Method for manufacturing a plastic article and a plastic article

Abstract

The invention relates to a method for manufacturing a plastic article (1) with at least one heating wire (2) connected to a carrier layer (3) and electrically contactable in a connection area (5) via a bridge element (40), wherein in the method a carrier layer (3) is or is provided with a base (41), a top layer (42) and / or a three-dimensional connecting component (43) of the bridge element (40), such that the bridge element (40) is or is electrically connected to the heating wire (2) in the connection area (4) and is present in the connection area (5), wherein the bridge element (40) directly adjoins the heating wire (2) and / or partially overlaps the heating wire (2) and extends beyond the heating wire (2). The invention also relates to a corresponding plastic article (1).

Description

[0001] The invention relates to a method for producing a plastic article and to a plastic article.

[0002] It is known to produce heated radomes to clear surfaces of snow and ice. For this purpose, heating elements made of heating layers or heating wires are integrated into injection-molded bodies. Electrical contact between the heating elements is usually achieved subsequently via recesses in the injection-molding compound, into which contact elements are inserted. The contact elements then enable a connection to a power network. For this purpose, the contact elements are fastened in the recesses with mechanical holders or material-fit connections. However, there is a relatively high probability of faulty contact, which can occur during the manufacturing process or as a fatigue phenomenon due to vibrations, e.g., during use as a vehicle part.In addition, the design options for the heating elements are limited due to the necessary contactability and the high demands placed on them, such as high pressures and temperatures during injection molding. Thus, the design options for such injection-molded parts and the corresponding manufacturing processes are relatively limited, and the resulting injection-molded parts are relatively prone to defects.

[0003] It is therefore an object of the invention to provide an improved method for producing a plastic article, in particular with a heater, and an improved plastic article, in particular with a heater.

[0004] The object is achieved by a method for producing a plastic article according to claim 1 and by a plastic article according to claim 26.

[0005] The plastic article produced by the method according to the invention comprises at least one heating wire connected to a carrier layer and electrically contacted and / or electrically contactable at least in one connection area via a bridge element, in particular by means of one or more electrical contacting means. The bridge element is electrically conductive and comprises or consists of one or more of the following elements: a base, a top layer, a three-dimensional connecting component that is integrated into the plastic article via a positive and / or non-positive fastening.

[0006] The procedure involves at least one of the following steps: A) Providing the carrier layer, which is or will be provided with the base, and then applying the at least one heating wire to the carrier layer and the base, B) Providing the carrier layer, which is or will be provided with the at least one heating wire, and subsequently applying the top layer to the carrier layer and to the at least one heating wire, and / or C) Providing the carrier layer, which is or will be provided with the at least one heating wire, and positively and / or non-positively fastening the three-dimensional connecting component.

[0007] Steps A), B), and / or C) are carried out in such a way that the bridge element is present in the connecting region and in the connection region, with the bridge element directly adjacent to the at least one heating wire. Alternatively or additionally, the bridge element overlaps the at least one heating wire and extends beyond the at least one heating wire. In addition, the following step is carried out in the method: i) Electrically conductively connecting the at least one heating wire and the at least one bridge element in the connection region.

[0008] The object is further achieved by a plastic article, which is produced in particular by the method according to the invention. The plastic article has at least one heating wire, which is connected to a carrier layer and is electrically contacted and / or can be electrically contacted in a connection region via at least one bridge element, in particular by means of one or more electrical contacting means. wherein the bridge element is or comprises one or more of the following elements: a base, a top layer, a three-dimensional connecting component that is integrated into the plastic article via a positive and / or non-positive fastening.

[0009] The bridge element is electrically conductive and is electrically connected to the at least one heating wire in a connection region. Furthermore, the bridge element is present in the connection region. The bridge element directly borders the at least one heating wire. Alternatively or additionally, the bridge element partially overlaps the at least one heating wire and extends beyond the at least one heating wire.

[0010] The present invention makes it possible, in particular, to achieve improved contacting of the at least one heating wire. Reliable contacting of the at least one heating wire can be ensured by means of the connection region via the bridge element, which is conductively connected to the at least one heating wire. There, the bridge element advantageously provides a connection surface for contacting by the contacting means, but its design options are not, or only slightly, restricted by the shape of the at least one heating wire. Furthermore, the shape of the connection region can be adapted to the contacting means and thus optimized by means of the bridge element. In the connection region, on the other hand, improved adaptability of the shape of the at least one heating wire with regard to several requirements can be achieved, as described in more detail in the following paragraph.In particular, improved adhesion of the at least one heating wire in the plastic article, preferably to the carrier layer and to the at least one bridge element, can be achieved at the same time, and the reliability of the electrical contact can be improved.

[0011] The at least one heating wire can be designed in an optimized manner, in particular according to the stresses during further processing, for example in such a way that improved adhesion and / or reduced displacement of the at least one heating wire in an injection-molded article is achieved. This is achieved in particular by the heating wire being arranged in such a way that shear forces and displacement forces caused by an oncoming injection-molding compound are reduced. For example, a sequence of paths of the heating wire in the connecting region (in particular in a partial region of the connecting region in which no bridge element is arranged) can be back-injected in such a way that a path arranged first in a flow direction of an injection-molding compound represents a "front" for the oncoming injection-molding compound, which reduces the stresses on downstream paths.For example, if several paths of at least one heating wire are arranged one behind the other in the flow direction of the injection molding compound (e.g., due to parallel paths of a meandering heating wire), it is possible that lower shear forces act on the paths arranged downstream along the flow direction than on the path arranged first or on the paths arranged upstream. This can advantageously improve the overall adhesion of the at least one heating wire, particularly in the connection area, and, in particular, reduce a positional tolerance.

[0012] Furthermore, it is advantageously possible to design the at least one heating wire in the connection region such that the probability of faulty contact via the at least one bridge element is reduced. This can be achieved in particular by increasing the density of the area covered by the at least one heating wire. For example, a plurality of contact points and / or one or more large-area contact points can be provided between the at least one heating wire and the at least one bridge element, in particular so that, despite one or more faulty contact points, successful contact is more likely due to the remaining contact points. This can also be achieved, for example, with a meandering shape of the at least one heating wire.

[0013] Furthermore, the at least one heating wire can be designed in the connection region such that improved wetting by the at least one bridge element, in particular the base layer and / or the top layer, can be achieved. For example, the at least one heating wire can provide gap structures which in particular have a capillary effect on layers that are applied in a flowable manner and / or whose flowability is generated after application. Such gap structures can also be achieved, for example, by a meandering shape of the at least one heating wire in the connection region. If the base layer and / or the top layer is applied, for example, as a solder, the latter can be drawn into the gaps of the gap structures when connected to the at least one heating wire due to the capillary effect and thus generate in particular improved wetting with the solder and / or a layer formed by corresponding soldering.

[0014] As can be explained using the example of a meandering heating wire, the at least one heating wire can advantageously be applied in the connection region in optimized shapes, which simultaneously offer several advantages in terms of adhesion and reliable contact. A meandering heating wire is not the only suitable option for this. Shapes that comprise a sequence of multiple paths of the at least one heating wire in one direction are particularly advantageous, such as meandering shapes, spiral shapes, loop-shaped shapes, pseudo-chaotic shapes, chaotic shapes, random shapes, pseudo-random shapes, single- and / or multi-layer shapes, alternating arrangements of different shapes, fractal shapes, flower-shaped shapes, and combinations of the aforementioned shapes.

[0015] Furthermore, in the connection area, particularly by means of the base layer and / or the top layer, improved design options are achieved with regard to the distribution of energy introduced during the process, which can prevent local damage to the carrier and / or the at least one heating wire. For example, the top layer can be designed such that it absorbs energy via ultrasound and specifically introduces it into nearby layers, such as the at least one heating wire, the carrier layer, and / or the base layer.

[0016] Further advantageous embodiments of the invention are described in the subclaims.

[0017] The plastic article is preferably a vehicle part, more preferably a headlight, a vehicle interior panel or a vehicle exterior panel, for example a cover for one or more radiation sources, preferably measuring devices, such as in particular radar devices, and / or lighting devices, such as in particular headlights, preferably LED headlights, preferably for a vehicle. The plastic article is in particular permeable, at least in some regions, preferably outside the at least one heating wire, to certain wavelengths, preferably at least to wavelengths in a range from 1 GHz to 150 GHz for radar applications and / or in a range from 350 THz to 850 THz for visible light. Permeable here preferably means having a transmittance, in particular for these wavelengths, of 5% to 100%, preferably of 15% to 85%.In particular, a surface of the plastic article can be heated by means of the at least one heating wire. The plastic article can form a cover and / or have additional layers and / or one or more radiation sources, preferably a measuring device, in particular a radar device, and / or a lighting device, in particular LED headlights. It is also possible for the plastic article to be, for example, a trim part of a household article, a sanitary article, a piece of furniture and / or white goods. A plastic article produced according to the method according to the invention can be used in a variety of areas. The produced plastic article can, for example, be used in or as one of the following parts: a vehicle part, a household article, a sanitary article, a piece of furniture, white goods.

[0018] A layer or ply is preferably understood to mean a substantially planar structure, which itself can in particular be single-layered or multi-layered.

[0019] A base layer is understood here in particular to mean a layer that is or will be applied, at least in part, between the carrier layer and the at least one heating wire. A top layer is understood here in particular to mean a layer that is or will be applied, at least in part, on a side of the at least one heating wire facing away from the carrier layer. The base layer is or will preferably be applied closer to the carrier layer, starting from the at least one heating wire, and / or the top layer is preferably applied further away from the carrier layer, starting from the at least one heating wire.

[0020] The one or more contacting means provide in particular an interface for integrating the at least one heating wire into a power grid, for example into an on-board power grid, preferably of a vehicle. Typical electrical voltages in a power grid for integrating the at least one heating wire range up to a maximum of 100V. Typical electrical currents in a power grid for integrating the at least one heating wire range up to a maximum of 60A. Typical electrical powers in a power grid for integrating the at least one heating wire range up to a maximum of 1500W. Therefore, it is preferred that the plastic article be usable and / or used in a system with a power grid with a maximum voltage of 100V and / or a maximum current of 60A and / or a maximum electrical power of 1500W.The at least one bridge element has, in particular, a connection surface via which the at least one heating wire is or will be electrically contacted and / or contactable by means of the one or more contacting means. The one or more contacting means can be or will be connected, in particular, mechanically or materially, to the bridge element in the connection area. The one or more contacting means, in particular, provide or form an interface for integration into an on-board electrical system.For example, the one or more electrical contacting means comprise at least one contact socket, preferably with an insertion opening, at least one plug contact which is electrically contacted with the bridge element in the connection area and which can be contacted in particular in the insertion opening, and / or one or more fastening means, in particular for holding a plug, which preferably serves to contact the plug contact to establish a connection to an on-board network.

[0021] The bridge element consists in particular of the base layer and / or the top layer and / or the three-dimensional connecting component. The bridge element forms, in particular, an area that is larger than the area covered by the at least one heating wire, which represents the connection surface. This advantageously makes it possible to use the connection surface for improved contact with the one or more contact means.

[0022] The bridge element, in particular the base and / or the top layer, can preferably form a contact pad, in particular an adhesive contact pad and / or a printed contact pad. A contact pad is understood to mean, in particular, a (preferably multi-layer) composite that provides the connection surface that is or will be connected to the one or more contacting means.

[0023] Steps A), B), C), and i), or several of them, may be performed in the specified order. In particular, it is possible to perform step A) first, then step B), and optionally subsequently step C). Step i) may be performed during or after one or more of steps A), B), and C), or may be a substep of one or more of steps A), B), and C.

[0024] Step i) is, in particular, an electrically conductive connection of the at least one heating wire and the at least one bridge element, in which the at least one bridge element is connected and / or mixed and / or fused to the at least one heating wire and / or multiple layers of the at least one bridge element by an energy input, such as, in particular, thermal energy, so that an electrically conductive composite is created which is in contact with the at least one heating wire and is present in the connection region. For example, the at least one bridge element can be or comprise a solder layer, and the connection in step i) can be, in particular, soldering.

[0025] The at least one bridge element can, for example, also be applied as a layer that is optionally not mixed with other layers, but which is connected to the at least one heating wire via an electrically conductive adhesive layer and is present in the connection region. For example, the at least one bridge element can be a metal layer and / or metal foil. It is also possible for a separate step, such as in particular an introduction of ultrasonic energy, to be carried out to generate the thermal energy input, whereby the electrically conductive composite is created. Preferably, the top layer is or will be designed as a medium for introducing energy, in particular ultrasonic energy or laser energy.

[0026] It is possible for the at least one heating wire to have an end in the connection region and / or the connection region. It is also possible for the at least one heating wire to have a further end in a further connection region and / or a further connection region. The further connection region can be shaped like the connection region. The further connection region can be shaped like the connection region. It is conceivable for the at least one heating wire to be contacted or to be contactable in the connection region and in the further connection region by means of a single contacting means or by means of several, preferably two, contacting means. In this case, the connection region is preferably assigned to a negative pole and the further connection region to a positive pole, or vice versa.

[0027] The at least one bridge element can, for example, be adjacent to the at least one heating wire, preferably directly adjacent, in that the base layer and / or the top layer is or comprises a solder layer. It is possible, particularly if the solder layer has already been soldered to the at least one heating wire, for the at least one heating wire to comprise a transition phase that includes solder components in addition to components of the at least one heating wire.

[0028] A region is understood, in particular, to be an area that has, as a base area, a surface that, when viewed perpendicularly, is spanned across a surface, preferably a main surface, of the plastic article, a layer and / or a ply, in particular the carrier layer, the base layer and / or the top layer, and that extends in the direction of the perpendicular view. A main surface has, in particular, the largest surface area of ​​the surfaces of the plastic article, a layer and / or a ply, in particular the carrier layer, the base layer and / or the top layer.

[0029] The connection area and the connection area are preferably separate or at least partially overlapping or completely overlapping.

[0030] It is possible for the at least one heating wire to be exposed at least in the connection region by an energy input during the process for electrically conductively connecting the at least one heating wire to the at least one bridge element, i.e. in particular in step i). Preferably, an electrically non-conductive insulation enclosing the at least one heating wire, preferably an electrically non-conductive insulating varnish layer, is removed at least partially from the at least one heating wire. Alternatively, it is possible for the at least one heating wire to already be exposed when the carrier layer is provided and is or will be provided with the heating wire, in particular in order to advantageously provide a thickness of the contacting region in this region that is reduced by the thickness of the insulation.

[0031] It is thus possible for the insulation, preferably the insulation layer, to be removed immediately before and / or during the electrically conductive connection of the at least one heating wire and the at least one bridge element. The removal of the insulation, preferably the insulation lacquer layer, is understood in particular to mean that the insulation, preferably the insulation lacquer layer, becomes flowable, preferably melted, and preferably is displaced at least in regions, and / or is destroyed as a result of the energy input. In this context, destruction means in particular that the chemical structures of the insulation are changed as a result of the energy input in such a way that there is no longer any electrical insulating effect and thus electrical contact with the heating wire is possible. The energy input is in particular a thermal energy input and / or results in a thermal energy input.Preferably, the energy input is introduced by means of ultrasound and / or by means of a laser and / or by means of a heated solder, which in particular forms a conductive layer of the top layer. Preferably, the process for generating the energy input, e.g., ultrasound generation or laser radiation or introducing energy by applying a heated solder, is continued and / or operated in such a way that, immediately after the insulation is removed, the electrically conductive connection of the at least one heating wire and the bridge element is established by means of this process. It is conceivable that the amount of energy input remains the same or changes during this process.

[0032] It is preferred that the at least one heating wire is applied to the carrier layer without insulation, preferably without an insulating lacquer layer. It is also possible for the at least one heating wire to be or to be provided only partially with insulation, preferably an insulating lacquer layer, and / or for the at least one heating wire to be or to be not provided with insulation, preferably an insulating lacquer layer, in a region associated with the connection region before the at least one heating wire is applied to the carrier layer. It is also possible for the at least one heating wire to be or to be applied to the carrier layer completely uninsulated. It is advantageously possible for the method for producing the plastic article not to comprise removing any insulation, preferably an insulating lacquer layer.Advantageously, material and time resources of a separate exposure step can be saved by using an already exposed heating wire or a heating wire that can be exposed by the energy input of the electrically conductive connection.

[0033] The insulation, preferably an insulating lacquer layer, preferably comprises or consists of at least one coating matrix. The coating matrix particularly comprises or consists of one or more of the following materials: base polymers based on polyester (PE), THEIC-modified polyester (PE), polyesterimides (PEI), polyamideimides, modified polyamideimides (PAI), polyimides (PI), modified polyimides, polyamides (PA), modified polyamides, polyurethanes (PU), modified polyurethanes and polyvinyl formal (PVF), butyral, epoxy, or combinations of the aforementioned materials.For example, it is possible for a solder used to connect the at least one heating wire to the bridge element to be selected such that it is hot enough or is applied hot enough to melt the coating matrix and, in particular, to simultaneously provide contact, wherein the coating matrix is ​​locally incorporated into a matrix of the solder or is destroyed by it. In this context, destruction means, in particular, that as a result of the energy input, the chemical structures of the insulation are changed in such a way that there is no longer any electrical insulating effect and, thus, electrical contact with the heating wire is possible. It is also possible for the energy input to be carried out by means of ultrasound or a laser, so that the insulation, preferably the insulating lacquer layer, is melted and, in particular, is connected to the carrier layer.Insulation, preferably an insulating varnish layer, can also contribute to improving the overall bond.

[0034] Preferably, the base layer and / or the top layer comprise a conductive paste and / or a multilayer system. It is possible for the base layer and / or the top layer to comprise or consist of one or more of the following materials: metal, in particular aluminum, tin, copper, silver, gold, carbon, or alloys thereof.

[0035] It is possible for the base layer and / or the top layer to be an adhesive contact pad and / or a printed contact pad. It is possible for the base layer and / or the top layer to be or comprise a conductive layer that is electrically conductive. The conductive layer is or will preferably be applied in the connection region and in the termination region. Alternatively or additionally, it is possible for the base layer and / or the top layer to have an adhesive layer, which is or will be applied in particular for connecting the conductive layer to the carrier layer and / or the at least one heating wire. It is possible for the base layer to comprise a conductive layer and a, preferably electrically conductive or non-electrically conductive, adhesive layer. Alternatively or additionally, it is possible for the top layer to comprise a conductive layer and a, preferably electrically conductive, adhesive layer.The conductive layer is or preferably comprises a metal layer and / or a conductive lacquer layer and / or a printing layer.

[0036] It is particularly preferred that the conductive layer of the base layer and / or the top layer comprises or includes a conductive ink layer and / or a printed layer. In particular, the conductive ink layer and / or the printed layer is applied by a printing process, such as in particular screen printing processes and / or gravure printing processes and / or flexographic printing processes, in particular by a digital printing process, preferably an inkjet process. Preferably, the conductive layer is or will be applied directly in contact with the carrier layer and / or the at least one heating wire. In particular, the conductive layer is or will be applied advantageously not via an adhesive layer provided in addition to the connection to the carrier layer and / or the at least one heating wire.

[0037] A conductive ink layer is or will be applied in particular comprising or consisting of a binder and / or electrically conductive components.

[0038] Alternatively or additionally, it is possible for the electrically conductive connection in step i) to be carried out by direct contact of the at least one heating wire or its insulation, preferably an insulating lacquer layer, with at least one conductive lacquer layer. It is possible for the optionally present insulation, preferably in the connection region, to be subsequently removed or made conductive, which can be done for example by means of an energy input in step i), which leads, for example, to the insulation being displaced and / or the conductive components of the conductive lacquer layer being distributed in the bridge element and / or the material of the insulation. It is possible for the conductive lacquer layer to be electrically connected to the at least one heating wire and in particular also to provide the electrical contact and / or contactability with the one or more contact means.It is also possible that by the energy input of step i), preferably by means of ultrasound or by means of laser radiation, an electrically conductive composite is obtained from the at least one bridge element and / or several elements of the at least one bridge element with the electrically conductive components.

[0039] It is possible for the base layer and / or the top layer to be or comprise an adhesive-free surface, in particular wherein, before the carrier layer is provided with the base layer and / or the top layer, an adhesive layer is applied to an area to be provided with the adhesive-free surface. It is thus possible for the base layer and / or the top layer in the plastic article to comprise an adhesive-free surface, in particular an adhesive-free layer, which is or will be introduced into the plastic article via an adhesive layer, in particular is or will be connected via an adhesive layer to the carrier layer and / or the at least one heating wire and / or other elements of the at least one bridge element.

[0040] It is possible for the adhesive layer to be single-layered or multi-layered and / or for the adhesive layer to be conductive or non-conductive and / or for the adhesive layer to be applied in the form of an adhesive film, a printed layer and / or a lacquer layer. The adhesive layer and / or a partial layer comprised thereby can be applied to one or more layers of the carrier layer, the base layer and the top layer and / or to the at least one heating wire. It is possible for the adhesive layer and / or a partial layer comprised thereby to be provided on one or more layers of the carrier layer, the base layer and the top layer and / or on the at least one heating wire, for example without the adhesive layer being applied in the process for producing the plastic article or wherein this step has already taken place beforehand.

[0041] It is also possible for the base layer and / or the top layer to comprise an adhesive layer and, in particular, to be bonded together with the adhesive layer to the plastic article, in particular to the carrier layer, the at least one heating wire, and / or other elements of the at least one bridge element. The base layer and / or top layer, in particular, forms an adhesive contact pad comprising at least the adhesive layer and an electrically conductive layer.

[0042] In particular, the carrier layer has or is provided with at least one passage in the connection region and / or in the connection region. Advantageously, the at least one passage can be designed such that it enables electrically conductive contact with the at least one heating wire, in particular from a side of the carrier layer opposite the at least one heating wire, and / or provides or enables a connection, in particular a form-fitting and / or force-fitting fastening, with the at least one bridge element, in particular the three-dimensional connecting component, and / or with the one or more contact means, which preferably enable integration of the at least one heating wire into a power grid.It is preferred that the at least one heating wire has a sequence of multiple tracks that extend at least partially across the at least one passage and preferably form gap structures that overlap the at least one passage. In this case, the improved wettability can be utilized in particular to achieve a reliable connection to the top layer even across the passage. Multiple passages, for example, six passages, are also conceivable in the connection area and / or the connection area.

[0043] It is possible that, in particular in step B), the top layer is or will be applied at least in part to the base layer which was applied in particular in step A).

[0044] The electrically conductive connection in step i) is or preferably comprises soldering the at least one bridge element to the at least one heating wire. In particular, the top layer is applied in the form of a solder layer or a solder layer is applied comprehensively. In this case, it is possible for the top layer to form or be encompassed by the at least one bridge element or, for example, for the at least one bridge element to be formed or encompassed by the base layer and the top layer. It is particularly possible for the base layer to be encompassed by the at least one bridge element and for a reinforced and / or permanent connection, in particular a mechanical and electrically conductive connection, to be produced to the at least one heating wire via the top layer, preferably after a provisional connection between the base layer and the at least one heating wire has already been produced in step A), which connection is not yet electrically conductive or is only weakly electrically conductive.

[0045] It is possible for the at least one heating wire to be connected to the carrier layer and optionally to the substrate under the action of ultrasound. It is preferred for the carrier layer to be provided with the at least one heating wire by penetrating the at least one heating wire into the carrier layer using ultrasound. Preferably, the at least one heating wire is guided through a sonotrode or guided to a sonotrode. The sonotrode vibrates and / or oscillates in particular at a frequency in a range from 20 kHz to 150 kHz, preferably from 50 kHz to 100 kHz, for example at 70 kHz, with lower ultrasonic frequencies typically being associated with a higher amplitude and higher ultrasonic frequencies with a lower amplitude.Preferably, by means of the sonotrode, in particular by means of a mouthpiece of the sonotrode, the at least one heating wire is attached, preferably successively attached, to a surface of the carrier layer and introduced, preferably successively introduced, into the surface of the carrier layer. This is done in particular by the surface of the carrier layer and / or an insulation, preferably an insulating lacquer layer, of the at least one heating wire and / or at least one coating layer, in particular at least one baked enamel layer, being melted locally at the location of the sonotrode, in particular the mouthpiece, as a result of the ultrasound and preferably the surface of the carrier layer being connected to the at least one heating wire and / or the insulation, preferably an insulating lacquer layer, and / or the at least one coating layer. At the same time, the sonotrode is preferably moved in accordance with the final shape of the at least one heating wire.In this context, but also independently thereof, an embodiment may be advantageous in which the at least one heating wire is or will be arranged in a curved, preferably loop-shaped and / or meandering manner in the plastic article, in particular outside the connection region, and / or is or will be arranged in a curved, preferably loop-shaped and / or meandering manner in at least some regions on a flat or curved surface of the carrier layer. In particular, the at least one heating wire in the plastic article, preferably outside the connection region, i.e., in a Cartesian coordinate system, has a curvature in all three spatial directions. The sonotrode is expediently movable and / or rotatable in one or more spatial directions. The sonotrode is preferably moved by means of a robot arm, preferably moved automatically, and / or is movable by means of the robot arm.Alternatively or additionally, it is possible for the carrier layer to be placed on a table during the production of the plastic article, which is movable and / or rotatable in one or more spatial directions. A particular advantage is that complex surfaces can be reliably and efficiently provided with the at least one heating wire.

[0046] Furthermore, a feed device for applying the at least one heating wire together with the sonotrode and a supply unit, in particular a supply roll, for providing the at least one heating wire can be provided, wherein the supply unit, preferably together with the sonotrode, is movably arranged and / or moved. The at least one heating wire is expediently guided from the supply unit to the sonotrode and / or through the sonotrode, for example by unwinding from the supply roll. After the at least one heating wire has been applied by means of the sonotrode, it is particularly possible to carry out the following step: separating, in particular automatically separating, the at least one heating wire. After separation, the feed device and / or the sonotrode are preferably removed from the carrier layer with the at least one heating wire.

[0047] In a preferred embodiment of the method, in particular of steps A) and / or B) and / or C), and / or of the plastic article, the at least one heating wire is or will be applied to the carrier layer and optionally to the base in the connection region using a mold, wherein the mold is characterized by an increased areal density on the carrier layer. The areal density is in particular related to the coverage of a first area with the at least one heating wire in the connection region compared to the coverage of an adjacent area and / or area not overlapping with the first area with the at least one heating wire, in particular outside the connection region. Preferably, the first area and / or the adjacent area and / or area not overlapping with the first area has a continuous area of ​​at least 1 mm 2 , preferably at least 3 mm 2 , more preferably at least 9 mm 2Preferably, the diameter of the at least one heating wire is the same in the regions used for comparison. The first surface can, for example, be located entirely within the connection region and / or be congruent therewith.

[0048] In the connection region, in particular in a region of the connection region overlapping the at least one bridge element and / or on the first surface, the at least one heating wire preferably has a sequence of multiple tracks in one direction. The tracks are connected to one another in particular by curves and / or corners, which are preferably also formed by the at least one heating wire. The at least one heating wire preferably has at least one turning point and / or at least one turning line in each of the tracks or at least in several tracks thereof. A turning line is to be understood in particular as a line which merges into a curvature on one side which differs in sign from a curvature on the other side. For example, the at least one heating wire is meandering in the connection region.It is also possible for the at least one heating wire in the connection region to have one or more of the following shapes: meandering, spiral, loop-shaped, pseudo-chaotic shapes, chaotic shapes, random structures, pseudo-random structures, single- and / or multi-layer shapes, alternating arrangement of different shapes, fractal shapes, flower-shaped, or combinations of the aforementioned shapes. Such shapes can, in particular, achieve corresponding advantages of successive paths, especially with an increased areal density.

[0049] The base layer and / or the top layer is or will preferably be applied overlapping several or all of the webs and in particular extending beyond these several or all of the webs.

[0050] It is preferred that at least two adjacent tracks or all adjacent tracks each have a spacing in a range of 0 mm to 12 mm, preferably 0.02 mm to 12 mm, preferably 0.02 mm to 1 mm. The spacing of the tracks is preferably measured between the outer surfaces of the respective tracks. "Adjacent to one another" means, in particular, without any intervening tracks.

[0051] Alternatively or additionally, it is possible for the tracks, including the curves and / or corners, to run in a region with a width in a range from 1 mm to 50 mm, preferably from 3 mm to 7 mm, and / or with a height in a range from 1 mm to 70 mm, preferably from 3 mm to 15 mm. The width is preferably measured perpendicular to the height. It is possible for the tracks, including the curves and / or corners, to be or to be provided in a region with a width and a height, wherein the height is greater than the width. The spacing of the tracks is preferably measured in the height direction. The base layer and / or the top layer preferably has larger dimensions in the height direction than in the width direction. In particular, the connecting region and / or the connection region has the specified width and / or height.

[0052] The at least one heating wire and / or the tracks are or are preferably applied with a diameter in a range from 20 µm to 350 µm, preferably from 75 µm to 120 µm.

[0053] The dimensions can be measured, in particular, in a top view of the plastic article. The top view can preferably be an orthogonal projection with the largest surface area of ​​the plastic article and / or the carrier layer.

[0054] By means of such a described design of the at least one heating wire, such as a meander-shaped or similar design in the connection area, the following advantages in particular can be achieved: 1) at least in outer zones of the at least one heating wire in the connection area and in the connection area, improved adhesion can be provided and a possible displacement (for example due to back-injection / flooding) can be counteracted, as has already been described in particular with reference to a "front" of a web which is first subjected to flow. 2) The probability of "misconnections" can be reduced. This can be explained in particular by the fact that misconnections can occur when the heating wire is soldered or connected to a surface. If the density of the paths that can be contacted is increased during this process, the relative frequency of misconnection of one or more paths leading to component failure is reduced, since at least a portion of the meandering heating wire is guaranteed to provide successful contact. 3) Wetting can be improved in the case of liquid media, such as solder and / or conductive ink and the like, and / or in the case of pastes used to apply the base layer and / or the top layer. This can be explained in particular by the fact that the capillary filling pressure of gaps increases with decreasing gap width and that gap structures are provided by the succession of tracks of the at least one heating wire, in particular of the meander-shaped at least one heating wire. A liquid medium can in particular be drawn into such gap structures. Depending on the spacing of the tracks in the connection region, the capillary effect can thus be exploited for successful wetting.

[0055] It is preferred that at least one layer of the base layer and the top layer is applied as a liquid medium and / or a conductive paste and is preferably brought into direct contact with the at least one heating wire, since in this way the aforementioned advantage 3) can be achieved in particular.

[0056] The at least one heating wire comprises, in particular, a metal and / or a metal alloy. The at least one heating wire further preferably comprises or consists of one or more of the following materials: NiCr15Fe, Cu, CuNi30Mn, CuMn12Ni, constantan, alloy 30Mn 70Cu, X10CrAlSi13. It is also possible to use other materials for the at least one heating wire, provided they have sufficient conductivity and thermal output.

[0057] Preferably, in particular at an ambient temperature of 20°C, the specific resistance of the material of the at least one heating wire is more than 0.3 Ω mm2 / m and / or the electrical conductivity is less than 3 S / m or m / Ω mm 2 .

[0058] The carrier layer is preferably single-layer or multi-layer. The carrier layer preferably comprises or consists of one or more of the following materials: polyolefin-based (PE), polypropylene (PP), polyvinyl chloride (PVC), polystyrene (PS), polyethylene terephthalate (PET), polycarbonate (PC), acrylonitrile butadiene styrene (ABS), polymethyl methacrylate (PMMA), coextrudates, triextrudates, multiextrudates. It is possible for the carrier layer to comprise cellophane and / or be coated therewith. It is also possible for the carrier layer to be made from a biopolymer base. The carrier layer can be a coated carrier, a fabric carrier, a multilayer composite, and / or a filled carrier. In particular, the carrier layer has a layer thickness in a range from 20 µm to 5000 µm, preferably from 50 µm to 800 µm.The carrier layer preferably has one or more of the following properties: smooth, rough, structured, partially structured, vapor-coated on one side, partially vapor-coated on one side, partially vapor-coated on both sides, perforated, partially coated, colored, transparent, fully coated, microstructured.

[0059] The conductive ink layer of the base and / or top layer is or will preferably be made of a conductive ink. The conductive ink is in particular a silver conductive ink or conductive silver, a copper conductive ink, or a graphite conductive ink. In particular, the conductive ink is a paint based on and / or comprising one or more of the following components: silver particles, copper particles, graphite particles, nanotubes, gold particles, aluminum particles, particles of alloys of the aforementioned metals, metal particle combinations, nanoparticles, and the like. The conductive ink preferably comprises, in particular as a binder, a single-component paint or a multi-component paint, preferably solvent-based or water-based, or a synthetic resin, preferably a single-component or two-component, or multi-component synthetic resin. Synthetic resins are also preferably suitable as a conductive adhesive, i.e., in particular for forming an adhesive surface of the conductive ink layer.

[0060] The conductive ink layer is preferably single-layer or multi-layer. It is possible for the conductive ink layer to comprise multiple layers that differ in composition. Alternatively or additionally, it is possible for the conductive ink layer to be a reactive ink, a spray ink, and / or a printing ink and / or to be applied as such. It is also possible for the conductive ink layer to be configured as a layered composite, preferably in conjunction with one or more vapor-deposited metal layers or transparent oxide layers.

[0061] The conductive layer, in particular the conductive lacquer layer, of the base layer and / or the top layer preferably has a thickness in a range of 2 µm to 100 µm, preferably in a range of 10 µm to 25 µm.

[0062] The bridge element, preferably the base and / or the top layer, in particular in the form of the adhesive contact pad or the printed contact pad, preferably has a thickness, in particular total thickness, in a range from 5 µm to 250 µm, preferably from 10 µm to 50 µm.

[0063] The base and / or the top layer, in particular in the form of the adhesive contact pad or the printed contact pad, comprises in particular one or more of the following metals or alloys thereof: copper, aluminum, gold, silver.

[0064] The base layer and / or the top layer, particularly in the form of the contact pad, preferably comprises a conductive ink and / or a multilayer system. The contact pad may be structured or unstructured and / or coated (e.g., on a side facing the carrier layer and / or a side facing away from the carrier layer), and / or partially coated (e.g., on a side facing the carrier layer and / or a side facing away from the carrier layer).

[0065] The adhesive layer of the base and / or the top layer, in particular in the form of the adhesive contact pad or the printed contact pad, is preferably conductive or non-conductive, and / or a multi-component system or a single-component system, and / or unfilled or filled, and / or curing, in particular curing by means of UV irradiation, and / or non-curing, in particular thermoplastic, and / or single-layer or multi-layer, etc. Filled is understood to mean, in particular, a layer, in particular an adhesive layer, in which inorganic substances are present in addition to the polymer matrix (adhesive matrix, binder). Such inorganic substances can, in particular, be pigments and / or particles of different sizes and shapes and consist, for example, of metal, metal alloys, metal oxides, or combinations thereof. The pigments and / or particles can have diameters in the micrometer range or even in the nanometer range (nanoparticles).The pigments and / or particles can be smaller or larger in diameter than the thickness of the respective layer. The pigments and / or particles can be contained in the respective layer as a mixture of different substances and / or of different sizes.

[0066] The solder layer of the base layer and / or the top layer is or will preferably be made of a solder, which is in particular a metal alloy. The metal alloy expediently serves to firmly and electrically conductively connect the at least one heating wire to the bridge element, in particular to a conductive layer of the bridge element. The metal alloy expediently comprises a specific mixing ratio of metals. In particular, the metal alloy comprises one or more metals selected from lead, tin, zinc, silver, and copper.

[0067] In particular, it is possible that an electronic solder is or will be used to create the solder layer. An electronic solder has a core, preferably a thin core, which in particular comprises or consists of rosin as a flux.

[0068] The melting point of the solder used is preferably lower than the melting point of the at least one heating wire, the conductive layer, and / or other layers of the bridge element. It is possible for the melting point of the solder to be higher than the melting point and / or the glass transition temperature of the insulating lacquer layer.

[0069] Examples of metal alloys are listed below: Designation composition Flux Melting point Sn60Pb40 Tin 60%; Lead 40% F-SW 26 183 to 190 °C Sn60Pb40 Tin 60%; Lead 40% F-SW 32 183 to 190 °C Sn62Pb36Ag2 Tin 62%; Lead 36%; Silver 2% F-SW 32 179 °C Sn95.8AgCu0.7 Tin 95.8%; Silver 3.5%; Copper 0.7% F-SW 32 217 °C Sn95.5AgCu0.7 Tin 95.5%; Silver 3.5%; Copper 0.7% F-SW 34 217 °C Sn95.5Ag3.8Cu0.65 Tin 95.5%; Silver 3.8%; Copper 0.7% F-SW 32 217 °C Sn96,Ag4 Tin 96%; Silver 4% F-SW 32 221 °C Sn99Cu1 Tin 99%; Copper 1% F-SW 32 230 °C Sn99Cu1 Tin 99%; Copper 1% modified rosin 227 °C Sn95Ag4Cu1 Tin 95%; Silver 4%; Copper 1% modified rosin 227 °C Sn95AgCu0.7 Tin 95%; Silver 4%; Copper 1% F-SW 34 217 °C

[0070] The solder type designation provides information about the materials to be soldered, the soldering process, and the flux used. The first letter, F, indicates that flux was added to the solder core during production. The second letter indicates the material to be soldered (S = heavy metal; L = light metal). The third letter indicates the soldering process (H = hard soldering; W = soft soldering). The final number indicates the flux type and the flux's corrosion behavior. Designation DIN 8511 Designation ISO 9454-1 corrosive 11; 12; 13 3.2.2; 3.1.1; 3.2.1 highly corrosive 21; 22; 23; 24; 25; 26; 27; 28 3.1.1; 3.1.2; 2.1.3; 2.1.1; 2.1.2; 1.1.2; 1.1.3; 1.2.2 slightly corrosive 31; 32; 33; 34 1.1.1; 1.1.3; 1.2.3; 2.2.3 non-corrosive

[0071] The composition of a flux depends particularly on the type of parts to be soldered. The flux contained in an electronic solder preferably leaves no corrosive residues. Aluminum and stainless steel can preferably only be soldered with special fluxes. For work on heavily contaminated joining partners, acidic fluxes can be used, for example, soldering fluid based on zinc chloride and / or soldering grease. Residues of acidic fluxes should be removed as soon as possible, as they can lead to long-term corrosion of the soldering joint. For soft and hard soldering, there are fluxes in particular whose composition and melting point take the temperature range in which the soldering takes place into account. When selecting the flux to be used, the requirement that it ensures oxide-free soldering surfaces or brings about oxide-free soldering is achieved is particularly important. Flux type base activator 1 = resin 1 = Rosin 1 = without activator 2 = without rosin 2 = with halogens 3 = without halogens 2 = Organic 1 = Water soluble 1 = without activator 2 = not water soluble 2 = with halogens 3 = without halogens

[0072] A lead-free solder is preferred. Especially with lead-free solder, it is important to ensure that the alloy and flux are a perfect match. The quality of the solder should support the following properties: • RoHS compliance • good electrical conductivity • low melting point • good thermal conductivity • good shear properties • good tensile properties • low fatigue properties • low corrosion properties • good wettability, especially for copper and / or the material of at least one heating wire.

[0073] The three-dimensional connecting component preferably comprises or consists of one or more of the following components: an eyelet, a crimping element, a plug-in connection element.

[0074] An eyelet preferably comprises two sub-elements, namely an upper eyelet part and an eyelet lower part. The entire eyelet is preferably provided by a preferably computer-controlled robot device, for example by a "pick and place" device, in particular a computer-controlled "pick and place" robot. Preferably, the robot device precisely positions and presses the two eyelet sub-elements, namely the upper eyelet part and the lower eyelet part, in the carrier layer, preferably in one pass through the carrier layer.

[0075] The crimping element preferably has one or more protruding elements arranged at the edge of a connection surface, which are in particular plastically deformable or deformed to expediently ensure a positive connection with the at least one passage. Preferably, at least two of the protruding elements are arranged in the connection area on opposite edges of the crimping element. These two protruding elements are preferably arranged along the direction of the successive paths of the at least one heating wire.

[0076] It is particularly possible that the three-dimensional connecting component is or will be arranged in the at least one passage, preferably in such a way that the at least one heating wire can be contacted and / or is contacted from a side which, starting from the carrier layer, is remote from the at least one heating wire and / or that the at least one heating wire can be contacted and / or is contacted both from this side and from a side of the carrier layer facing the at least one heating wire.

[0077] It is possible for the plastic article to be further processed. In particular, it is possible for the plastic article to have or be provided with a plastic injection-molding compound on a first side of the carrier layer provided with the at least one heating wire and the bridge element and / or on a side opposite the first side.

[0078] Preferably, at least the connection area is or will be formed free of plastic injection molding compound, in particular when the plastic injection molding compound is applied, or the connection area is or will be exposed after the plastic injection molding compound has been applied.

[0079] It is possible that the one or more contacting means are or will be applied only to the plastic article containing the plastic injection-molding compound. The one or more contacting means can be or will be mechanically and / or electrically conductively connected to the connection area, in particular by means of mechanical mountings, such as positive and / or non-positive connections, and / or by means of material-to-material connections, such as adhesive bonds and / or one or more additional solder layers.

[0080] Of course, the above-mentioned material characteristics can also be applied equivalently in a process or the above-mentioned process characteristics can be applied in the product.

[0081] The invention is explained below using several exemplary embodiments with the aid of the accompanying drawings. The exemplary embodiments shown are therefore not to be understood as limiting. Fig. 1 to 4 show schematic representations of a process and a manufactured plastic article. Fig. Figures 5 to 13 show further schematic representations of processes and manufactured plastic articles. Fig. 14 shows a schematic representation of a carrier layer. Fig. Figures 15 to 24 show further schematic representations of processes and manufactured plastic articles. Fig. Figure 25 shows a schematic representation of an injection molding process. Fig.26 shows a schematic representation of a heating wire.

[0082] Fig. 1 schematically illustrates an exemplary method for producing a plastic article 1 using the Fig. 1 a to Fig. 1e illustrated steps.

[0083] Fig.1e shows, by way of example and schematically, a plastic article 1 produced using the method, which article has the heating wire 2 connected to the carrier layer 3. The heating wire 3 can be electrically contacted at least in the connection region 5 via the bridge element 40. In this example, the bridge element 40 comprises the base layer 41 and the top layer 42. The connection region 5 is particularly suitable for contacting by means of one or more electrical contacting means, preferably in that the bridge element 40 provides a connection surface. The bridge element 40 forms, in particular, an enlarged area compared to an area overlapping with the heating wire 2, which area represents the connection surface. This advantageously makes it possible to use the connection surface for simplified or more reliable contacting with the one or more contacting means.The one or more contacting means can, for example, be or become connected to the connection area 5 and thus provide or form an interface, such as a contact socket, for integration into an on-board network.

[0084] For example, the one or more electrical contacting means comprise at least one contact socket, preferably with an insertion opening, at least one plug contact which is electrically contacted with the bridge element in the connection area and which can be contacted in particular in the insertion opening, and / or one or more fastening means, in particular for holding a plug, which preferably serves to contact the plug contact to establish a connection to an on-board network.

[0085] As also shown by Fig.1e, it is possible for the heating wire 2 to have one end in the connection region 4 and another end in a further connection region. The further connection region can be shaped like the connection region 4. In addition, by way of example, there is also a further connection region which can be shaped like the connection region 5. It is conceivable for the heating wire 2 to be contacted or to be contactable in the connection region 5 and in the further connection region by means of a single contacting means or by means of several, preferably two, contacting means. In this case, the connection region 5 is preferably assigned to a negative pole and the further connection region to a positive pole, or vice versa.

[0086] To produce the plastic article 1, it is possible that the carrier layer 3 is first provided, as shown by Fig.1a. The carrier layer 3 is preferably single-layer or multi-layer. Preferably, the carrier layer 3 comprises or consists of one or more of the following materials: polyolefin-based (PE), polypropylene (PP), polyvinyl chloride (PVC), polystyrene (PS), polyethylene terephthalate (PET), polycarbonate (PC), acrylonitrile butadiene styrene (ABS), polymethyl methacrylate (PMMA), coextrudates, triextrudates, multiextrudates. It is possible for the carrier layer 3 to comprise cellophane and / or be coated therewith. It is also possible for the carrier layer 3 to be made from a biopolymer basis. The carrier layer 3 can be a coated carrier, a fabric carrier, a multilayer composite, and / or a filled carrier. In particular, the carrier layer 3 has a layer thickness in a range from 20 µm to 5000 µm, preferably from 50 µm to 800 µm.The carrier layer 3 preferably has one or more of the following properties: smooth, rough, structured, partially structured, vapor-deposited on one side, partially vapor-deposited on one side, partially vapor-deposited on both sides, perforated, partially coated, colored, transparent, fully coated, microstructured. Subsequently, for example, the substrate 41 is applied, as is particularly the case with . Fig. 1b. As this is further demonstrated in particular by the Fig. 1c and the Fig. 1d, it is possible that the heating wire 2 is applied to the carrier layer 2 with the base 41 as the next step. It is also conceivable that the carrier layer 3 is already coated with the Fig.1b, and the application of the base 41 has taken place, for example, in a prior process. The method thus preferably comprises step A): providing the carrier layer 3, which is or will be provided with the base 41, and subsequently applying the heating wire 2 to the carrier layer 3 and the base 41.

[0087] The base layer 41 is, for example, electrically conductive and is applied at least in the connection region 5 and in the connection region 4. Preferably, the heating wire 2 partially overlaps the base layer 41 in the connection region 4. Thus, the base layer 41 directly borders the at least one heating wire 2, partially overlaps the at least one heating wire 2, and extends beyond the at least one heating wire. The base layer 41 is thus, for example, the bridge element 40 or at least enables contact in the connection region 5 and can be formed together with other elements, such as the top layer 42, to form the bridge element 40 and connected to the heating wire 2.

[0088] The base 41 is preferably an adhesive contact pad, which in particular represents a multi-layer system. The base 41 is or comprises in particular an electrically conductive conductive layer, which is present or applied in particular both in the connection region 4 and in the connection region 5. The conductive layer is preferably a metal layer and / or a metal foil, for example a copper layer and / or a copper foil. Preferably, the base 41 also has an adhesive layer that adheres to the carrier layer 3. The adhesive layer can in particular be provided over the entire surface of the bridge element 40 and / or the base 41. It is also possible for the conductive layer to comprise one or more of the chemical elements Al, Cu, Ag, Au, and / or C. Furthermore, it is possible for the conductive layer to be a conductive paste or to be applied as such.The adhesive layer can be or become electrically conductive or non-conductive and / or single-layered or multi-layered.

[0089] It is also conceivable that the base 41 is or comprises a conductive lacquer layer, which is or will be applied, preferably printed, to the carrier layer 3 (in particular without an additional adhesive layer in the connecting element 41). Regarding further alternative or additional possible embodiments of the base 41 and the conductive layer, reference is made in particular to the above explanations.

[0090] Fig. 1c and Fig.1d illustrates, by way of example, the use of a feed device 200, which in particular enables application of the heating wire 2 by means of ultrasound. The feed device 200 preferably has a sonotrode and a supply unit, in particular a supply roll, for providing the heating wire 2. The supply unit is preferably moved together with the sonotrode. The heating wire 2 is expediently guided from the supply unit to the sonotrode and / or through the sonotrode, for example by unwinding from the supply roll. After the heating wire 2 has been applied by means of the sonotrode, it is particularly possible to carry out the following step: separating, in particular automatically separating, the heating wire 2. After the separation, the feed device 200 is preferably removed from the carrier layer 3 with the heating wire 2. Fig.1d accordingly illustrates an exemplary step in which the heating wire 2 is completely applied and the heating wire 2 is separated and the feed device 200 is removed. Regarding possible embodiments of the sonotrode and the use of ultrasound to provide the carrier layer with the heating wire, reference is made in particular to the above explanations. It is preferred that the sonotrode vibrates and / or oscillates at 70 kHz.

[0091] As further exemplified by Fig.As illustrated in Figure 1e, after the heating wire 2 has been applied, the top layer 42 is preferably applied to the carrier layer 3, the heating wire 2, and in particular also the base layer 41. The method therefore preferably comprises step B): providing the carrier layer 3, which is provided with the heating wire 2 and in particular also with the base layer 41, and subsequently applying the top layer 42 to the carrier layer 3 and to the at least one heating wire 2.

[0092] The top layer 42 is, in particular, a solder layer, and step B) is or preferably comprises soldering the heating wire 2 and the base 41 using the solder layer. The solder layer thus advantageously enables a mechanically reliable and electrically conductive connection of the bridge element 40, in particular the conductive layer of the base 41, to the heating wire 2. By means of the solder layer, in particular, a permanent and firm connection can be established between the heating wire 2 and the base 41. It is also conceivable that, before soldering, the base 41 initially does not adjoin the heating wire 2 directly or does not adjoin it via a reliable connection, but then a reliable connection is established via the top layer 42. In the connection region 4, an electrically conductive connection between the heating wire 2 and the bridge element 40 is or will be established.This can be achieved, for example, by direct contact of the base layer 41 with the heating wire 2, which occurs when the heating wire 2 is applied and / or the top layer 42 is applied for this purpose.

[0093] The heating wire 2 here is, in particular, a copper wire. It is also possible for the heating wire to comprise one or more of the following chemical elements: Al, Cu, Ag, Au, C and / or an alloy thereof. Furthermore, it is possible for the heating wire 2 to be a multi-layer system. The heating wire 2 is preferably applied in the connection region 4 or completely uninsulated to the carrier layer 3. However, it has also been found that the thermal energy input by applying the solder layer can be utilized if the heating wire 2 is provided or applied in the connection region 4 with an insulating varnish layer on the carrier layer 3.In this case, the insulating lacquer layer and the solder layer are preferably formed in such a way and the method, in particular step B), is carried out in such a way that the thermal energy input through the solder layer during soldering preferably exposes the heating wire 2 from the insulating lacquer layer and thus in particular creates an electrically conductive connection between the heating wire 2 and the bridge element 40, in particular the conductive layer of the base 41. In particular with a conductive lacquer layer in the base 41 or as the base 41, it is possible for the insulating lacquer layer to be melted and partially incorporated into the solder layer and / or the conductive lacquer layer. If the top layer 42 is not applied as a solder layer, it is also conceivable to carry out a step for introducing ultrasonic energy in order to expose the heating wire 2 from the optionally present insulation at least in the connection region 4.

[0094] The particularly through the Fig. Steps A) and B) illustrated in Figures 1a to 1e are thus carried out such that the bridge element 40 is present in the connection region 4 and in the connection region 5, in that the bridge element 40 directly adjoins the heating wire 2 and partially overlaps the heating wire 2 and extends beyond the heating wire 2. Other possibilities for such an arrangement would be possible, for example, by providing only the base layer 41 in the form of a conductive ink layer as the bridge element 40, by providing only an upper layer 42 in the form of a conductive ink layer or in the form of a solder layer as the bridge element 40, or by providing a three-dimensional connecting component as the bridge element 40.

[0095] The procedure also includes the following step: Step i) Electrically conductive connection of the heating wire 2 and the bridge element 40 in the connection area 4. This step can, for example, comprise establishing contact between a conductive layer of the base 41 and the heating wire 2, as is particularly the case by the Fig. 1c and Fig. 1d, and / or include soldering, as can be seen in particular from the solder layer of the top layer 42 of the Fig. 1e is illustrated.

[0096] Fig. 2 schematically shows a plan view at the top and a schematic side view below of a region of the provided carrier layer 3 with the base 41. The base 41 is or will be used in particular in a plastic article 1, such as this preferably to Fig. 1 is applied to the carrier layer 3 and formed as in particular Fig. 1. The base 41 preferably comprises an adhesive layer on a side facing the carrier layer 3. The adhesive layer can, for example, be conductive or non-conductive. On a side facing away from the carrier layer 3, and thus in particular in the plastic article 1 facing the heating wire 2, the base 41 preferably comprises a conductive layer, such as a metal layer or a conductive lacquer layer. The base 41 is thus preferably applied as a conductive adhesive strip. However, it is also possible to provide the base 41 in the form of a conductive lacquer layer without an additional adhesive layer on the carrier layer 2, in particular by means of a printing process, such as preferably screen printing processes, gravure printing processes, digital printing processes (in particular inkjet and the like); letterpress printing processes (in particular flexographic printing and the like).

[0097] Fig. 3 shows schematically a plan view at the top and schematically a side view below of a region of the provided carrier layer 3 with the base 41, as this is particularly shown by Fig. 2, as well as the heating wire 2 applied thereto. Such an area can be used in the process in particular at a time after the Fig. 1d illustrated steps are present. As shown by the example of Fig. As can be seen in Figure 3, the shape of the heating wire 2 can also be advantageously influenced by means of the base 41, which can, for example, reduce faulty contacts. Furthermore, the base 41 can provide a connecting surface for additional layers, such as metal layers, in particular metal pads.

[0098] Fig. 4 shows schematically a top view and schematically a side view of a region of the plastic article 1, as shown in the Fig. 3, wherein the heating wire 2 and the base 41 are soldered by means of the top layer 42 in the form of a solder layer. Such an area can therefore be soldered in the process at a time after the Fig. 1e illustrated steps are present or in the Fig. 1e shown plastic article 1.

[0099] The Fig. The plastic article 1 illustrated in Figure 4 is thus produced in particular by applying the heating wire 2 to a carrier layer 3 provided with contact pads, in particular adhesive contact pads, which are preferably formed by the base 41, using an ultrasonic process, wherein the ends of the heating wire 2 are finally soldered to the contact pads using the top layer 42 as a solder layer. Particularly advantageous here is the preferred use of a heating wire 2 that is uninsulated or completely uninsulated at least in the connection region 4, in particular when applied to the carrier layer 3 and when providing the carrier layer 3 with the heating wire 2, or in the case of a heating wire 2 that is insulated in the connection region, the fact that the exposure can take place not before soldering, but during soldering by introducing thermal energy.In this context, the bridge element 40 can be formed by contact pads formed by the base layer 41 and / or the top layer 42, for example, via adhesive contact pads or via a pre-applied adhesive layer with subsequent application of a conductive layer, in particular in the form of a metal pad. The adhesive layer, which is pre-applied or also provided directly on the adhesive pads, can be conductive, non-conductive, single-layer, or multi-layer.

[0100] Fig. 5 shows schematically a top view and below schematically a side view of a portion of the plastic article 1 as shown by Fig. 3, except that the heating wire 2 is meandering in the connecting region 4. In the connecting region 4, the heating wire 2 thus has a sequence of several tracks 20 in one direction. The tracks are connected to one another by curves 21, which are also formed by the heating wire 2. Here, the heating wire 2 has, for example, a turning line in each of the tracks 20, since the tracks 20 run straight and then merge into the curves 21, which each have a curvature that differs in sign from a curvature of the curve on the other side.

[0101] In this example, the heating wire 2 is applied to the carrier layer 2 and the base 41 with a mold, wherein the mold is characterized by an increased areal density on the carrier layer. The areal density is particularly related to the coverage of a first area with the heating wire 2 in the connecting region 4 compared to the coverage of an adjacent area not overlapping with the first area with the heating wire 2. The first area can, for example, be present entirely in the connecting region 4. The adjacent area not overlapping with the first area in this example comprises the heating wire 2 leading to the connecting region 4. Preferably, the first area and the adjacent area not overlapping with the first area have a contiguous area of ​​at least 1 mm 2 , preferably at least 3 mm 2 , more preferably at least 9 mm 2 on.

[0102] Fig. 6 shows schematically a top view and below schematically a side view of a region of the plastic article 1 as this in particular by Fig. 4, except that the heating wire 2 is meander-shaped in the connecting area 4, as is particularly Fig. 5 and preferably that the top layer 42, which is preferably a solder layer, is or will be applied overlapping the tracks 20 and extending beyond the tracks 20. With regard to advantageous embodiments, particular reference is made to Fig. 26 described embodiments.

[0103] In particular, the advantages 1), 2) and 3) described above can be achieved. This is therefore a similar example to the Fig. 1 to 4. One difference lies in particular in the fact that in the connection area 4 the heating wire 2, which in the connection area 4 can be applied to the carrier layer 3 in an uninsulated or completely uninsulated or completely insulated manner and provided with the latter, is or will be laid (e.g. in a meandering shape) over the base 41, which is present in particular as a contact pad, preferably as an adhesive contact pad, in such a way that additional functionalities can be provided. In this way, a multiple contact option is advantageously provided in order to reduce the probability of incorrect contact and thus the probability of a non-functional plastic article 1. On the other hand, the shape, the spacing of the tracks 20, etc. can have a positive influence on the wetting with solder and likewise on the distribution of the introduced energy, in order to avoid in particular local damage to the carrier layer 3.

[0104] Fig. Fig. 7 shows schematically a top view and below schematically a side view of a region of the carrier layer 3 with the heating wire 2 and the base 41, as shown by Fig. 5, except that the substrate 41 is a conductive printing varnish layer. The substrate 41 is preferably printed onto the carrier layer 2. In particular, no additional adhesive layer is required. A preferred printing method is selected from screen printing methods, gravure printing methods; digital printing methods (particularly inkjet and the like); and relief printing methods (particularly flexographic printing and the like). The substrate 41 thus forms, in particular, a printed contact pad.

[0105] Fig. Figure 8 shows schematically a top view and below schematically a side view of a portion of the plastic article 1, as shown by Fig. 6, except that the base 41 is a conductive printing lacquer layer, as is Fig. 7. Preferred printing methods for the substrate 41 are screen printing methods, gravure printing methods; digital printing methods (particularly inkjet and the like); relief printing methods (particularly flexographic printing and the like).

[0106] Fig. 9 shows schematically a top view and below schematically a side view of a portion of the plastic article 1, as this is shown by Fig. 8, except that the base layer 41 and the top layer 42 are a conductive printing varnish layer. Preferred printing processes for the top layer 42 are screen printing processes, gravure printing processes; digital printing processes (particularly inkjet and the like); and relief printing processes (particularly flexographic printing and the like).

[0107] Thus, in particular, a contact pad is formed from two printed conductive ink layers, namely a conductive ink layer encompassed by the base layer 41 and a conductive ink layer encompassed by the top layer 42. It is further preferred that the heating wire 2 be applied and provided on the carrier layer 2 uninsulated or completely uninsulated, at least in the connection region 4. This advantageously saves energy for exposing the heating wire 2 and / or soldering.

[0108] Fig. 10 shows schematically a top view and below schematically a side view of a portion of the plastic article 1, as shown by Fig. 9, except that the base 41 comprises an adhesive layer and a conductive layer, as is particularly Fig. 2. The top layer 42 comprises a conductive printing layer. By introducing ultrasonic energy, a Fig. 11 illustrated plastic article 1 can be obtained.

[0109] The heating wire 2 can be applied and provided on the carrier layer 2 in an uninsulated, completely uninsulated or completely insulated manner, at least in the connecting region 4. In order to remove insulation from the heating wire 2 in the connecting region 4 and / or to expose the heating wire from this insulation, energy is preferably introduced by means of ultrasound or laser radiation by introducing ultrasonic vibration energy or laser energy, thus creating a conductive composite of the base layer 41, the top layer 42 and the heating wire 2. Thus, a plastic article 1 can be obtained, as shown in Fig. 11 is illustrated.

[0110] Fig. 11 shows schematically a top view and below schematically a side view of a portion of the plastic article 1, as shown by Fig. 10. The top layer 42 is in particular a conductive printing layer. Preferred printing methods for the top layer 42 are screen printing methods, gravure printing methods; digital printing methods (in particular inkjet and the like); letterpress printing methods (in particular flexographic printing and the like). The region 42a depicted in the top layer 42 is in particular a region for introducing energy, such as vibration energy or laser energy or the like. The region 42a is expediently the region in which the energy for providing the contact was introduced, in particular by thus forming an electrically conductive bond with the heating wire 2 and the base 41 and / or the top layer 42. For this purpose, for example, a Fig. 3, Fig. 5 or Fig. 7, the carrier layer 3 provided together with the base 41 may be provided with the top layer 42 comprising or consisting of a medium for introducing energy, such as vibration energy or laser energy or the like. The region for introducing energy, such as vibration energy or laser energy or the like, is or will preferably be arranged at least in a first region 420, which is located at least partially in the connecting region 4. The region for introducing energy, such as vibration energy or laser energy or the like, may preferably overlap the heating wire 2 and in particular extend beyond the heating wire 2, as is shown by Fig. 11 is illustrated by way of example. To introduce vibration energy, an ultrasound-generating sonotrode is preferably applied in the region 42a to introduce vibration energy. In the region 42a, the ultrasound can cause the upper layer 42 there to sink and / or thus lead to an electrical connection with the base 41 and / or the heating wire 2. This connection is, for example, in Fig. 11 in the connection region 4. Here, the heating wire 2 applied to the carrier layer 3 can preferably have insulation in the connection region 4, and step i) can comprise introducing ultrasonic vibration energy. It is also conceivable for the heating wire 2 to be applied and provided on the carrier layer 3 at least in the connection region 4 or completely uninsulated.

[0111] Fig. 12 shows schematically a top view and below schematically a side view of a portion of the plastic article 1, as shown by Fig. 11, except that the top layer 42 comprises or consists of a conductive layer and a conductive adhesive layer. The top layer 42 is thus applied in particular as an adhesive contact pad. The base layer 41 is also in particular an adhesive contact pad and preferably has a conductive layer and an adhesive layer, as is particularly the case with Fig. 2. To produce the example shown by Fig. 12 illustrated plastic article 1, for example, a Fig. 3, Fig. 5 or Fig. 7, the carrier layer 3 provided together with the base layer 41 may be provided with the top layer 42, which in particular comprises a conductive layer and a conductive adhesive layer. Preferably, the heating wire 2 may be applied and provided in the connecting region 4 or completely uninsulated or completely insulated on the carrier layer 3. In particular, by introducing energy, in particular ultrasonic energy, a conductive composite of heating wire 2, base layer 41 and top layer 42 may be obtained. The plastic article thus obtained is exemplified by Fig. 13 illustrates.

[0112] Fig. 13 schematically shows a top view and below schematically a side view of a region of the manufactured plastic article 1. The plastic article 1 is in particular after introduction of ultrasonic energy into the by Fig. 12. Preferably, an electrically conductive composite of the base layer 41, the top layer 42, and the heating wire 2 is obtained by introducing ultrasonic energy. The region 42a in the region of the top layer 42 represents, in particular, the region in which the energy was introduced, which ultimately leads to the electrical connection of the base layer 41, the heating wire 2, and the top layer 42.

[0113] Fig. 14 shows a schematic plan view and, at the bottom, a schematic side view of a region of a carrier layer 3, wherein a passage 8 is provided in the connection region 5. For this purpose, a Fig. 1 and Fig. 2 described carrier layer 2 and provided with the passage 8 or already have it. Such a carrier layer 3 can be used for the production of plastic articles 1 as described by the previous Fig. 1 to 13, or be contained in the plastic articles 1 thus produced. Preferably, the passage 8 is introduced before the heating wire 2 and, in particular, before the bridge element 40 is applied.

[0114] Fig. 15 illustrates a particularly based on and Fig. 2 illustrated carrier layer 2 with the base 41 and a corresponding method, except that the Fig. 14 illustrated carrier layer 2 is used.

[0115] Fig. 16 illustrates how the Fig. 5 illustrated carrier layer 2 with the base 41 and the heating wire 2 and a corresponding method, except that the Fig. 14 illustrated carrier layer 2 is used.

[0116] Fig. 17 illustrates how the Fig. 6 illustrated plastic article 1 and a corresponding method, except that the Fig. 14 is used or is present with the passage 8. By means of the passage 8 it is possible, for example, to connect the bridge element 40 from a side of the carrier layer 3 facing away from the heating wire (in the side view of Fig. 17, for example, from below) and / or from the side of the carrier layer 3 facing the heating wire 2 (in the side view of Fig. 17, for example, from above). As can be seen particularly here, the bridge element 40, in particular the base layer 41 and / or the top layer 42, preferably overlaps the passage 8.

[0117] Fig. 18 illustrates how, in particular, Fig. 11 illustrated plastic article 1 and a corresponding method, except that the Fig. 14 is used. By means of the passage 8, it is possible, for example, to contact the bridge element 40 from both sides of the carrier layer 3. As can be seen here in particular, the bridge element 40, in particular the base layer 41 and / or the top layer 42, preferably overlaps the passage 8.

[0118] Fig. 19 schematically shows a top view and, at the bottom, a side view of a region of a carrier layer 3, which has the heating wire 2 and is intended or provided for a plastic article 1 with an overlap of the connecting region 4 and the connecting region 5. Preferably, the heating wire 2 is also provided in the connecting region 5. As exemplified by Fig. 19, the heating wire 2 can thus be meander-shaped in the connecting region 4 and in the connecting region 5. Other shapes are also conceivable, provided that the heating wire 2 has an increased surface density in the connecting region 4 and in the connecting region 5 and / or a sequence of several tracks that are connected to one another by curves and / or corners of the heating wire 2, and preferably form gap structures that advantageously offer improved wetting with a liquid medium. For example, as shown in Fig. 26 described forms are present and / or forms of the above statements are present.

[0119] Fig. 20 shows schematically a top view and below schematically a side view of a region of the plastic article 1, which in particular by means of a Fig. 19 is or will be produced with the heating wire 2. In this case, the bridge element 40 is formed only by the top layer 42. The top layer 42 is in particular a solder layer 42 which is applied to the heating wire 2. Step i) and step B) are therefore preferably a soldering of the heating wire 2 by means of the top layer 2 in the form of a solder layer. The heating wire 2 can also be applied and provided on the carrier layer 2 at least in the connection region 4 uninsulated or completely uninsulated or completely insulated. Complex process steps involving the upstream provision of contact pads, such as adhesive contact pads or printed pads, can therefore be eliminated. In particular with such an embodiment, the advantage of improved wetting in the connection region 42 is utilized by applying the top layer 42 preferably as a liquid medium and bringing it into direct contact with the heating wire 2.There, as through . Fig. 19, a plurality of gaps is provided by the heating wire 2, a particularly good wetting ability with a solder forming the top layer 42 is possible.

[0120] Fig. 21 shows schematically a top view and below schematically a side view of a portion of a plastic article 1, as this in particular Fig. 19 and to Fig. 20, except that the plastic article 1 has a carrier layer 2, as described in particular for Fig. 14. In the connection area 5, a passage 8 is or will be provided, preferably before the heating wire 2 and in particular before the top layer 42 is applied. In addition, the connection area 4 is arranged overlapping the passage 8. Thus, the heating wire 2 preferably partially overlaps the passage 8 and the top layer 42 preferably completely covers the passage 8. For this purpose, the heating wire 2 is or will be preferably as shown schematically in particular by Fig. 22, with several tracks 20 overlapping the passage 8. It is also conceivable to provide several passages in the connection area 5 and / or in the connection area 4, in particular to form a further electrical and / or mechanical connection option. The passage 8, in particular, enables electrical contact of the heating wire 2 on both sides with respect to the carrier layer 2.

[0121] Fig. 22 schematically illustrates a carrier layer 2 with a passage 8 and with the heating wire 2, wherein the heating wire 2 overlaps with the passage 8 in the connection region 4. Thus, it is particularly possible to form a reliable connection between the heating wire 2 and the top layer 42 across the passage 8.

[0122] Fig. 23 schematically shows a top view and, below, a side view of a region of a plastic article 1 with a three-dimensional connecting component 43. In this example, the connecting component 43 is an eyelet which is fastened in the connection region 5 in a passage 8 in the carrier layer 3 and in particular has two eyelet sub-elements, namely an eyelet upper part and an eyelet lower part.

[0123] For this purpose, the heating wire 2 is preferably as schematically shown by Fig. 22, is applied and in particular spaced such that the heating wire 2 is not severed or damaged by the introduction of the eyelet. The entire eyelet is provided, for example, by a "pick and place" device, in particular a computer-controlled "pick and place" robot, wherein the device places the two eyelet sub-elements, namely the upper eyelet part and the lower eyelet part, in the carrier layer 3 with precise positioning and presses them in. By means of the eyelet, contact with the heating wire 2 is advantageously possible on both sides. The heating wire 2 is preferably applied to the carrier layer 3 at least in the connection region 4 without insulation or completely without insulation and is provided with the carrier layer. This eliminates the need for an additional step for exposing the heating wire 2.

[0124] Fig. Figure 24 schematically shows a top view and, at the bottom, a side view of a region of a plastic article 1 with a three-dimensional connecting component 43. In this example, the connecting component 43 is a crimp element, which in particular provides a connection surface in the connection region 5 and is or will be attached to the carrier layer 3 preferably by means of a crimp connection. For this purpose, the three-dimensional connecting component 43 preferably has one or more elements protruding from the edge of the connection surface, which are held by one or more passages. For this purpose, the protruding elements are, for example, plastically deformable and / or deformed. Fig. 24 illustrates an example with six passages 8 in the carrier layer 2 and six elements 431 protruding from the crimping element, each arranged in a passage 8. A different number is also conceivable, e.g., only two passages 8 and two protruding elements 431 are provided. Preferably, at least two of the protruding elements 431 are arranged opposite one another at the edge of the crimping element in the direction of the successive paths of the heating wire 2.

[0125] The heating wire 2 is preferably applied to the carrier layer in an uninsulated or completely uninsulated manner, at least in the connection region 4, and provided with the carrier layer. This eliminates the need for an additional step for exposing the heating wire 2.

[0126] As through Fig. 23 and Fig. 24, it is therefore also possible for the plastic article 1 to have, as a bridge element 40, a three-dimensional connecting component 43 which is integrated into the plastic article 1 via a positive and / or non-positive fastening. Such three-dimensional connecting components are in particular made of metal and are brought into contact with the heating wire 2. The connection region 5 is thus formed in particular by a surface of the three-dimensional connecting component 43. Since these can be rigid bodies, for example, which can lose contact with the heating wire 2 if displaced, it is advantageous here to reduce the probability of incorrect contact by means of a sequence of paths of the heating wire. Another advantage is that process steps for providing and applying adhesive contact pads or printed contact pads can be eliminated.

[0127] Fig. 25 schematically illustrates a step of back-molding the carrier layer 3 with an injection-molding compound 6. The carrier layer 3 has, in particular, at least the heating wire 2. The shown view of the carrier layer 3 with the heating wire 2 can, in particular, be a section through a partial region of the connecting region 4 in which no bridge element 40 is arranged. During the back-molding step, a cavity is formed by the wall 71 and the wall 72, and the carrier layer 2 is applied to the wall 72. The injection-molding compound 6 is injected into the cavity. Fig. 25 shows a flow profile of the injected injection molding compound 6 in a simplified manner as an incoming and uniform flow profile. In the region 22, a path is arranged first in the flow direction of the injection molding compound 6, which path can represent a "front" for the incoming injection molding compound 6 and thus reduce the loads on downstream paths. If, for example, several paths of the heating wire 2 are arranged one behind the other in the flow direction of the injection molding compound 6 (e.g. due to parallel paths of a meandering heating wire 2), it is possible that lower shear forces act on downstream paths along the flow direction than on the first path in the region 22 or than on upstream paths. In this example, the heating wire 2 is thus arranged such that shear forces and displacement forces due to the incoming injection molding compound 6 are reduced.

[0128] Fig. 26 illustrates schematically and by way of example the dimensions of the at least one heating wire 2 in the connecting region 4.

[0129] It is preferred that at least two adjacent tracks 20 or all adjacent tracks 20 each have a distance F in a range from 0 mm to 12 mm, preferably from 0.02 mm to 12 mm, preferably from 0.02 mm to 1 mm. The distance F of the tracks 20 is preferably measured between outer surfaces of the respective tracks 20. Adjacent to each other means in particular without intermediate tracks, as is the case for the Fig. 26 shown tracks 20 is the case. Alternatively or additionally, it is possible for the tracks including the curves and / or corners to run in a region with a width H in a range from 1 mm to 50 mm, preferably from 3 mm to 7 mm, and / or with a height L in a range from 1 mm to 70 mm, preferably from 3 mm to 15 mm. The width H is preferably measured perpendicular to the height L. As in Fig. 26, it is possible that the tracks together with the curves and / or corners are or will be provided in a region with a width H and a height L, wherein the height L is greater than the width H. The distance F between the tracks is preferably measured in the direction of the height L. Preferably, the base 41 and / or the top layer 42 has larger dimensions in the direction of the height L than in the direction of the width H. In particular, the connecting region 4 has the specified width H and / or height L.

[0130] The heating wire 2 and / or the tracks 20 are or will preferably be applied with a diameter D in a range from 20 µm to 350 µm, preferably from 75 µm to 120 µm.

[0131] Of course, the listed versions can be combined with each other as desired and do not represent any limitations. List of reference symbols 1 plastic item 2 heating wires 20 lanes 200 feeding device 21 curves 22 Area 3 Carrier layer 4 Connection area 40 bridge elements 41 Underlay 42 top layer 43 three-dimensional connecting component 431 protruding elements 5 Connection area 6 Injection molding compound 71, 72 Wall of a cavity 8th round

Claims

[1] Method for producing a plastic article (1) with at least one heating wire (2) which is connected to a carrier layer (3) and is electrically contacted and / or electrically contactable at least in one connection region (5) via a bridge element (40), in particular by means of one or more electrical contacting means, wherein the bridge element (40) is electrically conductive and is or comprises one or more of the following elements: a base (41), a top layer (42), a three-dimensional connecting component (43) which is integrated into the plastic article (1) via a positive and / or non-positive fastening, wherein the method comprises at least one of the following steps: A) Providing the carrier layer (3) which is or will be provided with the base (41), and then applying the at least one heating wire (2) to the carrier layer (3) and the base (41), B) providing the carrier layer (3) which is or will be provided with the at least one heating wire (2), and subsequently applying the top layer (42) to the carrier layer (3) and to the at least one heating wire (2), and / or C) providing the carrier layer (3), which is or will be provided with the at least one heating wire (2), and positively and / or non-positively fastening the three-dimensional connecting component (43), wherein steps A), B) and / or C) are carried out in such a way that the bridge element (40) is present in the connecting region (4) and in the connection region (5), wherein the bridge element (40) directly adjoins the at least one heating wire (2) and / or partially overlaps the at least one heating wire (2) and extends beyond the at least one heating wire (2), and the following step is carried out: i) Electrically conductively connecting the at least one heating wire (2) and the at least one bridge element (40) in the connecting region (4). [2] Method according to claim 1, characterized by , that the at least one heating wire (3) at least in the connecting area (4) either is exposed by an energy input of the process for electrically conductively connecting the at least one heating wire (2) to the at least one bridge element (40), wherein an electrically non-conductive insulation, preferably an electrically non-conductive insulation lacquer layer, surrounding the at least one heating wire (2) is removed at least in regions from the at least one heating wire (2), or is already exposed when the carrier layer (2) is provided and is or will be provided with the at least one heating wire (2). [3] Method according to one of the preceding claims, characterized bythat the at least one heating wire (3) is applied to the carrier layer without insulation, preferably without an insulating lacquer layer. [4] Method according to one of the preceding claims, characterized by that the at least one heating wire (2) is partially provided with the insulation, preferably the insulating lacquer layer, wherein the at least one heating wire (2) is not provided with the insulating lacquer layer in a region associated with the connecting region (4) before the at least one heating wire (2) is applied to the carrier layer (3). [5] Method according to one of the preceding claims, characterized by that the base layer (41) and / or the top layer (42) is or comprises a conductive layer which is electrically conductive. [6] Method according to one of the preceding claims, characterized by that the conductive layer is or will be applied in the connection area (4) and in the connection area (5). [7] Method according to one of the preceding claims, characterized by that the conductive layer of the base layer (41) and / or the top layer (42) is or comprises a conductive lacquer layer and / or a printing layer which is applied by a printing process, in particular by a screen printing process and / or a gravure printing process and / or a flexographic printing process and / or a digital printing process, preferably an inkjet process. [8] Method according to one of the preceding claims, characterized by that the conductive layer of the base layer (41) and / or the top layer (42) is or will be applied directly in contact with the carrier layer (3) and / or the at least one heating wire (2). [9] Method according to one of the preceding claims, characterized bythat the base layer (41) and / or the top layer (42) is or comprises an adhesive-free surface, wherein before the carrier layer (2) is provided with the base layer (41) and / or the top layer (42), an adhesive layer is applied to an area to be provided with the adhesive-free surface. [10] Method according to one of the preceding claims, characterized by that in step B) the top layer (42) is applied at least in some areas to the base layer (41). [11] Method according to one of the preceding claims, characterized by that the connection in step i) comprises soldering the at least one bridge element (40) to the at least one heating wire (2), in particular wherein the top layer (42) is applied in the form of a solder layer or comprising a solder layer. [12] Method according to one of the preceding claims, characterized bythat the connection in step i) is carried out by establishing direct contact of the at least one heating wire (2) with at least one conductive layer, in particular a conductive lacquer layer, wherein the at least one conductive layer, in particular a conductive lacquer layer, is encompassed by the base layer (41) and / or by the top layer (42). [13] Method according to one of the preceding claims, characterized by that during the bonding in step i) by an energy input of step i), preferably by means of ultrasound or laser radiation, an electrically conductive composite is obtained from the at least one bridge element (40), in particular the base (41) and the top layer (42). [14] Method according to one of the preceding claims, characterized by that the at least one heating wire (2) is connected to the carrier layer (3) under the action of ultrasound or laser radiation. [15] Method according to one of the preceding claims, characterized bythat the at least one heating wire (2) in the connecting region (4) is or will be applied to the carrier layer (3) and optionally to the base (41) in a shape which is characterized by an increased surface density. [16] Method according to one of the preceding claims, characterized by that the at least one heating wire (2) in the connecting region (4), in particular in a region of the connecting region (4) overlapping with the at least one bridge element (40), has a sequence of several tracks (20) in one direction. [17] Method according to one of the preceding claims, characterized by that the tracks are connected to each other by curves (21) and / or corners. [18] Method according to one of the preceding claims, characterized bythat at least two adjacent tracks (20) or all adjacent tracks (20) have a distance in a range from 0 mm to 12 mm, preferably from 0.02 mm to 12 mm, preferably from 0.02 to 1 mm, and / or the tracks (20) form gap structures. [19] Method according to one of the preceding claims, characterized by that the tracks (20) together with the curves (21) and / or corners run in an area with a width in a range of 1 mm to 50 mm, preferably from 3 mm to 7 mm, and / or with a height in a range of 1 mm to 70 mm, preferably from 3 mm to 15 mm. [20] Method according to one of the preceding claims, characterized by that the at least one heating wire (2) and / or the tracks (20) have a diameter in a range from 20 µm to 350 µm, preferably from 75 µm to 120 µm. [21] Method according to one of the preceding claims, characterized bythat the base layer (41) and / or the top layer (42) is or will be applied overlapping several or all of the webs (20) and extending beyond these several or all of the webs (20). [22] Method according to one of the preceding claims, characterized by that at least one layer of the base layer (41) and the top layer (42) is applied as a liquid medium and / or a conductive paste and is preferably brought into direct contact with the at least one heating wire (2), in particular with the sequence of several tracks (20). [23] Method according to one of the preceding claims, characterized by that the carrier layer (3) has or is provided with at least one passage (8) in the connecting region (4) and / or in the connection region (5). [24] Method according to one of the preceding claims, characterized bythat the sequence of several tracks (20) of the heating wire extends at least partially over the at least one passage (8). [25] Method according to one of the preceding claims, characterized by that the three-dimensional connecting component (43) is or will be arranged in the at least one passage (8). [26] Plastic article (1), in particular produced by the method according to one of the preceding claims, with at least one heating wire (2) which is connected to a carrier layer (3) and is electrically contacted and / or electrically contactable in a connection region (5) via at least one bridge element (40), in particular by means of one or more electrical contacting means, wherein the bridge element (40) is or comprises one or more of the following elements: a base (41), a top layer (42), a three-dimensional connecting component (43) which is integrated into the plastic article (1) via a form-fitting and / or force-fitting fastening, wherein the bridge element (40) is electrically conductive and is electrically conductively connected to the at least one heating wire (2) in a connection region (4) and is present in the connection region (5),wherein the bridge element (40) directly adjoins the at least one heating wire (2) and / or partially overlaps the at least one heating wire (2) and extends beyond the at least one heating wire (2). [27] Plastic article (1) according to one of the preceding claims, characterized by in that the at least one heating wire (3) is exposed at least in the connection region (4) by an energy input of the process for electrically conductively connecting the at least one heating wire (2) to the at least one bridge element (40), wherein an electrically non-conductive insulation enclosing the at least one heating wire (2), preferably an electrically non-conductive insulating lacquer layer, is at least partially removed from the at least one heating wire (2), or is already exposed when the carrier layer (3) is provided and is provided with the at least one heating wire (2). [28] Plastic article (1) according to one of the preceding claims, characterized by that the at least one heating wire (2) in the connecting region (4), in particular in a region of the connecting region (4) overlapping with the at least one bridge element (40), has a sequence of several tracks (20) in one direction. [29] Plastic article (1) according to one of the preceding claims, characterized by that the base layer (41) and / or the top layer (42) is or comprises a conductive layer which is electrically conductive. [30] Plastic article (1) according to one of the preceding claims, characterized by that the conductive layer of the base (41) and / or the top layer (42) is or comprises a conductive lacquer layer and / or a printing layer. [31] Plastic article (1) according to one of the preceding claims, characterized bythat the conductive layer of the base layer (41) and / or the top layer (42) is applied directly in contact with the carrier layer (3) and / or the at least one heating wire (2). [32] Plastic article (1) according to one of the preceding claims, characterized by that the carrier layer (3) has at least one passage (8) in the connecting region (4) and / or in the connection region (5). [33] Plastic article (1) according to one of the preceding claims, characterized by that the three-dimensional connecting component (43) is or will be arranged in the at least one passage (8). [34] Plastic article (1) according to one of the preceding claims, characterized by that the sequence of several tracks (20) of the heating wire extends at least partially over the at least one passage (8). [35] Plastic article (1) according to one of the preceding claims, characterized bythat the plastic article has a plastic injection molding compound on a first side of the carrier layer (2) provided with the at least one heating wire (2) and the bridge element (40) and / or on a side opposite the first side. [36] Plastic article (1) according to one of the preceding claims, characterized by that the plastic article has one or more contacting means comprising at least one contact socket.

Images