Micromechanical component for a sensor, microphone and / or microspeaker device

Abstract

The invention relates to a micromechanical component for a sensor, microphone and / or microspeaker device, comprising a capping structure (12) with an inner side (12a) of the capping structure (12) aligned with a sensitive surface (10a) of the micromechanical component, which inner side (12a) at least partially spans the sensitive surface (10a) of the micromechanical component, and with at least one air and / or medium access opening (14) structured by the capping structure (12), which openings extend from the inner side (12a) of the capping structure (12) to an outer side (12b) of the capping structure (12) directed away from the inner side (12a) of the capping structure (12), wherein the capping structure (12) has at least two web-shaped stiffening structures (24) protruding from the inner side (12a) of the capping structure (12),which are aligned parallel to each other with a distance between two adjacent stiffening structures (24) in a range between 50 nm and 1500 nm.,

Description

[0001] The invention relates to a micromechanical component for a sensor, microphone, and / or microspeaker device. The invention also relates to a manufacturing method for a micromechanical component for a sensor, microphone, and / or microspeaker device. State of the art

[0002] DE 10 2020 201 576 A1 discloses a micromechanical component for a sensor device, which comprises at least one stator electrode, at least one actuator electrode, and a membrane spanning the electrodes with a membrane outer side facing away from the electrodes. Furthermore, a stiffening and / or protective structure protruding from the membrane outer side is formed on the micromechanical component, which, for example, serves as a protective grid to ensure particle protection of the membrane outer side to prevent contamination of the membrane. Disclosure of the invention

[0003] The invention provides a micromechanical component for a sensor, microphone and / or microspeaker device having the features of claim 1 and a manufacturing method for a micromechanical component for a sensor, microphone and / or microspeaker device having the features of claim 6. Advantages of the invention

[0004] The present invention provides micromechanical components which, due to their respective encapsulation structure with the web-shaped stiffening structures, ensure more reliable protection of the sensitive surface of the respective micromechanical component against environmental influences, contamination, and damage. In particular, the web-shaped stiffening structures of a micromechanical component according to the invention ensure a high degree of robustness of its encapsulation structure, even when the encapsulation structure strikes an object. This robustness is further enhanced by the comparatively small distance between the at least two web-shaped stiffening structures.

[0005] In a micromechanical component according to the invention, even a relatively sensitive surface, such as a membrane surface of a warpable membrane used as a sensitive surface, is therefore hardly exposed to any risk of damage. Micromechanical components according to the invention can therefore be reliably used even in aggressive environments with high shock loads. The invention described here also creates micromechanical components with an increased service life compared to the prior art. As explained in more detail below, the web-shaped stiffening structures on the inside of the encapsulation structure of a micromechanical component according to the invention can also be formed by means of the present invention without any (significant) additional labor expenditure.Even the formation of the comparatively small distance between the at least two web-shaped stiffening structures is relatively easy to implement by using the present invention. Therefore, using the present invention does not increase, or only slightly increases, the manufacturing costs for the respective micromechanical component.

[0006] If a silicone-containing gel is conventionally used as a protective layer for a membrane surface of a warpable membrane that fulfills the function of the sensitive area, the total mass that can be subjected to warping movements is increased. The membrane surface conventionally "protected" by the silicone-containing gel therefore reacts more strongly to an acceleration of the device formed with the warpable membrane. In contrast, in a micromechanical component according to the invention, the formation of the web-shaped stiffening structures on its capping structure does not lead to an increase in the total mass that can be subjected to warping movements. Acceleration of the micromechanical component according to the invention with a membrane surface of a warpable membrane used as a sensitive area therefore does not contribute to the warping of the membrane.The increased protection of the membrane surface used as a sensitive area when using the present invention does not influence the detection behavior of the membrane.

[0007] Likewise, the design of a micromechanical component with a more robust encapsulation structure due to its web-shaped stiffening structures contributes to better protection of the partially manufactured micromechanical component during its production. Accordingly, damage to the micromechanical component according to the invention during transport is reliably prevented due to its encapsulation structure with the web-shaped stiffening structures protruding on the inside.

[0008] In an advantageous embodiment of the micromechanical component, the distance between two adjacent stiffening structures is in a range between 100 nm (nanometers) and 1000 nm (nanometers). The spacing of the stiffening structures from one another described here advantageously contributes to increasing the robustness of the encapsulation structure formed thereby.

[0009] Alternatively or additionally, for each of the at least two web-shaped stiffening structures, its width, oriented perpendicular to its respective maximum length, can be defined, and the height by which the stiffening structures protrude from the inside of the encapsulation structure can be greater than half the arithmetic mean of the widths of the at least two web-shaped stiffening structures. This also contributes to increasing the robustness of the respective encapsulation structure, so that even if an object strikes the encapsulation structure, there is little or no risk of damage to the encapsulation structure or the sensitive surface of the micromechanical component protected thereby.

[0010] Advantageously, the sensitive surface of the micromechanical component can be a membrane surface of a warpable membrane. The invention described here thus also advantageously contributes to protecting an otherwise comparatively sensitive sensitive surface from contamination and damage.

[0011] For example, the warpable membrane can be formed from a first semiconductor layer, the at least two web-shaped stiffening structures from a second semiconductor layer, and at least one anchoring region of the encapsulation structure, to which the at least two web-shaped stiffening structures are anchored, can be formed from a third semiconductor layer. As will become clear from the following description, the embodiment of the micromechanical component described here can be manufactured comparatively easily and cost-effectively.

[0012] Implementing a corresponding manufacturing method for a sensor, microphone, and / or microspeaker device also provides the advantages explained above. It is expressly noted that the manufacturing method can be further developed according to the embodiments of the micromechanical component explained above.

[0013] In an advantageous embodiment of the manufacturing method, the following substeps are carried out for arranging the encapsulation structure adjacent to the sensitive area of ​​the micromechanical component and for forming the at least two web-shaped stiffening structures: covering the sensitive area of ​​the micromechanical component at least partially with at least one first sacrificial layer, depositing a semiconductor layer on the at least one first sacrificial layer, structuring at least the at least two web-shaped stiffening structures from the semiconductor layer at least by structuring at least one trench lying between two later adjacent stiffening structures through the semiconductor layer with a trench width aligned parallel to the sensitive area, which corresponds to the respective distance between the two later adjacent stiffening structures,Depositing a second sacrificial layer on the semiconductor layer, whereby the at least one trench is at least partially filled with the sacrificial layer material of the second sacrificial layer; and forming at least one anchoring region of the capping structure, to which the at least two ridge-shaped stiffening structures are anchored, by exposing at least one partial surface of each of the at least two ridge-shaped stiffening structures from the second sacrificial layer and depositing a further semiconductor layer on the second sacrificial layer. The substeps described here can be carried out cost-effectively using standard semiconductor processes.

[0014] Preferably, during the deposition of the second sacrificial layer, a cavity (66) is enclosed in the at least one trench. As will become clear from the following description, the formation of the cavities in the trenches facilitates and accelerates subsequent removal of at least the sacrificial layer material of the second sacrificial layer by means of an etching process. This ensures reliable removal of the sacrificial layer material even in intermediate regions between two adjacent stiffening structures, despite the comparatively small distance between the two adjacent stiffening structures.

[0015] In a further advantageous embodiment of the manufacturing method, the encapsulation structure is anchored to a further semiconductor layer, from which a warpable membrane is formed with the sensitive area of ​​the micromechanical component as the membrane surface, by exposing at least a partial surface of the further semiconductor layer from at least the first sacrificial layer prior to deposition of the semiconductor layer. By anchoring the encapsulation structure to the further semiconductor layer in this way, a warpable region of the warpable membrane can be advantageously defined / delimited by preventing the surrounding regions of the further semiconductor layer from also warping when the membrane warps. Short description of the drawings

[0016] Further features and advantages of the present invention are explained below with reference to the figures. They show: Fig. 1 a schematic representation of a first embodiment of the micromechanical component; Fig. 2 a schematic representation of a second embodiment of the micromechanical component; and Fig. 3A to 3F are schematic representations of cross sections through intermediate products for explaining an embodiment of the manufacturing method for a micromechanical component. Embodiments of the invention

[0017] Fig. 1 shows a schematic representation of a first embodiment of the micromechanical component.

[0018] The Fig. 1 schematically illustrated micromechanical component can be used as (at least part of) a sensor, microphone and / or microspeaker device. The micromechanical component of the Fig. 1 can be used as a pressure sensor, wherein a membrane surface 10a of a warpable membrane 10 of the micromechanical component is used as a sensitive surface 10a to detect a pressure difference between a pressure p present in an external environment of the micromechanical component and a predetermined reference pressure p 0 to measure. However, it should be noted here that the micromechanical component explained below, especially its encapsulation structure 12, can be designed in a manner that is not limited to a specific sensor type.

[0019] The encapsulation structure 12 serves to protect the sensitive surface 10a of the micromechanical component and has an inner side 12a aligned with the sensitive surface 10a of the micromechanical component, which at least partially spans the sensitive surface 10a. In contrast, an outer side 12b of the encapsulation structure 12 is directed away from the inner side 12a and from the sensitive surface 10a of the micromechanical component. In addition, the encapsulation structure 12 is formed with at least one air and / or medium access opening 14 structured by the encapsulation structure, wherein the at least one air and / or medium access opening 14 extends from the inner side 12a of the encapsulation structure 12 to the outer side 12b of the encapsulation structure 12. By way of example only, the micromechanical component of the Fig. 1 only has a single air and / or medium access opening 14, which extends centrally through the capping structure 12. However, it is pointed out that the Fig. 1 outlined design of the capping structure 12 with only one air and / or medium access opening 14 is to be interpreted only as an example.

[0020] The at least one air and / or medium access opening 14 ensures, for example, that the pressure p present in the external environment of the micromechanical component is also present in a measuring volume 16 of the micromechanical component formed between the sensitive surface 10a of the micromechanical component and the inner side 12a of the encapsulation structure 12. The reference pressure p 0is enclosed in a reference volume 18, which is delimited by a membrane inner side 10b of the membrane 10 directed away from the sensitive surface 10a. At least one actuator or sensing electrode 20 is also suspended on the membrane inner side 10b of the membrane 10, which is actuated by means of a pressure difference between the pressure p and the reference pressure p 0 triggered warping of the membrane 10 is / is adjustable in relation to at least one fixedly arranged stator electrode 22. Based on an evaluation of a voltage or capacitance applied between the at least one actuator or sensing electrode 20 and the at least one stator electrode 22, the pressure difference between the pressure p and the reference pressure p 0 be determined.

[0021] As in Fig. 1, the encapsulation structure 12 has at least two web-shaped stiffening structures 24 protruding from the inner side 12a of the encapsulation structure 12. The at least two web-shaped stiffening structures 24 of the encapsulation structure 12 are aligned parallel to one another, wherein a distance between two adjacent stiffening structures 24 lies in a range between 50 nm (nanometers) and 1500 nm (nanometers). Thus, each of the stiffening structures 24 has its maximum length in a common spatial direction, which in the micromechanical component of the Fig. 1 lies in the image plane. The at least one air and / or medium access opening 14 may also extend through at least one of the stiffening structures 24.

[0022] The design of the encapsulation structure 12 described here, with its at least two web-shaped stiffening structures 24 projecting from the inner side 12a at a comparatively small distance of between 50 nm (nanometers) and 1500 nm (nanometers) from one another, advantageously increases the robustness of the encapsulation structure 12. The encapsulation structure 12 formed with the stiffening structures 24 can therefore better fulfill its function as a protective structure or protective layer for protecting the sensitive surface 10a of the micromechanical component from environmental influences, contamination, and damage. Even a conventionally relatively sensitive sensitive surface 10a, such as the one in Fig. The membrane surface 10a of the deflectable membrane 10, as shown in Figure 1, can therefore perform its function more reliably. Even if an object hits the outer surface 12b of the capping structure 12, this generally does not lead to incorrect measurements when determining the pressure difference between the pressure p and the reference pressure p 0 or damage to the sensitive surface 10a. Furthermore, the capping structure 12 also protects the sensitive surface 10a from the presence of foreign particles in the measuring volume 16 and from wetting of the sensitive surface 10a with a liquid. As can be seen from the Fig. 1, the advantageous design of the capping structure 12 with the at least two web-shaped stiffening structures 24 on its inner side 12a does not / hardly affect the detection behavior of the membrane 10.

[0023] For each of the at least two web-shaped stiffening structures 24, its width oriented perpendicular to its maximum length (perpendicular to the image plane of the Fig. 1). Preferably, an arithmetic mean of the widths of the at least two web-shaped stiffening structures 24 is at least a factor of 3, in particular at least a factor of 5, especially at least a factor of 8, greater than the distance between two adjacent stiffening structures 24. Alternatively or additionally, a height by which the stiffening structures 24 protrude on the inner side 12a of the capping structure 12 can be greater than one half of the arithmetic mean of the widths of the at least two web-shaped stiffening structures 24. The spacings and shapes of the stiffening structures 24 described here ensure advantageous robustness of the capping structure 12 formed therewith.

[0024] While the warpable membrane 10 can be formed from a first semiconductor layer 26a, for example, a polysilicon layer 26a, the at least two web-shaped stiffening structures 24 can be formed from a second semiconductor layer 26b, in particular a polysilicon layer 26b. Preferably, at least one anchoring region 28 of the encapsulation structure 12, to which the at least two web-shaped stiffening structures 24 are anchored, is optionally formed from a third semiconductor layer 26c, specifically a polysilicon layer 26c. Furthermore, at least one anchoring region 30 (formed from the second semiconductor layer 26b) can protrude from the inner side 12a of the encapsulation structure 12, which anchoring region 30 mechanically contacts the first semiconductor layer 26a such that the encapsulation structure 12 is anchored to the first semiconductor layer 26a via its at least one anchoring region 30.By forming the at least one anchoring region 30 of the capping structure 12, the surrounding regions of the first semiconductor layer 26a surrounding the membrane 10 can be "fixed" in such a way that, in the event of a warping of the membrane 10, undesirable concomitant warping movements of the surrounding regions are prevented due to their fixation by the at least one anchoring region 30. Warping behavior of the membrane 10 can thus be optimized by appropriate positioning of the at least one anchoring region 30.

[0025] For example, the micromechanical component of the Fig. 1 has a substrate 32 in which a substrate surface 32a is at least partially covered with at least one insulating layer 34a and 34b. The substrate 32 can in particular be a silicon substrate 32. The at least one insulating layer 34a and 34b can be, for example, a silicon dioxide layer 34a and / or a silicon-rich silicon nitride layer 34b. A first electrode layer 36, such as a polysilicon layer 36, is deposited on the at least one insulating layer 34a and 34b, from which at least the at least one stator electrode 22 is structured. Optionally, at least one reference counter electrode 38 and / or at least one conductor track can also be structured from the first electrode layer 36.A second electrode layer 42 can be deposited on a first sacrificial layer 40, specifically a silicon dioxide layer 40, which at least partially covers the structured first electrode layer 36, from which second electrode layer the at least one actuator or sensing electrode 20 and possibly also at least one reference electrode 44 are structured. The second electrode layer 42 can also be a polysilicon layer 42. The first semiconductor layer 26a can be deposited over a second sacrificial layer 46, e.g. a silicon dioxide layer 46, which at least partially covers the second electrode layer 42. At least one further sacrificial layer 48, specifically at least one further silicon dioxide layer 48, can be formed between the first semiconductor layer 26a and the second semiconductor layer 26b and / or between the second semiconductor layer 26b and the third semiconductor layer 26c. (For the sake of clarity, only one sacrificial layer 48 is shown in FIG. Fig. 1.) After at least partial removal of the sacrificial layers 40, 46 and 48 to expose the measuring volume 16 and the reference volume 18, the membrane 10 is in response to the pressure difference between the pressure p and the reference pressure p 0 so that the desired pressure measurements can be carried out using the micromechanical component.

[0026] As in Fig. 1, the third semiconductor layer 26c can also be used to deposit further layers, such as at least one insulating layer 50 and / or at least one passivating layer 52a and 52b and / or to fix at least one conductive layer 54.

[0027] Fig. 2 shows a schematic representation of a second embodiment of the micromechanical component.

[0028] The Fig. The micromechanical component schematically illustrated in Figure 2 differs from the previously explained embodiment only in the positioning of its at least one air and / or medium access opening 14. As in Fig. 2, several air and / or medium access openings 14 can also be structured by the capping structure 12. For example, the air and / or medium access openings 14 in the micromechanical component of the Fig. 2 at an edge region of the capping structure 12, which is kept free from the web-shaped stiffening structures 24, but is surrounded by the at least one anchoring region 30. Regarding further features and properties of the micromechanical component of the Fig. 2 and its advantages, reference is made to the embodiment explained above.

[0029] In all of the micromechanical components explained above, the distance between two adjacent stiffening structures 24 can, in particular, be in a range between 100 nm and 1000 nm. This also contributes to increasing the robustness of the respective micromechanical component.

[0030] Fig. 3A to 3F show schematic representations of cross sections through intermediate products for explaining an embodiment of the manufacturing method for a micromechanical component.

[0031] The manufacturing method described below can be used to produce a variety of different sensor, microphone and / or microspeaker devices. For example, as shown in the Fig. 3A to 3F, the method steps explained below are carried out to produce the micromechanical components described above (wherein the image plane of the Fig. 3A to 3F perpendicular to the image plane of the Fig. 1 and Fig. 2). However, it should be noted that the feasibility of the manufacturing process is not limited to the production of one of the micromechanical components explained above.

[0032] By means of the method steps described below, a capping structure 12 is arranged adjacent to a sensitive surface 10a of the subsequent micromechanical component such that an inner side 12a of the capping structure 12, which is aligned with the sensitive surface 10a of the micromechanical component, at least partially spans the sensitive surface 10a. In addition, the capping structure 12 is formed with at least two web-shaped stiffening structures 24, which protrude from the inner side 12a of the capping structure 12 and are aligned parallel to one another. Advantageously, the at least two web-shaped stiffening structures 24 are also arranged at a distance d using the method described here. 24 between two adjacent stiffening structures 24 in a range between 50 nm (nanometers) and 1500 nm (nanometers).

[0033] For example only, the encapsulation structure 12 formed by the manufacturing method described here is arranged on a first semiconductor layer 26a, from which a warpable membrane 10 is formed with the sensitive area 10a of the micromechanical component as the membrane surface 10a. The first semiconductor layer 26a can, for example, be a polysilicon layer 26a. However, the feasibility of the method steps described below is not limited to a sensitive area 10 formed as the membrane surface 10a of a warpable membrane 10.

[0034] To arrange the encapsulation structure 12 adjacent to the sensitive area 10a, the sensitive area 10a of the micromechanical component is at least partially covered with at least one first sacrificial layer 48, preferably a silicon dioxide layer 48. For later anchoring the encapsulation structure 12 to the first semiconductor layer 26a, at least one partial surface 30a of the first semiconductor layer 26a is exposed from at least the first sacrificial layer 48 before deposition of a second semiconductor layer 26b, from which at least the at least two web-shaped stiffening structures 24 protruding on the inner side 12a of the encapsulation structure 12 are formed. The at least one partial surface 30a can be located at a respective position of at least one later anchoring region 30 of the encapsulation structure 12. Fig. 3A shows the intermediate product.

[0035] Thereafter, the second semiconductor layer 26b is deposited on the at least one first sacrificial layer 48. The second semiconductor layer 26b is preferably a polysilicon layer 26b. Subsequently, at least the at least two ridge-shaped stiffening structures 24 are structured out of the second semiconductor layer 26b. This is done at least by structuring at least one trench 60 located between two later adjacent stiffening structures 24 through the second semiconductor layer 26b. To structure the at least one trench 60, an anisotropic etching step can be carried out using an etching mask (not shown). The at least one trench 60 is formed with a trench width d aligned parallel to the sensitive area 10a. 60 formed, which corresponds to the respective distance d 24 between the two later adjacent stiffening structures 24. In particular, the trench width d 60of the at least one trench 60 are selected such that the at least two web-shaped stiffening structures 24 are arranged at a distance d 24 between two adjacent stiffening structures 24 in a range between 100 nm (nanometers) and 1000 nm (nanometers). The intermediate product is in Fig. 3B.

[0036] As in Fig. 3Ca and Fig. 3Cb, after structuring the at least one trench 60 through the second semiconductor layer 26b, a second sacrificial layer 62, preferably a silicon dioxide layer 62, is deposited on the second semiconductor layer 26b, whereby the at least one trench 60 is at least partially filled with the sacrificial layer material of the second sacrificial layer 62. By means of an enlarged partial region 64 of the Fig. 3Ca is in Fig. 3Cb shows that during the deposition of the second sacrificial layer 62, a cavity 66 is enclosed in the at least one trench 60. The advantages of the at least one enclosed cavity 66 will be discussed below.

[0037] In the embodiment described here, an anchoring region 28 of the capping structure 12, to which the at least two web-shaped stiffening structures 24 are anchored, is also formed. For this purpose, at least one partial surface 68 of each of the at least two web-shaped stiffening structures 24 is first exposed from the second sacrificial layer 62. The intermediate product formed in this way is Fig. Shown in 3D.

[0038] Fig. 3E shows the intermediate product after deposition of a third semiconductor layer 26c on the second sacrificial layer 62 (and correspondingly on the exposed partial surfaces 68 of the at least two web-shaped stiffening structures 24) and structuring of at least one air and / or medium access opening 14 through at least the third semiconductor layer 26c. The third semiconductor layer 26c can also be a polysilicon layer 26c. At least the anchoring region 28 of the encapsulation structure 12 is formed in this way from at least a portion of the third semiconductor layer 26c.

[0039] The at least one air and / or medium access opening 14 is structured by the subsequent encapsulation structure 12 such that the at least one structured air and / or medium access opening 14 extends from the inner side 12a of the encapsulation structure 12 to an outer side 12b of the encapsulation structure 12 directed away from the inner side 12a of the encapsulation structure 12. Preferably, a portion of the sacrificial layer material of the second sacrificial layer 62 is exposed by means of the at least one air and / or medium access opening 14. Possibly, at least one (additional) etching access 70 can be formed together with the at least one air and / or medium access opening 14. To structure at least the at least one air and / or medium access opening 14, a further anisotropic etching step can be performed using an etching mask (not shown).The structuring of at least one air and / or medium access opening 14 of the encapsulation structure 12 can only take place relatively late in the manufacturing process of the micromechanical component, when all process steps in which particles are released and / or a liquid is sprayed have already been completed. Thus, there is no risk of particles and / or a liquid penetrating the at least one air and / or medium access opening 14 and possibly later penetrating the subsequently formed measurement volume 16 via the at least one air and / or medium access opening 14.

[0040] After structuring the at least one air and / or medium access opening 14, a gas phase etching process can be carried out to remove at least a portion of the sacrificial layer material of the sacrificial layers 48 and 62 from the measurement volume 16 (and possibly also from the reference volume 18 not shown). As in Fig. 3F, the cavities 66 facilitate and accelerate the at least partial removal of the sacrificial layer material of the at least one sacrificial layer 48 and 62 from the measuring volume 16. This reliably prevents undesired residues of the sacrificial layer material in the measuring volume 16.

[0041] In one, in Fig. 3F, optionally at least one hydrophobic material, such as fluoropolymer, can be deposited on the at least one air and / or medium access opening 14, whereby undesired penetration of liquids into the measuring volume 16 via the at least one air and / or medium access opening 14 coated with the hydrophobic material can be additionally prevented. If the reference cavity 18 (not shown) is also exposed in the gas phase etching process, a desired pressure value for the reference pressure p 0in the reference cavern 18 before the reference cavern 18 is sealed airtight and gas-tight.

[0042] Although the present invention is explained above with reference to pressure sensors, its applicability is not limited to this type of sensor. For example, the present invention can also be used for a chemical detection sensor whose sensitive surface 10a reacts to the absorption of a detection substance at the sensitive surface 10a with a detectable change in its electrical properties.

[0043] The present invention can be used for smartphones, tablets, wearables, hearables, drones, robots, games, toys, calorie counting devices, motion control devices, free fall detection devices, motion detection devices, ear detection devices, head movement detection devices, air quality detection devices, climate control devices, floor height detection devices, water level detection devices, senior care devices, indoor navigation, position tracking, flight control and / or altitude stabilization devices. QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] DE 10 2020 201 576 A1

[0002]

Claims

[1] Micromechanical component for a sensor, microphone and / or microspeaker device comprising: a capping structure (12) with an inner side (12a) of the capping structure (12) which is aligned with a sensitive surface (10a) of the micromechanical component and which at least partially spans the sensitive surface (10a) of the micromechanical component, and with at least one air and / or medium access opening (14) structured by the capping structure (12), which in each case extends from the inner side (12a) of the capping structure (12) to an outer side (12b) of the capping structure (12) directed away from the inner side (12a) of the capping structure (12); characterized by at least two web-shaped stiffening structures (24) projecting from the inner side (12a) of the capping structure (12), which are aligned parallel to one another with a distance (d 24) between two adjacent stiffening structures (24) in a range between 50 nm and 1500 nm. [2] Micromechanical component according to claim 1, wherein the distance (d 24 ) between two adjacent stiffening structures (24) lies in a range between 100 nm and 1000 nm. [3] Micromechanical component according to claim 1 or 2, wherein for each of the at least two web-shaped stiffening structures (24) its width oriented perpendicular to its respective maximum length is definable and a height by which the stiffening structures (24) protrude on the inner side (12a) of the capping structure (12) is greater than one half of the arithmetic mean of the widths of the at least two web-shaped stiffening structures (24). [4] Micromechanical component according to one of the preceding claims, wherein the sensitive surface (10a) of the micromechanical component is a membrane surface (10a) of a warpable membrane (10). [5] Micromechanical component according to claim 4, wherein the warpable membrane (10) is formed from a first semiconductor layer (26a), the at least two web-shaped stiffening structures (24) are formed from a second semiconductor layer (26b) and at least one anchoring region (28) of the encapsulation structure (12), to which the at least two web-shaped stiffening structures (24) are anchored, is formed from a third semiconductor layer (26c). [6] Manufacturing method for a micromechanical component for a sensor, microphone and / or micro loudspeaker device, comprising the steps: Arranging a capping structure (12) adjacent to a sensitive surface (10a) of the micromechanical component such that an inner side (12a) of the capping structure (12), which is aligned with the sensitive surface (10a) of the micromechanical component, at least partially spans the sensitive surface (10a) of the micromechanical component; and Structuring at least one air and / or medium access opening (14) through the capping structure (12) in such a way that the at least one structured air and / or medium access opening (14) extends from the inner side (12a) of the capping structure (12) to an outer side (12b) of the capping structure (12) directed away from the inner side (12a) of the capping structure (12); characterized by the step: Forming at least two web-shaped stiffening structures (24) which protrude on the inside (12a) of the capping structure (12) and are aligned parallel to one another with a distance (d 24 ) between two adjacent stiffening structures (24) in a range between 50 nm and 1500 nm. [7] Manufacturing method according to claim 6, wherein the at least two web-shaped stiffening structures (24) are arranged with the distance (d 24 ) between two adjacent stiffening structures (24) in a range between 100 nm and 1000 nm. [8] Manufacturing method according to claim 6 or 7, wherein the following substeps are carried out for arranging the encapsulation structure (12) adjacent to the sensitive surface (10a) of the micromechanical component and for forming the at least two web-shaped stiffening structures (24): Covering the sensitive surface (10a) of the micromechanical component at least partially with at least one first sacrificial layer (48); Depositing a semiconductor layer (26b) on the at least one first sacrificial layer (48); Structuring out at least the at least two web-shaped stiffening structures (24) from the semiconductor layer (26b) at least by structuring at least one trench (60) lying between two later adjacent stiffening structures (24) through the semiconductor layer (26b) with a trench width (d 60 ), which corresponds to the respective distance (d 24 ) between the two later adjacent stiffening structures (24); Depositing a second sacrificial layer (62) on the semiconductor layer (26b), whereby the at least one trench (60) is at least partially filled with the sacrificial layer material of the second sacrificial layer (62); and Forming at least one anchoring region (28) of the encapsulation structure (12), to which the at least two web-shaped stiffening structures (24) are anchored, by exposing at least one partial surface of each of the at least two web-shaped stiffening structures (24) from the second sacrificial layer (62) and depositing a further semiconductor layer (26c) on the second sacrificial layer (62). [9] Manufacturing method according to claim 8, wherein during the deposition of the second sacrificial layer (62) a cavity (66) is enclosed in the at least one trench (60). [10] Manufacturing method according to claim 8 or 9, wherein the encapsulation structure (12) is anchored to a further semiconductor layer (26a), from which a warpable membrane (10) with the sensitive area (10a) of the micromechanical component as the membrane surface (10a) is formed, by exposing at least a partial surface (30a) of the further semiconductor layer (26a) of at least the first sacrificial layer (48) before the deposition of the semiconductor layer (26b).

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