Sensor component

Abstract

A sensor component designed for press-fitting into a mounting hole comprises a sensor body, a detection element, and a pair of O-rings. The sensor body includes a primary molded section in which the detection element is embedded, a secondary molded section located on the opposite side of the primary molded section in the press-fit direction of the mounting hole, and a boundary section between the primary molded section and the secondary molded section. The primary molded section includes a first arrangement section to which one of the pair of O-rings is attached. The secondary molded section includes a second arrangement section to which the other of the pair of O-rings is attached. The second arrangement section, the boundary section, and the first arrangement section are arranged in this specified order in the press-fit direction.

Description

Technical area

[0001] The present invention relates to a sensor component. background

[0002] Conventionally, a sensor component for measuring the temperature of a device housing, which is a measurement target, has been known (see, for example, Patent Document 1). The sensor component described in Patent Document 1 is mounted in a hole provided in a device housing to measure the temperature of a measurement target. The sensor component includes a temperature measuring unit, a primary mold section in a rod shape in which a portion of the temperature measuring unit is embedded, a secondary mold section covering the primary mold section, and a metal cap bent and crimped to the tip of the primary mold section. The temperature measuring unit includes a pair of main wires and a temperature detection element that is electrically connected between the pair of main wires and detects the temperature of the measurement target.The temperature detection element is provided to be exposed from the tip of the primary mold portion, is covered with a metal cap, and is configured to sense the temperature of a fluid, particularly the measurement target. Related technologyPatent document

[0003] Patent document 1: EP2485023 (A2) Summary of the inventionProblem to be solved by the invention

[0004] However, the sensor component described in Patent Document 1 is provided with protrusions and fine irregularities on the outer surface of the primary mold portion covered with the secondary mold portion to prevent fluid from entering between the primary mold portion and the secondary mold portion (especially the inside), and therefore, the shape of the primary mold portion often becomes complicated and the amount of resin in the primary mold portion often increases.

[0005] It is an object of one embodiment to provide a sensor component having a simplified shape to mitigate infiltration of fluid into the sensor component. Solution to the problem

[0006] To solve the above problem and achieve the above object, an invention according to a first aspect is a sensor component to be press-fitted into a mounting hole provided in a housing to detect a physical quantity of a measurement target, the sensor component including a sensor body in a rod shape to be press-fitted into the mounting hole, a detection means provided on one side of the sensor body in a press-fitting direction of the mounting hole, the detection means configured to detect the physical quantity of the measurement target, and a pair of O-rings arranged on the sensor body and capable of coming into close contact with an inner surface of the mounting hole, the sensor body being manufactured by two-component molding, the sensor body including a primary mold portion manufactured by primary molding and in which the detection means is embedded;and a secondary mold portion formed by secondary molding and provided on an opposite side of the primary mold portion in the press-fitting direction of the mounting hole, and a boundary portion between the primary mold portion and the secondary mold portion, wherein the primary mold portion includes a first arranging portion at which one of the pair of O-rings is arranged, the secondary mold portion includes a second arranging portion at which the other of the pair of O-rings is arranged, and the second arranging portion, the boundary portion, and the first arranging portion are arranged in this specified order in the press-fitting direction. Advantageous effects of the invention

[0007] According to an invention of the first aspect, the shape can be simplified, and infiltration of fluid into the interior can be mitigated. Short description of the drawings Fig. 1 is a perspective view illustrating a sensor component according to an embodiment of the present invention. Fig. 2 is a vertical cross-sectional view of the Fig. 1 shown sensor component. Fig. 3 is a cross-sectional view showing the component press-fitted into a mounting hole of a housing. Detailed description of the exemplary embodiment

[0008] Embodiments of the present invention will be described hereinafter with reference to the Fig. 1 to 3. Fig. 1 is a perspective view illustrating a sensor component 1 according to an embodiment of the present invention. Fig. 2 is a vertical cross-sectional view of the Fig. 1 shown sensor component 1. Fig. 3 is a cross-sectional view illustrating the sensor component 1 press-fitted into a mounting hole 10a of a housing 10.

[0009] As in the Fig. 1 and Fig. 3, the sensor component 1 according to the invention is inserted into the mounting hole 10a provided in the housing 10 (in Fig. 3) and is used to measure the temperature (physical quantity) of the cooling water W provided in the housing 10 (measurement target, in Fig. 3).

[0010] As in the Fig. 1, Fig. 2, the sensor component 1 includes a sensor body 2 press-fitted into the mounting hole 10a, a temperature measuring unit 3 (in Fig. 2) which is embedded in the sensor body 2 and a detection element 31 (detection means, in Fig. 2) for detecting the temperature of the measurement target, and a pair of O-rings 4, 5 provided on the sensor body 2. Hereinafter, one of the pair of O-rings 4, 5 may be referred to as a "first O-ring 4" and the other as a "second O-ring 5."

[0011] Hereinafter, the direction in which the mounting hole 10a of the housing 10 penetrates may be referred to as a “vertical direction Z”, the press-fitting direction of the sensor component 1 into the mounting hole 10a may be referred to as a “bottom side Z2”, and the opposite direction thereto may be referred to as a “top side Z1”.

[0012] The sensor body 2 is manufactured by two-component molding, and the temperature measurement unit 3, which will be described later, is embedded by insert molding. The sensor body 2 includes a primary molding portion 6 manufactured by primary molding, a secondary molding portion 7 manufactured by secondary molding, and a boundary portion 8 between the primary molding portion 6 and the secondary molding portion 7 (hereinafter referred to as a boundary portion 8). The primary molding portion 6 and the secondary molding portion 7 are arranged coaxially.

[0013] As in the Fig. 1, Fig. 2, the primary mold section 6 includes a detection unit 61 in a cylindrical shape, which is formed by embedding a part of the temperature measuring unit 3 including the detection element 31 (shown in Fig. 2) and a first arrangement portion 62 including a first arrangement portion 63 which is continuous with the top surface Z1 of the detection unit 61 and on which the first O-ring 4 is arranged.

[0014] The detection unit 61 is manufactured by embedding a part of the temperature measuring unit 3 including the detection element 31 and is configured in a solid cylindrical shape with an axis extending in the vertical direction Z.

[0015] As in Fig. 2, the first arranging portion 62 is provided coaxially with the detection unit 61 and has a cylindrical shape with a larger diameter than the detection unit 61. The first arranging portion 62 is provided with a first arranging portion 63 in which the first O-ring 4, which will be described later, can be arranged. As shown in Fig. As shown in Fig. 2, the first arranging portion 63 includes a first bottom surface 63A provided at a position recessed in the central axis direction from the outer peripheral surface of the first arranging portion 62 and continuous around the axis of the first arranging portion 62; and a pair of first side surfaces 63B, 63B rising from both ends of the first bottom surface 63A in the vertical direction Z. The first arranging portion 63 is configured to have a groove shape on the outer peripheral surface of the first arranging portion 62. When the first O-ring 4 is arranged in the first arranging portion 63, the displacement of the first O-ring 4 in the vertical direction Z is regulated by the pair of first side surfaces 63B, 63B.

[0016] As in the Fig. 1, Fig. 2, the secondary mold section 7 includes a secondary mold section body 71, a second arranging section 72 continuous with the bottom surface Z2 of the secondary mold section body 71 and including a second arranging section 74 on which a second O-ring 5 is arranged, and a connector section 73 continuous with the top surface Z1 of the secondary mold section body 71 and connectable to an external device (not shown).

[0017] The secondary mold portion body 71 includes a cylindrical portion 711 in a cylindrical shape provided coaxially with the primary mold portion 6 and configured to have a diameter larger than the diameter of the second arranging portion 72 described later, a flange portion 712 provided at the upper end of the cylindrical portion 711 and protruding in the thickness direction, and a pair of protruding portions 713, 713 provided at the upper end of the cylindrical portion 711 and protruding from the outer peripheral surface of the cylindrical portion 711 in a direction away from each other.

[0018] As in Fig. 2, the second arranging portion 72 is provided coaxially with the secondary mold portion body 71 and the first arranging portion 62 and has a cylindrical shape with approximately the same diameter dimension as the first arranging portion 62. This second arranging portion 72 is provided with a second arranging portion 74 in which a second O-ring 5, which will be described later, can be arranged. As shown in Fig. 2, the second arranging portion 74 includes a second bottom surface 74A provided at a position recessed toward the central axis side from the outer peripheral surface of the second arranging portion 72 and continuous around the axis of the second arranging portion 72, and a pair of second side surfaces 74B, 74B rising from both ends of the second bottom surface 74A in the vertical direction Z. The second arranging portion 74 is configured to have a groove shape on the outer peripheral surface of the second arranging portion 72. When the second O-ring 5 is arranged in the first arranging portion 63, the pair of second side surfaces 74B, 74B restricts displacement of the second O-ring 5 in the vertical direction Z.

[0019] As in Fig. 2, the connector portion 73 includes a connector portion body 731 in a cylindrical shape, which is provided coaxially with the secondary mold portion body 71 and whose axis lies in the vertical direction Z, and a pair of external connection portions 732, 732, which are respectively parts of a pair of conductor portions 32, 32 constituting the temperature measurement unit 3, which will be described later, and which are provided so as to be exposed inside the connector portion body 731. The connector portion 73 is connected to an external device (not shown) and configured to transmit the temperature of the measurement target.

[0020] As in Fig. 2, the boundary portion 8 includes a first upper surface 81 (interface) in a flat circular shape of the first arranging portion 62 of the primary molding portion 6, a projecting portion 82 provided at the center of the first upper surface 81 and projecting from the center, a second lower surface 83 (interface) in a flat circular shape of the second arranging portion 72 of the secondary molding portion 7, and a depressed portion 84 provided at the center of the second lower surface 83 and depressed from the center to fit the projecting portion 82.

[0021] The first upper surface 81 has a circular shape with a flat surface perpendicular to the axis of the primary mold section 6. The second lower surface 83 has a circular shape with a flat surface perpendicular to the axis of the secondary mold section 7. These first upper surface 81 and the second lower surface 83 are configured to oppose each other with a very small space S when the sensor component 1 is completed.

[0022] In commonly available resin-molded products manufactured by two-component molding, the space between the primary mold portion and the secondary mold portion may be sealed using, for example, a potting agent, whereas in the present embodiment, the space S between the first upper surface 81 and the second lower surface 83 is not sealed with a potting agent or the like. As a result, the very small space S is formed between the first upper surface 81 and the second lower surface 83 when the sensor component 1 is completed. In the present embodiment, the heat transfer between the primary mold portion 6 and the secondary mold portion 7 is blocked by the very small space S between the first upper surface 81 and the second lower surface 83, so that heat radiation from the primary mold portion 6 to the secondary mold portion 7 is mitigated.

[0023] As in Fig. As shown in Fig. 2, the temperature measuring unit 3 includes a detection element 31 that detects the temperature of the measurement target, and a pair of conductor portions 32, 32 connected to both ends of the detection element 31. The pair of conductor portions 32, 32 are configured such that a portion of each conductor portion 32 is embedded in the primary mold portion 6 and the secondary mold portion body 71 and the second arrangement portion 72 of the secondary mold portion 7, and the external connection portions 732, which is another portion, are provided to be exposed inside the connector portion 73.

[0024] The first O-ring 4 is made of a water-resistant material. The first O-ring 4 is configured in a ring shape and can be arranged in the first arrangement portion 63. When the first O-ring 4 is arranged in the first arrangement portion 63, the outer peripheral surface of the first O-ring 4 is provided on the side facing away from the central axis with respect to the outer peripheral surface of the first arrangement portion 62, and when the sensor component 1 is press-fitted into the mounting hole 10a, the outer peripheral surface of the first O-ring 4 is configured to come into elastic contact with the inner peripheral surface of the mounting hole 10a.

[0025] The second O-ring 5 is made of an oil-resistant material. The second O-ring 5 is annular and configured to be disposed in the second arranging portion 74. When the second O-ring 5 is disposed in the second arranging portion 74, the outer peripheral surface of the second O-ring 5 is provided on the side opposite the central axis with respect to the outer peripheral surface of the second arranging portion 72, and when the sensor component 1 is press-fitted into the mounting hole 10a, the outer peripheral surface of the second O-ring 5 is configured to come into elastic contact with the inner peripheral surface of the mounting hole 10a.

[0026] In manufacturing the sensor component 1, the detection element 31 is electrically connected between the pair of conductor portions 32, 32, and the detection element 31 and the pair of conductor portions 32, 32 are arranged at a predetermined position in a mold (not shown). In this state, molten resin is injected into the mold (primary injection of molten resin). As the injection progresses, the primary injection of the molten resin into the interior of the mold is completed. Thereafter, the molten resin hardens in the mold. As a result, the primary mold portion 6, in which the detection element 31 and the pair of conductor portions 32, 32 are partially embedded, is formed.

[0027] Thereafter, molten resin is injected into the interior of the mold (secondary injection of molten resin). As the secondary injection progresses, the secondary injection of the molten resin into the mold is completed. After that, the molten resin in the mold is cured. As a result, the secondary mold portion 7 is formed to overlap the primary mold portion 6. In this case, the first upper surface 81 of the primary mold portion 6 and the second lower surface 83 of the secondary mold portion 7 face each other, and the very small space S is formed between the first upper surface 81 and the second lower surface 83.

[0028] Thereafter, the first O-ring 4 is arranged in the first arranging portion 63 provided in the primary mold portion 6, and the second O-ring 5 is arranged in the second arranging portion 74 provided in the secondary mold portion 7. In this way, the sensor component 1 is completed. When the sensor component 1 is completed, the very small space S is formed between the first upper surface 81 and the second lower surface 83 in the boundary portion 8 between the primary mold portion 6 and the secondary mold portion 7. That is, in the present embodiment, the sensor component 1 is completed without sealing the very small space S between the first upper surface 81 and the second lower surface 83.

[0029] Next, when the completed sensor component 1 is to be mounted into the mounting hole 10a of the housing 10, the tip of the sensor component 1 is brought closer to the top of the mounting hole 10a to be inserted (press-fitted) therein. As the insertion progresses, the sensor component 1 reaches a predetermined position in the mounting hole 10a. In this case, the outer peripheral surface of the first O-ring 4 is in elastic contact with the inner peripheral surface of the mounting hole 10a, and the outer peripheral surface of the second O-ring 5 is in elastic contact with the inner peripheral surface of the mounting hole 10a. In this state, the second O-ring 5, the boundary portion 8 between the primary mold portion 6 and the secondary mold portion 7, and the first O-ring 4 are arranged in this order in the press-fitting direction of the sensor component 1. In this way, the mounting of the sensor component 1 into the mounting hole 10a of the housing 10 is completed.

[0030] According to the embodiment explained above, the sensor component 1 includes a sensor body 2, a detection element 31 (detection means), and a pair of O-rings 4, 5. The sensor body 2 includes a primary molding portion 6, which is manufactured by primary molding and in which the detection element 31 (detection means) is embedded, a secondary molding portion 7, which is manufactured by secondary molding and is provided on an opposite side of the primary molding portion 6 in the press-fitting direction of the mounting hole 10a, and a boundary portion 8 between the primary molding portion 6 and the secondary molding portion 7. The primary molding portion 6 includes a first arranging portion 63, on which a first O-ring 4 (one of the pair of O-rings 4, 5) is arranged, the secondary molding portion 7 includes a second arranging portion 74, on which a second O-ring 5 (the other of the pair of O-rings 4, 5) is arranged,and the second arrangement portion 74, the boundary portion 8, and the first arrangement portion 63 are arranged in the specified order in the press-fitting direction. Accordingly, with the sensor component 1 press-fitted into the mounting hole 10a, the boundary portion 8 between the primary mold portion 6 and the secondary mold portion 7 is sealed by the first O-ring 4 and the second O-ring 5, so that infiltration of water (fluid) into the boundary portion 8 can be mitigated. In particular, the arrangement portions 63, 74, in which the O-rings 4, 5 are arranged, are provided on the primary mold portion 6 and the secondary mold portion 7 to achieve a simple structure, i.e., to simplify the shape while mitigating water infiltration into the boundary portion 8.

[0031] Furthermore, the boundary portion 8 includes the first upper surface 81 (interface) of the primary mold portion 6 and the second lower surface 83 (interface) of the secondary mold portion 7, which are provided to face each other; and a very small space S provided between the first upper surface 81 and the second lower surface 83. The space S blocks heat transfer between the first molded product and the second molded product, so that a reduction in response due to heat radiation from the first molded product to the second molded product can be mitigated.

[0032] Furthermore, the first arranging portion 63 is configured to have a groove shape on an outer peripheral surface of the primary mold portion 6, and the second arranging portion 74 is configured to have a groove shape on an outer peripheral surface of the secondary mold portion 7. Accordingly, with the first O-ring 4 arranged in the first arranging portion 63, the movement of the first O-ring 4 in the vertical direction Z is restricted, and with the second O-ring 5 arranged in the second arranging portion 74, the movement of the second O-ring 5 in the vertical direction Z is restricted, so that the infiltration of water (fluid) into the boundary portion 8 (inside) can be further mitigated.

[0033] Furthermore, in a case where water, which is the measurement target, is contained on the side in the press-fitting direction of the mounting hole 10a, and oil is contained on the opposite side in the press-fitting direction of the mounting hole 10a, then one of the pair of O-rings 4, 5 is made of a water-resistant material, and the other of the pair of O-rings 4, 5 is made of an oil-resistant material. In this way, the material of the O-rings and, for example, the diameters of the O-rings for the primary mold section 6 and the secondary mold section 7 can be freely selected, so that the sensors can be designed according to the external environment. Accordingly, the sensor structure suitable for the purpose can be provided.

[0034] The present invention is not limited to the above-described embodiment and includes other configurations that can achieve the object of the present invention, and the present invention also includes modifications such as those shown below.

[0035] In the embodiment, there is a very small space S between the first upper surface 81 and the second lower surface 83 without sealing it using a potting agent or the like, but the present invention is not limited to this. It should be understood that the scope of the present invention includes a sensor component manufactured without sealing but using a potting agent or the like. Regardless of whether the space S manufactured without sealing but using a potting agent or the like is the very small space S or an air layer between the first upper surface 81 and the second lower surface 83, which are slightly spaced apart, such a configuration is included within the scope of the present invention.

[0036] Furthermore, although the best configuration, method, and the like for carrying out the present invention are disclosed in the above description, the present invention is not limited thereto. That is, although the present invention has been illustrated and described primarily with reference to the specific embodiment, one skilled in the art may make various modifications to the above-described embodiment in terms of shape, material, quantity, and other detailed configurations without departing from the scope of the technical idea and purpose of the present invention.Since the descriptions limiting the shape, material, and the like disclosed above are provided as examples to facilitate understanding of the present invention and are not intended to limit the present invention, a description with a name of an element from which some or all of the restrictions on the shape, material, and the like are deleted is to be included in the present invention. List of reference symbols 1 sensor component 2 sensor bodies 31 Detection element (detection means) 4 first O-ring (one of a pair of O-rings) 5 second O-ring (the other of the pair of O-rings) 6 primary mold section 63 first section of the order 7 secondary mold section 74 second section of the order 8 border section 81 first upper surface (interface) 83 second lower surface (interface) S room 10 housings 10a Mounting hole W Cooling water (measurement target) QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] EP 2485023 (A2

[0003]

Claims

[1] A sensor component (1) to be press-fitted into a mounting hole (10a) provided in a housing (10) to detect a physical quantity of a measurement target, the sensor component (1) comprising: a sensor body (2) in a rod shape to be press-fitted into the mounting hole (10a); a detection means (31) provided on one side of the sensor body (2) in a press-fitting direction of the mounting hole (10a), the detection means (31) being configured to detect the physical quantity of the measurement target, and a pair of O-rings (4, 5) arranged on the sensor body (2) and capable of coming into close contact with an inner surface of the mounting hole (10a), wherein the sensor body (2) is manufactured by two-component molding, wherein the sensor body (2) includes a primary mold portion produced by primary molding and in which the detection means (31) is embedded; a secondary mold portion (7) which is produced by secondary molding and which is provided on an opposite side of the primary mold portion (6) in the press-fitting direction of the mounting hole (10a), and a boundary section (8) between the primary mold section (6) and the secondary mold section (7), wherein the primary mold portion (6) includes a first arranging portion (63) on which one of the pair of O-rings (4) is arranged, the secondary mold portion (7) includes a second locating portion (74) on which the other of the pair of O-rings (4, 5) is arranged, and the second arrangement portion (74), the boundary portion (8) and the first arrangement portion (63) are arranged in this specified order in the press-fitting direction. [2] The sensor component (1) according to claim 1, wherein the boundary portion (8) includes: respective interfaces of the primary mold section (6) and the secondary mold section (7) which are intended to face each other; and a very small space provided between the respective interfaces. [3] The sensor component (1) according to claim 1 or 2, wherein the first arranging portion (63) is configured to have a groove shape on an outer peripheral surface of the primary mold portion (6), and the second arranging portion (74) is configured to have a groove shape on an outer peripheral surface of the secondary mold portion (7). [4] The sensor component (1) according to claim 1 or 2, wherein in a case where water, which is the measurement target, is contained on one side in the press-fitting direction of the mounting hole (10a), and oil is contained on an opposite side in the press-fitting direction of the mounting hole (10a), then one of the pair of O-rings (4) is made of a water-resistant material, and the other of the pair of O-rings (5) is made of an oil-resistant material.

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