Power module with a circuit carrier

Abstract

The present invention relates to a power module (12) with a circuit carrier (14) comprising a carrier substrate (40) and an electrical insulation layer (16), wherein the circuit carrier (14) has a first conductor structure (18) with an external contact region (18.2) and at least one second conductor structure (20A, 20B) with at least one external contact region (20A.2, 20B.2) and a further, third conductor structure (22) having at least one external contact region (22.2), with semiconductor components (42) arranged individually or in groups (64, 66), wherein the power module (12) is assigned a multifunctional frame (50) with a printed circuit board (122), wherein the groups (64, 66) of semiconductor components (42) are arranged in a first level (60) which is spatially separated from a second level (62) in the multifunctional frame (50), wherein the printed circuit board (122) comprises a number of pins (146) which are inserted into sleeves (150) which are joined in a material-to-material manner either to a spacer (130) on a semiconductor component (42) or to an AMB substrate (134).

Description

Technical area

[0001] The invention relates to a power module comprising a first circuit carrier made of a carrier substrate and a first conductor structure with an external contact region, at least one second conductor structure with at least one external contact region, and a further, third conductor structure comprising an external contact region, further comprising a first group of semiconductor components and a second group of semiconductor components. Furthermore, the invention relates to a method for producing a power module. State of the art

[0002] In the current state of the art, power modules, for example, those installed in a power module bridge, are additionally molded. During molding, the power module is embedded in a rigid protective housing, for example, made of plastic (molding compound). The molding compound serves to enclose and protect the interior of the power module. However, these molding compound enclosures of the power module are not particularly resistant to cracking.

[0003] DE 10 2014 219 998 B4 discloses a power module, in particular for providing a phase current for an electric motor. The power module comprises a circuit carrier with a surface, at least two first contact surfaces on the surface, and at least two first power transistors, each of which has a ground contact surface. A first power transistor of the at least two first power transistors is arranged directly on each of the first contact surfaces and is electrically conductively connected to the respective first contact surface via its ground contact surface. Furthermore, the power module comprises a second contact surface on the surface and at least two second power transistors, each of which has a ground contact surface.The at least two second power transistors are arranged directly on the second contact surface and are electrically connected directly to the second contact surface via their respective ground contact surfaces. Furthermore, the power module comprises at least two third contact surfaces on the surface, wherein the at least two second power transistors each have a further contact surface on their sides facing away from the surface of the circuit carrier, and a second power transistor of the at least two second power transistors is electrically connected to one of the at least two third contact surfaces via its further contact surface.The at least two first contact surfaces and the at least two third contact surfaces are arranged alternately one after the other in a longitudinal direction of the power module, and the second contact surface is arranged next to the at least two first contact surfaces and the at least two third contact surfaces, the second contact surface having at least two contact regions, one of the at least two contact regions being located next to each of the at least two first power transistors. The at least two first power transistors each have a further contact surface on their sides facing away from the surface of the circuit carrier, and a first power transistor of the at least two first power transistors is electrically conductively connected via its further contact surface to the respective contact region of the at least two contact regions of the second contact surface located next to it.Here, the at least two contact regions of the second contact surface and the at least two second power transistors are arranged alternately one after the other in the longitudinal direction.

[0004] EP 2 418 925 B1 discloses an electrical contact between a flexible foil having at least one conductor track and at least one electrical contact of a sensor or control device. An end section of the flexible foil is electrically contacted at a contact point by heat input, with the end section of the flexible foil being positioned against protruding electrical contacts at the contact point. The end section of the flexible foil is designed as a waveguide, in particular as a deflection element. Disclosure of the invention

[0005] According to the invention, a power module is proposed, comprising a circuit carrier which comprises a carrier substrate and an electrical insulation layer, wherein the circuit carrier has a first conductor structure with an external contact region and at least one second conductor structure with at least one external contact region and a further, third conductor structure which comprises at least one external contact region, with semiconductor components arranged individually or in groups, wherein a multifunctional frame with a printed circuit board is assigned to the power module and the groups of semiconductor components are arranged in a first level which is spatially separated from a second level in the multifunctional frame. The printed circuit board comprises a number of pins which are inserted into sleeves which are materially joined either to a spacer on the semiconductor component or to an AMB substrate.

[0006] In a further advantageous embodiment of the power module proposed according to the invention, the semiconductor components are arranged individually or in groups on a base of the power module.

[0007] Furthermore, the power module proposed according to the invention is designed such that the power module is connected to a cooling surface either via an adhesive connection, a solder connection, or a sintered connection. These design variants of the connection between the cooling surface and the power module enable a flat and effective heat transfer.

[0008] In a further advantageous embodiment of the power module proposed according to the invention, signal transmission pins injected into the multifunctional frame are designed such that they are pressed into sleeves that are integrally bonded, in particular welded, to the AMB substrate. The signal transmission pins can be connected, for example, via bonding connections to NTCs or the like, so that the temperature of the power module can be measured during operation.

[0009] In a further advantageous embodiment of the power module proposed according to the invention, the circuit board is electrically connected to the multifunctional frame via the pins.

[0010] In the power module proposed according to the invention, it is provided that the multifunctional frame is arranged above or below the power module as seen in the Z direction.

[0011] In the power module proposed according to the invention, it is provided that current-carrying components, in particular a T+ bridge and a T- bridge, are formed one above the other or next to each other within the multifunctional frame in such a way that low-inductive connections are formed.

[0012] In the power module according to the present invention, this and / or the multifunctional frame is at least partially enclosed by a molding compound.

[0013] Furthermore, the invention relates to the use of the power module in an inverter or power electronics for controlling an electric drive of an electrically powered vehicle. Advantages of the invention

[0014] In the solution proposed by the invention, a separation between an active area and a layout area can be achieved by spatially separating the multifunction frame and the power module. The current flow is shifted to a multifunction frame arranged above the power module in the Z direction. This allows for better cooling of the semiconductor components used, arranged individually or in groups, since larger distances can be achieved between the semiconductor components arranged, for example, in groups. Advantageously, the current-carrying paths, such as the T+ path and T- path, are arranged one above the other or next to one another in the multifunction frame, resulting in a low-inductance connection and significantly reducing the resulting switching losses.

[0015] The proposed design of the power module allows its complexity to be significantly reduced, requiring significantly fewer process steps for its manufacture. The service life is increased due to the robust design, as the complexity of the power module is significantly reduced by the arrangement proposed by the invention. Short description of the drawings

[0016] Embodiments of the invention are explained in more detail with reference to the drawings and the following description.

[0017] They show: Fig. 1 a plan view of a first circuit carrier of a power module comprising a carrier substrate and a possible arrangement of semiconductor switches, Fig. 2 a plan view of a power module with separate cooling and layout areas with laterally arranged areas for press-in pins, Fig. 3 an arrangement of a power module mounted on a cooling surface and a multifunctional frame arranged above it in the Z direction, Fig. 4 a perspective top view of a circuit board of the power module, Fig. 5 the circuit board according to Fig. 4, here enclosed by the transparent multifunctional frame, Fig. 6 the top view of the semiconductor components arranged in groups with a circuit board indicated transparently above them, Fig. 7 a sectional view through the arrangement according to Fig. 5, Fig. 8.1 a variant of a contact between the printed circuit board and the semiconductor component, Fig. 8.2 a variant of an electrical contact between a printed circuit board and an AMB substrate and Fig. 8.3 a variant of a signal transmission pin that is electrically contacted with an AMB substrate via a sleeve. Embodiments of the invention

[0018] In the following description of the embodiments of the invention, identical or similar elements are designated by the same reference numerals, whereby a repeated description of these elements is omitted in individual cases. The figures only schematically illustrate the subject matter of the invention.

[0019] Fig. 1 shows a plan view of a power module 12, in particular of its first circuit carrier 14.

[0020] The top view according to Fig. 1 shows that a carrier substrate 40 of the first circuit carrier 14 is provided with a number of conductor structures 18, 20A, 20B, 22. The first circuit carrier 14 extends in an X,Y plane 10, wherein the first circuit carrier 14 is provided with an electrical insulation layer 16. A first conductor structure 18, which has an external contact region 18.2, is located on this layer, separated from one another by channel-shaped interruptions. Furthermore, second conductor structures 20A, 20B are located opposite one another on the first circuit carrier 14, symmetrical to a central longitudinal axis 24 of the power module 12. Each of the two second conductor structures 20A, 20B comprises an external contact region 20A.2, 20B.2. Finally, a third conductor structure 22 is applied to the first circuit carrier 14 or to its electrical insulation layer 16, which has at least one external contact area 22.2.

[0021] The aforementioned conductor structures 18, 20A, 20B, 22 are electrically separated from one another and applied to the first circuit carrier 14 essentially symmetrically to the central longitudinal axis 24. Position 36 denotes an active area, and a layout area surrounding this area for conducting current is designated by reference numeral 38. For example, AMB (Active Metal Brazing), which contains OFC (oxygen-free copper) / Si3N4 / OFC, can be selected as the carrier substrate 40 of the first circuit carrier 14.

[0022] According to the illustration Fig. 2 shows a plan view of the power module 12, wherein in this schematic representation semiconductor components 42 are arranged on active surfaces 36, which may be, for example, transistors, MOSFETs or other semiconductor components that can be used as semiconductor switches. Fig. 2 that a first group 64 of semiconductor components 42 is accommodated on the active surfaces 36. The individual semiconductor components 42 can be designed, for example, as MOSFETs and have control terminals 34 on their outer sides, via which a control (not shown in detail) of the individual semiconductor components 42 of the first group 64 of semiconductor components 42 can be carried out. Analogous to the first group 64, a second group 66 of semiconductor components 42 is arranged, which can also be MOSFETs, on the outer region of which control terminals 34 are each formed. The semiconductor components 42 of the second group 66 of semiconductor components 42 can be controlled from the outside via the control terminals 34, although this is not shown in the illustration according to Fig. 2 is not shown in detail.

[0023] Furthermore, the top view according to Fig. 2 shows that in the Fig. 2, areas are provided on the long sides of the first circuit carrier 14 in the form of a carrier substrate 40, in which press-in pins 76 - 94 are inserted into the plane of the drawing according to Fig. 2. In detail, these are first and second press-in pins 76, 78 as well as third and fourth press-in pins 80, 82 and, arranged opposite one another, fifth and sixth press-in pins 84, 86. In the area of ​​the opposite end face of the first circuit carrier 14, seventh and eighth press-in pins 88, 90 are provided as well as ninth and tenth press-in pins 92, 94. The spatial arrangement of the press-in pins 76, 78, 80, 82, 84, 86, 88, 90, 92, 94 is shown in the illustrations according to Fig. 3 and Fig. 4 for more details.

[0024] According to the side view Fig. 3 shows that a power module 12, shown here from the outside, is mounted with its underside 120 on a cooling surface 106. Viewed in the Z direction 54, a multifunctional frame 50 is located above the power module 12. On the top side of the Fig. In the side view of the multifunction frame 50 shown in Figure 3, the individual press-in pins 76, 78, 80, 82, 84, 86, 88, 90, 92, 94—here located in the same plane of the drawing—protrude vertically upward. The press-in pins 76-94 allow the individual components within the multifunction frame 50 or the power module 12 arranged underneath to be electrically connected in a robust and simple manner.

[0025] According to the illustration Fig. Figure 4 shows a perspective top view of a variant of the power module 12.

[0026] Fig. 4 shows that a printed circuit board 122 (PCB) is arranged above a base 96 of the power module 12. A bottom side 126 of the printed circuit board 122 has a number of semiconductor components 42 arranged on the base 96 of the power module 12 with an AMB substrate 134 interposed therebetween. The AMB substrate 134 is shown in its structure in the Fig. 8.1, 8.2 and 8.3 are presented in more detail.

[0027] The underside 126 of the circuit board 122 contacts the individual semiconductor components 42 via dome-shaped elevations that extend between the underside 126 of the circuit board 122 and, for example, spacer disks 130 that are formed above the semiconductor components 42.

[0028] According to the illustration Fig. 5 shows that the printed circuit board 122 is embedded in the multifunctional frame 50. The multifunctional frame 50 is a plastic component that encloses the printed circuit board 122 in such a way that it is embedded in the multifunctional frame 50. In the illustration according to Fig. 5, the multifunctional frame 50 is shown in a transparent representation.

[0029] On the side of the power module 12 there are various press-in pins 76, 78, 80, 82, 84, via which different areas of the power module 12 are electrically contacted.

[0030] According to the illustration Fig. 6 shows a further perspective view of the base 96 of the power module 12. In the illustration according to Fig. 6 is the semiconductor components 42 according to Fig. 4 covering circuit board 122 is shown as an outline 136, ie reproduced in a transparent representation. Fig. 6 shows that the individual semiconductor components 42 in said groups 64, 66 are arranged adjacent to one another at spatial distances from one another. The individual semiconductor components 42 each comprise a disk-shaped or rectangular spacer 130. In front of each spacer 130 there is a dome-shaped elevation, which provides electrical contact to the underside 126 of the Fig. 6 only in outline 136 shown circuit board 122 according to Fig. 4. Furthermore, Fig. 6 a first dome-shaped connection 140 and a second dome-shaped connection 142 opposite this, via which, for example, an electric drive can be controlled via the power module 12.

[0031] A further, third dome-shaped connection 144 extends centrally from the film capacitor connection 128, which also Fig. 6 printed circuit board 122 shown as outline 136 is contacted on its underside 126.

[0032] Furthermore, according to the perspective view Fig. 6 that, for example, an NTC sensor 138 can be contacted via wire-shaped bond connections 132, so that a temperature measurement of the power module 12 and thus a temperature monitoring of the same is possible.

[0033] The sectional view according to Fig. 7 shows that contact pins, for example pins 146, extend from the underside 126 of the printed circuit board 122, which are either electrically contacted with the AMB substrate 134 or are contacted with the semiconductor components 42 via interposed spacer disks 130, as shown in the Fig. 8.1 and 8.2 are shown in more detail.

[0034] Fig. 8.1 shows, for example, that starting from the underside 126 of the printed circuit board 122, which is embedded in the multifunctional frame 50, a pin 146 extends into a sleeve 150. In the embodiment according to Fig. 8.1, the sleeve 150 is integrally joined, in particular welded, to the top side of the spacer disk 130. Below the sleeve 150 and the spacer 130, the semiconductor component 42 to be contacted is shown, which in turn is applied to the AMB substrate 134, comprising two copper layers and a ceramic layer. The AMB substrate 134, in turn, is connected to the cooling surface 106 via a solder, sinter, or adhesive bond 148.

[0035] While in the illustration according to Fig. 8.1 the electrical contacting of the semiconductor component 42 is shown, can be done via the Fig. In the embodiment shown in Figure 8.2, the printed circuit board 122, or a pin 146 extending from its underside 126, can also be electrically connected to the AMB substrate 134. For this purpose, the pin 146 extending from the underside 126 of the printed circuit board 122 is inserted into the sleeve 150, which in turn is integrally joined to the top side of the AMB substrate 134 by means of a weld.

[0036] With the Fig. The various embodiments of the connection of the printed circuit board 122 to the semiconductor component 42 or to the AMB substrate 134 shown in Figures 8.1 and 8.2 can thus be used to Fig. 6 in the base 96 of the power module 12.

[0037] Fig.Figure 8.3 shows a variant in which a signal transmission pin 152 is pressed into the multifunction frame 50. The signal transmission pin 152 is inserted into the sleeve 150, which in turn is joined, in particular welded, to the upper side of the AMB substrate 134. The AMB substrate 134, comprising two copper layers and a ceramic layer, is connected to the upper side of the cooling surface 106 by means of the solder, sinter, or adhesive connection 148.

[0038] The invention is not limited to the embodiments described here and the aspects highlighted therein. Rather, numerous modifications are possible within the scope of the claims, which are within the scope of one skilled in the art. QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] DE 10 2014 219 998 B4

[0003] EP 2 418 925 B1

[0004]

Claims

[1] Power module (12) with a circuit carrier (14) comprising a carrier substrate (40) and an electrical insulation layer (16), wherein the circuit carrier (14) has a first conductor structure (18) with an external contact area (18.2) and at least one second conductor structure (20A, 20B) with at least one external contact area (20A.2, 20B.2) and a further, third conductor structure (22) comprising at least one external contact area (22.2), with semiconductor components (42) arranged individually or in groups (64, 66), characterized byin that the power module (12) is assigned a multifunctional frame (50) with a printed circuit board (122), wherein the groups (64, 66) of semiconductor components (42) are arranged in a first level (60) which is spatially separated from a second level (62) in the multifunctional frame (50), wherein the printed circuit board (122) comprises a number of pins (146) which are inserted into sleeves (150) which are materially joined either to a spacer (130) on a semiconductor component (42) or to an AMB substrate (134). [2] Power module (12) according to claim 1, characterized by that the semiconductor components (42) are arranged individually or in groups (64, 66) on a base (96) of the power module (12). [3] Power module (12) according to claims 1 or 2, characterized by that the power module (12) is connected to a cooling surface (106) either via an adhesive connection, a solder connection or a sintered connection (148). [4] Power module (12) according to claims 1 to 3, characterized by that signal transmission pins (152) which are injected into the multifunctional frame (50) are pressed into sleeves (150) which are integrally connected, in particular welded, to the AMB substrate (134). [5] Power module (12) according to claims 1 to 4, characterized by that the printed circuit board (122) is electrically connected to the multifunctional frame (50) via the pins (146). [6] Power module (12) according to claims 1 to 5, characterized by that the multifunctional frame (50) is arranged above or below the power module (12) as seen in the Z direction (54). [7] Power module (12) according to claims 1 to 6, characterized by that in the multifunctional frame (50) current-carrying components, in particular a T+ bridge and a T- bridge, are formed one above the other or next to each other, such that a low-inductive connection is formed. [8] Power module (12) according to claims 1 to 7, characterized by that the power module (12) and / or the multifunctional frame (50) is / are at least partially enclosed by a molding compound (108). [9] Power module (12) according to claims 1 to 8, characterized by that signal transmission pins (152) are pressed into the multifunctional frame (50) and inserted into a sleeve (150) which is integrally joined, preferably welded, to an AMB substrate (134). [10] Use of the power module (12) according to one of the preceding claims in an inverter / power electronics for controlling an electric drive of an electrically powered vehicle.

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