Production facility for the manufacture of conductor elements

Abstract

The present invention relates to a manufacturing device (12) for producing conductor elements (10a) for an electrical winding of an electrical machine, comprising a feed device (13) for advancing at least one enameled wire (10), in particular an enameled copper wire, unwound from a coil, along a feed path (90) through the manufacturing device (12), wherein a plasma cleaning station (1) for removing dirt particles from the enameled wire (10) is provided along the feed path (90), wherein the plasma cleaning station (1) has at least one plasma nozzle (2) arranged to direct a plasma stream onto the enameled wire (10), characterized in that the feed path (90) of the enameled wire (10) runs through the plasma nozzle (2) and the plasma nozzle (2) is designed to generate a plasma sheath stream around the enameled wire (10) flowing in the direction of the enameled wire (10).

Description

State of the art

[0001] The present invention relates to a manufacturing facility for producing conductor elements. Furthermore, the invention relates to a method for producing conductor elements. The conductor elements can be used in particular for electrical windings of an electrical machine.

[0002] It is known from the prior art to manufacture conductor elements from enameled wire. For this purpose, the enameled wire is stripped in places and cut at the stripped points. Stripping carries the risk that stripped material will adhere to the enameled wire. This can lead to problems during subsequent processing of an electrical machine, as such contamination can impair, for example, the welding or soldering of the conductor elements. It is therefore known in the prior art to clean the enameled wire with a plasma cleaning device after stripping. For this purpose, a plasma nozzle is used, which is directed at the enameled wire and through which the enameled wire is guided. Disclosure of the invention

[0003] The manufacturing device according to the invention enables the gentle and reliable removal of dirt particles from an enameled wire, while protecting the insulation of the enameled wire from damage. This is achieved in particular by performing the cleaning using a plasma nozzle, which generates a cleaning current around the enameled wire. Thus, the plasma current not only acts on one side of the enameled wire, but also cleans the enameled wire from all sides. This allows, in particular, the insulation residues that should actually be removed after a stripping step to be reliably removed from the enameled wire.

[0004] The production facility for producing conductor elements for an electrical winding of an electrical machine comprises a feed device and a plasma cleaning station. The feed device is designed to advance at least one enameled wire along a feed path through the production facility. The enameled wire is, in particular, unwound from a coil. The enameled wire is particularly advantageously enameled copper wire, for example, self-bonding enamel wire.

[0005] The plasma cleaning station is located along the feed path of the production facility. The plasma cleaning station serves to remove dirt particles from the enameled wire. The plasma cleaning station has at least one plasma nozzle arranged to direct a plasma stream onto the enameled wire.

[0006] The feed path of the enameled wire is intended to run through the plasma nozzle. The plasma nozzle is designed to generate a plasma sheath flow around the enameled wire, flowing in the direction of the enameled wire. This ensures that the enameled wire is impacted by the plasma sheath flow from all sides, thus reliably removing dirt particles from the enameled wire. The enameled wire can thus be reliably cleaned. The use of plasma as a cleaning agent and the formation of the plasma sheath flow through the plasma nozzle also ensures gentle cleaning, minimizing the risk of damage to the insulation of the enameled wire.

[0007] The subclaims show preferred developments of the invention.

[0008] Preferably, the plasma nozzle has a cleaning connection. A plasma can be introduced via the cleaning connection. The plasma nozzle also has at least one annular chamber connected to the cleaning connection. Furthermore, at least one wire inlet leading into the annular chamber and at least one wire outlet leading into the annular chamber are provided.

[0009] It is advantageous if a guide element for guiding the enamelled wire is arranged between the wire inlet and the wire outlet of the same enamelled wire, which guide element is formed in particular at the wire outlet and in particular projects into the annular chamber.

[0010] It is also advantageous if the annular chamber surrounds the guide element in a ring. The guide element thus shields the enameled wire from the plasma located within the annular chamber. The annular chamber extends in a nozzle-like manner to an annular gap between the wire inlet and the guide element in order to feed the plasma to the enameled wire at the annular gap for cleaning. The plasma of the annular chamber thus strikes the enameled wire at the annular gap, which in particular generates the plasma sheath flow. The nozzle-like extension of the annular chamber towards the annular gap advantageously accelerates the plasma, which reliably cleans the enameled wire. The plasma advantageously exits through the wire inlet and thus flows in particular in the opposite direction to the feed of the enameled wire.

[0011] The plasma nozzle particularly advantageously has an outer wall that defines the annular chamber. The wire inlet is formed in the outer wall. The outer wall is cup-shaped or conically tapered toward the wire inlet. In this way, the aforementioned nozzle shape is achieved simply and effectively.

[0012] In a preferred embodiment, the wire inlet has a funnel shape. The funnel shape serves in particular for introducing the enameled wire into the plasma nozzle. Alternatively or additionally, the funnel shape serves in particular for discharging the plasma escaping from the annular gap. This simplifies handling of the plasma nozzle, while also allowing for reliable cleaning of the enameled wire passing through the annular nozzle.

[0013] In an advantageous embodiment, the plasma nozzle has at least two wire inlets, at least two guide elements, and at least two annular chambers. The two annular chambers are, in particular, fluidically connected and have a common cleaning connection. Thus, the plasma nozzle can clean two enamel wires simultaneously, with each being cleaned by its own plasma sheath stream. In other words, both enamel wires are reliably exposed to plasma from all sides to ensure reliable removal of dirt particles. The common cleaning connection simplifies the supply of plasma to the plasma nozzle.

[0014] The feed device is preferably configured to advance the enameled wire along the feed path in a feed direction. The plasma nozzle is preferably configured to generate the plasma sheath flow with a flow direction opposite to the feed direction. This ensures that the plasma sheath flow effectively acts on the enameled wire, effectively cleaning the enameled wire. In particular, the opposing feed direction and flow direction ensure reliable removal of dirt particles from the enameled wire.

[0015] The plasma cleaning station advantageously has an extraction funnel. The extraction funnel, in turn, has a through-opening and an extraction opening. The feed path of the enameled wire runs through the extraction funnel. The extraction funnel serves to extract dirt particles that have been removed from the enameled wire by the plasma nozzle. For this purpose, it is particularly advantageous for the feed path to run through the through-opening. The extraction connection is arranged in particular in a side wall of the extraction funnel, wherein the extraction funnel is designed to collect dirt particles due to its funnel shape and to remove them via the extraction connection. For this purpose, a corresponding pump or similar device can be coupled to the extraction connection.The extraction funnel thus enables reliable removal and collection or disposal of the dirt particles, which in particular minimizes the risk of re-contamination of the enameled wire with the dirt particles removed by the plasma nozzle.

[0016] The extraction funnel is advantageously positioned downstream of the flow direction of the plasma sheath flow. Thus, the plasma sheath flow is directed into the extraction funnel. This leads to reliable transport of dirt particles to the extraction funnel and thus to the extraction connection.

[0017] In an advantageous embodiment, the production facility also has a stripping station arranged along the feed path. The stripping station is designed for local stripping or paint removal from the enameled wire at predetermined locations. Stripping or paint removal is carried out in particular by means of laser light. The feed device is designed to advance the enameled wire from the stripping station to the plasma cleaning station. During stripping or paint removal, there is a possibility that insulation residues may remain on the enameled wire as dirt particles. These dirt particles can be reliably removed by the plasma cleaning station. This ensures optimal stripping with the removal of the stripped material. After stripping by the stripping station and cleaning by the plasma cleaning station, the enameled wire can be easily and reliably further processed.

[0018] Particularly advantageously, the production facility has a wire-cutting station arranged along the feed path. The plasma cleaning station is preferably arranged between the wire-cutting station and the stripping station with respect to the feed path. This allows the wire-cutting station to reliably process the stripped and cleaned wire. The wire-cutting station is designed to cut the conductor elements from the enameled wire. This is done, in particular, by cutting the enameled wire in the areas of the enameled wire stripped or stripped of enamel by the stripping station. The conductor elements can then be bent to use them as U-pins or I-pins for producing a winding of an electrical machine.

[0019] The invention also relates to a method for producing conductor elements for an electrical winding of an electrical machine. The method comprises, in particular, the following steps: An enamel wire is advanced along a feed path, wherein the enamel wire is in particular unwound from a coil. The enamel wire is, in particular, an enamel copper wire. For example, the enamel wire can be a baked enamel wire. In addition, dirt particles are removed from the enamel wire. This is done, in particular, by means of a plasma cleaning station arranged along the feed path, wherein the plasma cleaning station has at least one plasma nozzle for directing a plasma stream onto the enamel wire. It is further provided that the enamel wire is advanced along the feed path through the plasma nozzle.The enameled wire is also cleaned using the plasma nozzle, which generates a plasma sheath flow around the enameled wire in the direction of the wire. This reliably cleans the enameled wire from all sides. Dirt particles are effectively removed from the enameled wire. Using the plasma cleaning station minimizes the risk of damage to the insulation of the enameled wire.

[0020] The enameled wire is advantageously advanced along the feed path in a feed direction. The plasma nozzle of the plasma cleaning station generates, in particular, the plasma sheath flow with a flow direction opposite to the feed direction. Such a counterflow ensures, in particular, that the enameled wire is reliably cleaned.

[0021] The method advantageously also comprises the steps of locally stripping or removing the enamel from the enameled wire at predetermined locations using a stripping station. The stripping or removing the enamel is carried out in particular using laser light. Furthermore, the conductor elements are advantageously cut from the enameled wire by cutting the enameled wire using a wire cutting station. The cutting takes place in the areas of the enameled wire previously stripped or removed by the stripping station. The step of locally stripping or removing the enamel is carried out in particular before the step of removing dirt particles. The step of cutting the conductor elements takes place in particular after the step of removing dirt particles. Thus, the conductor elements can be cut from the cleaned enameled wire, whereby the conductor elements are free of dirt particles and can be reliably processed further. Short description of the drawings

[0022] Embodiments of the invention will be described in detail below with reference to the accompanying drawings. In the drawing: Fig. 1 a schematic view of a manufacturing facility according to an embodiment of the invention, Fig. 2a-c show various schematic views of a plasma nozzle of a plasma cleaning station of the manufacturing device according to the embodiment of the invention, Fig. 3a-b show various views of an extraction funnel of the plasma cleaning station of the production facility according to the embodiment of the invention, and Fig. 4 a schematic view of the plasma cleaning station of the manufacturing facility according to the embodiment of the invention. Embodiments of the invention

[0023] Preferably, all identical components, elements and / or units in all figures are provided with the same reference numerals.

[0024] Fig. 1 schematically shows a production facility 12 for producing conductor elements 10a for an electrical winding of an electrical machine. For this purpose, a feed device 13, a stripping station 16, and a wire cutting station 17 are provided. The feed device 13 serves to advance at least one enameled wire 10, wherein the exemplary embodiments shown illustrate the simultaneous processing of two enameled wires 10. In this example, the feed device 13 is thus designed to advance two enameled wires 10 along a feed path 90 through the production facility 12.

[0025] The enameled wire 10 is, in particular, unwound from a coil. The enameled wire 10 is advantageously enameled copper wire. For example, the enameled wire 10 can be self-bonding enamel wire.

[0026] When the enameled wire 10 is advanced along the feed path 90, it first passes through the stripping station 16. The stripping station 16 is designed for local stripping or paint removal from the enameled wire 10 at predetermined locations. This is done, in particular, using laser light. Thus, a portion of the enamel on the enameled wire 10 is removed. In this way, the copper of the enameled copper wire can be exposed.

[0027] When the enameled wire 10 is stripped or de-lacquered, material is removed from the enameled wire 10. The stripping station 16 advantageously has a corresponding extraction system. Nevertheless, there is a possibility that dirt particles may remain on the enameled wire 10. Such dirt particles may, for example, be remnants of the insulation of the enameled wire 10.

[0028] If the enamel wire 10 is advanced further along the feed path 90 by the feed device 13, it passes from the stripping station 16 to the plasma cleaning station 1. The plasma cleaning station 1 serves to clean the enamel wire 10, reliably removing dirt particles from the enamel wire 10. The exact function of the plasma cleaning station 1 will be explained in more detail later.

[0029] If the enameled wire 10 is advanced further along the feed path 90 by the feed device 13, the enameled wire 10 moves from the plasma cleaning station 1 to the wire cutting station 17. The wire cutting station 17 serves to cut the conductor elements 10a from the enameled wire 10. This is done by cutting the enameled wire 10 in the areas of the enameled wire 10 that were stripped or de-lacquered by the stripping station 16. In this way, conductor elements 10a are created that have stripped ends. The conductor elements 10a can, in particular, be bent into a desired shape and can then be used as elements of an electrical winding of an electrical machine. Since this requires connecting the conductor elements 10a at their stripped or de-lacquered ends, the ends of the conductor elements 10a are usually welded or soldered during the production of the winding.Due to the reliable cleaning of the enameled wire 10 by the plasma cleaning station 1, these processes can be carried out safely and reliably, since the risk of contamination of the conductor elements 10a, in particular the stripped or de-coated ends of the conductor elements 10a, is minimized.

[0030] The plasma cleaning station 1 has a plasma nozzle 2 and a suction funnel 9. These two components are described below in the Fig. 2 and Fig. 3 shown in detail.

[0031] Fig. Figure 2a shows schematically the plasma nozzle 2 in a spatial representation. Fig. Figure 2b shows a schematic section through the plasma nozzle 2. Fig. Figure 2c shows a schematic sectional view of the spatial representation of the plasma nozzle 2. All of these figures are described together below.

[0032] The plasma nozzle 2 has a cleaning connection 4 through which a plasma can be introduced. Furthermore, the plasma nozzle 2 has two wire inlets 14a, 14b and two wire outlets 15a, 15b, between which a guide element 3a, 3b is arranged for passing the enamel wire 10. The plasma nozzle 2 is thus designed for the simultaneous processing of, for example, two enamel wires 10. It is understood that, according to the same principle, the plasma nozzle 2 could also have only a single wire inlet 14a and a single wire outlet 15a, as well as a larger number of wire inlets / outlets.

[0033] Ring chambers 5a, 5b extend around the guide elements 3a, 3b, which are fluidically connected to the cleaning connection 4. Thus, a first guide element 3a is arranged between a first wire inlet 14a and a first wire outlet 15a, with a first ring chamber 5a being formed annularly around the first guide element 3a. The first guide element 3a thus serves to shield the enameled wire 10 from the plasma located within the first ring chamber 5a. Analogously, the same structure is provided for a second wire inlet 14b, a second wire outlet 15b, a second guide element 3b, and a second ring chamber 5b.

[0034] Each wire inlet 14a, 14b and each wire outlet 15a, 15b leads into an annular chamber 5a, 5b. Between the wire inlet (14a, 14b) and the wire outlet (15a, 15b) of the same enameled wire 10, a guide element 3a, 3b is arranged for guiding the enameled wire 10. The guide element is formed in particular at the wire outlet 15a, 15b and projects into the annular chamber 5a, 5b.

[0035] The annular chambers 5a, 5b extend in a nozzle-like manner to a respective annular gap 6a, 6b between the respective wire inlet 14a, 14b and the respective guide element 3a, 3b. At the annular gap 6a, 6b, the plasma from the annular chamber 5a, 5b can thus be fed to the enameled wire 10 for cleaning. Due to the annular design of the annular chamber 5a, 5b, the plasma is fed to the enameled wire 10 from all sides. The feed path 90 of the enameled wire 10 thus runs through the plasma nozzle 2. The plasma nozzle generates a plasma sheath flow around the enameled wire 10, flowing in the direction of the enameled wire 10. This leads to effective and reliable cleaning of the enameled wire 10.

[0036] The annular chambers 5a, 5b extend in a nozzle-like manner to the respective annular gaps 6a, 6b. This is achieved in particular by the plasma nozzle 2 having an outer wall 7 delimiting the annular chambers 5a, 5b, wherein the wire inlets 14a, 14b are formed in the outer wall. The outer wall is in each case cup-shaped or conically tapered towards the wire inlet 14a, 14b. In this way, in particular, a nozzle shape is achieved so that the plasma is accelerated within the annular chamber 5a, 5b up to the annular gap 6a, 6b. This allows the plasma to act effectively on the enameled wire 10 to clean it.

[0037] The wire inlet 14a, 14b each has a funnel shape 8a, 8b. This funnel shape 8a, 8b is advantageously designed for introducing the respective enameled wire 10 into the plasma nozzle 2 and for discharging the plasma emerging from the annular gap 6a, 6b. The plasma nozzle 2 is manufactured in particular by a layer-by-layer manufacturing process, e.g., 3D printing.

[0038] The plasma cleaning station 1 also has the suction funnel 9, which is shown schematically in Fig. 3a and Fig. 3b is shown. Fig. Figure 3a shows a schematic spatial representation of the suction funnel 9. Fig. 3b shows a schematic sectional view through the suction funnel 9.

[0039] The extraction funnel 9 has a through-opening 11a, 11b. The feed path 90 of the enameled wires 10 runs through each of these through-openings 11a, 11b. The through-openings 11a, 11b are formed at a point of greatest tapering of the funnel shape of the extraction funnel 9. Furthermore, the extraction funnel 9 has an extraction connection 11c in its side wall near the through-openings 11a, 11b. Dirt particles removed by the plasma nozzle 2 can be extracted via the extraction connection 11c. This ensures reliable removal of the dirt particles.

[0040] Fig. Figure 4 shows a schematic representation of the extraction funnel 9 and the plasma nozzle 2 of the plasma cleaning station 1. The enamel wires 10 are advanced along the feed path 90 in a feed direction 200. The feed direction 200 is in Fig. 4 shown in dashed lines. By means of the plasma nozzle 2, the plasma sheath flow is generated along a flow direction 100, wherein the flow direction 100 in Fig. 4 is shown by a dash-dot representation. The flow direction 100 results from the direction of action 100a, with which the plasma is directed from the annular chambers 5a, 5b onto the respective enameled wire 10. The feed direction 200 and the flow direction 100 are oriented in opposite directions. This leads to effective cleaning of the enameled wires 10.

[0041] Furthermore, the extraction funnel 9 is arranged downstream of the flow direction 100. This means that the enamel wires 10, when moving in the feed direction 200, first pass through the extraction funnel 9 and then through the plasma nozzle 2. Due to the opposite flow direction 100, dirt particles removed from the enamel wires 10 by the plasma nozzle 2 reliably reach the extraction funnel 9 and can be extracted via the extraction connection 11c. This effectively cleans each enamel wire 10. The risk of remaining dirt particles on the enamel wire 10 is minimized. If the enamel wire 10 is processed in further stations, such as the wire cutting station 17, a cleaned enamel wire is achieved.

Claims

[1] Manufacturing device (12) for producing conductor elements (10a) for an electrical winding of an electrical machine, - with a feed device (13) for advancing at least one enamelled wire (10), in particular an enamelled copper wire, unwound from a coil, along a feed path (90) through the production device (12), - wherein a plasma cleaning station (1) for removing dirt particles from the enamelled wire (10) is provided along the feed path (90), wherein the plasma cleaning station (1) has at least one plasma nozzle (2) arranged to direct a plasma stream onto the enamelled wire (10), characterized by , that - the feed path (90) of the enamel wire (10) runs through the plasma nozzle (2) and the plasma nozzle (2) is designed to generate a plasma sheath flow around the enamel wire (10) flowing in the direction of the enamel wire (10). [2] Manufacturing device (12) according to claim 1, characterized by that the plasma nozzle (2) - a cleaning connection (4) through which a plasma can be introduced, and - at least one annular chamber (5a, 5b) which is fluidly connected to the cleaning connection (4), and - at least one wire inlet (14a, 14b) leading into the annular chamber (5a, 5b) and at least one wire outlet (15a, 15b) leading into the annular chamber (5a, 5b). [3] Manufacturing device (12) according to claim 2, characterized by that a guide element (3a, 3b) for guiding the enamelled wire (10) is arranged between the wire inlet (14a, 14b) and the wire outlet (15a, 15b), which guide element is formed in particular at the wire outlet (15a, 15b) and projects in particular into the annular chamber (5a, 5b). [4] Manufacturing device (12) according to claim 3, characterized bythat the annular chamber (5a, 5b) surrounds the guide element (3a, 3b) in a ring shape and extends in a nozzle-like manner to an annular gap (6a, 6b) between the wire inlet (14a, 14b) and the guide element (3a, 3b) in order to supply the plasma at the annular gap (6a, 6b) to the enamelled wire (10) for cleaning. [5] Manufacturing device (12) according to one of claims 2 to 4, characterized by that the plasma nozzle (2) has an outer wall (7) which delimits the annular chamber (5a, 5b) and in which the wire inlet (14a, 14b) is formed, wherein the outer wall (7) is cup-shaped or conically tapered towards the wire inlet (14a, 14b). [6] Manufacturing device (12) according to one of claims 2 to 5, characterized by that the wire inlet (14a, 14b) has a funnel shape (8a, 8b), which is preferably designed for introducing the enameled wire (10) into the plasma nozzle (2) and for discharging the plasma emerging from the annular gap (6a, 6b). [7] Manufacturing device (12) according to one of claims 2 to 6, characterized by that the plasma nozzle (2) has at least two wire inlets (14a, 14b) and at least two guide elements (3a, 4b) and at least two annular chambers (5a, 5b), wherein the annular chambers (5a, 5b) are fluidically connected and have a common cleaning connection (4). [8] Manufacturing device (12) according to one of the preceding claims, characterized by that the feed device (13) is designed to advance the enameled wire (10) along the feed path (90) in a feed direction (200) and the plasma nozzle (2) is designed to generate the plasma sheath flow with a flow direction (100) opposite to the feed direction (200). [9] Manufacturing device (12) according to one of the preceding claims, characterized bythat the plasma cleaning station (1) has a suction funnel (9) with a through opening (11a, 11b) and a suction opening (11c), wherein the feed path (90) of the enamelled wire (10) runs through the suction funnel (9), in particular the through opening (11a, 11b), and wherein the suction connection (11c) is designed to suck away dirt particles removed by means of the plasma nozzle (2). [10] Manufacturing device (12) according to claim 9 in conjunction with claim 8, characterized by that the suction funnel (9) is arranged downstream with respect to the flow direction (100). [11] Manufacturing device (12) according to one of the preceding claims, characterized bya stripping station (16) arranged along the feed path (90) for the local stripping or de-coating of the enamel wire (10) at predetermined locations, in particular by means of laser light, wherein the feed device (13) is designed to advance the enamel wire (10) from the stripping station (16) to the plasma cleaning station (1). [12] Manufacturing device (12) according to claim 11, characterized by a wire cutting station (17) arranged along the feed path (90), wherein the plasma cleaning station (1) is arranged between the wire cutting station (17) and the stripping station (16) with respect to the feed path (90), and wherein the wire cutting station (17) is designed to cut the conductor elements (10a) from the enamel wire (10) by cutting the enamel wire (10) in the areas of the enamel wire (10) stripped or de-insulated by the stripping station (16). [13] Method for producing conductor elements (10a) for an electrical winding of an electrical machine, comprising the steps: - advancing at least one enameled wire (10), in particular an enameled copper wire, unwound from a coil, along a feed path (90), and - removing dirt particles from the enameled wire (10) by means of a plasma cleaning station (1) arranged along the feed path (90), wherein the plasma cleaning station (1) has at least one plasma nozzle (2) for directing a plasma stream onto the enameled wire (10), characterized by , that - the enamel wire (10) is advanced along the feed path (90) through the plasma nozzle (2) and a plasma sheath flow flowing in the direction of the enamel wire (10) is generated around the enamel wire (10) by means of the plasma nozzle (2). [14] Method according to claim 13, characterized bythat the enameled wire (10) is advanced along the feed path (90) in a feed direction (200) and the plasma sheath flow is generated by means of the plasma nozzle (2) with a flow direction (100) opposite to the feed direction (200). [15] Method according to claim 13 or 14, characterized by the steps - local stripping or de-coating of the enamelled wire (10) at predetermined locations by means of a stripping station (16), in particular by means of laser light, and - cutting the conductor elements (10a) from the enamelled wire (10) by cutting the enamelled wire (10) by means of a wire cutting station (17) in the areas of the enamelled wire (10) previously stripped or de-lacquered by the stripping station (16), - wherein the step of local stripping or paint removal is carried out before the step of removing dirt particles and the step of cutting off the conductor elements (10a) is carried out after the step of removing dirt particles.

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