MEMS transducer with a carrier layer and at least two piezo layers

Abstract

The invention relates to a MEMS transducer (1), in particular a MEMS sound transducer unit, preferably for generating and / or detecting sound waves in the audible wavelength spectrum and / or in the ultrasound range, comprising a carrier (2) and at least one piezoelectric element (4) arranged on the carrier (2) and deflectable in the direction of a stroke axis (3), said element having at least two piezoelectric layers (5, 25, 35, 36) and at least one carrier layer (6), wherein electrical signals and deflections of the piezoelectric element (4) can be converted into one another by means of the at least one piezoelectric layer (5, 25, 35, 36). According to the invention, the carrier layer (6) is arranged between two piezoelectric layers (5, 25, 35, 36) in the direction of the stroke axis (3). The invention also relates to a use of the carrier layer (6) for MEMS transducers (1) and to a method for producing the MEMS transducer (1).

Description

[0001] The present invention relates to a MEMS transducer, in particular a MEMS sound transducer unit, preferably for generating and / or detecting sound waves in the audible wavelength spectrum and / or in the ultrasound range, with a carrier and with at least one piezo element arranged on the carrier and deflectable in the direction of a stroke axis, which has at least two piezo layers and at least one carrier layer, wherein electrical signals and deflections of the piezo element can be converted into one another by means of the at least one piezo layer.

[0002] The object of the invention is to create powerful MEMS converters.

[0003] The problem is solved by a MEMS converter, a use of a carrier layer for MEMS converters, and a method for manufacturing the MEMS converter having the features of the independent patent claims. Advantageous or preferred embodiments are each the subject of a corresponding dependent claim.

[0004] A MEMS transducer, preferably a MEMS sound transducer, is proposed, in particular for generating and / or detecting sound waves in the audible wavelength spectrum and / or in the ultrasonic range. The MEMS transducer can be operated as a loudspeaker and / or as a microphone and thus as a MEMS sound transducer.

[0005] The MEMS transducer comprises a carrier.

[0006] Furthermore, the MEMS transducer comprises at least one piezo element arranged on the carrier and deflectable in the direction of a stroke axis.

[0007] In addition, the at least one piezo element has at least two piezo layers and at least one carrier layer, wherein electrical signals and deflections of the piezo element can be converted into one another by means of the piezo layers.

[0008] In addition, at least one carrier layer is arranged between two piezo layers in the direction of the stroke axis. Thus, in the direction of the stroke axis, at least one piezo layer is arranged above and at least one piezo layer is arranged below the carrier layer. This allows the piezo element to be designed symmetrically, so that the deflection properties are improved. This makes it easy to arrange a neutral plane or neutral layer centrally in the carrier layer in the direction of the stroke axis. The piezo element is a cantilever arm and when the piezo element is deflected, compressive and tensile stresses develop within it. The ranges of the compressive and tensile stress depend on whether the piezo element deflects upwards or downwards. The compressive stresses develop on the side in the direction in which the piezo element deflects. The tensile stresses develop on the opposite side.This is a general principle of strength of materials. In one plane within the piezo element, namely the neutral plane or neutral layer, the tensile and compressive stresses cancel each other out, so that no stress exists there. However, the deflection properties of the piezo element depend on the location of this neutral plane or neutral layer within the piezo element. Due to the presence of at least one piezo layer above and below the carrier layer, this neutral plane is centrally located.

[0009] Furthermore, this design of the piezo element allows non-linearities in the deflection of the piezo layers to automatically cancel each other out, as these occur symmetrically and the non-linearities are canceled out by one piezo layer above and the other piezo layer below.

[0010] It is advantageous if the piezoelectric layers are made of scandium aluminum nitride. Such piezoelectric layers are very robust, which is due in particular to the scandium content, which can preferably be between 30% and 70%. It can be particularly advantageous if the scandium content is 30%, 40%, or 50%.

[0011] It is advantageous if a piezo layer is arranged below and above the carrier layer in the direction of the stroke axis.

[0012] It is beneficial if the same number of piezo layers are arranged above and below the carrier layer in the direction of the stroke axis. This maintains the symmetry of the piezo element.

[0013] It is also advantageous to arrange two piezo layers below and above the carrier layer in the direction of the stroke axis. This increases performance without requiring too many piezo layers.

[0014] It is advantageous if the at least one carrier layer comprises at least one metal layer, in particular a metal layer. The metal layer can further be an aluminum layer. Additionally or alternatively, the at least one carrier layer can comprise at least one oxide layer. The oxide layer can be a silicon oxide layer. Using these materials, the carrier layer can be formed using known manufacturing methods, for example using methods used in semiconductor technology. The carrier layer can therefore be produced in large quantities and / or very cost-effectively. Furthermore, the aluminum and silicon oxide layers have a comparable Young's modulus of in the range of 70 GPa. As a result, both layers have similar or almost identical deflection properties.

[0015] The at least one oxide layer and / or at least one metal layer further have the advantage of being thermally resistant to high temperatures, for example, up to 1200°C - 1400°C. Consequently, the piezoelectric layers and / or electrode layers can be applied using semiconductor technology methods, for example, a CMOS-compatible method. For example, the piezoelectric layers and / or electrode layers can be applied using a CVD (chemical vapor deposition) method.

[0016] Furthermore, it is advantageous if the carrier layer comprises a plurality of metal layers and a plurality of oxide layers. The metal and oxide layers can also be arranged alternately one above the other. This creates a sandwich-like structure of the carrier layer. Such a carrier layer is thus a stack of several layers, preferably of at least one metal layer and at least one, in particular at least two, oxide layers. The carrier layer can also be a structural layer.

[0017] It is advantageous if the top and bottom layers in the direction of the stroke axis are an oxide layer. When the carrier layer is built up layer by layer using at least one metal layer and at least two oxide layers, the top and bottom layers in the direction of the stroke axis are an oxide layer. This has the advantage that the oxide layer, in particular the silicon oxide layer, has the highest temperature resistance. The piezo layer and / or the electrode layer are applied to this oxide layer, which forms both the top and bottom layers, especially at higher temperatures. The oxide layer does not change at the higher temperatures.

[0018] The oxide layer, especially the silicon oxide layer, can also be easily processed. For example, this layer can be chemically polished. This process is known as chemical mechanical polishing, also known as chemical mechanical planarization (CMP). The oxide layer, especially the silicon oxide layer, can thus be made very flat and / or even.

[0019] According to an advantageous development of the invention, it is useful if the at least one carrier layer is made of a polymer. The polymer can be a polyamide. With the help of the at least one carrier layer made of polymer, higher deflections of the piezo element can be achieved. Additionally or alternatively, the length of the piezo element can also be shortened, whereby the deflections can be kept at least constant.

[0020] It is advantageous if the piezo element has a length in its longitudinal direction, especially from the carrier to a free end of the piezo element, between 0.5 mm and 2 mm.

[0021] It is advantageous if the at least one piezo element comprises several, in particular between two and six, preferably four, piezo layers.

[0022] An advantage results when the at least one piezoelectric element comprises at least one electrode layer. The at least one electrode layer allows the exchange of electrical signals that lead to the deflection of the piezoelectric element and / or that are generated when the piezoelectric element is deflected.

[0023] It is advantageous if the at least one piezo element comprises at least one insulation layer.

[0024] It is advantageous if the at least one piezo element is formed in a sandwich-like manner from the several piezo layers and the electrode layers.

[0025] An advantage results when the MEMS sound transducer comprises a coupling element with which the at least one piezo element can be coupled to a membrane.

[0026] An improvement results when the piezo element and the coupling element are coupled to one another by means of at least one spring element, wherein the at least one spring element is preferably arranged between the carrier layer and the coupling element in the longitudinal direction of the piezo element.

[0027] It is advantageous if the spring element is formed, preferably exclusively, by the carrier layer. This allows the spring element to be formed in a simple manner.

[0028] It is advantageous if the spring element is made of the polymer or a polymer, in particular polyamide. Additionally or alternatively, the spring element exhibits the mechanical properties of the polymer.

[0029] It is beneficial if the piezo element and the coupling element have the same layered structure.

[0030] An improvement results when the carrier layer is between 5µm and 100µm thick. Preferably, the carrier layer has a thickness of less than 100µm.

[0031] Furthermore, it is advantageous if the carrier layer has an E-modulus between 40 and 300 GPa.

[0032] Due to the above-mentioned mechanical properties of the at least one carrier layer, the deflections can be increased and / or the piezo element can be shortened while maintaining at least the same magnitude of the deflection or increasing the deflection.

[0033] Furthermore, a use of the carrier layer for the MEMS converter is proposed. The MEMS converter has at least one feature of the preceding and / or subsequent description. Additionally or alternatively, the carrier layer has at least one feature of the preceding and / or subsequent description. In particular, the carrier layer can comprise at least one metal layer, in particular an aluminum layer, and / or at least one oxide layer, in particular a silicon oxide layer, and optionally at least one further feature associated therewith.

[0034] Also proposed is a method for producing a MEMS transducer, preferably a MEMS sound transducer, in particular for generating and / or detecting sound waves in the audible wavelength spectrum and / or in the ultrasonic range. The method for producing the MEMS transducer can be carried out in such a way that the MEMS transducer is formed with at least one feature of the preceding and / or subsequent description.

[0035] In the method, at least one piezo element is formed on a carrier, which comprises at least two piezo layers and at least one carrier layer coupled thereto.

[0036] Furthermore, the method involves placing the carrier layer between at least two piezoelectric layers. This allows for a symmetrical structure of the piezoelectric element, particularly in the direction of the stroke axis. As a result, advantageous deflection properties can be achieved.

[0037] It is also beneficial if an oxide layer, in particular a silicon oxide layer, is processed by chemical-mechanical polishing. This makes the oxide layer flat and / or even. The at least one piezoelectric layer and / or electrode layer is then applied to this flat and / or even oxide layer.

[0038] It is advantageous if the piezo layers are formed on the carrier layer using semiconductor manufacturing processes.

[0039] It is also advantageous if the piezo layers are deposited on the carrier layer. The piezo layer, at least the first piezo layer, can also be deposited on the oxide layer. All subsequent piezo layers are then deposited on top of each other.

[0040] It is also advantageous if the piezo layers are formed on the carrier layer and / or the carrier layer is formed by chemical vapor deposition. This allows well-understood processes to be used for forming the piezo layers and / or the electrode layers. Furthermore, such processes can be carried out particularly easily.

[0041] The metal layer, the oxide layer, the electrode layer and / or the piezo layer can be formed using CMOS-compatible methods and / or arranged, in particular, on already existing layers.

[0042] Furthermore, it is beneficial if, after forming the piezo layers and / or the carrier layer, at least one area is removed, particularly by etching. Using the process steps described here, the piezo layers and / or the carrier layer can be built up one upon the other.

[0043] It is useful if the piezo layers are made of scandium aluminum nitride.

[0044] Furthermore, it is advantageous if the at least one piezo element is formed with several, in particular between two and six, in particular four, piezo layers. The performance of the piezo element can be increased by using several piezo layers.

[0045] Furthermore, it is advantageous if the same number of piezo layers is arranged above and below the carrier layer in the direction of the stroke axis.

[0046] For example, it is advantageous if two piezo layers are arranged above and below the carrier layer in the direction of the stroke axis, so that the piezo element comprises a total of four piezo layers.

[0047] It is beneficial if the at least one piezo element is formed in a sandwich-like manner from several piezo layers and at least one electrode layer.

[0048] The multiple piezo layers and multiple electrode layers can be arranged alternately one above the other.

[0049] Furthermore, it is advantageous if at least one insulation layer is arranged when forming the at least one piezo element.

[0050] It is useful if the polymer carrier layer is arranged on a side of the piezo layer facing away from the carrier.

[0051] An improvement results when the carrier layer made of the polymer is arranged on the at least one piezo layer after the piezo layer and / or a coupling element have been formed and / or after the carrier, the piezo layer and / or the coupling element have been post-processed, in particular separated from one another, in particular by means of etching.

[0052] It is beneficial if the piezo element and the coupling element are formed together in layers, preferably on the carrier.

[0053] It is advantageous if, after the layered construction of the piezo element and the coupling element, they are separated from each other, at least in sections, in particular by etching.

[0054] Furthermore, a method may be performed to provide the MEMS converter according to one or more of the preceding and / or following descriptions.

[0055] Further advantages of the invention are described in the following exemplary embodiments. They show: Fig. 1 a schematic sectional view of a MEMS transducer with a piezo element consisting of two piezo layers and at least one carrier layer, Fig. 2 a schematic sectional view of the piezo element with two piezo layers and at least one carrier layer, Fig. 3 a schematic sectional view of the piezo element with two piezo layers in the direction of the stroke axis above and below the carrier layer, Fig. 4 a schematic sectional view of the carrier layer consisting of metal layers and oxide layers, Fig. 5 a top view of a MEMS transducer with multiple piezo elements.

[0056] Fig. 1 shows a schematic sectional view of a MEMS transducer 1. The MEMS transducer 1 can also be a MEMS sound transducer. Using the MEMS sound transducer, for example, sound waves in the audible wavelength spectrum can be generated, so that it can be operated as a MEMS loudspeaker. Using the MEMS sound transducer, sound waves in the audible wavelength spectrum can additionally or alternatively be detected, so that it can be operated as a MEMS microphone. The MEMS sound transducer can also be arranged in a smartphone, for example, to enable telephone calls or listening to music. The MEMS sound transducer can also be arranged in headphones, for example. However, pressures can also be generated and / or detected using the MEMS transducer 1.

[0057] Another application area for the MEMS transducer can be the generation and / or detection of sound waves in the ultrasonic range. The MEMS transducer can be installed, for example, in an ultrasonic sensor, such as a distance sensor.

[0058] The MEMS transducer 1 further comprises a carrier 2, which can form a basic structure of the MEMS transducer 1. The carrier 2 can, for example, comprise a semiconductor substrate that can be produced using an etching process. The carrier 2 can, for example, be made of silicon and / or have the shape of a wafer. In the present view, two carriers 2 are shown. However, the carrier 2 can be designed as a frame, so that in this sectional view shown here, the two elements of the carrier 2 shown here are connected. For example, the carrier 2 can be rectangular in plan view. The plan view can, for example, be oriented in the direction of a stroke axis 3 explained below. The plan view can, for example, be parallel to the stroke axis 3. For example, the at least one piezo element 4 can at least partially face an interior of the carrier 2 if the carrier 2 is designed, for example, as a frame.

[0059] Furthermore, at least one piezo element 4 is arranged on the carrier 2. The at least one piezo element 4 can also be coupled to the carrier 2. The at least one piezo element 4 can be deflected along the stroke axis 3 shown. The at least one piezo element 4 can convert electrical signals into deflections, so that the MEMS transducer 1 is operated as a loudspeaker or the sound waves can be generated. Additionally or alternatively, deflections can also be converted into electrical signals with the help of the at least one piezo element 4, so that the MEMS transducer 1 is operated as a microphone or the sound waves can be detected. However, pressures can also be generated by means of the deflections. Additionally or alternatively, pressures can also be detected, since these cause a deflection of the at least one piezo element 4.

[0060] The at least one piezo element 4 comprises a free end 8 which can deflect along the stroke axis 3.

[0061] The piezoelectric element 4 further comprises at least two piezoelectric layers 5, 25. The at least two piezoelectric layers 5, 25 are formed from a piezoelectric material. The at least two piezoelectric layers 5, 25 can convert electrical signals into deflections and / or deflections into electrical signals. The at least two piezoelectric layers 5, 25 can be formed from scandium aluminum nitride (ScAlN).

[0062] In addition, the piezo element 4 comprises at least one carrier layer 6. This is coupled to the at least two piezo layers 5, 25. At least one piezo layer 5, 25 is arranged here between the carrier 2 and the at least one carrier layer 6. With the help of the at least one carrier layer 6, the at least one piezo layer 5, 25 can be stabilized. Furthermore, the at least one carrier layer 6 can prevent the at least one piezo layer 5, 25 from breaking during deflection. The at least one carrier layer 6 can also serve as a carrier layer for the at least one piezo layer 5, 25.

[0063] The carrier layer 6 can be formed from a polymer, for example. The carrier layer 6 is thus a polymer carrier layer. The polymer can be a polyamide. A polymer is softer, especially compared to silicon, so that the piezo element 4 can be made smaller, while still allowing high deflections of the piezo element 4. The performance of the piezo element 4 depends, among other things, on the strength of the deflection or even the elongation. The soft polymer, especially compared to silicon, enables consistent deflections with smaller dimensions, especially with a shorter length, of the piezo element 4.

[0064] Alternatively, the carrier layer 6 may also have at least one metal layer 41 - 43 and / or at least one oxide layer 37 - 40, as described in more detail in Fig. 4 is shown.

[0065] According to the present embodiment, the MEMS transducer 1 comprises a coupling element 9, with which the at least one piezo element 4 can be coupled to a membrane 11 (shown here) of the MEMS transducer 1. With the aid of the coupling element 9, the deflections of the piezo element 4 can be transmitted to the membrane 11 when the sound waves are generated by means of the membrane 11 if the MEMS transducer 1 is a MEMS sound transducer. Additionally or alternatively, the deflections of the membranes 11 can also be transmitted to the piezo element 4 when the sound waves are detected by means of the membrane 11 if the MEMS transducer 1 is a MEMS sound transducer.

[0066] According to the present embodiment, the piezo element 4 is coupled to the coupling element 9 by means of a spring element 10. The spring element 10 can be made of a polymer, for example. This provides the spring element 10 with flexibility.

[0067] It is advantageous if, as shown here, a coupling plate 12 is arranged between the coupling element 9 and the membrane 11. By means of the coupling plate 12, a planar transmission of the deflections between the coupling element 9 and the membrane 12 can be achieved. According to the present embodiment, a membrane frame 13 is also shown, with which the membrane 11 can be arranged on the carrier 2.

[0068] Furthermore, the at least one piezo element 4 has a length 33. The length 33 is defined here from the carrier 2 to the free end 8 of the at least one piezo element 4. The length 33 can be between 0.5 mm and 2 mm. Due to the carrier layer 6, the piezo element 4 can have this length 33, whereby large deflections along the stroke axis 3 are possible. The deflection of the at least one piezo element 4, in particular at the free end 8, can be at least 3%, preferably at least 10%.

[0069] A thickness 34 of the at least one piezo element 4 can be between 2 µm and 50 µm. The thickness 34 is oriented parallel to the stroke axis 3 and / or perpendicular to the layers of the at least one piezo element 4 (cf. Fig. 4).

[0070] Furthermore, the at least one piezo element 4 can have at least one recess (not shown in this figure). The at least one recess can extend at least partially between the top side 15 and the bottom side 16. The at least one recess can extend from the top side 15 and / or from the bottom side 16 in the direction of the correspondingly opposite top or bottom side 15, 16. With the help of these recesses, stresses in the piezo element 4 or in the at least one piezo layer 5 and / or in the at least one carrier layer 6 can be reduced. The top side 15 can also be referred to as the first side and the bottom side 16 as the second side.

[0071] Here, the top side 15 faces the membrane 11. The bottom side 16 faces away from the membrane 11. The terms "top side 15" and "bottom side 16" also define the terms "above" and "below". The terms "top side 15" and "bottom side 16" as well as "above" and "below" refer to the direction of the stroke axis 3.

[0072] Furthermore, a neutral plane 14 is shown here. The neutral plane 14 is a term from strength of materials and is also referred to as the neutral fiber or zero line. The neutral fiber or neutral plane 14 or the zero line is the plane or line in the piezo element 4 where the tensile and compressive stresses cancel each other out, so that no stress occurs there. Above and below, however, either tensile or compressive stresses act. The tensile or compressive stress naturally only occurs when the piezo element 4 is deflected. If, for example, the piezo element 4 is deflected upwards, i.e. in the direction away from the carrier 2, compressive stress acts in an upper area of ​​the piezo element 4 and tensile stress acts in a lower area of ​​the piezo element 4. If, on the other hand, the piezo element 4 is deflected downwards, i.e. towards the carrier 2, the compressive stress and the tensile stress are swapped. In the neutral plane 14 orNeither tensile stress nor compressive stress acts in the neutral layer, with this plane 14 or this layer being arranged between a top side 15 and a bottom side 16 of the piezo element 4. With the help of the first piezo layer 5 and the second piezo layer 25 in the direction of the stroke axis 3 above and below the carrier layer 6, the position of the neutral fiber or neutral plane 14 (or layer) or the zero line is adjusted in height or in the direction of the stroke axis 3. Since the two piezo layers 5, 25 are also identical to one another, i.e. are made of the same material, for example AlScN, and / or have the same thickness 34, the neutral plane 14 is arranged centrally in the piezo element 4 and / or in the carrier layer 6.

[0073] Features that have already been described in at least one previous figure cannot be explained again for the sake of simplicity. Furthermore, features can also be described in this or in at least one of the subsequent figures. Furthermore, for the sake of simplicity, the same reference symbols are used for the same features. Furthermore, for the sake of clarity, not all features can be shown and / or provided with a reference symbol in the following figures. However, features shown in one or more of the previous figures can also be present in this or in one or more of the subsequent figures. Furthermore, for the sake of clarity, features can also be shown and / or provided with a reference symbol in this or in one or more of the subsequent figures.Nevertheless, features which are only shown in one or more of the subsequent figures may already be present in this or a previous figure.

[0074] Fig. 2 shows a more detailed schematic sectional view of the piezo element 4. For the sake of clarity, the more detailed structure of the piezo element 4 is shown in this Fig. 2 explained.

[0075] Here, the at least two piezo layers 5, 25 are shown, with one piezo layer 5, namely the first piezo layer 5, being arranged above or on the top side 15 of the carrier layer 6, and one piezo layer 25, namely the second piezo layer 25, being arranged below or on the bottom side 16 of the carrier layer 6. This allows a symmetrical structure of the piezo element 4 to be achieved, so that the neutral plane 14 is arranged centrally in the piezo element 4 or in the carrier layer 6. This improves the deflection properties of the piezo element 4. For example, nonlinearities of the at least two piezo layers 5, 25 can thereby compensate for each other.

[0076] Furthermore, several electrode layers 22, 23, 26, 27 are shown here. In this exemplary embodiment, the first and second electrode layers 22, 23 are assigned to the first piezoelectric layer 5, and the third and fourth electrode layers 26, 27 are assigned to the second piezoelectric layer 25. With the aid of the electrode layers 22, 23, 26, 27, the piezoelectric layers 5, 25 can be supplied with an electrical signal, causing them to deflect, or the electrical signal can be dissipated when they themselves are deflected.

[0077] Fig. Figure 3 shows an embodiment of the piezo element 4, which comprises a carrier layer 6 and four piezo layers 5, 25, 35, 36. In this embodiment, two piezo layers 5, 25, namely the first and second piezo layers 5, 25, are arranged above and two piezo layers 35, 36, namely a third and fourth piezo layer 35, 36, are arranged below the carrier layer 6. As a result, the performance of the piezo element 4 can be increased compared to the piezo element 4 with two piezo layers 5, 25 of the Fig. 2. In this embodiment, however, the same number of piezo layers 5, 25, 35, 36 are arranged above and below the carrier layer 6, so that the piezo element 4 is again constructed symmetrically. In particular, the neutral plane 14 is arranged centrally.

[0078] Because of the two piezo layers 5, 25, 35, 36 above and below the carrier layer 6, three electrode layers 22, 23, 26-29 are arranged above and below the carrier layer 6. A piezo layer 5, 25, 35, 36 is arranged between each two electrode layers 22, 23, 26-29. In the direction of the stroke axis 3, an electrode layer 22, 23, 26-29 is thus arranged on both sides of each piezo layer 5, 25, 35, 36. This allows each piezo layer 5, 25, 35, 36 to be supplied with the electrical signal, or the electrical signal can be dissipated.

[0079] Fig. Figure 4 shows an embodiment of the carrier layer 6 in a sectional view. As can be seen here, the carrier layer 6 is formed from further layers 37-43. The carrier layer 6 can comprise at least one oxide layer 37-40 and / or one metal layer 41-43. Here, the lifting axis 3 and the neutral plane 14 are shown. In particular, the lifting axis 3 again makes it clear what "above" and "below" mean.

[0080] The at least one metal layer 41-43 can preferably be formed from aluminum. Additionally or alternatively, the at least one oxide layer 37-40 can be formed from silicon oxide. Using these materials, the carrier layer 6 can be formed using known manufacturing methods, for example, using methods used in semiconductor technology.

[0081] The at least one oxide layer 37-40 and / or at least one metal layer 41-43 further have the advantage of being thermally resistant to high temperatures, for example, up to 1200°C-1400°C. Consequently, the piezoelectric layers 5, 25, 35, 36 and / or the electrode layers 22, 23, 26-29 can be applied using semiconductor technology methods. For example, the piezoelectric layers 5, 25, 35, 36 and / or the electrode layers 22, 23, 26-29 can be applied using a CVD (chemical vapor deposition) process.

[0082] In this exemplary embodiment, the carrier layer 6 comprises four oxide layers 37-40 and three metal layers 41-43, which, as can be seen here, are advantageously arranged alternately one above the other in the direction of the lifting axis 3. In addition, an oxide layer 37, 40 is arranged above and below in the direction of the lifting axis 3. In comparison with the previous figures, at least one piezo layer 5, 25, 35, 36 is arranged in the direction of the lifting axis 3 above the first oxide layer 37 shown here, and at least one piezo layer 5, 25, 35, 36 is arranged in the direction of the lifting axis 3 below the fourth oxide layer 40 shown here. In this case, an electrode layer 22, 23, 26-29 can also be directly adjacent to the first and fourth oxide layers 37, 40 shown here. Only this electrode layer 22, 23, 26 - 29 can then be adjoined by the piezo layer 5, 25, 35, 36.However, this is only the case if an electrode for the piezoelectric layer 5, 25, 35, 36 is also formed as an electrode layer 22, 23, 26-29. The electrode for the piezoelectric layer 5, 25, 35, 36 can also be arranged on an end face of the piezoelectric layer 5, 25, 35, 36. In this case, the piezoelectric layer 5, 25, 35, 36 could directly border the first or fourth oxide layer 37, 40.

[0083] Furthermore, an electrode layer 22, 23, 26 - 29 can also extend in sections between the piezo layer 5, 25, 35, 36 and the adjacent oxide layer 37 - 40.

[0084] As shown here, the oxide layers 37-40 protrude laterally beyond the metal layers 41-43. Additionally or alternatively, some, in particular all, of the oxide layers 37-40 and the metal layers 41-43 may be flush and / or congruent.

[0085] As in the Fig. 4, the carrier layer 6 shown here comprises four oxide layers 37-40 and three metal layers 41-43. Alternatively, the carrier layer 6 may also comprise only two oxide layers 37-40 and one metal layer 41-43. Furthermore, alternatively, the carrier layer 6 may also comprise several oxide layers 37-40, for example eleven, and several metal layers 41-43, for example ten.

[0086] It is advantageous if the carrier layer 6 has an oxide layer 37-40 at the top and bottom in the direction of the stroke axis 6. Furthermore, the top and bottom layers of the layered structure of the carrier layer 6 can be an oxide layer 37-40. In addition, a metal layer 41-43 is arranged between each two oxide layers 37-40. Thus, the number of oxide layers 37-40 is one greater than the number of metal layers 41-43.

[0087] The oxide layers 37-40 have the advantage that they can be easily further processed. For example, the oxide layers 37-40 can be processed by chemical-mechanical polishing. This creates a flat and / or level surface on the oxide layer 37-40, on which the at least one piezoelectric layer 5, 25, 35, 36 and / or the electrode layer 22, 23, 26-29 is then arranged. Therefore, it is advantageous if the top and bottom layers of the carrier layer are an oxide layer 37-40.

[0088] Here, four oxide layers 37-40 and three metal layers 41-43 are used to achieve a thickness 34 of the piezo element 4 of approximately 7µm, which is advantageous for the deflection and performance of the piezo element 4. The number of oxide layers 37-40 and metal layers 41-43, and thus the thickness 34 of the piezo element 4, also depends on the length 33 of the piezo element 4.

[0089] Fig.Figure 5 shows a top view of an embodiment of the MEMS transducer 1. The carrier 2 is hexagonal in this embodiment. Furthermore, six piezo elements 4a-4f are shown here. Furthermore, each of the six piezo elements 4a-4f has an associated spring element 10a-10f. The six piezo elements 4a-4f and / or the six spring elements 10a-10f are coupled to the coupling element 9, which couples the piezo elements 4a-4f to the membrane 11 (not shown here). The multiple piezo elements 4a-4f can increase the performance of the MEMS transducer 1. List of reference symbols 1 MEMS converter 2 carriers 3 lifting axis 4 Piezo element 5 first piezo layer 6 Carrier layer 8 free end 9 Coupling element 10 spring element 11 Membran 12 first coupling plate 13 membrane frames 14 neutral level 15 Top 16 Bottom 22 first electrode layer 23 second electrode layer 25 second piezo layer 26 third electrode layer 27 fourth electrode layer 28 fifth electrode layer 29 sixth electrode layer 33 length 34 thickness 35 third piezo layer 36 fourth piezo layer 37 first oxide layer 38 second oxide layer 39 third oxide layer 40 fourth oxide layer 41 first metal layer 42 second metal layer 43 third metal layer

Claims

[1] MEMS transducer (1), in particular MEMS sound transducer unit, preferably for generating and / or detecting sound waves in the audible wavelength spectrum and / or in the ultrasonic range, with a carrier (2) and with at least one piezo element (4) arranged on the carrier (2) and deflectable in the direction of a stroke axis (3), which has at least two piezo layers (5, 25, 35, 36) and at least one carrier layer (6), wherein electrical signals and deflections of the piezo element (4) can be converted into one another by means of the at least one piezo layer (5, 25, 35, 36), characterized by , that the carrier layer (6) is arranged in the direction of the stroke axis (3) between two piezo layers (5, 25, 35, 36). [2] MEMS converter according to the previous claim, characterized bythat the piezo layers (5, 25, 35, 36) are formed from scandium aluminum nitride, wherein a scandium content is between 30% and 70%, preferably 30%, 40% or 50%. [3] MEMS converter according to one or more of the preceding claims, characterized by that a piezo layer (5, 25, 35, 36) is arranged below and above the carrier layer (6) in the direction of the stroke axis (3). [4] MEMS converter according to one or more of the preceding claims, characterized by that the same number of piezo layers (5, 25, 35, 36) are arranged below and above the carrier layer (6) in the direction of the stroke axis (3). [5] MEMS converter according to one or more of the preceding claims, characterized by that two piezo layers (5, 25, 35, 36) are arranged below and above the carrier layer (6) in the direction of the stroke axis (3). [6] MEMS converter according to the previous claim, characterized bythat the at least one carrier layer (6) comprises at least one metal layer (41 - 43), in particular an aluminum layer, and / or at least one oxide layer (37 - 40), in particular a silicon oxide layer. [7] MEMS converter according to the previous claim, characterized by that the carrier layer (6) comprises several metal layers (41 - 43) and several oxide layers (37 - 40), which are preferably arranged alternately one above the other. [8] MEMS converter according to the previous claim, characterized by that in the direction of the stroke axis (3) the uppermost and the lowermost layer is an oxide layer (37 - 40). [9] MEMS converter according to the previous claim, characterized by that the at least one carrier layer (6) is made of a polymer, in particular a polyamide. [10] MEMS converter according to one or more of the preceding claims, characterized bythat the piezo element (4) has a length (33) in its longitudinal direction, in particular from the carrier (2) to a free end (8) of the piezo element (4), between 0.5 mm and 2 mm. [11] MEMS converter according to one or more of the preceding claims, characterized by that the at least one piezo element (4) comprises several, in particular between two and six, preferably four, piezo layers (5, 25, 35, 36) and / or that the at least one piezo element (4) comprises at least one electrode layer (22, 23, 26 - 29) and / or that the at least one piezo element (4) comprises at least one insulation layer. [12] MEMS converter according to one or more of the preceding claims, characterized by that the MEMS transducer (1) comprises a coupling element (9) with which the at least one piezo element (4) can be coupled to a membrane (11). [13] MEMS converter according to one or more of the preceding claims, characterized bythat the piezo element (4) and the coupling element (9) are coupled to one another by means of at least one spring element (10), wherein the at least one spring element (10) is arranged in the longitudinal direction of the piezo element (4) preferably between the carrier layer (6) and the coupling element (9). [14] MEMS converter according to one or more of the preceding claims, characterized by that the spring element (10) is formed, preferably exclusively, by the carrier layer (6) and / or from the or a polymer. [15] Use of a carrier layer (6) for a MEMS converter (1), wherein the MEMS converter (1) is designed at least according to one of the preceding claims and / or wherein the carrier layer (6) is designed according to at least one of the claims. [16] Method for producing a MEMS transducer (1), in particular a MEMS sound transducer unit, preferably for generating and / or detecting sound waves in the audible wavelength spectrum and / or in the ultrasonic range, wherein the MEMS converter (1) preferably has at least one feature of the preceding claims, in which at least one piezo element (4) deflectable in the direction of a stroke axis (3) is arranged on a carrier (2), which has at least two piezo layers (5, 25, 35, 36) and at least one carrier layer (6), wherein electrical signals and deflections of the piezo element (4) can be converted into one another by means of the at least two piezo layers (5, 25, 35, 36), characterized by , that the carrier layer (6) is arranged between at least two piezo layers (5, 25, 35, 36). [17] Method according to the preceding claim, characterized bythat an oxide layer (37 - 40), in particular a silicon oxide layer, of the carrier layer (6) is processed by means of chemical-mechanical polishing. [18] Method according to one or more of the preceding claims, characterized by that the piezo layers (5, 25, 35, 36) are formed on the carrier layer (6) by means of semiconductor manufacturing processes. [19] Method according to one or more of the preceding claims, characterized by that the piezo layers (5, 25, 35, 36) are deposited on the carrier layer (6), in particular on the oxide layer (37 - 40). [20] Method according to one or more of the preceding claims, characterized by that the piezo layers (5, 25, 35, 36) on the carrier layer (6) and / or the carrier layer (6) are formed by means of chemical vapor deposition. [21] Method according to one or more of the preceding claims, characterized bythat after the formation of the piezo layers (5, 25, 35, 36) and / or the carrier layer (6), at least one region is removed, in particular by means of etching.

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