Housing with a carrier having a component receiving volume on one side and a repelling structure on the other side

Abstract

A housing (100) comprising an at least partially electrically conductive carrier (102) configured to define a receiving volume (104) therein, an electronic component (106) mounted on the carrier (102) and at least partially housed in the receiving volume (104), and a repelling structure (112) configured to repel an electrically conductive connecting medium (129) and arranged on a part of a surface of the carrier (102) facing away from the receiving volume (104).

Description

BackgroundTechnical area

[0001] Various embodiments generally relate to a housing, an electronic device, and a method of manufacture. Description of the state of the art

[0002] A conventional package may include a semiconductor device mounted on a carrier, such as a leadframe structure, may be electrically connected by a bonding wire extending from the semiconductor device to the carrier, and may be molded using a molding compound as an encapsulant.

[0003] However, there are also non-encapsulated packages, such as a DirectFET° package, in which a semiconductor chip is housed in a receiving volume of a carrier.

[0004] Finding a suitable combination of electrical reliability and thermal performance can still be a challenge. Summary

[0005] There may be a need for a package with high electrical reliability and high thermal performance.

[0006] According to an exemplary embodiment, a housing is provided comprising an at least partially electrically conductive carrier configured to delimit a receiving volume therein, an electronic component mounted on the carrier and at least partially accommodated in the receiving volume, and a repelling structure configured to repel an electrically conductive connecting medium and arranged on a part of a surface (in particular an outer surface) of the carrier facing away from the receiving volume.

[0007] According to another exemplary embodiment, an electronic device is provided comprising a housing having the above-mentioned features and a mounting structure mounted to the housing.

[0008] According to yet another exemplary embodiment, a method for manufacturing a housing is provided, the method comprising: providing an at least partially electrically conductive carrier configured to delimit a receiving volume therein, mounting an electronic component on the carrier and at least partially accommodated in the receiving volume, forming a repelling structure configured to repel an electrically conductive connecting medium, and arranging the repelling structure on a part of a surface of the carrier facing away from the receiving volume.

[0009] According to an exemplary embodiment, a housing is provided with an at least partially electrically conductive carrier, which can be configured to define a preferably flat inner surface surrounded by walls to define a receiving volume in which an electronic component can be arranged and secured. Advantageously, a repelling structure (e.g., a solder resist) for repelling an electrically conductive connecting medium (such as, for example, a solder) can be provided on an outer surface portion of the carrier opposite the inner receiving volume.This can make it possible to connect a mounting structure (such as a heat sink) to the outer surface portion facing the receiving volume without the risk of electrically conductive interconnect medium used to connect the mounting structure to the carrier flowing from the outer surface of the carrier into its inner surface and toward the electronic component, as this can be reliably prevented by the repelling structure. Avoiding unwanted flow of electrically conductive interconnect medium into undesired areas of the package can lead to proper electrical reliability.The ability to create a highly thermally conductive connection between a heat sink and the backside of the at least partially electrically conductive carrier, via the electrically conductive connection medium and the backside of the at least partially electrically conductive carrier, with the main heat source in the form of the housed electronic component can ensure high thermal performance. In short, the described configuration can enable a heat sink to be soldered to the backside of the component receiving carrier without the risk of unwanted solder flow along a potentially wettable outer surface of the carrier toward the receiving volume. Description of further exemplary embodiments

[0010] Further exemplary embodiments of the housing, the electronic device and the method are explained below.

[0011] In the context of the present application, the term "housing" may, in particular, refer to an assembly that may comprise one or more housed electronic components. A partially or fully electrically conductive carrier may also form part of the housing. The components of the housing may be unencapsulated or may be at least partially encapsulated by an encapsulant. Optionally, one or more electrically conductive connecting elements (such as metal pillars, bumps, bond wires, and / or clips) may be implemented in a housing, for example, for electrically coupling and / or mechanically supporting the electronic component.

[0012] In the context of the present application, the term "carrier" may in particular refer to a support structure (which may be at least partially electrically conductive) that serves as mechanical support in a package and that may also contribute to the electrical connection between one or more electronic components and the periphery of the package. In other words, the carrier may fulfill a mechanical support function and / or an electrical connection function. A carrier may comprise or consist of a single part, multiple parts connected via encapsulation or other package components, or a subassembly of carriers. If the carrier forms part of a lead frame, it may be or comprise a die pad.For example, the carrier can be embodied as an electrically conductive plate, particularly made of a metal such as copper, aluminum, or the like, which can be bent to define the receiving volume for the electronic component. A recessed portion of the carrier can form the receiving volume, whereas an opposite, pressed-out portion of the carrier can define a heat dissipation surface for mounting a heat sink thereon.

[0013] In the context of the present application, the term "support formed to define a receiving volume" may, in particular, refer to a support that may be bent, for example, bent three-dimensionally, to define a recess, a cavity, or another type of free volume therein, allowing an electronic component to be mounted on the support and in the receiving volume. For example, such a support for defining a receiving volume may be formed by bending a metal plate. For example, the bending may be of such a type that a can-shaped support for defining a receiving volume may be obtained.

[0014] In the context of the present application, the term "electronic component" may in particular encompass a semiconductor chip (in particular a power semiconductor chip), an active electronic device (such as a transistor), a passive electronic device (such as a capacitor or an inductor or an ohmic resistor), a sensor (such as a microphone, a light sensor, a temperature sensor, or a gas sensor), an actuator (e.g., a loudspeaker), and a microelectromechanical system (MEMS). However, in other embodiments, the electronic component may also be of a different type, such as a mechatronic element, in particular a mechanical switch, etc. In particular, the electronic component may be a semiconductor chip comprising at least one integrated circuit element (such as a diode or a transistor in a surface portion thereof).The electronic component may be a bare die or may already be packaged or encapsulated. Semiconductor chips implemented according to exemplary embodiments may be formed, for example, using silicon technology, gallium nitride technology, silicon carbide technology, etc.

[0015] In the context of the present application, the term "repelling structure configured to repel an electrically conductive connecting medium" may, in particular, refer to a physical structure made of a material and arranged at a position where a flow of an electrically conductive connecting medium (such as a solder, a sintering material, or an electrically conductive adhesive) along the repelling structure is strongly inhibited or even deactivated. For example, the repelling structure may be made of a material that has repelling or non-wetting properties for the electrically conductive connecting medium. For example, the repelling structure may be a solder resist if the electrically conductive connecting medium is a solder. For example, the non-wetting properties of the repelling structure may be at least more pronounced than for surrounding material of the housing.It may be desirable for the repelling structure to be annularly closed to keep the electrically conductive connecting medium within a region defined by the fence-like, annularly closed repelling structure. However, in other embodiments, it may also be possible to configure the repelling structure not as a ring, but as one or more individual physical structures that act as a mechanical and chemical barrier to the electrically conductive connecting medium.

[0016] In the context of the present application, the term "electrically conductive connecting medium" may in particular refer to a material that is capable of conducting electrical current, which is preferably also capable of conducting heat, and which additionally has properties for connecting the carrier to an electronic component and / or to a mounting structure, such as a heat sink and / or a mounting plate (such as a printed circuit board, PCB). Examples of the electrically conductive connecting medium are a solder, a sintering paste, and / or an electrically conductive adhesive (for example, an adhesive comprising metal particles therein). The connecting medium may be a material that can be configured to connect various components to one another, preferably mechanically and electrically.Such a bonding medium may be fluid during processing and may be made solid (especially permanently) by curing, hardening, or the like. Examples of a bonding medium include a solder, an adhesive, or an assembly adhesive, or even a sinterable or semi-sinterable material.

[0017] In the context of the present application, the term "electronic device" may, in particular, refer to a device having electronic functionality and which may include a housing with one or more electronic components and a carrier, as well as one or more exposed electrically conductive structure(s) (such as pads, terminals, leads, etc.). The electronic device may include a mounting base supporting the housing and / or may include a heat sink mounted on the housing, i.e., at least one mounting structure.

[0018] In the context of the present application, the term "mounting structure" may, in particular, refer to a structure that is electrically and / or mechanically and / or thermally coupled to the housing. For example, such a mounting structure may comprise a mounting base (which may, for example, be a printed circuit board (PCB)). The housing may be surface-mounted on the mounting base. Additionally or alternatively, the mounting structure may comprise a heat sink attached to the housing to dissipate heat generated by the housing, for example, primarily generated by the at least one electronic component of the housing during operation.

[0019] In the context of the present application, the term "main surface" of a body may, in particular, refer to the largest body surface of one of the largest body surfaces. For example, a body (such as a carrier or an electronic component) may have two opposing main surfaces separated by body material in a thickness direction and connected to each other by a peripheral edge.

[0020] In one embodiment, the housing comprises a wettable coating (in particular a solderable coating) configured to be wettable by an electrically conductive connecting medium and arranged on at least a part of a heat dissipation surface (in particular an outer heat dissipation surface, which may be planar) of the carrier that faces away from the receiving volume. In other words, the wettable coating may be formed on at least a surface portion of the carrier that faces opposite the concave side of the carrier with the receiving volume. In particular, the wettable coating may be formed on the heat dissipation surface, which may be a top-side outer planar surface of the carrier.

[0021] Advantageously, this can enable a solder connection to be made between the heat dissipation surface and a heat sink, as the solder can properly wet the wettable coating. Advantageously, the repelling structure can prevent a flowable electrically conductive connection medium from flowing away from the heat dissipation surface, for example, to a bottom side of the carrier.

[0022] In the context of the present application, the term "wettable coating" (such as a wettability layer) may, in particular, refer to a film or sheet having a surface property that promotes wetting by an electrically conductive bonding medium (such as solder or adhesive) thereon (e.g., flowable during processing). In particular, wetting may refer to the ability of an electrically conductive bonding medium to maintain contact with a solid surface of the wettable coating, resulting, in particular, from intermolecular interactions when the two are brought together. The degree of wetting may be referred to as wettability and may be determined by a balance of forces between adhesive and cohesive forces.

[0023] In one embodiment, the wettable coating also coats at least a portion of a surface of the carrier facing away from the heat-dissipating surface and delimiting the receiving volume. Thus, a wettable coating can also be present on a concave surface of the carrier. Advantageously, this can enable a solder connection to be established between the surface of the wettable coating on the carrier in the receiving volume and the electronic component to be mounted on the wettable carrier in the receiving volume.

[0024] In one embodiment, the wettable coating coats an entire outer surface of the carrier. This may allow the wettable coating to be formed on the entire surface of the carrier using a single, common manufacturing process, for example, plating, without the need for selective plating or patterning of the wettable coating. Thanks to the repellent structure on the wettable coating, a wettable coating covering the entire surface allows solder flow only in permitted areas, as the repellent structure can act as a mechanical and / or chemical barrier to such solder flow.

[0025] In one embodiment, the wettable coating is configured to wet a solder-like electrically conductive connection medium. Alternatively, the wettable coating may be configured to wet an electrically conductive adhesive or a sintering material.

[0026] In one embodiment, the wettable coating is a plating layer. A plating layer may be a layer formed at least partially by plating, for example, by depositing a metal on a surface (for example, by electroless plating or sputtering). It is possible to perform the plating directly on the carrier, such as a lead frame or a clip.

[0027] In one embodiment, the wettable coating comprises or consists of silver. Silver can exhibit excellent wetting properties, allowing a solder to be distributed homogeneously over a silver surface. Advantageously, silver plating can provide better wetting than other materials (such as copper).

[0028] In one embodiment, the wettable coating comprises silver and / or nickel. In particular, the coating can be a bilayer comprising a bottom nickel layer on the substrate and a top silver layer on the nickel layer. Nickel is solderable, hard, and retains its color. Silver is also solderable, reduces the risk of copper migration, can prevent nickel from oxidizing, and has a pronounced wetting function. In short, a wettable coating comprising silver and nickel can form an excellent solderable film.

[0029] In another embodiment, the wettable coating comprises one of the group comprising or consisting of palladium, gold, titanium, nickel, and NiP.

[0030] Although the wettable coating materials mentioned in the preceding paragraphs may be preferred choices, the wettable coating may be formed from any material having affinity to an implemented electrically conductive interconnect medium (particularly a solder).

[0031] In one embodiment, the repelling structure is formed at least on at least a portion of each of two opposing rails of the carrier. If it is formed at least partially on the rails, unwanted bleeding, creeping, or flowing of a flowable electrically conductive connecting medium from the top side to the bottom side of the carrier across the rails can be reliably prevented.

[0032] In one embodiment, the repelling structure comprises a closed annular structure. According to such a preferred embodiment, the repelling structure can form a circumferentially closed ring, which prevents unintentional bleeding, creeping, or flowing of a flowable electrically conductive connecting medium from the spatial area delimited by the annular structure or the ring. Full circumferential protection against unwanted spreading of a flowable electrically conductive connecting medium can thus be ensured.

[0033] In one embodiment, the repellent structure comprises a solder resist. A solder resist or solder mask may be a stripe, track, or layer of an ink, polymer, paste, laminate, lacquer, or any other dielectric material applied to a surface to prevent solder bleed or solder bridge formation. A solder resist may also serve to prevent oxidation. For example, a solder resist may be based on an epoxy resin. For example, the repellent structure may be embodied as an epoxy mask.

[0034] In one embodiment, the repellent structure is disposed on the wettable coating. If the repellent structure is formed directly on the wettable coating, a flowable electrically conductive connecting medium (e.g., molten solder) flowing along the path of a wettable coating can be directly stopped by the chemical and mechanical barrier in the form of the repellent structure.

[0035] In one embodiment, the repelling structure is arranged on an outer surface of a transition section between a preferably planar outer heat dissipation surface of the carrier and an inner surface of the carrier that delimits the receiving volume. Given such a preferred configuration, the entire area of ​​the (preferably flat) outer heat dissipation surface adjacent to the transition section (preferably a beveled, stepped, or vertical edge section of the carrier) can remain available for heat dissipation, for example, for soldering a heat sink thereon. Furthermore, when arranged on the transition section, the repelling structure can be spatially retracted and thus properly protected from damage.

[0036] In one embodiment, the transition section of the support is curved and / or stepped. For example, the transition section may have a plurality of steps and / or a plurality of curved sections and may also have one or more horizontal platforms. This curved and / or stepped configuration of the transition section allows its interior to laterally delimit the receiving volume, while its exterior can serve as a support surface for the repelling structure.

[0037] In one embodiment, the repelling structure is arranged on a platform (which may be a horizontal platform), in particular on an upper platform (preferably on a top platform), of the transition section, which is retracted downwards with respect to the heat dissipation surface (see for example Fig. 2). According to such a preferred embodiment, the entire heat dissipation surface remains available for heat dissipation purposes, while the repelling structure can nevertheless be formed very close to the upper main surface of the carrier, thereby reliably preventing or limiting the flow of a flowable electrically conductive connecting medium from this region. In other words, solder flow can be spatially confined to the heat dissipation surface, and the flow of molten solder to the lower portion of the transition region can also be prevented by the repelling structure.

[0038] In one embodiment, the repelling structure extends from the upper (or topmost) platform up to and including (in particular partially or completely) a lower (or bottommost) platform of the transition section (see for example Fig. 4). Such a spatially extended configuration of the repelling structure and the corresponding complex shape of the repelling structure, which extends between different platforms and thus different height levels of the transition section, create a complicated and elongated flow path that makes it almost impossible for a flowable, electrically conductive connecting medium to pass through this complex mechanical and chemical barrier. Furthermore, the barrier can also be complex enough to prevent or at least inhibit unwanted moisture creep along the transition section.

[0039] In one embodiment, the repelling structure is arranged on a planar region of the heat dissipation surface (see, for example, Fig. 6). For example, the repulsive structure can form a ring extending along the upper outer surface of the carrier. Such a configuration enables particularly simple fabrication of the repulsive structure on an easily accessible planar surface area. To keep the heat dissipation surface of the carrier as large as possible, the repulsive structure can then be formed along an outer perimeter of the planar heat dissipation surface.

[0040] In one embodiment, the electronic component has at least one terminal connected to the carrier on a main surface on which the electronic component is mounted on the carrier. It is also possible to provide a plurality of terminals connected to the carrier.

[0041] In one embodiment, the electronic component has an exposed terminal, for example a plurality of exposed terminals, at least remote from the carrier. For example, the exposed terminals can be arranged side by side.

[0042] It is also possible for the electronic component to have terminals on both of its opposite main surfaces. For example, the electronic component may be a semiconductor die that experiences vertical current flow between terminals on both of its two opposite main surfaces during operation.

[0043] In one embodiment, the carrier is can-shaped and / or has two opposing rails (see, for example, Fig. 8 and Fig. 9). Based on such a carrier, a DirectFET package ® -type are manufactured.

[0044] In one embodiment, the carrier comprises a lead frame structure, a clip and / or a bent metal plate.

[0045] In the context of the present application, the term "leadframe structure" may, in particular, refer to a sheet-like metal structure that may be bent, stamped, and / or structured to form leadframe structures as mounting portions for mounting chips. In one embodiment, the leadframe may be a metal plate (made, in particular, of copper or a copper-containing alloy) that may be bent and / or structured. Forming the carrier as a leadframe structure is a cost-effective and mechanically and electrically very advantageous configuration, allowing a low-resistance connection of chips to be combined with a robust support capability of the leadframe structure.Furthermore, a leadframe structure can contribute to the thermal conductivity of the package and dissipate heat generated during operation of the chip(s) as a result of the high thermal conductivity of the metallic (particularly copper) material of the leadframe structure. In the context of the present application, the term "clip" may specifically refer to a three-dimensionally curved connecting element comprising an electrically conductive material, such as copper, and being an integral body with portions to be connected to chip terminals and / or a submount.

[0046] In one embodiment, the housing is configured as a discrete housing. In particular, the housing may include a single electronic component. However, in another embodiment, the housing may include a plurality of electronic components mounted on the same carrier. Thus, the housing may also include a plurality of semiconductor components mounted in the receiving volume. Thus, the housing may include one or more semiconductor components (e.g., at least one passive component, such as a capacitor, and at least one active component).

[0047] In one embodiment, the housing is configured as a non-encapsulated housing. Thus, the housing may be free of an encapsulant. Alternatively, the housing may include an encapsulant, such as a molding compound.

[0048] In one embodiment, the package is configured as a power package. For example, the package is configured as a semiconductor power package. For example, an exemplary embodiment of the package may be an intelligent power module (IPM). Another exemplary embodiment of the package is a dual in-line package (DIP). For example, such a DIP may have multiple leads on the can-shaped carrier. For example, the can may be placed over the leads of the DIP and insulated from them.

[0049] In one embodiment, the electronic component is a power semiconductor chip. Thus, the semiconductor component (such as a semiconductor chip) can be used for power applications (e.g., in the automotive sector) and can, for example, comprise at least one integrated insulated-gate bipolar transistor (IGBT) and / or at least one transistor of another type (such as a MOSFET, a JFET, etc.) and / or at least one integrated diode. Such integrated circuit elements can, for example, be manufactured using silicon technology or be based on wide-bandgap semiconductors (such as silicon carbide or gallium nitride). A semiconductor power chip can comprise one or more field-effect transistors, diodes, inverter circuits, half-bridges, full-bridges, drivers, logic circuits, other components, etc.

[0050] In one embodiment, the electronic component comprises a monolithically integrated transistor, in particular a field-effect transistor. Other transistors are possible, for example, a bipolar transistor.

[0051] In one embodiment, the electronic device comprises an electrically conductive connecting medium that electrically connects the housing to the mounting structure. For example, the electrically conductive connecting medium comprises a solder, a sintered material, and / or an electrically conductive adhesive.

[0052] In one embodiment, the electrically conductive connection medium comprises a solder. In the context of the present application, the term "solder" may refer to a solderable material that can be subjected to soldering to thereby establish an electrically conductive solder connection between different components. For example, such a solder structure may be a film or layer of solder or may be a solder bump. For example, it is possible to use a solder paste with lead-based or bismuth-based solder materials. It may also be possible to use a solder structure comprising tin.

[0053] In one embodiment, the electrically conductive bonding medium comprises an assembly adhesive, for example, an electrically conductive adhesive. It is also possible for such an assembly adhesive to be a die-attach paste. The assembly adhesive can also be any resin-based assembly adhesive, including semi-sintered materials and pressure-based sintered materials. Regarding hybrid and semi-sintered materials, a corresponding paste can be a partially adhesive and partially sintered paste, for example, a silver-filled adhesive. Thus, an assembly adhesive can be resin-based, while pure sintered products can be solvent-based. They can be handled using the same or similar methods as other die-attach adhesives. Thus, any resin-based die-attach or assembly materials can be used as the bonding medium.For example, the assembly adhesive can be epoxy-based or based on acrylic, silicone, bismaleimide (BMI) and / or hybrid materials.

[0054] In one embodiment, the mounting structure comprises a heat sink mounted on a heat dissipation surface of the carrier. In the context of the present application, the term "heat sink" may in particular refer to a highly thermally conductive body that may be thermally coupled to the exposed carrier of the package to dissipate heat generated by the electronic component(s) during operation of the package. For example, the heat sink may be made of a material having a thermal conductivity of at least 10 W / mK, in particular at least 50 W / mK, even up to 400 W / mK or even higher. For example, the heat sink may be made of an electrically conductive material such as copper, an alloy of copper and / or aluminum, but may also comprise a ceramic material. The heat sink may be thermally coupled to the carrier directly or indirectly, for example, by solder.For example, the heat sink may comprise a thermally conductive body (such as a metal plate) with a plurality of cooling fins extending from the thermally conductive body. Additionally or alternatively, liquid and / or gas cooling may also be achieved through a heat sink. Thermally coupling the housing with a heat sink can ensure efficient cooling.

[0055] In one embodiment, the mounting structure comprises a mounting base, for example, a laminate board, on which the carrier and / or the electronic component is / are mounted. For example, the mounting base can be a printed circuit board (PCB), an insulated metal substrate (IMS), a direct copper bond (DCB) substrate, or an active metal solder (AMB) substrate. Alternatively to a printed circuit board, another type of laminate carrier can also be implemented as the mounting base.

[0056] For example, the housing can be arranged between a mounting base and a heat sink. For example, rails of the carrier can be soldered to the mounting base. It is also possible for an exposed main surface of the electronic component mounted in the receiving volume of the carrier to be soldered to a mounting base. Thus, the mounting base can form a bottom body of the electronic device. A heat sink can be soldered to the top main surface of the carrier, which faces away from the receiving volume, and can therefore form a top body of the electronic device.

[0057] In one embodiment, the method comprises forming the repellent structure by printing, for example, inkjet printing or three-dimensional printing, optionally followed by curing. In this way, the repellent structure can be produced in a simple and precise manner. Furthermore, using inkjet printing may also make it possible to increase the thickness of the coating by applying multiple layers on top of one another.

[0058] A semiconductor substrate, in particular a silicon substrate, can be used as the substrate or wafer that forms the basis of the semiconductor component(s). Alternatively, a silicon oxide or other insulating substrate can be provided. It is also possible to implement a germanium substrate or a III-V semiconductor material. For example, exemplary embodiments can be implemented using GaN or SiC technology.

[0059] The above and other objects, features and advantages will become apparent from the following description and the appended claims, taken in conjunction with the accompanying drawings, in which like parts or elements are designated by like reference numerals. Short description of the drawings

[0060] The accompanying drawings, which are included to provide a further understanding of example embodiments and constitute a part of the specification, illustrate example embodiments.

[0061] The drawings show: Fig. 1 a cross-sectional view of an electronic device with a housing according to an exemplary embodiment. Fig. 2 a cross-sectional view of the housing of the electronic device according to Fig. 1. Fig. 3 a top view of the housing according to Fig. 2. Fig. 4 a cross-sectional view of a housing according to another exemplary embodiment. Fig. 5 a top view of the housing according to Fig. 4. Fig. 6 a cross-sectional view of a housing according to another exemplary embodiment. Fig. 7 a top view of the housing according to Fig. 6. Fig. 8 a three-dimensional plan view of a carrier with a recessed receiving volume of a housing according to another exemplary embodiment. Fig. 9 a three-dimensional bottom view of the carrier with receiving volume of the housing according to Fig. 8. Fig. 10 is a flowchart of a method for manufacturing a housing according to an exemplary embodiment. Detailed description

[0062] The representation in the drawing is schematic and not to scale.

[0063] Before describing exemplary embodiments in more detail with reference to the figures, some general considerations on the basis of which exemplary embodiments were developed are summarized.

[0064] A DirectFET ® The package may comprise a can-shaped metallic carrier containing at least one surface-mounted electronic component, such as one or more power MOSFET devices. Solderable contacts on the surface of the silicon chip may be provided for connecting the gate and source to a printed circuit board (PCB). A copper clip attached to the back of the chip may provide the drain connection.

[0065] A conventional DirectFET ®A package can be provided with a silver coating only on its underside or inside to enable silver-epoxy adhesion. For example, a Ni / Ag coating can be applied to the inner surface of the carrier. This can promote proper assembly of the electronic component onto the carrier. However, silver is kept away from the top surface of the carrier to prevent tarnishing and excessive potential for silver migration.

[0066] According to an exemplary embodiment, a housing (which may be of a non-encapsulated type) may comprise a (e.g., metallic) carrier having a receiving volume on its front or bottom side for receiving an electronic component (e.g., a semiconductor chip). Advantageously, a (e.g., annular) repelling structure may be provided as a barrier for repelling an electrically conductive interconnect medium and may be formed on an outer surface portion of the back side of the carrier facing away from the receiving volume. Preferably, the repelling structure for repelling an electrically conductive interconnect medium may be a solder resist for repelling solder.Consequently, an electrically conductive connecting medium (such as solder), which may be used, for example, to connect a heat sink or other mounting structure on the back of the carrier, can be reliably prevented from wetting a front surface portion of the carrier in which the electronic component may be mounted. As a result, good electrical reliability can be achieved because the repelling structure can help keep electrically conductive connecting medium only in targeted areas. At the same time, proper heat dissipation can be ensured by the ability to solder a heat sink to the back of the at least partially metallic carrier. This can lead to excellent package performance.For example, the described housing may advantageously allow a heat sink to be soldered to the back of the carrier, while reliably preventing unintentional solder flow to the front side with the electronic component mounted in the receiving volume.

[0067] According to an exemplary embodiment, a repellent structure configured as a solder mask may be applied to a wettable coating to form a silver backside package with solder bleed protection. For example, such a solder mask may enable a solder connection of a heat sink, which may be connected to the backside of the carrier, facing away from the mounting side of the electronic component.

[0068] Advantageously, it may be particularly possible to provide a silver-supported DirectFET°-type package with a repelling structure serving as a solder keep-out zone to enable soldering (for example, a heat sink) to the backside of a can-shaped carrier.

[0069] To promote the transfer of heat through the top surface of a DirectFET° package, a heat sink can be added. Doing this using a non-electrically conductive TIM (thermal interface material) is conventionally an option, although thermal coupling may be limited by the low thermal conductivity of the TIM. However, soldering the heat sink to the can-shaped carrier top surface can enable significantly better heat conduction and may therefore be highly preferred. However, with conventional approaches, this can lead to unwanted solder wetting of unintended surface portions of the carrier (for example, those facing the mounted electronic component), which can result in undefined or irreproducible configurations that pose electrical reliability issues.According to an exemplary embodiment, a repellent structure, such as a solder mask, may be formed, for example, on the outer edge of the carrier, preferably directly on a wettable coating. This may make it possible to reliably prevent a solder—or more generally an electrically conductive bonding medium—from wetting the carrier surface where it is not desired. Furthermore, this may prevent an electrically conductive bonding medium, such as solder, from penetrating beneath the can-shaped carrier and flowing where it is not desired. Thus, the electrical reliability of the package can be improved by providing the described repellent structure.

[0070] At the same time, this can provide the opportunity to solder a heat sink to the back of the carrier, as the solder can be prevented from flowing into unwanted areas by the repelling structure. This, in turn, can lead to significantly improved thermal performance of the package due to the creation of a highly efficient heat flow path from the electronic component, through the carrier and the heat sink, to the surroundings of the electronic device. By transferring heat more efficiently, the package can run at a lower temperature, improving efficiency, and may require less energy for cooling. This can also contribute to a reduction in carbon dioxide emissions. With improved cooling, it can also enable increased operating currents, as Joule heating from the device can be more effectively dissipated due to the improved cooling enabled by exemplary embodiments.

[0071] In a preferred embodiment, the entire can-shaped carrier may be coated with nickel (Ni) and silver (Ag), which may be applied, for example, by plating. Although silver, and particularly a silver-nickel combination, may be preferred, other materials such as gold may also be used. This may enable a heat sink to be soldered to the back of the can-shaped carrier itself to improve overall heat capacity, while also allowing an electronic component to be mounted on the front of the carrier by soldering. To prevent solder wetting on the edges of the can-shaped carrier and beneath the can-shaped carrier, a repellent structure such as a solder mask may be provided, which in a preferred embodiment may sit neatly within the first bottom surface of the can.For example, the repelling structure, which may advantageously be implemented as a solder mask, may be dispensed or printed. Thus, a core of an exemplary embodiment may be to coat the entire can with silver to enable sintering, silver-epoxy bonding, or soldering of a heat sink to the top of the can.

[0072] Therefore, to prevent wetting of unwanted portions of the carrier by electrically conductive connecting medium (especially solder), it can be very advantageous to provide a repellent structure, such as a solder mask, preferably on the edge of the can-shaped carrier. This solder mask can prevent solder from wetting above and below the carrier. The aforementioned positioning of the solder mask can ensure that it does not interfere with the appearance of the package or the positioning of an optional laser marking. For example, the solder mask-type repellent structure can be applied in leadframe form using a dispensing or inkjet process. This can contribute to an efficient, high-throughput manufacturing process on an industrial scale. As a result, it may be possible to solder a heat sink to the top of the can-shaped carrier.To assist this, it may be beneficial to add silver to the back of the case with a solder mask on it.

[0073] Thus, an exemplary embodiment provides a package (such as a discrete package, e.g., a field-effect transistor (FET) package) with a metal can construction of the carrier of the package. A silver coating (preferably a NiAg coating, which may be implemented as a bilayer composed of a bottom nickel layer and a top silver layer) on the backside of the package (which may correspond to a top side of the can-shaped carrier) may advantageously be combined with a solder stop zone in the form of a solder resist-type repelling structure. Advantageously, attachment of a heat sink to the backside of the package may be enabled using an electrically conductive bonding medium, such as a silver-filled epoxy, a sinner, or a solder.

[0074] In a preferred embodiment, the repellent structure forming a solder stop zone can be fabricated by adding a solder mask to prevent overflow of solder material on the underside of the electronic component (in particular a die), thereby preventing tarnishing and excess silver migration.

[0075] Advantageously, a solder mask-type repelling structure in the form of a ring can be added surrounding the first bottom surface of the can-shaped carrier, thereby maintaining the planarity of the structure. Advantageously, reducing (in particular, minimizing) a solder mask area can increase (in particular, maximize) the cooling capacity of the package. Double-sided cooling can also be enabled with such a package configuration.

[0076] Advantageously, a solder mask may be sprayed to form a repellent structure to cover drain edges while preventing solder from moving upward to drain rails. In one embodiment, it may also be possible to spray a solder mask-type repellent structure to cover only the backside of the carrier.

[0077] In short, a solder mask-type repellent structure can inhibit leakage of electrically conductive interconnection medium, such as solder, from a top surface of the carrier, across its sidewalls, downwards, and toward the electronic component. In other words, the repellent structure can prevent parasitic creep of solder—or other electrically conductive interconnection medium—into undesired areas by providing a stopper—in particular, a solder stopper—at the backside of the carrier, which can be implemented, for example, as a leadframe structure or a clip. At the same time, the repellent structure can enable a solder connection to be made on the backside of the carrier with a heat sink to improve thermal reliability.

[0078] Fig. 1 illustrates a cross-sectional view of an electronic device 124 having a housing 100 according to an exemplary embodiment.

[0079] The illustrated electronic device 124 includes the housing 100 and a mounting structure 126 composed of two separate components mounted on the top and bottom of the housing 100, respectively.

[0080] In particular, the top-side component of the mounting structure 126 is embodied here as a heat sink 130 mounted on a heat dissipation surface 110 of the housing 100. The heat sink 130 is configured to efficiently dissipate heat from the top of the housing 100. In the illustrated embodiment, the heat sink 130 includes a highly thermally conductive plate 150 thermally coupled to the top of the housing 100. A plurality of cooling fins 152 extend parallel to each other from the highly thermally conductive plate 150 and are integrally formed therewith. The heat sink 130 may be made of a highly thermally conductive material such as copper, aluminum, or a ceramic. Other embodiments of the heat sink 130 are possible, for example, a water-cooled heat sink, a fan heat sink, a heat sink comprising heat pipes, etc.

[0081] On an underside of the electronic device 124, another component of the mounting structure 126 is provided, which is embodied as a mounting base 132, for example, a laminated board such as a printed circuit board (PCB) or an interposer. A carrier 102 and an electronic component 106 of the housing 100, described in more detail below, are mechanically and electrically mounted on the mounting base 132.

[0082] As shown, an electrically conductive interconnection medium 128 electrically and mechanically connects the carrier 102 and the electronic component 106 of the housing 100. Furthermore, another electrically conductive interconnection medium 127 electrically and mechanically connects the mounting base 132 of the mounting structure 126 to the carrier 102 and the electronic component 106. In particular, the electrically conductive interconnection medium 127 connects exposed pads 154 (such as copper pads) of the PCB-type mounting base 132 to exposed terminals 122, 123 on a lower major surface of the electronic component 106 of the housing 100 and connects further exposed pads 154 to the carrier 102. Similarly, another electrically conductive interconnection medium 129 electrically and mechanically connects the carrier 102 of the housing 100 to the heat sink 130 of the mounting structure 126.In the embodiment shown, the electrically conductive connecting medium 128 comprises, for example, a silver-filled epoxy or hybrid sintering paste or a diffusion solder joint. For example, the electrically conductive connecting medium 129 may be a solder such as an SAC (Sn / Ag / Cu) alloy. For example, the electrically conductive connecting medium 127 may be a different or the same solder. More generally, the electrically conductive connecting medium 127, 128, 129 may be different or the same. For example, the electrically conductive connecting medium 127 and / or 128 and / or 129 may be a solder, a sintering material (such as a sintering paste), and / or an electrically conductive adhesive (such as an epoxy-based adhesive with metal particles therein).The aforementioned connections established by the electrically conductive connecting media 127, 128, 129 ensure the mechanical integrity of the electronic device 124 as a whole. The bottom connections established by the electrically conductive connecting medium 127 can enable electrical signal transmission between the mounting base 132 and components of the housing 100, in particular the electronic component 106 and the carrier 102. The top connection established by the electrically conductive connecting medium 129 can create a highly efficient thermal path from the electronic component 106 (which may be the main heat source during operation of the electronic device 124) through the carrier 102, through the heat sink 130, and from there to an environment of the electronic device 124.The intermediate electrically conductive connecting medium 128 can connect the electronic component 106 and the carrier 102, for example, can realize a die attachment.

[0083] Thus, the electrically conductive interconnect media 127, 128, 129 may include the die-to-substrate material (reference numeral 127), the die attachment material (reference numeral 128), and the heat sink attachment material (reference numeral 129). In particular, the die attachment may be a silver-filled epoxy or hybrid sintered material, the die-to-board attachment material may be a solder, and the heat sink attachment material may be a solder, for example, a different or similar alloy. The heat sink attachment material may also be a sintering paste, etc.

[0084] In particular, a wettable coating 108 coats an entire outer surface of the carrier 102. By coating the entire outer surface of the carrier 102 with the wettable coating 108, the wettable coating 108 promotes a reliable solder connection through the electrically conductive interconnection medium 128 in a receiving volume 104 between the electronic component 106 and the carrier 102 and at the bottom of the carrier 102 to the mounting base 132. On the top side of the carrier 102, the wettable coating 108 promotes a reliable solder connection through the electrically conductive interconnection medium 129 with respect to the heat sink 130. The coating 108 provides a surface that enables a reliable solder connection between the heat sink 130 and the carrier 102, while also providing a surface that enables a reliable die attach connection between the electronic component 106 and the carrier 102.The coating 108 may also enable a reliable solder connection to be formed between the carrier 102 and the mounting base 132 (such as a substrate).

[0085] Advantageously, the wettable coating 108 is configured to wet an (e.g., solder-like) electrically conductive interconnect medium 127, 128, 129. In particular, the coating 108 provides a wettable surface for soldering and a reliable surface for adhering die attach materials. As shown in a detail 160, the wettable coating 108 may be embodied as a double layer comprising a first metal layer 156 and a second metal layer 158 on the first metal layer 156. For example, the first metal layer 156 may be a nickel layer. For example, the second metal layer 158 may be a silver layer. The outer surface of the wettable coating 108 may be configured to promote wetting by the electrically conductive interconnect medium 127, 128, 129, in particular when embodied as solder (e.g., comprising tin).Thus, the wettable coating 108 ensures proper coating by the electrically conductive connecting medium 127, 128, 129 and thus a very reliable connection between the various components of the electronic device 124, which is effected by the electrically conductive connecting medium 127, 128, 129.

[0086] The construction of the housing 100 is described in more detail below: In the embodiment of Fig. 1, the housing 100 comprises an electrically conductive carrier 102 configured to define a receiving volume 104 or cavity therein. For example, the carrier 102 may be a metal plate (made, for example, from copper, an alloy comprising copper, aluminum, an alloy comprising aluminum, or an alloy of aluminum and copper) that is three-dimensionally bent to define the receiving volume 104 or the cavity for receiving an electronic component 106. The carrier 102 may be can-shaped with a central planar plate portion surrounded by at least two opposing sidewalls, preferably four sidewalls arranged along all four surrounding sides of the receiving volume 104. According to Fig. 1, the carrier 102 is can-shaped and has two laterally and downwardly extending opposing rails 134, 136 (which may be referred to as drain rails) that define a transition section 114. This transition section 114 may provide the carrier 102 with a spacer, for example, to keep the underside of the electronic component 106 slightly spaced from the mounting base 132 before a solder connection is made therebetween. For example, the carrier 102 may have a thickness D in a range of 100 µm to 500 µm, for example, 250 µm. For example, the carrier 102 may be embodied as a leadframe structure (which may, for example, be singulated as a can section from a leadframe) or as a clip.

[0087] As already mentioned, the electronic component 106 is mounted on the carrier 102 and housed in the receiving volume 104. In the illustrated embodiment, the housing 100 has only a single electronic component 106 and is a discrete package. Although not shown, a housing 100 may also have a plurality of electronic components 106 housed in the receiving volume 104. Thus, the housing 100 may also be a multi-chip package. According to Fig. 1, the electronic component 106 may be a semiconductor chip, fabricated, for example, using silicon technology or silicon carbide technology. The electronic component 106 may be a power semiconductor chip. For example, the electronic component 106 may be a metal-oxide-semiconductor field-effect transistor (MOSFET) chip. Alternatively, the electronic component 106 may be an insulated-gate bipolar transistor (IGBT) chip. As shown, the electronic component 106 has a plurality of exposed electrically conductive terminals 122, 123 on its bottom side and a terminal 120 connected to the carrier on its top side. For example, the terminal 122 may be a gate terminal, the terminals 123 may be source terminals, and the terminal 120 may be a drain terminal of the field-effect transistor-type electronic component 106.Any other greater or lesser number of terminals on the top and / or bottom of the electronic component 106 is possible in other embodiments. In the embodiment of . Fig. 1, the bottom terminals 122, 123 are solder-connected to the submount 132, whereas the top terminal 120 may be connected to the carrier 102. For example, the die attachment may be silver-filled epoxy, hybrid sinter paste, sinter paste, or diffusion soldering. Particularly in a DirectFET® application, the die attachment may be silver-filled epoxy. However, since the carrier 102 is also solder-connected to the submount 132, the top terminal 120 is also electrically connected to the submount 132 via the carrier 102.

[0088] As already mentioned, the wettable coating 108 covering the entire outer surface of the carrier 102 is very advantageous for ensuring efficient coating of the surface of the carrier 102 with electrically conductive bonding medium 127, 128, 129, preferably solder. In particular, the wettable coating 108 on the upper side of the carrier 102 facing the heat sink 130 can be of greatest advantage, as this allows the heat sink 132 to be connected to the carrier 102 by a highly thermally conductive and mechanically reliable solder joint. One consequence of this is excellent thermal performance of the package 100. However, the excellent wettability of the wettable coating 108 can also lead to a pronounced tendency for the flowable electrically conductive bonding medium 129 to flow into undesired areas of the outer surface of the carrier 102.In particular, without taking further measures, it may happen that a flowable electrically conductive connecting medium 129 (such as molten solder) can flow from the top to the bottom of the carrier 102. This may involve the risk of forming undesirable electrically conductive paths and may inadvertently result in an external appearance of the housing 100 being unreproducible.

[0089] To suppress or even eliminate such undesirable phenomena, it has proven highly advantageous to provide a repellent structure 112 on a selected portion of the outer surface of the wettable coating 108 on the carrier 102. This repellent structure 112 is configured, in particular made of such a material and located in such regions of the wettable coating 108, that it is capable of efficiently repelling electrically conductive connecting medium 129. In particular, the repellent structure 112 can prevent a flowable electrically conductive connecting medium 129 flowing along the wettable coating 108 from passing through the repellent structure 112, which can thus act as a mechanical and chemical barrier for a flowable electrically conductive connecting medium 129.For this purpose, the repelling structure 112 is arranged on a surface portion of the carrier 102 facing away from the receiving volume 104. The repelling structure 112 can be a circumferentially closed ring that surrounds the entire electrically conductive connecting medium 129 formed on the top-side heat dissipation surface 110 and supporting the heat sink 130. Since the receiving volume 104 is formed on an underside of the carrier 102, the repelling structure 112 is arranged on the top side of the carrier 102, which is opposite the underside. Preferably, the repelling structure 112 comprises a solder resist. As shown in FIG. Fig. As shown in Figure 1, the repellent structure 112 can be disposed directly on the wettable coating 108. For example, the repellent structure 112 can be formed as a closed or ring-shaped structure. In one embodiment, the repellent structure 112 can be formed by printing (e.g., three-dimensional printing or inkjet printing).

[0090] Advantageously, the repulsive structure 112 of Fig. 1 on an outer surface of a transition section 114 between the upper heat dissipation surface 110 of the carrier 102, at which the carrier 102 is connected to the heat sink 130, and a lower surface of the carrier 102, which delimits the receiving volume 104. As in Fig. 1, the transition section 114 of the carrier 102 can be formed by curved and stepped sections. Advantageously, the repelling structure 112 is arranged on an upper platform 116 of the transition section 114, which is retracted downward relative to the heat dissipation surface 110. This has advantages: First, arranging the repelling structure 112 on the transition section 114 does not reduce the area of ​​the heat dissipation surface 110 available for heat dissipation, in particular for mounting a heat sink 130 thereon.

[0091] This can ensure excellent thermal performance of the package 100. Second, arranging the repelling structure 112 on the transition section 114 can prevent solder leaking from the heat dissipation surface 110 downward along the transition section 114 from reaching the underside of the carrier 102, and in particular, the receiving volume 104. As a result, the underside of the carrier 102 remains reliably free of creeping solder due to the described arrangement of the repelling structure 112. Thus, configuring the repelling structure 112 as a bottom surface on the transition section 114 can maximize the top-side cooling area of ​​the carrier 102 and can prevent solder creeping from the top side to the bottom side of the carrier 102.

[0092] In the embodiment of Fig. 1, a NiAg bilayer is also applied as a wettable coating 108 to the top of the can-shaped carrier 102 to enable attachment of the heat sink 130 through the electrically conductive bonding medium 129, which may comprise a solder, silver-filled epoxy, or a sinter. In addition to the wettable coating 108 made of NiAg, it may also be highly advantageous to add a solder mask-type repelling structure 112 to prevent overflow of solder material from the underside of the electronic component 108 into the underside of the carrier 102.

[0093] Thus, in the embodiment of Fig. 1, a Ni / Ag coating may be present on the outside of the can-shaped carrier 102 and on the inside of the can-shaped carrier 102. The additional solder mask forming the repellent structure 112 may prevent solder from wetting downward toward the inside of the can.

[0094] Fig. 2 illustrates a cross-sectional view of the housing 100 of the electronic device 124 according to Fig. 1. Fig. Figure 3 illustrates a top view of the housing 100 according to Fig. 2.

[0095] As in Fig. As shown in Figure 3, the repellent structure 112 has a closed annular structure. By providing the repellent structure 112 as a circumferentially closed ring, bleeding of an electrically conductive connecting medium 129 (such as molten solder) along the entire circumference of the carrier 102 can be reliably prevented. This is particularly advantageous when the entire surface of the carrier 102 is coated by the wettable coating 108, as this can promote the flow of solder in any direction.

[0096] More precisely, according to Fig. 2 and Fig. 3, the repellent structure 112 (which is particularly embodied as a solder mask) is provided as a ring surrounding the first underside of the transition portion 114 of the can-shaped carrier 102. This combines reliable protection against solder bleeding with a large area of ​​the heat dissipation surface 110 that is not limited by the repellent structure 112.

[0097] The solder mask-type repellent structure 112 can be formed by inkjet printing and curing on the wettable coating 108. The can-shaped carrier 102 can be in lead frame form. By keeping the solder mask area sufficiently small and away from the heat dissipation surface 110, it may be possible to increase the cooling capacity of the package 100.

[0098] By disposing the solder mask type repellent structure 112 at the lower region of the transition section 114, the planarity of the heat dissipation surface 110 is also maintained, which is fully usable for heat dissipation purposes, for example, for connecting a heat sink 130 thereto by soldering.

[0099] As from Fig. 2, the terminals on the lower main surface of the electronic component 106 may be covered with solder balls or solder bumps, which form the electrically conductive interconnection medium 127 on the underside of the electronic component 106. Between adjacent structures of the electrically conductive interconnection medium 127, the underside of the electronic component 106 may be provided with a patterned electrically insulating passivation layer 162. For example, the passivation layer 162 may be referred to as a chip-level solder mask.

[0100] Fig. 4 is a cross-sectional view of a housing 100 according to another exemplary embodiment. Fig. 5 a top view of the housing 100 according to Fig. 4.

[0101] The embodiment according to Fig. 4 and Fig. 5 differs from the embodiment of Fig. 2 and Fig. 3 in particular by the fact that, according to Fig. 4 and Fig. 5, the repelling structure 112 extends from the upper platform 116 of the transition section 114 up to and including a lower platform 118 of the transition section 114. As in Fig. 5, the repelling structure 112 may be formed on the entire upper surface of both opposing rails 134, 136 of the carrier 102.

[0102] As in Fig. 4 and Fig. 5, the solder mask type repellent structure 112 may be sprayed to also cover the drain edges to prevent solder from moving upwards to the drain rails 134, 136. The embodiment of Fig. 4 and Fig. 5 provides very reliable protection against solder bleeding without affecting the area of ​​the heat dissipation surface 110. Thus, no reduction in the cooling surface capacity and no reduction in the planarity of the housing 100 is caused by the embodiment of Fig. 4 and Fig. 5. Apart from that, the embodiment of Fig. 4 and Fig. 5 may result in an increased and more complex moisture path, so that the repellent structure 112 may also protect the housing 100 from moisture creep.

[0103] Fig. 6 is a cross-sectional view of a housing 100 according to another exemplary embodiment. Fig. 7 a plan view of the housing 100 according to Fig. 6.

[0104] The embodiment according to Fig. 6 and Fig. 7 differs from the embodiment of Fig. 2 and Fig. 3 in particular by the fact that, according to Fig. 6 and Fig. 7, the repulsive structure 112 is arranged on a top-side outer planar region of the heat dissipation surface 110 of the carrier 102. In other words, the repulsive structure 112 can be Fig. 6 and Fig. 7 may be formed on the same vertical plane as the heat dissipation surface 110.

[0105] Thus, the solder mask-type repellent structure 112 can be sprayed to cover only the backside of the carrier 102 and the wettable coating 108 thereon. This can result in a very simple application process for forming the repellent structure 112.

[0106] Fig. 8 illustrates a three-dimensional top view of a carrier 102 with a receiving volume 104 of a housing 100 according to another exemplary embodiment. Fig. Figure 9 illustrates a three-dimensional bottom view of the carrier 102 with recessed receiving volume 104 of the housing 100 according to Fig. 8. Fig. 8 and Fig. 9 do not show any electronic component, but only the carrier 102.

[0107] Thus, the Fig. 8 and Fig. 9, the metallic carrier 102 has a central can region 164 with a cavity-type receiving volume 104 surrounded by four stepped, beveled, or vertical side walls 166. Rod-shaped rails 134, 136 extend laterally outward from two opposite side walls 166.

[0108] Fig. 10 illustrates a flowchart 200 of a method for manufacturing a housing 100 according to an exemplary embodiment. The reference numerals used for the following description of the manufacturing method refer to the embodiments of Fig. 1 and Fig. 9.

[0109] Referring to a block 202, the method comprises: providing an at least partially electrically conductive carrier 102 configured to define a receiving volume 104 therein.

[0110] Referring to a block 204, the method comprises: mounting an electronic component 106 on the carrier 102 and at least partially housed within the receiving volume 104.

[0111] Referring to a block 206, the method comprises: forming a repelling structure 112 configured to repel an electrically conductive interconnect medium 127, 128, 129.

[0112] Referring to a block 208, the method comprises: disposing the repellent structure 112 on a portion of a surface of the carrier 102 facing away from the receiving volume 104.

[0113] In inkjet printing, the forming and dispensing processes can be the same (for example, the material can be dispensed where it is blasted). However, when dip-coating or spray-coating the material, additional processes such as drying, exposing / developing / firing can be performed to pattern the solder mask. In this sense, for inkjet printing, stages 206 and 208 can be combined into one.

[0114] It should be noted that the term "comprising" does not exclude other elements or features, and "a" or "an" does not exclude a plurality. Even elements described in connection with different embodiments may be combined. It should also be noted that reference numerals are not to be construed as limiting the scope of the claims. Furthermore, the scope of the present application is not intended to be limited to the particular embodiments of the process, machine, manufacture, composition of matter, means, methods, and steps described in the specification. Accordingly, the appended claims are intended to include such processes, machines, manufacture, compositions of matter, means, methods, or steps within their scope.

Claims

[1] A housing (100) comprising: • an at least partially electrically conductive carrier (102) which is designed to delimit a receiving volume (104) therein; • an electronic component (106) mounted on the carrier (102) and at least partially housed in the receiving volume (104); and • a repelling structure (112) configured to repel an electrically conductive connecting medium (129) and arranged on a part of a surface of the carrier (102) facing away from the receiving volume (104). [2] The housing (100) according to claim 1, comprising a wettable coating (108) configured to be wettable by an electrically conductive connecting medium (127, 128, 129) and arranged on at least a part of a heat dissipation surface (110) of the carrier (102) facing away from the receiving volume (104). [3] The housing (100) according to claim 2, wherein the wettable coating (108) also coats at least a portion of a surface of the carrier (102) facing away from the heat dissipation surface (110) and defining the receiving volume (104). [4] The housing (100) according to claim 2 or 3, wherein the wettable coating (108) coats an entire outer surface of the carrier (102). [5] The housing (100) according to any one of claims 2 to 4, wherein the wettable coating (108) is configured to wet a solder-like electrically conductive connecting medium (127, 128, 129). [6] The housing (100) according to any one of claims 2 to 5, wherein the wettable coating (108) comprises silver and / or nickel. [7] The housing (100) according to any one of claims 1 to 6, wherein the repelling structure (112) is formed at least on at least a part of two opposite rails (134, 136) of the carrier (102). [8] The housing (100) according to any one of claims 1 to 7, wherein the repelling structure (112) has a closed annular structure. [9] The package (100) according to any one of claims 1 to 8, wherein the repellent structure (112) comprises a solder resist. [10] The housing (100) according to any one of claims 2 to 9, wherein the repellent structure (112) is arranged on the wettable coating (108). [11] The housing (100) according to one of claims 1 to 10, wherein the repelling structure (112) is arranged on an outer surface of a transition section (114) between a preferably planar outer heat dissipation surface (110) of the carrier (102) and an inner surface of the carrier (102) which delimits the receiving volume (104). [12] The housing (100) according to claim 11, wherein the transition section (114) of the carrier (102) is curved and / or stepped. [13] The housing (100) according to claim 11 or 12, wherein the repelling structure (112) is arranged on a platform, in particular on an upper platform (116), of the transition section (114) which is retracted downwards with respect to the heat dissipation surface (110). [14] The housing (100) of claim 13, wherein the repelling structure (112) extends from the upper platform (116) up to and including a lower platform (118) of the transition section (114). [15] The housing (100) according to any one of claims 1 to 14, wherein the repelling structure (112) is arranged on a planar region of the heat dissipation surface (110). [16] The housing (100) according to any one of claims 1 to 15, comprising at least one of the following features: the electronic component (106) has at least one terminal (120) connected to the carrier on a main surface on which the electronic component (106) is mounted on the carrier (102); the electronic component (106) has an exposed terminal (122, 123) at least remote from the carrier (102), for example a plurality of exposed terminals (122, 123); the carrier (102) is can-shaped; the carrier (102) has two opposite rails (134, 136); the carrier (102) comprises a lead frame structure, a clip and / or a bent metal plate; the housing (100) is configured as a discrete housing; the housing (100) is configured as a non-encapsulated housing; the housing (100) is configured as a power housing; the electronic component (106) is a power semiconductor chip; the electronic component (106) has a monolithically integrated transistor, in particular a field-effect transistor. [17] Electronic device (124), comprising: • a housing (100) according to one of claims 1 to 16; and • a mounting structure (126) mounted to the housing (100). [18] The electronic device (124) according to claim 17, comprising at least one of the following features: comprising an electrically conductive connecting medium (127, 129) which electrically connects the housing (100) to the mounting structure (126), wherein, for example, the electrically conductive connecting medium (127, 129) comprises a solder, a sintered material and / or an electrically conductive adhesive; wherein the mounting structure (126) comprises a heat sink (130) mounted on a heat dissipation surface (110) of the carrier (102); wherein the mounting structure (126) comprises a mounting base (132), for example a laminate plate, on which the carrier (102) and / or the electronic component (106) is / are mounted. [19] A method of manufacturing a housing (100), the method comprising: • Providing an at least partially electrically conductive carrier (102) which is designed to delimit a receiving volume (104) therein; • Mounting an electronic component (106) on the carrier (102) and at least partially accommodated in the receiving volume (104); • Forming a repelling structure (112) configured to repel an electrically conductive connecting medium (129); and • Arranging the repulsive structure (112) on a part of a surface of the carrier (102) that faces away from the receiving volume (104). [20] The method according to claim 19, wherein the method comprises forming the repellent structure (112) by printing, for example inkjet printing or three-dimensional printing, optionally followed by curing.

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