Pin for electronic components

Abstract

The present invention relates to a pin (10) for electronic components, comprising: a contact point (12) which can be connected to a press-in hole (14) in an energy- and / or signal-conducting manner, wherein the contact point (12) has a surface (16), wherein at least a part (18) of the surface (16), starting from a first end (20) of the contact point (12), has an emission coating (22), wherein the emission coating (22) is configured to absorb a beam with a wavelength between 100 nm and 400 nm and to emit a light beam with a wavelength between 400 nm and 780 nm depending on the beam.

Description

Prior ArtThe present invention relates to a pin for electronic components, a method for producing a pin, a method for detecting the pin position, an electrical unit, a vehicle and the use of a pin.At present, there are a large number of different solutions for contacting pins at press-in holes. As a result of the increasing number of contact points and the increased cost efficiency requirement, the need for innovative and robust contact-making possibilities is constantly increasing.The steady weight reduction in the vehicle sector for reducing consumption and the increasing competition provides cost pressure, so that favorable and more efficient components for vehicles are more demanded.Disclosure of the InventionThe pin according to the invention for electronic components having the features of claim 1 has the advantage over the known ones that the position of the pin can be determined unambiguously and precisely independently of the geometric shape of the pin tip by means of a fluorescent coating. In this way, in particular, a simple, precise and cost-effective measurement of the pin in a module and / or a connection can be made possible. In this case, in particular the pin with the fluorescent coating can be configured such that, when the pin is arranged in the press-in hole, the tip of the pin protruding on the rear side of the press-in hole can be very easily checked whether the pin has been successfully pressed into the press-in hole.This is achieved according to the invention in that the pin for electronic components has a contact point. The contact point can be connected to a press-in hole in an energy- and / or signal-conducting manner, wherein the contact point has a surface, wherein at least a part of the surface has an emission coating proceeding from a first end of the contact point, wherein the emission coating is configured to absorb a beam having a wavelength between 100 nm and 400 nm and to emit a light beam having a wavelength between 400 nm and 780 nm depending on the beam.In other words, the pin can be configured such that the emission coating or fluorescent coating is arranged at the tip of the pin and can emit visible light in a dark environment when irradiated with UVA radiation, also known as black light. Thus, for the detection system, a positionally correct position of the pin in a surrounding housing or a press-in hole can be detected easily and precisely independently of the shape of the pin tip. This can be achieved in particular in that the detection can be carried out independently of the visible light emitted, since the exact center point of the pin can be determined independently of the form of the pin tip. In a further advantageous application, the pin tip can be detected in the same way if the pin has been guided through the press-in hole and protrudes on the rear side of the press-in hole. The pin can be produced in a wheel-to-wheel process or else be electroplated. The emission coating can be built up as an additional selective coating at the end of a strip-electroplating coating on the pin tips. Furthermore, the entire pin can also be provided with a fluorescent coating, provided it has sufficient electrical conductivity to be able to provide an energy- and / or signal-conducting connection to the press-in hole.The dependent claims show preferred developments of the invention.Preferably, the emission coating has an emission surface, wherein the emission coating is configured to emit the light beam over substantially the entire emission surface when at least a part of the emission surface absorbs the beam.An advantage of this embodiment is that the detection accuracy of an orientation of the pin can be significantly improved, since the contour of the pin can be significantly more easily detected by the emission of light beams over the entire emission surface.More preferably, the emission coating extends substantially completely over the pin.An advantage of this embodiment is that any manufacturing process of the pin can be simplified, in order to thus achieve higher cycle times. In this context, manufacturing tolerances in particular essentially include.Preferably, the contact point has a first extension direction, wherein the first end is arranged at a tip of the contact point along the first extension direction.An advantage of this embodiment is that as soon as the tip protrudes through the press-in hole, the required contacting between the pin and the press-in hole can be determined, since when an ultraviolet radiation having a wavelength between 100 nm and 400 nm is applied to the rear side of the press-in hole, the tip of the pin is excited to emit visible light, and successful contacting can be detected by means of a detection system via this emitted visible light.Further preferably, the contact point has a predetermined length along the first direction of extension, wherein the emission coating extends up to 25% of the first predetermined length along the first direction of extension starting from the first end, but at most up to the beginning of the contact point.An advantage of this embodiment is that the amount of fluorescent coating can be reduced, which can have a particularly positive effect on the production costs of the pin. For example, the pin has a length of approximately 5 mm, wherein the fluorescent coating extends from the first end up to 1 mm along the contact point or the surface of the contact point.Further preferably, the contact point has a second direction of extent, which is arranged substantially orthogonally to the first direction of extent, wherein the emission coating substantially surrounds the contact point along the second direction of extent.An advantage of this embodiment is that when the emission coating covers the contact pad along the second extension direction, the emitted visible light of the emission coating is generated from each direction around the contact pad, so that the detection of the emitted light can be significantly simplified.Preferably, the contact point has a second predetermined length along the second direction of extension, wherein a ratio between the first predetermined length and the second predetermined length is substantially between a 1⁄4 and 1⁄2.An advantage of this embodiment is that it could be determined experimentally that an optimum between the costs of production and the detectability of the fluorescent coating or the successful mounting of the pin can be achieved in this ratio range.The emission coating preferably has a layer thickness of less than 10 μ.An advantage of this embodiment is that the mounting process between the pin and the press-in hole is not made more difficult by the additional material thickness due to the emission coating, since in the predetermined range of less than 10 μm the application can lie within the tolerance range of such a connection.Preferably, the emissive coating comprises a temperature resistant fabric which resists at least once a short temperature load of up to 300°C.An advantage of this embodiment is that the emission coating does not dissolve during a later injection molding process, because a temperature-resistant substance can form a form- and / or substance-liquid connection. For example, the temperature-resistant substance can be a parylene or the like.Further preferably, the pin has a contact region, wherein the contact point and the contact region are formed in one piece, wherein the contact region is configured to form a connection with a semi-finished product.An advantage of this embodiment is that during the injection of the pin, the contact point does not have to be additionally mounted on the injection part, so that the manufacturing process is simplified and also becomes more cost-effective. In this case, in particular the contact region can be formed with a square surface or the like, wherein the contact point can be formed in particular in the form of a column.A further aspect of the invention relates to a method for producing a pin, which method has the following steps:providing a pin having a contact point,dipping the pin into a liquid emission coating in a basin in a predetermined position,curing of the emission coating outside the basin,wherein the emission coating is configured to absorb a beam having a wavelength between 100 nm and 400 nm and to emit a light beam having a wavelength between 400 nm and 780 nm the dependence of the beam, wherein the predetermined position is selected such that a part of the contact point is covered with the emission coating.An advantage of this embodiment is that the tip of the pin can be coated using a simple dipping method. Thus, the coating pins may be integrated into the process query for producing pins. Further preferably, the curing of the emission coating can take place in particular by means of a furnace and / or a pre-exposure apparatus depending on the respective group of groups. It can further preferably be a fluorescent substance in the emission coating, such as, for example. The binding agent may be a uranine or a water-soluble sodium salt of fluorescein. The pin can preferably also be produced by means of other production methods, such as, for example. Jet method, micro spray or the like.A further aspect of the invention relates to a method for measuring at least one pin, as described above and below, having the steps:inserting the pin into a press-in hole for forming a connection between the pin and the press-in hole,emitting a radiation having a wavelength between 100 nm and 400 nm,detecting a first image element which has an emitted light radiation with a wavelength between 400 nm and 780 nm as a function of the radiation and at least one pin,determining a contour of the pin based on the first picture element,determining an alignment of the pin with respect to the press-in hole based on the determined contour of the pin.An advantage of this embodiment is that only one detection unit is sufficient for detecting the successful connection between the pin and the press-in hole, since it is possible to detect by the emissions of the pin by means of the emission coating whether or not the connection has been formed as predetermined. In the case where the pin has been arranged in the press-in hole as predetermined, the emission coating protrudes on the rear side of the press-in hole, so that when the rear side of the press-in hole is illuminated with ultraviolet radiation, the pin emits light depending on the ultraviolet radiation. In the event that the pin has not formed a successful connection to the press-in hole, the emission coating does not protrude on the rear side of the press-in hole, so that even no emitted light can be detected. In the case that the pin has been successfully arranged in the press-in hole, the pin tip or the emission coating protrudes from the rear side of the press-in hole, so that a signal can be output which can be used to be integrated, for example, in a production line or the like.The method for measuring the pin further preferably comprises the steps of:emitting the radiation onto at least a part of the emission coating,determining the contour of the pin on the basis of an outer contour of the emission coating.An advantage of this embodiment is that when the radiation impinges on a part of the emission coating, the emission coating emits or emits rays over its entire surface, so that the pin tip is completely visible in a camera image. The outer contour of the emission coating can thus be detected in a clearly simplified manner, since it is not distorted by reflections or reflections or the like.The method for measuring further preferably has the steps:determining a second contour of a second pin based on the first picture element,determining a second alignment of the second pin with respect to the press-in hole based on the second determined contour of the pin,determining a relationship between the orientation of the pin and the second orientation of the second pin.An advantage of this embodiment is that in the case of a UV light source, a multiplicity of emission coatings can be illuminated onto a multiplicity of pins and all contours or alignments of the pins can be detected by means of a single image element. Furthermore, it is thus possible to determine relations of the alignment of the individual pins of the plurality of pins to one another. This results in massive cost advantages, since a possible breaking of the pin can be prevented, since both the position of the pin and the relation between the pins can be determined.Further preferably, the determination of the contour of the pin comprises the step:identifying the contour based on a comparison between an image point of the image element which has the light beam and a further image point of the image element which is substantially free of the light beam.An advantage of this embodiment is that the high contrast between pixels of the first pixel, which represent a light beam that was emitted by the emission coating and pixels that do not have any beams, makes it possible to identify the outer contour of the pin in a simple manner. Thus, in particular, the contour of the pin can be determined.Further preferably, the method further comprises the steps of:determining a center point of the pin based on the determined contour of the pin,determining or adjusting the determined alignment based on the determined center point of the pin.An advantage of this embodiment is that any incorrect mounting of the pin can be detected in good time, so that corresponding measures can be initiated. Based on the determined outer contour of the pin by the emission coating, a center point of the pin can be determined. Further preferably, a position of the center point can also be adapted in order thus to be able to simulate an assembly process better, for example.The method for measuring preferably has the step:outputting a signal when the detected pixel has at least one pixel with a light beam.An advantage of this embodiment is that a self-controlling system can be provided which can reduce the number of mismounts.Further preferably, the method for measuring further comprises the steps:generating a second image element, which shows an emitted light radiation with a wavelength between 400 nm and 780 nm as a function of the beam and the at least one pin, with a second detection unit,generating a third image element, which shows the press-in hole, with a third detection unit,correlating a first position of the pin in the second picture element with a second position of the press-in hole in the third picture element,forming the connection based on the correlation of the first position with the second position.An advantage of this embodiment is that a position of a relation to the camera can be detected by means of a detection unit for each of the pin and the press-in hole. Further preferably, the position between the detection unit and the third detection unit is known, so that the position of the pin relative to the press-in hole can be determined. Further preferably, when mounting the pin in the press-in hole, the respective positions of the pin and the press-in hole are taken into account on the basis of the correlation, so that the connection between the pin and the press-in hole can be formed successfully.A further aspect of the invention relates to an electronics unit which has a pin as described above and below.A further aspect relates to a vehicle which has a pin as described above and below.A further aspect relates to the connection of a pin, as described above and below, at least partially for forming an energy- and / or signal-conducting connection, in particular in an electronics unit.Brief Description of the DrawingsHereinafter, embodiments of the invention will be described in detail with reference to the accompanying drawings. In the drawing, the following is: FIGS. 1 to 2 b show a pin according to one embodiment, FIGS. 3 and 4 show an electronic unit according to one embodiment, FIG. 5 shows a pin according to an embodiment, FIG. 6 shows an electronic unit according to one embodiment, FIG. 7 shows a vehicle according to an embodiment, FIGS. 8 ato 9 show a pin according to one embodiment, FIG. 10 shows a flow chart to illustrate steps of the method for producing a pin according to one embodiment, and FIGS. 11 and 12 show a flow chart for illustrating steps of the method for measuring at least one pin according to one specific embodiment.Embodiments of the InventionAll the same components, elements and / or units are preferably provided with the same reference numerals in all the figures.FIG. 1 shows a pin 10 according to an embodiment. The pin 10 for electronic components has a contact point 12 which can be connected to a press-in hole 14 in an energy-conducting and / or signal-conducting manner, wherein the contact point 12 has a surface 16, wherein at least a part 18 of the surface 16 has an emission coating 22 starting from a first end 20 of the contact point 12, wherein the emission coating 22 is configured to absorb a beam having a wavelength between 100 Nm and 400 Nm and to emit a light beam having a wavelength between 400 Nm and 780 Nm as a function of the beam. Preferably, the emission coating 22 has an emission surface 23. Preferably, the emission coating 22 is configured to emit the light beam over substantially the entire emission surface 23 when at least a portion of the emission coating 22 absorbs the beam.Further preferably, the first end 20 of the contact surface 12 has a tip 26 of the contact point 12. In particular, the tip 26 preferably protrudes on a rear side of the press-in hole 14 when the pin 10 of the press-in hole 14 has been inserted. Further preferably, the contact surface 12 has a predetermined length 28 along the first direction of extension 24. In this case, as shown in FIG. 1, the emission coating 22 preferably extends up to 25% of the predetermined length 28 along the first direction of extent 24 starting from the first end 20, in particular along the surface 16 of the contact surface 12. Substantially orthogonal may mean a deviation of ±45° in this context. The emission coating 22 furthermore preferably encloses the contact point 12 along the second direction of extent 30. As is illustrated in FIG. 1, the emission coating 22 encloses the contact point 12 fully circumferentially, such that it is completely enclosed or covered along the second direction of extent 30. More preferably, the contact point 12 has a predetermined length 32 along the second direction of extension 30, wherein a ratio of the first predetermined length 28 and the second predetermined length 32 is substantially between 1 / 4 and 1 / 2. Further preferably, the pin 10 has a contact region 34. In this case, the contact region 34 can be introduced in particular into a semi-finished product or the like and thus form a connection with the semi-finished product. In this case, the contact point 12 of the contact region 34 can be formed in particular in one piece.FIG. 2 ashows a pin 10 according to an embodiment. In FIG. 2 a, the pin 10 is preferably introduced into a liquid emission coating 22 in a basin 102 in a predetermined position 104. With the predetermined position 104, a degree of coating can be adjusted on the pin 10 by means of the emission coating 22. Further preferably, a plurality 108 of pins 10 can also be arranged in a stamped part or the like, wherein the stamped part is introduced at least temporarily into the basin 102, in order thus to coat a plurality of pins 10.FIG. 2 b shows a pin 10 according to an embodiment. In this case, the pin 10 is arranged outside the basin 102. As can be seen in FIG. 2 b, all of the pins 10 of the plurality 108 of pins 10 are provided to a certain extent with the emission coating 22 on the contact point 12. In this case, the degree of coating can be variably adjusted on the basis of the predetermined position 104 along the contact point 12.FIG. 3 shows an electronic unit 300 according to an embodiment. The electronics unit 300 has a plurality of pins 10. In this case, the pins 10 can be arranged in particular on a contact 302 or the like.FIG. 4 shows an electronic unit 300 according to an embodiment. In this case, the electronics unit 300 has, in particular, a multiplicity of pins 10. In this case, the plurality of pins 10 may be arranged along a contact 302. Each pin 10 has a contact point 12 which is at least partially covered with an emission coating 22. Further preferably, a plurality of pins may also be arranged at different locations of the electronic unit 300. Further preferably, pins 10 without an emission coating 22 can also be arranged in the electronics unit 300.FIG. 5 shows an image of a pin 10 according to an embodiment. The first part 310 of the image shows a pin 10 with a contact point 12 and an emission coating 22, which was recorded by means of a commercially available sensor. The second part 312 of the image shows a photograph of the pin 10 with the emission coating 22, wherein this image or the second part 312 of the image represents only ultraviolet rays. As can be seen well in FIG. 5, only the emission coatings 22 are visible under ultraviolet radiations and can therefore be isolated well.FIG. 6 shows an electronic unit 300 according to an embodiment. The electronics unit 300 preferably has a pin 10 as described above and below.FIG. 7 shows a vehicle 400 according to an embodiment. The vehicle 400 preferably has a pin 10 as described above and below.FIGS. 8 ato 8 e show different pins according to different embodiments. FIGS. 8 ato 8 eshow the concept for measuring the pin 10. In this case, the emission coating 22 can have an emission surface 23 which, when at least a part of the emission coating 22 is struck by ultraviolet light, essentially completely begins to fluoresce. Thus, in particular by means of a comparison between image points of an image which are dark and by means of image points which have a fluorescent image, the contour 36 of the pin 10 can be determined. Based on the contour 36, the center point 37 of the pin can subsequently be determined. Thus, in particular, an accurate determination of the pin tip can be dispensed with, since the center point 37 of the pin 10 can be deduced by determining the contour of the pin 10. As can be seen in FIGS. 8 ato 8 e, the pin 10 can have different tilts, which are at least partially ignored in the further method, however, since the contour 36 of the pin 10 can be determined with the aid of the fluorescent emission coating 22. Orientation tolerances of the pin 10 can thus be compensated for in particular during the mounting.FIG. 9 shows a pin 10 according to an embodiment. As already explained, the contour 36 of the pin 10 can be determined by the emission coating 22. Thus, the position of the pin tip 26 does not necessarily have to be determined in order to be able to introduce the pin 10 into the press-in hole 14.FIG. 10 shows a flow chart to illustrate steps of the method for manufacturing 100 for manufacturing a pin 10. Furthermore, the method 100 preferably has the step of dipping S 2 the pin 10. The method 100 preferably comprises the step of curing S 3 the emission coating 22.FIG. 11 shows a flow chart to illustrate steps of method 200 for measuring at least one pin 10 according to one specific embodiment. The method 200 preferably has the steps: introducing S 10 the pin 10, emitting S 11 a radiation, detecting S 12 a first image element, ascertaining S 13 a contour 36 and ascertaining S 14 an orientation of the pin 10.FIG. 12 shows a flow diagram for illustrating steps of method 200 measuring at least one pin 10 according to one specific embodiment. The method 200 preferably has the steps: introducing S 10 to S 14, as has already been explained with reference to FIG. 11. Further preferably, the method 200 has the steps: emitting S 15 the radiation and ascertaining S 16 the contour 36 of the pin 10. Method 200 preferably has the steps: ascertaining S 17 a second contour 40 of a second pin 10, ascertaining S 18 a second orientation of second pin 10, and ascertaining S 19 a relation. Further preferably, the method 200 comprises the step: identifying S 20 the contour 36. The method further preferably has the steps: determining S 21 a center point 37 and ascertaining and / or adapting S 22 the ascertained orientation. Preferably, the method 200 comprises the steps of: generating S 22 a second pixel, generating S 23 a third pixel, correlating S 24 a first position of the pin 10 in the second pixel with a second position of the press-in hole 14 in the third pixel, and forming S 25 the connection.

Claims

Pin (10) for electronic components, comprising: - a contact point (12) which can be connected to a press-in hole (14) in an energy-conducting and / or signal-conducting manner, - wherein the contact point (12) has a surface (16), - wherein at least a part (18) of the surface (16), starting from a first end (20) of the contact point (12), has an emission coating (22), - wherein the emission coating (22) is configured to absorb a beam having a wavelength between 100 nm and 400 nm and to emit a light beam having a wavelength between 400 nm and 780 nm as a function of the beam.The pin (10) of claim 1, wherein the emission coating (22) comprises an emission surface (23), the emission coating (22) being configured to emit the light beam over substantially the entire emission surface (23) when at least a portion of the emission coating (22) absorbs the beam.The pin (10) of any preceding claim, wherein the emissive coating (22) extends substantially entirely over the pin (10).Pin (10) according to one of the preceding claims, wherein the contact point (12) has a first direction of extension (24), - wherein the first end (20) is arranged at a tip (26) of the contact point (12) along the first direction of extension (24).The pin (10) of any preceding claim, wherein the emissive coating (22) comprises a temperature resistant fabric that resists at least once a transient thermal stress of up to 300 degrees Celsius.Pin (10) according to one of the preceding claims, wherein the pin (10) has a contact region (34), - wherein the contact point (12) and the contact region (34) are formed in one piece, - wherein the contact region (34) is configured to form a connection to a semi-finished product.Method (100) for producing a pin (10), comprising the steps of: - providing (S1) a pin (10) which has a contact point (12), - dipping (S2) the pin (10) into a liquid emission coating (22) in a basin (102) in a predetermined position (104), - curing (S3) the emission coating (22) outside the bridge (102), - wherein the emission coating (22) is configured to absorb a beam having a wavelength between 100 nm and 400 nm and to emit a light beam having a wavelength between 400 nm and 780 nm depending on the beam, - wherein the predetermined position (104) is selected such that at least a part of the contact point (12) is covered with the emission coating (22).Method (200) for measuring at least one pin (10) according to one of Claims 1 to 6, having the steps: - introducing (S10) the pin (10) into a press-in hole (14) for forming a connection between the pin (10) and the press-in hole (14), - emitting (S11) a radiation having a wavelength between 100 nm and 400 nm, - detecting (S12) a first image element which has an emitted light radiation having a wavelength between 400 nm and 780 nm as a function of the beam and the at least one pin (10), - determining (S13) a contour (36) of the pin (10) on the basis of the first image element, - determining (S14) an alignment of the pin (10) with respect to the press-in hole (14) on the basis of the determined contour (36) of the pin (10).Method (200) according to claim 7, wherein the pin (10) has an emission coating (22), further comprising the steps: - emitting (S15) the radiation onto at least a part of the emission coating (22), - determining (S16) the contour (36) of the pin (10) on the basis of an outer contour of the emission coating (22).Method (200) according to claim 9, comprising the steps of: - determining (S17) a second contour (40) of a second pin (10) based on the first picture element, - determining (S18) a second orientation of the second pin (10) to a further press-in hole (14) based on the second determined contour of the second pin (10), - determining (S19) a relation between the orientation of the pin (10) and the second orientation of the second pin (10).Method (200) according to one of claims 8 to 10, wherein the determination (S16) of the contour (36) of the pin (10) comprises the step of: - identifying (S20) the contour (36) based on a comparison between an image point of the image element which comprises the light beam and a further image point of the image element which is substantially free of the light beam.Method (200) according to claim 11, further comprising the steps of: - determining (S21) a center point (37) of the pin (10) based on the determined contour (36) of the pin (10), - determining and / or adapting (S22) the determined alignment based on the determined center point (37) of the pin (10).Method (200) according to one of claims 11 to 12, further comprising the steps of: - generating (S22) a second image element, which shows an emitted light radiation with a wavelength between 400 nm and 780 nm depending on the beam and the at least one pin (10), with a second detection unit, - generating (S23) a third image element, which shows the press-in hole (14), with a third detection unit, - correlating (S24) a first position of the pin (10) in the second image element with a second position of the press-in hole (14) in the third image element, - forming (S25) the connection on the basis of the correlation of the first position with the second position.Vehicle (400) comprising a pin (10) according to one of claims 1 to 6.Use of a pin (10) according to one of Claims 1 to 6 for at least partially forming an energy- and / or signal-conducting connection.

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