in the positive direction so that the hold-down force received by the hold-down element 510 can be transmitted to one or more further hold-down projections 1541, 1542 provided in the second processing position 805. The third variant 502 corresponds to the second variant 501 with respect to the actuator element 520, which extends substantially along the first axis 910 in the negative direction so that the hold-down force received by the hold-down element 510 can also be transmitted to one or more hold-down projections 541, 542 provided at the first processing position 800.For example, the hold-down force applied to the substrate 300, 1600 is up to 75 Newton (N) at each processing position 800, 805. • B06: A further process environment 1700 is provided at the second processing position 805 inside the process chamber 400 between the further substrate 1300 and the further process head 1150. The process environment 1700 is predetermined and / or controlled such that it is suitable for processing. Preferably, a process environment 1700 is also provided that is identical, the same, similar, or different to the process environment 700 at the first processing position 800. • B07: Fig. 3A is a simplified and schematic cross-section through a portion of the third embodiment 102 at the first processing position 800 and the second processing position 805, as shown in Fig. Line 3A-3A shown in Figure 3B. Fig. 3B is a simplified and schematic cross-section through a portion of the third embodiment 102 at the second processing position 805, as shown in Fig. Line 3B-3B shown in Figure 3A.

[0076] Fig. 4 illustrates a perspective view of the third variant 502, as well as an enlarged perspective view of the actuator element 520 and the hold-down projections 541, 542. In this non-limiting example, the actuator element 520 extends along the third axis 930 in the negative direction and along the second axis 920 in both the positive and negative directions.

[0077] The third variant 502 comprises the hold-down element 510, which extends along the second axis 920 and is arranged to exert the hold-down force directly on the actuator element 520. The hold-down element 510 is arranged to extend outside the process chamber (not shown in Fig. 4). The following aspects, C01 to C04, are in Fig. 4 and in Fig. 3A or Fig. 3B not or not fully shown: • C01: In the illustrated example, the arrangement of the hold-down element 510 is explained in more detail. The hold-down element 510 includes a first end portion with a drive attachment 550 for attachment to a hold-down drive (not shown). The hold-down element 510 includes a second end portion with a pivot point 570 arranged to convert, in use, at least a portion of the movement of the hold-down element 510 due to the operation of the hold-down drive 560 into a degree of rotation about the first axis 910. • C02: In the example shown, the arrangement of the actuator element 520 is explained in more detail. The attachment of the hold-down element 510 to the actuator element 520 is arranged such that, in use, at least part of the degree of rotation about the first axis 910 is converted into a degree of movement of the actuator element 520 along the third axis 930 in the direction of the holder (not shown) at the first processing position 800, whereby a hold-down force absorbed by the hold-down element 510 is transmitted to the actuator element 520. • C03: The example shown illustrates a possible arrangement of hold-down projections 541, 542 attached to the actuator element 520. These are two elongated finger-shaped hold-down projections 541, 542, each extending in the negative direction along the first axis 910 and intended to be positioned near an edge of the component (not shown). • C04: The third variant 502 also includes further hold-down projections 1541, 1542, which are attached to the actuator element 520. These hold-down projections 1541, 1542 are in the Fig. 4 because they are hidden behind the hold-down element 510. The further hold-down projections 1541, 1542 are similar to the hold-down projections 541, 542 in that they are two elongated finger-shaped projections, each extending in the positive direction along the first axis 910 and each arranged to be positioned near an edge of the component (not shown).

[0078] Fig. 5 illustrates a further perspective view of a portion of the process chamber 400 included in the third embodiment 102. The third embodiment 102 includes the third variation 502 of a hold-down device described above with respect to Fig. 4 was described. Fig. However, Figure 5 shows the third variant 502 after assembly and after closing the process chamber 400. The third embodiment 102 is thus shown as it is used in processing. The following aspects, D01 to D09, are shown in Fig. 5 and in Fig. 3A or Fig. 3B not or not fully shown: • D01: The third embodiment 102 includes a hold-down drive 560 arranged to be outside the process chamber 400. The hold-down drive 560 is connected to the drive mount 550 of the hold-down element 510 such that the hold-down drive 560 can exert a hold-down force on the first end portion of the hold-down element 510, thereby providing, in use, a degree of rotation about the first axis 910 and, in particular, a degree of rotation about the pivot point 570 comprising the second end portion of the hold-down element 510. • D02: In the example shown, the hold-down element 510 extends outside the processing chamber 400 for processing along the second axis 920 and is arranged to exert the hold-down force on the actuator element (not shown). The actuator element is in Fig. 5 because it is hidden behind the upper chamber wall 410 and behind the hold-down member 510. The first end portion of the hold-down member 510 includes a drive attachment 550 connected to the hold-down drive 560, making the third embodiment 102 ready for use in processing the components. The second end portion of the hold-down member 510 includes the pivot point 570 attached to the third embodiment 102 so that, in use, at least a portion of the movement of the hold-down member 510 is converted into a degree of rotation about the first axis 910 due to the operation of the hold-down drive 560. • D03: The hold-down element 510 extends between the pivot point 570 and the drive mount 550 along the outer surface of the upper chamber wall 410. The hold-down element 510 is located above the hold-down opening 270 and is attached to the actuator element (not shown) and arranged to transmit the hold-down force received by the hold-down element 510 through the hold-down opening 270 to the actuator element (not shown). Fig. In the example shown in Figure 5, the hold-down opening 270 is separate from the process opening 250 and also separate from the further process opening 1250. • D04: The process head and the further process head are in Fig. 5 not shown. The upper chamber wall 410 includes the process opening 250, which is arranged to receive the process head (not shown) during movement of the process head (not shown) along the third axis 930 toward the holder or support (both not shown). Similarly, the upper chamber wall 410 includes a separate further process opening 1250, which is arranged to receive the further process head (not shown) during movement of the further process head (not shown) along the third axis 930 toward the further holder or support (both not shown). Additionally or alternatively, as described above, the further process opening 1250 is arranged to receive the process head (not shown). As in Fig. 5, the openings 250, 270, 1250 in the upper chamber wall 410 are shown to be approximately rectangular in cross-section. However, any suitable cross-sectional shape may be used. • D05: One of the hold-down projections 542 is in Fig. 5 because it is visible through the process opening 250 in this view. A second hold-down projection is hidden in this perspective view. Similarly, one of the further hold-down projections 1541 is shown in Fig. 5 because it is visible in this view through the further process opening 1250. A second further hold-down projection is hidden in this perspective view. • D06: The pivot point 570 is rigidly mounted so that, in use, at least a portion of the movement of the hold-down element 510 is converted into a degree of rotation about the first axis 910. Preferably, as in Fig. 5, the mechanical attachment 580 of the pivot point 570 is rigidly attached to an outer surface of the process chamber 400. Preferably, as shown in Fig. 5, the mechanical attachment 580 is rigidly attached to a suitable portion of the lower chamber wall 420. Preferably, it is advantageous to rigidly attach the pivot point 570 to a portion that is highly mechanically isolated from the processing chamber 400—this may increase the degree of mechanical isolation of the third variant 502 of a hold-down device from the processing chamber 400. Preferably, a high degree of mechanical isolation is provided by one or more gaps between the processing chamber 400 and the portion to which the pivot point 570 is rigidly attached. • D07: The hold-down drive 560 is rigidly mounted so that, in use, a hold-down force is exerted on the first end portion of the hold-down element 510. Preferably, the hold-down drive 560 is rigidly mounted to an outer surface of the process chamber 400 for processing. Preferably, the hold-down drive 560 is fixedly connected to a suitable part of the upper chamber wall 410. Preferably, as in Fig. 5, the hold-down drive 560 is rigidly attached to a part that is highly mechanically isolated from the process chamber 400—this may increase the degree of mechanical isolation of the third hold-down device variant 502 from the process chamber 400. Additionally or alternatively, this may increase the degree of thermal isolation of the third hold-down device variant 502 from the process chamber 400. Preferably, a high degree of thermal and / or mechanical isolation is provided by one or more gaps between the walls of the process chamber 400 and the temperature-sensitive hold-down drive 560. The hold-down drive 560 may generate and provide the hold-down force by any suitable means, such as mechanical, electrical, magnetic, inductive, pneumatic, hydraulic, or a combination thereof. • D08: The third embodiment 102 further comprises an optional processing position 810 for processing. In the illustrated example, the further processing position 810 is separated from the first processing position 800 along the first axis 910 and also separated from the second processing position 805 along the first axis 910. Additionally or alternatively, the further processing position 800 and the second processing position 805 are separated from one another along the second axis 920. In the illustrated example, the process chamber 400 does not extend to the further processing position, so that the functionalities provided at the further processing position 805 differ from the functionalities provided at the first processing position 800 and also from the functionalities provided at the second processing position 810.The processes provided at the further processing position 810 are similar to or different from the processes provided at the second processing position 805 and are also similar to or different from the processes provided at the first processing position 800. In the example shown, the second processing position 805 is located between the first processing position 800 and the further processing position 810.For example, at the first processing position 800, solder dispensing is arranged, at the second processing position 805, solder pre-pressing is arranged, and at the further processing position 810, bonding is arranged. The third variant 502 of a holding device is arranged to firmly hold a component (not shown) during solder dispensing and solder pre-pressing, and the third embodiment 102 of a device is arranged to move the component with applied solder to the further processing position 810 for bonding. • D09: Preferably, a component driver (not shown) is provided at least partially within the process chamber 400 to move one or more components between different processing positions. For example, a media carrier or a substrate handler is provided to move the one or more components. For example, one or more components are moved using an index pin (not shown), the index pin being arranged to be received by corresponding holes in the one or more components, such that the one or more components are moved through the process chamber between the processing positions 800, 805, 810.

[0079] Fig. 6 illustrates another perspective view of a portion of the process chamber 400 included in the third embodiment 102 of a bonding apparatus (or third embodiment 102). The third embodiment 102 includes the third variation 502 of a hold-down device described above with respect to Fig. 4 was described. Fig. However, Figure 6 shows the third variant 502 during assembly or maintenance and before closing the process chamber 400 for use, wherein a portion of the upper chamber wall 410 is preferably arranged to open as a lid for access to the interior of the process chamber 400. For example, opening the lid portion of the upper chamber wall 410 may provide physical access to the process environment, the fixture, the component, or a module or device comprising the process chamber 400. The following aspects, E01 to E03, are in Fig. 6 and in Fig. 3A or Fig. 3B not or not fully shown: • E01: The hold-down drive 560 and the drive attachment 550 of the hold-down element 510 are released from each other so that the hold-down element 510 can rotate about the first axis 910 at the pivot point (not shown). Preferably, as in Fig. 6, the mechanical attachment 580 of the pivot point (not shown) is rigidly connected to a suitable portion of the lower chamber wall 420 so that the hold-down element 510 can rotate with the lid portion of the upper chamber wall 410 about the first axis 910. Preferably, the hold-down drive 560 and / or the drive attachment 550 is arranged to allow for quick release and / or quick attachment. • E02: The hold-down drive 560 is rigidly attached to a part that is highly mechanically isolated from the process chamber 400. Preferably, a high degree of mechanical isolation is provided by one or more gaps between the process chamber 400 and the part to which the hold-down drive 560 is rigidly attached. The hold-down drive 560 is not rigidly connected to the upper chamber wall 410, so that the lid portion of the upper chamber wall 410 is rotatable about the first axis 910. • E03: Preferably, the lid portion of the upper chamber wall 410 comprises one or more hinges (not shown) arranged to allow a certain degree of rotation about the first axis 910 for opening and closing. Preferably, it is advantageous to position the pivot point (not shown) approximately on the same axis of rotation as the one or more hinges (not shown).

[0080] Fig. 7A and Fig. 7B are simplified and schematic cross-sections through a part of the process chamber included in the third embodiment 102. The third embodiment 102 includes the third variant 502 of a hold-down device described above with respect to Fig. 4 was described. Fig. 7A and Fig. However, Figures 7B and 7C show the third variant 502 after assembly and after the process chamber has been closed. The third embodiment 102 is shown at two moments during processing use. Fig. 7A shows the third variant 502, which does not exert a hold-down force on the substrate 300, and Fig. Figure 7B shows the third variant 502, which exerts a hold-down force on the substrate 300. The following aspects, F01 to F07, are shown in Fig. 7A and Fig. 7B and in Fig. 3A or Fig. 3B not or not fully shown: • F01: The third embodiment 102 includes the hold-down drive 560, which is located outside the processing chamber for processing. The hold-down drive 560 is connected to the drive mount 550 of the hold-down element 510 so that the hold-down drive 560 can exert a hold-down force on the first end portion of the hold-down element 510. In the illustrated example, the hold-down drive 560 is positioned to be actuated along a hold-down drive axis 960 that is not parallel to the third axis 930. • F02: The hold-down element 510 extends outside the process chamber and is aligned along a first hold-down element axis 923. The hold-down element 510 is arranged to rotate about the pivot point 570 so that a hold-down force is exerted on the actuator element 520. • F03: The hold-down element 510 is connected to the actuator element 520 via an actuator element pivot point 571 and is arranged to transmit the hold-down force received by the hold-down element 510 through the hold-down opening 270. • F04: In the illustrated example, the actuator element 520 also extends significantly further along the first axis 910 in the negative direction so that the hold-down force received by the hold-down element 510 can be transmitted to the one or more hold-down projections 541, 542. In the illustrated example, the one or more hold-down projections 541, 542 are two elongated projections that extend along the first axis 910. In Fig. 7A, the hold-down element 510 is shown in a non-exerted position, wherein the one or more hold-down projections 541, 542 do not exert any significant force on the substrate 300. In Fig. 7B, the hold-down element 510 is shown in an applied position, with the one or more hold-down projections 541, 542 exerting a significant force on the substrate 300. • F05: In the example shown, the hold-down drive 560 is rigidly attached to an outer surface of the process chamber for processing. The hold-down drive 560 is therefore not attached to a chamber end wall 430 of the process chamber 400, and the distance in the form of a gap or gap enables a high degree of mechanical isolation, i.e., decoupling, of the third variant 502 from the process chamber. Additionally or alternatively, a high degree of thermal insulation is provided by a substantial air gap between the temperature-sensitive hold-down drive 560 and the chamber end wall 430. • F06: In the example shown, the substrate 300 has been positioned in a processing position that allows one or more process steps to be performed on at least a portion of one or more processing surfaces (not shown) of the substrate 300. The one or more hold-down projections 541, 542 are arranged such that, in use, they exert the hold-down force transmitted by the actuator element 520 directly on at least a portion of the substrate 300. In the example shown in Fig. 7B, the one or more hold-down projections 541, 542 are each arranged to be positioned along the first axis 910 near an edge of the substrate 300. • F07: In Fig. 7A, the hold-down drive 560 is shown in a non-exercised position, wherein an actuator (not shown) of the hold-down drive 560 is rigidly attached to the drive mount 550 such that the first axis of the hold-down element 923 is approximately parallel to the second axis 920. In Fig. 7B, the hold-down drive 560 is shown in a loaded position, wherein an actuator element (not shown) of the hold-down drive 560 is rigidly connected to the drive mount 550 such that the axis of the first hold-down element 923 is not parallel to the second axis 920. The hold-down drive 560 is arranged, for example, to control a position of the actuator (not shown) between a non-loaded position, as in Fig. 7A, and one or more loading positions, such as the one shown in Fig. 7B. For example, the hold-down drive 560 is arranged to move a position of the actuator (not shown) into one or more loading positions, such as those shown in Fig. 7B, and allows the actuator (not shown) to move to a non-loading position as shown in Fig. 7A, by canceling the force exerted by the hold-down drive 560. Additionally or alternatively, the process chamber is provided with one or more resilient members, such as springs (not shown), to assist in the movement or resistance of the actuator (not shown) between one or more positions. Additionally or alternatively, the process chamber is provided with one or more buffers, such as stops (not shown), to assist in resisting the movement of the actuator (not shown) or to limit a range of movement. The one or more resilient members (not shown) or buffers (not shown) are advantageously disposed between the upper chamber wall 410 and the hold-down member 510.

[0081] Fig. 8 is a simplified and schematic cross-section through a part of the process chamber that includes the third embodiment 102. The third embodiment 102 includes the third variant 502 of a holding device, which was described above with reference to Fig. 4. Fig. However, 8 shows the third variant 502 during assembly or maintenance and before closing the process chamber for use, wherein a part of the upper chamber wall 410 is preferably arranged such that it opens as a lid for access to the interior of the process chamber. The following aspects, G01 to G04, are shown in Fig. 8 and are not or not fully shown in Fig. 3A or Fig. 3B. • G01: The hold-down drive 560 is positioned so that it is actuated along the hold-down drive axis 960, which is not parallel to the third axis 930. This has the advantage that the opening and closing of the lid portion of the upper chamber wall 410 is possible with a reduced actuation range of the hold-down drive. The angle between the axis of the hold-down drive 960 and the third axis 930 is, for example, in the range of 5 to 20 degrees, or in the range of 5 to 15 degrees, or approximately 10 degrees. In the example shown, the attachment point of the actuator (not shown) of the hold-down drive 560 is tilted away from the chamber end wall 430 by this angle. • G02: The mechanical attachment 580 of the pivot point 570 is rigidly attached to a suitable part of the lower chamber wall 420. In the example shown, the drive attachment 550 and the actuator (not shown) of the hold-down drive 560 are detached from each other so that the hold-down element 510 can rotate with the cover part of the upper chamber wall 410 about the first axis 910. It is advantageous if the cover part of the upper chamber wall 410 and the hold-down element 510 preferably rotate about the same pivot point 570 in order to reduce the complexity of the components for the opening. • G03: The hold-down drive 560 is shown beyond a non-extended position in which the actuator (not shown) has disengaged from the drive mount 550. Preferably, the hold-down drive 560 and / or the drive mount 550 is arranged to allow for quick disengagement. For example, the hold-down drive 560 (not shown) is arranged to automatically disengage from the drive mount 550 when the actuator (not shown) is moved to a non-active position or when the actuator (not shown) is moved beyond a non-active position. For example, a distal end of the actuator (not shown) includes one or more pins arranged to retain the drive mount 550 in the applied position.However, as the distal end of the actuator element (not shown) moves along the hold-down drive axis 930 to non-exercise positions, the angle between the hold-down drive axis 960 and the third axis 930 causes the distal end of the actuator element (not shown) to also move away from the chamber end wall 430 until the hold-down element 510 can rotate about the first axis 910 because the drive mount 550 is no longer prevented from rotating by the one or more pins (not shown). The movement of the distal end of the actuator (not shown) is driven by the hold-down drive 560 or the movement is performed manually by an operator. • G04: Preferably, the hold-down drive 560 and / or the drive mount 550 is arranged to allow for rapid attachment by reversing the method described in G03. In other words, the process chamber 400 is closed by rotating the first hold-down element 510 with the lid portion of the upper chamber wall 410 back about the first axis 910. When the axis 923 of the first hold-down element is approximately parallel to the second axis 920, the distal end of the actuator element (not shown) is moved to a loading position, with the attachment to the drive mount 550 being held in loading positions by the one or more locking pins. The movement of the distal end of the actuator (not shown) is driven by the hold-down drive 560 or the movement is performed manually by an operator.

[0082] The present embodiments may further be modified to provide a higher degree of throughput, a higher degree of flexibility, a higher degree of accuracy, or any combination thereof.

[0083] In summary, hold-down devices are used in processing machines to press the substrate against a fixture or support during at least part of a heating operation. However, inaccuracies arise if the hold-down device and / or the hold-down drive heat unevenly. An improved apparatus for processing a substrate (100, 101, 102) is provided by providing a hold-down device (500, 501, 502) arranged to exert a hold-down force on at least part of the substrate in use. The process chamber 400 includes a hold-down opening 270 for receiving an actuator element 520 of the hold-down device, the hold-down force being exerted directly from outside the process chamber 400 in use. As a result, the applied hold-down force can be independently predetermined and / or controlled to a high degree.Additionally, this can also provide a high degree of thermal and / or mechanical isolation, i.e., decoupling, thereby improving accuracy. This is particularly advantageous when a portion of the process chamber 400 is arranged to be openable as a lid or hatch. List of reference symbols 100 first embodiment of a device 101 second embodiment of a device 102 third embodiment of a device 150 process head 250 Process opening 270 hold-down opening 300 substrate 320 copies 400 process chamber 410 upper chamber wall 420 lower chamber wall 430 Chamber end wall 500 first variant of a hold-down device 501 second variant of a hold-down device 502 third variant of a hold-down device 510 hold-down element 520 actuator element 541, 542 hold-down projections 550 drive mounting 560 hold-down drive 570 pivot point 571 Pivot point of the actuator element 580 mechanical fastening for a pivot point 600 components 700 process environment 800 first processing position 805 second processing position 810 additional processing positions 910 first axis (X) 920 second axis (Y) 923 first axis of the hold-down element 930 third axis (Z) 933 Axis of the chamber end wall 960 Axis of the hold-down drive 1250 further process opening 1150 additional process heads 1300 additional substrate 1320 further editions 1541, 1542 further hold-down projections 1600 additional components 1700 additional process environments

Claims

[1] An apparatus (100) for processing a substrate (300), the apparatus (100, 101, 102) comprising a process chamber (400), the process chamber (400) comprising an upper chamber wall (410) extending along a first axis (910) and along a second axis (920), the second axis (920) being perpendicular to the first axis (910); and wherein, in use, the substrate (300) is arranged to be processable at a first processing position (800); and wherein the apparatus (100, 101, 102) further comprises a hold-down device (500, 501, 502) arranged to exert, in use, a hold-down force on at least a portion of the substrate (300) along a third axis (930) against a support (320) at the first processing position (800); wherein the upper chamber wall (410) comprises a hold-down opening (270) for receiving at least one actuator element (520) of the hold-down device (500, 501, 502);and wherein the actuator element (520) is arranged such that, in use, a hold-down force received directly from outside the process chamber (400) can be exerted on at least a portion of the substrate (300); and wherein the device further comprises a process head (150) for releasably attaching to a component (600), which is arranged such that it can be positioned at the first processing position (800) with the component (600). [2] The apparatus of claim 1, wherein a portion of the upper chamber wall (410) is arranged to be openable to provide access to at least a portion of the interior of the process chamber (400). [3] The apparatus of claim 1 or claim 2, wherein the apparatus further comprises a process head (150) for dispensing solder onto the substrate (300) for a soldering process. [4] The apparatus of claim 1 or claim 2, wherein the apparatus further comprises a process head (150) for forming solder on the substrate (300) for a soldering process. [5] Apparatus according to claim 1 or claim 2, wherein the apparatus further comprises a process head (150) for inspecting the substrate (300), for inspecting the component (600), for inspecting the support (320), for inspecting after a previous process step and / or for inspecting before a subsequent process step. [6] Apparatus according to any one of the preceding claims, wherein the upper chamber wall (410) comprises a process opening (250) for receiving the process head (150), the process opening (250) being arranged to enable movement of the process head (150) towards and / or away from the first processing position (800) along the third axis (930), the third axis (930) being perpendicular to the first axis (910) and perpendicular to the second axis (920). [7] The apparatus of claim 6, wherein the process opening (250) and the hold-down opening (270) are each separate openings in the upper chamber wall (410). [8] Apparatus according to any one of the preceding claims, wherein the hold-down device (500) comprises one or more hold-down projections (541, 542, 1541, 1542) attached to the actuator element (520), the one or more hold-down projections (541, 542, 1541, 1542) being arranged to exert, in use, a hold-down force received by the actuator element (520) directly onto at least a portion of the substrate (300). [9] Device according to one of the preceding claims, wherein the hold-down device (500, 501, 502) comprises a hold-down drive (560) arranged outside the process chamber (400) to exert a hold-down force on the actuator element (520). [10] Device according to one of the preceding claims, wherein the hold-down device (500, 501, 502) comprises a hold-down element (510) extending outside the process chamber (400) along the second axis (920) and arranged to exert a hold-down force on the actuator element (520). [11] The apparatus of claim 10, wherein a first end portion of the hold-down member (510) includes a drive mount (550) for attachment to a hold-down drive (560) positioned outside the process chamber (400); wherein a second end portion of the hold-down member (510) includes a pivot point (570) arranged to convert, in use, at least a portion of the movement of the hold-down member (510) due to operation of the hold-down drive (560) into a degree of rotation about the first axis (910); and wherein the attachment of the hold-down element (510) to the actuator element (520) is arranged to convert, in use, at least a portion of the degree of rotation about the first axis (910) into a degree of movement of the actuator element (520) along the third axis (930) toward the substrate (300) at the first processing position (800), thereby exerting a hold-down force on the actuator element (520). [12] Apparatus according to any one of the preceding claims, wherein the process chamber 400 is arranged to provide one or more process environments (700, 1700) in use. [13] Apparatus according to claim 12, wherein the process opening (250, 1250) is arranged to provide one or more gas curtains which, during use, enable a predetermined and / or controlled gas flow into and / or out of one or more process environments (700, 1700). [14] Apparatus according to claim 12 or claim 13, wherein the hold-down opening (270) is arranged to provide one or more gas curtains which, during use, enable a predetermined and / or controlled gas flow into and / or out of one or more process environments (700, 1700). [15] Apparatus according to any preceding claim, wherein the process chamber (400) comprises a lower chamber wall (420) extending along the first axis (910) and along the second axis (920). [16] Device according to claim 15, wherein the lower chamber wall (420) and the support (320) are secured to one another in one piece or in a form-fitting and force-fitting manner. [17] Apparatus according to any one of the preceding claims, wherein the apparatus (100, 101, 102) comprises one or more heating devices and / or one or more heating elements arranged to increase a temperature of at least a portion of one or more surfaces of the substrate (300) to be processed. [18] The apparatus of claim 17, wherein the one or more heating devices and / or the one or more heating elements are mounted on the process head (150). [19] Apparatus according to claim 17 or 18, wherein the one or more heating devices and / or the one or more heating elements are housed in the process chamber (400) or attached to the process chamber (400). [20] Apparatus according to any one of the preceding claims, wherein the process chamber (400) is arranged to receive a component (600) and wherein the substrate (300) is arranged, in use, to receive and hold the component (600) during processing. [21] The apparatus of claim 20, wherein the component (600) is a semiconductor die, a semiconductor package, a chip, an integrated circuit, a substrate, or any combination thereof. [22] Apparatus according to any one of the preceding claims, wherein the apparatus (100, 101, 102) comprises a media carrier arranged to move along the first axis (910) to position the substrate at the first processing position (800). [23] Device according to claim 22, wherein the media carrier and the support (320) are connected to one another in one piece or in a form-fitting and force-fitting manner. [24] The apparatus of claim 22, wherein the media carrier is arranged to move the substrate along the first axis (910) and to position the substrate at one or more further positions for loading the substrate, dispensing solder onto at least a portion of the substrate processing position, distributing solder onto at least a portion of the substrate processing position, processing the substrate, and / or unloading the substrate. [25] Apparatus according to claim 22 or 24, wherein the apparatus (100, 101, 102) comprises a further processing head (1150) for releasably attaching to a further component (1600), which is arranged such that it can be positioned with the further component (1600) in a second processing position (805), wherein the media carrier is arranged such that it can be moved along the first axis (910) and / or along the second axis (920) in order to position a further substrate (1300) at the second processing position (805). [26] Apparatus according to claim 25, wherein the hold-down device (500, 501, 502) is arranged to exert, in use, a hold-down force on at least a portion of the further substrate (1300) along the third axis (930) at the second processing position (805), the further hold-down force being exerted, in use, using the actuator element (520) directly from outside the process chamber (400) on at least a portion of the one or more further substrates (1300).

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