Tires

Abstract

A tire is provided to which an electronic component is attached and which has improved durability during driving, and in particular a tire is provided comprising a tread section, a bead section composed of a bead tapex and a bead core, a clinch provided outside the bead section in the tire width direction and extending to a bead band section, and a carcass layer, wherein an electronic component is provided between the bead tapex and the carcass layer;The complex elastic modulus 70 °CE*-BA (MPa) of the bead tapex, measured under conditions of a temperature of 70 °C, a frequency of 10 Hz, an initial strain of 5%, a dynamic strain rate of 1%, and tensile deformation mode, exceeds 30 MPa: and the loss tangent 70 °C-tanδ-CA of the clinch, measured under conditions of a temperature of 70 °C, a frequency of 10 Hz, an initial strain of 5%, a dynamic strain rate of 1%, and tensile deformation mode, and the length L (mm) of the electronic component in the circumferential direction satisfy the following formula: 70 °C-tanδ-CA × L < 12.;

Description

[TECHNICAL FIELD]

[0001] The present invention relates to tires in which electronic components, such as RFID, are embedded. [STATE OF THE ART]

[0002] In recent years, it has been proposed to embed electronic devices such as RFID (Radio-Frequency Identification) transponders (hereinafter simply referred to as “RFID”) to record information such as manufacturing / shipping information and driving information of tires and to communicate with the outside world (for example, PTL 1 to 4). [PTL on the state of the art][PTL] [PTL 1] JP 2021-506676 A [PTL 2] JP 2021-514891 A [PTL 3] JP 2021-084510 A [PTL 4] JP 2021-127114 A [SUMMARY OF THE INVENTION][PROBLEM TO BE SOLVED BY THE INVENTION]

[0003] However, if an electronic component is embedded in an unvulcanized tire and then integrated with the tire, there is a risk that the electronic components and the rubber element will separate due to impact loads during driving, which will reduce the durability of the tire.

[0004] An object of the present invention is therefore to provide a tire having an electronic component mounted thereon and having improved durability during driving. [METHODS TO SOLVING THE PROBLEM]

[0005] The present invention is a tire comprising a tread portion, a bead portion constructed of a bead apex and a bead core, a clinch provided outside the bead portion in the tire width direction and extending to a chafer portion, and a carcass layer, wherein an electronic component is provided between the bead tread and the carcass layer; complex elastic modulus 70 °CE*-BA (MPa) of the bead tapex, measured under the conditions of a temperature of 70 °C, a frequency of 10 Hz, an initial strain of 5%, a dynamic strain rate of 1% and tensile deformation mode, exceeds 30 MPa; and Loss tangent 70 °C-tanδ-CA of the clinch, which is measured under the conditions of temperature of 70 °C, frequency of 10 Hz, initial strain of 5%, dynamic strain rate of 1% and tensile deformation mode, and length L (mm) of the electronic component in the tire circumferential direction satisfy the following formula 1. 70°C−tanδ−CA×L<12 [EFFECT OF INVENTION]

[0006] According to the present invention, it is possible to improve the durability of a tire to which an electronic component is attached during driving. [BRIEF DESCRIPTION OF DRAWINGS] [ Fig. 1] is a schematic cross-sectional view showing the configuration of a tire according to an embodiment of the present invention. [ Fig. 2] is a schematic cross-sectional view showing the configuration of a tire according to an embodiment of the present invention. [ Fig. 3A and Fig. 3B] are schematic diagrams that depict the shape of an electronic component. [ Fig. 4] is a schematic cross-sectional view showing the embedded position of an electronic component in a comparative example. [ Fig. 5] is a schematic cross-sectional view showing the embedded position of an electronic component in a comparative example. [EMBODIMENTS FOR CARRYING OUT THE INVENTION]

[0007] [1] Features of the tire according to the present invention First, the features of the tire according to the present invention will be explained. 1.Overview

[0008] The tire according to the present invention includes a tread portion, a bead portion composed of a bead stapex and a bead core, a clinch, and a carcass layer; and an electronic component is provided between the bead stapex and the carcass layer.

[0009] Then, complex elastic modulus 70 °CE*-BA (MPa) of the bead tapex, which is measured under the conditions of temperature 70 °C, frequency 10 Hz, initial strain 5%, dynamic strain rate 1% and tensile deformation mode, exceeds 30 Mpa.

[0010] Furthermore, loss tangent 70 °C-tanδ-CA of the clinch, which is measured under the conditions of temperature 70 °C, frequency 10 Hz, initial strain 5%, dynamic strain rate 1% and tensile deformation mode, and length L (mm) of the electronic component in the tire circumferential direction satisfy the following (Formula 1). 70°C−tanδ−CA×L<12

[0011] By exhibiting these properties, as described later, it is possible to improve the durability of a tire to which an electronic component is attached during driving. 2. Mechanism of effect expression in the tire according to the present invention

[0012] The mechanism of the above-mentioned effect expression in the tire according to the present invention is assumed as follows.

[0013] As described above, in the tire according to the present invention, the electronic component is provided between the bead tread and the carcass layer.

[0014] The carcass layer is a tire element that forms the tire's framework and has a much higher elastic modulus than other tire elements. Since the carcass layer, which forms the tire's framework, is the tire's deformation center, it is assumed that the amount of deformation near the carcass layer during driving is smaller than that of the surrounding area.

[0015] On the other hand, since the bead portion composed of the bead stapex and the bead core is a portion attached to the rim, it is assumed that the deformation amount of the bead stapex connected to the bead core attached to the rim during driving is small.

[0016] Therefore, by providing an electronic component between the bead tread and the carcass layer, it is possible to reduce the amount of deformation around the electronic component during driving and suppress the occurrence of detachment of the electronic component within the tire. As a result, it is believed that tire damage can be suppressed and the durability of the tire to which the electronic component is attached can be improved during driving.

[0017] Although the deformation amount of the bead tapex during driving is considered small as described above, it is still deformed along the carcass layer while the tire is rolling, and accordingly, heat is generated.

[0018] If the heat generation of the bead tread becomes excessive, the bead tread will deform significantly and generate heat, which can lead to the occurrence of separation of electronic components within the tire. For this reason, it is considered necessary to increase the complex elastic modulus of the bead tread.

[0019] That is, the complex elastic modulus is a parameter indicating the stiffness of the rubber layer, and it is believed that by increasing the complex modulus (stiffness), deformation of the bead apex and heat generation can be suppressed.

[0020] Specifically, it is believed that when the complex elastic modulus 70°CE*-BA (MPa) of the bead tread, measured under conditions of temperature 70°C, frequency 10 Hz, initial strain 5%, dynamic strain rate 1%, and tensile deformation mode, exceeds 30 MPa, deformation of the bead tread and heat generation can be sufficiently suppressed, and the occurrence of peeling of the electronic component inside the tire can be suppressed, thereby improving the durability of the tire to which an electronic component is attached during driving. It is more preferably 34 MPa or more, even more preferably 36 MPa or more, even more preferably 41 MPa or more, even more preferably 52 MPa or more, even more preferably 59 MPa or more, and even more preferably 71 MPa or more.

[0021] Furthermore, the clinch, located outside the bead apex in the tire width direction, tends to transfer heat generated by friction against the rim during rolling to the inner side of the tire. Therefore, it is considered necessary to appropriately control the relationship between the clinch loss tangent and the length of the electronic component in the tire circumferential direction.

[0022] That is, the loss tangent tanδ is a viscoelastic parameter that indicates energy absorption performance. The larger the value, the more energy is absorbed, heat is generated, and the material deforms. On the other hand, the smaller the length of the electronic component in the tire circumferential direction, the easier it is for heat to be released, so heat generation can be suppressed.

[0023] Therefore, if the product of the loss tangent of the clinch and the length of the electronic component in the tire circumferential direction can be controlled to a certain value or less, heat generation in the area where the electronic component is in contact can be appropriately suppressed, and it is believed that the occurrence of peeling of the electronic component can be sufficiently prevented and the durability of the tire to which an electronic component is attached during driving can be improved.

[0024] Specifically, when the product of the clinch loss tangent 70°C-tanδ-CA measured under conditions of temperature 70°C, frequency 10 Hz, initial strain 5%, dynamic strain rate 1%, and tensile deformation mode, and the length of the electronic component in the tire circumferential direction is less than 12, it is considered that the durability of a tire to which an electronic component is attached during driving can be improved. This product is more preferably 11.20 or less, even more preferably 10.40 or less, even more preferably 9.75 or less, even more preferably 9.60 or less, even more preferably 9.00 or less, even more preferably 8.80 or less, even more preferably 8.50 or less, even more preferably 8.00 or less, and even more preferably 7.65 or less.

[0025] As described above, in the tire according to the present invention, an electronic component is provided between the bead tread and the carcass layer, the complex modulus of the bead tread is increased, and the product of the clinch loss tangent and the length of the electronic component in the tire circumferential direction is controlled to a certain value or less. As a result, it is believed that the amount of deformation around the electronic component during driving can be reduced, thereby suppressing the peeling and damage of the electronic component inside the tire and improving the durability of a tire to which an electronic component is attached during driving.

[0026] Above, the complex elastic modulus and loss tangent (tanδ) can be measured, for example, using a viscoelasticity measuring device such as “Eplexor (registered trademark)” manufactured by GABO. [2] Further preferred embodiments of the tire according to the present invention

[0027] The tire according to the present invention can obtain even greater effects by using the following embodiments. 1. Tire radial distance from the top of the bead core to the electronic component

[0028] The larger the tire radial distance D2 from the top end of the bead core to the electronic component, the more easily the bead stack deforms and generates heat. Therefore, it is preferable to increase the complex modulus of the bead stack relative to the tire radial distance from the top end of the bead core to the electronic component.

[0029] Specifically, when the ratio of 70°CE*-BA to the tire radial distance D2 (mm) from the top of the bead core to the electronic component (i.e., 70°CE*-BA / D2) exceeds 0.85, it is considered that the deformation and heat generation of the bead apex can be sufficiently suppressed, and the durability of a tire to which an electronic component is attached during driving can be further improved. This ratio is more preferably 0.91 or more, even more preferably 1.03 or more, even more preferably 1.16 or more, even more preferably 1.17 or more, even more preferably 1.48 or more, and even more preferably 1.78 or more.

[0030] At this time, as D2 increases, heat generation of the bead apex can be suppressed by reducing 70°C-tanδ-BA. By controlling the product (70°C-tanδ-BA × D2) to be equal to or less than a predetermined value, heat generation is expected to be suppressed and the durability of tires mounted with an electronic component during driving is further improved.

[0031] In particular, when the product of 70°C-tanδ-BA and the tire radial distance D2 (mm) from the top of the bead core to the electronic component (ie, 70°C-tanδ-BA × D2) is 8.5 or less, heat generation is appropriately suppressed and the durability of a tire to which an electronic component is attached during driving can be further improved. This product is more preferably 8.10 or less, even more preferably 8.00 or less, even more preferably 7.00 or less, and even more preferably 6.30 or less.

[0032] The ratio (D2 / H) of D2 (mm) to the height of the bead stack, that is, the distance H (mm) from the top of the bead core to the apex of the bead stack, is preferably more than 0.2 and less than 0.8. By disposing the electronic component in such a position, heat generation can be appropriately suppressed and peeling can be suppressed. The ratio is more preferably 0.3 or more and 0.5 or less, and even more preferably about 0.4.

[0033] In the above description, the “top end of the bead core” refers to the outer edge of the bead core in the tire radial direction. 2. Loss tangent of tread

[0034] In the present invention, it is preferable that the loss tangent 30°C-tanδ-TR of the tread measured under the conditions of temperature 30°C, frequency 10 Hz, initial strain 5%, dynamic strain rate 1%, and tensile deformation mode be less than 0.25. It is more preferably 0.23 or less, and even more preferably 0.21 or less. Thus, by setting 30°C-tanδ-TR to a small value, it is possible to reduce the amount of heat generated at the tread during running, suppress the temperature rise of the entire tire, and it is believed that the durability of a tire to which an electronic component is attached during running can be further improved.

[0035] At this time, it is preferable that the loss tangent 0°C-tanδ-TR of the tread measured under the conditions of temperature 0°C, frequency 10 Hz, initial strain 5%, dynamic strain rate 1%, and tensile deformation mode be more than 0.50. It is more preferably 0.55 or more, and even more preferably 0.60 or more. In this way, by increasing the loss tangent tanδ at low temperatures, it is possible to suppress the vibrations occurring on the tread surface due to the influence of the road surface during running, and it is believed that bead deformation occurring due to vibration on the tread surface is sufficiently suppressed, and the durability of a tire to which an electronic component is attached during running can be further improved.

[0036] Note that the "tread portion" refers to a member in a region constituting the ground contact surface of a tire, and a portion outward in the tire radial direction from a member including a fiber material, such as a carcass, a belt layer, and a belt reinforcing layer. The tread portion may be formed of only one layer of cap rubber, may be formed of two layers by providing a rubber base layer within the cap rubber layer, may be formed of three layers, or may be formed of four or more layers. In this case, the thickness of the cap rubber layer over the entire tread portion is preferably 10% or more. Note that the thickness of the cap rubber layer in the entire tread portion is more preferably 70% or more.

[0037] The thickness of the cover rubber layer and the thickness of the base rubber layer described above can be calculated by adding the thickness of the cover rubber layer and the thickness of the base rubber layer to the thickness of the tread portion measured with the bead portion aligned with the standardized rim width in a cross-section cut in the radial direction of the tire.

[0038] Here, the "standardized rim" is a rim defined for each tire in a standard system containing a standard on which the tire is based. For example, in the case of JATMA (Japan Automobile Tire Association), it is the standard rim in applicable sizes described in the "JATMA YEAR BOOK," in the case of ETRTO (The European Tire and Rim Technical Organization), it is the "Measuring Rim" described in the "STANDARDS MANUAL," and in the case of TRA (The Tire and Rim Association, Inc.), it is the "Design Rim" described in the "YEAR BOOK." JATMA, ETRTO, and TRA are referred to in order, and if there is an applicable size at the time of reference, the standard is followed.In the case of tires not specified in the standard, it refers to a rim that can be mounted and maintain internal pressure, that is, the rim that does not cause air leakage between the rim and the tire and has the smallest rim diameter and then the narrowest rim width. 3. Tire weight and maximum load capacity

[0039] In the present invention, the ratio of tire weight (kg) to the maximum load capacity (kg) of the tire (tire weight / maximum load capacity) is preferably less than 0.0150. Thus, tires with a low tire weight compared to the maximum load capacity of the tire have relatively thin rubber, so it is possible to sufficiently suppress the temperature rise of the entire tire, and it is believed that the durability of a tire to which an electronic component is attached during driving can be further improved.The ratio is more preferably 0.0149 or less, even more preferably 0.0148 or less, even more preferably 0.0147 or less, even more preferably 0.0146 or less, even more preferably 0.0145 or less, even more preferably 0.0144 or less, even more preferably 0.0139 or less, even more preferably 0.0135 or less, even more preferably 0.0134 or less, and even more preferably 0.0132 or less.

[0040] Please note that “Tire weight (kg)” above refers to the weight of the tire alone, not including the weight of the rim.

[0041] And "maximum load capacity (kg)" can be determined as WL from the formula described below, where Wt is the tire section width measured in a standardized condition, Wt (mm), Ht is the tire section height (mm), and Dt is the tire outer diameter (mm). The tire section width Wt here is the maximum width between the outer surfaces of the sidewalls in a standardized condition, excluding any patterns or letters on the tire side surfaces. The tire section height Ht is 1 / 2 of the difference between the tire outer diameter and the nominal diameter of a rim. V={(Dt / 2)2−(Dt / 2−Ht)2}×π×Wt WL=0.000011×V+100

[0042] In the above description, the term "standardized condition" refers to a condition in which the tire is mounted on a standardized rim, filled with a standardized internal pressure, and under no load. It should be noted that the "standardized internal pressure" is the air pressure specified for each tire by each standard in the standards system that includes the standard on which the tire is based. For JATMA, it is the maximum air pressure, for ETRTO, it is "INFLATION PRESSURE," and for TRA, it is the maximum value described in the table "TIRE LOAD LIMITS AT VARIOUS COLD INFLATION PRESSURES." JATMA, ETRTO, and TRA are referred to in order, as with standardized rims, and if there is an applicable size at the time of reference, the standard is followed.And in the case of a tire not defined in the standard, it is the standardized internal pressure (but 250 kPa or more) of another tire size (specified in the standard) for which the standardized rim is described as the standard rim. If multiple standardized internal pressures of 250 kPa or more are listed, reference is made to the minimum value below. 4. Relationship between complex module of bead apex and length of electronic component in tire circumferential direction

[0043] It is believed that as the length of the electronic component in the tire circumferential direction increases, the length of the electronic component in contact with the surroundings becomes longer, making stress concentration more likely to occur and becoming a starting point for peeling. On the other hand, as described above, it is believed that deformation and heat generation of the bead tread can be suppressed by increasing the complex modulus of the bead tread. For this reason, it is preferable to suppress stress concentration by increasing the complex modulus of the bead tread relative to the length of the electronic component in the tire circumferential direction.

[0044] In particular, when the ratio of 70°CE*-BA to L (mm) (70°CE*-BA / L) is 0.6 or more, stress concentration can be sufficiently suppressed, and it is believed that the durability of the tire to which an electronic component is attached during driving can be further improved. This ratio is more preferably 0.63 or more, even more preferably 0.68 or more, even more preferably 0.72 or more, even more preferably 0.87 or more, even more preferably 0.91 or more, even more preferably 0.98 or more, and even more preferably 1.29 or more. 5. Relationship between loss tangent of bead apex and clinch and length of electronic component in tire circumferential direction

[0045] As described above, since the bead tread is a portion attached to the rim, the amount of deformation during driving is assumed to be small; however, it still deforms and generates heat as the tire rolls. On the other hand, since the clinch is also a portion attached to the rim, the amount of deformation during driving is assumed to be small, but it still deforms and generates heat as the tire rolls.

[0046] Therefore, by controlling the product of the sum of the heat generation characteristics (loss tangent) of the bead apex and clinch and the length of the electronic component in the tire circumferential direction to a certain value or less, heat generation and heat accumulation around the electronic component are suppressed, and the occurrence of deformation can be suppressed. As a result, it is believed that the durability of the tire to which the electronic component is attached during driving can be further improved.

[0047] Specifically, the product of the sum of 70 °C-tanδ-BA and 70 °C-tanδ-CA (i.e., 70 °C-tanδ-BA + 70 °C-tanδ-CA) and the length L (mm) of the electronic component in the tire circumferential direction (i.e., (70 °C-tanδ-BA + 70 °C-tanδ-CA) × L) is controlled to be 25 or less, heat generation and heat accumulation around the electronic component are suppressed, and the occurrence of deformation can be suppressed; and it is believed that the durability of tires to which an electronic component is attached during driving can be further improved. The product is more preferably 23.8 or less, even more preferably 23.4 or less, even more preferably 22.8 or less, even more preferably 21.6 or less, even more preferably 19.8 or less, even more preferably 18.5 or less, even more preferably 17.0 or less, and even more preferably 16.7 or less. 6. Relationship between the complex module of bead tapping and clinch and the length of electronic component in the tire circumferential direction

[0048] (1) As mentioned above, as the length of the electronic component in the tire circumferential direction increases, the contact length between the electronic component and the surrounding area becomes longer, and it is believed that the starting point of peeling is likely to occur. However, by increasing the ratio of the complex elastic modulus of the bead staple to the complex elastic modulus of the clinch and by increasing the ratio to the length of the electronic component in the tire circumferential direction, it becomes easier to suppress the occurrence of deformation at the contact surface between the electronic component and its surrounding area. As a result, it is believed that the durability of the tire to which an electronic component is attached during driving can be further improved.

[0049] In particular, when the ratio of L (mm) to the ratio of 70°CE*-BA to 70°CE*-CA (70°CE*-BA / 70°CE*-CA) (i.e., (70°C - E* - BA / 70°CE*-CA) / L) is 0.055 or more, the occurrence of deformation at the contact surface between the electronic component and its surroundings is suppressed, and it is believed that the durability of the tire to which an electronic component is attached during driving is further improved. The ratio is more preferably 0.063 or more, even more preferably 0.065 or more, even more preferably 0.068 or more, even more preferably 0.072 or more, even more preferably 0.091 or more, even more preferably 0.098 or more, and even more preferably 0.117 or more.

[0050] (2) It is assumed that as the length of the electronic component in the tire circumferential direction increases, the contact length between the electronic component and the surrounding environment becomes longer, which makes stress concentration more likely to occur and the starting point of peeling more likely. For this reason, it is preferable to increase the sum of the complex elastic modulus of the bead apex and the clinch with respect to the length L to suppress stress concentration.

[0051] In particular, when the ratio of the sum of 70°CE*-BA and 70°CE*-CA (i.e., 70°CE*-BA + 70°CE*-CA) to L (mm) (i.e., (70°CE*-BA + 70°CE*-CA) / L) is 0.8 or more, it is possible to sufficiently suppress stress concentration, and it is believed that the durability of the tire to which an electronic component is attached during driving can be further improved. This ratio is more preferably 0.82 or more, even more preferably 0.88 or more, even more preferably 0.94 or more, even more preferably 1.07 or more, even more preferably 1.13 or more, even more preferably 1.15 or more, and even more preferably 1.49 or more. 7. Electronic components

[0052] In the present invention, RFID or a sensor is preferably used as the electronic component. RFID can store a large amount of information and read it without contact. It is further preferred considering that manufacturing information, management information, customer information, etc., can be stored in addition to data such as pressure and temperature. Note that specific sensors include, for example, a pressure sensor, a temperature sensor, an acceleration sensor, a magnetic sensor, and a groove depth sensor.

[0053] Preferably, the surface of the electronic component is provided with an adhesive layer or a plating layer to improve adhesion to rubber. This can sufficiently suppress detachment of electronic components.

[0054] It should be noted that a known metal-rubber adhesive can be used as a specific adhesive layer and can be purchased from LORD Company or the like. The plating layer preferably contains copper, for example, and is preferably alloyed with tin, nickel, iron, zinc, cobalt, aluminum, magnesium, or the like.

[0055] Further, it is preferable that an electronic component coating layer with a thickness of 0.5 mm or more be provided on the surface of the electronic component. Thus, by providing an appropriate clearance between the electronic component and the adjacent bead tapping or carcass layer, it is possible to make the electronic component less susceptible to deformation at the interface and sufficiently suppress the detachment of the electronic component.

[0056] Furthermore, as a specific coating layer for electronic components, for example, a rubber composition or a thermoplastic elastomer composition can be used. Examples include a rubber composition described in this specification or a rubber composition known in the tire industry, etc.

[0057] The product of the shortest distance D1 (mm) to the outer surface of the tire and the weight W (g) of the electronic component (i.e., D1 × W) is preferably 2.5 or less. By controlling D1 × W to such a value, deformation around the electronic component can be sufficiently suppressed, and peeling can be suppressed. This product is more preferably 2.2 or less.

[0058] Furthermore, in the present invention, the length in the longitudinal direction of the electronic component (including the antenna) is preferably 80 mm or less, more preferably 70 mm or less, even more preferably 60 mm or less, even more preferably 50 mm or less, and still more preferably 40 mm or less. By selecting such a size, not only can the occurrence of local stress concentration be suppressed, but also the electronic component is allowed to fit properly along the tire member, so that peeling can be sufficiently suppressed, and it is believed that the durability of the tire to which an electronic component is attached during driving can be further improved. [3] Embodiment

[0059] The present invention will be specifically described below based on embodiments. 1. Tires according to this embodiment

[0060] Fig. 1 and Fig. 2 are schematic cross-sectional views showing the structure of a tire according to an embodiment of the present invention. In Fig. 1 and Fig. 2, 1 is a tire, 2 is a bead portion, 3 is a sidewall portion, 4 is a tread portion, 31 is a sidewall, 32 is a carcass layer, 33 is an inner liner, and 34 is an electronic component. The carcass layer 32 is folded back at the lower end of the bead core 21 along the bead core 21 and bead tread 22 constituting the bead portion 2, from the inside to the outside in the tire width direction, and then bonded to the inner carcass layer 32. A chafer 24 is provided on the inside of the bead portion 2 in the tire width direction, and a clinch 23 extending to the chafer 24 is provided on the outside in the tire width direction.

[0061] As in Fig. 1 and Fig. 2, in this embodiment, an electronic component 34 is provided between the bead tapping 22 and the carcass layer 32. "An electronic component is provided between the bead tapping and the carcass layer" here means that an electronic component is provided between the surfaces of the bead tapping and the carcass layer that are opposite to the respective surfaces where they come into contact with each other, and a case where the component is embedded in the bead tapping or the carcass layer is included.

[0062] For example, in Fig. 1 an electronic component 34 is provided between the bead tapping 22 and the carcass layer 32 on the inside in the tire width direction, and in Fig. 2, an electronic component 34 is provided between the bead tapping 22 and the carcass layer 32 on the outer side in the tire width direction.

[0063] Fig.3A and Fig. 3B are schematic plan views showing the shape of the electronic component used in this embodiment. As shown in Fig. 3A and Fig. As shown in Fig. 3B, the electronic component 34 includes a main body 34a made of an IC chip and an antenna 34b.

[0064] With this configuration, the bead apex 22, the clinch 23, and the tread portion 4 satisfy each of the above-mentioned parameters, so the amount of deformation around the electronic component is sufficiently small, thereby suppressing breakage and damage to the electronic component. As a result, the durability of the tire to which an electronic component is attached during driving can be improved. 2. Rubber composition

[0065] In this embodiment, each rubber composition constituting the bead tapex, the clinch, and the tread described above (hereinafter referred to as “rubber composition for bead tapex,” “rubber composition for clinch,” and “rubber composition for tread,” respectively) can be obtained by kneading various compound materials such as rubber components, reinforcing materials, antioxidants, oils, resin materials, and additives. (1) Joining materials(a) Rubber component

[0066] In each rubber composition, the rubber component is not particularly limited, and for example, diene-based rubbers such as natural rubber (NR), isoprene rubber (IR), butadiene rubber (BR), styrene-butadiene rubber (SBR), acrylonitrile-butadiene rubber (NBR), chloroprene rubber (CR), and butyl rubber (IIR) can be used. These can be used alone or in combinations of two or more. For example, in a rubber composition for bead tapex, a combination of isoprene rubber and SBR is preferable, a combination of isoprene rubber and BR is preferable in a rubber composition for clinch, and a combination of isoprene rubber, SBR, and BR is preferable in a rubber composition for tread. (a-1) Isoprene-based rubber

[0067] Examples of isoprene-based rubber include natural rubber (NR), isoprene rubber (IR), reshaped NR, modified NR, and modified IR. Among them, NR is preferred because of its excellent strength.

[0068] As the NR, for example, those commonly used in the tire industry can be used, such as SVR-L, SIR20, RSS#3, and TSR20. The IR is not particularly limited, and, for example, one commonly used in the tire industry, such as IR2200 manufactured by Nippon Zeon Co., Ltd., can be used. Examples of the reformed NR include deproteinized natural rubber (DPNR) and high-purity natural rubber (UPNR); examples of the modified NR include epoxidized natural rubber (ENR), hydrogenated natural rubber (HNR), and grafted natural rubber; and examples of the modified IR include epoxidized isoprene rubber, hydrogenated isoprene rubber, and grafted isoprene rubber. These can be used alone or in combinations of two or more.

[0069] In the rubber composition for bead tapex, the content of isoprene-based rubber in 100 parts by mass of the rubber component is preferably 75 parts by mass or more, and more preferably 80 parts by mass or more. On the other hand, it is preferably 95 parts by mass or less, and more preferably 90 parts by mass or less.

[0070] In the rubber composition for clinching, the content of isoprene-based rubber in 100 parts by mass of the rubber component is preferably 35 parts by mass or more, and more preferably 55 parts by mass or more. On the other hand, it is preferably 70 parts by mass or less, and more preferably 65 parts by mass or less.

[0071] Furthermore, in the rubber composition for a tread, the content of isoprene rubber in 100 parts by mass of the rubber component is preferably 5 parts by mass or more, and more preferably 8 parts by mass or more. On the other hand, it is preferably 15 parts by mass or less, and more preferably 12 parts by mass or less. (a-2) SBR

[0072] The weight-average molecular weight of SBR is, for example, more than 100,000 and less than 2,000,000. The styrene content of SBR is, for example, preferably more than 5 mass%, more preferably more than 10 mass%, and even more preferably more than 15 mass%. On the other hand, it is preferably less than 40 mass%, more preferably less than 35 mass%, and even more preferably less than 30 mass%.

[0073] For example, the vinyl content (1,2-bonded butadiene unit amount) of SBR is preferably more than 5 mass%, more preferably more than 10 mass%, and even more preferably more than 15 mass%. On the other hand, it is preferably less than 70 mass%, more preferably less than 40 mass%, and even more preferably less than 30 mass%. It should be noted that the structural identification of SBR (measurement of styrene content and vinyl content) can be performed using, for example, a JNM-ECA series apparatus manufactured by JEOL Ltd.

[0074] SBR is not particularly limited, and emulsion-polymerized styrene-butadiene rubber (E-SBR), solution-polymerized styrene-butadiene rubber (S-SBR), and the like can be used, for example. SBR can be either unmodified SBR or modified SBR. Furthermore, hydrogenated SBR obtained by hydrogenating the butadiene portion in SBR can be used. Hydrogenated SBR can be obtained by subsequently hydrogenating the BR portion in SBR, or a similar structure can be obtained by copolymerizing styrene, ethylene, and butadiene.

[0075] The modified SBR is preferably an SBR having a functional group that interacts with a filler, such as silica. Examples include end-modified SBR (end-modified SBR having the above functional group at the end), in which at least one end of the SBR is modified with a compound having the above functional group (modifying agent), main chain-modified SBR with the functional group on the main chain, main chain end-modified SBR having the functional group on the main chain and at the end (for example, a main chain end-modified SBR having the above functional group on the main chain and having at least one end modified with the above modifier), and end-modified SBR modified (coupled) with a polyfunctional compound having two or more epoxy groups in the molecule and into which an epoxy group or a hydroxyl group has been introduced.

[0076] Examples of the functional group include an amino group, an amide group, a silyl group, an alkoxysilyl group, an isocyanate group, an imino group, an imidazole group, a urea group, an ether group, a carbonyl group, an oxycarbonyl group, a mercapto group, a sulfide group, a disulfide group, a sulfonyl group, a sulfinyl group, a thiocarbonyl group, an ammonium group, an imide group, a hydrazo group, an azo group, a diazo group, a carboxyl group, a nitrile group, a pyridyl group, an alkoxy group, a hydroxyl group, an oxy group, and an epoxy group. Furthermore, these functional groups may have a substituent.

[0077] Furthermore, as the modified SBR, for example, SBR modified with a compound (modifier) ​​represented by the following formula can be used.

[0078] In the formula, R 1, R 2 and R 3 same or different and each represents an alkyl group, an alkoxy group, a silyloxy group, an acetal group, a carboxyl group (-COOH), a mercapto group (-SH) or a derivative thereof. R 4 and R 5 are the same or different and represent a hydrogen atom or an alkyl group. R 4 and R 5 can be combined with the nitrogen atom to form a ring structure. Here, n represents an integer.

[0079] As the modified SBR modified by the compound (modifier) ​​represented by the above formula, SBR in which the polymerization end (active end) of the solution-polymerized styrene-butadiene rubber (S-SBR) is modified by the compound represented by the above formula (for example, modified SBR described in JP-A-2010-111753) can be used.

[0080] As R 1 , R 2 and R 3 an alkoxy group is suitable (preferably an alkoxy group having 1 to 8 carbon atoms, more preferably an alkoxy group having 1 to 4 carbon atoms). As R 4 and R 5 an alkyl group (preferably an alkyl group having 1 to 3 carbon atoms) is suitable. Here, n is preferably 1 to 5, more preferably 2 to 4, and even more preferably 3. Further, when R 4 and R 5 When combined with a nitrogen atom to form a ring structure, a 4- to 8-membered ring is preferred. The alkoxy group also includes a cycloalkoxy group (cyclohexyloxy group, etc.) and an aryloxy group (phenoxy group, benzyloxy group, etc.).

[0081] Specific examples of the above modifier include 2-dimethylaminoethyltrimethoxysilane, 3-dimethylaminopropyltrimethoxysilane, 2-dimethylaminoethyltriethoxysilane, 3-dimethylaminopropyltriethoxysilane, 2-diethylaminoethyltrimethoxysilane, 3-diethylaminopropyltrimethoxysilane, 2-diethylaminoethyltriethoxysilane, and 3-diethylaminopropyltriethoxysilane. These can be used alone or in combinations of two or more.

[0082] Furthermore, as the modified SBR, a modified SBR modified with the following compound (modifier) ​​can also be used. Examples of the modifier include Polyglycidyl ethers of polyhydric alcohols, such as ethylene glycol diglycidyl ether, glycerol triglycidyl ether, trimethylolethane triglycidyl ether and trimethylolpropane triglycidyl ether; Polyglycidyl ethers of aromatic compounds containing two or more phenol groups, such as diglycidylated bisphenol A; Polyepoxy compounds such as 1,4-diglycidylbenzene, 1,3,5-triglycidylbenzene and polyepoxidized liquid polybutadiene; Epoxy group-containing tertiary amines, such as 4,4'-diglycidyldiphenylmethylamine and 4,4'-diglycidyldibenzylmethylamine; diglycidylamino compounds, such as diglycidylaniline, N,N'-diglycidyl-4-glycidyloxyaniline, diglycidylorthotoluidine, tetraglycidylmetaxylenediamine, tetraglycidylaminodiphenylmethane, tetraglycidyl-p-phenylenediamine, diglycidylaminomethylcyclohexane, and tetraglycidyl-1,3-bisaminomethylcyclohexane;

[0083] Amino group-containing acid chlorides such as bis-(1-methylpropyl)carbamate chloride, 4-morpholinecarbonyl chloride, 1-pyrrolidinecarbonyl chloride, N,N-dimethylcarbamic acid chloride and N,N-diethylcarbamic acid chloride;

[0084] Epoxy group-containing silane compounds such as 1,3-bis-(glycidyloxypropyl)-tetramethyldisiloxane and (3-glycidyloxypropyl)-pentamethyldisiloxane;

[0085] Silane compounds containing sulfide groups, such as (trimethylsilyl) [3-(trimethoxysilyl)propyl] sulfide, (trimethylsilyl) [3-(triethoxysilyl)propyl] sulfide, (trimethylsilyl) [3-(tripropoxysilyl)propyl] sulfide, (trimethylsilyl) [3-(tributoxysilyl)propyl] sulfide, (trimethylsilyl) [3-(methyldimethoxysilyl)propyl] sulfide, (trimethylsilyl) [3-(methyldiethoxysilyl)propyl] sulfide, (trimethylsilyl) [3-(methyldipropoxysilyl)propyl] sulfide and (trimethylsilyl) [3-(methyldibutoxysilyl)propyl] sulfide;

[0086] N-substituted aziridine compounds such as ethyleneimine and propyleneimine;

[0087] Alkoxysilanes such as methyltriethoxysilane, N,N-bis(trimethylsilyl)-3-aminopropyltrimethoxysilane, N,N-bis(trimethylsilyl)-3-aminopropyltriethoxysilane, N,N-bis(trimethylsilyl)-aminoethyltrimethoxysilane and N,N-bis(trimethylsilyl)-aminoethyltriethoxysilane;

[0088] (Thio)benzophenone compounds having an amino group and / or a substituted amino group, such as 4-N,N-dimethylaminobenzophenone, 4-N,N-di-t-butylaminobenzophenone, 4-N,N-diphenylaminobenzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 4,4'-bis(diphenylamino)benzophenone and N,N,N',N'-bis-(tetraethylamino)benzophenone;

[0089] Benzaldehyde compounds having an amino group and / or a substituted amino group, such as 4-N,N-dimethylaminobenzaldehyde, 4-N,N-diphenylaminobenzaldehyde and 4-N,N-divinylaminobenzaldehyde;

[0090] N-substituted pyroridones, such as N-methyl-2-pyrrolidone, N-vinyl-2-pyrrolidone, N-phenyl-2-pyrrolidone, Nt-butyl-2-pyrrolidone and N-methyl-5-methyl-2-pyrrolidone;

[0091] N-substituted piperidones, such as methyl-2-piperidone, N-vinyl-2-piperidone and N-phenyl-2-piperidone;

[0092] N-substituted lactams, such as N-methyl-ε-caprolactam, N-phenyl-ε-caprolactam, N-methyl-ω-laurilolactam, N-vinyl-ω-laurilolactam, N-methyl-β-propiolactam and N-phenyl-β-propiolactam; and

[0093] N,N-bis-(2,3-epoxypropoxy)-aniline, 4,4-methylene-bis-(N,N-glycidylaniline), tris-(2,3-epoxypropyl)-1,3,5-triazine-2,4,6-trione, N,N-diethylacetamide, N-methylmaleimide, N,N-diethyl urea, 1,3-dimethylethylene urea, 1,3-divinylethylene urea, 1,3-diethyl-2-imidazolidinone, 1-methyl-3-ethyl-2-imidazolidinone, 4-N,N-dimethylaminoacetophenone, 4-N,N-diethylaminoacetophenone, 1,3-bis(diphenylamino)-2-propanone and 1.7- Bis(methylethylamino)-4-heptanone. Modification with the above compound (modifying agent) can be carried out by a known method.

[0094] For example, SBR manufactured and sold by Sumitomo Chemical Co., Ltd., ENEOS Materials Co., Ltd., Asahi Kasei Co., Ltd., Nippon Zeon Co., Ltd., etc. can be used as the SBR. It should be noted that SBR can be used alone or in combination with two or more SBRs.

[0095] In the rubber composition for bead tapex, the SBR content in 100 parts by mass of the rubber component is preferably 5 parts by mass or more, and more preferably 15 parts by mass or more. On the other hand, it is preferably 35 parts by mass or less, and more preferably 25 parts by mass or less.

[0096] In the rubber composition for clinching, the content of SBR in 100 parts by mass of the rubber component is preferably 30 parts by mass or more, and more preferably 35 parts by mass or more. On the other hand, it is preferably 50 parts by mass or less, and more preferably 45 parts by mass or less.

[0097] Furthermore, in the rubber composition for tread, the content of SBR in 100 parts by mass of the rubber component is preferably 50 parts by mass or more, and more preferably 60 parts by mass or more. Although the upper limit is not particularly limited, it is preferably 90 parts by mass or less, and more preferably 70 parts by mass or less. (a-3) BR

[0098] For example, the weight-average molecular weight of BR is more than 100,000 and less than 2,000,000. The vinyl content of BR is, for example, more than 1 mass% and less than 30 mass%. The cis content of BR is, for example, more than 1 mass% and 98 mass% or less. The trans content of BR is, for example, more than 1 mass% and less than 60 mass%. It should be noted that the cis content can be measured by infrared absorption spectroscopy.

[0099] The BR is not particularly limited, and BR with a high cis content (90% or more cis content), BR with a low cis content, BR containing syndiotactic polybutadiene crystals, etc. can be used. The BR can be either unmodified BR or modified BR. For example, a BR modified with a compound (modifier) ​​represented by the following formula can be used as the modified BR.

[0100] In the formula, R 1 , R 2 and R 3 same or different and each represents an alkyl group, an alkoxy group, a silyloxy group, an acetal group, a carboxyl group (-COOH), a mercapto group (-SH) or a derivative thereof. R 4 and R 5 are the same or different and represent a hydrogen atom or an alkyl group. R 4 and R 5can be combined with the nitrogen atom to form a ring structure. Here, n represents an integer.

[0101] Examples of the modified BR modified with the compound (modifier) ​​represented by the above formula include BR whose polymerization terminal (active terminal) is modified with the compound represented by the above formula.

[0102] As R 1 , R 2 and R 3 an alkoxy group is suitable (preferably an alkoxy group having 1 to 8 carbon atoms, more preferably an alkoxy group having 1 to 4 carbon atoms). As R 4 and R 5 an alkyl group (preferably an alkyl group having 1 to 3 carbon atoms) is suitable. Here, n is preferably 1 to 5, more preferably 2 to 4, and even more preferably 3. Further, when R 4 and R 5When combined with a nitrogen atom to form a ring structure, a 4- to 8-membered ring is preferred. The alkoxy group also includes a cycloalkoxy group (cyclohexyloxy group, etc.) and an aryloxy group (phenoxy group, benzyloxy group, etc.).

[0103] Specific examples of the above modifier include 2-dimethylaminoethyltrimethoxysilane, 3-dimethylaminopropyltrimethoxysilane, 2-dimethylaminoethyltriethoxysilane, 3-dimethylaminopropyltriethoxysilane, 2-diethylaminoethyltrimethoxysilane, 3-diethylaminopropyltrimethoxysilane, 2-diethylaminoethyltriethoxysilane, and 3-diethylaminopropyltriethoxysilane. These can be used alone or in combinations of two or more.

[0104] Furthermore, as the modified BR, a modified BR modified with the following compound (modifier) ​​can also be used. Examples of the modifier include

[0105] Polyglycidyl ethers of polyhydric alcohols, such as ethylene glycol diglycidyl ether, glycerol triglycidyl ether, trimethylolethane triglycidyl ether and trimethylolpropane triglycidyl ether;

[0106] Polyglycidyl ethers of aromatic compounds containing two or more phenol groups, such as diglycidylated bisphenol A; Polyepoxy compounds such as 1,4-diglycidylbenzene, 1,3,5-triglycidylbenzene and polyepoxidized liquid polybutadiene;

[0107] Epoxy group-containing tertiary amines such as 4,4'-diglycidyldiphenylmethylamine and 4,4'-diglycidyldibenzylmethylamine;

[0108] Diglycidylamino compounds such as diglycidylaniline, N,N'-diglycidyl-4-glycidyloxyaniline, diglycidylorthotoluidine, tetraglycidylmetaxylenediamine, tetraglycidylaminodiphenylmethane, tetraglycidyl-p-phenylenediamine, diglycidylaminomethylcyclohexane and tetraglycidyl-1,3-bisaminomethylcyclohexane;

[0109] Amino group-containing acid chlorides such as bis-(1-methylpropyl)carbamate chloride, 4-morpholinecarbonyl chloride, 1-pyrrolidinecarbonyl chloride, N,N-dimethylcarbamic acid chloride and N,N-diethylcarbamic acid chloride;

[0110] Epoxy group-containing silane compounds such as 1,3-bis-(glycidyloxypropyl)-tetramethyldisiloxane and (3-glycidyloxypropyl)-pentamethyldisiloxane;

[0111] Silane compounds containing sulfide groups, such as (trimethylsilyl) [3-(trimethoxysilyl)propyl] sulfide, (trimethylsilyl) [3-(triethoxysilyl)propyl] sulfide, (trimethylsilyl) [3-(tripropoxysilyl)propyl] sulfide, (trimethylsilyl) [3-(tributoxysilyl)propyl] sulfide, (trimethylsilyl) [3-(methyldimethoxysilyl)propyl] sulfide, (trimethylsilyl) [3-(methyldiethoxysilyl)propyl] sulfide, (trimethylsilyl) [3-(methyldipropoxysilyl)propyl] sulfide and (trimethylsilyl) [3-(methyldibutoxysilyl)propyl] sulfide;

[0112] N-substituted aziridine compounds such as ethyleneimine and propyleneimine;

[0113] Alkoxysilanes such as methyltriethoxysilane, N,N-bis(trimethylsilyl)-3-aminopropyltrimethoxysilane, N,N-bis(trimethylsilyl)-3-aminopropyltriethoxysilane, N,N-bis(trimethylsilyl)-aminoethyltrimethoxysilane and N,N-bis(trimethylsilyl)-aminoethyltriethoxysilane;

[0114] (Thio)benzophenone compounds having an amino group and / or a substituted amino group, such as 4-N,N-dimethylaminobenzophenone, 4-N,N-di-t-butylaminobenzophenone, 4-N,N-diphenylaminobenzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 4,4'-bis(diphenylamino)benzophenone and N,N,N',N'-bis-(tetraethylamino)benzophenone;

[0115] Benzaldehyde compounds having an amino group and / or a substituted amino group, such as 4-N,N-dimethylaminobenzaldehyde, 4-N,N-diphenylaminobenzaldehyde and 4-N,N-divinylaminobenzaldehyde;

[0116] N-substituted pyroridones, such as N-methyl-2-pyrrolidone, N-vinyl-2-pyrrolidone, N-phenyl-2-pyrrolidone, Nt-butyl-2-pyrrolidone and N-methyl-5-methyl-2-pyrrolidone;

[0117] N-substituted piperidones, such as methyl-2-piperidone, N-vinyl-2-piperidone and N-phenyl-2-piperidone;

[0118] N-substituted lactams, such as N-methyl-ε-caprolactam, N-phenyl-ε-caprolactam, N-methyl-ω-laurilolactam, N-vinyl-ω-laurilolactam, N-methyl-β-propiolactam and N-phenyl-β-propiolactam; and

[0119] N,N-bis-(2,3-epoxypropoxy)-aniline, 4,4-methylene-bis-(N,N-glycidylaniline), tris-(2,3-epoxypropyl)-1,3,5-triazine-2,4,6-trione, N,N-diethylacetamide, N-methylmaleimide, N,N-diethyl urea, 1,3-dimethylethylene urea, 1,3-divinylethylene urea, 1,3-diethyl-2-imidazolidinone, 1-methyl-3-ethyl-2-imidazolidinone, 4-N,N-dimethylaminoacetophenone, 4-N,N-diethylaminoacetophenone, 1,3-bis(diphenylamino)-2-propanone and 1,7-Bis(methylethylamino)-4-heptanone. Modification with the above compound (modifier) ​​can be carried out by a known method. These modified BRs can be used alone or in combinations of two or more.

[0120] For example, products manufactured by Ube Industries, Ltd., ENEOS Materials Co., Ltd., Asahi Kasei, Nippon Zeon, etc. can be used as the BR.

[0121] In the rubber composition for a tread, the BR content in 100 parts by mass of the rubber component is preferably 5 parts by mass or more, and more preferably 10 parts by mass or more. On the other hand, it is preferably 25 parts by mass or less, and more preferably 20 parts by mass or less.

[0122] In the rubber compositions for bead tapex and in the rubber composition for clinch, if necessary, 1 part by mass or more and less than 10 parts by mass of BR may be contained in 100 parts by mass of the rubber component. (a-4) Other rubber components

[0123] In the present embodiment, each rubber composition may contain, if necessary, a rubber (polymer) commonly used for manufacturing tires, such as nitrile rubber (NBR), as other rubber components.

[0124] (b) Joining materials other than rubber components (b-1) Filler

[0125] In this embodiment, each rubber composition preferably contains carbon black, silica, or the like, which is a reinforcing agent, as a filler. In addition to the above-mentioned carbon black and silica, examples of the filler include calcium carbonate, talc, alumina, clay, aluminum hydroxide, and mica. When using silica, it is preferable to use it together with a silane coupling agent.

[0126] In each rubber composition, the total amount of fillers is preferably 40 parts by mass or more, and more preferably 50 parts by mass or more, based on 100 parts by mass of the rubber component. On the other hand, from the viewpoint of dispersibility in the rubber composition, the amount is preferably 150 parts by mass or less, and more preferably 100 parts by mass or less. (i) Soot

[0127] Carbon black is used for the purpose of improving crack growth resistance, durability, resistance to UV deterioration, etc. of tires.

[0128] For example, from the viewpoint of reinforcing property for rubber, the nitrogen adsorption specific surface area (N2SA) of carbon black is preferably 30 m 2 / g or more, more preferably 50 m 2 / g or more and even more preferably 60 m 2 / g or more. On the other hand, from the point of view of heat generation, the area is preferably 250 m 2 / g or less, more preferably 150 m 2 / g or less and more preferably 120 m 2 / g or less. The amount of dibutyl phthalate (DBP) absorbed by carbon black (DBP absorption amount) is, for example, preferably 50 ml / 100 g or more, and more preferably 100 ml / 100 g or more from the viewpoint of rubber rigidity. On the other hand, from the viewpoint of rubber deformation adaptability, the amount is preferably 250 ml / 100 g or less, and more preferably 150 ml / 100 g or less. Note that the nitrogen adsorption specific surface area of ​​carbon black is measured according to ASTM D4820-93, and the DBP absorption amount is measured according to ASTM D2414-93.

[0129] Carbon black is not particularly limited, and examples include furnace black (Furnace Black), such as SAF, ISAF, HAF, MAF, FEF, SRF, GPF, APF, FF, CF, SCF, and ECF; acetylene black (Acetylene Black); thermal black (Thermal Black), such as FT and MT; and channel black (Channel Black), such as EPC, MPC, and CC. These can be used alone or in combinations of two or more.

[0130] In addition to mineral oil carbon black, biomass-derived carbon black obtained by burning lignin or the like, and recycled carbon black obtained by thermally decomposing and purifying rubber products containing carbon black such as tires can be used by appropriately replacing the same amounts of them.

[0131] Specific carbon black is not particularly limited, and examples include N134, N110, N220, N234, N219, N339, N330, N326, N351, N550, and N762. Commercially available products include, for example, products from Asahi Carbon Co., Ltd., Cabot Japan Co., Ltd., Tokai Carbon Co., Ltd., Mitsubishi Chemical Corporation, Lion Corporation, Shin Nikka Carbon Co., Ltd., Columbia Carbon Co., Ltd., etc. These can be used alone or in combinations of two or more.

[0132] For example, in the rubber composition for bead tapex, the content of carbon black based on 100 parts by mass of the rubber component is preferably 50 parts by mass or more, and more preferably 60 parts by mass or more. On the other hand, it is preferably 90 parts by mass or less, and more preferably 80 parts by mass or less.

[0133] In the rubber composition for clinching, the content of carbon black based on 100 parts by mass of the rubber component is preferably 40 parts by mass or more, and more preferably 50 parts by mass or more. On the other hand, it is preferably 70 parts by mass or less, and more preferably 60 parts by mass or less.

[0134] Furthermore, in the rubber composition for tread, the content of carbon black based on 100 parts by mass of the rubber component is preferably 5 parts by mass or more, and more preferably 10 parts by mass or more. On the other hand, it is preferably 25 parts by mass or less, and more preferably 20 parts by mass or less. (ii) Silicon dioxide

[0135] Because silica is not electrically conductive, when used as a reinforcing material, the dielectric constant can be lowered, extending the reading range of electronic components. Furthermore, because the hydration water and surface functional groups contained in silica can capture ozone, ozone resistance can be improved, and tire durability can be improved.

[0136] For silica, it is preferable to use silica with a diameter larger than 8 nm because processability deteriorates if the average primary particle diameter is too small. The thickness is more preferably 9 nm or more, and even more preferably 10 nm or more. On the other hand, from the viewpoint of ensuring reinforcing properties of the rubber and ensuring steering stability on wet roads during driving, the thickness is preferably 25 nm or less, more preferably 20 nm or less, and even more preferably 17 nm or less.

[0137] The average primary particle diameter of silica refers to the average of the values ​​obtained by observing the smallest particle unit of silica forming the agglomerated structure as a circle and measuring the absolute maximum length of the smallest particle as the diameter of the circle. It can be determined by observing with a transmission or scanning electron microscope, measuring 400 or more primary particles of silica observed within the field of view, and averaging them.

[0138] The BET specific surface area of ​​the silica is preferably more than 100 m from the viewpoint of obtaining good durability performance 2 / g and more preferably more than 130 m 2 / g. On the other hand, it is preferably less than 250 m 2 / g and more preferably less than 200 m 2 / g. The above-mentioned BET specific surface area is the value of N2SA measured by the BET method according to ASTM D3037-93.

[0139] Examples of silica include dry silica (anhydrous silica), wet silica (hydrous silica), and colloidal silica. Among these, wet silica is preferred because it contains water of hydration, contains a large amount of silanol groups, and can effectively capture ozone. Furthermore, silica from hydrous glass or the like and silica from biomass materials such as rice hulls, etc., can be used.

[0140] For example, products from Evonik Industries, Rhodia Co., Ltd., Tosoh Silica Co., Ltd., Solvay Japan Co., Ltd., Tokuyama Corporation, etc. can be used as the silicon dioxide.

[0141] In the rubber composition for tread, the content of silica based on 100 parts by mass of the rubber component is preferably 40 parts by mass or more, and more preferably 50 parts by mass or more. On the other hand, from the viewpoint of dispersibility in the rubber composition, the content is preferably 110 parts by mass or less, and more preferably 100 parts by mass or less.

[0142] The rubber composition for bead tapex and the rubber composition for clinching may contain silica if necessary. In this case, considering sufficient extrusion processability and ozone resistance, the silica content based on 100 parts by mass of the rubber composition is, for example, preferably 5 parts by mass or more, and more preferably 10 parts by mass or more. Furthermore, it is preferably 20 parts by mass or less, and more preferably 15 parts by mass or less. By setting such an amount of silica, sufficient extrusion processability and ozone resistance can be obtained. (iii) Silane coupling agents

[0143] When silica is used as a filler, it is preferable to use a silane coupling agent in combination to improve the dispersibility of the silica by reacting with the silica and to improve mechanical properties and formability.

[0144] The silane coupling agent is not particularly restricted. Examples of the silane coupling agent include sulfide-based ones such as bis(3-triethoxysilylpropyl)tetrasulfide, bis(2-triethoxysilylethyl)tetrasulfide, bis(4-triethoxysilylbutyl)tetrasulfide, bis(3-trimethoxysilylpropyl)tetrasulfide, bis(2-trimethoxysilylethyl)tetrasulfide, bis(2-triethoxysilylethyl)trisulfide, bis(4-trimethoxysilylbutyl)trisulfide, bis(3-triethoxysilylpropyl)disulfide, bis(2-triethoxysilylethyl)disulfide, bis(4-triethoxysilylbutyl)disulfide, bis(3-trimethoxysilylpropyl)disulfide, bis(2-trimethoxysilylethyl)disulfide, bis(4-trimethoxysilylbutyl)disulfide, 3-trimethoxysilylpropyl-N,N-dimethylthiocarbamoyltetrasulfide, 2-triethoxysilylethyl-N,N-dimethylthiocarbamoyltetrasulfide and 3-triethoxysilylpropylmethacrylate monosulfide; those based on mercapto, such as 3-mercaptopropyltrimethoxysilane, 2-mercaptoethyltriethoxysilane, and NXT and NXT-Z, manufactured by Momentive; those based on vinyl, such as vinyltriethoxysilane and vinyltrimethoxysilane; those based on amino, such as 3-aminopropyltriethoxysilane and 3-aminopropyltrimethoxysilane; those based on glycidoxy, such as γ-glycidoxypropyltriethoxysilane and γ-glycidoxypropyltrimethoxysilane; those based on nitro, such as 3-nitropropyltrimethoxysilane and 3-nitropropyltriethoxysilane; and Chlorine-based ones, such as 3-chloropropyltrimethoxysilane and 3-chloropropyltriethoxysilane. Among these, a silane coupling agent having a thiocarbonyl group, such as the aforementioned NXT, is preferred. These can be used alone or in combinations of two or more.

[0145] As the silane coupling agent, for example, products from Evonik Industries, Momentive Co., Ltd., Shin-Etsu Silicone Co., Ltd., Tokyo Chemical Industry Co., Ltd., Azumax Co., Ltd., Dow Corning Toray Co., Ltd., etc. can be used.

[0146] For example, the content of the silane coupling agent is preferably more than 3 parts by mass, and more preferably 5 parts by mass or more, based on 100 parts by mass of silica. On the other hand, it is preferably less than 15 parts by mass, and more preferably 10 parts by mass or less. (iv) Other fillers

[0147] In addition to the above-mentioned carbon black and silica, any rubber composition may further contain other fillers commonly used in the tire industry, such as graphite, calcium carbonate, talc, alumina, clay, aluminum hydroxide, mica, and magnesium sulfate. The content of these fillers is, for example, more than 0.1 part by mass and less than 150 parts by mass, based on 100 parts by mass of the rubber component. (b-2) Plasticizer component

[0148] Considering proper dispersion of the powder material during kneading, it is preferable to use a plasticizer component in each rubber composition as needed. Note that the plasticizer component here refers to a component that plasticizes the rubber composition, such as process oil, extender oil for rubber components, liquid rubber, and resin components.

[0149] At this time, in each rubber composition, the content of the plasticizer component based on 100 parts by mass of the rubber component is preferably 2 parts by mass or more, and more preferably 5 parts by mass or more. On the other hand, it is preferably 20 parts by mass or less, and more preferably 15 parts by mass or less.

[0150] It should be noted that the content of a plasticizer also includes the amount of oil contained in rubber (oil-extended rubber) and the like. (i) Oil

[0151] Examples of oil include mineral oil, synthetic oil, vegetable oil, animal oil, or mixtures thereof.

[0152] Examples of mineral oils include paraffinic, aromatic, and naphthenic oils such as products from Idemitsu Kosan Co., Ltd., Sankyo Yuka Kogyo Co., Ltd., ENEOS Co., Ltd., Orisoi Co., Ltd., H&R Co., Ltd., Toyokuni Oil Co., Ltd., Showa Shell Sekiyu Co., Ltd., and Fuji Kosan Co., Ltd. These can be used alone or in combinations of two or more.

[0153] In addition, from the perspective of environmental impact, lubricating oil used in mixers and motors of rubber mixers, waste cooking oil used in restaurants, etc. can be appropriately refined and used as these oils.

[0154] Examples of vegetable oils include linseed oil, rapeseed oil, safflower oil, soybean oil, corn oil, cottonseed oil, rice bran oil, tall oil, sesame oil, perilla oil, castor oil, tung oil, pine oil, pine tar oil, sunflower oil, coconut oil, palm oil, palm kernel oil, olive oil, camellia oil, jojoba oil, macadamia nut oil, peanut oil, grapeseed oil and wood wax.

[0155] Furthermore, vegetable oils also include refined oils (salad oil, etc.) obtained by refining any of the above oils, interesterified oils obtained by interesterification, hydrogenated oils, thermopolymerized oils obtained by thermal polymerization, oxidized polymerized oils obtained by oxidation, waste cooking oils recovered from edible oils, and the like. It should be noted that vegetable oil can be liquid or solid at room temperature (25°C). These can be used alone or in combinations of two or more.

[0156] As the vegetable oil, acylglycerol is preferred, and triacylglycerol is more preferred. Note that acylglycerol refers to a compound in which a hydroxy group of glycerin and a carboxylic acid form an ester bond. The acylglycerol is not particularly limited and may be 1-monoacylglycerol, 2-monoacylglycerol, 1,2-diacylglycerol, 1,3-diacylglycerol, or triacylglycerol. Furthermore, the acylglycerol may be a monomer, a dimer, a trimer, or more. Incidentally, the acylglycerol having a dimer or more can be obtained by thermal polymerization, oxidative polymerization, or the like. Furthermore, acylglycerol may be liquid or solid at room temperature (25°C).

[0157] The method for checking whether acylglycerol is contained in the rubber composition is not particularly limited, but it can be 1H-NMR measurement. For example, a rubber composition containing triacylglycerol is immersed in deuterated chloroform for 24 hours at room temperature (25 °C) to remove the rubber composition, and then 1 H NMR measured at room temperature, signals near 5.26 ppm, near 4.28 ppm, and near 4.15 ppm are observed when the tetramethylsilane (TMS) signal is set to 0.00 ppm. Since these signals are suspected to be signals originating from the hydrogen atom bonded to the carbon atom adjacent to the oxygen atom of the ester group, the acylglycerol content can be verified. Note that "near" here refers to a range of ±0.10 ppm.

[0158] It should be noted that the carboxylic acid is not particularly restricted and can be an unsaturated fatty acid or a saturated fatty acid. Examples of unsaturated fatty acids include monounsaturated fatty acids such as oleic acid and polyunsaturated fatty acids such as linoleic acid and linolenic acid.

[0159] As the vegetable oils, products commercially available from, for example, Idemitsu Kosan Co., Ltd., Sankyo Yuka Kogyo Co., Ltd., ENEOS Co., Ltd., Orisoi Co., Ltd., H&R Co., Ltd., Toyokuni Oil Co., Ltd., Fuji Kosan Co., Ltd. and Nisshin Oillio Group Co., Ltd. can be used. (ii) Liquid rubber

[0160] Liquid rubber is a polymer that is in a liquid state at room temperature (25 °C) and is a rubber component that can be extracted from a vulcanized tire by acetone extraction. Examples of liquid rubber include farnesene-based polymers, liquid diene polymers, and hydrogenated products thereof.

[0161] Farnesene-based polymer is a polymer obtained by polymerizing farnesene and has a structural unit based on farnesene. Farnesene includes isomers such as α-farnesene ((3E,7E)-3,7,11-trimethyl-1,3,6,10-dodecatetraene) and β-farnesene (7,11-dimethyl-3-methylene-1,6,10-dodecatriene).

[0162] The farnesene-based polymer can be a homopolymer of farnesene (farnesene homopolymer) or a copolymer of farnesene and a vinyl monomer (farnesene-vinyl monomer copolymer).

[0163] Examples of the liquid diene polymer include a liquid styrene-butadiene copolymer (liquid SBR), a liquid butadiene polymer (liquid BR), a liquid isoprene polymer (liquid IR), and a liquid styrene-isoprene copolymer (liquid SIR).

[0164] The liquid diene polymer has a polystyrene equivalent weight-average molecular weight (Mw), as measured, for example, by gel permeation chromatography (GPC), of more than 1.0 × 10 3 and less than 2.0 × 10 5 Here, Mw of the liquid diene polymer is a polystyrene conversion value measured by gel permeation chromatography (GPC).

[0165] For example, the content of liquid rubber (total content of farnesene-based liquid polymer, liquid diene polymer, etc.) is preferably more than 1 part by mass and less than 50 parts by mass based on 100 parts by mass of the rubber component in each rubber composition.

[0166] As the liquid rubber, for example, products manufactured by Kuraray Co., Ltd., Clay Valley Co., Ltd., etc. can be used. (iii) Resin component

[0167] The resin component also functions as a tackifying component and can be solid or liquid at room temperature. Specific examples of the resin component include rosin-based resin, styrene resin, coumarone-based resin, terpene resin, C5 resin, C9 resin, C5C9 resin, and acrylic resin, and two or more types can be used in combination. In each rubber composition, the content of the resin component is preferably more than 2 parts by mass and less than 45 parts by mass, and more preferably less than 30 parts by mass, based on 100 parts by mass of the rubber component.

[0168] Rosin-based resin is a resin whose main component is rosin acid, which is obtained by processing pine resin. This rosin-based resin (colophony) can be classified according to the presence or absence of modification and can be classified into unmodified rosin (unmodified rosin) and modified rosin (rosin derivative). Examples of unmodified rosin include tall rosin (also known as tall oil rosin), balsam rosin, wood rosin, disproportionate rosin, polymerized rosin, hydrogenated rosin, and other chemically modified rosins.The modified rosin is a modified version of unmodified rosin, and examples thereof include rosin esters, unsaturated carboxylic acid modified rosin, unsaturated carboxylic acid modified rosin esters, amide compounds of rosin, and amine salts of rosin.

[0169] The styrene resin is a polymer using a styrene monomer as a monomer component, and examples thereof include a polymer obtained by polymerizing a styrene monomer as a main component (50 mass% or more). Specifically, it includes polymer homopolymers obtained by individually polymerizing styrene monomers (styrene, o-methylstyrene, m-methylstyrene, p-methylstyrene, α-methylstyrene, p-methoxystyrene, p-tert-butylstyrene, p-phenylstyrene, o-chlorostyrene, m-chlorostyrene, p-chlorostyrene, etc.), copolymers obtained by copolymerizing two or more of the styrene monomers, and, in addition to this, copolymers obtained by copolymerizing a styrene monomer and other monomers that can be copolymerized with the styrene monomer.

[0170] Examples of the other monomers include acrylonitriles such as acrylonitrile and methacrylate; unsaturated carboxylic acids such as acrylic acid and methacrylic acid; unsaturated carboxylic acid esters such as methyl acrylate and methyl methacrylate; dienes such as chloroprene, butadiene and isoprene; olefins such as 1-butene and 1-pentene; α,β-unsaturated carboxylic acids and acid anhydrides thereof such as maleic anhydride.

[0171] Among coumarone-based resins, coumarone-indene resin is preferred. Coumarone-indene resin is a resin containing coumarone and indene as monomer components, which form the skeleton (main chain) of the resin. In addition to coumarone and indene, a monomer component such as styrene, α-methylstyrene, methylindene, and vinyltoluene may be included in the skeleton.

[0172] For example, the content of the coumarone-indene resin in each rubber composition is preferably more than 1.0 part by mass and less than 50.0 parts by mass based on 100 parts by mass of the rubber component.

[0173] For example, the hydroxyl value (OH value) of coumarone-indene resin is greater than 15 mgKOH / g and less than 150 mgKOH / g. The OH value is the amount of potassium hydroxide required to neutralize acetic acid bonded to a hydroxyl group when 1 g of the resin is acetylated and is expressed in milligrams. It is a value measured by a potentiometric titration method (JIS K 0070: 1992).

[0174] For example, the softening point of coumarone-indene resin is higher than 30 °C and lower than 160 °C. The softening point is the temperature at which the ball falls when the softening point, defined in JIS K 6220-1: 2001, is measured by a ring-and-ball type softening point measuring device.

[0175] Examples of terpene resins include polyterpenes, terpene phenols, and aromatically modified terpene resins. Polyterpene is a resin obtained by polymerizing a terpene compound and a hydrogenated product thereof. The terpene compound is a hydrocarbon with a composition of (C5H8) n or an oxygen-containing derivative thereof, which is a compound containing a terpene classified as monoterpenes (C 10 H 16 ), sesquiterpenes (C 15 H 24 ), diterpenes (C 20 H 32), etc., as the basic skeleton. Examples include α-pinene, β-pinene, dipentene, limonene, myrcene, alloocimene, osimene, α-phellandrene, α-terpinene, γ-terpinene, terpinolene, 1,8-cineole, 1,4-cineole, α-terpineol, β-terpineol, and γ-terpineol.

[0176] Examples of the polyterpene include terpene resins such as α-pinene resin, β-pinene resin, limonene resin, dipentene resin, and β-pinene / limonene resin, which are made from the above-mentioned terpene compound, as well as a hydrogenated terpene resin obtained by hydrogenating the terpene resin. Examples of the terpene phenol include a resin obtained by copolymerizing the above-mentioned terpene compound and the phenol compound, and a resin obtained by hydrogenating the above-mentioned resin. In particular, a resin obtained by condensing the above-mentioned terpene compound, the phenol compound, and formalin can be mentioned. Examples of the phenol compound include phenol, bisphenol A, cresol, and xylenol. Examples of the aromatically modified terpene resin include a resin obtained by modifying a terpene resin with an aromatic compound and a resin obtained by hydrogenating the above-mentioned resin.The aromatic compound is not particularly limited as long as it is a compound having an aromatic ring, and examples thereof include phenol compounds such as phenol, alkylphenol, alkoxyphenol, and phenol containing unsaturated hydrocarbon group; naphthol compounds such as naphthol, alkylnaphthol, alkoxynaphthol, and naphthols containing unsaturated hydrocarbon group; styrene derivatives such as styrene, alkylstyrene, alkoxystyrene, styrene containing unsaturated hydrocarbon group; coumarone, and indene.

[0177] "C5 resin" refers to a resin obtained by polymerizing a C5 fraction. Examples of the C5 fraction include petroleum fractions with 4 to 5 carbon atoms, such as cyclopentadiene, pentene, pentadiene, and isoprene. A dicyclopentadiene resin (DCPD resin) is preferably used as the C5-based petroleum resin.

[0178] The "C9 resin" refers to a resin obtained by polymerizing a C9 fraction, and may be hydrogenated or modified. Examples of the C9 fraction include petroleum fractions having 8 to 10 carbon atoms, such as vinyltoluene, alkylstyrene, indene, and methylindene. As specific examples, a coumarone-indene resin, a coumarone resin, an indene resin, and an aromatic vinyl resin are preferably used. As the aromatic vinyl-based resin, a homopolymer of α-methylstyrene (AMS resin) or styrene, or a copolymer of α-methylstyrene and styrene is preferred because it is economical, easy to process, and excellent in heat generation. A copolymer of α-methylstyrene and styrene is more preferred. As the aromatic vinyl-based resin, for example, those commercially available from Clayton Co., Eastman Chemical Co., etc., can be used.

[0179] "C5C9 resin" refers to a resin obtained by polymerizing the C5 fraction and the C9 fraction, and may be hydrogenated or modified. Examples of the C5 fraction and the C9 fraction include the petroleum fractions mentioned above. For example, those commercially available from Tosoh Corporation, LUHUA Co., etc. can be used as the C5C9 resin.

[0180] Although the acrylic resin is not particularly limited, a solvent-free acrylic resin can be used, for example.

[0181] As the solvent-free acrylic resin, a (meth)acrylic resin (polymer) synthesized by a high-temperature continuous polymerization method (high-temperature continuous lump polymerization method: a method described in US 4,414,370 B, JP 84-6207 A, JP 93-58805 A, JP 89-313522 A, US 5,010,166 B, Toagosei Synthetic Research Annual Report TREND2000 No. 3, pp. 42-45, and the like) without using polymerization initiators, chain transfer agents, organic solvents, etc. as auxiliary raw materials as much as possible can be mentioned. In the present invention, (meth)acrylic means methacrylic and acrylic.

[0182] Examples of the monomer component constituting the acrylic resin include (meth)acrylic acid and (meth)acrylic acid derivatives such as (meth)acrylic acid esters (alkyl esters, aryl esters and aralkyl esters, etc.), (meth)acrylamide and (Meth)acrylamide derivatives.

[0183] In addition, as the monomer component constituting the acrylic resin, aromatic vinyl compounds such as styrene, α-methylstyrene, vinyltoluene, vinylnaphthalene, divinylbenzene, trivinylbenzene, divinylnaphthalene, and the like can be used together with (meth)acrylic acid or (meth)acrylic acid derivatives.

[0184] The acrylic resin may be a resin composed solely of a (meth)acrylic component or a resin that also contains a component other than the (meth)acrylic component. Furthermore, the acrylic resin may contain a hydroxyl group, a carboxyl group, a silanol group, or the like.

[0185] Examples of the resin component that can be used include products of Maruzen Petrochemical Co., Ltd., Sumitomo Bakelite Co., Ltd., Yasuhara Chemical Co., Ltd., Tosoh Corporation, Rutgers Chemicals Co., Ltd., BASF Co., Ltd., Clayton Co., Ltd., Nitto Chemical Co., Ltd., Nippon Shokubai Co., Ltd., ENEOS Co., Ltd., Arakawa Chemical Industry Co., Ltd., Taoka Chemical Industry Co., Ltd., etc. (b-3) Curable resin component

[0186] Each rubber composition preferably contains a curable resin component such as a modified resorcinol resin or a modified phenolic resin as a heat resistance improver to suppress changes in E* at high temperatures.

[0187] Specific examples of modified resorcinol resins include Sumikanol 620 (modified resorcinol resin) manufactured by Taoka Chemical Co., Ltd., and specific examples of modified phenolic resins include PR12686 (cashew nut oil modified phenolic resins) manufactured by Sumitomo Bakelite Co., Ltd.

[0188] The content of the curable resin component is, for example, preferably 1 part by mass or more, and more preferably 2 parts by mass or more, based on 100 parts by mass of the rubber component, from the viewpoint of sufficiently improving the complex elastic modulus and maintaining a large reaction force during deformation. On the other hand, from the viewpoint of maintaining fracture strength, the content is preferably 10 parts by mass or less, and more preferably 8 parts by mass or less.

[0189] When using a modified resorcinol resin, it is preferable to also include a methylene donor as a curing agent. Examples of the methylene donor include hexamethylenetetramine (HMT), hexamethoxymethylolmelamine (HMMM), and hexamethylolmelamine pentamethyl ether (HMMPME). It is preferably contained in an amount of 5 parts by mass or more, and more preferably about 15 parts by mass. If it is too little, a sufficient complex modulus may not be obtained. On the other hand, if the amount is too large, the viscosity of the rubber may increase, and processability may deteriorate.

[0190] As a specific methylene donor, for example, Sumikanol 507 manufactured by Taoka Chemical Industry Co., Ltd. can be used. (b-4) Lubricant (stearic acid)

[0191] Each rubber composition may also contain a lubricant. A lubricant based on a fatty acid derivative, such as stearic acid, is preferably used as the lubricant. Conventionally known stearic acids can be used as the stearic acid. Specifically, stearic acids manufactured by NOF Corporation, Kao Corporation, Fujifilm Wako Pure Chemical Industries, Ltd., Chiba Fatty Acid Co., Ltd., etc., can be used. Furthermore, Structol WB16 manufactured by Structol Co., Ltd., and the like can also be used.

[0192] For example, the content of stearic acid is preferably more than 0.5 parts by mass and less than 10.0 parts by mass based on 100 parts by mass of the rubber component. (b-5) Antioxidants

[0193] Each rubber composition may also contain an antioxidant. The antioxidant content is, for example, more than 1 part by mass and less than 10 parts by mass, based on 100 parts by mass of the rubber component.

[0194] Examples of the antioxidant include naphthylamine-based antioxidants such as phenyl-α-naphthylamine; diphenylamine-based antioxidants such as octylated diphenylamine and 4,4'-bis(α,α'-dimethylbenzyl)diphenylamine; p-phenylenediamine-based antioxidants such as N-isopropyl-N'-phenyl-p-phenylenediamine, N-(1,3-dimethylbutyl)-N'-phenyl-p-phenylenediamine, and N,N'-di-2-naphthyl-p-phenylenediamine; quinoline-based antioxidants such as a polymer of 2,2,4-trimethyl-1,2-dihydroquinoline; monophenolic antioxidants such as 2,6-di-t-butyl-4-methylphenol and styrenated phenol; and bis-, tris-, or polyphenolic antioxidants, such as tetrakis[methylene-3-(3',5'-di-t-butyl-4'-hydroxyphenyl)propionate]methane. These can be used alone or in combinations of two or more.

[0195] As specific antioxidants, for example, products manufactured by Seiko Chemical Co., Ltd., Sumitomo Chemical Co., Ltd., Ouchi Shinko Chemical Industry Co., Ltd., Flexsys Co., Ltd., etc. can be used. (b-6) Zinc oxide

[0196] Any rubber composition can contain zinc oxide. The zinc oxide content is, for example, more than 0.5 parts by mass and less than 10 parts by mass based on 100 parts by mass of the rubber component. Conventionally known zinc oxides can be used, such as products from Mitsui Mining & Smelting Co., Ltd., Toho Zinc Co., Ltd., Hakusui Tech Co., Ltd., Shodo Chemical Industry Co., Ltd., Sakai Chemical Industry Co., Ltd., etc. (b-7) Wax

[0197] Any rubber composition may contain wax. For example, the wax content is preferably 0.5 to 20 parts by mass, more preferably 1.0 to 15 parts by mass, and even more preferably 1.5 to 10 parts by mass, based on 100 parts by mass of the rubber component.

[0198] The wax is not particularly limited, and examples include petroleum waxes such as paraffin wax and microcrystalline wax; natural waxes such as vegetable waxes and animal waxes; and synthetic waxes such as polymers of ethylene or propylene. These can be used alone or in combinations of two or more.

[0199] For example, products manufactured by Ouchi Shinko Chemical Industry Co., Ltd., Nippon Seiro Co., Ltd. and Seiko Kagaku Co., Ltd. can be used as the wax. (b-8) Crosslinking agents and vulcanization accelerators

[0200] Each rubber composition preferably contains a crosslinking agent, such as sulfur. The content of the crosslinking agent is, for example, more than 0.1 parts by mass and less than 10.0 parts by mass, based on 100 parts by mass of the rubber component. It should be noted that the sulfur content refers to the pure sulfur content, and when insoluble sulfur is used, it refers to the content excluding the oil content.

[0201] Sulfur includes sulfur powder, precipitated sulfur, colloidal sulfur, insoluble sulfur, highly dispersed sulfur, soluble sulfur, and the like, which are commonly used in the rubber industry. These can be used alone or in combinations of two or more.

[0202] As the sulfur, for example, products manufactured by Tsurumi Chemical Industry Co., Ltd., Karuizawa Sulfur Co., Ltd., Shikoku Chemicals Corporation, Flexsys Co., Ltd., Nippon Kanryu Kogyo Co., Ltd., Hosoi Chemical Industry Co., Ltd., etc. can be used.

[0203] Crosslinking agents other than sulfur can be used. Specific examples of crosslinking agents other than sulfur include vulcanizing agents containing a sulfur atom, such as Tackirol V200 manufactured by Taoka Chemical Industry Co., Ltd., DURALINK HTS (1,6-hexamethylene sodium dithiosulfate dihydrate) manufactured by Flexsys Co., Ltd., and KA9188 (1,6-bis(N,N'-dibenzylthiocarbamoyldithio)hexane; (hybrid crosslinking agent)) manufactured by Lanxess Co., Ltd., and organic peroxides such as dicumyl peroxide.

[0204] Each rubber composition preferably contains a vulcanization accelerator. For example, the content of the vulcanization accelerator is preferably more than 0.3 parts by mass and less than 10.0 parts by mass, based on 100 parts by mass of the rubber component.

[0205] Examples of the vulcanization accelerator include thiazole-based vulcanization accelerators such as 2-mercaptobenzothiazole, di-2-benzothiazolyl disulfide, and N-cyclohexyl-2-benzothiadylsulfenamide; Thiuram-based vulcanization accelerators such as tetramethylthiuram disulfide (TMTD), tetrabenzylthiuram disulfide (TBzTD) and tetrakis(2-ethylhexyl)thiuram disulfide (TOT-N); Sulfenamide-based vulcanization accelerators such as N-cyclohexyl-2-benzothiazolesulfenamide, Nt-butyl-2-benzothiazolylsulfenamide, N-oxyethylene-2-benzothiazolesulfenamide, N-oxyethylene-2-benzothiazolesulfenamide, and N,N'-diisopropyl-2-benzothiazolesulfenamide; and guanidine-based vulcanization accelerators such as diphenylguanidine, diortho-tolylguanidine, and ortho-tolylbiguanidine. These can be used alone or in combinations of two or more. (b-9) Other

[0206] In addition to the components described above, any rubber composition may, if desired, contain additives commonly used in the tire industry, such as organic fillers such as cellulose fibers and organic peroxides. The content of these additives is, for example, more than 0.1 parts by mass and less than 50 parts by mass, based on 100 parts by mass of the rubber component.

[0207] Furthermore, for each rubber composition, the loss tangent (tanδ) can be adjusted by adjusting the amount of carbon black or sulfur, etc., so that the target loss tangent (tanδ) can be adjusted without the need for excessive trial and error.

[0208] The complex elastic modulus (E*) can be adjusted by adjusting the amount of the curable resin component. Furthermore, the complex elastic modulus (E*) can also be adjusted by adjusting the amount of carbon black or sulfur. In particular, the complex elastic modulus (E*) can be increased by increasing the amount of carbon black or sulfur. However, as the amount of carbon black is increased, the exotherm increases, and as the amount of sulfur is increased, the exotherm decreases. Therefore, it is preferable to first determine whether to use a curable resin component and its composite amount, then adjust the amount of sulfur, and finally adjust the amount of carbon black. According to this method, a desired complex elastic modulus (E*) can be achieved without the need for excessive trial and error. (2) Manufacture of each rubber composition

[0209] Each rubber composition is produced using a general method. For example, it can be produced by a production process comprising a basic kneading step in which the rubber component and a filler such as carbon black are kneaded, and a final kneading step in which the kneaded material obtained in the basic kneading step is kneaded with a crosslinking agent.

[0210] Kneading can be carried out using a known kneader (of the closed type), such as a Banbury mixer, a kneader or an open roll.

[0211] The kneading temperature of the basic kneading step is, for example, higher than 50°C and lower than 200°C, and the kneading time is, for example, more than 30 seconds and less than 30 minutes. In the basic kneading process, in addition to the above components, coupling agents conventionally used in the rubber industry, such as plasticizers such as oil, stearic acid, zinc oxide, antioxidants, waxes, and vulcanization accelerators, can be appropriately added and kneaded as needed.

[0212] In the final kneading step, the kneaded product obtained in the initial kneading step and the crosslinking agent are kneaded. The kneading temperature of the final kneading step is, for example, above room temperature and below 80°C, and the kneading time is, for example, longer than 1 minute and shorter than 15 minutes. In the final kneading step, in addition to the above components, a vulcanization accelerator, zinc oxide, etc., can be appropriately added and kneaded as needed.

[0213] The rubber composition for bead stapex, the rubber composition for clinch, and the rubber composition for tread obtained as described above are then extruded into a predetermined shape to be formed into a bead stapex, a clinch, and a tread, respectively. 3. Tire manufacturing

[0214] The tire according to this embodiment can be manufactured by a normal process except for embedding an electronic component during molding. First, each rubber composition obtained above is molded into a predetermined shape to produce a bead tread, a clinch, and a tread. Next, they are combined with other rubber elements on a tire molding machine to produce an unvulcanized tire.

[0215] Specifically, the inner liner (a member for ensuring the airtightness of the tire), the carcass (a member for withstanding the load, impact, and inflation pressure received by the tire), and a belt member (a member for strongly tensioning the carcass to increase the rigidity of the tread, etc.) are wound on a forming drum. Both ends of the carcass are attached to both side edges, a bead portion (a member for attaching the tire to the rim) is arranged, and they are formed into a ring shape. Then, the tread is bonded at the center of the outer circumference, and the sidewall portion is bonded in the radial direction on the outer side to form a side part, thus producing an unvulcanized tire. In this unvulcanized tire manufacturing process, an electronic component is embedded in a predetermined position.

[0216] A tire is then obtained by heating and pressurizing the unvulcanized tire produced as described above in a vulcanizing machine. The vulcanization process can be carried out using known vulcanizing agents. The vulcanization temperature is, for example, higher than 120°C and lower than 200°C, and the vulcanization time is, for example, longer than 5 minutes and shorter than 15 minutes.

[0217] As described above, the tire obtained as described above is provided with an electronic component between the bead tapping and the carcass layer; the complex modulus of the bead tapping is increased, and the product of the clinching loss tangent and the circumferential length of the electronic component is controlled to a certain value or less to reduce the amount of deformation around the electronic component during driving. Since this can suppress peeling and damage to the electronic component inside the tire, the durability of the tire to which the electronic component is attached during driving can be improved.

[0218] The tires according to the present invention can be suitably used as passenger car tires, large passenger car tires, large SUV tires, truck and bus tires, two-wheeled vehicle tires, competition tires, studless tires (winter tires), all-season tires, and run-flat tires. They are particularly preferably used as passenger car tires. [Example]

[0219] In the following, examples (Examples) considered preferable for implementation are shown, but the scope of the present invention is not limited to these examples.

[0220] Tires made of a bead tread, clinch, and tread composed of the rubber compositions for bead tread, clinch rubber composition, and tread rubber composition based on Tables 1 to 3, respectively, and the various bonding materials shown below, along with other rubber elements, were produced. The tires thus produced (tire sizes 205 / 55 R16, 195 / 65R15, and 155 / 60R16) are considered, and the results are shown in Tables 4 to 9. 1. Preparation of each rubber composition

[0221] A rubber composition for bead tapex, a rubber composition for clinch, and a rubber composition for tread are prepared using various bonding materials shown below. (1) Connecting materials (a) Rubber component (a-1) No.: TSR20 (a-2) SBR-1: SBR1502, manufactured by ENEOS Materials Co. Ltd.

[0222] (Styrene content: 23.5 mass%, vinyl bond amount: 16 mass%, non-oil extended) (a-3) SBR-2: SE-0212, manufactured by Sumitomo Chemical Co., Ltd.

[0223] (Solution polymerization SBR: non-oil extended) (a-4) SBR-3: Nipol-NS540, manufactured by Zeon Corporation (Solution polymerization SBR: 25% oil extended) (a-5) BR: UBEPOL BR150B (Hicys BR), manufactured by Ube Industries, Ltd. (Mw: 440,000, cis-1,4-bond content: 96 mass%)

[0224] (b) Joining materials other than rubber components (b-1) Carbon black-1: Diablack N220, manufactured by Mitsubishi Chemical Corporation (b-2) Carbon black-2: DIABLACK N330, manufactured by Mitsubishi Chemical Corporation (Average particle size: 31 nm, CTAB: 78 m 2 / g, N2SA: 79 m 2 / G) (b-3) Carbon black-3: Diablack N351H, manufactured by Mitsubishi Chemical Corporation (Average particle size: 31 nm, CTAB: 78 m 2 / g, N2SA: 79 m 2 / G) (b-4) Silicon dioxide: Ultrasil VN3, manufactured by Eponic Industries (N2SA: 175 m 2 / g, average primary particle diameter: 17 nm) (b-5) Oil: Viva Tec 500 (TDAE oil), manufactured by H&R Co., Ltd. (b-6) Thermosetting resin: PR12686, manufactured by Sumitomo Bakelite Co., Ltd. (Cashew nut oil-modified phenolic resin) (b-7) Resin-1: SP-1068, manufactured by Schenectady International Co., Ltd. (Alkylphenol / formaldehyde condensation resin)

[0225] (b-8) Resin-2: Sylvatraxx4401, manufactured by Clayton Co., Ltd. (α-methylstyrene resin)

[0226] (b-9) Stearic acid: Stearic acid “Tsubaki”, manufactured by NOF Corporation

[0227] (b-10) Antioxidant-1: Nocrac 6C, manufactured by Ouchi Shinko Chemical Industry Co., Ltd. (N-(1,3-Dimethylbutyl)-N'-phenyl-p-phenylenediamine)

[0228] (b-11) Antioxidant-2: Nocrac RD, manufactured by Ouchi Shinko Chemical Industry Co., Ltd. (Poly(2,2,4-trimethyl-1,2-dihydroquinoline))

[0229] (b-12) Zinc oxide: 2 types of zinc oxide manufactured by Mitsui Mining & Smelting Co., Ltd.

[0230] (b-13) Sulfur: Powdered sulfur manufactured by Karuizawa Sulfur Co., Ltd.

[0231] (b-14) Accelerator-1: Nocceler-NS, manufactured by Ouchi Shinko Chemical Industry Co., Ltd. (N-tert-butyl-2-benzothiazolylsulfenamide (TBBS))

[0232] (b-15) Accelerator-2: Nocceler D, manufactured by Ouchi Shinko Chemical Industry Co., Ltd. (N,N'-diphenylguanidine (DPG))

[0233] (b-16) Accelerator-3: Nocceler H, manufactured by Ouchi Shinko Chemical Industry Co., Ltd. (Hexamethylenetetramine (HMT))(2) Production of rubber composition for Wulstapex

[0234] According to each formulation shown in Table 1, materials other than sulfur and the vulcanization accelerator are kneaded for 5 minutes at 150 °C using a Banbury mixer to obtain a kneaded product. Note that each compound amount is in parts by mass.

[0235] Next, sulfur and a vulcanization accelerator are added to the kneaded product and kneaded for 5 minutes at 80 °C using an open roll to obtain rubber compositions for bead taps from BA-1 to BA-8. [Table 1] material BA-1 BA-2 BA-3 BA-4 BA-5 BA-6 BA-7 BA-8 (Recipe) NR 85 85 85 85 85 85 85 85 SBR-1 15 15 15 15 15 15 15 15 Soot-2 70 75 75 72 75 75 70 75 Öl 2 7 7 3 7 7 7 12 Thermosetting resin 9 9 10 12 15 17 8 8 Harz-1 2 2 2 2 2 2 2 2 Stearic acid 2 2 2 2 2 2 2 2 zinc oxide 3, 5 3, 5 3,5 3,5 3,5 3,5 3,5 3,5 sulfur 3, 2 3,2 3, 2 3,8 3, 2 3, 2 3, 2 3,2 Accelerator-1 2,35 2,35 2,35 2,35 2,35 2,35 2,35 2,35 Accelerator-3 1, 5 1,5 1,5 1,5 1,5 1,5 1,5 1,5 (Physical properties) 70 °C-tanδ 0,18 0,20 0,20 0,18 0,20 0,20 0,18 0,20 70 °CE* (MPa) 36 34 41 52 59 71 29 28 (3) Preparation of rubber composition for clinch

[0236] In parallel, based on the recipes shown in Table 2, rubber compositions for Clinch CA-1 to CA-4 are obtained in the same way as the rubber compositions for Wulstapex. [Table 2] material CA-1 CA-2 CA-3 CA-4 (Recipe) NR 40 60 60 60 BR 60 40 40 40 Soot-3 67 72 72 72 Öl 10 10 13 16 Harz-1 2 2 2 2 Stearic acid 3 3 3 3 Antioxidant-1 1,5 1,5 1,5 1,5 Antioxidant-2 1,5 1,5 1,5 1,5 zinc oxide 1,5 1,5 1,5 1,5 sulfur 2,33 2,7 2,7 2,7 Accelerator-1 3 3 3 3 (Physical properties) 70 °C-tanδ 0,16 0,15 0,16 0,17 70 °CE* (MPa) 10 12 11 10 (4) Production of rubber composition for tread

[0237] In parallel, based on each recipe shown in Table 3, rubber compositions for treads TR-1 to TR-3 are obtained in the same manner as in the production of rubber compositions for bead tapex. [Table 3] material TR-1 TR-2 TR-3 (Recipe) NR 10 10 10 SBR-2 56 56 56 SBR-3 15, 4 15, 4 15, 4 (Rubber) (12,3) (12,3) (12,3) (oil content) (3,1) (3,1) (3,1) Butadiene rubber 21,7 21,7 21,7 Soot-1 25 15 5 Silicon dioxide 55 70 85 Öl 10 10 10 Harz-2 10 10 10 Stearic acid 2 2 2 Antioxidant-1 2,5 2,5 2,5 Antioxidant-2 1 1 1 zinc oxide 2 2 2 sulfur 1,5 1,5 1,5 Accelerator-1 2 2 2 Accelerator-2 2,5 2,5 2,5 (Physical properties) 30 °C-tanδ 0,25 0,23 0,21 0 °C-tanδ 0,50 0,55 0,60 2. Forming of bead tapex, clinch and tread

[0238] Next, each rubber composition obtained above is formed into a bead tapex, a clinch, and a tread of a predetermined shape.

[0239] Among the physical properties listed in Tables 1 to 3, 70 °C-tanδ, 30 °C-tanδ and 0 °C-tanδ are determined by measuring a test piece cut from each tire to have a size of 20 mm in length × 4 mm in width × 1 mm in thickness under the conditions of a frequency of 10 Hz, an initial strain of 5%, a dynamic strain rate of 1%, a tensile deformation mode and at a temperature of 70 °C, 30 °C and 0 °C, respectively, using “Eplexor (registered trademark)” manufactured by GABO.

[0240] In addition, 70 °CE* is determined by measuring a test piece prepared in the same manner as above under the conditions of a temperature of 70 °C, a frequency of 10 Hz, an initial strain of 5%, a dynamic strain rate of 1%, and a tensile deformation mode using “Eplexor (registered trademark)” manufactured by GABO.

[0241] It should be noted that when manufacturing the test piece, the longitudinal direction of the test piece is made to coincide with the circumferential direction. Furthermore, in the case of the tread, the thickness direction of the test piece is made to coincide with the radial direction of the tire, and in the cases of bead apex and clinching, the thickness direction is made to coincide with the width direction of the tire. If the thickness of each element is less than 1 mm, a test piece of a certain thickness must be taken from the thickest part of the element on the tire equatorial plane. For example, if the thickness on the tire equatorial plane is 0.5 mm, a test piece measuring 20 mm in length x 4 mm in width x 0.5 mm in thickness must be taken. 3. Tire manufacturing

[0242] Next, the bead tapex, clinch, and tread obtained above are bonded with other tire elements according to the combinations shown in Tables 4 to 9 to form an unvulcanized tire, and then press vulcanization is performed under the conditions of 170 °C for 10 minutes to produce each test tire shown in Tables 4 to 9.

[0243] When forming an unvulcanized tire, an electronic component (RFID) with the dimensions shown in Tables 4 to 9 (weight W (g) and longitudinal length (tire circumferential length) L (mm)) is embedded in the embedding position shown in Tables 4 to 9. At this time, a plating layer containing copper and nickel is previously formed on the surface of the electronic component, and a coating layer for rubber with a thickness of 0.5 mm is provided.

[0244] In Tables 4 to 9, embedding position 1 indicates that the electronic component is embedded between the bead tapex and the carcass layer on the inside in the tire width direction (see Fig. 1), Embedding position 2 indicates that the electronic component is embedded between the bead tread and the carcass layer on the outside in the tire width direction (see Fig. 2), Embedding position 3 indicates that the electronic component is embedded on the outside in the tire width direction and outside the carcass layer (see Fig. 4), and the embedding position 4 indicates that the electronic component is embedded on the outer side in the tire width direction between the carcass layer and the sidewall portion (see Fig. 5). 4. Calculation of parameters

[0245] Next, the tire weight (kg), section height Ht (mm), and outer diameter Dt (mm) are measured for each test tire (different from the tire from which the test piece was taken), and the maximum load capacity (kg) is calculated based on these values. In addition, the shortest distance D1 (mm) from the electronic component to the tire outer surface and the tire radial distance D2 (mm) from the top of the bead core to the electronic component are measured, and (D2 / H) is calculated.

[0246] And 70 °C-tanδ-CA × L, 70 °CE*-BA / D2, tire weight / maximum load capacity, 70 °C-tanδ-BA × D2, 70 °CE*-BA / L, (70 °C-tanδ-BA + 70 °C-tanδ-CA) × L, (70 °CE*-BA / 70 °CE*-CA) / L, (70 °CE*-BA + 70 °CE*-CA) / L, and D1 × W are calculated. 5. Performance evaluation test (evaluation of tire durability during driving)

[0247] After installing each test tire on all wheels of a vehicle (domestic FF vehicle, displacement 2000 cc) and inflating it with air to a pressure of 230 kPa, the vehicle runs on a test track under an overload condition. During the test, the vehicle repeatedly encounters uneven road surfaces and drives normally. The vehicle starts traveling at a speed of 50 km / h and gradually increases speed with each repetition. The running speed immediately before the driver senses an abnormality is recorded.

[0248] Next, the results for Comparative Example 1-1, Comparative Example 2-1, and Comparative Example 3-1 (referred to as "Comparative Example" in the formula below) are set to 100, and the results are indexed based on the formulas below to evaluate the tire's driving durability. The larger the value, the better the tire's driving durability. Tire durability during driving = [(Test tire results) / (Comparative tire results)] × 100 [Table 4] Example 1-1 1-2 1-3 1-4 1-5 1-6 1-7 1-8 Tires Tire size 205 / 5 5R16 205 / 5 5R16 205 / 5 5R16 205 / 5 5R16 205 / 5 5R16 205 / 5 5R16 205 / 5 5R16 205 / 5 5R16 Tire weight (kg) 7, 8 7,0 7,2 7,7 7,7 7,4 6,8 7,0 Cross-sectional height Ht (mm) 113 113 114 112 113 113 114 112 Outer diameter Dt (mm) 632 635 633 632 632 630 632 634 Maximum load capacity (kg) 515 522 517 515 515 510 515 519 Recipe Wulstapex (BA) BA-1 BA-2 BA-3 BA-3 BA-4 BA-5 BA-6 BA-1 Clinch (CA) CA-1 CA-1 CA-1 CA-2 CA-2 CA-1 CA-3 CA-3 Tread (TR) TR-1 TR-1 TR-2 TR-2 TR-2 TR-2 TR-2 TR-3 Physical properties 70 °C-tanδ-BA 0,18 0,20 0,20 0,20 0,18 0,20 0,20 0,18 70 °CE*-BA (Mpa) 36 34 41 41 52 59 71 36 70 °C-tanδ-CA 0,16 0,16 0,16 0,15 0,15 0,16 0,16 0,16 70 °CE*-CA (Mpa) 10 10 10 12 12 10 11 11 30 °C-tanδ-TR 0,25 0,25 0,23 0,23 0,23 0,23 0,23 0,21 0 °C-tanδ-TR 0,50 0,50 0,55 0,55 0,55 0,55 0,55 0,60 Electronic components Embedding position 2 3 3 2 2 3 2 2 Weight W(g) 0, 4 0,4 0,4 0,4 0,4 0,4 0,4 0,4 Tire circumference L (mm) 70 70 65 65 60 60 55 50 Longitudinal length (mm) 100 80 80 70 70 60 50 40 D2 / H 0,4 0,4 0,4 0,4 0,4 0,4 0,4 0,3 D1 (mm) 6,5 6,5 6,5 6,5 6,5 6,5 6,5 5,5 D2 (mm) 45 45 45 40 45 40 40 35 parameter 70 °C-tanδ-CA × L 11,20 11,20 10,40 9,75 9,00 9,60 8,80 8,00 70 °CE*-BA / D2 0,80 0,76 0, 91 1,03 1,16 1,48 1,78 1,03 Tire weight / maximum load capacity 0,0152 0,0134 0,0139 0,0150 0,0150 0,0145 0,0132 0,0135 70 °C-tanδ-BA × D2 8, 10 9,00 9,00 8,00 8, 10 8,00 8,00 6,30 70 °CE*-BA / L 0,51 0,49 0,63 0,63 0,87 0, 98 1,29 0,72 (70 °C-tanδ-BA + 70 °C-tanδ-CA) × L 23,8 25,2 23,4 22,8 19,8 21,6 19,8 17,0 (70 °CE*-BA / 70 °CE*-CA) / L 0,051 0,049 0,063 0,053 0,072 0,098 0,117 0,065 (70 °CE*-BA + 70 °CE*-CA) / L 0,66 0,63 0,78 0,82 1,07 1,15 1,49 0,94 D1 × W 2,6 2,6 2,6 2,6 2,6 2,6 2,6 2,2 Evaluation results (tire durability during driving) Results 125 120 130 135 135 140 140 150 [Table 5] Example Comparison example 1-9 1-10 1-1 1-2 1-3 1-4 1-5 1-6 Tires Tire size 205 / 5 5R16 205 / 5 5R16 205 / 5 5R16 205 / 5 5R16 205 / 5 5R16 205 / 5 5R16 205 / 5 5R16 205 / 5 5R16 Tire weight (kg) 7,7 7,6 7,5 7,7 7,6 7,8 7,6 7,8 Cross-sectional height Ht (mm) 113 113 113 114 112 113 114 113 Outer diameter Dt (mm) 633 632 633 634 633 632 634 632 Maximum load capacity (kg) 517 515 517 519 517 515 519 515 Recipe Wulstapex (BA) BA-2 BA-3 BA-1 BA-2 BA-7 BA-2 BA-3 BA-8 Clinch (CA) CA-4 CA-4 CA-1 CA-1 CA-1 CA-2 CA-2 CA-2 Tread (TR) TR-3 TR-3 TR-1 TR-1 TR-3 TR-1 TR-1 TR-1 Physical properties 70 °C-tanδ-CA 0,20 0,20 0,18 0,20 0,18 0,20 0,20 0,20 70 °C-tanδ-BA 34 41 36 34 29 34 41 28 70 °CE*-BA (Mpa) 0,17 0,17 0,15 0,16 0,15 0,15 0,15 0,15 70 °CE*-CA (Mpa) 10 10 12 10 10 12 12 12 30 °C-tanδ-TR 0,21 0,21 0,25 0,25 0,21 0,25 0,25 0,25 0 °C-tanδ-TR 0,60 0,60 0,50 0,50 0,60 0,50 0,50 0,50 Electronic components Embedding position 10 10 12 10 10 12 12 12 Weight W(g) 0,4 0,4 0,4 0,4 0,4 0,4 0,4 0,4 Tire circumference L (mm) 50 45 55 75 70 60 70 70 Longitudinal length (mm) 40 40 40 40 80 80 80 40 D2 / H 0,4 0,3 0,4 0,4 0,2 0,3 0,3 0,3 D1 (mm) 5,5 5,5 7,0 6,5 6,5 6,0 8,0 7,0 D2 (mm) 40 35 40 40 25 30 35 35 parameter 70 °C-tanδ-CA × L 8,50 7,65 8,25 12,00 11,20 9,00 10,50 10,50 70 °CE*-BA / D2 0,85 1,17 0,90 0,85 1,16 1,13 1,17 0,80 Tire weight / maximum load capacity 0,0149 0,0148 0,0145 0,0148 0,0147 0,0151 0,0146 0,0151 70 °C-tanδ-BA × D2 8,00 7,00 7,20 8,00 4,50 6,00 7,00 7,00 70 °CE*-BA / L 0,68 0,91 0,65 0,45 0,41 0,57 0,59 0,40 (70 °C-tanδ-BA + 70 °C-tanδ-CA) × L 18,5 16,7 18,2 27,0 23,8 21,0 24,5 24,5 (70 °CE*-BA / 70 °CE*-CA) / L 0,068 0,091 0,055 0,045 0,41 0,57 0,59 0,40 (70 °CE*-BA + 70 °CE*-CA) / L 2,2 2,2 2,8 2,6 2,6 2,4 3,2 2,8 Evaluation results (tire durability during driving) Results 145 150 100 75 85 85 85 80 [Table 6] Example 2-1 2-2 2-3 2-4 2-5 2-6 2-7 2-8 Tires Tire size 195 / 6 5R15 195 / 6 5R15 195 / 6 5R15 195 / 6 5R15 195 / 6 5R15 195 / 6 5R15 195 / 6 5R15 195 / 6 5R15 Tire weight (kg) 8,0 7,8 7,8 7,7 7,7 7,8 7,8 8,0 Cross-sectional height Ht (mm) 127 125 126 126 127 128 125 127 Outer diameter Dt (mm) 635 635 633 632 632 630 632 634 Maximum load capacity (kg) 534 535 530 528 528 524 528 533 Recipe Wulstapex (BA) BA-1 BA-2 BA-3 BA-3 BA-4 BA-5 BA-6 BA-1 Clinch (CA) CA-1 CA-1 CA-1 CA-2 CA-2 CA-1 CA-3 CA-3 Tread (TR) TR-1 TR-1 TR-2 TR-2 TR-2 TR-2 TR-2 TR-3 Physical properties 70 °C-tanδ-BA 0,18 0,20 0,20 0,20 0,18 0,20 0,20 0,18 70 °CE*-BA (Mpa) 36 34 41 41 52 59 71 36 70 °C-tanδ-CA 0,16 0,16 0,16 0,15 0,15 0,16 0,16 0,16 70 °CE*-CA (Mpa) 10 10 10 12 12 10 11 11 30 °C-tanδ-TR 0,25 0,25 0,23 0,23 0,23 0,23 0,23 0,21 0 °C-tanδ-TR 0,50 0,50 0,55 0,55 0,55 0,55 0,55 0,60 Electronic components Embedding position 2 3 3 2 2 3 2 2 Weight W(g) 0,4 0,4 0,4 0,4 0,4 0,4 0,4 0,4 Tire circumference L (mm) 70 70 65 65 60 60 55 50 Longitudinal length (mm) 100 80 80 70 70 60 50 40 D2 / H 0,4 0,4 0,4 0,3 0,4 0,3 0,3 0,3 D1 (mm) 6,5 6,5 6,5 6,5 6,5 6,5 6,5 5,5 D2 (mm) 45 45 45 40 45 40 40 35 parameter 70 °C-tanδ-CA × L 11,20 11,20 10,40 9,75 9,00 9,60 8,80 8,00 70 °CE*-BA / D2 0,80 0,76 0, 91 1,03 1,16 1,48 1,78 1,03 Tire weight / maximum load capacity 0,0150 0,0146 0,0147 0,0146 0,0146 0,0149 0,0148 0,0150 70 °C-tanδ-BA × D2 8,10 9,00 9,00 8,00 8,10 8,00 8,00 6,30 70 °CE*-BA / L 0,51 0,49 0,63 0,63 0,87 0, 98 1,29 0,72 (70 °C-tanδ-BA + 70 °C-tanδ-CA) × L 23,8 25,2 23,4 22,8 19,8 21,6 19,8 17,0 (70 °CE*-BA / 70 °CE*-CA) / L 0,051 0,049 0,063 0,053 0,072 0,098 0,117 0,065 (70 °CE*-BA + 70 °CE*-CA) / L 0,66 0,63 0,78 0,82 1,07 1,15 1,49 0,94 D1 × W 2,6 2,6 2,6 2,6 2,6 2,6 2,6 2,2 Evaluation results (tire durability during driving) Results 125 120 130 135 135 135 135 140 [Table 7] Example Comparison example 2-9 2-10 2-1 2-2 2-3 2-4 2-5 2-6 Tires Tire size 195 / 6 5R15 195 / 6 5R15 195 / 6 5R15 195 / 6 5R15 195 / 6 5R15 195 / 6 5R15 195 / 6 5R15 195 / 6 5R15 Tire weight (kg) 7, 7 7, 6 7, 7 7, 7 7, 6 7, 9 7, 9 8, 0 Cross-sectional height Ht (mm) 128 128 128 125 127 125 126 127 Outer diameter Dt (mm) 633 632 633 634 633 632 634 632 Maximum load capacity (kg) 530 528 530 533 530 528 533 528 Recipe Wulstapex (BA) BA-2 BA-3 BA-1 BA-2 BA-7 BA-2 BA-3 BA-8 Clinch (CA) CA-4 CA-4 CA-2 CA-1 CA-1 CA-2 CA-2 CA-2 Tread (TR) TR-3 TR-3 TR-1 TR-1 TR-3 TR-1 TR-1 TR-1 Physical properties 70 °C-tanδ-BA 0,20 0,20 0,18 0,20 0,18 0,20 0,20 0,20 70 °CE*-BA (Mpa) 34 41 36 34 29 34 41 28 70 °C-tanδ-CA 0,17 0,17 0,15 0,16 0,16 0,15 0,15 0,15 70 °CE*-CA (Mpa) 10 10 12 10 10 12 12 12 30 °C-tanδ-TR 0,21 0,21 0,25 0,25 0,21 0,25 0,25 0,25 0 °C-tanδ-TR 0,60 0,60 0,50 0,50 0,60 0,50 0,50 0,50 Electronic components Embedding position 2 3 1 2 3 1 4 4 Weight W(g) 0, 4 0,4 0,4 0,4 0,4 0,4 0,4 0,4 Tire circumference L (mm) 50 45 55 75 70 60 70 70 Longitudinal length (mm) 40 40 40 40 80 80 80 40 D2 / H 0,3 0,3 0,3 0,3 0,2 0,4 0,3 0,3 D1 (mm) 5, 5 5,5 7,0 6,5 6,5 6,0 8,0 7,0 D2 (mm) 40 35 40 40 30 45 35 35 parameter 70 °C-tanδ-CA × L 8,50 7,65 8,25 12,00 11,20 9,00 10,50 10,50 70 °CE*-BA / D2 0,85 1,17 0,90 0,85 0,97 0,76 1,17 0,80 Tire weight / maximum load capacity 0,0145 0,0144 0,0145 0,0145 0,0143 0,0150 0,0148 0,0151 70 °C-tanδ-BA × D2 8,00 7,00 7,20 8,00 5,40 9,00 7,00 7,00 70 °CE*-BA / L 0,68 0,91 0,65 0,45 0,41 0,57 0,59 0,40 (70 °C-tanδ-BA + 70 °C-tanδ-CA) × L 18,5 16,7 18,2 27,0 23,8 21,0 24,5 24,5 (70 °CE*-BA / 70 °CE*-CA) / L 0,068 0,091 0,055 0,045 0,041 0,047 0,049 0,033 (70 °CE*-BA + 70 °CE*-CA) / L 0,88 1,13 0,87 0,59 0,56 0,77 0,76 0,57 D1 × W 2,2 2,2 2,8 2,6 2,6 2,4 3,2 2,8 Evaluation results (tire durability during driving) Results 145 150 100 75 80 75 85 80 [Table 8] Example 3-1 3-2 3-3 3-4 3-5 3-6 3-7 3-8 Tires Tire size 155 / 6 0R16 155 / 6 0R16 155 / 6 0R16 155 / 6 0R16 155 / 6 0R16 155 / 6 0R16 155 / 6 0R16 155 / 6 0R16 Tire weight (kg) 5,3 5,3 5,2 5,1 5,0 5,1 5,2 5,3 Cross-sectional height Ht (mm) 93 93 92 92 94 93 95 94 Outer diameter Dt (mm) 592 594 593 592 592 590 592 594 Maximum load capacity (kg) 349 351 350 348 348 345 348 351 Recipe Wulstapex (BA) BA-1 BA-2 BA-3 BA-3 BA-4 BA-5 BA-6 BA-1 Clinch (CA) CA-1 CA-1 CA-1 CA-2 CA-2 CA-1 CA-3 CA-3 Tread (TR) TR-1 TR-1 TR-2 TR-2 TR-2 TR-2 TR-2 TR-3 Physical properties 70 °C-tanδ-BA 0,18 0,20 0,20 0,20 0,18 0,20 0,20 0,18 70 °CE*-BA (Mpa) 36 34 41 41 52 59 71 36 70 °C-tanδ-CA 0,16 0,16 0,16 0,15 0,15 0,16 0,16 0,16 70 °CE*-CA (Mpa) 10 10 10 12 12 10 11 11 30 °C-tanδ-TR 0,25 0,25 0,23 0,23 0,23 0,23 0,23 0,21 0 °C-tanδ-TR 0,50 0,50 0,55 0,55 0,55 0,55 0,55 0,60 Electronic components Embedding position 2 3 3 2 2 3 2 2 Weight W(g) 0,4 0,4 0,4 0,4 0,4 0,4 0,4 0,4 Tire circumference L (mm) 70 70 65 65 60 60 55 50 Longitudinal length (mm) 100 80 80 70 70 60 50 40 D2 / H 0,5 0,5 0,5 0,4 0,5 0,4 0,4 0,4 D1 (mm) 6,5 6,5 6,5 6,5 6,5 6,5 6,5 5,5 D2 (mm) 45 45 45 40 45 40 40 35 parameter 70 °C-tanδ-CA × L 11,20 11,20 10,40 9,75 9,00 9,60 8,80 8,00 70 °CE*-BA / D2 0,80 0,76 0, 91 1,03 1,16 1,48 1,78 1,03 Tire weight / maximum load capacity 0,0152 0,0151 0,0149 0,0146 0,0144 0,0148 0,0149 0,0151 70 °C-tanδ-BA × D2 8, 10 9,00 9,00 8,00 8, 10 8,00 8,00 6,30 70 °CE*-BA / L 0,51 0,49 0,63 0,63 0,87 0,98 1,29 0,72 (70 °C-tanδ-BA + 70 °C-tanδ-CA) × L 23,8 25,2 23,4 22,8 19,8 21,6 19,8 17,0 (70 °CE*-BA / 70 °CE*-CA) / L 0,051 0,049 0,063 0,053 0,072 0,098 0,117 0,065 (70 °CE*-BA + 70 °CE*-CA) / L 0,66 0,63 0,78 0,82 1,07 1,15 1,49 0,94 D1 × W 2,6 2,6 2,6 2,6 2,6 2,6 2,6 2,2 Evaluation results (tire durability during driving) Results 125 120 130 135 135 135 135 140 [Table 9] Example Comparison example 3-9 3-10 3-1 3-2 3-3 3-4 3-5 3-6 Tires Tire size 155 / 6 0R16 155 / 6 0R16 155 / 6 0R16 155 / 6 0R16 155 / 6 0R16 155 / 6 0R16 155 / 6 0R16 155 / 6 0R16 Tire weight (kg) 5,2 5,1 5,2 5,3 5,2 5,2 5,2 5,3 Cross-sectional height Ht (mm) 93 93 93 93 95 95 93 95 Outer diameter Dt (mm) 593 592 593 594 593 592 594 592 Maximum load capacity (kg) 350 348 350 351 350 348 351 348 Recipe Wulstapex (BA) BA-2 BA-3 BA-1 BA-2 BA-7 BA-2 BA-3 BA-8 Clinch (CA) CA-4 CA-4 CA-2 CA-1 CA-1 CA-2 CA-2 CA-2 Tread (TR) TR-3 TR-3 TR-1 TR-1 TR-3 TR-1 TR-1 TR-1 Physical properties 70 °C-tanδ-BA 0,20 0,20 0,18 0,20 0,18 0,20 0,20 0,20 70 °CE*-BA (Mpa) 34 41 36 34 29 34 41 28 70 °C-tanδ-CA 0,17 0,17 0,15 0,16 0,16 0,15 0,15 0,15 70 °CE*-CA (Mpa) 10 10 12 10 10 12 12 12 30 °C-tanδ-TR 0,21 0,21 0,25 0,25 0,21 0,25 0,25 0,25 0 °C-tanδ-TR 0,60 0,60 0,50 0,50 0,60 0,50 0,50 0,50 Electronic components Embedding position 2 3 1 2 3 1 4 4 Weight W(g) 0,4 0,4 0,4 0,4 0,4 0,4 0 4 0,4 Tire circumference L (mm) 50 45 55 75 75 60 70 70 Longitudinal length (mm) 40 40 40 40 80 80 80 40 D2 / H 0,4 0,4 0,4 0,4 0,3 0,5 0,4 0,4 D1 (mm) 5,5 5,5 7,0 6,5 6,5 6,0 8,0 7,0 D2 (mm) 40 35 40 40 30 45 35 35 parameter 70 °C-tanδ-CA × L 8,50 7,65 8,25 12,00 12,00 9,00 10,50 10,50 70 °CE*-BA / D2 0,85 1,17 0,90 0,85 0,97 0,76 1,17 0,80 Tire weight / maximum load capacity 0,0149 0,0146 0,0149 0,0151 0,0149 0,0149 0,0148 0,0152 70 °C-tanδ-BA × D2 8,00 7,00 7,20 8,00 5,40 9,00 7,00 7,00 70 °CE*-BA / L 0,68 0,91 0,65 0,45 0,39 0,57 0,59 0,40 (70 °C-tanδ-BA + 70 °C-tanδ-CA) × L 18,5 16,7 18,2 27,0 25,5 21,0 24,5 24,5 (70 °CE*-BA / 70 °CE*-CA) / L 0,068 0,091 0,055 0,045 0,039 0,047 0,049 0,033 (70 °CE*-BA + 70 °CE*-CA) / L 0,88 1,13 0,87 0,59 0,52 0,77 0,76 0,57 D1 × W 2,2 2,2 2,8 2,6 2,6 2,4 3,2 2,8 Evaluation results (tire durability during driving) Results 145 150 100 70 80 75 85 80

[0249] Although the present invention has been described above based on the embodiments, the present invention is not limited to the above embodiments. Various modifications can be made to the above embodiments within the same and equivalent scope of the present invention.

[0250] The present invention (1) is a tire comprising a tread portion, a bead portion constructed of a bead apex and a bead core, a clinch provided outside the bead portion in the tire width direction and extending to a chafer portion, and a carcass layer, wherein an electronic component is provided between the bead tread and the carcass layer; complex elastic modulus 70 °CE*-BA (MPa) of the bead tapex, measured under the conditions of a temperature of 70 °C, a frequency of 10 Hz, an initial strain of 5%, a dynamic strain rate of 1% and tensile deformation mode, exceeds 30 MPa; and Loss tangent 70 °C-tanδ-CA of the clinch, which is measured under the conditions of temperature of 70 °C, frequency of 10 Hz, initial strain of 5%, dynamic strain rate of 1% and tensile deformation mode, and length L (mm) of the electronic component in the tire circumferential direction satisfy the following (Formula 1). 70°C−tanδ−CA×L<12

[0251] The present invention (2) is a tire according to the present invention (1), wherein the 70 °C tanδ CA and the L (mm) satisfy the following (Formula 2). 70°C−tanδ−CA×L≦8

[0252] The present invention (3) is the tire according to the present invention (1) or (2), wherein a tire radial distance D2 (mm) from the top end of the bead core to the electronic component and the 70 °CE*-BA (MPa) satisfy the following (Formula 3). (70°C−E*−BA / D2)>0.85

[0253] The present invention (4) is the tire of a combination of the present inventions (1) to (3), wherein a loss tangent 30 °C-tanδ-TR of the tread portion measured under the conditions of temperature 30 °C, frequency 10 Hz, initial strain 5%, dynamic strain rate 1% and tensile deformation mode is less than 0.25.

[0254] The present invention (5) is the tire of a combination of the present inventions (1) to (4), wherein a loss tangent 0 °C-tanδ-TR of the tread portion measured under the conditions of temperature 0 °C, frequency 10 Hz, initial strain 5%, dynamic strain rate 1% and tensile deformation mode is more than 0.50.

[0255] The present invention (6) is the tire of a combination of the present inventions (1) to (5), wherein tire weight (kg) and maximum load capacity (kg) of the tire satisfy the following (Formula 4). Tire weight / maximum load capacity<0.0150

[0256] The present invention (7) is the tire of a combination of the present inventions (1) to (6), wherein loss tangent 70°C-tanδ-BA of the bead apex measured under the conditions of temperature 70°C, frequency 10 Hz, initial strain 5%, dynamic strain rate 1%, tensile deformation mode, and tire radial distance D2 (mm) from the top end of the bead core to the electronic component satisfy the following (Formula 5). 70°C−tanδ−BA×D2≦8.5

[0257] The present invention (8) is the tire of a combination of the present inventions (1) to (7), wherein the 70 °CE*-BA (MPa) and the L (mm) satisfy the following (Formula 6). 70°C−E*−BA / L≧0.6

[0258] The present invention (9) is the tire of a combination of the present inventions (1) to (8), wherein loss tangent 70 °C-tanδ-BA of the bead apex measured under the conditions of temperature 70 °C, frequency 10 Hz, initial strain 5%, dynamic strain rate 1% and tensile deformation mode, the 70 °C-tanδ-CA and the L (mm) satisfy the following (Formula 7). (70°C−tanδ−BA+70°C−tanδ−CA)×L≦25

[0259] The present invention (10) is the tire of a combination of the present inventions (1) to (9), wherein the 70 °CE*-BA (MPa), complex elastic modulus 70 °CE*-CA (MPa) of the clinch measured under the conditions of temperature 70 °C, frequency 10 Hz, initial strain 5% and dynamic strain rate 1% and tensile deformation mode, and the L (mm) satisfy the following (Formula 8). (70°C−E*−BA / 70°C−E*−CA) / L≧0.055

[0260] The present invention (11) is the tire of a combination of the present inventions (1) to (10), wherein the 70 °CE*-BA (MPa), complex elastic modulus 70 °CE*-CA (MPa) of the clinch measured under the conditions of temperature 70 °C, frequency 10 Hz, initial strain 5% and dynamic strain rate 1% and tensile deformation mode, and the L (mm) satisfy the following (Formula 9). (70°C−E*−BA+70°C−E*−CA) / L≧0.8

[0261] The present invention (12) is the tire of a combination of the present inventions (1) to (11), wherein the electronic component is an RFID tag or a sensor.

[0262] The present invention (13) is the tire of a combination of the present inventions (1) to (12), wherein an adhesive layer or a plating layer for improving adhesion to rubber is provided on the surface of the electronic component.

[0263] The present invention (14) is the tire of a combination of the present inventions (1) to (13), wherein an electronic component coating layer having a thickness of 0.5 mm or more covering the electronic component is provided.

[0264] The present invention (15) is the tire of a combination of the present inventions (1) to (14), wherein a distance H (mm) from the top end of the bead core to the apex of the tip of the bead apex and the tire radial distance D2 (mm) from the top end of the bead core to the electronic component satisfy the following (Formula 10). 0.2 <D2 / H<0,8

[0265] The present invention (16) is the tire of a combination of the present inventions (1) to (15), wherein the weight W (g) of the electronic component and the shortest distance D1 (mm) from the electronic component to the tire outer surface satisfy the following (Formula 11). D1 × W ≦ 2.5

[0266] The present invention (17) is the tire of a combination of the present inventions (1) to (16), wherein the length of the electronic component in the longitudinal direction is 80 mm or less.

[0267] The present invention (18) is the tire according to the present invention (17), wherein the length of the electronic component in the longitudinal direction is 50 mm or less. [Description of reference symbols] 1 tire 2 bead section 3 side wall section 4 Tread section 21 Bead core 22 Bead Apex 23 Clinch 24 Bead band 31 Side wall 32 carcass layers 32a Middle 32b End 33 inner liners 34 electronic components 34a Main body 34b antenna D1 shortest distance D2 Tire radial distance H distance L Length of electronic component in longitudinal direction QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] JP 2021-506676 A

[0002] JP 2021-514891 A

[0002] JP 2021-084510 A

[0002] JP 2021-127114 A

[0002] JP-A-2010-111753

[0079] US 4,414,370

[0181] JP 84-6207 A

[0181] JP 93-58805 A

[0181] JP 89-313522 A

[0181] US 5,010,166

[0181]

Claims

[1] A tire comprising a tread portion, a bead portion composed of a bead apex and a bead core, a clinch provided on an outer side in a tire width direction with respect to the bead portion and extending to a chafer portion, and a carcass layer, wherein an electronic component is provided between the bead tread and the carcass layer; a complex elastic modulus 70 °CE*-BA (MPa) of the bead tapex, measured under conditions of a temperature of 70 °C, a frequency of 10 Hz, an initial strain of 5%, a dynamic strain rate of 1% and tensile deformation mode, exceeds 30 Mpa; and a loss tangent 70 °C-tanδ-CA of the clinch, measured under conditions of a temperature of 70 °C, a frequency of 10 Hz, an initial strain of 5%, a dynamic strain rate of 1%, and tensile deformation mode, and a length L (mm) of the electronic component in a tire circumferential direction satisfy the following (Formula 1): 70 °C−tanδ−CA × L < 12 [2] The tire according to claim 1, wherein the 70 °C tanδ CA and the L (mm) satisfy the following (Formula 2): 70 °C−tanδ−CA × L ≦ 8 [3] A tire according to claim 1 or 2, wherein a tire radial distance D2 (mm) from an upper end of the bead core to the electronic component and the 70 °CE*-BA (MPa) satisfy the following (Formula 3): (70 °C−E* −BA / D2) >0.85 [4] A tire according to any one of claims 1 to 3, wherein a loss tangent 30°C-tanδ-TR of the tread portion measured under conditions of a temperature of 30°C, a frequency of 10 Hz, an initial strain of 5%, a dynamic strain rate of 1% and tensile deformation mode is less than 0.

25. [5] A tire according to claim 4, wherein a loss tangent 0 °C-tanδ-TR of the tread portion measured under conditions of a temperature of 0 °C, a frequency of 10 Hz, an initial strain of 5%, a dynamic strain rate of 1 % and measured in tensile deformation mode is more than 0.

50. [6] A tire according to any one of claims 1 to 5, wherein a tire weight (kg) and a maximum load capacity (kg) of the tire satisfy the following (Formula 4): Tire weight / maximum load capacity <0.0150 [7] A tire according to any one of claims 1 to 6, wherein a loss tangent 70°C-tanδ-BA of the bead apex measured under conditions of a temperature of 70°C, a frequency of 10 Hz, an initial strain of 5%, a dynamic strain rate of 1%, and tensile deformation mode, and a tire radial distance D2 (mm) from a top end of the bead core to the electronic component satisfy the following (Formula 5): 70 °C−tanδ−BA × D2 ≦ 8.5 [8] A tire according to any one of claims 1 to 7, wherein the 70 °CE*-BA (MPa) and the L (mm) satisfy the following (Formula 6): 70 °C−tanδ−BA / L ≧ 0.6 [9] A tire according to any one of claims 1 to 8, wherein a loss tangent 70°C-tanδ-BA of the bead apex measured under conditions of a temperature of 70°C, a frequency of 10 Hz, an initial strain of 5%, a dynamic strain rate of 1% and tensile deformation mode, the 70°C-tanδ-CA and the L (mm) satisfy the following (Formula 7): (70 °C−tanδ−BA + 70 °C−tanδ−CA) × L ≦ 25 [10] The tire according to any one of claims 1 to 9, wherein the 70 °CE*-BA (MPa), a complex elastic modulus 70 °CE*-CA (MPa) of the clinch, measured under conditions of a temperature of 70 °C, a frequency of 10 Hz, an initial strain of 5%, a dynamic strain rate of 1% and tensile deformation mode, and the L (mm) satisfy the following (Formula 8): (70°C−tanδ−BA / 70 °C−E*−CA) / L≧0.055 [11] A tire according to any one of claims 1 to 10, wherein the 70 °CE*-BA (MPa), a complex elastic modulus 70 °CE*-CA (MPa) of the clinch, measured under conditions of a temperature of 70 °C, a frequency of 10 Hz, an initial strain of 5%, a dynamic strain rate of 1% and tensile deformation mode, and the L (mm) satisfy the following (Formula 9): (70 °C−tanδ−BA + 70 °C−E*−CA) / L≧0.8 [12] Tire according to one of claims 1 to 11, wherein the electronic component is an RFID tag or a sensor. [13] A tire according to any one of claims 1 to 12, wherein an adhesive layer or a plating layer for improving adhesion to rubber is provided on a surface of the electronic component. [14] A tire according to any one of claims 1 to 13, wherein an electronic component coating layer having a thickness of 0.5 mm or more covering the electronic component is provided. [15] A tire according to any one of claims 1 to 14, wherein a distance H (mm) from an upper end of the bead core to a vertex of a tip of the bead apex and a tire radial distance D2 (mm) from the upper end of the bead core to the electronic component satisfy the following (Formula 10): 0.2< D2 / H < 0.8 [16] A tire according to any one of claims 1 to 15, wherein a weight W (g) of the electronic component and a shortest distance D1 (mm) from the electronic component to a tire outer surface satisfy the following (Formula 11): D1 × W ≦2.5 [17] A tire according to any one of claims 1 to 16, wherein a length of the electronic component in a longitudinal direction is 80 mm or less. [18] A tire according to claim 17, wherein the length of the electronic component in the longitudinal direction is 50 mm or less.

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