DISPLAY BOARD AND PERSONAL IMMERSIVE DEVICE THAT CONTAINS IT

Abstract

A display panel and a personal immersive device containing it are disclosed. In the display panel, a first electrode and / or a second electrode of a light-emitting element comprise: an incident-side metal layer onto which light is incident; a reflection-side metal layer from which the light is reflected; and a transparent intermediate layer arranged between the incident-side metal layer and the reflection-side metal layer.

Description

[0001] This application claims priority to and the benefit of Korean Patent Application 10-2023-0080393, filed on June 22, 2023. BACKGROUND area

[0002] The present disclosure relates to a display panel and a personal immersive device incorporating the same, and more particularly, by way of example and without limitation, to a display panel capable of reducing certain light to which a user is exposed and to a personal immersive device employing the same. Discussion of the state of the art

[0003] Personal immersive devices have been developed in various forms, such as head-mounted devices (HMDs), face-mounted devices (FMDs), and eyeglass-type displays (EGDs). Personal immersive devices are divided into virtual reality (VR) devices and augmented reality (AR) devices.

[0004] In a personal immersive device, the distance between the user's eyes and a display panel is small. The display of such a personal immersive device requires high resolution, high luminance, and low-power operation.

[0005] Each pixel of the display panel may include a red sub-pixel, a green sub-pixel, and a blue sub-pixel to implement color. Since blue light negatively affects the human retina, prolonged exposure to blue light can lead to eye fatigue, dry eyes, sleep disturbances, and the like. In particular, in personal immersive devices, the distance between the user's eyes and the display panel is small, so blue light causes greater damage to the user's eyes.

[0006] The description provided in the description of the "Prior Art" section should not be considered prior art simply because it is mentioned in or associated with the description of the "Prior Art" section. The description of the "Prior Art" section may contain information describing one or more aspects of the technology in question, and the description in that section does not limit the invention. SUMMARY

[0007] The present disclosure has been devised in an effort to address the above-mentioned needs and / or disadvantages.

[0008] The present disclosure provides a display panel that can reduce light of a particular wavelength, e.g., blue light, to which a user is exposed, and a personal immersive device using the same.

[0009] The object of the present disclosure is not limited to the above-mentioned problems, and other problems not mentioned will be clearly apparent to those skilled in the art from the following description.

[0010] The objects are achieved by the subject matter of the independent claim. Advantageous embodiments and further developments are described in the respective dependent claims.

[0011] A display panel according to an exemplary embodiment of the present disclosure includes a light-emitting element configured to emit light in response to a voltage applied to a first electrode and a second electrode. The first and / or second electrodes include: an incident-side metal layer onto which light from the light-emitting element is incident; a reflection-side metal layer from which the light is reflected; and a transparent interlayer disposed between the incident-side metal layer and the reflection-side metal layer.

[0012] According to another embodiment of the present disclosure, a display panel comprises: a light-emitting element configured to emit light in response to a voltage applied to a first electrode and a second electrode, wherein at least one of the first and second electrodes comprises: an incident-side metal layer onto which light from the light-emitting element is incident; a reflection-side metal layer from which the light is reflected; and a transparent intermediate layer disposed between the incident-side metal layer and the reflection-side metal layer, wherein the incident-side metal layer is thinner than the reflection-side metal layer.

[0013] According to another embodiment of the present disclosure, a display panel comprises: a light-emitting element layer in which a light-emitting element is disposed; a circuit layer disposed under the light-emitting element layer and including a pixel circuit configured to drive the light-emitting element; and an encapsulation layer disposed on the light-emitting element layer, wherein the light-emitting element layer comprises: a plurality of first electrodes disposed in a plurality of respective sub-pixels and separated between the plurality of sub-pixels; and a second electrode shared by the plurality of sub-pixels.The first electrodes and / or the second electrode may include: an incident-side metal layer onto which light from the light-emitting element is incident; a reflection-side metal layer from which the light is reflected; and a transparent interlayer disposed between the incident-side metal layer and the reflection-side metal layer. The incident-side metal layer may be thinner than the reflection-side metal layer. The plurality of sub-pixels may include a red sub-pixel, a green sub-pixel, and a blue sub-pixel, wherein the first electrode of at least the blue sub-pixel includes the incident-side metal layer, the reflection-side metal layer, and the transparent interlayer.

[0014] A display panel according to another embodiment of the present disclosure includes a light-emitting element layer in which a light-emitting element is disposed; a circuit layer disposed below the light-emitting element layer and including a pixel circuit configured to drive the light-emitting element; and an encapsulation layer disposed on the light-emitting element layer. The light-emitting element layer includes a plurality of first electrodes disposed in a red sub-pixel, a green sub-pixel, and a blue sub-pixel, respectively, and separated between the sub-pixels; and a second electrode shared by the red sub-pixel, the green sub-pixel, and the blue sub-pixel.One of the first and second electrodes includes an incident-side metal layer onto which light from the light-emitting element is incident; a reflection-side metal layer from which the light is reflected; and a transparent intermediate layer disposed between the incident-side metal layer and the reflection-side metal layer.

[0015] A display panel according to another embodiment of the present disclosure includes a light-emitting element layer in which a light-emitting element is disposed; a circuit layer disposed below the light-emitting element layer and including a pixel circuit configured to drive the light-emitting element; and an encapsulation layer disposed on the light-emitting element layer. The light-emitting element layer includes a plurality of first electrodes disposed in a red sub-pixel, a green sub-pixel, and a blue sub-pixel, respectively, and separated between the sub-pixels; and a second electrode shared by the red sub-pixel, the green sub-pixel, and the blue sub-pixel. The red sub-pixel includes a first reflective layer disposed below the first electrode of the red sub-pixel.The green sub-pixel includes a second reflective layer disposed below the first electrode of the green sub-pixel. The blue sub-pixel includes a third reflective layer disposed below the first electrode of the blue sub-pixel. At least the third reflective layer among the first reflective layer, the second reflective layer, and the third reflective layer includes an incident-side metal layer onto which light from the light-emitting element is incident; a reflection-side metal layer from which the light is reflected; and a transparent interlayer disposed between the incident-side metal layer and the reflection-side metal layer.

[0016] According to another embodiment, a personal immersive device comprises: a first display panel in which a plurality of red sub-pixels, a plurality of green sub-pixels, and a plurality of blue sub-pixels are arranged, each comprising a light-emitting element and a pixel circuit configured to drive the light-emitting element; and a second display panel in which a plurality of red sub-pixels, a plurality of green sub-pixels, and a plurality of blue sub-pixels are arranged, each comprising a light-emitting element and a pixel circuit configured to drive the light-emitting element;wherein the light-emitting element of the first and second display panels emits light in response to a voltage applied to a first electrode and a second electrode, wherein one of the first electrode and the second electrode or a reflective layer disposed under the first electrode comprises: an incident-side metal layer onto which light from the light-emitting element is incident; a reflection-side metal layer from which the light is reflected; and a transparent intermediate layer disposed between the incident-side metal layer and the reflection-side metal layer, and wherein the incident-side metal layer is thinner than the reflection-side metal layer.

[0017] According to one or more embodiments of the present disclosure, a personal immersive device includes the display panel.

[0018] The personal immersive device may be of a glasses type.

[0019] Embodiments of the present disclosure may include at least one of the following optional features:

[0020] The incident-side metal layer is thinner than the reflection-side metal layer.

[0021] The incident-side metal layer may have a thickness between 50 Å and 450 Å and the reflection-side metal layer may have a thickness between 500 Å and 2000 Å.

[0022] The incident-side metal layer and the reflection-side metal layer may each contain metals selected from silver (Ag), gold (Au), and aluminum (Al).

[0023] The transparent intermediate layer can have a thickness between 50 nm and 80 nm or a thickness between 140 nm and 160 nm.

[0024] The transparent intermediate layer may comprise a single layer selected from a transparent conductive oxide, an inorganic insulating material, and an organic insulating material, or a stacked structure in which at least two of the transparent conductive oxide, the inorganic insulating material, and the organic insulating material are stacked.

[0025] The incident-side metal layer can be thinner than the reflection-side metal layer.

[0026] The light-emitting element may include a white light-emitting element arranged in the red sub-pixel, the green sub-pixel, and the blue sub-pixel to emit white light. The red sub-pixel may include a red color filter arranged on the encapsulation layer or below the first electrode of the red sub-pixel. The green sub-pixel may include a green color filter arranged on the encapsulation layer or below the first electrode of the green sub-pixel. The blue sub-pixel may include a blue color filter arranged on the encapsulation layer or below the first electrode of the blue sub-pixel.

[0027] The circuit layer may include an insulating layer adjacent to the first electrodes. The insulating layer may be recessed between the sub-pixels. The light-emitting element layer may have an insulating layer pattern covering a top surface and a side surface of an edge of each of the first electrodes.

[0028] The incident-side metal layer can be thinner than the reflection-side metal layer.

[0029] The first reflective layer, the second reflective layer, and the third reflective layer may each comprise the incident-side metal layer, the reflection-side metal layer, and the transparent intermediate layer.

[0030] An insulating layer between the first reflective layer and the first electrode of the red sub-pixel may be thicker than an insulating layer between the second reflective layer and the first electrode of the green sub-pixel.

[0031] The third reflective layer and the first electrode of the blue sub-pixel may be in contact with each other.

[0032] The incident-side metal layer can have a thickness between 50 Å and 450 Å. The reflection-side metal layer can have a thickness between 500 Å and 2000 Å.

[0033] The incident-side metal layer and the reflection-side metal layer may each contain metals selected from silver (Ag), gold (Au) and aluminum (Al).

[0034] The transparent intermediate layer can have a thickness between 50 nm and 80 nm or a thickness between 140 nm and 160 nm.

[0035] The transparent intermediate layer may comprise a single layer selected from a transparent conductive oxide, an inorganic insulating material, and an organic insulating material, or a stacked structure in which at least two of the transparent conductive oxide, the inorganic insulating material, and the organic insulating material are stacked.

[0036] The light-emitting element may include a white light-emitting element arranged in the red sub-pixel, the green sub-pixel, and the blue sub-pixel to emit white light.

[0037] The red sub-pixel may include a red color filter disposed on the encapsulation layer or under the first electrode of the red sub-pixel.

[0038] The green sub-pixel may include a green color filter disposed on the encapsulation layer or under the first electrode of the green sub-pixel.

[0039] The blue sub-pixel may include a blue color filter disposed on the encapsulation layer or under the first electrode of the blue sub-pixel.

[0040] The circuit layer may include an insulating layer adjacent to the first electrodes, the insulating layer being recessed between the plurality of sub-pixels. The light-emitting element layer may have an insulating layer pattern covering a top surface and a side surface of an edge of each of the first electrodes.

[0041] The incident-side metal layer can have a thickness between 50 Å and 450 Å. The reflection-side metal layer can have a thickness between 500 Å and 2000 Å. The transparent intermediate layer can have a thickness between 50 nm and 80 nm or a thickness between 140 nm and 160 nm.

[0042] The incident-side metal layer and the reflection-side metal layer may each contain metals selected from silver (Ag), gold (Au), and aluminum (Al). The transparent intermediate layer may comprise a single layer selected from a transparent conductive oxide, an inorganic insulating material, and an organic insulating material, or a stacked structure in which at least two of the transparent conductive oxide, the inorganic insulating material, and the organic insulating material are stacked.

[0043] The display panel may further comprise: a light-emitting element layer in which the light-emitting element is arranged; a circuit layer arranged below the light-emitting element layer and comprising a pixel circuit configured to drive the light-emitting element; and an encapsulation layer arranged on the light-emitting element layer, wherein the light-emitting element layer comprises: a plurality of the first electrodes each arranged in a plurality of sub-pixels and separated between the plurality of sub-pixels;and the second electrode shared by the plurality of sub-pixels, wherein the plurality of sub-pixels comprises a plurality of reflective layers disposed below the first electrodes of the plurality of sub-pixels, at least one of the plurality of reflective layers comprising: the incident-side metal layer, the reflection-side metal layer, and the transparent interlayer.;

[0044] The plurality of subpixels may include a red subpixel, a green subpixel, and a blue subpixel. The red subpixel may include a first reflective layer disposed below the first electrode of the red subpixel. The green subpixel may include a second reflective layer disposed below the first electrode of the green subpixel. The blue subpixel may include a third reflective layer disposed below the first electrode of the blue subpixel.

[0045] At least the third reflective layer of the first reflective layer, the second reflective layer, the third reflective layer may include the incident-side metal layer, the reflection-side metal layer, and the transparent intermediate layer.

[0046] The first reflective layer, the second reflective layer, and the third reflective layer may each comprise the incident-side metal layer, the reflection-side metal layer, and the transparent intermediate layer.

[0047] An insulating layer between the first reflective layer and the first electrode of the red sub-pixel may be thicker than an insulating layer between the second reflective layer and the first electrode of the green sub-pixel.

[0048] The third reflective layer and the first electrode of the blue sub-pixel may be in contact with each other.

[0049] The light-emitting element may include a white light-emitting element arranged in the red sub-pixel, the green sub-pixel, and the blue sub-pixel to emit white light. The red sub-pixel may include a red color filter arranged on the encapsulation layer or below the first electrode of the red sub-pixel. The green sub-pixel may include a green color filter arranged on the encapsulation layer or below the first electrode of the green sub-pixel. The blue sub-pixel may include a blue color filter arranged on the encapsulation layer or below the first electrode of the blue sub-pixel.

[0050] The circuit layer may include an insulating layer adjacent to the first electrodes, the insulating layer being recessed between the plurality of sub-pixels. The light-emitting element layer may have an insulating layer pattern covering a top surface and a side surface of an edge of each of the first electrodes.

[0051] The incident-side metal layer can have a thickness between 50 Å and 450 Å. The reflection-side metal layer can have a thickness between 500 Å and 2000 Å. The transparent intermediate layer can have a thickness between 50 nm and 80 nm or a thickness between 140 nm and 160 nm.

[0052] The incident-side metal layer and the reflection-side metal layer may each contain metals selected from silver (Ag), gold (Au), and aluminum (Al). The transparent intermediate layer may comprise a single layer selected from a transparent conductive oxide, an inorganic insulating material, and an organic insulating material, or a stacked structure in which at least two of the transparent conductive oxide, the inorganic insulating material, and the organic insulating material are stacked.

[0053] According to the present disclosure, light in a wavelength band that adversely affects the user's eyes can be absorbed in a reflective layer, and the thickness of the metal layer of the reflective layer can be adjusted to appropriately adjust the absorption rate, transmittance, and reflectance of the light. Therefore, the present disclosure can selectively reduce or minimize light in a blue wavelength band that adversely affects the user's eye health among the light incident on the user's eyes from pixels of the display panel, without degrading the image quality perceived by the user.

[0054] According to the present disclosure, it is possible to implement a display device that can be operated at low power by reducing light loss and reducing a leakage current flowing between sub-pixels.

[0055] According to the present disclosure, it is possible to prevent deterioration of the light-emitting element by forming a fence at the edge of the electrode.

[0056] The effects of the present disclosure are not limited to those mentioned above, and other effects not mentioned will be clearly apparent to those skilled in the art from the description of the claims.

[0057] It is to be understood that both the foregoing general description and the following detailed description of the present disclosure are exemplary and explanatory and are intended to provide further explanation of the disclosure as claimed. BRIEF DESCRIPTION OF THE DRAWINGS

[0058] The above and other objects, features and advantages of the present disclosure will become more apparent to those skilled in the art when exemplary embodiments thereof are described in detail with reference to the accompanying drawings, in which: Fig. 1 is a plan view showing a pixel of a display panel according to an exemplary embodiment of the present disclosure; Fig. 2 is a cross-sectional view schematically showing an example of a cross-sectional structure of a pixel taken along line II' of Fig. 1 in an emission type display panel facing upwards; Fig. 3 is a cross-sectional view schematically showing an example of a cross-sectional structure of a pixel taken along line II' of Fig. 1 in an emission type display panel facing downwards; Fig. 4 is a cross-sectional view showing a cross-sectional structure of a reflective layer capable of absorbing light in an absorption wavelength band according to an exemplary embodiment of the present disclosure; Fig. 5 and Fig. 6 diagrams showing a light absorption rate for each wavelength as a function of the thickness of a transparent interlayer for fixed thicknesses of an incident-side metal layer and a reflection-side metal layer; Fig. 7 is a graph showing transmittance for each wavelength as a function of the thickness of silver (Ag); Fig. 8 is a graph showing a light absorption rate for each wavelength versus the thickness of a reflection-side metal layer in a reflective layer; Fig. 9 is a diagram showing a transmittance for each wavelength as a function of the thickness of a reflection-side metal layer in a reflective layer; Fig. 10 is a diagram showing a reflectance of light for each wavelength as a function of the thickness of a reflection-side metal layer in a reflective layer; Fig. 11 is a cross-sectional view showing another example in which the Fig. 4 is applied in an upward emission type display panel; Fig. 12 is a cross-sectional view showing another example in which the Fig. 4 is applied in a downward emission type display panel; Fig. 13 and Fig. 14 cross-sectional views showing further examples where the Fig. 4 is applied in an upward emission type display panel; Fig. 15 is a diagram showing an example of the appearance of a personal immersive device; and Fig. 16 is a block diagram showing an example of a display device applicable to a personal immersive device.

[0059] In the drawings and detailed description, unless otherwise noted, the same drawing reference numerals refer to the same elements, features, and structures. The relative size and representation of these elements may be exaggerated for clarity, illustration, and convenience. DETAILED DESCRIPTION OF THE EXEMPLARY EMBODIMENTS

[0060] Reference will now be made in detail to embodiments of the present disclosure, examples of which may be illustrated in the accompanying drawings. The sequence of the described processing steps and / or operations is an example; however, the sequence of steps and / or operations is not limited to that set forth herein and may be changed as known in the art, except for steps and / or operations that are strictly required to occur in a particular order. The names of the respective elements used in the following explanations may be chosen only to simplify the writing of the disclosure and may therefore differ from those used in actual products.

[0061] The advantages and features of the present disclosure and the methods for implementing them will be more clearly understood from the exemplary embodiments described below with reference to the accompanying drawings. However, the present disclosure is not limited to the following exemplary embodiments, but may be implemented in various forms; rather, the present embodiments will complete the disclosure of the present disclosure and enable those skilled in the art to fully understand the scope of the present disclosure.

[0062] The shapes, sizes, ratios, angles, numbers, and the like illustrated in the accompanying drawings for describing exemplary embodiments of the present disclosure are merely examples, and the present disclosure is not limited thereto. Like reference numerals generally designate like elements throughout this specification. Furthermore, detailed descriptions of known related technologies may be omitted from the description of the present disclosure in order not to unnecessarily obscure the subject matter of the present disclosure.

[0063] Terms used herein, such as "comprise," "have," "comprise," "consist of," "consist of," "contain," and the like, are generally intended to allow for the addition of other components, unless the terms are used with the term "only." All references to the singular may include the plural unless expressly stated otherwise.

[0064] Components are designed to include a normal range of errors, even if this is not explicitly stated.

[0065] When describing a positional or connecting relationship between two components, such as "on," "over," "above," "below," "below," "next to," "beside," "next to," "connecting or coupling to," "crossing," "intersecting," or the like, one or more other components may be interposed therebetween unless "immediately" or "directly" is used. For example, when one element or layer is disposed "on" another element or layer, a third layer or element may be interposed therebetween.

[0066] When expressing that an element or layer "contacts", "overlaps", or the like, another element or layer, the element or layer may not only directly contact, overlap, or the like another element or layer, but may also indirectly contact, overlap, or the like, with one or more intermediate elements or layers arranged or interposed between the elements or layers, unless otherwise stated.

[0067] When describing a temporal, sequential relationship such as "after," "following," "next," "before," or the like, it may not be continuous on a time basis unless "just," "immediate," or "direct" is used.

[0068] The terms "first," "second," "A," "B," "(a)," and "(b)," and the like, may be used to distinguish elements from one another, but the functions or structures of the components are not limited by ordinal numbers or component names preceding the components. For example, a first element could be referred to as a second element, and similarly, a second element could be referred to as a first element, without departing from the scope of the present disclosure.

[0069] The following embodiments may be partially or completely interconnected or combined with each other and linked and operated in technically different ways. The embodiments may be implemented independently of each other or in conjunction with each other.

[0070] Hereinafter, various embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0071] With reference to Fig. 1 to 3, a display panel according to an exemplary embodiment of the present disclosure has a length extending in the X-axis direction, a width extending in the Y-axis direction, and a thickness extending in the Z-axis direction. The display panel may be rectangular in plan view or have a different shape including at least one portion that is curved or elliptical.

[0072] A substrate 10 of the display panel may be made of glass, plastic, flexible polymer film, silicon wafer, or the like. The substrate 10 may be configured as a backplane. For example, the flexible polymer film may be made of polyimide (PI), polyethylene terephthalate (PET), acrylonitrile-butadiene-styrene copolymer (ABS), polymethyl methacrylate (PMMA), polyethylene naphthalate (PEN), polycarbonate (PC), polyethersulfone (PES), polyarylate (PAR), polysulfone (PSF), cyclic olefin copolymer (COC), triacetylcellulose (TAC), polyvinyl alcohol (PVA), and / or polystyrene (PS), and the present disclosure is not limited thereto.

[0073] A plurality of pixels PIX are arranged on the display panel. Each of the plurality of pixels PIX can emit light with different wavelengths. The plurality of sub-pixels can include first to third sub-pixels that emit light of different colors. For example, each of the pixels PIX can include a red (R) sub-pixel SP1, which is a first sub-pixel, a green (G) sub-pixel SP2, which is a second sub-pixel, and a blue (B) sub-pixel SP3, which is a third sub-pixel, for color implementation. Furthermore, each of the pixels can include, but is not limited to, a white (W) sub-pixel. The size or shape of each of the plurality of sub-pixels, such as sub-pixels SP1, SP2, and SP3, can be modified variously. A recessed groove T can be arranged between the adjacent sub-pixels SP1, SP2, and SP3. The groove T blocks a current flowing between the adjacent sub-pixels.The trench T can block a leakage current flowing to the sub-pixel by extending a current path between the adjacent sub-pixels SP1, SP2 and SP3.

[0074] For example, the plurality of sub-pixels SP may include red, green, and blue sub-pixels, wherein the red, green, and blue sub-pixels may be repeatedly arranged. Alternatively, the plurality of sub-pixels SP may include red, green, blue, and white sub-pixels, wherein the red, green, blue, and white sub-pixels may be repeatedly arranged, or the red, green, blue, and white sub-pixels may be arranged in quadruple form. For example, the red sub-pixel, the blue sub-pixel, and the green sub-pixel may be sequentially arranged along a row direction, or the red sub-pixel, the blue sub-pixel, the green sub-pixel, and the white sub-pixel may be sequentially arranged along the row direction.However, in the exemplary embodiment of the present disclosure, the color type, arrangement type, and arrangement order of the sub-pixels are not limitative and may be designed in various shapes according to the light emission characteristics, device lifetime, and device specifications.

[0075] However, the sub-pixels may have different light-emitting areas depending on their light-emitting characteristics. For example, a sub-pixel that emits light of a different color than a blue sub-pixel may have a different light-emitting area than the blue sub-pixel. For example, the red sub-pixel, the blue sub-pixel, and the green sub-pixel, or the red sub-pixel, the blue sub-pixel, the white sub-pixel, and the green sub-pixel may each have a different light-emitting area.

[0076] A circuit layer 20, a light-emitting element layer 30, and an encapsulation layer 40 may be stacked on the substrate 10. For example, the circuit layer 20 may be disposed over the substrate 10, the light-emitting element layer 30 may be disposed over the circuit layer 20, and the encapsulation layer 40 may be disposed over the light-emitting element layer 30. Embodiments are not limited thereto. For example, at least one of the above components may be omitted and / or one or more additional components may be additionally included.

[0077] The circuit layer 20 may include a pixel circuit that drives light-emitting elements of the sub-pixels SP1, SP2, and SP3 based on pixel data of an input image. The circuit layer 20 may further include a gate drive circuit that supplies a gate signal to the pixel circuit. The pixel circuit may include a drive transistor that supplies a current to the light-emitting element based on its gate-source voltage, a switching transistor that applies a data voltage of the pixel data to the gate or source of the drive transistor, a storage capacitor that maintains the gate-source voltage of the drive transistor, a plurality of insulating layers that insulate metal patterns of such circuit elements, and the like. For example, the drive transistor and the switching transistor in the pixel circuit may be implemented as PMOS (P-channel metal-oxide-semiconductor) or NMOS (N-channel metal-oxide-semiconductor).

[0078] The light-emitting element layer 30 may include a light-emitting element disposed in each of the sub-pixels SP1, SP2, and SP3 and driven by the pixel circuit. In one exemplary embodiment, the light-emitting element may be a white light-emitting element disposed collectively in the sub-pixels SP1, SP2, and SP3 to generate white light. When the light-emitting layer includes a white organic light-emitting element, a color filter may be disposed on the light-emitting layer to convert white light from the white organic light-emitting element into light of a different color. In another exemplary embodiment, a red light-emitting element that generates red light may be disposed in the red sub-pixel SP1, and a green light-emitting element that generates green light may be disposed in the green sub-pixel SP2.A blue light-emitting element that generates blue light may be arranged in the blue sub-pixel SP3.

[0079] When the white light-emitting element is arranged in sub-pixels SP1, SP2, and SP3, a color filter 50 may be arranged to selectively transmit a wavelength of each color. The light-emitting elements of the light-emitting element layer 30 may be covered by multiple passivation layers, including organic and inorganic layers.For example, the multiple passivation layers may be formed by inorganic films in a single layer or in multiple layers; for example, the inorganic film in a single layer may be a silicon oxide film (SiOx film) or a silicon nitride film (SiNx film), and inorganic films in multiple layers may be formed by alternately stacking one or more silicon oxide films (SiOx films), one or more silicon nitride films (SiNx films), and one or more amorphous silicon films (a-Si films), but the present disclosure is not limited thereto.

[0080] The light-emitting element may be implemented as an organic light-emitting element or an inorganic light-emitting element. For example, the light-emitting element of the light-emitting element layer 30 may be implemented with an organic light-emitting diode (OLED) or an inorganic LED. The light-emitting element may include a first electrode 32, a second electrode 34, and an emission layer formed between the electrodes 32 and 34. The first electrode 32 may be, but is not limited to, an anode electrode of the light-emitting element separate for each sub-pixel. In other words, a respective one of the plurality of first electrodes 32 is arranged in each of the sub-pixels SP1, SP2, and SP3, as shown in Fig. 2. The second electrode 34 may be a common electrode shared by the plurality of sub-pixels, such as sub-pixels SP1, SP2, and SP3. The second electrode 34 may be, but is not limited to, a cathode electrode of the light-emitting element.

[0081] As it is in Fig. 2, the first electrodes 32 of the light-emitting element layer 30 may be arranged on the circuit layer 20, the second electrode 34 of the light-emitting element layer 30 may be arranged under the encapsulation layer 40, and the color filters 50 may be arranged on the encapsulation layer 40. As shown in Fig. 3, the color filters 50 may be disposed on the circuit layer 20, the first electrode 32 of the light-emitting element layer 30 may be disposed under the color filter 50, and the second electrode 34 of the light-emitting element layer 30 may be disposed under the encapsulation layer 40.

[0082] The encapsulation layer 40 covers the light-emitting element layer 30 to seal the circuit layer 20 and the light-emitting element layer 30. For example, the encapsulation layer 40 may have a multilayer insulating layer structure in which, for example, an organic layer and an inorganic layer are alternately stacked, or the encapsulation layer 40 may have a structure in which at least one organic layer is sandwiched between two inorganic layers. The inorganic layer blocks the penetration of moisture or oxygen, and the inorganic layers may contain an inorganic insulating material. For example, the inorganic layers may contain an inorganic insulating material that can be deposited at low temperatures, such as silicon nitride (SiN), silicon oxide (SiO), silicon oxynitride (SiON), and aluminum oxide (AlO).The organic layer smooths the surface of the inorganic layer, and the organic layer may contain an organic insulating material such as acrylic resin, epoxy resin, polyimide, polyethylene, and silicon oxycarbide (SiOC). When the organic layer and the inorganic layer are stacked in multiple layers, a path for moisture or oxygen becomes longer compared to a single layer, so that the penetration of moisture and oxygen that affect the light-emitting element layer 30 can be effectively blocked.

[0083] The display panel may have an upward emission type structure as shown in Fig. 2. Depending on the emission direction of the light emitted by the light emitting diode, the various embodiments may have a structure of the downward emission type as shown in Fig. 3, or a double-sided emission type structure, but are not limited thereto.

[0084] In the upward emission type display panel, as shown in Fig. 2, light is emitted from the light-emitting element layer 30 through the second electrode 34, the encapsulation layer 40 and the color filter 50 to the outside (as shown by the arrows in Fig. 2). In the top emission type display panel, the first electrode 32 may also serve as a reflective layer to increase light efficiency, and the second electrode 34 may be implemented as a transparent or translucent electrode. In the top emission type display panel, a distance between the first electrode 32 and the second electrode 34 may be set to be different for each color of the plurality of sub-pixels such as sub-pixels SP1, SP2, and SP3 or the like to achieve a micro-cavity effect. By using the micro-cavity, the light reflected between the electrodes 32 and 34 undergoes constructive interference, which increases the amplitude at the wavelength of the light and thereby increases the amount of light emitted outward in the top emission type.

[0085] In the case of the display panel with downward emission, as shown in Fig. 3, light from the light-emitting element layer 30 is transmitted through the first electrode 32, the color filter 50, the circuit layer 20 and the substrate 10 (as shown by the arrows in Fig. 3). In the bottom emission display panel, the second electrode 34 may also serve as a reflective layer to increase light efficiency, and the first electrode 32 may be implemented as a transparent or translucent electrode.

[0086] Although not shown in the drawing, in the double-side emission type, the light emitted from the LED is emitted to an upper portion and a lower portion of the substrate 10 on which the LED is disposed. In the case of the double-side emission type, the first electrode 32 and the second electrode 34 may both be formed of a transparent conductive material to allow the light emitted from the LED to reach the upper and lower portions of the substrate 10. In the exemplary embodiment of Fig. 2, the color filter 50 may be disposed over the encapsulation layer 40. In the exemplary embodiment of Fig. 3, the color filter 50 may be arranged between the first electrode 32 of the light-emitting element layer 30 and the circuit layer 20.

[0087] To reduce light of a specific wavelength, such as blue light, which adversely affects a user, the reflective layer may have a structure as shown in Fig. 4 is shown.

[0088] Fig. 4 is a cross-sectional view showing a cross-sectional structure of a reflective layer capable of absorbing light in an absorption wavelength band.

[0089] With reference to Fig. 4, the reflective layer may comprise an incident-side metal layer 301, a reflection-side metal layer 302, and a transparent intermediate layer 303 disposed between the incident-side metal layer 301 and the reflection-side metal layer 302. The three-layer structure as shown in Fig. 4 may be provided only in the specific sub-pixel, e.g., the blue sub-pixel SP3, or in each of the sub-pixels SP1, SP2, and SP3, and the present disclosure is not limited thereto. In particular, the three-layer structure as shown in Fig. 4, may be applied to one of the first and second electrodes or a reflective layer disposed under the first electrode, but the present disclosure is not limited thereto.

[0090] The incident-side metal layer 301 and the reflection-side metal layer 302 may each be made of a metal such as silver (Ag), gold (Au), or aluminum (Al), or the like. The transparent interlayer 303 may be a single layer selected from a transparent conductive oxide such as indium zinc oxide (IZO) or indium tin oxide (ITO), an inorganic insulating material such as silicon nitride (SiNx) or silicon oxide (SiO2), and an organic insulating material such as polyimide (PI), or may have a stacked structure of two or more of them, but the present disclosure is not limited thereto. The transparent interlayer 303 may have a transmittance of about 50% or more.

[0091] Light can impinge on the incident-side metal layer 301. The light then passes through the incident-side metal layer 301 into the transparent intermediate layer 303. In the light that passes through the transparent intermediate layer 303 and further propagates to the reflection-side metal layer 302, wavelengths that adversely affect the user's eye health in an absorption wavelength band, e.g., the wavelength band of blue light, are absorbed by the transparent intermediate layer 303, while light of other wavelengths passes through the transparent intermediate layer 303 and is reflected by the reflection-side metal layer 302. The wavelength band of blue light is 400 nm to 49 nm. In the visible light band, short wavelengths that adversely affect the user's eye health may be short wavelengths (e.g., specifically, 400 nm to 450 nm) in the blue wavelength band.Such short wavelengths may be absorption wavelengths that are absorbed within the reflective layer and / or the electrodes with the reflective layer.

[0092] Depending on the thickness t3 of the transparent intermediate layer 303, at least a portion of the light of a specific wavelength, e.g., the light in the blue wavelength band, may be absorbed in the reflective layer by destructive interference rather than constructive interference between the incident-side metal layer 301 and the reflection-side metal layer 302. Light with a wavelength other than the absorption wavelength may resonate between the incident-side metal layer 301 and the reflection-side metal layer 302, increasing its amplitude due to constructive interference, and thus may pass through the incident-side metal layer 301.

[0093] For example, a thickness t1 of the incident-side metal layer 301, onto which light is incident, is smaller than a thickness t2 of the reflection-side metal layer 302, from which light is reflected. For example, the thickness t1 of the incident-side metal layer 301 can be between 50 Å and 450 Å, and the thickness t2 of the reflection-side metal layer 302 can be between 500 Å and 2000 Å, but they are not limited thereto.

[0094] The transparent intermediate layer 303 in the reflective layer can absorb light of a certain wavelength band depending on its thickness t3. Fig. 5 and Fig. 6 are diagrams illustrating the variation of a light absorption rate for each wavelength band depending on the thickness t3 of the transparent intermediate layer 303 when the thickness t1 of the incident-side metal layer 301 is 20 nm and the thickness t2 of the reflective metal layer 302 is 100 nm. In Fig. 5 and Fig. 6, the horizontal axis is the wavelength of light [nm] and the vertical axis is the absorption rate of light, and the different curves represent different thicknesses of the transparent intermediate layer 303. For example, the thickness of the transparent intermediate layer 303 may be 30 nm, 40 nm, 50 nm, 60 nm, 70 nm, 80 nm, 90 nm, and the like.

[0095] As it is in Fig. 5, the blue wavelength band can be absorbed in the reflective layer when the thickness of the transparent intermediate layer 303 is between 50 nm and 80 nm. Furthermore, as shown in Fig. 6, the blue wavelength band can be absorbed in the reflective layer when the thickness of the transparent intermediate layer 303 is between 140 nm and 160 nm. Therefore, to reduce light in the blue wavelength band, the thickness t3 of the transparent intermediate layer 303 can be set to a thickness between 50 nm and 80 nm or between 140 nm and 160 nm, which can selectively absorb light of the absorption wavelength, but the present disclosure is not limited thereto.

[0096] Depending on the thicknesses t1 and t2 of the first and second metal layers 301 and 302, a transmittance can vary for each light wavelength. For example, Fig. 7 a transmittance for each wavelength of light when the thickness of silver (Ag) is 100 Å, 200 Å, 400 Å and 1000 Å. In Fig. 7, the horizontal axis is the light wavelength [nm], and the vertical axis is the light transmittance. When the transmittance is "1," 100% of the incident light passes through the silver (Ag), and when the transmittance is "0.2," 20% of the incident light passes through the silver (Ag). As the thickness of the metal increases, the light transmittance decreases, while the light reflectance increases. Fig. 7, the transmittance is 0.0 for all wavelengths when the silver (Ag) thickness is 1000 Å, ie the thicker the first and second metal layers 301 and 302 are, the lower their transmittance becomes.

[0097] Fig. Fig. 8 is a graph showing a light absorption rate for each wavelength depending on the thickness t2 of the reflection-side metal layer 302 in the reflective layer having a three-layer structure as shown in Fig. 4 is shown. In Fig. 8, the horizontal axis is the light wavelength [nm] and the vertical axis is the light absorption rate for each wavelength. Fig. Fig. 9 is a graph showing a light transmittance for each wavelength depending on the thickness t2 of the reflection-side metal layer 302 in the reflective layer having a three-layer structure as shown in Fig. 4 is shown. In Fig. 9, the horizontal axis is the light wavelength [nm] and the vertical axis is the light transmittance for each wavelength. Fig. Fig. 10 is a graph showing a light reflectance for each wavelength depending on the thickness t2 of the reflection-side metal layer 302 in the reflective layer having a three-layer structure as shown in Fig. 4 is shown. In Fig. 10, the horizontal axis is the wavelength of light [nm] and the vertical axis is the light reflectance for each wavelength. In the experiments of Fig. 8 to 10, the metal of the reflection-side metal layer 302 is silver (Ag), but the present disclosure is not limited thereto, and other metals that also have this reflective function may be used.

[0098] The experimental result of Fig. 8 shows that with a thickness t3 of the transparent intermediate layer 303 set to 60 nm and an absorption wavelength band of the transparent intermediate layer 303 set to 450 nm, the absorption rate of light converges to a maximum value at a thickness t2 of 50 nm or more with the thickness t1 of the incident-side metal layer 301 fixed at 20 nm when the thickness t2 of the reflection-side metal layer 302 is changed.

[0099] When the thickness t2 of the reflection-side metal layer 302 is equal to or similar to the thickness t1 of the incident-side metal layer 301, for example, when t1=t2=20 nm, constructive interference can occur in the reflective layer, thereby maximizing the transmittance of the light passing through the reflective layer. As shown in Fig. As can be seen from Figure 9, when the thickness t2 of the reflective metal layer 302 is 20 nm, the transmittance of a wavelength of 450 nm passing through the reflective layer is maximum.

[0100] Only wavelengths that negatively affect the user's eyes should be selectively absorbed, while light of other wavelengths should be reflected by the reflective layer. For this purpose, it is desirable to increase the thickness t2 of the reflective metal layer 302. In the experimental result of Fig. 7, the transmittance of light with a wavelength of 450 nm is about 10% when the thickness of silver (Ag) is 400 Å = 40 nm. This means that when the reflection-side metal layer 302 is made of silver (Ag) and its thickness is 40 nm, the light passing through the reflection-side metal layer 302, that is, the light loss, is 10%. In order to minimize the light loss for wavelengths other than the absorption wavelength band, the thickness t2 of the reflection-side metal layer 302, as shown in Fig. 10, therefore preferably at least 50 nm or more, for example between 500 Å and 2000 Å.

[0101] Fig. 11 is a cross-sectional view showing another example in which the Fig. 4 is applied in a display panel of the upward emission type. In Fig. 11 the substrate is omitted.

[0102] With reference to Fig. 11, the circuit layer 20 may include an insulating layer adjacent to the first electrodes 32 of the light-emitting element layer 30. The insulating layer may have a trench 21 recessed at a boundary between the plurality of sub-pixels, such as sub-pixels SP1, SP2, and SP3.

[0103] The light-emitting element layer 30 may be disposed on the circuit layer 20. The light-emitting element layer 30 includes the plurality of first electrodes 32 disposed on the insulating layer of the circuit layer 20, and the second electrode 34 opposite the first electrodes 32 with the emission layer interposed therebetween. The light-emitting element layer 30 may include the white light-emitting element disposed in the plurality of sub-pixels, such as sub-pixels SP1, SP2, and SP3. The white light-emitting element can emit light when a voltage applied to the first electrode 32 and the second electrode 34 is greater than its threshold voltage.

[0104] In each of the plurality of sub-pixels such as the sub-pixels SP1, SP2 and SP3, the first electrode 32 may include the incident-side metal layer 301, the reflection-side metal layer 302 and the transparent intermediate layer 303 disposed between the metal layers 301 and 302, as shown in Fig. 4. Light from the white light-emitting element traveling toward the back surface of the display panel passes through the incident-side metal layer 301 and the transparent interlayer 303 of the first electrode 32 to reach the reflection-side metal layer 302, is reflected by the reflection-side metal layer 302, and then emitted toward the front surface of the display panel through the transparent interlayer 303, the incident-side metal layer 301, the emission layer of the white light-emitting element, the second electrode 34, the encapsulation layer 40, and the color filter 50. Alternatively, only the first electrode 32 of the blue sub-pixel SP3 may be used as the reflective layer of the Fig. 4, but the present disclosure is not limited thereto. In this case, the first electrodes 32 of the red and green sub-pixels SP1 and SP2 may be formed of a single-layer metal or a stacked structure and / or material different from the structure shown in Fig. 4. In other implementations, only the red subpixel SP1 or the green subpixel SP2 may be formed as a reflective layer with a three-layer structure, as shown in Fig. 4 is shown.

[0105] For example, if light in the red wavelength band needs to be reduced or minimized, the reflective layer of the Fig. 4 may be formed only in the red sub-pixel SP1, which is a first sub-pixel. If light in the green wavelength band needs to be reduced or minimized, the reflective layer of the Fig. 4 may be formed only in the green sub-pixel SP2, which is a second sub-pixel. If light in the blue wavelength band needs to be reduced or minimized, the reflective layer of the Fig. 4 may be formed only in the blue sub-pixel SP3, which is a third sub-pixel, but the present disclosure is not limited thereto.

[0106] In some or all subpixels SP1, SP2, and SP3, the incident-side metal layer 301 is thinner than the reflection-side metal layer 302. In some or all subpixels SP1, SP2, and SP3, the thickness of the transparent interlayer 303 can be set to a thickness that absorbs light of a specific wavelength, e.g., light in the blue wavelength band, especially light with short wavelengths within the blue wavelength band. The absorption wavelength band can be selected by the thickness of the transparent interlayer 303, and the light absorption rate, light transmittance, and light reflectance can be selected by the thickness of the metal layers 301 and 302.

[0107] As it is in Fig. As shown in Figure 2, the encapsulation layer 40 may be disposed on the light-emitting element layer 30, and the color filters 50 may be disposed on the encapsulation layer 40. In the light incident on the color filter 50 of each of the sub-pixels SP1, SP2, and SP3, the amount of short-wavelength light in the blue wavelength band is reduced or minimized by the three-layer structure of the reflective layer of the first electrode 32.

[0108] A red color filter 50 arranged in the red sub-pixel SP1 can transmit light in a red wavelength band of visible light from the white light-emitting element and block light in other wavelength bands. A green color filter 50 arranged in the green sub-pixel SP2 can transmit light in a green wavelength band of visible light from the white light-emitting element and block light in other wavelength bands. A blue color filter 50 arranged in the blue sub-pixel SP3 can transmit light in the blue wavelength band of visible light from the white light-emitting element and block light in other wavelength bands.

[0109] Fig. 12 is a cross-sectional view showing another example in which the Fig. 4 is applied in a downward emission type display panel. In Fig. 12 the substrate is omitted.

[0110] With reference to Fig. 12, the light-emitting element layer 30 may be disposed on the circuit layer 20, and the encapsulation layer 40 may be disposed on the light-emitting element layer 30. In the circuit layer 20, the insulating layer in contact with the light-emitting element layer 30 may have the trench omitted in the drawing. The light-emitting element layer 30 includes the plurality of first electrodes 32 disposed on the insulating layer of the circuit layer 20, and the second electrode 34 opposite the first electrodes 32, with the emission layer of the white light-emitting element interposed therebetween.

[0111] The first electrodes 32 can be transparent or translucent electrodes through which light from the white light-emitting element passes. The color filters 50 can be arranged below the first electrodes 32 of the light-emitting element layer 30. The red color filter 50 arranged in the red sub-pixel SP1 can transmit light in the red wavelength band of visible light from the white light-emitting element and block light in other wavelength bands. The green color filter 50 arranged in the green sub-pixel SP2 can transmit light in the green wavelength band of visible light from the white light-emitting element and block light in other wavelength bands. The blue color filter 50 arranged in the blue sub-pixel SP3 can transmit light in the blue wavelength band of visible light from the white light-emitting element and block light in other wavelength bands.

[0112] In each of the plurality of sub-pixels such as the sub-pixels SP1, SP2 and SP3, the second electrode 34 may include the reflective layer having a three-layer structure, ie, the incident-side metal layer 301, the reflection-side metal layer 302 and the transparent intermediate layer 303 disposed between the metal layers 301 and 302, as shown in Fig. 4. In the light incident on the color filter 50 of each of the sub-pixels SP1, SP2, and SP3, the amount of short-wavelength light in the blue wavelength band is reduced or minimized by the three-layer structure of the reflective layer of the second electrode 34.

[0113] In each of the multiple sub-pixels, such as sub-pixels SP1, SP2, and SP3, the incident-side metal layer 301 is thinner than the reflection-side metal layer 302. In each of the multiple sub-pixels, such as sub-pixels SP1, SP2, and SP3, the thickness of the transparent interlayer 303 can be set to a thickness that absorbs light in the blue wavelength band, particularly light with short wavelengths within the blue wavelength band. The absorption wavelength band can be selected by the thickness of the transparent interlayer 303, and the light absorption rate, light transmittance, and light reflectance can be selected by the thickness of the metal layers 301 and 302.

[0114] Light from the white light-emitting element traveling toward the front surface of the display panel passes through the incident-side metal layer 301 and the transparent interlayer 303 of the second electrode 34 to reach the reflection-side metal layer 302, is reflected by the reflection-side metal layer 302, and then emitted through the transparent interlayer 303, the incident-side metal layer 301, the emission layer of the white light-emitting element, the first electrode 32, the color filter 50, the circuit layer 20, and the substrate toward the rear surface of the display panel.

[0115] Fig. 13 and Fig. 14 are cross-sectional views showing yet another example in which the Fig. 4 shown reflective layer applied in a display panel of the type with emission upwards is absorbed. In Fig. 13 and Fig. 14, the substrate, the encapsulation layer, the color filter, and the like are omitted. Fig. 13 provides a microcavity effect in each of the plurality of subpixels such as subpixels SP1, SP2 and SP3.

[0116] In Fig. 13 and Fig. 14, “TFT” means a thin film transistor arranged in the circuit layer to be electrically connected to the light-emitting element and to supply a current to the light-emitting element.

[0117] A light-emitting element, a thin-film transistor (TFT) for driving the light-emitting element, and the like may be arranged in each of the plurality of sub-pixels such as sub-pixels SP1, SP2, and SP3. A plurality of light-emitting elements may be defined differently depending on the type of display panel. For example, when the display panel is an inorganic light-emitting display panel, the light-emitting element may be a light-emitting diode (LED) or a micro-light-emitting diode (micro-LED). When the display panel is an organic light-emitting display panel, the light-emitting element may be an organic light-emitting diode (OLED), but embodiments of the present disclosure are not limited to this.

[0118] With reference to Fig. 13, the circuit layer may include a first insulating layer 22 covering the TFT, a second insulating layer 24 disposed on the first insulating layer 22, and a third insulating layer 26 disposed on the second insulating layer 24. A reflective layer 35 of the red sub-pixel SP1 may be disposed on the first insulating layer 22. A reflective layer 36 of the green sub-pixel SP2 may be disposed on the second insulating layer 24. A reflective layer 37 of the blue sub-pixel SP3 may be disposed on the third insulating layer 26. For example, each of the first insulating layer 22, the second insulating layer 24, and the third insulating layer 26 may be formed by an inorganic film in a single layer or in multiple layers.For example, the inorganic film in a single layer may be a silicon oxide film (SiOx film) or a silicon nitride film (SiNx film), and inorganic films in multiple layers may be formed by alternately stacking one or more silicon oxide films (SiOx films), one or more silicon nitride films (SiNx films), and one or more amorphous silicon films (a-Si films), but the present disclosure is not limited thereto.

[0119] The light-emitting element layer may further include a fence. In each of the plurality of sub-pixels, such as sub-pixels SP1, SP2, and SP3, the edge of the first electrode 32 may be covered by a fence 33. The fence 33 is an insulating layer pattern covering the upper surface and the side surface of the edge of the first electrode 32. The fence 33 may be formed of an inorganic insulating material such as SiNx, SiO2, or the like. In the absence of the fence 33, the light-emitting element may be degraded due to the lightning rod effect generated by an electric field concentrated at the edge and corner of the first electrode 32.

[0120] To increase the amount of light of each color using the microcavity effect in each of the multiple sub-pixels, such as sub-pixels SP1, SP2, and SP3, the thickness of the insulating layer between the first electrode 32 and the reflective layers 35, 36, and 37 may be different for each sub-pixel. For example, the insulating layers 24 and 26 between the first electrode 32 and the reflective layer 35 in the red sub-pixel SP1 are thicker than the insulating layer 26 between the first electrode 32 and the reflective layer 36 in the green sub-pixel SP2. In the blue sub-pixel SP3, the first electrode 32 and the reflective layer 37 may be in contact with each other without a gap.

[0121] The reflective layers 35, 36 and 37 of the plurality of sub-pixels such as the sub-pixels SP1, SP2 and SP3 may be substantially the same as the reflective layer of the Fig. 4. Alternatively, only the reflective layer 37 of the blue sub-pixel SP3 can be used as a reflective layer with the structure shown in Fig. 4. In this case, the reflective layers 35 and 36 of the red and green sub-pixels SP1 and SP2 may be formed from a single-layer metal or a stacked structure and / or material different from that shown in Fig. 4. In other implementations, only the reflective layers 35 or 36 of the red or green sub-pixels SP1 and SP2 may be formed as a reflective layer with a three-layer structure, as shown in Fig. 4 is shown.

[0122] With reference to Fig. 14, the first electrode 32 and the reflective layers 35, 36, and 37 in the sub-pixels SP1, SP2, and SP3 may be in contact with each other. In this embodiment, the reflective layers 35, 36, and 37 of the sub-pixels SP1, SP2, and SP3 may be substantially the same as the reflective layer of the Fig. 4. Alternatively, only the reflective layer 37 of the blue sub-pixel SP3 can be used as a reflective layer with the structure shown in Fig. 4. In this case, the reflective layers 35 and 36 of the red and green sub-pixels SP1 and SP2 may be formed from a single-layer metal or a stacked structure and / or material different from that shown in Fig. 4 shown reflective layer.

[0123] For example, if light in the red wavelength band needs to be reduced or minimized, the reflective layer of the Fig. 4 shown three-layer structure may be formed only in the reflective layer 35 of the red sub-pixel SP1. If light in the green wavelength band needs to be reduced or minimized, the reflective layer of the Fig. 4 may be formed only in the reflective layer 36 of the green sub-pixel SP2. If light in the blue wavelength band needs to be reduced or minimized, the reflective layer of the Fig. 4 may be formed only in the reflective layer 37 of the blue sub-pixel SP3, but the present disclosure is not limited thereto.

[0124] The display panel of the embodiments described above may implement a left-eye screen and a right-eye screen of a personal immersive device.

[0125] Fig. Figure 15 is a diagram showing an example of the appearance of a personal immersive device. The appearance of a personal immersive device is not shown in Fig. 15 limited.

[0126] With reference to Fig. 15, the personal immersive device may be manufactured in an HMD exterior design including a main body 1000 and a headband 1100.

[0127] The main body 1000 may include the display panel of the above-described embodiment, a lens arranged to face a screen of the display panel, a display panel driver, a system controller, a plurality of sensors, and the like. The main body 1000 may further include a camera. The lens may include an eyepiece or a fisheye lens. The display panel driver receives the pixel data of the input image and controls the pixels to display the input image on the display panel pixels.

[0128] The system controller may include an external device interface connected to a sensor, camera, or the like, and connected to a memory or external video source, a user interface for receiving a user command, and one or more processors connected to a power supply that generates power. The sensors include various sensors such as a gyro sensor and an accelerometer. The sensors send their outputs to the system controller. The system controller may receive the sensor outputs, shift the pixel data of an image displayed on the pixels of the display panel in synchronization with the user's movement, and execute a foveal rendering algorithm that follows the user's gaze.

[0129] The personal immersive device can be implemented using a mobile terminal system such as a smartphone. In this case, a left-eye image and a right-eye image can be displayed together on the display panel of the mobile terminal system. The smartphone supports the VR mode, which is an example of a partial mode. In the VR mode of the smartphone, the left-eye image and the right-eye image can be displayed together separately on a single display panel. In this case, the configuration of the main body 1000 is Fig. 15 is simplified, and the mobile terminal system supporting the VR mode can be detachably mounted on the main body 1000.

[0130] Fig. 16 is a block diagram showing an example of a display device applicable to a personal immersive device.

[0131] With reference to Fig.16, the display device, e.g., a personal immersive eyeglass-type device, may include a first display panel 100A on which a left-eye image is displayed and a second display panel 100B on which a right-eye image is displayed.

[0132] Display panels 100A and 100B include data lines DL, gate lines GL, and pixels PIX. A screen of display panels 100A and 100B includes a pixel array on which an image is displayed. The pixel array includes pixel lines L1 to Ln, into which pixel data is written by sequentially scanning them with scanning pulses shifted along a scanning direction.

[0133] The display panel driver may include data drivers 111 and 112, gate drivers 121 and 122, a controller 130, and the like. The data drivers 111 and 112 and the gate drivers 121 and 122 may be separate for each of the display panels 100A and 100B, while the controller 130 may be shared. The data drivers 111 and 112 convert the pixel data input from the controller 130 into voltage or current to supply the pixels with data signals. The gate drivers 121 and 122 sequentially output scanning pulses synchronized with the data signals output from the data drivers 111 and 112 under the control of the controller 130.

[0134] The problems to be solved by the present disclosure, the means for solving the problems and the effects of the present disclosure described above do not specify essential features of the claims, and therefore the scope of the claims is not limited to the disclosure of the present disclosure.

[0135] Although the embodiments of the present disclosure have been described in more detail with reference to the accompanying drawings, the present disclosure is not limited thereto and may be embodied in many different forms without departing from the technical concept of the present disclosure. Therefore, the embodiments disclosed in the present disclosure are for illustrative purposes only and are not intended to limit the technical concept of the present disclosure. The scope of the technical concept of the present disclosure is not limited thereto. Therefore, it should be understood that the embodiments described above are illustrative in all aspects and do not limit the present disclosure. QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] KR 10-2023-0080393

[0001]

Claims

[1] Scoreboard, which includes: at least a first electrode and a second electrode, a light-emitting element configured to emit light in response to a voltage applied to the at least one first electrode (32) and the second electrode (34), wherein the first electrode (32) and / or the second electrode (34) comprise: an incident-side metal layer (301) onto which light from the light-emitting element is incident; a reflection-side metal layer (302) from which the light is reflected; and a transparent intermediate layer (303) arranged between the incident-side metal layer (301) and the reflection-side metal layer (302), wherein the incident-side metal layer (301) is thinner than the reflection-side metal layer (302). [2] The display panel according to claim 1, wherein the incident-side metal layer (301) has a thickness between 5 nm and 45 nm and / or wherein the reflection-side metal layer (302) has a thickness between 50 nm and 200 nm. [3] A display panel according to any preceding claim, wherein the incident-side metal layer (301) and the reflection-side metal layer (302) each contain a metal selected from silver (Ag), gold (Au) and aluminum (Al). [4] A display panel according to any one of the preceding claims, wherein the transparent intermediate layer (303) has a thickness between 50 nm and 80 nm or a thickness between 140 nm and 160 nm. [5] A display panel according to any one of the preceding claims, wherein the transparent intermediate layer (303) comprises a single layer selected from a transparent conductive oxide, an inorganic insulating material and an organic insulating material, or a stacked structure in which at least two of the transparent conductive oxide, the inorganic insulating material and the organic insulating material are stacked. [6] Scoreboard, which includes: a light-emitting element layer (30) in which a plurality of light-emitting elements are arranged in a plurality of respective sub-pixels (SP1, SP2, SP3); a circuit layer (20) disposed beneath the light-emitting element layer (30) and comprising a plurality of pixel circuits configured to control the plurality of respective light-emitting elements; and an encapsulation layer (40) arranged on the layer for light-emitting elements (30), wherein the layer for light-emitting elements (30) comprises: a plurality of said first electrodes (32) arranged in said plurality of respective sub-pixels (SP1, SP2, SP3) and separated from each other between said plurality of sub-pixels; and a second electrode (34) shared by the plurality of sub-pixels, wherein the plurality of sub-pixels comprise a plurality of reflective layers (35, 36, 37) arranged under the respective first electrodes (32) of the plurality of sub-pixels, wherein at least one of the plurality of reflective layers (35, 36, 37) comprises: an incident-side metal layer (301) onto which light from the light-emitting element is incident; a reflection-side metal layer (302) from which the light is reflected; and a transparent intermediate layer (303) arranged between the incident-side metal layer (301) and the reflection-side metal layer (302), wherein the incident-side metal layer (301) is thinner than the reflection-side metal layer (302). [7] A display panel according to claim 6, wherein the plurality of sub-pixels comprise a red sub-pixel, a green sub-pixel and a blue sub-pixel, wherein the red sub-pixel comprises a first reflective layer (35) disposed beneath the first electrode (32) of the red sub-pixel, the green sub-pixel comprises a second reflective layer (36) disposed beneath the first electrode (32) of the green sub-pixel, and the blue sub-pixel comprises a third reflective layer (37) arranged below the first electrode (32) of the blue sub-pixel, wherein the third reflective layer (37) comprises the incident-side metal layer (301), the reflection-side metal layer (302) and the transparent intermediate layer (303). [8] A display panel according to claim 6 or 7, wherein the first reflective layer (35), the second reflective layer (36) and the third reflective layer (37) each comprise the incident-side metal layer (301), the reflection-side metal layer (302) and the transparent intermediate layer (303). [9] A display panel according to any one of claims 6 to 8, wherein an insulating layer between the first reflective layer (35) and the first electrode (32) of the red sub-pixel is thicker than an insulating layer between the second reflective layer (36) and the first electrode (32) of the green sub-pixel. [10] A display panel according to any one of claims 7 to 9, wherein the third reflective layer (37) and the first electrode (32) of the blue sub-pixel are in contact with each other. [11] A display panel according to any one of claims 7 to 10, wherein the plurality of light-emitting elements comprise a white light-emitting element arranged in the red sub-pixel, a white light-emitting element arranged in the green sub-pixel, and a white light-emitting element arranged in the blue sub-pixel, wherein the red sub-pixel comprises a red color filter arranged on the encapsulation layer (40) or under the first electrode of the red sub-pixel, wherein the green sub-pixel comprises a green color filter arranged on the encapsulation layer (40) or under the first electrode of the green sub-pixel, and wherein the blue sub-pixel comprises a blue color filter disposed on the encapsulation layer (40) or under the first electrode of the blue sub-pixel. [12] A display panel according to any one of claims 7 to 11, wherein the circuit layer (20) comprises an insulating layer adjacent to the first electrodes, the insulating layer being recessed between the plurality of sub-pixels, and the light-emitting element layer has an insulating layer pattern (33) covering a top surface and a side surface of an edge of each of the first electrodes. [13] A display panel according to any one of claims 7 to 12, wherein the incident-side metal layer (301) has a thickness between 5 nm and 45 nm, and / or wherein the reflection-side metal layer (302) has a thickness between 50 nm and 200 nm, and / or wherein the transparent intermediate layer (303) has a thickness between 50 nm and 80 nm or a thickness between 140 nm and 160 nm. [14] The display panel according to any one of claims 7 to 13, wherein the incident-side metal layer (301) and the reflection-side metal layer (302) each contain a metal selected from silver (Ag), gold (Au) and aluminum (Al), and / or wherein the transparent intermediate layer (303) comprises a single layer selected from a transparent conductive oxide, an inorganic insulating material and an organic insulating material, or a stacked structure in which at least two of the transparent conductive oxide, the inorganic insulating material and the organic insulating material are stacked. [15] Scoreboard, which includes: a light-emitting element layer (30) in which a plurality of light-emitting elements are each arranged in a plurality of sub-pixels (SP1, SP2, SP3); a circuit layer (20) disposed beneath the light-emitting element layer (30) and comprising a plurality of pixel circuits configured to respectively control the plurality of light-emitting elements; and an encapsulation layer (40) arranged on the layer for light-emitting elements (30), wherein the layer for light-emitting elements (30) comprises: a plurality of first electrodes (32) each arranged in the plurality of sub-pixels (SP1, SP2, SP3) and separated from each other between the plurality of sub-pixels; and a second electrode (34) shared by the plurality of sub-pixels, wherein the plurality of subpixels comprise a red subpixel, a green subpixel and a blue subpixel, wherein the first electrode of at least the blue sub-pixel comprises: an incident-side metal layer (301) onto which light from the respective light-emitting element is incident; a reflection-side metal layer (302) from which the light is reflected; and a transparent intermediate layer (303) arranged between the incident-side metal layer (301) and the reflection-side metal layer (302), wherein the incident-side metal layer (301) is thinner than the reflection-side metal layer (302) [16] The display panel according to claim 15, wherein the plurality of light-emitting elements comprise a white light-emitting element arranged in the red sub-pixel, a white light-emitting element arranged in the green sub-pixel, and a white light-emitting element arranged in the blue sub-pixel to emit white light, wherein the red sub-pixel comprises a red color filter arranged on the encapsulation layer (40) or under the first electrode of the red sub-pixel, wherein the green sub-pixel comprises a green color filter arranged on the encapsulation layer (40) or under the first electrode of the green sub-pixel, and wherein the blue sub-pixel comprises a blue color filter disposed on the encapsulation layer (40) or under the first electrode of the blue sub-pixel. [17] The display panel according to claim 15 or 16, wherein the circuit layer (20) comprises an insulating layer adjacent to the first electrodes, the insulating layer being recessed between the plurality of sub-pixels, and the light-emitting element layer (30) has an insulating layer pattern (33) covering a top surface and a side surface of an edge of each of the first electrodes. [18] A display panel according to any one of claims 15 to 17, wherein the incident-side metal layer (301) has a thickness between 5 nm and 45 nm and / or wherein the reflection-side metal layer (302) has a thickness between 50 nm and 200 nm and / or wherein the transparent intermediate layer (303) has a thickness between 50 nm and 80 nm or a thickness between 140 nm and 160 nm. [19] The display panel according to any one of claims 15 to 18, wherein the incident-side metal layer (301) and the reflection-side metal layer (302) each contain a metal selected from silver (Ag), gold (Au) and aluminum (Al), and / or wherein the transparent intermediate layer (303) comprises a single layer selected from a transparent conductive oxide, an inorganic insulating material and an organic insulating material, or a stacked structure in which at least two of the transparent conductive oxide, the inorganic insulating material and the organic insulating material are stacked. [20] Personal immersive device, comprising in particular: a first display panel (100A) according to any one of the preceding claims; and a second display panel (100B) according to any one of the preceding claims.

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