Methods for the material-bonded joining of components

Abstract

Method for the material-bonded joining of components (105, 110, 115, 120), comprising the steps (1000) Providing a first component (105), a second component (110), a third component (115) and a connecting foil (200) with several connecting sections (205) and a reaction section (210) connecting the connecting sections (205) together, wherein the connecting foil (200) contains metallic materials which react exothermically when activated, (2000) Placing the connecting foil (200) on the first component (105), (3000) Arranging the second and third components (110, 115) on the connecting film (200) such that a first connecting section (205) is arranged between the first component (105) and the second component (110) and a second connecting section (205) is arranged between the first component (105) and the third component (115), and (4000) Activating the metallic materials of the connecting foil (200) via an activating agent (135) attached to the reaction section (210), such that the connecting foil (200) heats up in such a way that the first component (105) is metallurgically bonded to the second component (110) and the third component (115).

Description

[0001] The invention relates to a connection between a first component and a second and third component. In this context, a method for attaching the second and third components to the first component is particularly claimed. The invention is especially suitable for applications in which the first component is a measuring object and the second and third components are designed as a chip or sensor chip.

[0002] German patent DE 10 2021 208 761 A1 discloses a method for connecting a sensor chip to a measurement object. According to this patent, a measurement object, a sensor chip, and a connecting film are provided, the connecting film containing metallic materials that react exothermically upon activation. The connecting film is then placed between the sensor chip and the measurement object. The metallic materials of the connecting film are then activated, causing the connecting film to heat up sufficiently to create a metallurgical bond between the sensor chip and the measurement object.

[0003] DE 10 2012 110 542 A1 shows a self-activating thin-film getter in reactive multilayer systems.

[0004] The object of the present invention is to provide a method for joining a first component to a second and a third component that requires fewer ignition sources and is suitable for component connections with difficult-to-access joining surfaces. The invention achieves this object by means of the subject matter of the independent claims. Dependent claims describe preferred embodiments.

[0005] The present invention proposes a reactive foil soldering process for obtaining a particularly intermetallic bond between components. The joining process is based on the use of a reactive multilayer foil as a local heat source. The foil consists of a novel class of nanotechnology material in which self-propagating exothermic reactions can be triggered at room temperature by an ignition process. By inserting such a foil, for example, between two components, the heat generated by the reaction in the foil melts the foil, so that the bond is completed at room temperature in approximately one second. The heat induced during the reaction is very low due to the rapid reaction rate (e.g., 10 m / s) and the small material thickness (e.g., <100 µm).

[0006] In this sense, a method for the material-bonded joining of components is proposed according to a first aspect of the invention. In step (1000), a first component, a second component, a third component, and a bonding film with several bonding sections and a reaction section connecting the bonding sections are provided, wherein the bonding film contains metallic materials that react exothermically upon activation. In step (2000), the bonding film is placed on the first component. In step (3000), the second and third components are arranged on the bonding film such that a first bonding section is arranged between the first component and the second component, and a second bonding section is arranged between the first component and the third component.In one step (4000) the metallic materials of the connecting foil are activated via an activating agent attached to the reaction section, so that the connecting foil heats up in such a way that the first component is metallurgically bonded to the second component and the third component.

[0007] The first component can be a measurement object, and the second and / or third component can be a sensor chip configured to detect a physical property of the measurement object. The first component serves as a carrier for the other components.

[0008] For example, a so-called NanoFoil® from Indium Corporation can be used as a connecting foil. The NanoFoil® is a reactive multilayer foil produced by vapor deposition of thousands of alternating nanoscale layers of aluminum and nickel. When the foil is activated by a small pulse of local energy from electrical, optical, or thermal sources, it reacts exothermically to generate precise local heat up to temperatures of 1500 °C in fractions of a second.

[0009] The proposed method allows for the creation of multiple bonding surfaces, enabling the bonding of two or more components to a single component in one step. The bond between the first component and all subsequent components to be connected to it via the bonding film is initiated and created using a single activation agent or ignition source. Thus, the bond is established in a single activation step. Conversely, it is not necessary to bond each component separately, i.e., with a separate bonding film and activation agent. This results in advantages regarding the production process, manufacturing time, and production costs.This also means that the joining process can be carried out largely independently of the geometry of the components to be joined, because the ignition source and the respective joining surface between the first component and the other component can be spatially separated from each other.

[0010] The reaction section of the connecting film links the connecting sections together, regardless of their number. The shape, geometry, and structure of the reaction section are selected such that all connections between the first component and the subsequent components can be created in a single step. The reaction section can have several strip sections that connect the ignition source to the connecting sections via intersections, branches, or the like. The reaction section therefore preferably includes intersections and / or branches. A first strip of the reaction section can be subdivided into several further strips, whereby the energy in the first strip can be transferred to the further strips with essentially no loss. The reaction section of the connecting film can be network-shaped or tree-like with main arms and secondary arms that connect via intersections or branches.Branches are interconnected and designed in a specific way. A main arm can be divided into two or more secondary arms to distribute the reaction section across multiple connecting sections.

[0011] Following step (4000), the reaction section can be removed in step (5000), leaving no structural or conductive connection between the finished joints where the connection sections were previously located. After step (4000), all subsequent components are therefore bonded to the first component. The reaction section can be removed, for example, by etching.

[0012] Naturally, the process can also be carried out with more than three components, with the connecting foil being designed according to the number of components to be attached to the first component. Accordingly, steps (1000) to (3000) can be extended with additional components as needed, with each additional component placed on the connecting foil providing another connection section between the first component and the respective additional component. The reaction section is geometrically adapted accordingly so that, similar to controlled explosions, a precisely defined activation sequence is maintained to ensure that each connection is reliably established.

[0013] Steps (2000) and (3000) can be performed or combined such that the bonding film, in a sandwich configuration, is in direct contact with the facing surfaces of the first and second or third components. Accordingly, in step (4000), the material of the first component and / or the second component can be locally melted or partially melted, resulting in direct welding.

[0014] Alternatively, steps (2000) and (3000) can be performed or combined such that the bonding foil is arranged in a sandwich configuration between two solder layers, the solder layers being applied to the facing surfaces of the first and second or third components, or to the corresponding bonding sections of the bonding foil. These surfaces are, in particular, flat surfaces that can be brought into contact with one another for subsequent metallurgical bonding. If a solder layer is arranged between the bonding section and the respective component, the two components are soldered together in step (4000). Thus, the first component can be soldered to the second or third component by melting solder layers or other adhesion-promoting layers.

[0015] In this sense, according to one embodiment, a first adhesion promoter layer is applied to the first component in step (1300) before step (2000), wherein the bonding film is positioned on the first component in step (2000) such that the first adhesion promoter layer is located between the first component and the first and second bonding sections. Alternatively, a first adhesion promoter layer is applied to both the first and second bonding sections in step (1300) before step (2000). The adhesion promoter layer serves to improve the adhesion between the materials of the components to be joined. It is generally applied to the surface of the components to be joined.

[0016] Preferably, the metallic materials of the bonding foil are activated in step (4000) such that the bonding foil heats up to such an extent that the first adhesion promoter layer melts and the first component is metallurgically bonded to the second and third components via the molten first adhesion promoter layer. The first adhesion promoter layer is preferably a first solder layer. Thus, during activation, the bonding foil heats up so intensely that the first adhesion promoter layer melts and the first component is soldered to the second and third components via the molten first adhesion promoter layer.

[0017] Alternatively or additionally, a second adhesion promoter layer is applied to the second and third components in step (1500) prior to step (3000), wherein the second and third components are positioned on the bonding film in step (3000) such that a second adhesion promoter layer is present between the first bonding section and the second component, as well as between the second bonding section and the third component. Furthermore, alternatively, a second adhesion promoter layer is applied to the first bonding section and to the second bonding section in step (1500) prior to step (3000).

[0018] Preferably, the metallic materials of the bonding foil are activated in step (4000) such that the bonding foil heats up to the point where the second adhesion promoter layer melts and the first component is metallurgically bonded to the second and third components via the molten second adhesion promoter layer. The second adhesion promoter layer is preferably a second solder layer, such that upon its activation, the bonding foil heats up to the point where the second adhesion promoter layer melts and the first component is soldered to the second and third components via the molten second adhesion promoter layer.

[0019] The respective joining section is to be understood as an joining section that, after step (4000), forms a bonding layer between the first component and the second or third component. The reaction section is to be understood as an activation section or reactive part of the joining foil, wherein the activating agent is applied at a defined location within the reaction section where the metallic material of the joining foil can be initially activated. The reactive part of the joining foil is only required to provide energy for activating the joining section. If further layers, such as adhesion promoter layers or solder layers, are provided between the joining section and the respective component, the reaction section is dimensioned such that sufficient activation energy is provided for melting the further layer(s).

[0020] The reaction of the metallic material in the bonding foil spreads along the reaction section until it reaches the bonding sections, at which point the metallic material is activated to create the metallurgical bond between the two components. Each bonding section is dimensioned such that the activated bonding foil metallurgically connects the first component to the second or third component via the bonding layer defined by the bonding section. The reaction section of the bonding foil lies outside the joining surface defined by the bonding layer between the first component and the second or third component.

[0021] In its simplest form, the connecting film has a substantially constant layer thickness across its entire surface. In other words, the connecting sections and the reaction section that joins them in one piece have the same thickness. However, it is conceivable that the connecting section of the film has a first layer thickness and the reaction section has a second layer thickness that differs from the first. In other words, the connecting film can be designed with variable thickness. Preferably, the reaction section is thinner than the connecting sections. This allows for material savings in the connecting film, since the reaction section only needs to be thick enough to transfer sufficient energy to activate the respective connecting section.In contrast, the respective connection section can be thicker in order to provide sufficient energy for the exothermic reaction of the metallic material of the connection foil during activation in step (4000), especially if adhesion promoter layers are provided.

[0022] The activation of the metallic materials of the connecting foil can be achieved, for example, by ignition using the activating agent. The process requires no special heat, vacuum, or gas atmosphere. The connecting foil can be ignited, for example, with a standard 9V battery connected to the foil via the respective activating agent. The activating agent can comprise wires, such as a positive and a negative terminal, with a potential difference between the terminals. The wires can be separate and handled independently. Alternatively, the two wires can be joined at their ends to form a connector, in order to maintain a defined distance between the wires. The activating agent can also be or comprise a voltage source, particularly a battery, or a heating probe.

[0023] During the process, no high pressures or temperatures need to be applied to the components. High electromagnetic fields are also unnecessary. The metallic bonding layer between the components, created by activating the metallic materials of the bonding foil, exhibits particularly high dimensional stability as well as high thermal and electrical conductivity. Furthermore, the manufacturing or bonding process is simplified, enabling particularly cost-effective production.

[0024] The inventive method is characterized by lower temperatures and stresses during joining. These lower stresses induce fewer prestresses in the components. Furthermore, the low temperatures and low pressure allow for a wider range of materials, such as polymers. The bond between the components produced by the inventive method does not age over time or with temperature changes. Steam, pressure, or similar factors do not alter the parameters of the bond. The composite material is particularly resistant to moisture, chemicals, high / low temperatures, and rapid temperature changes. Therefore, the bond does not change its parameters, especially due to temperature, humidity, pressure, or similar factors. The composite material also offers elastic deformation for repeatability.

[0025] Advantageously, the electrical connection between the activating agent and the connecting film can be made with the same device used to place the second and third components on the first component and to apply pressure for a metallurgical bond.

[0026] If solder layers are intended as adhesion promoters, they can consist of materials such as copper, gold, palladium, or nickel. These materials can be applied particularly advantageously as metallic starter layers using plasma processes, sputtering, or vapor deposition. Other options include two-shot injection molding, additive manufacturing, and similar methods.

[0027] The bonding film can be shaped to the desired dimensions with exceptional precision and efficiency using laser cutting and then positioned between the two surfaces. The structure and geometry of the bonding film can be created after it has been applied to the first component. The laser cutting is performed specifically before step (3000).

[0028] To prevent unpredictable deformation of the bond between the first and second components or between the first and third components, a fixing pad can be applied to the layers with low pressure. In this respect, preferably a fixing pad exerting pressure on the first component and / or the second and third components is used to counteract deformation of the bonding film and optional solder layers during activation and metallurgical bonding in step (4000). The pressure is so low that it does not lead to any stresses within the components that could impair the strength of the bond or the measurement accuracy.

[0029] According to a second aspect of the invention, an arrangement of a second component and a third component is provided on a first component, wherein the second and third components have been connected to the first component by a method according to the first aspect of the invention. The first component can be significantly larger than the second component and / or the third component. The first component can be a measuring object or a carrier component, wherein the second and third components are each configured as a chip, in particular as a sensor chip, the respective sensor chip being configured to detect a physical property of the measuring object. The measuring object can, for example, be an axle or a shaft for an engine or transmission of a motor vehicle or a robot arm segment for a robot. The sensor chip can, in particular, be configured to measure a deformation, a strain, a force, and / or a torque.that is generated by the object being measured, in particular by the axle, the motor shaft or the transmission shaft.

[0030] Where elements are designated by means of a numbering system, for example "second component," "third component," and "further component," this numbering or designation is solely for differentiation purposes and does not imply any dependency between the elements or a mandatory sequence. This means, in particular, that a device does not need to have a "second component" in order to have a "third component," and vice versa.

[0031] The arrangement can also include a "third component" and a "fourth component" without necessarily having a "second component".

[0032] The invention will now be described in more detail with reference to the attached figures, in which: Fig. 1 a top view of an arrangement according to the invention of a first component on a second component according to a preferred embodiment; Fig. 2 a longitudinal sectional view of a section of the arrangement according to the invention Fig. 1 to illustrate a layer structure; Fig. 3 an exploded view of layers and tools for joining a first component to a second component and a third component by means of the connecting film, as well as the arrangement resulting from the joining; Fig. 4 a block diagram to illustrate a process of a method according to the invention for connecting a first component with a second component and a third component; and Fig. 5 A greatly enlarged cross-sectional view of the connecting foil for the arrangement according to Fig. 1, Fig. 2 or Fig. 5; represents, where identical or similar elements are provided with the same reference symbol.

[0033] Fig. 1 and Fig. Figure 2 shows an arrangement 100 in which a first component 105, serving as a carrier plate or measuring object, is materially bonded to several other components 110, 115, 120, wherein the other components 110, 115, 120 can be, for example, chips, in particular sensor chips, or the like. A physical property of the first component 105 can be detected by means of the respective sensor chip. The second component 110, the third component 115, and all other components 120 are connected by a method that takes into account Fig. As described in more detail in section 4, the first component 100 is materially bonded. The first component 105 is significantly larger than the subsequent components 110, 115, and 120.

[0034] According to Fig. Figure 1 shows ten additional components 110, 115, 120 arranged on the first component 105 and thus materially bonded. The distinction between "second component", "third component" and "further component" is made here only to illustrate that this method is advantageously applicable to arrangements in which the further components 110, 115, 120, in particular the joining surfaces to the first component 105, are either difficult to access and / or all further components 110, 115, 120 are to be joined to the first component 105 in a single activation step.

[0035] After Fig. Figure 2 shows a state of the arrangement 100 before the material bond between the first component 105 and the further components 110, 115, 120 is created. For easier illustration and explanation, see Figure 2. Fig. Figure 2 merely illustrates a connection area between the first component 105 and the second component 110. The statements made here apply equally and analogously to the connection areas between the first component 105 and the second component 115, as well as to the further components 120.

[0036] A bonding foil 200 is provided to create a strong, at least metallurgical, connection between the first component 105 and the other components 110, 115, 120 arranged on it. The bonding foil 200 is a so-called NanoFoil®, i.e., a reactive multilayer foil produced by vapor deposition of thousands of alternating nanoscale layers of aluminum 202 and nickel 203. A highly magnified cross-sectional view of the bonding foil 200 with the aluminum and nickel layers 202, 203 is shown in Fig. Figure 5 shows that when the connecting foil 200 is activated by a small pulse of local energy from electrical, optical, or thermal sources, it reacts exothermically to generate precise local heat up to temperatures of 1500 °C in fractions of a second. The aluminum and nickel layers 202, 203 are to be understood as the metallic materials of the connecting foil 200 within the meaning of the invention.

[0037] In a first process step 1000 of the method according to the invention, the components 105, 110, 115, 120 and the connecting film 200 are initially provided. The connecting film 200 has a number of connecting sections 205 corresponding to the number of components 110, 115, 120 to be attached to the first component 105, which form the joining area between the first component 105 and the further component 110, 115, 120. The bearing or joining surface of the connecting section 205 is selected such that the further component 110, 115, 120 completely covers the associated connecting section 205.

[0038] The connecting sections 205 are integrally connected to a reaction section 210 of the connecting foil 200, wherein the reaction section 210 is shown in the top view according to Fig. 1 is ring-shaped and has intersections 125 and branches 130 for branching the reaction section 210 to the connecting sections 205. An activation agent 135 is attached to the reaction section 210, the attachment point of the activation agent 135 to the reaction section 210 being understood as the activation point 140 of the connecting foil 200. The activation agent 135 comprises according to Fig. 3. A battery 300 serves as an ignition source, providing electrical current to activate the metallic materials of the connecting foil 200 and introducing it at activation point 140. The reaction section 210 can be understood as a distribution network, whereby electrical energy introduced into the connecting foil 200 at activation point 140 activates the metallic material of the connecting foil 200, thereby triggering a chain reaction that successively activates all connecting sections 205 at the end of each branch 130 or intersection 125. In this case, the energy at activation point 140 is directly split into two paths to the left and right. This shortens the reaction time for producing the metallurgical bond.

[0039] After Fig. 2 in conjunction with Fig. 3. A first adhesion promoter layer 215 is arranged between the connecting section 205 of the connecting foil 200 and the first component 105. The first adhesion promoter layer 215 is applied in process step 1300 to the first component 105 or alternatively to a surface of the connecting section 205 facing the first component 105. Furthermore, a second adhesion promoter layer 220 is arranged between the connecting section 205 of the connecting foil 200 and the second component 110. The second adhesion promoter layer 220 is applied in process step 1500 to the second component 110 or alternatively to a surface of the connecting section 205 facing the second component 110. The adhesion promoter layers 215 and 220 are solder layers comprising tin.

[0040] Depending on the application, design, and material of components 105, 110, 115, and 120, the adhesion promoter layers 215 and 220 can be omitted, allowing process step 2000 to follow directly after process step 1000. This is illustrated by the dashed arrow between process steps 1000 and 2000. After process step 2000, the bonding film 200 is placed on the first component 105. In other words, the bonding film 200 is positioned on the surface of the first component 105 and prepared to receive the subsequent components 110, 115, and 120.

[0041] In the subsequent process step 3000, the second component 110, the third component 115, and the further components 120 are arranged on the respective connecting section 205 of the connecting foil 200, so that the respective connecting section 205 is located between the first component 105 and a corresponding further component 110, 115, 120. It is conceivable to alternatively perform process step 1500 before process step 3000.

[0042] After steps 2000 and 3000, the bonding foil 200 contacts the first adhesion promoter layer 215 of the first component 205 on one side and the second adhesion promoter layer 220 of the second component 210 on the other side. After process step 3000, the aluminum layers 202 and the nickel layers 203 of the bonding foil 200 are still arranged alternately next to each other as shown in Fig. 2 and Fig. 5 is shown.

[0043] In process step 4000, a pulse is sent via battery 300 to activation point 140 of reaction section 210. The aluminum and nickel layers 202, 203 of the connecting foil 200 then react strongly exothermically, causing the adhesion promoter layers 215, 220 to melt and thus bonding the first component 105 to the other components 110, 115, 120.

[0044] Fig. Figure 2 also shows that the connecting section 205 of the connecting foil 200 has a first layer thickness that is thicker than the second layer thickness of the reaction section 210. The reaction section 210 is made thick enough to transfer sufficient energy from the activation point 140 into the respective connecting section 205 to initiate the exothermic reaction for the metallurgical bonding of the first component 105 with the further components 110, 115, 120. This allows for savings in aluminum and nickel in the production of the connecting foil 200. However, the process can be simplified if the connecting foil 200 has a substantially constant thickness across its entire surface.

[0045] In the left part of the Fig. Figure 3 shows a state in which no material bond has yet been created between the first component 105 and the exemplary second component 105. The right part of the Fig. Figure 3 shows the state after the formation of the material-bonded connection between the two components 105, 110 to realize the arrangement 100.

[0046] Before being placed between components 105, 110, 115, and 120, the connecting foil 200 is laser-cut to give it a shape and dimensions that include the connecting sections 205 (which can be understood as joining sections) and the reaction section 210. In this example, the battery 300 of the activating agent 18 is electrically connected to the activation point 140 via wires 305. After process step 3000, all layers are located in the Fig. The three components are stacked on top of each other in the sequence shown on the left. At the beginning of process step 4000, or before, a fixing pad 310 exerts a pressure p on the stack formed by the first component 105, the bonding film 200, the second component 205, and the two adhesion promoter layers 215, 220 via a flexible layer 315. This pressure p is very low and acts perpendicularly on the top surface of the second component 110. The pressure p serves to counteract deformation of the adhesion promoter layers 215, 220 and the bonding film 200 during activation in process step 4000. Activation creates a stable bonding layer 325 between the first component 105 and the second component 110, cf. Fig. 3, right.

[0047] What here in Fig. 2 and Fig. Figure 3, which is shown as an example for the connection between the first and second components 105, 110, is in reality for the connection between the first component 105 on the one hand and all further components 110, 115, 120 on the other hand according to Fig.To understand this, the other components 110, 115, and 120 are arranged in a common plane and each rests on the one-piece connecting film 200. The fixing pad 315 and the flexible layer 320 are designed such that the pressure p is applied simultaneously and uniformly to all other components 110, 115, and 120 before the metallic material of the connecting film 200 is activated in process step 4000 as described above. This results in all metallurgical bonds being created in a single activation step after the pulse is introduced at the activation point 140. The connecting film 200 is thus heated in such a way that the first component 105 is metallurgically bonded to the second component 110, the third component 115, and each subsequent component 120, partly simultaneously and / or partly immediately one after the other.Since the reaction rate of the connecting film is approximately 10 m / s due to its small thickness, the activation and the associated material bonding of the first component 105 with the other components 110, 115, 120 is perceived as a simultaneous process.

[0048] An optional process step 5000 may be provided, in which, after the activation of the metallic material of the connecting foil 200, i.e., after process step 4000, excess material from the reaction section 210, which is not required for the bond between the first component 105 and the further components 110, 115, 120, is removed. This may be necessary, for example, if the assembly 100 is to be freed from impurities, in particular if the assembly 100 is to be encapsulated and / or assembled in a further manufacturing step. Reference sign p print 100 arrangement 105 first component 110 second component 115 third component 120 Additional component 125 Intersection 130 Junction 135 Activating Agents 140 activation point 200 connecting foil 202 Aluminum layer 203 Nickel layer 205 Connecting section 210 Reaction section 215 first custody intermediary layer 220 second custody mediator layer 300 battery 310 wire 315 Fixing pad 320 compliant layer 325 Compound layer 1000 process step 1300 Process step 1500 process step 2000 process step 3000 process step 4000 process step 5000 process step

Claims

[1] Method for the material-bonded joining of components (105, 110, 115, 120), comprising the steps (1000) Providing a first component (105), a second component (110), a third component (115) and a connecting foil (200) with several connecting sections (205) and a reaction section (210) connecting the connecting sections (205) together, wherein the connecting foil (200) contains metallic materials which react exothermically when activated, (2000) Placing the connecting foil (200) on the first component (105), (3000) Arranging the second and third components (110, 115) on the connecting film (200) such that a first connecting section (205) is arranged between the first component (105) and the second component (110) and a second connecting section (205) is arranged between the first component (105) and the third component (115), and (4000) Activating the metallic materials of the connecting foil (200) via an activating agent (135) attached to the reaction section (210), such that the connecting foil (200) heats up in such a way that the first component (105) is metallurgically bonded to the second component (110) and the third component (115). [2] Method according to claim 1, wherein prior to step (2000) in a step (1300) a first adhesion promoter layer (215) is applied to the first component (105), wherein the bonding film (200) is placed on the first component (105) in step (2000) such that the first adhesion promoter layer (215) is arranged between the first component (105) and the first bonding section (205) and the second bonding section (205). [3] Method according to claim 1, wherein prior to step (2000) in a step (1300) a first adhesion promoter layer (215) is applied to the first joining section (205) and to the second joining section (205). [4] Method according to claim 2 or claim 3, wherein the metallic materials of the bonding film (200) are activated in step (4000) such that the bonding film (200) heats up in such a way that the first adhesion promoter layer (215) melts and the first component (105) is bonded to the second component (110) and the third component (115) by means of the melted first adhesion promoter layer (215). [5] Method according to one of claims 1 to 4, wherein prior to step (3000) in a step (1500) a second adhesion promoter layer (220) is applied to the second component (110) and the third component (115), wherein the second and third components (110, 115) are arranged on the bonding film (200) in step (3000), such that a second adhesion promoter layer (220) is arranged between the first bonding section (205) and the second component (110) and between the second bonding section (205) and the third component (115). [6] Method according to any one of claims 1 to 4, wherein, prior to step (3000) in step (1500) a second adhesion promoter layer (220) is applied to the first joining section (205) and to the second joining section (205). [7] Method according to claim 5 or claim 6, wherein the metallic materials of the bonding film (200) are activated in step (4000) such that the bonding film (200) heats up in such a way that the second adhesion promoter layer (220) melts and the first component (105) is bonded to the second component (110) and the third component (115) by means of the melted second adhesion promoter layer (220). [8] Method according to one of the preceding claims, wherein the connecting section (205) of the connecting film (200) has a first layer thickness and the reaction section (210) has a second layer thickness different from the first layer thickness. [9] Method according to any of the preceding claims, wherein the reaction section (210) comprises intersections (125) and / or branches (130).

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