Sensor arrangement for mounting on a measuring chamber, device for qualifying a mask and method for qualifying a mask

Abstract

Sensor arrangement (100; 200; 300; 500) for arrangement on a measuring chamber (540), wherein the sensor arrangement (100; 200; 300; 500) comprises a sensor (124; 224; 324; 524), an intake port (131; 231; 331) and an outlet (132; 232; 332; 532), wherein the sensor arrangement (100; 200; 300; 500) comprises a fluid connection (133; 233; 333) between the intake port (131; 231; 331) and the outlet (132; 232; 332; 532); - wherein the sensor arrangement (100; 200; 300; 500) comprises a first section (190; 290; 390) and a second section (110; 210; 310), wherein the first section (190; 290; 390) comprises the outlet (132; 232; 332; 532) and wherein the second section (110; 210; 310) comprises the intake opening (131; 231; 331) and the sensor (124; 224; 324; 524), wherein the fluid connection (133; 233; 333) connects the first section (190; 290; 390) to the second section (110; 210; 310); and - wherein the sensor arrangement (100; 200; 300; 500) comprises an electronic unit (120; 220; 320), wherein the first section (190; 290; 390) comprises the electronic unit (120; 220; 320).

Description

[0001] The present invention relates to a sensor arrangement for placement on a measuring chamber, a device for qualifying a mask and a method for qualifying a mask.

[0002] In known sensor arrangements for mounting on a measuring chamber, especially on a vacuum measuring chamber, particles and / or gases can be introduced, particularly from the sensor arrangement into the measuring chamber, for example, outgassing of an adhesive into the measuring chamber.

[0003] Devices and methods for qualifying a mask for use in lithography are known in the prior art. Here, a mask intended for use in lithography can be examined for defects and / or contamination by capturing optical images, in order to improve quality in a subsequent lithography process for manufacturing semiconductor elements. A method for qualifying a mask can be carried out using a device comprising a sensor arrangement. With sensor arrangements known in the prior art, there is the possibility that particles or contaminants from parts of the sensor arrangement and / or from the measuring chamber may be deposited on an optical sensor or on optical surfaces, for example, on optical surfaces within the measuring chamber.This can lead to the formation of unwanted deposits on optical components and / or on a sensor, particularly an optical sensor, which can impair the measurement result. These unwanted deposits can include, for example, organic substances. In addition to contaminants originating from the sensor assembly, contaminants not originating from the sensor assembly can also accumulate on surfaces, especially a sensor surface. This can, for example, affect the measurement results of a process for qualifying a mask for use in lithography, and in particular, the mask or optical components can become contaminated. This can, for example, reduce the reliability of defect detection, especially over time.Alternatively or additionally, the mask to be qualified may become contaminated through the known process, which would negatively affect the lithography result. Alternatively or additionally, the rate of false-positive defect detections may increase and / or existing defects may not be detected.

[0004] DE 10 2008 000 957 A1 discloses, inter alia, an EUV lithography device comprising a protective module and a housing, wherein a sensor is arranged in the housing, and wherein, to prevent contamination of this sensor, a gas supply and a gas outlet, e.g., connected to a pump or a vacuum system, are arranged on the housing in such a way that a gas flow prevents the penetration of unwanted substances to the sensor. Inert gases (e.g., molecular nitrogen, argon, krypton, helium, neon, or xenon) can be introduced into the protective module via the gas supply.

[0005] DE 10 2010 063 337 A1 discloses, inter alia, a method for mask inspection, wherein light from a light source enters a lighting system and directs an illumination beam bundle onto a mask arranged in the object plane of a projection lens, and wherein the illuminated area of ​​the mask is imaged onto a sensor arrangement via an observation beam bundle using the projection lens.

[0006] It is an object of the present invention to provide a sensor arrangement for placement on a measuring chamber, a device for qualifying a mask and a method for qualifying a mask, which reduce contamination of the measuring chamber and / or the mask.

[0007] Accordingly, a sensor arrangement for mounting on a measuring chamber is proposed. The sensor arrangement includes a sensor. The sensor can be an optical sensor, in particular an imaging sensor. The sensor can, for example, comprise a CCD (charge-coupled device) chip, a CMOS (complementary metal-oxide-semiconductor) chip, and / or a photodiode. Particularly preferably, the sensor can comprise a TDI (time delay and integration) sensor. The sensor arrangement can, for example, be a camera system. The sensor arrangement has an inlet and an outlet. The sensor arrangement has a fluid connection between the inlet and the outlet. The inlet can be configured to guide a fluid from the measuring chamber into the sensor arrangement, in particular into a cavity of the sensor arrangement. The fluid can be a gaseous and / or liquid medium, for example, air.The intake port can be completely or partially filled with a medium permeable to the fluid. The outlet can be configured to guide a fluid out of the sensor assembly via at least a portion of the fluid connection. The outlet can be configured as an opening. The outlet can be completely or partially filled with a medium permeable to the fluid. The fluid connection is configured to guide the fluid through at least a portion of the sensor assembly. The fluid connection can be configured to guide a fluid from the intake port to the outlet. The fluid connection can be configured at least partially as a cavity. The fluid connection can be at least partially filled with a medium permeable to the fluid.

[0008] The fluid connection can be configured to draw a medium from the measuring chamber during operation of the sensor arrangement. The medium can preferably be the fluid itself. The medium can comprise a gas, in particular a gas mixture, and / or particles and / or impurities.

[0009] The sensor assembly may include an adhesive layer. This adhesive layer may be configured to bond two or more elements of the sensor assembly together. The adhesive layer may act as a barrier against contamination. It may also be configured to prevent contaminants from migrating towards the measuring chamber. The fluid connection may be configured to vent, particularly by extraction, outgassing from the adhesive layer during operation of the sensor assembly. This can prevent the outgassing from diffusing into the measuring chamber and / or allow outgassing from the adhesive layer to be directed to the outlet via the intake opening and / or the fluid connection.

[0010] The sensor assembly comprises a first section and a second section. The first section includes the outlet. The second section includes the intake opening and the sensor. Additionally, the second section may include the adhesive layer. The fluid connection links the first section to the second section. The first section may be separated from the second section, for example, by a plane. If the sensor assembly is mounted on the measuring chamber, this plane may be located on a wall of the measuring chamber. The first section of the sensor assembly may be located essentially outside the measuring chamber. The second section of the sensor assembly may project essentially into the measuring chamber.Within the scope of the present invention, expressions such as "first", "second", "third", as for example in "first section" serve as mere designations, in particular without reference to a sequence and without reference to the presence of a further element of the said type.

[0011] The sensor assembly includes an electronics unit, the first section of which comprises the electronics unit. The electronics unit may include electrical connections and / or a wiring harness and / or a control unit and / or an evaluation unit.

[0012] The first section can include a carrier plate. The second section can include a sensor carrier. The carrier plate can be configured to mount the sensor assembly to the measuring chamber. The carrier plate can, for example, be permanently or reversibly connected to a wall of the measuring chamber. The sensor assembly can, for example, include a sealing element, in particular a seal, such as an O-ring, and / or a fluid-tight adhesive layer and / or a fluid-tight coating. A seal, in particular an O-ring, can be arranged between the carrier plate and a wall of the measuring chamber for sealing purposes. The carrier plate can have an opening, for example, a circular opening. At least part of the electronic unit can be accommodated in the opening. The carrier plate and / or the sensor carrier and / or the sensor can be arranged substantially parallel to each other.The term "essentially parallel" here refers to an angle between two elements of less than 30°, particularly less than 10°, and most preferably less than 1°. The adhesive layer can be arranged between the sensor carrier and the sensor. The adhesive layer can be configured to bond the sensor carrier to the sensor. The electronic unit can be connected to the sensor via the sensor carrier or an opening in the sensor carrier and / or via a passage through the adhesive layer, and in particular, it can be electrically connected. The electronic unit can, for example, be substantially cylindrical in shape.

[0013] The second section can include the adhesive layer. This adhesive layer can be designed to prevent contamination from the first section, particularly from the electronics unit, into the measuring chamber. This eliminates the need for the electronics unit to be vacuum-compatible, thus reducing costs. The adhesive layer also reduces the volume of the sensor assembly that must be vacuum-compatible. Furthermore, the adhesive layer can shield non-vacuum-compatible components of the sensor assembly.

[0014] The sensor arrangement can be configured to generate a decreasing pressure gradient from the first section to the second section, in particular such that outgassing from the second section, especially from the adhesive layer, can be extracted. The first section can have a first cavity. The second section can have a second cavity. A partial pressure in the first cavity can be lower than a partial pressure in the second cavity, particularly during operation of the sensor arrangement. Preferably, the sensor arrangement can be configured such that a partial pressure in the first cavity can be lower than a partial pressure in the second cavity, particularly during operation of the sensor arrangement. The first cavity can, for example, be part of the electronics unit. The second cavity can, for example, be a channel and / or the intake opening.The first cavity and / or the second cavity can be at least partially filled with a medium, for example, a porous medium. The second cavity can, for example, be located in the sensor carrier, in particular in a porous material of the sensor carrier and / or in a cable gland of the sensor carrier.

[0015] The sensor arrangement can comprise multiple sensors, in particular multiple imaging sensors, and most preferably multiple TDI sensors. The sensor arrangement can, for example, include multiple CCD (charge-coupled device) chips and / or multiple CMOS (complementary metal-oxide-semiconductor) chips and / or multiple photodiodes. The sensor arrangement can, for example, comprise 2 to 100 sensors, in particular 5 to 50, and most preferably 10 to 30 sensors. The sensor arrangement can be configured such that each of the multiple sensors is configured to capture a partial image, and the partial images can be added after a time delay. This allows the field of view of the sensor arrangement to be increased when using small sensors, and / or enables sensors to be replaced individually when worn. The sensor arrangement can comprise multiple TDI chips, which can be arranged in a single plane, preferably without overlapping.

[0016] The sensor, and in particular the sensor assembly, can be configured to detect radiation in the EUV range. The radiation can have a wavelength between 1 nm and 250 nm, particularly between 10 nm and 100 nm, preferably between 13 nm and 14 nm.

[0017] The sensor assembly can include a first connecting element. The first connecting element can be connected to a vacuum source. The first connecting element can be identical to the outlet.

[0018] The sensor arrangement can include a vacuum source. The vacuum source can be a pump. The vacuum source can be a vacuum system. The vacuum source can be configured to generate ultra-high vacuum. Ultra-high vacuum can be understood here as a partial pressure of less than 10 Pascals, preferably less than 5 Pascals. Particularly preferably, ultra-high vacuum can be understood as a partial pressure of less than 100 nanopascals. The sensor arrangement can, for example, include several pumps, in particular a backing pump and a main pump. The vacuum source can include one or more elements selected from the group comprising a vane pump, a rotary vane pump, a jet pump, a molecular pump, a turbomolecular pump, a cryopump, and a sorption pump. The sensor arrangement can include a bake-out device.This prevents contaminants from entering a measuring chamber during operation.

[0019] The sensor assembly may include a second connecting element. This second connecting element may be designed to connect to the measuring chamber for operation under ultra-high vacuum. The second connecting element may be configured to permanently or reversibly connect the mounting plate to a wall of the measuring chamber. The connecting element may include an O-ring for sealing. The second connecting element may, for example, include a flange. The second connecting element may be designed to be bolted to the measuring chamber. The second connecting element may have one or more drill holes.

[0020] The sensor arrangement can include a purge device for conducting a purge flow of a purge medium. The purge device can comprise one or more elements selected from the group consisting of a purge medium source, a line for conducting the purge medium, and an outlet, in particular a nozzle, for supplying the sensor with purge medium. The purge medium can comprise one or more gases selected from the group consisting of helium, hydrogen, nitrogen, neon, argon, krypton, xenon, and oxygen. The purge medium can be a pure gas. Alternatively, the gas can be a gas mixture. Preferably, the purge medium can be a gas mixture comprising helium and hydrogen. The purge device can be configured to generate a constant purge flow. The purge device can be configured to generate a laminar purge flow.Preferably, the rinsing device can be configured to direct a rinsing flow over at least a portion of the sensor, particularly over the sensor edges. The sensor can be cleaned by means of this rinsing flow. Alternatively or additionally, heat can be dissipated by means of the rinsing flow, for example, from the sensor, particularly from the first section of the sensor assembly. This can improve the sensor's function. The intake port can be configured to draw in the rinsing medium. The fluid connection can be configured to direct the rinsing flow from the intake port to the outlet. The rinsing flow can be configured to carry away contaminants and / or outgassing from the adhesive layer. The rinsing device and / or the fluid connection can be configured to create a vacuum in parts of the sensor assembly.This allows, for example, impurities and / or outgassing to be extracted, especially towards the outlet.

[0021] The sensor assembly can have a first housing. At least part of the sensor assembly can be integrated into the first housing. For example, the electronic unit and / or the mounting plate can be at least partially located in the first housing and / or mechanically connected to the first housing. For example, the first housing of the sensor assembly can have the outlet. For example, the sensor assembly can have a second housing. The second housing can, for example, at least partially encompass the sensor carrier and / or the sensor and / or the rinsing device. This simplifies the extraction of contaminants and / or outgassing, for example, from the electronic unit and / or from an adhesive layer of the sensor assembly.

[0022] The fluid connection can have one or more channels. The fluid connection can, for example, include an annular gap. The annular gap can have a constant gap width. The annular gap can, for example, have interruptions, particularly for elements to stabilize the sensor arrangement and / or for electrical connections. The annular gap can be formed between the cylindrical electronic unit and the carrier plate, particularly by the electronic unit projecting into a circular opening in the carrier plate. The radius of the annular opening can be larger than the radius of the electronic unit, for example by 0.1 mm to 1 cm, preferably by 0.5 mm to 2 mm, and particularly preferably by 1 mm.

[0023] The channel can have a cross-section of at least 0.1 mm² 2 , in particular at least 1mm 2 , preferably at least 5mm 2The channel can be located, for example, between the carrier plate and the electronic unit. Alternatively or additionally, the channel can be located between the housing of the electronic unit and the carrier plate. The housing of the electronic unit and / or the electronic unit itself can be, for example, essentially tubular, can-shaped, or cylindrical. Alternatively, the housing of the electronic unit and / or the electronic unit itself can be, for example, essentially cuboidal. The housing of the electronic unit can be connected to the sensor carrier, for example, by means of an adhesive layer. The housing of the electronic unit can be connected to the first housing of the sensor assembly, for example. The housing of the electronic unit can have openings for the routing of electrical conductors.

[0024] The sensor arrangement can, for example, have a third section. The third section can include a third cavity. The third cavity can, for example, be integrated into the housing of the electronic unit. A partial pressure in the third cavity can be higher than in the first cavity and / or in the second cavity, particularly during operation of the sensor arrangement. Preferably, the sensor arrangement can be configured such that a partial pressure in the third cavity can be higher than in the first cavity and / or in the second cavity, particularly during operation of the sensor arrangement. Preferably, a partial pressure in a cavity of the first section can be higher than in a cavity of the second section. The third section can preferably include the electronic unit. The sensor arrangement can have a further adhesive layer, particularly between the housing of the electronic unit and the sensor carrier.The additional adhesive layer can be arranged in a ring shape, in particular such that part of the electronic unit can pass through the adhesive layer to the sensor carrier. The third section can be separated from the first section and / or the second section by a fluid-tight wall and / or by the housing of the electronic unit and / or by the additional adhesive layer, in particular by fluid separation. This eliminates the need for the electronic unit to be designed for vacuum operation. The sensor arrangement can be designed such that the partial pressure in the first cavity and / or the partial pressure in the second cavity can be controlled, for example by means of the electronic unit.Particularly preferably, the sensor arrangement can be configured such that the partial pressure in the first cavity and / or the partial pressure in the second cavity and / or the partial pressure in the third cavity can be controlled, for example, by means of the electronic unit. For example, the vacuum source can be configured to set and / or control partial pressures in cavities of the sensor arrangement. The vacuum source can be configured to generate and / or control different partial pressures in the first cavity and / or in the second cavity. Preferably, the vacuum source can be configured to generate and / or control different partial pressures in the first cavity and / or in the second cavity and / or in the third cavity.

[0025] The sensor assembly can, for example, include a cooling device. The cooling device can comprise a Peltier element. The cooling device can be configured to cool the sensor. The fluid connection can be arranged such that a fluid flow and / or a purge flow passes over a warm side of the Peltier element, in particular such that the heat is carried away to the outlet. Alternatively or additionally, the fluid connection can be configured such that a fluid flow and / or a purge flow passes over a cold side of the Peltier element, in particular such that condensing moisture is carried away to the outlet. The fluid connection can, for example, be a gap between the sensor carrier and the cooling device, in particular the Peltier element. The fluid connection can be configured to carry moisture, in particular condensate, from the cooling device to the outlet.The fluid connection, in particular the channels, can be located at least partially within the cooling device and / or in the sensor carrier. This allows heat, moisture, and / or contaminants to be specifically dissipated from the sensor.

[0026] For example, the sensor arrangement can be designed such that partial pressures within the sensor arrangement can be controlled in such a way that the electronic unit can have a partial pressure that is lower than the partial pressure of the measuring chamber. This has the advantage that the sensor and / or the sensor carrier and / or the cooling device, in particular the Peltier element, bend less, especially due to a smaller pressure difference between the measuring chamber and the electronic unit.

[0027] The fluid connection may include one or more valves. The valves may be configured to prevent fluid flow from the first section to the second section. This prevents, for example, contaminants from entering the measuring chamber from the sensor assembly when a vacuum source is switched off. The valve may, for example, be a check valve. Alternatively or additionally, the outlet and / or the fluid connection may include a device configured to close the outlet and / or the fluid connection when necessary, in particular a fluid-tight seal, such as a fluid-tight gate valve. The fluid connection and / or the outlet may, for example, include a filter to filter aspirated fluid. The fluid connection and / or the outlet may include a device to analyze aspirated fluid, such as a mass spectrometer.This allows conclusions to be drawn about a source of contamination, in particular a source of outgassing. The sensor arrangement can include one or more pressure sensors. This allows the fluid flow through the sensor arrangement to be monitored and / or controlled.

[0028] In another aspect, the invention can comprise a device for qualifying a mask for use in lithography. The device includes a sensor arrangement as disclosed. The qualification of the mask can, for example, include an inspection of the mask. Alternatively or additionally, the qualification of the mask can include a pretreatment of the mask, for example, a correction.

[0029] The mask can be a photolithographic mask, preferably a photolithographic mask for an EUV wavelength range. The mask can have multiple layers, particularly planar layers. The mask can have an absorber structure made up of absorbing pattern elements.

[0030] The device for qualifying a mask can comprise an evaluation and control unit and a measuring chamber comprising an optical system. The evaluation and control unit can have separate evaluation units and separate control units, both of which can be connected to each other via an interface. Alternatively, the evaluation and control unit can be designed as a single device. The evaluation and control unit preferably includes a data processing device. The evaluation and control unit can, for example, be operated by a person via an interface. This interface can be a keyboard or a touchpad.

[0031] The optical system can include an illumination unit and an imaging unit. The illumination unit can be configured to illuminate the mask, in particular with illuminating light. The illumination unit can include an EUV light source. The imaging unit can be configured to image light reflected from the mask onto an image plane.

[0032] The device for qualifying a mask can have at least one housing. For example, the optical system can be arranged inside the housing of the mask qualification device, preferably completely inside the housing. The evaluation and control unit can be arranged partially inside the housing of the mask qualification device. For example, the evaluation and control unit can be arranged completely inside the housing of the mask qualification device. Alternatively, the evaluation and control unit can be arranged completely outside the housing of the mask qualification device. For example, the sensor arrangement can be arranged at least partially inside the housing of the mask qualification device.

[0033] The device may include a means of storing the mask. The means of storing the mask may be configured to purge the mask with at least one purge gas, in particular a purge gas as described above. Alternatively or in addition to the purge device of the sensor assembly, the means of storing the mask may also purge the sensor of the sensor assembly with purge gas. By using the sensor assembly according to the disclosure, the detection of defects on the mask can be improved using the device.

[0034] In a further aspect of the present invention, a method for qualifying a mask for use in lithography is proposed. The method comprises providing a device for qualifying a mask, wherein the device includes a sensor arrangement as disclosed. The device may include an evaluation and control unit and a measuring chamber. An optical system may be arranged in the measuring chamber. The sensor arrangement comprises a sensor, an intake port, and an outlet. The sensor arrangement has a fluid connection between the intake port and the outlet. The device may include a vacuum source. The method further comprises acquiring at least one optical image of a part of the mask by means of the sensor. The method further comprises drawing a medium from the measuring chamber via the fluid connection, in particular by means of the evaluation and control unit.In a further step, one or more images generated by the sensor can be evaluated, particularly using the evaluation and control unit. In a further step, defect detection can be performed, also using the evaluation and control unit. For example, a defect and / or contamination on the mask can be detected. In a further step, the mask can be repaired.

[0035] The disclosed sensor arrangement for mounting on a measuring chamber, the disclosed device for qualifying a mask, and the disclosed method for qualifying a mask offer various advantages, at least in exemplary embodiments. In particular, the reliability of a mask qualification can be increased, for example, by reducing outgassing of an adhesive layer into the measuring chamber and / or by extracting contaminants and / or moisture and / or by dissipating heat from the measuring chamber and / or from the sensor arrangement.

[0036] It is understood that the features mentioned above and those to be explained below can be used not only in the combinations specified, but also in other combinations or on their own, without leaving the scope of this disclosure.

[0037] Exemplary embodiments of the disclosure are shown in the drawings and are explained in more detail below. They show: Fig. 1 a schematic representation of a first embodiment of a sensor arrangement according to the invention; Fig. 2 a schematic representation of a second embodiment of a sensor arrangement according to the invention; Fig. 3 a schematic representation of a third embodiment of a sensor arrangement according to the invention; Fig. 4 a schematic representation of an embodiment of a device according to the invention for qualifying a mask; and Fig. 5 a schematic representation of a method according to the invention for qualifying a mask.

[0038] Fig. Figure 1 shows a first embodiment of a sensor arrangement 100 according to the invention for mounting on a measuring chamber. The sensor arrangement 100 comprises a sensor 124, an intake opening 131, and an outlet 132. The sensor arrangement 100 has a fluid connection 133 between the intake opening 131 and the outlet 132. The fluid connection 133 is configured to draw a medium from the measuring chamber during operation of the sensor arrangement 100. The sensor 124 can be configured to detect radiation in the EUV range. The sensor arrangement 100 can comprise several sensors 124, in particular several imaging sensors 124, which can be configured to detect radiation in the EUV range.

[0039] The sensor arrangement 100 has an adhesive layer 123. The fluid connection 133 can be configured to extract outgassings 126 from the adhesive layer 123 during operation of the sensor arrangement 100.

[0040] The sensor arrangement 100 has a first section 190 and a second section 110. In the Fig. In the embodiment shown in Figure 1, the dashed line 141 marks a plane as the boundary between the first section 190 and the second section 110. The first section 190 includes the outlet 132. The second section 110 has the intake opening 131 and the sensor 124. The fluid connection 133 connects the first section 190 to the second section 110.

[0041] The sensor assembly 100 comprises an electronics unit 120. The first section 190 comprises the electronics unit 120. The first section 190 further comprises a carrier plate 121. The second section 110 comprises a sensor carrier 122. The sensor assembly 100 can be configured to generate a decreasing pressure gradient from the first section 190 to the second section 110.

[0042] The first section 190 has a first cavity 134. The first cavity 134 can, for example, be enclosed by the electronic unit 120. The second section 110 has a second cavity 135. The second cavity 135 can be the intake opening 131. A partial pressure in the first cavity 134 can be lower than in the second cavity 135, particularly when the sensor arrangement 100 is operated on a measuring chamber under ultra-high vacuum.

[0043] The sensor assembly 100 can have a first housing 143. The outlet 132 and / or the carrier plate 121 and / or the electronic unit 120 can be at least partially integrated into the first housing 143. Alternatively or additionally, the sensor assembly 100 can have a second housing. The second housing can, for example, at least partially enclose the sensor carrier 122 and / or the sensor 124 and / or a rinsing device. This simplifies the extraction of contaminants and / or outgassing, for example, from the electronic unit 120 and / or from an adhesive layer 123 of the sensor assembly 100. For example, a cavity in the first housing 143 can be the first cavity. For example, a cavity in the second housing can be the second cavity.

[0044] The sensor assembly 100 has a first connecting element 137. The first connecting element 137 can be connected to a vacuum source. Alternatively, the sensor assembly 100 can have a vacuum source, for example, a pump. The sensor assembly 100 has a second connecting element 139. In the exemplary embodiment, the second connecting element 139 is Fig. 1 the carrier plate 121. The second connecting element 139 can be connected to the measuring chamber for operation under ultra-high vacuum.

[0045] The fluid connection 133 has a channel 141. The channel 141 according to Fig. 1 is essentially designed as an annular gap. The annular gap may, for example, have interruptions, in particular by elements for the mechanical stabilization of the sensor arrangement 100 and / or by electrical connections. The channel 141 is formed by a gap between the electronic unit 120 and the carrier plate 121. The channel 141 can have a cross-section of at least 0.1 mm². 2 , in particular at least 1mm 2 , preferably at least 5mm 2 The fluid connection 133 may have one or more valves. The sensor arrangement 100 may have a cooling device.

[0046] The electronic unit 120 is essentially cylindrical in shape. Alternatively, the electronic unit 120 can be essentially cuboid in shape. The electronic unit 120 is received in a circular opening in the carrier plate 121. The electronic unit 120 is connected to a sensor carrier 122, in particular by means of electrical connections. The sensor carrier 122 is connected to the sensor 124 by means of an adhesive layer 123. The sensor 124 can be a TDI sensor. For example, the sensor 124 can comprise several TDI sensors.When a pump is connected to the outlet 132, a negative pressure can be generated in the first section 190, which comprises the electronic unit 120, the outlet 132, the carrier plate 121, and at least parts of the first housing 143 of the sensor assembly 100. This negative pressure can generate a fluid flow from the second section 110, which comprises the sensor carrier 122, the adhesive layer 123, and the sensor 124, into the first section 190. This allows outgassing 126 from the adhesive layer 123 in the second section 110 to be directed into the first section 190.

[0047] The embodiment of the sensor arrangement 200 according to Fig. 2 can be implemented essentially like the exemplary embodiment according to Fig. 1. The embodiment according to Fig. 2 comprises a rinsing device 227 for guiding a rinsing stream 228 of a rinsing medium. The rinsing medium can contain one or more gases selected from the group consisting of helium, hydrogen, nitrogen, neon, argon, krypton, xenon, and oxygen. The rinsing device 227 can, for example, be configured as an annular nozzle arrangement. The rinsing device 227 can be configured to enhance the extraction of outgassings 226 from the adhesive layer 223. The rinsing device 227 can be configured to direct the rinsing stream 228 onto edges of the sensor 224 and / or onto an edge zone of the adhesive layer 223. This can intensify the extraction of outgassings 226 from the adhesive layer 223 and / or of contaminants from the sensor 224.

[0048] The sensor assembly 200 can have a first housing 243. The outlet 232 and / or the carrier plate 221 and / or the electronic unit 220 can be at least partially integrated into the first housing 243.

[0049] The sensor arrangement 200 after Fig. 2 comprises a second housing 244 of the sensor assembly 200. The second housing 244 of the sensor assembly 200 can, for example, at least partially enclose the sensor carrier 222 and / or the sensor 224 and / or the rinsing device 227 and / or the adhesive layer 223. This simplifies the extraction of contaminants and / or outgassings 226, for example, from the electronic unit 220 and / or from an adhesive layer 223 of the sensor assembly 200. For example, a cavity of the first housing 243 can be the first cavity 234. For example, a cavity of the second housing 244 can be the second cavity 235. During operation of the sensor assembly 200, a partial pressure in the first cavity 234, particularly in the first housing 243, can be lower than in the second cavity 235, particularly in the second housing 244.

[0050] The embodiment of the sensor arrangement 300 according to Fig. 3 can essentially be like the sensor arrangements according to Fig. 1 and / or Fig. 2. It may be designed in a specific way and may, for example, also include components which are in Fig. 3 are not shown. The first section 390 comprises the carrier plate 321. The second section 310 comprises the sensor 324, the sensor carrier 322 and the adhesive layer 323, which connects the sensor 324 to the sensor carrier 322.

[0051] The sensor assembly 300 comprises a further adhesive layer 323a, which may be configured to fluidically seal a housing 321a of the electronic unit 320 against the first section 390 and the second section 310, in particular against the sensor carrier 322. The sensor assembly 300 has a third section 340. The third section 340 comprises the electronic unit 320. The sensor assembly 300 has a first cavity 334 in a first section 390 and a second cavity 335 in a second section 310. The third section 340 may have a third cavity 345, which, during operation of the sensor assembly 300, has a higher partial pressure than the first section 390 and the second section 310. The third cavity 345 may have atmospheric pressure, in particular during operation of the sensor assembly 300. The sensor assembly 300 includes a cooling device 342.

[0052] The sensor assembly 300 can have a first housing 343. The outlet 332 and / or the carrier plate 321 and / or the electronic unit 320 can be at least partially integrated into the first housing 343. Alternatively or additionally, the sensor assembly 300 can have a second housing. The second housing can, for example, at least partially enclose the sensor carrier 322 and / or the sensor 324 and / or the rinsing device 327 and / or the adhesive layer 323. This simplifies the extraction of contaminants and / or outgassing, for example, from the electronic unit 320 and / or from an adhesive layer 323 of the sensor assembly 300. For example, a cavity of the first housing 343 can be the first cavity 334. For example, a cavity of the second housing can be the second cavity.During operation of the sensor device 300, the partial pressure in the first cavity 334, in particular in the first housing 343, can be lower than in the second cavity, in particular in the second housing.

[0053] Fig. Figure 4 shows an embodiment of a device 550 according to the invention for qualifying a mask 530 for use in lithography, wherein the device 550 comprises a sensor arrangement 500 according to the invention. The sensor arrangement 500 can be configured like a sensor arrangement described above. Fig. Figure 4 shows a sensor arrangement 500, which in particular comprises a sensor 524 and an outlet 532. The sensor 524 can be configured to detect radiation in the EUV range 536. The outlet 532 is the first connecting element 537. The outlet 532 is connected to a vacuum source 538. The vacuum source 538 is integrated into the sensor arrangement 500, in particular into a first housing 543 of the sensor arrangement 500. The device 550 comprises an EUV source 510.

[0054] The device 550 comprises an evaluation and control unit 543 and a measuring chamber 540 comprising an optical system 520. The evaluation and control unit 543 can be connected via interfaces to the sensor arrangement 500 and / or to the EUV source 510 and / or to the optical system 520. The device 550 has a housing 590. The housing 590 can, for example, delimit the measuring chamber 540. The device 550 can be configured to perform a method according to the invention for qualifying a mask 530.

[0055] Fig. Figure 5 shows an embodiment of the inventive method for qualifying a mask for use in lithography. The method comprises providing a device for qualifying a mask. The device can, for example, be a [device / system] such as [shown in Figure 5]. Fig. 4 illustrated device 550. The device comprises in particular a sensor arrangement according to the invention, as for example shown in 4. Fig. 1, Fig. 2, Fig. 3 or Fig.Figure 4 illustrates the device. The device can include an evaluation and control unit and a measuring chamber comprising an optical system. The sensor arrangement comprises a sensor, an intake opening, and an outlet. The sensor arrangement includes a fluid connection between the intake opening and the outlet. The device can include a vacuum source. In a further step 1020, at least one optical image of at least a part of the mask is captured by the sensor. For example, several images can be captured. In a further step 1030, a medium is extracted from the measuring chamber via the fluid connection by means of the evaluation and control unit. In a further step, an evaluation can be carried out by means of the evaluation and control unit; in particular, defect detection can be carried out to detect defects or contamination of the mask. Reference symbol list 100, 200, 300, 500 sensor array 540 measuring chamber 124, 224, 324, 524 Sensor 131, 231, 331 Intake opening 132, 232, 332, 532 Outlet 133, 233, 333 fluid compound 123, 223, 323 Adhesive layer 126, 226, 326 outgassings 190, 290, 390 first section 110, 210, 310 second section 1010 Provide 1020 Capture 1030 Suction 120, 220, 320 electronic unit 121, 221, 321 Carrier plate 122, 222, 322 Sensor carriers 134, 234, 334, 534 first cavity 135, 235, 335, 535 second cavity 536 Radiation in the EUV range 137, 337, 537 first connecting element 538 Vacuum source 139, 239, 339 second connecting element 227, 327 Flushing device 228, 328 Flushing current Channels 141, 241, and 341 342 Cooling unit 530 mask 543 Evaluation and control unit 520 optical system 550 Device for qualifying a mask Levels 142, 242, 342 323a additional adhesive layer 321a Housing of the electronic unit 340 third section 510 EUV source 590 Housing of the device for qualifying the mask 143, 243, 343, 543 first housing of the sensor assembly 244 second housing of the sensor assembly 345 third cavity

Claims

[1] Sensor arrangement (100; 200; 300; 500) for arrangement on a measuring chamber (540), wherein the sensor arrangement (100; 200; 300; 500) comprises a sensor (124; 224; 324; 524), a suction opening (131; 231; 331) and an outlet (132; 232; 332; 532), wherein the sensor arrangement (100; 200; 300; 500) comprises a fluid connection (133; 233; 333) between the suction opening (131; 231; 331) and the outlet (132; 232; 332; 532); - wherein the sensor arrangement (100; 200; 300; 500) has a first section (190; 290; 390) and a second section (110; 210; 310), wherein the first section (190; 290; 390) has the outlet (132; 232; 332; 532) and wherein the second section (110; 210; 310) has the intake opening (131; 231; 331) and the sensor (124; 224; 324; 524), wherein the fluid connection (133; 233; 333) connects the first section (190; 290; 390) to the second section (110; 210; 310); and - wherein the sensor arrangement (100; 200; 300; 500) comprises an electronics unit (120; 220; 320), wherein the first section (190; 290; 390) comprises the electronics unit (120; 220; 320). [2] Sensor arrangement (100; 200; 300; 500) according to claim 1, wherein the fluid connection (133; 233; 333) is arranged to suck a medium out of the measuring chamber (540) during operation of the sensor arrangement (100; 200; 300; 500). [3] Sensor arrangement (100; 200; 300; 500) according to claim 1 or 2, wherein the sensor arrangement (100; 200; 300; 500) has an adhesive layer (123; 223; 323, 323a). [4] Sensor arrangement (100; 200; 300; 500) according to claim 3, wherein the fluid connection (133; 233; 333) is arranged to suck out gases (126; 226; 326) of the adhesive layer (123; 223; 323, 323a) during operation of the sensor arrangement (100; 200; 300; 500). [5] Sensor arrangement (100; 200; 300; 500) according to one of the preceding claims, wherein the first section (190; 290; 390) comprises a carrier plate (121, 221, 321), wherein the second section (110; 210; 310) comprises a sensor carrier (122; 222; 322). [6] Sensor arrangement (100; 200; 300; 500) according to one of the preceding claims, wherein the sensor arrangement (100; 200; 300; 500) is arranged to generate a decreasing pressure gradient from the first section (190; 290; 390) to the second section (110; 210; 310). [7] Sensor arrangement (100; 200; 300; 500) according to one of the preceding claims, wherein the first section (190; 290; 390) has a first cavity (134; 234; 334; 534), wherein the second section (110; 210; 310) has a second cavity (135; 235; 335; 535), wherein a partial pressure in the first cavity (134; 234; 334; 534) is lower than in the second cavity (135; 235; 335; 535). [8] Sensor arrangement (100; 200; 300; 500) according to claim 7, wherein the sensor arrangement (100; 200; 300; 500) comprises a third section (340), wherein the third section (340) has a third cavity (345), wherein a partial pressure in the third cavity (345) is higher than in the first cavity (134; 234; 334; 534) and in the second cavity (135; 235; 335; 535). [9] Sensor arrangement (100; 200; 300; 500) according to one of the preceding claims, wherein the sensor arrangement (100; 200; 300; 500) comprises a plurality of sensors (124; 224; 324; 524), in particular a plurality of imaging sensors (124; 224; 324; 524). [10] Sensor arrangement (100; 200; 300; 500) according to one of the preceding claims, wherein the sensor (124; 224; 324; 524) is configured to detect radiation in the EUV range (536). [11] Sensor arrangement (100; 200; 300; 500) according to one of the preceding claims, wherein the sensor arrangement (100; 200; 300; 500) has a first connecting element (137; 337; 537), wherein the first connecting element (137; 337; 537) is connectable to a vacuum source (538). [12] Sensor arrangement (100; 200; 300; 500) according to one of the preceding claims, wherein the sensor arrangement (100; 200; 300; 500) comprises a vacuum source (538). [13] Sensor arrangement (100; 200; 300; 500) according to one of the preceding claims, wherein the sensor arrangement (100; 200; 300; 500) comprises a second connecting element (139; 239; 339), wherein the second connecting element (139; 239; 339) is connectable to the measuring chamber (540) for operation under ultra-high vacuum. [14] Sensor arrangement (100; 200; 300; 500) according to one of the preceding claims, wherein the sensor arrangement (100; 200; 300; 500) comprises a flushing device (227; 327) for guiding a flushing flow (228; 328) of a flushing medium. [15] Sensor arrangement (100; 200; 300; 500) according to claim 14, the purge medium comprises one or more gases selected from the group comprising helium, hydrogen, nitrogen, neon, argon, krypton, xenon and oxygen. [16] Sensor arrangement (100; 200; 300; 500) according to one of the preceding claims, wherein the fluid connection (133; 233; 333) has one or more channels (141; 241; 341). [17] Sensor arrangement (100; 200; 300; 500) according to claim 16, wherein a channel (141; 241; 341) has a cross section of at least 0.1mm 2 , in particular at least 1mm 2 , particularly preferably at least 5mm 2 has. [18] Sensor arrangement (100; 200; 300; 500) according to one of the preceding claims, wherein the fluid connection (133; 233; 333) comprises one or more valves. [19] Sensor arrangement (100; 200; 300; 500) according to one of the preceding claims, wherein the sensor arrangement (100; 200; 300; 500) comprises a cooling device (342). [20] Apparatus for qualifying a mask (530) for use in lithography, the apparatus comprising a sensor arrangement (100; 200; 300; 500) according to one of the preceding claims. [21] Device (550) for qualifying a mask (530) according to claim 20, wherein the device comprises an evaluation and control device (543) and a measuring chamber (540) comprising an optical system (520). [22] A method for qualifying a mask (530) for use in lithography, the method comprising the following steps: • Providing (1010) a device (550) for qualifying a mask (530), wherein the device comprises a sensor arrangement (100; 200; 300; 500) according to one of claims 1 to 19, wherein the device (550) has an evaluation and control device (543) and a measuring chamber (540) comprising an optical system (520), wherein the sensor arrangement (100; 200; 300; 500) has a sensor (124; 224; 324; 524), a suction opening (131; 231; 331) and an outlet (132; 232; 332; 532), wherein the sensor arrangement (100; 200; 300; 500) has a fluid connection (133; 233; 333) between the suction opening (131; 231; 331) and the outlet (132; 232; 332; 532), wherein the device (550) has a negative pressure source (538); • detecting (1020) at least one optical image of at least a part of the mask (530) by means of the sensor (124; 224; 324; 524); and • Suction (1030) of a medium from the measuring chamber (540) via the fluid connection (133; 233; 333) by means of the evaluation and control device (543).

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