Package containing vertical electronic components held together by a clip

Abstract

Housing (100), comprising: • a vertically extending first electronic component (102) with at least one exposed electrically conductive first terminal (104-106); • a vertically extending second electronic component (108) with at least one exposed electrically conductive second terminal (110-112); and • a clip (114) with a recording volume (116) in which the first electronic component (102) and the second electronic component (108) are recorded and held together; • wherein the clip (114) has two spaced-apart legs (130, 132) which are connected by a head (124), • wherein the clip (114) has a lateral extension section (120) at its base, which extends laterally outwards in a horizontal direction from a central access opening of the clip; • wherein the at least one first connection (104-106) and the at least one second connection (110-112) are electrically accessible on an underside of the clip (114); • wherein the underside of the clip (114), an underside of the first electronic component (102) and an underside of the second electronic component (108) are on the same vertical plane; wherein a central section of the clip (114) is connected to the first electronic component (102) and the second electronic component (108), wherein the underside of the clip (114) is laterally spaced from the first electronic component (102) and the second electronic component (108) by a gap.

Description

BackgroundTechnical area

[0001] Various embodiments generally relate to a package and a method of manufacturing a package. Description of the state of the art

[0002] A conventional package may include an electronic component mounted on a chip carrier, may be electrically connected by a bonding wire extending from the chip to the chip carrier or to a lead, and may be molded using a molding compound as an encapsulant.

[0003] The space required for a conventional package can be a problem. DE 1 245 499 A, EP 2 525 394 B1, DE 1 123 049 A, and DE 197 23 270 A1 each disclose a housing in which a first and a second electrical component are held together. Summary

[0004] There may be a need for a compact package with high reliability and reasonable or low manufacturing costs.

[0005] According to an exemplary embodiment, a package is provided comprising a vertically extending first electronic component with at least one exposed electrically conductive first terminal, a vertically extending second electronic component with at least one exposed electrically conductive second terminal, and a clip having a receiving volume in which the first electronic component and the second electronic component are received and held together, wherein the clip has two spaced-apart legs connected by a head, wherein the clip has a lateral extension portion at its bottom extending laterally outwardly in a horizontal direction from a central access opening of the clip, wherein the at least one first terminal and the at least one second terminal are electrically accessible at an underside of the clip, wherein the underside of the clip (114),a bottom of the first electronic component (102) and a bottom of the second electronic component (108) lie on the same vertical plane, and wherein a central portion of the clip (114) is connected to the first electronic component (102) and the second electronic component (108), wherein the bottom of the clip (114) is laterally spaced from the first electronic component (102) and the second electronic component (108) by a gap.

[0006] According to a further exemplary embodiment, a method for producing a package is provided, the method comprising: inserting a vertically extending first electronic component with at least one exposed electrically conductive first terminal into a receiving volume of a clip, inserting a vertically extending second electronic component with at least one exposed electrically conductive second terminal into the receiving volume of the clip, wherein the insertion of the separate first electronic component and second electronic component takes place in a clip of a common multi-clip body, holding the first electronic component and the second electronic component together in the receiving volume by the clip and configuring the first electronic component, the second electronic component and the clip such thatthat the at least one first terminal and the at least one second terminal are electrically accessible on an underside of the clip, separating the common multi-clip body into individual clips, thereby obtaining a plurality of separate packages (100).

[0007] According to an exemplary embodiment, a package comprises at least two vertically extending electronic components, each having one or more exposed terminals. Advantageously, a clip accommodates both electronic components within its receiving volume and holds them in their vertical orientation. The package can be designed such that terminals of the electronic components are electrically accessible on an underside of the clip. Such a package design has the advantageous effect that, due to the vertical arrangement of the electronic components, the package footprint and thus the spatial dimensions of the package can be very small. Thus, a high integration density can be achieved with the described package concept.At the same time, the clip not only fulfills a mechanical protective function by accommodating and at least partially surrounding the electronic components, but also contributes to the electronic functionality of the package by allowing access to the component terminals on an underside of the clip. For package manufacturing, inserting the vertically aligned electronic components into the receiving volume can be a simple task, which can simplify manufacturability compared to conventional approaches. Consequently, a package according to an exemplary embodiment can be compact, have high reliability, and be easily manufactured. Description of further exemplary embodiments

[0008] Further exemplary embodiments of the package and the method are explained below.

[0009] In the context of the present application, the term "package" may, in particular, refer to an electronic device that may comprise electrically connected electronic components. The components of the package may optionally be encapsulated by an encapsulant. Furthermore, one or more electrically conductive connecting bodies (such as metallic pillars, bumps, bond wires, conductive plates, and / or clips) may optionally be implemented in a package, for example, for electrically coupling and / or mechanically supporting the electronic components. It is also possible for one or more carriers to form part of the package, for example, a metallic carrier that contributes to the electronic functionality.

[0010] In the context of the present application, the term "electronic component" may in particular encompass a semiconductor chip (in particular a power semiconductor chip), an active electronic device (such as a transistor), a passive electronic device (such as a capacitor or an inductor or an ohmic resistor), a sensor (such as a microphone, a light sensor, or a gas sensor), an actuator (e.g., a loudspeaker), and a microelectromechanical system (MEMS). However, in other embodiments, the electronic component may also be of a different type, such as a mechatronic element, in particular a mechanical switch, etc. In particular, the electronic component may comprise a semiconductor chip having at least one integrated circuit element (such as a diode or a transistor in a surface portion thereof).The electronic component may be a bare chip or may already be packaged or encapsulated. Semiconductor chips implemented according to exemplary embodiments may be formed, for example, using silicon technology, gallium nitride technology, silicon carbide technology, etc.

[0011] In the context of the present application, the term "vertically extending electronic component" may in particular refer to an electronic component arranged such that its thickness direction extends horizontally and / or its main surfaces extend vertically. The main surfaces may be two opposite surfaces of the electronic components with largest areas. An active region of a semiconductor chip-type electronic component may extend in a vertical plane when the associated electronic component is inserted into the receiving volume of the clip and when the bottom of the clip is on a horizontal surface. In a scenario where a vertically extending electronic component has a cuboid shape or a substantially cuboid shape, the smallest dimension of the electronic component may extend horizontally.A vertically extending electronic component may have vertically exposed surface areas on its terminals.

[0012] In the context of the present application, the term "clip" may specifically refer to a physical structure defining a receiving volume therein and configured to exert a retaining force (such as a clamping force and / or a connecting force through a connecting medium such as solder) when two (or more) vertically aligned electronic components are inserted as a stack or sandwich into the receiving volume of the clip. In particular, a clip of a preferred embodiment may be a clamp configured to connect, constrict, or compress two or more parts (including at least two vertically extending electronic components) to firmly hold them together. For example, a clamp-type clip may exert a resilient force (e.g., a spring force) on the vertically extending electronic components to firmly hold them together.

[0013] In the context of the present application, the term "terminal" may in particular refer to an electrically conductive interface element (such as a metallic pad) of the electronic component that is accessible for conducting an electrical signal or electrical power toward the electronic component and / or away from the electronic component. In particular, a respective electronic component may be an integrated transistor chip. Such a transistor may be a field-effect transistor chip having a source terminal (or pad), a drain terminal (or pad), and a gate terminal (or pad). Alternatively, a respective integrated transistor chip may be a bipolar transistor chip having an emitter terminal (or pad), a collector terminal (or pad), and a base terminal (or pad). A diode-type electronic component may have a cathode terminal and an anode terminal.

[0014] In the context of the present application, the term "terminal electrically accessible at an underside of the clip" may in particular refer to electrically conductive structures being exposed at the underside of the clip, which can be contacted to establish an electrically conductive connection with the respective terminals of the electronic components. For example, this may be achieved by the clip itself if it is made of an at least partially electrically conductive material and if it exerts a holding force on a terminal of one of the electronic components, such that contacting the underside of the clip allows the terminal to be electrically connected or accessed. It is also possible for one of the terminals itself to be directly accessible at the underside of the clip.In yet another embodiment, a terminal of one of the electronic components on the underside of the clip may be accessible through another electrically conductive element, such as a metallic carrier, which in turn is electrically coupled to the respective terminal.

[0015] In one embodiment, at least one of the first electronic component and the second electronic component is a bare chip, a chip encapsulated by an encapsulant, a plurality of chips encapsulated by an encapsulant, a bare chip mounted on a conductive element (such as a carrier), or a bare chip connected between two conductive elements. In the context of the present application, the term "bare chip" may be an unencapsulated semiconductor chip. In the context of the present application, the term "encapsulant" may in particular refer to a substantially electrically insulating material surrounding a chip to provide mechanical protection, electrical insulation, and optionally contribute to heat dissipation during operation. In particular, the encapsulant may be a molding compound.A molding compound can comprise a matrix of flowable and curable material and filler particles embedded therein. As an alternative to a molding compound (e.g., based on epoxy resin), the encapsulant can also be a potting compound (e.g., based on a silicone gel). In the context of the present application, the term "conductive element" can, in particular, refer to an at least partially electrically conductive carrier or a support structure (such as a metallic plate) that serves as mechanical support for the electronic component(s) to be mounted thereon and that can also contribute to the electrical connection between the electronic component(s) and the periphery of the package. In other words, a carrier can fulfill a mechanical support function and an electrical connection function.A carrier may include or consist of a single part, multiple parts connected by encapsulation or other package components, or a subassembly of carriers. If the carrier forms part of a leadframe, it may be or include a chip pad. For example, such a carrier may be a leadframe structure (e.g., made of copper), a DAB (Direct Aluminum Bonding) substrate, a DCB (Direct Copper Bonding) substrate, etc. Furthermore, the carrier may also be configured as an AMB (Active Metal Brazing) substrate.

[0016] In particular, the package can be configured according to the following three embodiments: In a first embodiment, the clip is a clamp that clamps the first vertically extending component and the second vertically extending electronic component together. In a second embodiment, the clip is attached to the first vertically extending electronic component and / or to the second vertically extending electronic component via a clip connection medium, such as adhesive or solder. In a third embodiment, the holding by clamping according to the first embodiment and the holding by a connection medium according to the second embodiment can be combined.

[0017] In one embodiment, the clip is configured to clamp the first electronic component and the second electronic component together in the receiving volume through a clamping force. For example, a clamping force exerted by the clip on the electronic components may be the only connecting force for connecting the electronic components. This can result in a very simple design. Alternatively, a clamping force exerted by a clamp-type clip may be supplemented by a connecting medium (such as solder or adhesive) that connects the clip to the electronic component(s) and / or connects the electronic components to each other.

[0018] In one embodiment, the clip is electrically conductive. Preferably, an electrically conductive connection between the clip and at least one of the at least one first terminal and the at least one second terminal is established by holding them together, for example, clamping. For example, an electrical signal or electrical power can flow from a terminal of an electronic component to the electrically conductive clip or vice versa. It is also possible for an electrical signal or electrical power to flow from a first terminal of the first electronic component via the electrically conductive clip to the second terminal of the second electronic component or vice versa. Advantageously, the clip can then contribute to the electrical function of the package.For example, the clip may be clamped or integrally connected (e.g., soldered) directly to an electrically conductive terminal of at least one of the electronic components with direct physical contact, so that the clip, in addition to providing a mechanical connection and protection function, can also conduct an electrical signal or electrical power to or from the terminal.

[0019] In one embodiment, an electrically conductive connection (e.g., with direct physical contact or with a connecting medium therebetween) between at least one of the at least one first terminal and at least one of the at least one second terminal is established by holding them together. Thus, an electrical signal or electrical power can flow from a first terminal of the first electronic component directly or only via a connecting medium therebetween to the second terminal of the second electronic component, or vice versa. The clip can then fulfill a dual function, i.e., a mechanical holding function and an electrical connecting function.

[0020] In one embodiment, the package comprises a component connection medium, for example adhesive or solder, which connects the first electronic component to the second electronic component in the receiving volume. By integrally connecting the first electronic component and the second electronic component to each other through a component connection medium, the reliability of the package can be further improved. Alternatively or in addition to clamping, a permanent connection between the two (or more) electronic components can thus be established by gluing, soldering, sintering, etc. For example, one main surface of the electronic components can be connected to the clip, whereas the opposite main surface of the electronic components can be connected to each other through a component connection medium.For example, solder attachment (or attachment using another component connection medium) may be performed between the electronic components in addition to clamping. In another embodiment, solder attachment (or attachment using another component connection medium) may be performed between the electronic components as an alternative to clamping.

[0021] In one embodiment, the component interconnection medium connects at least one of the at least one first terminal and at least one of the at least one second terminal. In such a scenario, it may be advantageous for the component interconnection medium to be electrically conductive. The component interconnection medium can reliably interconnect the electronic components and can also create an electrically conductive connection therebetween, for example, for transmitting electrical power or electrical signals.

[0022] In one embodiment, the package comprises a clip connection medium, such as adhesive or solder, that connects the clip to at least one of the first electronic component and the second electronic component in the receiving volume. Such a configuration can ensure mechanical and / or electrical reliability of the electronic device. For example, a clamp connection between clip and electronic component(s) can be enhanced by an additional permanent connection established by the clip connection medium. Alternatively, a permanent connection established by the clip connection medium can be the only connection between clip and electronic component(s). If the clip connection medium is electrically conductive, it can also promote electrical coupling between a terminal of a respective electronic component and an electrically conductive clip.For example, solder attachment (or attachment using another clip connection medium) may be performed between the clip and the electronic component(s) in addition to clamping. In another embodiment, solder attachment (or attachment using another clip connection medium) may be performed between the clip and the electronic component(s) as an alternative to clamping.

[0023] The clip has a lateral extension portion at its bottom. The lateral extension portion extends laterally or radially outward in a horizontal direction from a central access opening of the clip. The clip may have a retaining portion in which a retaining force can be exerted on the electronic components, wherein the lateral extension portion may extend laterally from such a retaining portion. The lateral extension portion may facilitate mounting of the assembly on a subassembly (such as a printed circuit board) by increasing the usable mating area. For example, the lateral extension portion may comprise two separate opposing lateral extension elements or may have an annular shape.

[0024] In one embodiment, the package comprises a submount electrically and mechanically connected to the first electronic component, the second electronic component, and the clip at its bottom. For example, such a submount may be a printed circuit board (PCB). The package may be surface-mounted on the submount. Since the terminals of the electronic components may all be accessible at the bottom of the clip, connecting the clip to the submount with an electrically conductive connecting medium (such as solder or a sintered material) may establish a mechanical and electrical connection between the electronic components and the submount.

[0025] In one embodiment, the clip has a head (which may be facing away from the bottom) connected to a lateral retaining portion that defines the receiving volume and leads to an end-side external access opening. Advantageously, but not necessarily, the head may be a closed head. The lateral retaining portion, for example, two lateral retaining legs, may extend downward from the head and may exert the actual retaining (e.g., clamping) force on the electronic components. The head may protect the electronic components within the receiving volume.

[0026] The clip has two spaced legs connected by a head. Such a clip can exert a holding (particularly clamping) force for connecting the electronic components. A clip of this type can have two separate legs that exert the clamping force. Alternatively, the clip can be a cap with a head connected to a circumferentially closed holding sleeve, for example, a centrally delimited sleeve. A cap-like clip can be annularly closed to provide protection around the entire circumference and holding (particularly clamping) performance. Advantageously, but not necessarily, the head can be a closed head.

[0027] In one embodiment, a vertical extension of the first electronic component and / or the second electronic component along an insertion direction into the receiving volume is greater than another extension of the first electronic component and / or the second electronic component perpendicular to this insertion direction or along a clamping force direction. In particular, the greatest spatial extension of the first electronic component and / or the second electronic component can be in the vertical direction, i.e., along an insertion direction of the respective electronic component into the receiving volume. The described configurations can lead to a very compact design.

[0028] In one embodiment, each of the at least one first terminal and the at least one second terminal has an outer planar surface arranged vertically or perpendicular to a clamping force direction. Such terminals may be electrically and mechanically connected to inner surface regions of the clip and / or may be mechanically connected to a facing terminal of the respective other electronic component.

[0029] In one embodiment, the package includes a thermal interface body with a recess that accommodates at least a portion of the clip. The thermal interface body may comprise a thermal interface material (TIM). Such a thermal interface material may, for example, be a thermal paste that provides thermal coupling with a low-thermal-resistance heat sink therebetween. The thermal interface body may contribute to the dissipation of heat generated by the electronic components during operation of the package.

[0030] In one embodiment, the housing includes a heat sink attached to an exterior surface of the thermal interface body. A suitable heat sink may be a heat dissipation body, which may be made of a highly thermally conductive material such as copper or aluminum. For example, such a heat sink may include a base body facing the thermal interface body and may include a plurality of cooling fins extending from the base body and parallel to each other to dissipate heat toward the environment.

[0031] In one embodiment, the thermal interface body tapers from the heat sink toward the clip. Such an embodiment is shown, for example, in Fig. 7. The described configuration allows for the use of an enlarged heat sink combined with a compact package. Furthermore, this design can result in efficient heat dissipation. Thus, size reduction can be combined with excellent thermal performance.

[0032] In one embodiment, at least one of the at least one first terminal and the at least one second terminal is electrically accessible on the underside of the clip by being electrically coupled to the clip, which comprises an electrically conductive material. In other words, the electrical accessibility of the respective terminal can be achieved indirectly by an at least partially electrically conductive clip that allows access on its underside and that can be electrically connected to the terminal to be accessed.

[0033] In one embodiment, at least one of the at least one first terminal and the at least one second terminal is electrically accessible directly at an exposed bottom side of the first electronic component and / or at an exposed bottom side of the second electronic component. The clip may have an open bottom side, at which at least some of the terminals of the electronic components inserted into the receiving volume of the clip may be directly accessible. Thus, it may be sufficient to mount only one bottom side of the package, including a bottom side of the clip, on a submount to obtain direct access to one, some, or all of the terminals of both electronic components.

[0034] A central portion of the clip is connected to the first electronic component and the second electronic component (e.g., directly contacting them), with the bottom of the clip being laterally spaced from the first electronic component and the second electronic component by a gap. In other words, a gap may be formed between the bottom of the clip and the bottom of the electronic components held (e.g., clamped) by the clip, so that central portions of the clip and the electronic components can be held (preferably clamped) together. Furthermore, a further gap may optionally be formed between the top of the clip and the top of the electronic components. This can increase a mounting surface on the bottom and a cooling surface on the top, while concentrating the clamping force in a central portion.In addition, such a design can lead to large creepage distances at the bottom of the clip.

[0035] In one embodiment, at least one of the first electronic component and the second electronic component comprises a transistor chip, i.e., a chip with an integrated transistor. This may, in particular, refer to a chip, such as a semiconductor chip, in which at least one transistor may be integrated, in particular monolithically integrated. In particular, a respective chip with an integrated transistor may be a field-effect transistor chip having a source terminal (or pad), a drain terminal (or pad), and a gate terminal (or pad). Alternatively, a respective chip with an integrated transistor may be a bipolar transistor chip having an emitter terminal (or pad), a collector terminal (or pad), and a base terminal (or pad). Specific examples of the transistor chips are a metal-oxide-semiconductor field-effect transistor (MOSFET) and an insulated-gate bipolar transistor (IGBT).

[0036] In one embodiment, the package comprises at least one further first electronic component, at least one further second electronic component and at least one further clip having the above-mentioned features, wherein a common mounting base is connected to the clip, the first electronic component, the second electronic component, the at least one further clip, the at least one further first electronic component and the at least one further second electronic component. Such an embodiment is described in Fig. 8. A plurality of clips with inserted electronic components can be surface-mounted on the same mounting base. This can enable even sophisticated electronic functionality to be implemented in a compact manner and can enable efficient warpage management.

[0037] In one embodiment, the package comprises at least one further first electronic component, at least one further second electronic component and at least one further clip having the above-mentioned features, wherein a common thermal interface body has recesses that accommodate at least a part of the clip and at least a part of the at least one further clip. For such an embodiment, reference is again made to Fig. 8. The various clips with inserted electronic components can not only share a common mounting base, but can also share a common interface body and heat sink. This can contribute to package compactness and excellent thermal performance.

[0038] In one embodiment, a bottom surface of the first electronic component and a bottom surface of the second electronic component are exposed at an access opening to the receiving volume at the bottom of the clip. This can provide convenient electrical access to the terminals at a bottom surface of the electronic components.

[0039] The bottom of the clip, a bottom of the first electronic component, and a bottom of the second electronic component are on the same vertical plane. Thus, the bottoms of the clip and the electronic components can be flush with each other. This can simplify electrical and mechanical connection to a submount, for example, by providing a common soldering or sintering plane.

[0040] In one embodiment, the at least one exposed electrically conductive first terminal has at least two (e.g., three) first terminals, and / or the at least one exposed electrically conductive second terminal has at least two (e.g., three) second terminals. Electronic components with two terminals can be diode chips. Electronic components with three terminals can be transistor chips. However, any other number of terminals of the electronic components is also possible.

[0041] In one embodiment, the method comprises: producing the first electronic component and the second electronic component as parts of a common encapsulated multi-component body, separating the first electronic component and the second electronic component from the multi-component body. It is also possible to provide separate multi-component bodies for forming first electronic components and for forming second electronic components. In particular, with reference to Fig. 9, batch production of packages can enable high throughput on an industrial scale. Electronic components for packages can be manufactured on the basis of a common encapsulated multi-component body, which can be provided at low cost and then separated, for example, by mechanical or laser cutting. The clips of different packages can also initially form part of a common multi-clip body, which can be manufactured with little effort. By inserting the separated electronic components into individual clip sections of the common multi-clip body and then separating the common multi-clip body into individual clips, a large number of packages can be manufactured quickly and efficiently.

[0042] In one embodiment, the package is configured as a power package. A power package may be a package that includes at least one power chip as electronic component(s). Thus, the package may be configured as a power module, for example, a molded power module such as a semiconductor power package. For example, an exemplary embodiment of the package may be an intelligent power module (IPM). Another exemplary embodiment of the package is a dual inline package (DIP).

[0043] Accordingly, the electronic components can be configured as a power semiconductor chip. Thus, the electronic component (such as a semiconductor chip) can be used for power applications, for example, in the automotive sector, and can, for example, comprise at least one integrated insulated-gate bipolar transistor (IGBT) and / or at least one transistor of another type (such as a MOSFET, a JFET, a HEMT, etc.) and / or at least one integrated diode. Such integrated circuit elements can, for example, be fabricated using silicon technology or be based on wide-bandgap semiconductors (such as silicon carbide, gallium nitride). A semiconductor power chip can include one or more field-effect transistors, diodes, inverter circuits, half-bridges, full-bridges, drivers, logic circuits, other devices, etc.Advantages of exemplary embodiments with respect to isolation are particularly pronounced for power chips.

[0044] A semiconductor substrate, in particular a silicon substrate, can be used as the substrate or wafer that forms the basis of the electronic component(s). Alternatively, a silicon oxide or other insulating substrate can be provided. It is also possible to implement a germanium substrate or a III-V semiconductor material. For example, exemplary embodiments can be implemented using GaN or SiC technology.

[0045] The above and other objects, features and advantages will become apparent from the following description and the appended claims, taken in conjunction with the accompanying drawings, in which like parts or elements are designated by like reference numerals. Short description of the drawings

[0046] The accompanying drawings, which are included to provide a further understanding of example embodiments and constitute a part of the specification, illustrate example embodiments.

[0047] The drawings show: Fig. 1 a cross-sectional view of a housing according to an exemplary embodiment. Fig. 2 a side view of the housing according to Fig. 1. Fig. 3 a bottom view of the housing according to Fig. 1. Fig. 4 a side view of a housing according to an exemplary embodiment. Fig. 5 a three-dimensional view of the housing according to Fig. 4. Fig. 6 Cross-sectional views of structures obtained during the manufacture of a housing according to an exemplary embodiment. Fig. 7 a cross-sectional view of a housing according to an exemplary embodiment. Fig. 8 a cross-sectional view of a housing according to another exemplary embodiment. Fig. 9 various views of structures obtained during the manufacture of housings according to an exemplary embodiment. Fig. 10 is a cross-sectional view of a housing according to another exemplary embodiment. Fig. 11 is a cross-sectional view of a housing according to yet another exemplary embodiment. Fig. 12 a cross-sectional view of a housing according to another exemplary embodiment. Fig. 13 a side view of the housing according to Fig. 12. Fig. 14 a bottom view of the housing according to Fig. 12. Fig. 15 is a flowchart of a method for manufacturing a housing according to an exemplary embodiment. Detailed description

[0048] The representation in the drawing is schematic and not to scale.

[0049] Before describing exemplary embodiments in more detail with reference to the figures, some general considerations on the basis of which exemplary embodiments were developed are summarized.

[0050] There is a continuing trend toward miniaturization in semiconductor chip packaging. However, conventional packaging designs are increasingly reaching technological limits.

[0051] According to an exemplary embodiment, a vertical package is provided with two or more vertically extending electronic components. The vertical components may have exposed terminals. A clip receives the electronic components within its interior and holds (e.g., clamps and / or integrally connects them through a connecting medium such as solder) the electronic components together to mechanically connect them and preferably to simultaneously establish an electrical coupling therebetween. Advantageously, the terminals of the at least two held electronic components are electrically accessible at the bottom of the clip, for example, indirectly through the clip and / or directly through an accessible end of the electronic components at the bottom of the receiving volume or indirectly through one or more other conductive elements.Advantageously, the vertical alignment of the electronic components in their assembled state in the clip can result in a compact package with high electrical and mechanical reliability. A corresponding manufacturing process is very simple and requires only the insertion of the vertical electronic components into the receiving volume, where they can be automatically clamped and / or integrally connected using a connecting material or medium. As a result, a package can be obtained that is compact in size, can exhibit excellent reliability, and can be easily manufactured.

[0052] Regarding the dimensioning of SMD (Surface Mounted Device) packages, a vertical package can offer a compact footprint design with double-sided cooling options. Large chip package contact areas can also be achieved with vertical packages. This can lead to low package resistance (for example, a reduction in the Rdson value of approximately 60% for a dual-chip configuration). Furthermore, a vertical package offers the possibility of counter-directional current flow within the package, which can lead to low radiated emissions. Furthermore, improved temperature cycling on-board (TCoB) characteristics can be achieved with packages according to exemplary embodiments. Furthermore, the package design according to exemplary embodiments can offer a high creepage distance.Furthermore, a potential separation of the two (or more) electronic components during processes such as reflow can be reliably prevented according to exemplary embodiments.

[0053] Advantageously, an exemplary embodiment can create a flat package-to-package stack. A clip, e.g., embodied as a U-shaped clip (e.g., in frame form), can be provided to clamp from a top and / or central side to stabilize the structure and make electrical contacts accessible at a bottom. In addition to or alternatively to clamping, a clip can also form an integral connection structure with the electronic components. Advantageously, such a manufacturing concept can generally be applicable to very different package types, in particular to all double-sided cooling packages. A package according to an exemplary embodiment can be configured as a vertical package with low Rdson packaging DC-DC characteristics, excellent power regulation, and high power efficiency.

[0054] In various embodiments, a vertical package configured with a single or dual-chip design may be provided.

[0055] Thus, exemplary embodiments provide a way to enable compact package design in a vertical package configuration. At the same time, exemplary embodiments can solve challenges of vertical packages regarding TCoB, creepage distance, the risk of package separation during processes such as reflow, and heat dissipation. Fig. 1 illustrates a cross-sectional view of a housing 100 according to an exemplary embodiment. Fig. Figure 2 shows a side view of the housing 100 according to Fig. 1. Fig. Figure 3 shows a bottom view of the housing 100 according to Fig. 1 and Fig. 2. The illustrated package 100 is a vertical power semiconductor package.

[0056] A vertically extending first electronic component 102 includes a semiconductor chip (e.g., a bare chip, not shown) encapsulated by an encapsulant 164, such as a molding compound. Although not shown, a chip carrier (such as a leadframe structure supporting the semiconductor chip) may be disposed within the encapsulant 164 of the first electronic component 102. The semiconductor chip, in the illustrated embodiment, provides a transistor function, for example, a field-effect transistor functionality. The vertically extending first electronic component 102 includes three exposed electrically conductive first terminals 104-106. A first terminal 104 is a source terminal.

[0057] A second terminal 105 is a drain terminal. A third terminal 106 is a gate terminal. The first electronic component 102 extends vertically in the illustrated assembled state, so that its first terminals 104-106 are exposed on vertical sidewalls of the first electronic component 102.

[0058] Furthermore, a vertically extending second electronic component 108 includes a semiconductor chip (e.g., a bare chip, not shown) encapsulated by an encapsulant 164, such as a molding compound. Although not shown, a chip carrier (such as a leadframe structure supporting the semiconductor chip) may be disposed within the second electronic component 108. The semiconductor chip, in the embodiment shown, provides a transistor function, for example, a field-effect transistor functionality. The vertically extending second electronic component 108 includes three exposed electrically conductive second terminals 110-112. A first terminal 110 is a source terminal. A second terminal 111 is a drain terminal. A third terminal 112 is a gate terminal.The second electronic component 108 extends vertically so that its second terminals 110-112 are exposed on vertical sidewalls of the second electronic component 108.

[0059] In the embodiment shown, the two transistor chips of the electronic components 102, 108 form two switches to improve the switching current. However, other embodiments may include other electronic functionality, such as diode functionality, half-bridge functionality, etc. The electronic components 102, 108 may be of the same chip type or may be different chip types. Furthermore, the connection arrangement according to Fig. 1, for example, source, drain and gate terminals can be configured in a different way than in Fig. 1 to Fig. 3. A larger or smaller number of connections is also possible.

[0060] A clip 114 (which may, for example, be substantially U-shaped) defines a receiving volume 116 within it. In the embodiment shown, the clip 114 is made of an electrically conductive material, such as a metal, so that the clip 114 may also contribute to the electrical functionality of the package 100, as described below. As shown, the first electronic component 102 and the second electronic component 108 are both received in a horizontally stacked vertical configuration within the receiving volume 116 and are held together by a clamping force exerted by the clip 114 on the stacked electronic components 102, 108. More specifically, the clip 114 creates a substantially horizontal clamping force that clamps the electronic components 102, 108 together and clamps the clip 114 to the electronic components 102, 108.As a result of the clamping force, the clip 114 and the electronic components 102, 108 form a firmly connected body that can be handled as a whole. When inserted in their vertical orientation into the receiving volume 116 of the clip 114, the electronic components 102, 108 are clamped to the clip 114 and to each other by a clamping force generated by the clip 114.

[0061] Further with reference to Fig. 1, a vertically central portion of the clip 114 directly contacts the first electronic component 102 and the second electronic component 108, including their terminals 105, 111. In contrast, the bottom of the clip 114 is laterally spaced from the first electronic component 102 and the second electronic component 108 by a gap at an access opening 128. A bottom of the first electronic component 102 and a bottom of the second electronic component 108 are exposed at the access opening 128 to the receiving volume 116 at the bottom of the clip 114.

[0062] Given the vertical arrangement or orientation of the electronic components 102, 108, a vertical extension of the first electronic component 102 and the second electronic component 108 along an insertion direction 142 into the receiving volume 116 is greater than a horizontal extension of the first electronic component 102 and the second electronic component 108 along a clamping force direction 144 along which the clip 114 exerts a clamping force. Accordingly, each of the first terminals 104-106 and the second terminals 110-112 has an outer planar surface that is arranged perpendicular to the clamping force direction 144, i.e., vertically.

[0063] The electronic components 102, 108 are inserted from a bottom side of the clip 114 into the receiving volume 116 of the clip 114, so that the first terminals 104-106 and the second terminals 110-112 on a bottom side of the clip 114 are electrically accessible from an outside of the package 100. As best shown in Fig. 1 and Fig. 3, the terminals 104, 106, 110, and 112 are directly electrically accessible at an exposed portion of the electronic components 102, 108 on the underside of the clip 114. Furthermore, the terminals 105, 111, which are in direct physical contact with wall portions of the clip 114, are electrically accessible at the underside of the clip 114 via a lateral extension portion 120 of the clip 114. The lateral extension portions 120 can result in a large soldering area. The gull-wing design of the clip 114 ensures advantageous TCoB properties and enables proper creepage distance management. Advantageously, the electrical accessibility of all terminals 104-106, 110-112 on the underside of the clip 114 allows the package 100 to be easily assembled on a submount 122 (such as a printed circuit board), see Fig. 6, by merely soldering the package 100 onto the mounting base 122. This may be sufficient to establish an electrical connection of all terminals 104-106, 110-112 of the package 100 to the mounting base 122. Since the bottom of the clip 114, a bottom of the first electronic component 102, and a bottom of the second electronic component 108 are on the same vertical plane (see Fig. 1), the assembly of the package 100 on the submount 122 can be further promoted. Since the clip 114 is electrically conductive, an electrically conductive connection between the clip 114 and the terminals 105, 111 can be established by clamping. Furthermore, the clamping force holds the electronic components 102, 108 together to promote an electrical connection between the terminals 105, 111, between the terminals 104 and 110, and optionally between the terminals 112 and 106. The terminals 105, 111 are indirectly electrically accessible at the bottom of the clip 114 by being electrically coupled to the clip 114, which is made of an electrically conductive material. Furthermore, the terminals 104, 106, 110, 112 are directly electrically accessible at an exposed bottom of the first electronic component 102 or the second electronic component 108, respectively.In short, the clamping functionality of the clip 114 can promote a mechanical connection between the electronic components 102, 108 and the clip 114 and can also establish an electrical connection between the electronic components 102, 108 and the clip 114.

[0064] How best in Fig. 1 and Fig. As shown in Figure 3, the package 100 further includes an optional component connection medium 118, such as solder, that connects the first electronic component 102 to the second electronic component 108 in the receiving volume 116. In particular, the connection medium 118 can connect the terminals 104, 110 and can connect the terminals 105, 111 through a solder connection. Alternatively to solder, the connection medium 118 can also be an electrically conductive adhesive or a sintered material.

[0065] In the illustrated embodiment, the clip 114 has a horizontally extending closed head 124 connected to a vertically extending lateral clamping portion 126 that defines the receiving volume 116 and leads to an end-side external access opening 128. In particular, the clip 114 is Fig. 1 to Fig. 3, a clip with two legs 130, 132 connected by the closed head 124. This configuration protects the electronic components 102, 108 received by the clip 114, provides the clamping functionality, and also contributes to the electrical functionality. Furthermore, the clip 114 has a lateral extension portion 120 at its bottom that extends horizontally from the lateral clamping portion 126. This can increase the connection area usable for mounting the package 100 on a mounting base 122 (see Fig. 6).

[0066] Fig. 4 illustrates a side view of a housing 100 according to an exemplary embodiment. Fig. Figure 5 illustrates a three-dimensional view of the housing 100 according to Fig. 4.

[0067] In the embodiment according to Fig. 4 and Fig. 5, vertical sidewall portions of the package 100 are formed by the lateral clamping portions 126 of the clip 114, by exposed major surfaces of the encapsulant 164 of the electronic components 102, 108, and by connecting rods 170, by which individual packages 100 are separated by dicing. As best shown in Fig. 5, the terminals 104-106, 111 are directly exposed on a bottom side of the connected electronic components 102, 108 (in Fig. 4 and Fig. 5 not specified individually).

[0068] With the clip-like clamping arrangement of Fig. 4 and Fig. 5, the upper surface of the package 100 becomes flat at the head 124. This is very advantageous in terms of easy component insertion, especially when assembling larger electronic devices.

[0069] Also regarding the creepage distance, the Package 100 offers Fig. 4 and Fig. 5 the advantage of improving the creep properties from "limited by package thickness" to "limited by package surface area". Due to a gap at the access opening 128, the creepage distance L can be increased compared to conventional approaches. Due to the design of Fig. 4 and Fig. 5, a positive impact on board-level assembly can be achieved, for example, when mounting the illustrated package 100 on a submount 122.

[0070] Fig. 6 shows cross-sectional views of structures obtained during the manufacture of a housing 100 according to an exemplary embodiment.

[0071] On the left side of Fig. 6 is a housing according to Fig. 1. This package 100 is mounted on a mounting base 122 on the right side of Fig. 6. The mounting base 122 may be, for example, a lead frame or a printed circuit board. For this mounting, electrically conductive structures 174 (such as pads) on the surface of the mounting base 122 may be connected to the lateral extension section 120 and to the exposed terminals 104, 106, 110, 112 (in Fig. 6 only partially visible) with the submount connection medium 117 in between. This can be achieved by the submount connection medium 117, which is designed as solder, sintered material, or conductive adhesive. The electrical accessibility of all connections 104-106, 110-112 of the clamp-connected electronic components 102, 108 on the underside of the clip 114 can enable simple and planar mounting of the package 100 on the submount 122. Thus, the submount 122 can be electrically and mechanically connected to the first electronic component 102, the second electronic component 108, and the clip 114 at its bottom during an assembly process.

[0072] Furthermore, a lower portion of the legs 130, 132 advantageously tapers toward the head 124, so that the access opening 128 forms a gap between the electronic components 102, 108 on the one hand and the lateral extension portion 120 on the other. This creates a large creepage distance.

[0073] Optionally, a source / gate pad on the illustrated sandwich structure can be sealed with adhesive. The interconnect structure (such as solder) can close gaps and can also increase the solder area to achieve better TCoB or low-resistance contact.

[0074] Fig. 7 illustrates a cross-sectional view of a housing 100 according to an exemplary embodiment.

[0075] As in Fig. 7, the housing 100 may include a thermal interface (TIM) body 148 having a recess that receives the upper portion of the clip 114. Further, a heat sink 152 (shown schematically in Fig. 7) may be attached to an outer surface of the thermal interface body 148. Advantageously, the thermal interface body 148 may taper from the heat sink 152 toward the clip 114. The thermal interface body 148 may be made of a material with a suitable thermal conductivity, for example, may comprise a thermal paste or grease or the like. Thus, the thermal interface body 148 may reduce the thermal barrier between the clip 114 and the heat sink 152, which may be made of a highly thermally conductive material such as aluminum or copper. The illustrated arrangement provides a very high contact area and consequently a very low thermal contact resistance between the clip 114 and the heat sink 152.Thus, heat generated by the electronic components 102, 108 during operation of the package 100 can be dissipated highly efficiently via the thermal interface body 148 to the heat sink 152, from where it can be dissipated toward the surrounding environment. The tapered configuration of the thermal interface body 148 can distribute heat toward a larger area of ​​the heat sink 152, which can make heat dissipation highly efficient.

[0076] Thus, the package 100 can have thermal contact with the TIM and the heat sink 152. In this context, the U-shaped clip structure of the clip 114 can provide a large contact area. This can result in a package 100 with excellent thermal performance. Fig. 8 is a cross-sectional view of a housing 100 according to yet another exemplary embodiment. The embodiment of Fig. 8 differs from the embodiment of Fig. 7 in particular by the fact that, according to Fig. 8, a plurality of clips 114 with electronic components 102, 108 clamped therein are connected to one in the same thermal interface body 148 and one of the same heat sink 152. This can make heat dissipation even more efficient.

[0077] In particular, the package 100 includes Fig. 8 additionally two further first electronic components 102', 102'', two further second electronic components 108', 108'' and two further clips 114', 114'' with the features as described with reference to Fig. 1 to Fig. 3 for the first electronic component 102, the second electronic component 108, and the clip 114. A common mounting base 122, such as a PCB, is connected to the clip 114, the first electronic component 102, the second electronic component 108, the two further clips 114', 114'', the two further first electronic components 102', 102'', and the two further second electronic components 108', 108''. In addition, a common thermal interface body 148 has three recesses that accommodate upper portions of the clip 114 and the two further clips 114', 114''. This configuration simplifies the assembly of elements that provide even sophisticated electrical functionality with efficient heat dissipation and heat distribution in a small footprint. Furthermore, the illustrated arrangement of Fig. 8 provides improved curvature management.

[0078] Thus, with a small footprint of the package 100 (where electronic components can be placed closely on a PCB) and a large contact area to a TIM, the impact of thermal resistance variations or bottlenecks related to an application can be reduced or even minimized.

[0079] Fig. Figure 9 shows various views of structures obtained during the fabrication of packages 100 according to an exemplary embodiment. The batch manufacturing process shown is highly efficient and enables the high-throughput production of packages 100 on an industrial scale.

[0080] Referring to reference numeral 180, the first electronic components 102 and the second electronic components 108 are manufactured as parts of a common encapsulated multi-component body 156. Alternatively, the first electronic components 102 are manufactured as parts of a common encapsulated multi-component body 156, and the second electronic components 108 are manufactured as parts of another common encapsulated multi-component body 156. The terminals 104-106, 110-112 of the electronic components 102, 108 may be exposed beyond the encapsulant 164, which may be a molding compound. According to reference numeral 180, the terminals 104-106, 110-112 or pads may be tinned.

[0081] Referring to reference numeral 182, the multi-component body 156 is shown after forming the interconnect medium 118 on the exposed terminals 104-106, 110-112. For example, the interconnect medium 118 may be formed by printing a conductive paste. This process may be optional, for example, if the respective pad or terminal can form a connection that is not melt-sensitive.

[0082] Referring to reference numeral 184, the resulting structure may be subjected to a singulation process (and optionally an adhesive curing process). By taking this step, the first electronic components 102 and the second electronic components 108 are separated from one or more multi-component bodies 156.

[0083] Reference numeral 186 shows a mirror-image separated housing structure that can be subjected to a pick and place process.

[0084] Optionally, a respective first electronic component 102 and a respective second electronic component 108 may be stacked, optionally with the connecting medium 118 therebetween (see reference numeral 188).

[0085] Stacked pairs of a separate first electronic component 102 and a separate second electronic component 108 are inserted in a vertical orientation into a clip 114 of a common multi-clip body 158, see reference numeral 190. Thus, a sandwich of electronic components 102, 108 can be inserted into a U-clip frame. The common multi-clip body 158 has a plurality of integrally formed clips 114 (see reference numeral 194; an incoming U-clip frame may be plated, e.g., tinned, or otherwise preprocessed).In particular, a vertically extending first electronic component 102 having at least one exposed electrically conductive first terminal 104-106 is inserted into a receiving volume 116 of a clip 114 together with a vertically extending second electronic component 108 having at least one exposed electrically conductive second terminal 110-112. The first electronic component 102 and the second electronic component 108 are clamped together in the receiving volume 116 by a clamping force generated by the clip 114. Advantageously, the first electronic component 102, the second electronic component 108, and the clip 114 are configured such that the at least one first terminal 104-106 and the at least one second terminal 110-112 are electrically accessible on an underside of the clip 114.

[0086] In addition or alternatively to clamping the electronic components 102, 108 together by a clamping-type clip 114, it is also possible to hold the electronic components 102, 108 together by a clip 114 that is connected to the electronic components 102, 108 by a connecting medium (see, for example, reference numerals 118, 119 in Fig. 12).

[0087] Now, with reference to reference numeral 192, the common multi-clip body 156 with the inserted electronic components 102, 108 is separated into individual clips 114 (for example, by stamping), each having a pair of inserted clamp-connected electronic components 102, 108, whereby a plurality of separate packages 100 is obtained.

[0088] One or more additional processes can be performed at the end of production, such as plating, laser marking, clip-to-TSC melt annealing, punch separation.

[0089] Fig. 10 illustrates a cross-sectional view of a housing 100 according to another exemplary embodiment.

[0090] In Fig. 10, the electronic components 102, 108 each comprise a bare chip connected to a pair of parallel conductive elements 160, 162 via the interconnect medium 118. For example, such conductive elements 160, 162 may comprise a chip carrier (such as a leadframe structure or a metal plate or any other connector), a metallic clip, etc. It is also possible to provide only one conductive element 160, 162 per electronic component 102, 108. In the embodiment shown, the conductive elements 160, 162 are exposed beyond the respective encapsulant 164 and are accessible at an underside of the clip 114 to provide electrical access to the associated terminals 104, 105, 110, 111. Thus, the conductive elements 160, 162 connect the respective semiconductor chips of the electronic components 102, 108 to the underside of the housing 100.Thus, the terminals 104, 105, 110, 111 on the underside of the clip 114 are electrically accessible by being electrically coupled to the electrically conductive elements 160, 162 that extend vertically in the receiving volume 116 to the underside of the clip 114.

[0091] In the embodiment of Fig. 10, it may be possible, for example, for the clip 114 to be a cap with a closed head 124 connected to a circumferentially closed clamping sleeve 138. In short, the embodiment of Fig. 10 to a four-sided or circumferentially closed lid or cap instead of a two-sided or two-leg clip (as in Fig. 1). Fig. 10 thus shows that instead of using a U-clip, a lid can be used as clip 114. According to Fig. 10, the sleeve 138 is designed as a centrally limited sleeve, which can further improve the clamping performance of the clip 114.

[0092] According to Fig. 10, the clip 114 provides only a mechanical clamping force (exerted in the clamping force direction 144) and does not conduct electricity. Thus, the clip 114 can be Fig. 10 may also be made of an electrically insulating material, such as a plastic. However, the clip 114 also has Fig. 10 has electronic functionality because it compresses the metallic conductive elements 162, 162 of the electronic components 102, 108, thereby creating an electrically conductive coupling therebetween.

[0093] Fig. 11 illustrates a cross-sectional view of a housing 100 according to yet another exemplary embodiment.

[0094] The embodiment of Fig. 11 differs from the embodiment of Fig. 10 in particular by the fact that according to Fig. 11, the encapsulant 164 is omitted in both electronic components 102, 108, so that the clip 114 acts directly on the conductive elements 160 of the electronic components 102, 108 when it exerts a clamping force. If the clip 114 is made of a metallic material, it can also electrically couple the terminals 104 and 111 via the conductive elements 160 and the clip 114 itself. Alternatively, the clip 114 can also be Fig. 11 be made of an electrically insulating material. The housing 100 according to Fig. 11 is an unmolded housing.

[0095] Fig. 12 illustrates a cross-sectional view of a housing 100 according to another exemplary embodiment. Fig. 13 illustrates a side view of the housing 100 according to Fig. 12. Fig. 14 illustrates a bottom view of the housing 100 according to Fig. 12.

[0096] In contrast to the embodiment of Fig. 1 to Fig. 3 includes the embodiment of Fig. 12 to Fig. 14, a clip connection medium 119 (for example, adhesive or solder) that integrally connects the clip 114 to the first electronic component 102 and to the second electronic component 108 in the receiving volume 116. Thus, the connection strength and consequently the reliability of the package 100 can be increased according to Fig. 12 to Fig. 14 can be further improved by combining a clamping connection formed by the clip 114 with a permanent material connection formed by the clip connection medium 119. As shown, a spatially limited central portion of the clip 114 can contact the first electronic component 102 and the second electronic component 108 via the clip connection medium 119 (and / or with direct physical contact).

[0097] With reference to Fig. 12, each of the legs 130, 132 is limited in a central section where the clip 114 clamps onto the electronic components 102, 108. Furthermore, each of the legs 130, 132 tapers from the bottom of the clip 114 and from the head 124 of the clip 114 toward the central section. On the top side, this results in an enlarged upper surface, allowing for improved heat dissipation. On the bottom side, this results in a higher creepage distance.

[0098] Thus, the embodiment of Fig. 12 to Fig. 14 a different U-clip contact profile than the embodiment of Fig. 1 to Fig. 3. A point-contact clamping profile is provided to enable an additional soldering point of the package's top pad to the clip. This embodiment also allows for an increased upper cooling surface. In particular, a primary cooling surface there can result in a reduced TIM thickness for a heat sink.

[0099] It should be understood that a U-clip connector base shape is not limited to gullwing characteristics, but can also be designed in other ways. The size of the U-clip is also not limited and can, for example, be larger or smaller than the plastic package, or it can have the same dimensions.

[0100] Furthermore, the embodiment of Fig. 12 to Fig. 14 can also be adapted with a clip 114 that does not exert a clamping force on the vertical electronic components 102, 108 to hold them together. In such an embodiment, it may be possible for the clip connection medium 119 alone to provide a holding or connecting force that holds the clip 114, on the one hand, and the electronic components 102, 108, on the other hand, together (i.e., without clamping). A corresponding integral connection that holds the components of the package 100 together according to such an embodiment can be further enhanced by the component connection medium 118 holding the electronic components 102, 108 together.In such an embodiment, the clip 114 functions as a protective structure that defines and provides a receiving volume 116 in which the electronic components 102, 108 can be received and connected to each other and to the clip 114 by the connecting medium 118, 119 (such as a solder, a sintering paste, an adhesive, etc.).

[0101] Fig. 15 shows a flowchart 200 of a method for manufacturing a housing 100 according to an exemplary embodiment. The reference numerals used for the following description of the manufacturing method refer to the embodiment of Fig. 1.

[0102] Referring to a block 202, the method includes inserting a vertically extending first electronic component 102 having at least one exposed electrically conductive first terminal 104-106 into a receiving volume 116 of a clip 114.

[0103] Referring to a block 204, the method includes inserting a vertically extending second electronic component 108 having at least one exposed electrically conductive second terminal 110-112 into the receiving volume 116 of the clip 114.

[0104] Referring to a block 206, the method includes holding together (e.g., clamping) the first electronic component 102 and the second electronic component 108 in the receiving volume 116 by the clip 114 (and optionally additionally by a connecting medium 118 and / or 119).

[0105] Referring to a block 208, the method includes configuring the first electronic component 102, the second electronic component 108, and the clip 114 such that the at least one first terminal 104-106 and the at least one second terminal 110-112 are electrically accessible on a bottom surface of the clip 114.

[0106] As a result, a package 100 can be obtained which has a vertically extending first electronic component 102 with at least one exposed electrically conductive first terminal 104-106, a vertically extending second electronic component 108 with at least one exposed electrically conductive second terminal 110-112 and a clip 114 with a receiving volume 116 in which the first electronic component 102 and the second electronic component 108 are received and held together (for example, clamped), wherein the at least one first terminal 104-106 and the at least one second terminal 110-112 are electrically accessible on an underside of the clip 114.

[0107] It is understood that each of the above-mentioned embodiments that hold electronic components 102, 108 together solely by a clamping clip 114 can also be modified with a non-clamping clip 114 in combination with a clip connection medium 119 and / or a component connection medium 118, or with a clamping clip 114 in combination with a clip connection medium 119 and / or a component connection medium 118. Accordingly, each of the above-mentioned embodiments that hold electronic components 102, 108 together solely by a clamping clip 114 in combination with a clip connection medium 119 and / or a component connection medium 118 can also be modified with a clamping clip 114 with or without a clip connection medium 119 and / or a component connection medium 118.

[0108] It should be noted that the term "comprising" does not exclude other elements or features, and "a" or "an" does not exclude a plurality. Even elements described in connection with different embodiments may be combined. It should also be noted that reference numerals are not to be construed as limiting the scope of the claims. Furthermore, the scope of the present application is not intended to be limited to the particular embodiments of the process, machine, manufacture, composition of matter, means, methods, and steps described in the specification. Accordingly, the appended claims are intended to include such processes, machines, manufacture, compositions of matter, means, methods, or steps within their scope.

Claims

[1] Housing (100), comprising: • a vertically extending first electronic component (102) having at least one exposed electrically conductive first terminal (104-106); • a vertically extending second electronic component (108) having at least one exposed electrically conductive second terminal (110-112); and • a clip (114) having a receiving volume (116) in which the first electronic component (102) and the second electronic component (108) are received and held together; • wherein the clip (114) has two spaced legs (130, 132) connected by a head (124), • wherein the clip (114) has at its bottom a lateral extension portion (120) extending laterally outwardly in a horizontal direction from a central access opening of the clip; • wherein the at least one first terminal (104-106) and the at least one second terminal (110-112) are electrically accessible on an underside of the clip (114); • wherein the bottom of the clip (114), a bottom of the first electronic component (102), and a bottom of the second electronic component (108) lie on the same vertical plane; wherein a central portion of the clip (114) is connected to the first electronic component (102) and the second electronic component (108), wherein the bottom of the clip (114) is laterally spaced from the first electronic component (102) and the second electronic component (108) by a gap. [2] Housing (100) according to claim 1, comprising a component connection medium (118), for example adhesive or solder, which connects the first electronic component (102) to the second electronic component (108) in the receiving volume (116). [3] The housing (100) of claim 2, wherein the component connection medium (118) interconnects at least one of the at least one first terminal (104-106) and at least one of the at least one second terminal (110-112). [4] Housing (100) according to one of claims 1 to 3, comprising a clip connection medium (119), for example adhesive or solder, which connects the clip (114) to at least one of the first electronic component (102) and the second electronic component (108) in the receiving volume (116). [5] Housing (100) according to one of claims 1 to 4, wherein the clip (114) is configured to clamp the first electronic component (102) and the second electronic component (108) together in the receiving volume (116) by a clamping force. [6] The package (100) according to any one of claims 1 to 5, wherein at least one of the first electronic component (102) and the second electronic component (108) is a bare chip, a chip encapsulated by an encapsulant (164), a plurality of chips encapsulated by an encapsulant (164), a bare chip mounted on a conductive element (160, 162), or a bare chip connected between two conductive elements (160, 162). [7] Housing (100) according to one of claims 1 to 6, wherein the clip (114) is electrically conductive. [8] Housing (100) according to claim 7, wherein an electrically conductive connection between the clip (114) and at least one of the at least one first terminal (104-106) and the at least one second terminal (110-112) is established by holding them together. [9] Housing (100) according to one of claims 1 to 8, wherein an electrically conductive connection between at least one of the at least one first terminal (104-106) and at least one of the at least one second terminal (110-112) is established by holding them together. [10] Housing (100) according to one of claims 1 to 9, comprising a mounting base (122) electrically and mechanically connected to the first electronic component (102), the second electronic component (108) and the clip (114) at its bottom. [11] Housing (100) according to one of claims 1 to 10, wherein a vertical extension of the first electronic component (102) and / or the second electronic component (108) along an insertion direction (142) into the receiving volume (116) is greater than another extension of the first electronic component (102) and / or the second electronic component (108) perpendicular to the insertion direction (142). [12] Housing (100) according to one of claims 1 to 11, comprising a thermal interface body (148) having a recess that receives at least a portion of the clip (114). [13] The housing (100) of claim 12, comprising a heat sink (152) attached to an exterior of the thermal interface body (148). [14] The housing (100) of claim 13, wherein the thermal interface body (148) tapers from the heat sink (152) toward the clip (114). [15] Housing (100) according to one of claims 1 to 14, comprising at least one of the following features: wherein each of the at least one first terminal (104-106) and the at least one second terminal (110-112) has a vertically disposed outer planar surface; wherein at least one of the at least one first terminal (104-106) and the at least one second terminal (110-112) is electrically accessible on the underside of the clip (114) by being electrically coupled to the clip (114) comprising an electrically conductive material; wherein at least one of the at least one first terminal (104-106) and the at least one second terminal (110-112) is electrically accessible directly at an exposed underside of the first electronic component (102) and / or at an exposed underside of the second electronic component (108); wherein at least one of the at least one first terminal (104-106) and the at least one second terminal (110-112) is electrically accessible on the underside of the clip (114) by being electrically coupled to an electrically conductive element (160, 162) extending vertically in the receiving volume (116) to the underside of the clip (114); wherein a spatially limited central portion of the clip (114) contacts the first electronic component (102) and the second electronic component (108) directly or via a clip connection medium (119); wherein at least one of the first electronic component (102) and the second electronic component (108) comprises a transistor chip; wherein at least one of the first electronic component (102) and the second electronic component (108) comprises a semiconductor power chip; comprising at least one further first electronic component (102', 102"), at least one further second electronic component (108', 108") and at least one further clip (114', 114") according to one of claims 1 to 17, wherein a common mounting base (122) is connected to the clip (114), the first electronic component (102), the second electronic component (108), the at least one further clip (114', 114"), the at least one further first electronic component (102', 102") and the at least one further second electronic component (108', 108"); comprising at least one further first electronic component (102', 102"), at least one further second electronic component (108', 108") and at least one further clip (114', 114") according to one of claims 1 to 17, wherein a common thermal interface body (148) has recesses that receive at least a portion of the clip (114) and at least a portion of the at least one further clip (114', 114"); wherein a bottom side of the first electronic component (102) and a bottom side of the second electronic component (108) are exposed at an access opening (128) to the receiving volume (116) on the bottom side of the clip (114); wherein the at least one exposed electrically conductive first terminal (104-106) has at least two, for example three, first terminals (104-106) and / or the at least one exposed electrically conductive second terminal (110-112) has at least two, for example three, second terminals (110-112). [16] A method of manufacturing a housing (100), the method comprising: • Inserting a vertically extending first electronic component (102) having at least one exposed electrically conductive first terminal (104-106) into a receiving volume (116) of a clip (114); • Inserting a vertically extending second electronic component (108) having at least one exposed electrically conductive second terminal (110-112) into the receiving volume (116) of the clip (114); • wherein the separate first electronic component (102) and second electronic component (108) are inserted into a clip (114) of a common multi-clip body (158); • Holding the first electronic component (102) and the second electronic component (108) together in the receiving volume (116) by the clip (114); and • Configuring the first electronic component (102), the second electronic component (108) and the clip (114) such that the at least one first terminal (104-106) and the at least one second terminal (110-112) are electrically accessible on a bottom side of the clip (114); • Separating the common multi-clip body (156) into individual clips (114), thereby obtaining a plurality of separate packages (100). [17] The method of claim 16, wherein the method comprises: manufacturing the first electronic component (102) and the second electronic component (108) as parts of a common encapsulated multi-component body (156); Separating the first electronic component (102) and the second electronic component (108) from the multi-component body (156).

Images