MEMS component

Abstract

The invention relates to a MEMS component, in particular an acoustic transducer or pressure sensor, comprising: a substrate with a cavern and a mainland, an interaction element arranged above the cavern and connected to the mainland, where the interaction element is a bending beam, a boundary layer arranged at a distance from the bending beam via connecting elements, which defines a cavity with the bending beam, and a back plate located within the cavity, which is designed as a back electrode, wherein the back plate is designed to be stiffer with respect to the boundary layer and the bending beam, at least one electrode which forms a readable capacitance with a back electrode of the back plate in order to capacitively detect a deflection of at least one of the bending beam, the connecting elements and the boundary layer, at least one stop element which is designed to be displaced into a mechanical stop, wherein the stop element in the stop has at least one fluid flow resistance, in particular a fluid seal, between the cavity on a substrate-facing side and a volume on a substrate-facing side of the cavity.

Description

[0001] The invention relates to a MEMS component, in particular an acoustic transducer or a pressure sensor. State of the art

[0002] The patent EP 2 664 058 B1 discloses a micromechanical component.

[0003] The patent EP 3 568 595 B1 discloses a micromechanical device.

[0004] The published patent application CN 1 14 885 264 A1 discloses a microphone.

[0005] The utility model CN ​​2 16 852 338 U discloses a microelectromechanical microphone.

[0006] Capacitive MEMS microphones offer particularly high performance in terms of signal-to-noise ratio, power consumption, and processability. This has led to a widespread replacement of electret microphones by MEMS microphones.

[0007] The development of dual-diaphragm MEMS microphones has further led to a significant improvement in the signal-to-noise ratio. This concept almost completely eliminates the fluidic damping between the rigid backplate and the movable dynamic pressure diaphragm. This is achieved by mounting the backplate in a vacuum area between two coupled diaphragms.

[0008] Two such dual-diaphragm microphones are disclosed in US Pat. Nos. 9,181,080 and 9,986,344. The disadvantage of this arrangement is the high mechanical rigidity of the dual-diaphragm structure, which limits its deflectability and thus its sensitivity and signal-to-noise ratio. Disclosure of the invention

[0009] The object underlying the invention is to provide a MEMS component.

[0010] This object is achieved by means of the subject matter according to the independent claim. Advantageous embodiments of the invention are the subject matter of the respective dependent subclaims.

[0011] According to a first aspect, a MEMS component is provided, in particular an acoustic transducer or a pressure sensor, comprising: a substrate with a cavern and a mainland, an interaction element arranged above the cavern and connected to the mainland, wherein the interaction element comprises a bending beam, a boundary layer arranged at a distance from the bending beam via connecting elements, which defines a cavity with the bending beam, and a back plate located within the cavity, which back plate comprises a back electrode, wherein the back plate is designed to be stiffer than the boundary layer and the bending beam, at least one electrode which forms one or more readable capacitances with the back electrode of the back plate in order to capacitively detect a deflection of at least one of the bending beam and the connecting elements and the boundary layer, at least one stop element which is designed to be displaced into a mechanical stop, wherein the stop element in the stop has at least one fluid flow resistance, in particular a fluid seal, between the cavity on a substrate-facing side and a volume on a substrate-facing side of the cavity.

[0012] The invention is based on and includes the finding that the above object is achieved by providing an interaction element which is arranged above the cavern. Furthermore, at least one stop element is provided which can be displaced into a mechanical stop. When the stop element is in the mechanical stop, this creates at least one fluid flow resistance, in particular a fluid seal, between the cavern on a side facing the substrate and a volume on a side of the cavity facing away from the substrate. In the cavity itself, for example, there is a negative pressure. The stop element is enclosed, for example, by the interaction element or by the mainland or by the substrate.

[0013] This advantageously prevents fluidic squeeze-film damping effects. In particular, gap noise during rapid differential pressure changes can be advantageously avoided. Furthermore, fluid leakage can be advantageously minimized. Furthermore, deflection can be advantageously maximized. Furthermore, the sensitivity of the component can be advantageously maximized.

[0014] Thus, in particular, a MEMS component is provided which, compared to the above-mentioned prior art, enables a small size with the same performance or a higher performance with the same size.

[0015] The abbreviation “MEMS” stands for micro-electro-mechanical system.

[0016] In one embodiment, the MEMS component comprises an actuating device which is configured to displace the stop element into the stop.

[0017] This provides the technical advantage, for example, that the stop element can be moved efficiently.

[0018] In one embodiment, the MEMS component comprises a plurality of electrodes formed and / or anchored in and / or on the bending beam and / or in and / or on the boundary layer and / or in and / or on the connecting elements in regions that are electrically insulated from one another.

[0019] These multiple electrodes, together with the backplate, form readable capacitances for capacitively detecting a corresponding deflection of at least one of the bending beam and / or the connecting elements and / or the boundary layer relative to the backplate. In other words, these electrodes, together with the backplate, form readable capacitances and thus advantageously enable differential capacitive evaluation, such as measuring a deflection of the interaction element relative to the backplate as a function of an externally applied differential pressure.

[0020] In one embodiment of the MEMS component, it is provided that the electrodes are each formed as a planar electrode or as an electrode structure projecting into the cavity.

[0021] This results in the technical advantage of achieving high capacitance surface densities and thus higher sensitivities. Planar electrodes allow for smaller gap spacing, while protruding electrode structures allow for larger electrode surfaces.

[0022] In one embodiment of the MEMS component, it is provided that the bending beam and / or the connecting elements and / or the boundary layer are each formed from an electrically non-conductive material to which the electrode structure projecting into the cavity is anchored.

[0023] This advantageously allows higher capacitance densities to be achieved and / or parasitic capacitances to be minimized, which enables miniaturization or an increase in the sensitivity of the component.

[0024] In one embodiment of the MEMS component, it is provided that the electrode structure(s) form a plurality of electrically isolated segments in order to form independently readable capacitances with the backplate.

[0025] This results in the technical advantage, for example, that independently readable capacitances are formed or shaped, so that differential capacitive evaluation is possible.

[0026] In one embodiment of the MEMS component, it is provided that the boundary layer is anchored to the bending beam via boundary walls or that the boundary layer is designed as a further bending beam and is directly connected to the mainland via an insulation layer.

[0027] These two possibilities described above advantageously enable complete stress decoupling from the substrate or from the mainland.

[0028] In one embodiment of the MEMS component, it is provided that the connecting elements are formed from an electrically insulating material.

[0029] An evaluation electronics, which can be comprised of the MEMS component, for example, ideally requires the highest possible insulation resistance between all measuring electrodes, which is efficiently promoted by providing connecting elements made of an electrically insulating material.

[0030] In one embodiment of the MEMS component, it is provided that the connecting elements comprise a spring element which is mechanically anchored on one side to the bending beam and / or to the boundary layer or which is formed in two parts, wherein the two parts only come into contact by a movement towards each other.

[0031] A one-sided connection of the connecting elements has the particular advantage of allowing greater flexibility of the bending beams and preventing torque transfer. The two-part connection, for example, has the technical advantage of creating a particularly stable connection.

[0032] For example, multiple spring elements are provided. The above statements regarding one spring element apply analogously to multiple spring elements. Thus, for example, internal spring elements can be mechanically anchored on one side to the bending beam and / or the boundary layer, so that they only come into mechanical contact when external gas pressure is applied.

[0033] In one embodiment of the MEMS component, it is provided that the peripheral boundary wall of the cavity has a laterally undulating course.

[0034] This results in the technical advantage, for example, that the edge of the interaction element is stiffened to prevent collapse.

[0035] For example, several boundary walls running essentially next to one another can be provided, so that the above statements in connection with one boundary wall also apply to several boundary walls and vice versa.

[0036] In other words, several boundary walls can be provided, which are, for example, laterally undulating and run next to each other.

[0037] In one embodiment of the MEMS component, it is provided that the back plate is at least partially formed by an electrically conductive layer and / or by a dielectric.

[0038] This results in the technical advantage, for example, that the backplate is implemented efficiently and disruptive parasitic capacitances can be minimized.

[0039] For example, the backplate may be formed directly from a conductive layer and / or a dielectric.

[0040] In one embodiment of the MEMS component, it is provided that the back plate comprises an electrically insulating carrier layer on which one or more mutually electrically insulated and electrically conductive regions are formed as back electrodes.

[0041] This results in the technical advantage, for example, that the backplate is implemented efficiently and disruptive parasitic capacitances can be minimized.

[0042] Thus, the backplate can consist of or be formed from, for example, an insulating carrier layer, for example, silicon-rich nitride with a thickness of, for example, 0.5 µm to 5 µm, and, for example, at least one electrode or a plurality of electrodes formed therein or thereon, at least partially insulated from one another, which can also be arranged in multiple layers, for example, made of polysilicon. Advantageously, leakage currents can thus be suppressed in this way, and a measuring capacitance can be designed such that the measuring capacitance can be maximized and parasitic capacitances can be minimized.

[0043] In one embodiment of the MEMS component, it is provided that the back plate has at least one flexible region at each of its anchoring regions, which is softer than a central region of the back plate.

[0044] This provides the technical advantage, for example, of ensuring efficient decoupling between the boundary walls and the back plate.

[0045] In particular, the back plate is designed in such a way that when the two coupled boundary layers, i.e. the boundary layer and the bending beam, are deflected, the back plate is deflected by less than half as much.

[0046] The deflection of the two coupled boundary layers, i.e., the boundary layer and the bending beam, is transmitted to the backplate via the boundary walls. To achieve a large signal, i.e., a large deflection between the boundary layers of the backplate, suitable mechanical decoupling at this point is particularly advantageous and therefore specifically provided.

[0047] For example, the backplate has a flexible area at the edges facing the mainland clamping point that is softer than the center of the backplate. This can be achieved, for example, by structuring the backplate at the edges facing the clamping point, by structuring springs into the backplate in this area, and / or by using or providing different materials or designs of the backplate with different thicknesses between the inner area and the edges.

[0048] In other words, according to one embodiment of the MEMS component, it is provided that the edge regions each have a spring structure in order to form the flexible region.

[0049] As already explained above, this results in the technical advantage of achieving efficient mechanical decoupling.

[0050] Thus, according to the above statements, according to one embodiment of the MEMS component, it is provided that the edge regions comprise a different material compared to the central region and / or wherein a thickness of a respective intermediate region between the edge regions and the central region is smaller than a thickness of the central region and / or wherein a tensile stress layer and / or a tensile stress structure is provided in a respective intermediate region between the edge regions and the central region, which generates or generates a tensile stress relative to the central region.

[0051] This results in the technical advantage, for example, of particularly efficient decoupling.

[0052] With regard to the tensile stress layer and the tensile stress structure described above, the following is added.

[0053] For example, a layer and / or structure is provided in an outer region of the backplate that generates a tensile stress relative to an inner region. This layer or structure is the aforementioned tensile stress layer or tensile stress structure.

[0054] This layer or structure creates a tensile stress against an inner area.

[0055] The provision of such a layer or such a structure is particularly advantageous when a thin backplate with a thickness of less than 5µm is provided. This means, for example, that the backplate has a thickness of less than 5µm.

[0056] For example, the backplate may be formed entirely or partially from tensile-stressed silicon nitride in an outer region, and from polysilicon in an inner region. This causes the polysilicon region to be subjected to tensile stress, for example, and thus to be rigid in the face of bending, which may be transferred to the backplate by clamping the backplate.

[0057] In one embodiment of the MEMS component, it is provided that the stop element is formed by one of the boundary layer, the bending beam and the back plate.

[0058] The use of these layers advantageously reduces process complexity and increases the robustness of the device.

[0059] In one embodiment of the MEMS component, it is provided that the stop element has a corrugation.

[0060] This results in the technical advantage that, for example, the flexibility of the stop element can be increased via the corrugation and / or a fluidic seal can be defined efficiently.

[0061] In one embodiment of the MEMS component, an insulating layer is provided between the stop element and the stop.

[0062] The insulation layer advantageously serves for the electrical insulation of the electrode, generally the actuating device, provided for attraction into the stop according to an exemplary embodiment.

[0063] In one embodiment of the MEMS component, it is provided that a pressure equalization hole is or are provided in the stop element and / or that a pressure equalization hole is or are provided as a cylinder recess through the cavity.

[0064] This provides the technical advantage, for example, of allowing a quasi-static differential pressure to be compensated and enabling a defined pressure equalization between the fluid volumes on either side of the interaction element. This allows a microphone signal to be independent of ambient pressure fluctuations.

[0065] In one embodiment of the MEMS component, the bending beam has one or two beam ends fixed to the mainland or to the substrate.

[0066] This provides the technical advantage, for example, that the bending beam can be efficiently fixed to the substrate.

[0067] In other words, the bending beam can have one or two beam ends fixed to the substrate. Fixing the beam ends advantageously defines the position of the bending beam and provides, for example, the necessary electrical supply line(s). Furthermore, it is advantageous and, for example, intended to anchor the beam ends to the mainland as softly as possible using a spring structure to enable impact at low electrical voltage.

[0068] In one embodiment of the MEMS component, the boundary layer is designed as a further bending beam or as a membrane element.

[0069] This provides, for example, the technical advantage that the stress decoupling of the interaction element from the substrate or mainland can be achieved efficiently.

[0070] In one embodiment of the MEMS component, it is provided that a further stop is provided on a side of the stop element opposite the first stop.

[0071] This provides the technical advantage, for example, that the interaction element can be brought into a defined deflection / position and that undesired movement beyond a deflection can be limited, so that the robustness of the component can be efficiently increased.

[0072] In one embodiment of the MEMS component, it is provided that the actuating device comprises at least one actuating electrode which is configured to generate an electrical force in order to displace the stop element into the stop.

[0073] This provides the technical advantage, for example, that the stop element can be efficiently moved into the stop and then forms a fluidic seal between the adjacent environments.

[0074] The phrase “at least one” means “one or more”.

[0075] Whenever the singular is used for the stop element, the plural should always be read as well, and vice versa. This means that multiple stop elements may be provided.

[0076] The MEMS component is, for example, an acoustic transducer or a pressure sensor. The pressure sensor is, for example, a relative pressure sensor. The acoustic transducer is, for example, a microphone.

[0077] If only “component” is written, it should always be understood that this is the MEMS component.

[0078] The acoustic transducer is, for example, a loudspeaker.

[0079] In one embodiment of the MEMS component, the stop element is comprised by the interaction element or the mainland or the substrate.

[0080] If there are several anchor elements, these are each encompassed by the interaction element or by the mainland or by the substrate.

[0081] The embodiments and exemplary embodiments described here can be combined with one another in any way, even if this is not explicitly described.

[0082] The invention is explained in more detail below using preferred embodiments. In the following: Fig. 1 a schematic cross-sectional view of a first MEMS component, Fig. 2 a schematic sectional view of the first MEMS component of the Fig. 1, Fig. 3 a schematic cross-sectional view of a second MEMS component, Fig. 4 a schematic sectional view of the second MEMS component of the Fig. 3, Fig. 5 a schematic cross-sectional view of a third MEMS component, Fig. 6 a schematic sectional view of the third MEMS component of the Fig. 5, Fig. 7 a schematic cross-sectional view of a fourth MEMS device and Fig. 8 a schematic cross-sectional view of a fifth MEMS device.

[0083] In the following, the same reference symbols may be used for the same features.

[0084] Fig. 1 shows a schematic cross-sectional view of a first MEMS device 101.

[0085] The first MEMS component 101 comprises a substrate 103 with a cavity 105 and a mainland 107. Furthermore, the first MEMS component 101 comprises an interaction element 109 arranged above the cavity 105 and connected to the mainland 107. For the sake of clarity, insofar as the interaction element 109 comprises multiple elements, the elements belonging to the interaction element 109 are enclosed by a dashed line labeled with the reference numeral 109. In other words, the interaction element 109 comprises multiple elements, which will be explained below.

[0086] The interaction element 109 comprises a bending beam 111. The interaction element 109 comprises a boundary layer 115 arranged at a distance from the bending beam 111 via connecting elements 113, which defines a cavity 117 with the bending beam 111.

[0087] Within the cavity 117, a back plate 119 is arranged, which is designed as a back electrode, wherein the back plate 119 is designed to be stiffer with respect to the boundary layer 115 and the bending beam 111.

[0088] According to the Fig. 1, the first MEMS element 101 comprises a plurality of connecting elements 113. Here, outer connecting elements 121, 125 are provided as boundary walls and inner connecting elements 123 as support elements.

[0089] This means that the connecting elements 123 are arranged between the two outer connecting elements 121, 125. The outer connecting elements 121, 125 are, for example, a boundary wall. An inner connecting element 123 is designed here as a column. While the outer connecting element 121 is mechanically connected to the back plate 119, there is no mechanical coupling of the connecting elements 123, 125 to the back plate. Rather, they can move freely in through-openings of the back plate 119.

[0090] A first electrode 126 and a second electrode 127 are shown schematically. The first electrode 126 is located on the flexural beam 111 on a side of the flexural beam facing the back plate 119. The second electrode 127 is located on the boundary layer 115 on a side of the boundary layer 115, which also faces the back plate 119.

[0091] Thus, the two electrodes 126, 127 each form a readable capacitance with the backplate 119 to capacitively detect a deflection of the cantilever 111 and the boundary layer 115 relative to the backplate. For this purpose, the backplate 119 has a first back electrode 129 and a second back electrode 131. These two back electrodes 129, 131 can also be referred to as counter electrodes.

[0092] Here, the first back electrode 129 is arranged opposite the first electrode 126 on the back plate 119. The second back electrode 131 is arranged opposite the second electrode 127 on the back plate 119.

[0093] The interaction element 109 comprises a stop element 133 which is configured to be displaced into a mechanical stop 135, wherein the stop element 133 in the stop 135 causes at least one fluid flow resistance, in particular a fluid seal, between the cavity 105 on a side facing the substrate and a volume 137 on a side of the cavity 117 facing away from the substrate.

[0094] Furthermore, a pressure equalization hole 139 is provided as a cylinder recess through the cavity 117.

[0095] Furthermore, a section line II is drawn, whereby the section representation according to the section line II in Fig. 2 is shown. In Fig. 2 a section line II-II is drawn, whereby a cross section along the section line II-II in Fig. 1 is shown.

[0096] Fig. 3 shows a schematic cross-sectional view of a second MEMS device 301.

[0097] As a difference to the first component 101 of the Fig. 1, in the second MEMS component 301, the boundary layer 115 is formed as a further bending beam 303. Therefore, the element with the reference numeral 115 is additionally identified by the reference numeral 303.

[0098] Furthermore, two spring elements 305 are provided as connecting elements 113.

[0099] Furthermore, a first stop element 307 and a second stop element 309 are provided, which can respectively strike a first stop 311 and a second stop 313.

[0100] Fig. 4 shows a schematic sectional view of the second MEMS device 301 of the Fig. 3 along line II.

[0101] Fig. 5 shows a schematic cross-sectional view of a third MEMS device 501.

[0102] The third MEMS component 501 has an electrode structure 503 suspended centrally on the connecting element 125, which is provided as the back electrode of the back plate 119.

[0103] Fig. 6 shows a schematic sectional view of the third MEMS device 501 of the Fig. 5 along line II.

[0104] Fig. 7 shows a schematic cross-sectional view of a fourth MEMS component 701. Here, it is provided that the back plate 119 has different thicknesses in order to achieve decoupling between the outer boundary walls 121 and the back plate 119.

[0105] Reference numeral 703 indicates a location of a clamping of the backplate. Reference numeral 705 indicates a flexible region in the backplate compared to a rigid region 707 of the backplate 119.

[0106] Fig.8 shows a fifth MEMS device 801, wherein the backplate 119 has an outer ring that creates a tensile stress on an inner region, thereby stiffening it to effect decoupling between the outer boundary walls 121 and the backplate 119. The prestressed region is designated by reference numeral 803. The outer ring that creates a tensile stress is designated by reference numeral 805. This outer ring 805 is the tensile stress structure identified above.

[0107] In summary, the concept described here is based in particular on the MEMS component having a flexible, free-standing interaction element, inside which a rigid backplate is located in a negative pressure region. The recess in the substrate serves as a back volume that reduces the damping effect of the back volume spring or, alternatively, as a sound access opening. Tightening the stop element against a stop, for example, using electrodes as an actuating means or as an actuating device, in particular creates a fluidic sealing effect, minimizes fluid leakage, and maximizes deflection or sensitivity. This advantageously allows the sensitivity at low frequencies to be specifically adjusted.

[0108] Electrodes can be formed or anchored in electrically isolated areas in / on the bending beam, in / on the boundary layer, and / or on connecting elements. These can be implemented as planar electrodes or as electrode structures extending into the low-pressure region of the cavity. These electrodes, together with the backplate, form readable capacitances and thus enable differential capacitive evaluation, such as measuring the deflection of the interaction element relative to the backplate as a function of an externally applied differential pressure.

[0109] The cantilever beam and the confinement layer can be formed from a non-conductive material to which conductive immersion finger electrode structures pointing into the cavity can be anchored. This measure allows, for example, higher capacitance densities to be achieved than with planar electrodes, enabling miniaturization or increased sensitivity of the component.

[0110] The electrode structures anchored to the bending beam, the boundary layer and / or connecting elements can form several electrically isolated segments and thus form independently readable capacitances.

[0111] The boundary layer can either be anchored to the flexural beam via boundary walls, or alternatively, the boundary layer itself can be designed as a flexural beam and connected directly to the mainland via an insulation layer. Both options allow complete stress decoupling from the substrate or the mainland area.

[0112] The connecting elements (outer boundary walls, inner spring elements) can be made at least partially of an insulating material. Ideally, the evaluation electronics requires the highest possible insulation resistance between all measuring electrodes, which is promoted by this design.

[0113] Internal spring elements can be mechanically anchored to the bending beam and / or the boundary layer on one side, so that they only come into mechanical contact when gas pressure is applied externally. Alternatively, the spring element can consist of two parts, which also only come into contact when gas pressure is applied externally. A one-sided connection of the support elements has the advantage of allowing greater flexibility of the bending beam and preventing torque from being transmitted.

[0114] The peripheral boundary walls may be undulating, particularly laterally. This primarily serves to provide a collapse-resistant margin.

[0115] The backplate can be formed directly from a conductive layer and / or a dielectric. Alternatively, the backplate can consist of an insulating carrier layer, such as Si-rich nitride, with a thickness of 0.5 to 5 µm, and at least one electrode or a plurality of electrodes (also in multiple layers) formed thereon, which are insulated from one another at least in some areas, made of, for example, polySi. This advantageously suppresses leakage currents and configures the measuring capacitance to maximize the measuring capacitance and minimize parasitic capacitance.

[0116] The backplate can have corresponding through-holes for connecting elements and, if necessary, immersion finger electrodes. The through-holes decouple the backplate from the movement of the flexure beams. The spring elements prevent the upper and lower boundary layers from collapsing onto the backplate. Furthermore, the boundary walls and spring elements connect the flexure beam and the boundary layer, enabling their synchronous movement.

[0117] For example, the stop element can be formed from parts of at least one of the boundary layer, the flexural beam layer, or the backplate layers and can include corrugations. The use of these layers reduces process complexity and increases the robustness of the component. Corrugations can either increase the flexibility of the stop element or define the fluidic seal.

[0118] An insulating layer may be located between the stop element and the stops. This serves to electrically insulate the actuating elements / electrodes required to pull the stop into the stop.

[0119] For an acoustic transducer (microphone, loudspeaker), either a cylindrical recess in the cavity and / or a pressure equalization hole and / or gap can be provided in the area of ​​the support seal. This is necessary to compensate for a quasi-static differential pressure and enable a defined pressure equalization between the fluid volumes on either side of the interaction element. The microphone signal is thus independent of ambient pressure fluctuations.

[0120] The bending beam(s) can have one or two beam ends fixed to the substrate. The fixation of the beam ends defines the position and provides the necessary electrical supply(s). Furthermore, it is advantageous if these are anchored to the substrate as softly as possible via a spring structure to enable the connection at low voltage.

[0121] The boundary layer can be designed as a membrane element or as a bending beam. Both variants advantageously enable stress decoupling of the interaction element from the substrate / land.

[0122] A second stop on the side of the stop element opposite the first stop may be provided to limit undesired movement beyond a deflection and to increase the robustness of the component. QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] EP 2 664 058 B1

[0002] EP 3 568 595 B1

[0003] CN 1 14 885 264 A1

[0004] CN 2 16 852 338 U

[0005] US 9,181,080

[0008] US 9,986,344

[0008]

Claims

[1] MEMS component (101, 301, 501, 701, 801), in particular acoustic transducer or pressure sensor, comprising: a substrate (103) with a cavern (105) and a mainland (107), an interaction element (109) arranged above the cavern (105) and connected to the mainland (107), wherein the interaction element (109) comprises a bending beam (111), a boundary layer (115) arranged at a distance from the bending beam (111) via connecting elements, which defines a cavity (113) with the bending beam (111), and a back plate (119) located within the cavity (113), which has a back electrode, wherein the back plate (119) is designed to be stiffer with respect to the boundary layer (115) and the bending beam (111), at least one electrode which forms a readable capacitance with the back electrode of the back plate (119) in order to capacitively detect a deflection of at least one of the bending beam (111), the connecting elements and the boundary layer (115), at least one stop element (133) which is designed to be displaced into a mechanical stop (135), wherein the stop element (133) in the stop (135) causes at least one fluid flow resistance, in particular a fluid seal, between the cavity (105) on a side facing the substrate and a volume on a side of the cavity (113) facing away from the substrate. [2] MEMS component (101, 301, 501, 701, 801) according to claim 1, comprising an actuating device which is configured to displace the stop element (133) into the stop (135). [3] MEMS component (101, 301, 501, 701, 801) according to claim 1 or 2, comprising a plurality of electrodes which are formed and / or anchored in and / or on the bending beam (111) and / or in and / or on the boundary layer (115) and / or in and / or on the connecting elements in regions which are electrically insulated from one another. [4] MEMS component (101, 301, 501, 701, 801) according to claim 3, wherein the electrodes are each formed as a planar electrode or as an immersion finger electrode structure projecting into the cavity (113). [5] MEMS component (101, 301, 501, 701, 801) according to claim 4, wherein the bending beam (111) and / or the boundary layer (115) are each formed from an electrically non-conductive material to which the electrode structures projecting into the cavity (113) are anchored. [6] MEMS component (101, 301, 501, 701, 801) according to one of claims 3 to 5, wherein the electrode structure(s) form a plurality of electrically isolated segments in order to form independently readable capacitances with the backplate (119). [7] MEMS component (101, 301, 501, 701, 801) according to one of the preceding claims, wherein the boundary layer (115) is anchored to the bending beam (111) via boundary walls or wherein the boundary layer (115) is formed as a further bending beam (111) and is connected directly to the mainland (107) via an insulation layer. [8] MEMS component (101, 301, 501, 701, 801) according to one of the preceding claims, wherein the connecting elements are formed from an electrically insulating material. [9] MEMS component (101, 301, 501, 701, 801) according to one of the preceding claims, wherein the connecting elements comprise a spring element which is mechanically anchored on one side to the bending beam (111) and / or to the boundary layer (115) or which is formed in two parts, wherein the two parts only come into contact by a movement towards one another. [10] MEMS component (101, 301, 501, 701, 801) according to one of the preceding claims, wherein the boundary wall (121) is laterally undulated. [11] MEMS component (101, 301, 501, 701, 801) according to one of the preceding claims, wherein the back plate (119) is formed by an electrically conductive layer and / or by a dielectric. [12] MEMS component (101, 301, 501, 701, 801) according to one of the preceding claims, wherein the back plate (119) comprises an electrically insulating carrier layer on which one or more mutually electrically insulated and electrically conductive regions are formed as back electrodes. [13] MEMS component (101, 301, 501, 701, 801) according to one of the preceding claims, wherein the back plate (119) has at its edge regions in each case a flexible region which is softer than a central region of the back plate (119). [14] MEMS device (101, 301, 501, 701, 801) according to claim 13, wherein the edge regions each have a spring structure to form the flexible region. [15] MEMS component (101, 301, 501, 701, 801) according to claim 13 or 14, wherein the edge regions comprise a different material compared to the central region and / or wherein a thickness of a respective intermediate region between the edge regions and the central region is smaller than a thickness of the central region and / or wherein in a respective intermediate region between the edge regions and the central region a tensile stress layer and / or a tensile stress structure (805) is provided, which generates or generates a tensile stress relative to the central region. [16] MEMS device (101, 301, 501, 701, 801) according to one of the preceding claims, wherein the stop element (133) comprises parts of one of the confinement layer (115), the bending beam (111) and the back plate (119). [17] MEMS component (101, 301, 501, 701, 801) according to one of the preceding claims, wherein the stop element (133) has a corrugation. [18] MEMS component (101, 301, 501, 701, 801) according to one of the preceding claims, wherein an insulating layer is provided between the stop element (133) and the stop (135). [19] MEMS component (101, 301, 501, 701, 801) according to one of the preceding claims, wherein a pressure equalization hole is or are provided in the stop element (133) and / or wherein a pressure equalization hole (139) is or are provided as a cylinder recess through the cavity (113). [20] MEMS component (101, 301, 501, 701, 801) according to one of the preceding claims, wherein the bending beam (111) has one or two beam ends fixed to the substrate (103). [21] MEMS component (101, 301, 501, 701, 801) according to one of the preceding claims, wherein the boundary layer (115) is formed as a further bending beam (111) or as a membrane element. [22] MEMS component (101, 301, 501, 701, 801) according to one of the preceding claims, wherein a further stop (135) is provided on a side of the stop element (133) opposite the one stop (135). [23] MEMS component (101, 301, 501, 701, 801) according to one of the preceding claims as far as dependent on claim 2, wherein the actuating device comprises at least one actuating electrode which is configured to generate an electrical force in order to displace the stop element (133) into the stop (135).

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