Inverters, especially with modularly arranged inverter modules

Abstract

Automotive electric drive systems often rely on converters or inverters 100 that are as simple as possible, which are intended to generate an alternating voltage, usually a multi-phase alternating voltage, from the vehicle's direct voltage source for one or more of the vehicle's drive motors. A key component for generating the alternating voltage (or alternating current) is a power switch assembly, of which there is at least one such assembly for each phase to be generated. The two capacitors 111, 113 and four switches 103, 105, 107, 109 lie stretched out in one plane, the position of the inverter 100. This means that at least two capacitors 111, 113 and at least four switches 103, 105, 107, 109 are arranged in one layer, wherein two switches 103, 105 and 107, 109 are advantageously combined to form a switch pair by a frontally mirrored longitudinal side arrangement.In the event that such an arrangement is to be implemented multiple times, the high-side and low-side switches and the zero-terminal switches can be arranged alternately multiple times.

Description

[0001] The present invention relates to an arrangement of switches of an inverter.

[0002] In other words, the present invention relates to an inverter according to the preamble of claim 1. Technical field

[0003] Automotive electric drive systems often rely on converters that are as simple as possible, designed to generate an alternating voltage, usually a multiphase alternating voltage, from the vehicle's DC voltage source for one or more of the vehicle's drive motors. Therefore, there are many systems and thus also many descriptions of multiphase two-level inverters.

[0004] Although drives with two-stage inverters are quite simple in design, they are generally equipped with higher switching losses and thus a poorer WLTP (Worldwide Harmonized Light-Duty Vehicles Test Procedure) range value than inverters that operate more complexly, e.g. because they are multi-stage inverters. State of the art

[0005] EP patent EP 3 316 461 B1 (patent holder: Power Integrations, Inc.; patent granted: December 2, 2020), which also includes family member US 10 903 774 B2, describes how many components are required to make up a half-bridge inverter module so that a half-bridge with a high-side switch and a low-side switch can actually be used to generate a sinusoidal electrical current to flow through a stator coil of a multi-phase alternating current machine. An inverter module includes at least one high-side switch (or several high-side switches), at least one low-side switch (or several high-side switches), e.g. in the form of several MOSFETs, driver components for switching the switches, constant current sources, monitoring components, communication components, sensor lines, and a computing and control unit, e.g. B. a “Digital Signal Processor” (DSP).EP 3 316 461 B1 describes a number of monitoring options, such as a faulty voltage range, overcurrent detection, temperature overshoots, and control signal monitoring. All of these components discussed therein can be combined to form, as the document puts it, a half-bridge module. All of the additional circuits and assemblies must therefore be considered in a half-bridge module layout. EP 3 316 461 B1 aims to use such a circuit to construct a multiphase 2-phase inverter (also known as a "two-level inverter").

[0006] DE 10 2017 204 561 A1 (applicant: Siemens AG; disclosure date: September 20, 2018), in contrast to EP 3 316 461 B1, addresses multi-level inverter technology and proposes arranging the switching elements, diodes, and gate driver circuits on a common circuit carrier, in particular on an IMS substrate, an FR4 substrate, or a DCB ceramic, in a multi-level inverter, as in a three-level inverter or a five-level inverter, instead of using switch modules. This keeps the line lengths between the respective gate driver circuits and the switching elements as short as possible, thereby benefiting from lower inductances, enabling the switching elements to be controlled at higher switching frequencies, and reducing switching and conduction losses. The electronic components to be installed on the common circuit carrier should preferably be SMD components.

[0007] How such electronic components, which are discussed, for example, in DE 10 2017 204 561 A1, can be manufactured as so-called leadless packages can be found in DE 10 2021 125 297 A1 (applicant: Infineon Technologies AG; disclosure date: March 30, 2023). It should be noted that DE 10 2019 133 954 B4 (patent holder: Hanon Systems; patent grant date: August 5, 2021), for example, advises against using TO-247 packages or similar packages because these packages would lead to excessive stray inductances and associated interference in the circuit.

[0008] US patent US 11 476 179 B2 (patent owner: Tesla Inc.; patent grant date: October 18, 2022) presents a transistor power module that is a block-like, flat switch equipped with contact tabs on the edges in the form of an IGBT or in the form of a MOSFET, each in a Kelvin connection, and claims (among other things) an inverter with such switches. The patent describes, for example, using the Fig. 4 and 7a - 7c show an arrangement of two switches in series (one behind the other). The entire document appears to refer exclusively to a 2-liter inverter arrangement and focuses on the installation of a heat sink with the switches.

[0009] Mounting flat, block-like switches, particularly those with edge-mounted contacts, similar to the switches discussed in US Pat. No. 11,476,179 B2, is generally easier to implement than through-hole mounting. However, inductance reduction measures, which can be considered in circuit path layouts with more complex switches, cannot be directly transferred.

[0010] The aforementioned publications are deemed to be fully incorporated into the present invention description by their naming. This is intended to avoid the need to repeatedly discuss generally known relationships between inductance, housing, conductor routing, and circuit layout. Instead, terms such as "leakage inductance," "multi-point inverter technology," and "conductor routing," particularly with a heat sink, should be considered to be defined for the present invention by reference to the publications. Task

[0011] How the electronic components of an inverter or converter are to be arranged is determined by a whole series of partly contradictory requirements regarding the arrangement of the components.

[0012] A developer or designer entrusted with such a task (for the task of "conductor routing") must, for example, consider the most efficient, easy-to-manufacture, and cost-effective arrangement of electronic components during the component placement process. Another requirement for this developer is to keep losses due to the routing of the cables as low as possible, e.g., by using the widest possible conductor tracks. The switches, as well as other electronic components, are heat sources, so special measures must be taken to prevent overheating; for example, the greatest possible distance between one heat source and the next is desirable. On the other hand, the inverter or converter should be as compact as possible.Another requirement placed on a conductor path decoupling system is a routing of the cables between the electronic components that causes the lowest possible stray inductance.

[0013] In this situation, a developer of printed circuit boards for inverters and for complete devices that are inverters is required to find an optimum in the arrangement of the electronic components for a multi-dimensional problem area. Description of the invention

[0014] The object of the invention is achieved by an inverter according to claim 1. Advantageous further developments can be found in the dependent claims.

[0015] As is well known, an inverter generates one or more alternating voltages from a direct current (DC) voltage, e.g., from a battery array (traction battery in an electrically powered vehicle), which can be applied to the stator coils of an electric motor, such as an asynchronous or synchronous motor. Such devices are also referred to as inverters. If the inverter can set three stepped voltages, or three voltage levels, the inverter can be categorized or referred to as three-level inverters. If the inverter operates with more than three voltage levels to generate the output current, the inverter can be referred to as a four-level, five-level, six-level, etc. inverter, depending on the number of voltage levels. Within an AC voltage category, such as a three-level inverter, various switching principles are known for how the inverter can be constructed.Accordingly, the name of the inverter consists of a word component for the number of voltage levels and a word component for the switching principle before the actual name component of the voltage converter, the word “inverter”.

[0016] A key component for generating alternating voltage (or current) is the power switch module, of which there is at least one for each phase to be generated. In an inverter, the power module, particularly – in inverters for multiple phases – the respective phase-generating power module, can be implemented modularly using discrete individual switches that are aligned parallel to one another and arranged – in two groups – with the same contact sides facing each other. Such an arrangement can positively influence the stray inductances, heat losses, thermal behavior, and the magnitude of parasitic capacitances of the power switch module(s).

[0017] The switching of an inverter's switches, which is often carried out at high frequency (in a frequency range of more than 1 kHz, preferably more than 10 kHz), generates losses in the switches, which are therefore advantageously placed on a heat sink. The switches can be arranged next to each other and / or one behind the other. One switch follows the next in one direction or the other. The switches, if they are installed in square housings (for example, housings of the types TO-218, TO-247 (especially TO-247-4), TO-252, TO-254, TO-257, TO-258, TO-259, TO-263 247 (especially TO-263-7), TO-267), these can be square metal housings, for example, and can be arranged with their long sides and / or their short sides next to each other. Common switches, such as switches in surface-mount flat packages (e.g.of the package types STPAK, DPAK, D2PAK, TOLL, DFN8*8, HU3PAK, PDSO-20, Power SO-10, 1206) have a long side and a short side due to their flat, elongated shape. Of the packages listed, the STPAK, TO-252, TO-263, TOLL and HU3PAK packages are particularly advantageous for semiconductor switches in inverters. All of the previously mentioned packages can be mounted on busbars, printed circuit boards or heat sinks. The surface of the busbar, the surface of the printed circuit board or the surface of the heat sink serves as a carrier for the package mounted on the carrier, e.g. E.g., one of the types STPAK, TO-252, TO-263, TOLL, HU3PAK, DPAK, D2PAK, DFN8*8, PDSO-20, Power SO-10, and 1206. It is particularly advantageous if the contact pads or contact lugs are located on the edge. Such a switch can be mounted with a flat, horizontal housing on a support such as a heat sink. The number of contact pads or contact lugs depends on the size of the device.The contact lugs depend on the internal structure of the switch; for example, four contacts may be present if the switch has a Kelvin connection. In such housing types, the switches, especially those designed discretely, can be arranged side by side with their long sides and / or their short sides. With this switch arrangement, the switches can be grouped; the switches can be arranged in a group. In other words, the switches are grouped together.

[0018] Each switch can be implemented in its own housing; such a design can also be referred to as a discrete design or with discretely implemented switches. The advantage of discretely implemented switches is the (spatial) distribution of heat losses due to the switching of each switch.

[0019] Switches with a Kelvin connection generally have lower inductances than similar switches without a Kelvin connection. The Kelvin connection is a measure to reduce the inductive effects during switching. If a Kelvin connection is to be present, the switch housing must have an additional pin of this type.

[0020] The switches can be interconnected to form a converter or an inverter with a three-level inverter. A particularly advantageous inverter type is the three-level TNPC inverter. The TNPC inverter allows for a wide frequency spectrum, allowing the switching frequency to be varied without significantly affecting the inverter's efficiency (efficiency reduction of less than five percentage points across the entire frequency spectrum of the (varying) switching frequencies at the gates or bases of the switches).

[0021] The inverter advantageously has four switches per output phase. One of the switches can be referred to as the high-side switch. One of the switches can be referred to as the low-side switch. Two of the switches can be referred to as neutral terminal switches. Consequently, the inverter has at least one high-side switch, at least one low-side switch, and at least two neutral terminal switches for each phase. Four switches are actuated, or more precisely, at different times, in order to supply a voltage to an output phase. Each output phase is generated by the interaction of up to four switches, although usually only one or two switches are active or switched on at any one time. Each output phase is tapped at four switches with which the inverter is equipped.

[0022] There are also at least two capacitors. The inverter is equipped with at least two capacitors connected in series. This allows a center potential to be formed as a relative zero point.

[0023] The switches and capacitors are arranged next to each other. The switches and capacitors are placed in a layer. This layer can also be referred to as a layer. The layer contains both the two capacitors, a first capacitor and a second capacitor, as well as the switches. The capacitors are present to create a voltage intermediate circuit in the inverter. The capacitors create a relative zero point that can be used as a potential point. All four switches, the high-side switch, the low-side switch, and the neutral terminal switches, are electrically connected to this zero point (directly and partly indirectly via another switch). The high-side switch can connect the positive intermediate circuit voltage to a phase output contact. The low-side switch can connect the negative intermediate circuit voltage to that phase output contact.The neutral terminal switches can connect the neutral point to the phase output. The switches and capacitors are located in the layer. The switches and capacitors are located in a common layer.

[0024] The zero point (also referred to as the potential point) is a connection point for one of the zero-terminal switches, which can be referred to as the first zero-terminal switch. The potential point serves as a reference potential for one of the two zero-terminal switches, specifically the first zero-terminal switch.

[0025] The high-side switch and the low-side switch are aligned with each other. The zero-terminal switches are aligned with each other and parallel to the high-side switch and the low-side switch. The zero-terminal switch and the high-side switch are arranged directly adjacent to each other. One zero-terminal switch is arranged directly adjacent to the high-side switch. The second zero-terminal switch is arranged directly adjacent to the low-side switch.

[0026] The two capacitors and the four switches are arranged in a plane, the position of the inverter. This means that at least two capacitors and at least four switches are arranged in one layer, with two switches advantageously combined into a switch pair by a frontally mirrored longitudinal arrangement.

[0027] The arrangement presented keeps the stray inductances low.

[0028] Advantageous embodiments and further developments are set out below, which, viewed individually or in combination, may also reveal inventive aspects.

[0029] The inverter has at least one phase output contact. The phase output contact is located between at least one terminal of the high-side switch, at least one terminal of the low-side switch, and at least one terminal of one of the two neutral-terminal switches. The phase output contact is placed between the three switches mentioned above. The switches are electrically connected to each other. This placement contributes to a short distance, thus low losses, and also low stray inductance.

[0030] The phase output contact is advantageously located on the switch sides facing away from the first and second capacitors. Compensating currents between capacitors and switches thus have only a minimal influence on the inductive behavior in the area of the phase output contact.

[0031] If the inverter is designed for larger currents (e.g. 300 amps), it has two zero-terminal switches between several high-side switches and between several low-side switches. On two sides, a zero-terminal switch is surrounded either by a first high-side switch and a second high-side switch, or by a first low-side switch and a second low-side switch. Viewed from one side, a high-side switch is followed by a zero-terminal switch and then another high-side switch. The sequence low-side switch, zero-terminal switch, and low-side switch can also be found when two switches of the same type, such as two high-side switches and two low-side switches, are required to switch a larger current. This makes it possible to conduct an initial current via a first switch, which, for example,is “only” 800 amperes, and to pass a second current via a second switch, which is also in the range of 800 amperes.

[0032] The inverter has lead terminals necessary for contacting. The lead terminals can be arranged so that they protrude from the layer. To contact the gates or sources of the switches, the lead terminals can protrude from the layer or the layer. Smaller currents flow through these terminals. The first derivative of the current, i.e., the current change, is therefore small. Induced voltages are kept at a low level.

[0033] The inverter is advantageously equipped with one or more heat sinks. A first conductor leads to one edge of the heat sink. A second conductor also leads to the same edge of the heat sink. The heat sink can also contribute to reducing stray inductances.

[0034] In an advantageous refinement, the inverter has its zero-terminal switches aligned parallel to the high-side switch. Advantageously, the zero-terminal switches are also aligned parallel to the low-side switch in close proximity. Ideally, a second conductor leads to the same edge of the heat sink (see above). The zero-terminal switches are routed to the edge by a second conductor. Crosstalk, parasitic capacitance, and possible stray inductances are largely avoided.

[0035] A favorable arrangement of the components is achieved through a well-thought-out layout of all components. The inverter has the first capacitor and the second capacitor arranged so that they are directly adjacent to one of the two paired zero-terminal switches and one of the two adjacent high-side and low-side switches. The capacitors are arranged behind the zero-terminal switches and the two branch switches, the high-side and low-side switches. This creates low stray inductance.

[0036] It saves space if the switches are arranged in rows on a heat sink, especially if several switches form a row flanked by additional rows. This creates multiple rows in which the switches are arranged. This space-saving arrangement also ensures short conductors and short connections, which helps keep stray inductances low.

[0037] The inverter's switches can be surface-mounted, particularly welded to copper. The contact tabs of the switches and the busbars or the inverter's conductors can establish electrical and mechanical contact by forming a welded connection between the two electrically conducting components. Such a connection between the conductive components ensures low inductance. Parasitic capacitances can thus be kept low.

[0038] Each switch can be a discrete switch. Each switch is housed in a separate housing. Each switch is installed in its own dedicated enclosure. This ensures that each enclosure has only a single heat source—the single switch within the enclosure. Depending on the expected or designed switching frequencies, the switches can be distributed and positioned on the heat sink.

[0039] A switch housing can be equipped with contact lugs along its edges. The contacts refer to a single switch in a single housing. Such an arrangement allows surface-cooled circuit breakers to be distributed on a heat sink while observing maximum permissible stray inductances.

[0040] In the inverter, individual layers are defined by the arrangement of busbar conductors. Multiple busbar conductors can be used to determine the location of a layer within the inverter. In this way, the busbar conductors also serve as positioning components for the switch arrangement. This avoids additional inductances that result from longer, more complexly routed lines.

[0041] In the inverter, at least one of the high-side switches, at least one of the low-side switches, and the two neutral-terminal switches form a phase voltage generator. The phase voltage is formed by the interaction of at least four switches. Four switches together form the phase voltage generator for one phase.

[0042] Advantageously, the inverter has a carrier plate. The carrier plate advantageously has at least one laminated busbar, and preferably even several laminated busbars.

[0043] A laminated busbar can be designed as a conductor between the capacitors. A laminated busbar can be designed as a conductor to or from one of the switches, forming an electrical connection. A busbar is often designed as a so-called rail.

[0044] A switch can be placed directly on heat sinks, which are arranged between a substrate material of the layer and each switch. This ensures good heat dissipation. The switching behavior of the switches remains consistently good. Inductance influences due to changes in switching behavior are kept to a minimum.

[0045] The arrangement of the switches in the inverter can also be described from the edge of a heat sink. When viewed from the edge of the heat sink, the switch arrangement consists of a first row of switches and a second row of switches. There are at least two rows of switches. The switches are arranged in rows.

[0046] The switches can be distributed so that high-side switches are located in the first row. It is also possible for all zero-terminal switches facing away from the potential point, preferably the zero-terminal switches referred to as second zero-terminal switches, to be located in the first row.

[0047] The other row is the second row. It is best if the second row contains low-side switches and / or all zero-terminal switches facing the potential point. Therefore, the first zero-terminal switch(es) is / are preferably located in the first row.

[0048] In such an arrangement, the high-side switches and the second neutral terminal switches are located in the first row, and the remaining switches of the inverter's TNPC arrangement are located in the second row.

[0049] Advantageously, the switches in the first row and the switches in the second row are rotated around a vertical axis of the housing. The rotation can be 180°. In such a rotated configuration, the switches face each other with the same terminals. The switches are arranged such that two adjacent switches are always aligned in the layer or position, rotated 180° to each other.

[0050] Depending on the type of switch used, e.g. whether a MOSFET or an IGBT is used, two switches arranged in a row can always be positioned opposite each other so that their emitters (in the case of IGBTs) or their source terminals (in the case of MOSFETs) are facing each other.

[0051] However, some or individual switch pairs can also be arranged in such a way that two switches located in a row, especially in a transverse row, are opposite each other with their collectors (in the case of IGBTs) or their drain connections (in the case of MOSFETs).

[0052] Advantageously, each switch is equipped with its own freewheeling diode. The freewheeling diode can be designed as a freewheeling diode integrated into the switch. In this case, each switch is equipped with its own freewheeling diode in a switch module housing. A switch also includes a freewheeling diode.

[0053] In one embodiment, all four switches in a phase can be MOSFETs. It is also possible to implement all four switches in a phase using IGBTs.

[0054] The conductor tracks of the inverter between the switches run in a layer, which can advantageously be enclosed on both sides by shielding layers of the conductor or the circuit board.

[0055] It is also possible to install shielding plates in the inverter, e.g. around the phase output contact or around an entire (power) module (or power stage) or even around several (power) modules (or power stages).

[0056] The inverter has a low-resistance lead wire connection between a switch and a capacitor. Such a lead wire connection can, in particular, have a total resistance of less than 0.1 ohms along the conductor extending from the capacitor to the switch.

[0057] It also has a particularly positive effect if the connection between a capacitor and a switch has a very low impedance. A low-impedance sheet metal connection contributes to reducing stray inductance.

[0058] A first switch pair consisting of a high-side switch and a low-side switch may be flanked by a second switch pair formed by two zero-terminal switches, wherein the two zero-terminal switches are embedded between two pairs, the first switch pair and a third switch pair consisting of a high-side switch and a low-side switch.

[0059] It is also possible, particularly in cases where the inverter is required to conduct larger currents than provided for by the component design of a single switch, to alternately arrange a switch pair consisting of a high-side switch and a low-side switch, and a switch pair consisting of two neutral-terminal switches, side by side. Switches have a maximum current load rating that is intended for a continuous current load. By connecting similar switch pairs in parallel, the current load ratings of the (power) module can be increased, even though the individual current load rating of a switch is exceeded by the total current to be provided by the inverter. In such a case, where the individual group of switches is to be implemented multiple times, the high-side and low-side switches and the neutral-terminal switches can be arranged alternately multiple times.

[0060] According to a further aspect, a (power) assembly can also be regarded as a (power) switchgear cell, which can be treated as a modular, closed, in particular shielded, assembly.

[0061] The inverter can combine four switches or group the four switches into components, forming both a high-side current loop and a low-side current loop. In both the high-side current loop and the low-side current loop, the source terminals or emitter terminals of two switches can be arranged face-to-face. This further shortens the distance between two switches, a further measure for reducing stray inductance.

[0062] The combinations and embodiments presented above can also be considered in numerous other connections and combinations.

[0063] Many of the measures, techniques and layout aspects described above result in a shortening of the distance between the switches leading to the node where the phase decoupling takes place.

[0064] In addition, a whole series of measures can be taken in accordance with the aspects outlined above to reduce, in particular, the stray inductance, but also other negative physical effects such as heat loss and thermal expansion, in a corresponding inverter, including: • mirrored pin arrangements of the semiconductor pins • Shielding plates • Kelvin contacting • Shielding layers • Equalization of the distribution of switches • Discretization of the switches • immediate proximity to and in relation to the phase voltage generation(s) • Total surface cooling of the (power) module • Alternating arrangement of zero terminal switches and high-side with low-side switches Short character description

[0065] The present invention can be understood even better if reference is made to the accompanying figures, which illustrate particularly advantageous embodiments by way of example, without limiting the present invention to these, wherein Fig. 1 shows a circuit diagram of a TNPC inverter based on its switches - neglecting other peripheral electronic components - Fig. 2 shows a placement of a 3L-TNPC inverter assembly of an inverter, Fig. 3 shows a placement of a second 3L-TNPC inverter assembly of an inverter and Fig. 4 shows a placement of a third 3L-TNPC inverter assembly of an inverter. Character description

[0066] Fig. Figure 1 shows an assembly, based on its switches 3, 5, 7, 9 and its capacitors 11, 13, which can be viewed as the core of a single-phase 3L-TNPC inverter 1 (three-point T-type neutral-point clamped inverter), i.e., as a power assembly or power switch assembly. As is well known, an inverter also includes other assemblies, such as a control group (not shown) for actuating the switches, which can be implemented by a DSP (digital signal processor), a current measurement assembly (not shown), which can include a Hall sensor, or a water cooling system (not shown).

[0067] The inverter 1 - thus reduced in its scope of representation - has a positive supply 17 and a negative supply 19, which can be obtained, for example, from a traction battery of the vehicle in which the inverter is installed or is to be installed.

[0068] The two capacitors 11, 13, which are located between the positive supply 17 and the negative supply 19, create the voltage intermediate circuit 55 with their supplies 17, 19, with the zero point 31 formed between the two capacitors 11, 13. The zero point 31 is the point to which the two switches 7, 9 (or the transistors) are "clamped."

[0069] Each switch 3, 5, 7, 9 is equipped with a freewheeling diode 67, 67 I , 67 II , 67 III equipped.

[0070] The positive supply 17 is connected via a first conductor 21, which is formed by a rail, to the first capacitor 11 and to the high-side switch 3. The negative supply 19 is connected via a third conductor 25, which is also formed by a rail, to the second capacitor 13 and to the low-side switch 5. The second conductor 23 comprises the phase output contact 15 and connects the high-side switch 3, the low-side switch 5, and a drain terminal 75 of one of the two zero-terminal switches 7, 9. The fourth conductor 27 is formed between the zero-terminal switches 7, 9, each of which has a source side 65, 65 I each of the zero-terminal switches 7, 9. The first zero-terminal switch 7 is connected via the fifth conductor 29 to the zero point 31, which lies between the capacitors 11, 13.

[0071] Due to its topology, inverter 1 has a high-side current loop 183 and a low-side current loop 185. The high-side switch 3 switches as one of the components in the high-side current loop 183. The low-side switch 5 switches as one of the components in the low-side current loop 185.

[0072] Thanks to the topology of inverter 1 as a 3L-TNPC inverter, three different voltages (positive voltage (minus a voltage drop across high-side switch 3), negative voltage (minus a voltage drop across low-side switch 5), and zero voltage of the neutral point 31 (minus a voltage drop across the neutral terminal switches 7, 9)) can be present on the phase output contact 15. The 3L-TNPC inverter 1 can be a phase voltage generation device 61.

[0073] Fig. Figure 2 shows a first layout of a 3L TNPC inverter 100 assembly with four switches 103, 105, 107, 109 equipped with integrated freewheeling diodes. Each switch 103, 105, 107, 109 has its own freewheeling diode in its housing, so that switch 103 internally corresponds to the combination of switch 3, which is a MOSFET, and freewheeling diode 67 - as shown in Fig. 1 - corresponds.

[0074] As can be seen from the layout of the power module of the 3L TNPC inverter 100, the capacitors 111, 113 are arranged on a side facing away from a phase output contact 115. One edge 153 of the heat sink 151 is the edge 153 where a second conductor 123 with the phase output contact 115 is also located.

[0075] Each of the switches 103, 105, 107, 109 is an identical, flat, square, elongated electronic component, which has a vertical axis 163, 163 I (the vertical axis of the housing). Each of the switches 103, 105, 107, 109 thus has elongated sides 133, 133', 133", 135, 135', 135", 137, 137', 139, 139'. Due to the sides 133, 133', 133", 135, 135', 135", 137, 137', 139, 139 I which are parallel or perpendicular to each other, the switches, such as the low-side switch 105 and the second zero-terminal switch 109, can be placed in a parallel orientation 141 and, such as the high-side switch 103 and the low-side switch 105, in an aligned orientation or in an aligned arrangement 157.

[0076] As a result, the switches 103, 105, 107, 109 are in a first row 181 and in a second row 181 I, i.e., in two rows. The power module has a first longitudinal row 181 and a second longitudinal row 181 I , which is formed by the arrangement and alignment of the switches 103, 105, 107, 109. The switches 103, 105, 107, 109 are arranged from row to row around their vertical housing axes 163, 163 I rotated (see the exemplary representation of the housing vertical axes 163, 163 I at switches 103, 105).

[0077] Consequently, the capacitors 111, 113 and the switches 103, 105, 107, 109 are in an aligned arrangement 157 toward the phase output contact 115. In addition, pairs of switches 103, 105 and 107, 109 are in a parallel alignment 141 to each other. The switches 103, 105 and 107, 109 are arranged in individual rows 159, 159 I . Each switch 103, 105, 107, 109 has copper pads or copper tabs 160, 160 on its edges. I , 160 II , 160 III , 160IV , 160 V , 160 VI , 160 VII , which are used to contact conductors 121, 123, 125, 127, 129. Conductors 121, 123, 125, 127, 129 are laminated busbar conductors. To ensure contact between switches 103, 105, 107, 109 (and capacitors 111, 113) and conductors 121, 123, 125, 127, 129, a welded connection 169, 169 is used. I , 169 II manufactured.

[0078] The switches 103, 105, 107, and 109 are supported by the heat sink 151. The heat sink 151 serves as a common heat sink. Thus, the switches 103, 105, 107, and 109 share a large heat sink.

[0079] The adjacent capacitors 111, 113 form a voltage intermediate circuit 155 with a zero point 131. The fifth conductor 129 is connected to the zero point 131 and establishes an electrical connection to the first zero terminal switch 107.

[0080] From the top view, which is Fig. 2, the shortening of the distances between the switches 103, 105 and 107, 109 is evident due to the favorable routing of the conductors 121, 123, 125, 127, 129.

[0081] A positive supply 117 is connected via the first conductor 121 to the flag 160 VII at the high-side switch 103, which is a drain terminal 175. The short, straight section of the first conductor 121, i.e. without kinks, bends or other bends, is shown in the view of the Fig. 2. The negative supply 119 is connected via the third conductor 125 to the flag 160 V at the low-side switch 105, which is a source terminal or the source 165 I A source 165 of the high-side switch 103 and the source 165 I of the low-side switch 105 are mirror images of each other, or one could also say vis-à-vis.

[0082] Because the switches 103, 105, 107, 109, i.e. each of the switches 103, 105, 107, 109 is equipped with a Kelvin connector 171 and not only with a pin for connecting a gate 173 (see e.g. low-side switch 105 in Fig. 2), the effects of current switching edges, especially at higher switching frequencies such as 10 kHz, and the associated inductive effects can be reduced.

[0083] The connection to the pin for connecting the gate 173 protrudes from the plane in which the switches 103, 105, 107, 109 are located. Therefore, in the Fig. In the sectional view shown in Figure 2, the conductor track (not visible in the selected illustration) to the connection of gate 173 is in-plane; it continues in a different direction (out of plane). The connection for Kelvin connector 171 also protrudes out of plane.

[0084] By means of additional shielding (see the - in Fig. By enclosing the entire power assembly of switches 103, 105, 107, 109 and their connectors or conductors 121, 123, 125, 127, 129 (shown in section in Figure 2), the disruptive stray inductance can be further reduced. If the shielding 177 or the shielding plate 177 is connected directly to the heat sink 151, the shielding 177 and the heat sink 151 each have a dual function. The heat sink 151 completes the shielding 177. The shielding 177 conducts thermal energy into and out of the heat sink 151 via its metallic surface, thus ensuring temperature equalization.

[0085] Fig. 3 shows a further embodiment of a power module (or a power assembly) with several discretely implemented switches 203, 203 I , 205, 205 I, 207, 209 to a voltage intermediate circuit 255 formed by two capacitors 211, 213 around a neutral point 231. The power module is an assembly that can be considered one of the core components of an inverter 200, which is a TNPC inverter with three voltage levels. Such an inverter 200 can also be referred to as a 3L-TNPC inverter.

[0086] In the area of the capacitors 211, 213 there are also the positive supply 217 and the negative supply 219, because the capacitors 211, 213 are, as already mentioned above, arranged to form a voltage intermediate circuit 255 between the positive supply 217 and the negative supply 219.

[0087] Based on the one phase output contact 215 in the second conductor 223, it can be seen that the inverter 200 generates a phase (voltage) generation 261 through its switches 203, 203 I , 205, 205 I, 207, 209. If the inverter 200 is to generate an alternating voltage from a direct voltage for a multi-phase motor, the inverter 200 has several times in accordance with the number of phases the six switches 203, 203 I , 205, 205 I , 207, 209. The phase output contact 215 is repeated, and there are as many phase output contacts 215 as there are phases of the vehicle's traction motor.

[0088] Because the half-bridge formed by the two high-side switches 203, 203 I and the two low-side switches 205, 205 I , a larger electrical current should flow than in the TNPC inverter module, which is in Fig. 2, the power module, which is shown in Fig. 3, two high-side switches 203, 203 I and two low-side switches 205, 205 I .

[0089] Because the high-side switch 203, 203 I occurs twice in the power assembly, the power module, there are also two first conductors 221, 221 I (which can of course also be designed as a single conductor) from the first capacitor 211 to the copper terminal or copper lug 260 VII the high-side switch 203, 203 I , actually from the positive supply 217 to the high-side switches 203, 203 I . Likewise, both low-side switches 205, 205 I to the negative supply 219 via the third conductor 225.

[0090] Because there is only one pair of switches 207, 209, which are the zero terminal switches 207, 209, the circuit according to Fig. 3 only a fourth conductor 227 and a fifth conductor 229.

[0091] The second conductor 223 connects as a busbar the high-side switches 203, 203 I , the low-side switches 205, 205 Iand the second zero terminal switch 209 for phase output contacting 215. The entire arrangement of components, such as the switches 203, 203', 205, 205', 207, 209, the capacitors 211, 213 and the conductors 221, 221 I , 223, 225, 227, 229 are combined to form a phase voltage generator 261.

[0092] The ladder 221, 221 I , 223, 225, 227, 229 touch copper flags 260, 260 I , 260 II , 260 III , 260 IV , 260 V , 260 VI , 260 VII via welded joints, such as welded joint 269, and are fixed in this way.

[0093] Due to the alignment of the pages 233 I , 233" the high-side switch 203, 203 I , pages 235, 235 I , 235 II the low-side switch 205, 205 I and pages 237, 237', 239, 239 Iof the two zero terminal switches 207, 209 results in a parallel alignment 241 and also an aligned alignment or aligned arrangement 257 of the switches 203, 203 I , 205, 205 I , 207, 209.

[0094] The switches 203, 203', 205, 205', 207, 209 are supported by a heat sink 251, so that the switches 203, 203 I , 205, 205 I , 207, 209 can also be aligned with respect to an edge 253 of the heat sink 251. The alignment relative to the edge 253 of the heat sink 251 and a parallel alignment 241 between the switches 203, 203 I , 205, 205 I , 207, 209 results in a uniform spacing between the switches 203, 203 I , 205, 205 I , 207, 209, whereby waste heat can be evenly introduced into the heat sink 251.

[0095] The current-insignificant pins for the gate terminal 273 are led out of the plane of the switches 203, 203', 205, 205', 207, 209.

[0096] The switches 203, 203', 205, 205 I , 207, 209 are in pairs in rows 259, 259 I , 259" arranged, two switches are lined up in a row. In each row 259, 259 I , 259 II there are two switches 203, 205, 207, 209, 203 I , 205 I , one of which is the two switches 203, 205, 207, 209, 203 I , 205 I by rotation around one of the two vertical axes of the housing 263, 263 I is arranged in a mirror image to the other switch. In this way, the two connections for the source 265, 265 I a pair of switches, e.g., consisting of switches 203, 205, vis-a-vis.

[0097] Advantageously, each switch 203, 203', 205, 205', 207, 209 has a Kelvin connection 271 to further reduce the effect of stray inductances.

[0098] Fig. 4 shows an arrangement of a power module with ten switches 303, 303 I , 303 II , 305, 305 I , 305 II , 307, 307 I , 309, 309 I . There are three high-side switches 303, 303 I , 303 II connected in parallel to the positive supply 317. There are three low-side switches 305, 305 I , 305 II connected in parallel to the negative supply 319.

[0099] The explanations to the Fig. 1, Fig. 2 and Fig. 3 can be found on the Fig. 4 are transferred directly, so that the Fig. 1, Fig. 2 and Fig. 3 shown objects, components and parts are numbered 100 higher each and can be renumbered from a figure with a lower figure number to a figure with a figure one higher. To avoid repetition, please refer to the figure explanations for the Fig. 1, Fig. 2 and Fig. 3 if the Fig. 4. A reader should mentally number the figures accordingly.

[0100] In addition, the following special features in connection with Fig. 4 highlighted.

[0101] Both as a node between the high-side switches 303, 303 I , 303 II , the low-side switch 305, 305 I , 305 II and one of the two to one of two switches 307, 309 and 307 I , 309 I Zero terminal switches 307, 307 connected to a group I , 309, 309 IA phase output contact 315 serves as a connection for a load.

[0102] The switches 303, 303 I , 303 II , 305, 305 I , 305 II , 307, 307', 309, 309 I are in transverse rows 379, 379 I , 379 II , 379 III , 379 IV and longitudinal rows 381, 381 I , each in pairs, arranged in the plane (see the five transverse rows 379, 379 I , 379", 379 III , 379 IV ; see the two longitudinal rows 381, 381 I ). Two switches, see for example switches 307, 309, are connected by a shaft pivoted around one of the two vertical axes 363, 363 I rotated arrangement (see Source 365, see Source 365 I ) are connected to each other via a conductor (see conductor 327) in the shortest possible way. The high-side switches 303, 303 I , 303 II and the low-side switches 305, 305 I , 305 IIare IGBTs, with their emitters (seen at the emitter terminals 366, 366 I , 366 II , 366 III ). The high-side switches 303, 303 I , 303 II and the low-side switches 305, 305 I , 305 II are combined into pairs. By pairing the switches 303, 303 I , 303 II , 305, 305 I , 305 II , 307, 307 I , 309, 309 I Particularly simple and particularly short distances between the switches 303, 303 I , 303 II , 305, 305 I , 305 II , 307, 307 I , 309, 309 I realize.

[0103] By a parallel arrangement (see arrangement 341) of several similar switches (see e.g. switches 305, 305 I , 305 II ) the inverter 300 is designed for higher currents than the nominal currents of the switches 303, 303', 303", 305, 305', 305", 307, 307', 309, 309 Idesigned.

[0104] The circuit according to Fig. 4 is a circuit consisting of MOSFETs for the zero-terminal switches 307, 307 I , 309, 309 I and IGBTs for the high-side switches 303, 303 I , 303" and the low-side switches 305, 305 I , 305 II The circuit according to Fig. 4 is a mixed circuit of switches of different semiconductor switch technologies (specifically IGBTs and MOSFETs).

[0105] There are thus several zero-terminal switch branches (made up of MOSFET pairs) and also several bridge half-branches (made up of IGBT pairs), which means that inverter 301 is designed for a higher current and a higher continuous current load.

[0106] The design options shown in the individual figures can also be combined with each other in any way.

[0107] The Fig. 2 by means of shielding housing 177 around an entire assembly of at least four switches 103, 105, 107, 109 can also be used around larger assemblies such as the one shown in Fig. 4 shown assembly of ten switches 303, 303 I , 303", 305, 305 I , 305 II , 307, 307 I , 309, 309 I If the inverter, e.g., the one in Fig. If the inverter 200 shown in Figure 3 is designed for more than one phase, the assembly consists of, for example, six switches 203, 203 I , 205, 205 I , 207, 209 accordingly. In such a case, a shielding housing such as the shielding housing 177 can be drawn around each individual (power) module as well as around modules for more than one phase, e.g., modules for three phases.

[0108] In the Fig. 2 to 4 are switches with identical housings 103, 105, 107, 109, 203, 203 I , 205, 205 I, 207, 209, 303, 303 I , 303", 305, 305 I , 305", 307, 307', 309, 309 I shown. Of course, different switches (IGBTs for the high-side switches and low-side switches; MOSFETs (Si-MOSFETs, SiC-MOSFETs, or GaN-MOSFETs) for the zero-terminal switches) can also be installed for the individual functions or at the individual circuit diagram locations, each having its own package shapes (e.g., TO-247 for the zero-terminal switches and, e.g., TO-263 for the high-side switches and the low-side switches) without deviating from interesting aspects of the present invention. List of reference symbols 1, 100, 200, 300 inverters 3, 103, 203, 203 I , 303, 303 I , 303 II High-side switch 5, 105, 205, 205 I , 305, 305 I , 305 II Low-side switch 7, 107, 207, 307, 307 IZero-terminal switch, especially first zero-terminal switch 9, 109, 209, 309, 309 I Zero terminal switch, especially second zero terminal switch 11, 111, 211, 311 capacitor, in particular first capacitor 13, 113, 213, 313 Capacitor, in particular second capacitor 15, 115, 215, 315 phase output contact 17, 117, 217, 317 positive supply 19, 119, 219, 319 negative supply 21, 121, 221, 221 I , 321, 321 I , 321 II first conductor, especially rail with positive voltage 23, 123, 223, 323 second conductor, in particular output phase conductor 25, 125, 225, 325 third conductor, especially rail with negative voltage 27, 127, 227, 327 fourth conductor, especially connector between zero terminal switch 29, 129, 229, 329, 329 I fifth conductor, especially neutral point conductor 31, 131, 231, 331 zero point, especially virtual zero point 133, 133 I , 133 II , 233 I , 233 II , 333 I , 333 II Side of the high-side switch 135, 135 I , 135 II , 235, 235 I , 235 II , 335 I , 335 II , 335 III Low-side switch side 137, 137 I , 237, 237 I , 337, 337 first side of a zero-terminal switch 139, 139 I , 239, 239 I , 339, 339 I second side of a zero-terminal switch 141, 241, 341 parallel alignment between two switches, in particular two switch housings 151, 251 heat sinks 153, 253 Edge of a heat sink 55, 155, 255 voltage intermediate circuit 157, 257, 357 aligned arrangement 159, 159 I , 259, 259 I , 259 II Row 160, 160 I , 160 II , 160 III , 160 IV , 160 V , 160 VI , 160 VII , 260, 260 I , 260 II , 260 III , 260 IV , 260 V , 260 VI , 260 VII Copper or copper flag 61, 261 Phase voltage generation 163, 163 I , 263, 263 I , 363, 363 I Housing vertical axis 65, 65 I , 165, 165 I , 265, 265 I , 365, 365 I Source or source connection or source side 366, 366 I , 366 II , 366 III Emitter or emitter terminal 67, 67 I , 67 II , 67 III Freewheeling diode 169, 169 I , 169 II , 269 welded joint 171, 271 Kelvin connectors 173, 273 Gate 75, 175 drain or drain connection 177 Shielding housing 379, 379I , 379 II , 379 III , 379 IV cross row 181, 181 I , 381, 381 I Longitudinal row 183 High-side current loop 185 Low-side current loop QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] EP 3 316 461 B1 [0005, 0006] US 10 903 774 B2

[0005] DE 10 2017 204 561 A1 [0006, 0007] DE 10 2021 125 297 A1

[0007] DE 10 2019 133 954 B4

[0007] US 11 476 179 B2 [0008, 0009]

Claims

[1] Inverters (1, 100, 200, 300), in which there are semiconductor switches (3, 5, 7, 9, 103, 105, 107, 109, 203, 203', 205, 205', 207, 209, 303, 303', 303", 305, 305', 305 II , 307, 307 I , 309, 309 I ) gives, which are arranged side by side and one behind the other on a heat sink (151, 251) to form at least one group, characterized by , that the inverter (1, 100, 200, 300) a three-point inverter (1), in particular a three-level TNPC inverter (100, 200, 300), which is equipped with at least one high-side switch (3, 103, 203, 203 I , 303, 303 I , 303 II ), with at least one low-side switch (5, 105, 205, 205 I , 305, 305 I , 305 II ) and with at least two zero terminal switches (7, 9, 107, 109, 207, 209, 307, 307 I , 309, 309I ) per output phase as one power stage and which is equipped with at least two capacitors (11, 13, 111, 113, 211, 213, 311, 313), wherein in one layer or in the layer both the two capacitors (11, 13, 111, 113, 211, 213, 311, 313) in the form of a first capacitor (11, 111, 211, 311) and in the form of a second capacitor (13, 113, 213, 313) of a voltage intermediate circuit (55, 155, 255) for producing a relative zero point (31, 131, 231, 331) as a potential point as well as all four switches (3, 5, 7, 9, 103, 105, 107, 109, 203, 203 I , 205, 205 I , 207, 209, 303, 303 I , 303 II , 305, 305 I , 305 II , 307, 307 I , 309, 309 I ), the high-side switch (3, 103, 203, 203 I , 303, 303 I , 303 II ), the low-side switch (5, 105, 205, 205 I , 305, 305 I , 305II ) and the zero terminal switches (7, 9, 107, 109, 207, 209, 307, 307 I , 309, 309 I ), via ladders (21, 23, 25, 27, 29, 121, 123, 125, 127, 129, 221, 221 I , 223, 225, 227, 229, 321, 321 I , 321 II , 323, 325, 327, 329, 329 I ) are electrically connected, wherein the potential point (31, 131, 231, 331) serves as a connection point for one of the zero terminal switches (7, 9, 107, 109, 207, 209, 307, 307 I , 309, 309 I ), in particular for a first zero terminal switch (7, 107, 207, 307, 307 I ), serves, where the high-side switch (3, 103, 203, 203 I , 303, 303 I , 303 II ) and the low-side switch (5, 105, 205, 205 I , 305, 305 I , 305 II ) aligned with each other, the zero terminal switches (7, 9, 107, 109, 207, 209, 307, 307 I , 309, 309 I) aligned with each other and parallel to the high-side switch (3, 103, 203, 203 I , 303, 303 I , 303 II ) and to the low-side switch (5, 105, 205, 205 I , 305, 305 I , 305 II ) are arranged directly adjacent. [2] Inverter (1, 100, 200, 300) according to claim 1, characterized by , that at least one phase output contact (15, 115, 215, 315) between at least one terminal of the high-side switch (3, 103, 203, 203 I , 303, 303 I , 303"), at least one terminal of the low-side switch (5, 105, 205, 205 I , 305, 305 I , 305 II ) and at least one terminal (75) of one of the two zero-terminal switches (7, 9, 107, 109, 207, 209, 307, 307 I , 309, 309 I ) and connected to the switches (3, 5, 7, 9, 103, 105, 107, 109, 203, 203 I , 205, 205 I , 207, 209, 303, 303 I , 303 II, 305, 305 I , 305 II , 307, 307 I , 309, 309 I ) is electrically connected, wherein the phase output contact (15, 115, 215, 315) is preferably placed on switch sides facing away from the first (11, 111, 211, 311) and the second capacitor (13, 113, 213, 313). [3] Inverter (200, 300) according to one of the preceding claims, characterized by that the zero terminal switches (207, 209, 307, 307 I , 309, 309 I ) on two sides (237, 237 I , 239, 239 I , 337, 337 I , 339, 339 I ) by a first high-side switch (203, 303) and by a second high-side switch (203 I , 303 I , 303 II ) and by a first low-side switch (205, 305) and a second low-side switch (205 I , 305 I , 305 II ) are framed. [4] Inverter (1, 100, 200, 300) according to one of the preceding claims, characterized by that line connections, in particular for contacting gates (173, 273) or sources of the switches (103, 105, 107, 109, 203, 203 I , 205, 205 I , 207, 209), protrude from the layer or from the layer. [5] Inverter (1, 100, 200, 300) according to one of the preceding claims, characterized by that a first leader (21, 121, 221, 221 I , 321, 321 I , 321 II ) onto an edge (153, 253) of the heat sink (151, 251). [6] Inverter (1, 100, 200, 300) according to one of claims 5, characterized by that the zero terminal switches (7, 9, 107, 109, 207, 209, 307, 307 I , 309, 309 I ) aligned parallel to the high-side switch (3, 103, 203, 203 I , 303, 303 I , 303 II ) and to the low-side switch (5, 105, 205, 205 I , 305, 305 I , 305 II) in the immediate vicinity to the same edge (153, 253) of the heat sink (151, 251) through a second conductor (23, 123, 223, 323). [7] Inverter (1, 100, 200, 300) according to one of the preceding claims, characterized by , that the first (11, 111, 211, 311) and the second capacitor (13, 113, 213, 313) immediately adjacent to one of the two paired zero-terminal switches (7, 9, 107, 109, 207, 209, 307, 307 I , 309, 309 I ) and to one of the two high-side switches (3, 103, 203, 203 I , 303, 303 I , 303") and low-side switches (5, 105, 205, 205 I , 305, 305 I , 305 II ) are arranged, where the switches (3, 5, 7, 9, 103, 105, 107, 109, 203, 203 I , 205, 205 I , 207, 209, 303, 303 I , 303 II , 305, 305 I , 305 II , 307, 307 I , 309, 309I ) are arranged in rows on a heat sink (151, 251). [8] Inverter (1, 100, 200, 300) according to one of the preceding claims, characterized by , that the switches (3, 5, 7, 9, 103, 105, 107, 109, 203, 203 I , 205, 205 I , 207, 209, 303, 303 I , 303 II , 305, 305 I , 305 II , 307, 307 I , 309, 309 I ) surface-mounted, especially copper (160, 160 I , 160 II , 160 III , 160 IV , 160 V , 160 VI , 160 VII , 260, 260 I , 260 II , 260 III , 260 IV , 260 V , 260 VI , 260 VII ) welded, preferably discreetly installed in individual housings, especially with contact lugs (160, 160 I , 160 II , 160 III , 160 IV , 160 V , 160 VI , 160VII , 260, 260 I , 260 II , 260 III , 260 IV , 260 V , 260 VI , 260 VII ) on the edges of a single housing, particularly preferred surface-cooled, Circuit breakers (3, 5, 7, 9, 103, 105, 107, 109, 203, 203 I , 205, 205 I , 207, 209, 303, 303 I , 303 II , 305, 305 I , 305 II , 307, 307 I , 309, 309 I ) are. [9] Inverter (1, 100, 200, 300) according to one of the preceding claims, characterized by that the position is determined by several busbar conductors (121, 123, 125, 127, 129, 223). [10] Inverter (1, 100, 200, 300) according to one of the preceding claims, characterized by that one of the high-side switches (3, 103, 203, 203 I , 303, 303 I , 303 II ) and one of the low-side switches (5, 105, 205, 205 I , 305, 305 I , 305 II) and the two zero terminal switches (7, 9, 107, 109, 207, 209, 307, 307 I , 309, 309 I ) form a phase voltage generator (61, 261). [11] Inverter (1, 100, 200, 300) according to one of the preceding claims, characterized by , that a carrier plate at least one laminated bus bar (21, 25, 121, 125, 221, 221 I , 225, 321, 321 I , 321 II , 325), preferably several laminated bus bars (21, 25, 121, 125, 221, 221 I , 225, 321, 321 I , 321 II , 325), has, which are particularly known as conductors (29, 129, 229, 329, 329 I ) between the capacitors (11, 13, 111, 113, 211, 213, 311, 313) and / or which are designed in particular as conductors (21, 23, 25, 27, 29, 121, 123, 125, 127, 129, 221, 221 I , 223, 225, 227, 229, 321, 321 I , 321 II , 323, 325, 327, 329, 329 I) from or to one of the switches (3, 5, 7, 9, 103, 105, 107, 109, 203, 203 I , 205, 205 I , 207, 209, 303, 303 I , 303 II , 305, 305 I , 305 II , 307, 307 I , 309, 309 I ) forms an electrical connection. [12] Inverter (1, 100, 200, 300) according to one of the preceding claims, characterized by , that the switches (3, 5, 7, 9, 103, 105, 107, 109, 203, 203 I , 205, 205 I , 207, 209, 303, 303 I , 303 II , 305, 305 I , 305 II , 307, 307 I , 309, 309 I ) are placed directly on heat sinks, which is arranged between a carrier material of the layer and a switch (3, 5, 7, 9, 103, 105, 107, 109, 203, 203 I , 205, 205 I , 207, 209, 303, 303 I , 303 II , 305, 305 I , 305 II , 307, 307 I , 309, 309 I) are arranged. [13] Inverter (100, 200, 300) according to one of claims 5 to 12, characterized by , that viewed from the edge (153, 253) of the heat sink (151, 251), there is a first row (181, 381) of switches and a second row (181 I , 381 I ) switch, wherein in particular in the first row (181, 381) switches of the type high-side switches (103, 203, 203 I , 303, 303 I , 303 II ) and / or all zero-terminal switches facing away from the potential point (31, 131, 231, 331), thus preferably second zero-terminal switches (109, 209, 309, 309 I ), and where especially in the second row (181 I , 381 I ) Low-side switch type (105, 205, 205 I , 305, 305 I , 305 II ) and / or all zero terminal switches facing the potential point, so preferably first zero terminal switches (107, 207, 307, 307 I ), condition. [14] Inverter (1, 100, 200, 300) according to claim 13, characterized by that the switches (105, 109, 305, 305 I , 305 II , 309, 309 I ) of the first row (181, 381) and the switches (103, 303, 303 I , 303 II , 107, 307, 307 I ) of the second row (181 I , 381 I ) around a vertical axis of the housing (163, 163 I , 263, 263 I , 363, 363 I ) are rotated by 180°. [15] Inverter (1, 100, 200, 300) according to one of the preceding claims, characterized by that two in a row, especially in a transverse row (379, 379 I , 379 II , 379 III , 379 IV ), switches located (303, 305; 307, 309; 303 I , 305 I ; 307 I , 309 I ; 303 II , 305 II) each with their emitters (366, 366 I , 366 II , 366 III ) or their source terminals (65, 65 I , 165, 165 I , 265, 265 I , 365, 365 I ) face each other. [16] Inverter (1, 100, 200, 300) according to one of the preceding claims, characterized by that two switches arranged in a row, in particular in a transverse row, are opposite each other with their collectors or their drain connections (75, 175). [17] Inverter (1) according to one of the preceding claims, characterized by that each switch (67, 67 I , 67 II , 67 III ) equipped with its own integrated freewheeling diode (3, 5, 7, 9) and comprising a switch module housing. [18] Inverter (1, 100, 200, 300) according to one of the preceding claims, characterized by that at least four, in particular all, switches (3, 5, 7, 9, 103, 105, 107, 109, 307, 307 I , 309, 309I ) of a phase are MOS-FETs. [19] Inverter (1, 100, 200, 300) according to one of the preceding claims, characterized by that a power stage is enclosed by a shielding plate (177). [20] Inverter (1, 100, 200, 300) according to one of the preceding claims, characterized by that between a switch (3, 5, 7, 103, 105, 107, 203, 203 I , 205, 205 I , 207, 303, 303 I , 303 II , 305, 305 I , 305 II , 307, 307 I ) and a capacitor (11, 13, 111, 113, 211, 213, 311, 313) a low-resistance lead conductor connection, in particular a lead conductor connection, which has less than 0.1 ohm total resistance along its conductor (21, 121, 221, 221 I , 321, 321 I , 321 II , 25, 125, 225, 325, 29, 129, 229, 329, 329 I ) from the capacitor (11, 13, 111, 113, 211, 213, 311, 313) to the switch (3, 5, 7, 9, 103, 105, 107, 109, 203, 203 I, 205, 205 I , 207, 209, 303, 303 I , 303 II , 305, 305 I , 305 II , 307, 307 I , 309, 309 I ) exists. [21] Inverter (200, 300) according to one of the preceding claims, characterized by , that a first pair of switches consisting of a high-side switch (203, 203 I , 303, 303 I , 303") and a low-side switch (205, 205 I , 305, 305 I , 305 II ) by a second pair of switches formed by two zero-terminal switches (207, 209, 307, 307 I , 309, 309 I ), flanked, where the two zero terminal switches (207, 209, 307, 307 I , 309, 309 I ) between two pairs, the first pair of switches and a third pair of switches, consisting of a high-side switch (203, 203 I , 303, 303 I , 303 II ) and a low-side switch (205, 205 I , 305, 305I , 305 II ) are embedded. [22] Inverter (300) according to one of the preceding claims, characterized by that a pair of switches consisting of a high-side switch (203, 203 I , 303, 303 I , 303 II ) and a low-side switch (205, 205 I , 305, 305 I , 305 II ) and a pair of two zero-terminal switches (207, 209, 307, 307 I , 309, 309 I ) are arranged alternately next to each other. [23] Inverter (1) according to one of the preceding claims, characterized by , that the four switches (3, 5, 7, 9) are components of a high-side current loop (183) and a low-side current loop (185), wherein both in the high-side current loop (183) and in the low-side current loop (183) emitter terminals (75) or source terminals (65, 65 I ) of two switches (7, 9) are arranged vis-a-vis each other.

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