Signal transmission

Abstract

According to various aspects, a signal feedthrough (100) comprises: a ceramic feedthrough element (102) in the form of a hollow cylinder, such that a through-opening (108) of the ceramic feedthrough element (102) extends from a first side of the hollow cylinder to a second side of the hollow cylinder opposite the first side, wherein the ceramic feedthrough element (102) is configured to guide a signal conductor (104), the diameter of which is smaller than a diameter of the through-opening (108), through the through-opening (108); a metallic sleeve (106) which is physically connected to the ceramic feedthrough element (102) by means of a solder material (114), wherein the metallic sleeve (106) is configured to connect to the signal conductor;wherein: the ceramic feedthrough element in a section of a surface of the ceramic feedthrough element facing the metallic sleeve and / or the metallic sleeve (106) has a surface structuring (110, 112) on a surface of the metallic sleeve opposite the ceramic feedthrough element to reduce thermal residual stresses at an interface between the ceramic feedthrough element and the solder material.;

Description

[0001] Various embodiments relate to a signal feedthrough.

[0002] Signal feedthroughs can generally be used to pass through one (or more than one) signal conductor in order to transmit signals (e.g. from sensors) via the signal conductor.

[0003] In applications involving relatively high temperatures (e.g., at least 1073 K) and / or relatively high pressures (e.g., at least 100 bar) and / or in the presence of water vapor, conventional signal feedthroughs may be damaged, leading to signal transmission failure. Illustratively, conventional signal feedthroughs may be limited to operating temperatures below 1073 K and / or operating pressures below 100 bar and / or to environments without water vapor.

[0004] However, these applications may be desirable and / or even necessary for various applications. For example, these applications may be required in energy security to ensure an effective transition to a low-carbon energy economy (e.g., for signal feedthroughs for sensors and / or imaging technologies). Modern highly parallel computer architectures are capable of processing large amounts of data at high speed. This means that imaging technologies can increasingly take on the role of sensors used to control machines and industrial plants. However, this also means that for certain applications, higher requirements are placed on the signal feedthroughs, in particular higher resistance to water vapor, high temperatures, and / or pressure.

[0005] EP 3 650 415 describes a joint comprising an at least partially crystallized glass and its use and a crystallizable and an at least partially crystallized glass and its use.

[0006] WO 2022 / 223258 A1 describes a feedthrough through a housing component, comprising an inner conductor, an outer conductor and an electrically insulating component arranged between the outer conductor and the inner conductor, which component comprises a glass or a glass ceramic and which keeps the inner conductor electrically insulated relative to the outer conductor, in which a sleeve is assigned to the outer conductor or formed on it, by means of which sleeve it is held on a thermally loaded housing component of a functional assembly of the exhaust system of a motor vehicle.

[0007] The invention aims to provide a signal conduction that is temperature-resistant up to at least 1073 K (e.g., up to at least 1300 K) and pressure-resistant up to at least 100 bar (e.g., up to at least 1000 bar). The object is achieved by a device according to claim 1.

[0008] According to various embodiments, a signal conduction is provided that is temperature-resistant up to at least 1073 K (e.g., up to at least 1300 K) and pressure-resistant up to at least 100 bar (e.g., up to at least 1000 bar). Furthermore, the signal conduction described herein is resistant in a steam environment.

[0009] For example, the signal feedthrough described herein may enable use in a temperature range of at least about 298 K (e.g., room temperature) to at least about 1073 K (e.g., from about 30 K to about 1300 K). For example, the signal feedthrough described herein may enable use in a pressure range of at least about 1 bar to at least about 100 bar (e.g., from about 0 bar to about 1000 K). Illustratively, the signal feedthrough may be temperature-resistant in the temperature range and / or pressure-resistant in the pressure range. Furthermore, the signal feedthrough described herein may enable use in a water vapor environment.

[0010] This temperature resistance, pressure resistance and water vapor resistance are achieved by combining a material combination of metallic sleeve and ceramic feedthrough element with one or more surface structuring, which reduces thermal residual stresses at an interface of a ceramic feedthrough element of the signal feedthrough (and thus increases the durability of the signal feedthrough).

[0011] For example, the signal feedthrough described herein does not require threads, thereby reducing technical complexity and manufacturing costs.

[0012] According to various embodiments, the signal feedthrough comprises: a ceramic feedthrough element in the shape of a hollow cylinder, such that a through-opening of the ceramic feedthrough element extends from a first side of the hollow cylinder to a second side of the hollow cylinder opposite the first side, wherein the ceramic feedthrough element is configured to pass a signal conductor, whose diameter is smaller than a diameter of the through-opening, through the through-opening; a metallic sleeve physically connected to the ceramic feedthrough element by means of a solder material, wherein the metallic sleeve is configured to connect to the signal conductor;wherein: the ceramic feedthrough element has a surface structuring in a section of a surface of the ceramic feedthrough element facing the metallic sleeve and / or the metallic sleeve has a surface structuring on a surface of the metallic sleeve opposite the ceramic feedthrough element for reducing thermal residual stresses at an interface between the ceramic feedthrough element and the solder material;

[0013] It shows Fig. 1A to 1G each show different aspects of a signal feedthrough; Fig. 2 a result of a simulation of thermal residual stresses of a signal feedthrough that has no surface structuring; Fig. 3A to 4A each show a result of a simulation of thermal residual stresses of a signal feedthrough with at least one surface structuring according to various embodiments; and Fig. 4B shows a result of a simulation of the equivalent plastic strain of a signal feedthrough with at least one surface structuring according to various embodiments.

[0014] In the following detailed description, reference is made to the accompanying drawings, which form a part hereof, and in which is shown by way of illustration specific embodiments in which the invention may be practiced.

[0015] Fig. 1A to Fig. 1G each show different aspects of a signal feedthrough 100.

[0016] The signal feedthrough 100 may include a ceramic feedthrough element 102 (also referred to as a block part). The ceramic feedthrough element 102 may be made of a ceramic material. The ceramic material may be a material that is temperature-resistant up to an operating temperature (also referred to as application temperature) of at least 1000 K (e.g., at least 1073 K, e.g., approximately 1300 K) and pressure-resistant up to an operating pressure (also referred to as application pressure) of at least 100 bar (e.g., approximately 1000 bar).

[0017] The ceramic material can be, for example, ZrO 2 , TiO 2 , Al 2 O 3 , Yb 2 SiO 5 , Y 2 SiO 5(e.g., consist of one of these ceramic materials or of a combination of several of these materials or of a combination of one of these materials with another (ceramic) material). It is understood that these are exemplary ceramic materials and that the ceramic material can be any ceramic material that is resistant up to the service temperature and pressure.

[0018] Resistance (e.g., temperature resistance, pressure resistance, water vapor resistance, etc.) of the signal feedthrough and / or a material, as used herein, can be understood as meaning that the properties of the signal feedthrough and / or the material do not substantially change up to the correspondingly specified operating conditions (e.g., operating temperature, operating pressure, etc.). Water vapor resistance can generally be understood as meaning that the properties do not substantially change in the presence of water vapor.

[0019] The ceramic feedthrough element 102 may have the shape of a hollow cylinder. Illustratively, the ceramic feedthrough element 102 may have a through-opening 108 extending from a first side (e.g., base surface) of the hollow cylinder to a second side (e.g., top surface) of the hollow cylinder opposite the first side. The ceramic feedthrough element may be configured to pass through a signal conductor 104 (see, for example, Fig. 1A, Fig. 1C, Fig. 1F). The signal conductor 104 may have an (outer) diameter that is smaller than a diameter 116 of the through-hole 108. The signal conductor 104 may, for example, be a (e.g., insulated) wire.

[0020] In the figures, the ceramic feedthrough element 102 is shown as an example in the form of a circular hollow cylinder (see for example cross-sectional view in Fig. 1B). It is understood that this is for illustrative purposes only and that the ceramic feedthrough element 102 may also be any other type of (e.g., straight) hollow cylinder (i.e., with a different shape of base and top surface).

[0021] The signal feedthrough 100 may have at least one metallic sleeve 106.

[0022] Various figures show, by way of example, a first metallic sleeve 106-1 and a second metallic sleeve 106-2. It is understood that this is for illustrative purposes and that the signal feedthrough 100 may, in some aspects, also comprise only one metallic sleeve 106 (e.g., the first metallic sleeve 106-1 or the second metallic sleeve 106-2). In this case, the signal feedthrough 100 may be used illustratively as a half-part. If the signal feedthrough 100 comprises the first metallic sleeve 106-1 and the second metallic sleeve 106-2, the first metallic sleeve 106-1 and the second metallic sleeve 106-2 may, in some aspects, be configured identically. In other aspects, the first metallic sleeve 106-1 and the second metallic sleeve 106-2 may differ from one another (e.g.,in the shape and / or geometry of the surface structuring(s), the presence of surface structuring(s), the design as an overlapping connection or as a butt connection, etc.).

[0023] Various aspects of a metallic sleeve 106 are described below. It is understood that what is described for the metallic sleeve 106 may apply to the first metallic sleeve 106-1 and (if present) the second metallic sleeve 106-2.

[0024] A "sleeve" as described herein may generally be a connector configured to connect to the signal conductor 104 and the ceramic feedthrough element 102. Illustratively, the ceramic feedthrough element 102 may be indirectly physically connectable to the signal conductor 104 via the sleeve (and the solder material).

[0025] A metallic sleeve as described herein may be made of a metallic material. The metallic material may comprise one or more metals (e.g., a metal alloy). The metallic material may, for example, be a (stainless) steel, titanium, a titanium alloy, a nickel-based alloy, etc.

[0026] The metallic sleeve 106 may be configured to connect to the signal conductor 104.

[0027] The metallic sleeve 106 may be physically connected (illustratively attached) to the ceramic feedthrough element 102 by means of a solder material 114 (e.g., the first metallic sleeve 106-1 by means of a first solder material 114-1 and the second metallic sleeve 106-2 by means of a second solder material 114-2).

[0028] The solder material 114 can be a hard solder material (short: brazing solder). This can ensure the temperature resistance of the signal feedthrough 100 up to the operating temperature (for example, at least 1000 K). The brazing solder can consist, for example, of an active alloy or a glass solder material.

[0029] In a method for manufacturing the signal feedthrough 100, the application of the solder material 114 may, for example, comprise reactive soldering (e.g., laser soldering or vacuum soldering).

[0030] According to various aspects, the ceramic feedthrough element 102 may have a feedthrough element surface structuring 110 and / or the metallic sleeve 106 may have a sleeve surface structuring 112. Thus, Fig. 1A shows an exemplary embodiment in which the first metallic sleeve 106-1 has a first sleeve surface structuring 112-1, the second metallic sleeve 106-2 has a second sleeve surface structuring 112-2, and the ceramic feedthrough element 102 has a first feedthrough element surface structuring 110-1 and a second feedthrough element surface structuring 110-2. Fig. 1F shows an exemplary embodiment in which the ceramic feedthrough element 102 has a first feedthrough element surface structuring 110-1 and a second feedthrough element surface structuring 110-2.

[0031] In general, the ceramic feedthrough element 102 can have the feedthrough element surface structuring 110 in a section of a surface (e.g., lateral surface) of the ceramic feedthrough element 102 facing the metallic sleeve 106.

[0032] In a first embodiment (also called overlapping connection), as shown in the Fig. 1A, Fig. 1C to Fig. 1E, the metallic sleeve 106 completely surrounds (e.g., concentrically) a portion of the ceramic feedthrough element 102. In this case, the metallic sleeve 106 can have a recess in which a portion of the ceramic feedthrough element 102 is arranged.

[0033] As in Fig. 1D, the ceramic feedthrough element 102 can have a first plurality of (e.g., evenly spaced) depressions in its surface (e.g., lateral surface), at least in the section that the metallic sleeve 106 completely surrounds. Each depression can extend, at least in the section, from the base surface toward the cover surface (or vice versa). Clearly, each depression can run substantially parallel to a longitudinal extent of the ceramic feedthrough element 102. The first plurality of depressions can form the feedthrough element surface structuring 110.

[0034] As in Fig. 1E, the metallic sleeve 106 may have a second plurality of (e.g., evenly spaced) recesses in the surface of the metallic sleeve 106 opposite the ceramic feedthrough element. Each recess may completely surround the metallic sleeve 106. Illustratively, each recess may be substantially concentric, with a longitudinal axis of the ceramic feedthrough element 102 forming a center point. The second plurality of recesses may form the sleeve surface structure 112.

[0035] In a second embodiment (also called butt joint), as shown in Fig. 1F, the metallic sleeve 106 may be physically connected to an end face of the ceramic feedthrough element 102 by means of the solder material 114. In this second embodiment, the end face of the ceramic feedthrough element 102 may have the feedthrough element surface structuring 110. In this case, the end face of the ceramic feedthrough element 102 may have a plurality of recesses. Each recess of the plurality of recesses may be concentric with a periphery of the end face. Fig. 1G shows exemplary patterns 116-1 to 116-9 of the surface structuring 110 on the front side of the ceramic feedthrough element 102 (where the white areas represent the depressions).

[0036] The plurality of depressions of a surface structuring 110, 112 may form a pattern. The pattern may, for example, be a wave-shaped (e.g., sinusoidal) pattern (see, for example, feedthrough element surface structuring 110 in Fig. 4B) or a rectangular pattern (see e.g. socket surface structuring 112 in Fig. 3B).

[0037] The periods, depth and width of the surface structuring 110, 112 can be in the millimeter, micrometer or submicrometer range.

[0038] In a method for producing the signal feedthrough 100, the respective surface structuring can be carried out, for example, using a laser beam (e.g., a nanosecond laser beam, a femtosecond laser beam, a picosecond laser beam, etc.) (e.g., by means of laser ablation) (e.g., with or without scanning and / or wobbling).

[0039] The feedthrough element surface structuring 110 and / or the sleeve surface structuring 112 in combination of the materials (of ceramic feedthrough element 102, metallic sleeve 106 and brazing alloy 112) can ensure the temperature resistance (up to at least 1073 K, e.g. up to at least 1300 K), pressure resistance (up to at least 100 bar, e.g. up to at least 1000 bar) and water vapor resistance described herein.

[0040] The properties of the materials (the ceramic feedthrough element 102, the metallic sleeve 106 and the solder material) can follow the following relationship: 0.01≤α∗E(inMpaK)≤10, where α is the linear expansion coefficient and E is the elastic modulus.

[0041] According to various aspects, the use of a feedthrough element surface structuring 110 and / or a sleeve surface structuring 112 can reduce residual thermal stresses. The feedthrough element surface structuring 110 and the sleeve surface structuring 112, individually and in combination, can realize self-compensating thermal expansion.

[0042] Illustratively, the signal feedthrough 100 can exhibit reduced thermal residual stresses, as explained below. Reference is made to various simulations for this purpose. These simulations are finite element simulations, whereby it is assumed that the metal and brazing material exhibit isotropic and ideally elastoplastic behavior characterized by a von Mises yield function and the associated Ludwik hardening law. For the ceramic material, in contrast, exclusively elastic deformation is assumed. The simulation starts at the solidus temperature of the solder, which is considered an important starting point. The simulation concludes at a temperature of 20°C. The thickness of the brazing foil is simulated for 100 µm. The minimum size of the mesh elements is 1.8 µm.

[0043] Fig. Figure 2 shows the result of a simulation of thermal residual stresses of a signal feedthrough that does not have surface structuring 110, 112. The stress concentration (in the area marked by the circle) is up to 0.97 GPa and thus greater than the tensile strength and flexural strength of the ceramic material (e.g., the Weibull strength of the ceramic material) of the ceramic feedthrough element 102.

[0044] For example, the Weibull strength of the ceramic material may be approximately 0.4 GPa. In various aspects, the use of feedthrough element surface texturing 110 and / or sleeve surface texturing 112 may reduce the stress concentration of the ceramic feedthrough element 102 to a maximum residual stress value of the von Mises stress (also referred to as the von Mises stress criterion) of less than 0.4 GPa.

[0045] Fig. 3A shows a result of a simulation of thermal residual stresses of the signal feedthrough 100, which according to the first embodiment (see e.g. Fig. 1A) is equipped with the feedthrough element surface structuring 110. This shows a significant reduction in the thermal residual stresses to a stress concentration (as the maximum residual stress value of the von Mises stress) of 0.39 GPa.

[0046] Clearly, the feedthrough element surface structuring 110 can reduce stress concentration at the interface between the ceramic feedthrough element 102 and the solder material 114. Thus, the feedthrough element surface structuring 110 can effectively change the magnitude and direction of a torque. Clearly, this reduces residual tensile stresses in the ceramic feedthrough element 102.

[0047] Fig. 3B shows a result of a simulation of thermal residual stresses of the signal feedthrough 100, which according to the first embodiment (see e.g. Fig. 1A) is provided with the sleeve surface structuring 112. This demonstrates a reduction in stress concentration by transferring it to the (ductile) metallic sleeve 106. In this case, too, the stress concentration on the ceramic bushing element 102 is below 0.4 GPa.

[0048] Clearly, the sleeve surface structuring 112 can reduce stress concentration at the interface between the ceramic feedthrough element 102 and the solder material 114 by transferring the stresses to the metallic sleeve 106 (which has a ductile material due to the metallic material).

[0049] It is understood that the combination of feedthrough element surface structuring 110 and sleeve surface structuring 112 can further increase the application range (e.g., temperature resistance) since the stress concentration on the ceramic feedthrough element 102 can be further reduced.

[0050] Fig. 4A shows a result of a simulation of thermal residual stresses of the signal feedthrough 100, which according to the second embodiment (see e.g. Fig. 1F) is equipped with the feedthrough element surface structuring 110. Here, too, a significant reduction of the thermal residual stresses to a stress concentration (as the maximum residual stress value of the von Mises stress (also referred to as the von Mises equivalent stress)) of 0.39 GPa is observed.

[0051] Fig. 4B shows a result of a simulation of the equivalent plastic strain of the signal feedthrough 100, which is produced according to the second embodiment (see e.g. Fig. 1F) with the feedthrough element surface structuring 110 according to the Fig. 1G. The equivalent plastic strain at the interface is approximately 1.8%. This transfers the stress concentration to the metallic sleeve 106. A portion of the metallic sleeve 106 may deform (e.g., plastically) as a result.

[0052] Illustratively, the combination of a sleeve 106 made of a ductile, metallic material with a ceramic feedthrough element 102 in conjunction with the feedthrough element surface structuring 110 and / or the sleeve surface structuring 112 results in the reduction of thermal residual stresses in the ceramic feedthrough element 102 at an interface between it and the solder material 114 by dissipating the stresses and / or transferring them to the ductile, metallic material of the sleeve 106. As a result, the thermal residual stresses at this interface can be reduced to a maximum residual stress value (the von Mises stress) of less than 0.4 GPa. This enables, for example, use of the signal feedthrough 100 at a temperature of at least 1073 K (e.g., at least 1300 K) and at a pressure of at least 100 bar (e.g., at least 1000 bar).Furthermore, the structural design in conjunction with the material combination enables the signal feedthrough 100 to be used in a water vapor environment. Clearly, the signal feedthrough 100 described herein can be temperature-resistant at 1073 K or more, pressure-resistant at 100 bar or more, and water vapor-resistant.

[0053] Various examples are provided below that describe one or more aspects of the signal feedthrough. It is understood that a method may include method steps for manufacturing a signal feedthrough described herein.

[0054] Example 1 is a signal feedthrough, comprising: a ceramic feedthrough element in the form of a hollow cylinder, such that a through-opening of the ceramic feedthrough element extends from a first side (e.g. base surface) of the hollow cylinder to a second side (e.g. cover surface) of the hollow cylinder opposite the first side, wherein the ceramic feedthrough element is configured to pass a signal conductor, the diameter of which is smaller than a diameter of the through-opening, through the through-opening; a metallic sleeve which is physically connected to the ceramic feedthrough element by means of a solder material, wherein the metallic sleeve is configured to connect to the signal conductor; wherein: the ceramic feedthrough element is configured in a section of a surface facing the metallic sleeve (e.g.lateral surface) of the ceramic feedthrough element and / or the metallic sleeve has a surface structuring on a surface of the metallic sleeve opposite the ceramic feedthrough element in order to reduce thermal residual stresses at an interface between the ceramic feedthrough element and the solder material.

[0055] Example 2 is configured according to Example 1, wherein the metallic sleeve has a recess in which a section of the ceramic feedthrough element extending from the first side of the ceramic feedthrough element is arranged, so that a wall surface of the metallic sleeve facing the ceramic feedthrough element completely surrounds the surface (e.g., lateral surface) of the ceramic feedthrough element in the section.

[0056] Example 3 is configured according to Example 2, wherein the ceramic feedthrough element has the surface structuring; wherein the surface structuring of the ceramic feedthrough element has a plurality of (e.g., evenly spaced) depressions in the surface (e.g., lateral surface) of the ceramic feedthrough element, each depression extending at least in the section from the first side toward the second side of the ceramic feedthrough element.

[0057] Example 4 is configured according to example 2 or 3, wherein the metallic sleeve has the surface structuring; wherein the surface structuring of the metallic sleeve has a plurality of (e.g., evenly spaced) depressions in the surface of the metallic sleeve opposite the ceramic feedthrough element, each depression completely surrounding the metallic sleeve.

[0058] Example 5 is configured according to Example 4, wherein each recess of the plurality of recesses extends concentrically to the ceramic feedthrough element (e.g., to a lateral surface of the hollow cylinder).

[0059] Example 6 is configured according to Example 1, wherein the metallic sleeve is physically connected to the first side of the ceramic feedthrough element by means of the solder material; and wherein the portion of the first side of the ceramic feedthrough element facing the metallic sleeve has the surface structuring.

[0060] Example 7 is configured according to Example 6, wherein the surface structuring of the ceramic feedthrough element comprises a plurality of (e.g., evenly spaced) depressions in the surface (e.g., lateral surface) of the first side.

[0061] Example 8 is configured according to Example 7, wherein each recess of the plurality of recesses is concentric with a perimeter of the first side.

[0062] Example 9 is configured according to any one of Examples 1 to 8, wherein the metallic sleeve is a first metallic sleeve and wherein the signal feedthrough further comprises a second metallic sleeve physically connected to the ceramic feedthrough element by means of a (e.g., the) solder material, wherein the second metallic sleeve is configured to connect the signal conductor to the ceramic feedthrough element; and wherein: the ceramic feedthrough element has a surface structuring in a section of a surface of the ceramic feedthrough element facing the second metallic sleeve and / or the second metallic sleeve has a surface structuring on a surface of the second metallic sleeve opposite the ceramic feedthrough element for reducing thermal residual stresses at an interface between the ceramic feedthrough element and the solder material.

[0063] Example 10 is configured according to any one of Examples 1 to 9, wherein the solder material is a brazing material.

[0064] Example 11 is configured according to any one of Examples 1 to 10, wherein the hollow cylinder is a (e.g., straight) circular hollow cylinder. Illustratively, the base and top surfaces can be circular.

[0065] Example 12 is configured according to any one of Examples 1 to 10, wherein the surface structuring (of the ceramic feedthrough element and / or the metallic sleeve) has a wave-shaped (e.g., sinusoidal) pattern or a rectangular pattern.

Claims

[1] Signal feedthrough (100), comprising: • a ceramic feedthrough element (102) in the form of a hollow cylinder, so that a through-opening (108) of the ceramic feedthrough element (102) extends from a first side of the hollow cylinder to a second side of the hollow cylinder opposite the first side, wherein the ceramic feedthrough element (102) is configured to pass a signal conductor (104), the diameter of which is smaller than a diameter of the through-opening (108), through the through-opening (108); • a metallic sleeve (106) physically connected to the ceramic feedthrough element (102) by means of a solder material (114), the metallic sleeve (106) being adapted to connect to the signal conductor (104); • where: ◯ the ceramic lead-through element (102) in a section of a surface of the ceramic lead-through element (102) facing the metallic sleeve (106) and / or ◯ the metallic sleeve (106) on a surface of the metallic sleeve (106) opposite the ceramic lead-through element (102) a surface structuring (110, 112) for reducing thermal residual stresses at an interface between the ceramic feedthrough element (102) and the solder material (114). [2] Signal feedthrough (100) according to claim 1, wherein the metallic sleeve (106) has a recess in which a section of the ceramic feedthrough element (102) extending from the first side of the ceramic feedthrough element (102) is arranged, so that a wall surface of the metallic sleeve facing the ceramic feedthrough element (102) completely surrounds the surface of the ceramic feedthrough element in the section. [3] Signal feedthrough (100) according to claim 2, • wherein the ceramic feedthrough element (102) has the surface structuring (110); • wherein the surface structuring (110) of the ceramic feedthrough element (102) has a plurality of depressions in the surface of the ceramic feedthrough element (102), each depression extending at least in the section from the first side towards the second side of the ceramic feedthrough element (102). [4] Signal feedthrough (100) according to claim 2 or 3, • wherein the metallic sleeve (106) has the surface structuring (112); • wherein the surface structuring (112) of the metallic sleeve (106) has a plurality of depressions in the surface of the metallic sleeve (106) opposite the ceramic feedthrough element (102), each depression completely surrounding the metallic sleeve (106). [5] The signal feedthrough (100) of claim 4, wherein each recess of the plurality of recesses is concentric with the ceramic feedthrough element (102). [6] Signal feedthrough (100) according to claim 1, • wherein the metallic sleeve (106) is physically connected to the first side of the ceramic feedthrough element (102) by means of the solder material (114); and • wherein the section of the first side of the ceramic feedthrough element (102) facing the metallic sleeve (106) has the surface structuring (110). [7] Signal feedthrough (100) according to claim 6, • wherein the surface structuring (110) of the ceramic feedthrough element (102) has a plurality of depressions in the surface of the first side. [8] The signal feedthrough (100) of claim 7, wherein each recess of the plurality of recesses is concentric with a periphery of the first side. [9] Signal feedthrough (100) according to one of claims 1 to 8, • wherein the metallic sleeve (106) is a first metallic sleeve (106-1) and wherein the signal feedthrough (100) further comprises a second metallic sleeve (106-2) physically connected to the ceramic feedthrough element (102) by means of a solder material (114), wherein the second metallic sleeve (106) is configured to connect the signal conductor (104) to the ceramic feedthrough element (102); and • where: ◯ the ceramic lead-through element (102) in a section of a surface of the ceramic lead-through element (102) facing the second metallic sleeve (106-2) and / or ◯ the second metallic sleeve (106-2) has a surface structuring (110, 112) on a surface of the second metallic sleeve (106-2) opposite the ceramic feedthrough element (102) for reducing thermal residual stresses at an interface between the ceramic feedthrough element (102) and the solder material (114). [10] Signal feedthrough (100) according to one of claims 1 to 9, wherein the surface structuring (110, 112) has a wave-shaped pattern or a rectangular pattern.

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