Sensor device, method for producing a sensor device, power converter, electric axle drive and motor vehicle

Abstract

A sensor device (100) for a power converter (105) has at least one sensor (110), a spring element (115), and a support element (120). The at least one sensor (110) is designed to sense a temperature of at least one electronic functional unit (108) of the power converter (105). The spring element (115) is designed to resiliently mount the sensor device (100) relative to the power converter (105). The support element (120) forms an arrangement side (130) and a detection side (135). The at least one sensor (110) and the spring element (115) are arranged on the arrangement side (130). When the sensor device (100) is mounted in the power converter (105), the detection side (135) faces the at least one electronic functional unit (108).

Description

[0001] The present invention relates to a sensor device, a method for producing a sensor device, a power converter, an electric axle drive and a motor vehicle.

[0002] Temperature sensors can be used to monitor the heating of, for example, DDPs (Dual Die Packages) in inverters. These can be mounted on additional supports, which can then be installed using hot-staking or screws.

[0003] DE 10 2019 103 117 A1 shows a sensor carrier for a temperature sensor.

[0004] US 5,911,897 A shows a temperature control system.

[0005] US2019 / 0296655 A1 discloses a component for energy conversion of a system of an electrically powered vehicle.

[0006] JP 2012-212 863 A1 shows a semiconductor package with two chambers and a temperature sensor.

[0007] US 2019 / 0319551 A1 shows an inverter module of an electric vehicle.

[0008] DE 10 2020 205 412 A1 discloses a mounting structure for a temperature sensor.

[0009] Against this background, the present invention provides an improved sensor device, an improved method for manufacturing a sensor device, an improved power converter, an improved electric axle drive, and an improved motor vehicle according to the main claims. Advantageous embodiments emerge from the subclaims and the following description.

[0010] The advantages achievable with the approach presented here are, in particular, that a sensor device is created that can reduce tolerances.

[0011] A sensor device for a power converter has at least one sensor, a spring element, and a support element. The at least one sensor is designed to sense a temperature of at least one electronic functional unit of the power converter. The spring element is designed to resiliently mount the sensor device relative to the power converter. The support element forms an arrangement side and a detection side. The at least one sensor and the spring element are arranged on the arrangement side. When the sensor device is mounted in the power converter, the detection side faces the at least one electronic functional unit.

[0012] The electronic functional unit can be, for example, a dual-die package (DDP) or another electrical circuit, for example, with power electronics. When the sensor device is in an operational and assembled state, the sensor device can be reliably fastened, attached, or mounted in the power converter. The electronic functional unit can heat up when in an operational state and / or during operation of the power converter. The radiated heat can be sensed by the sensor. In addition, the heated electronic functional unit and surrounding components can expand. The spring element can compensate for this expansion, wherein the sensor device can be arranged resiliently in the power converter.

[0013] The fastenings can result in a tight tolerance chain, as fewer components are required for assembly. Furthermore, a complex assembly process and additional costs for things like screws and additional or alternative bushings can be eliminated.

[0014] In other words, the tolerance chain can be reduced by using the spring element, which can be arranged on the support element. The sensor device designed in this way, which can also be referred to as a temperature sensor module and / or temperature sensor, can compensate for tolerance fluctuations due to the clamped installation state. The sensor device can be or will be spring-mounted.

[0015] The sensor device comprises a printed circuit board that is or can be arranged on the arrangement side of the carrier element. The at least one sensor is designed as a sensor for surface mounting on the printed circuit board. The sensor can be designed, for example, as a surface-mounted component (SMD) and soldered or mounted on the printed circuit board in some other way. This allows costs to be reduced because drilling in the printed circuit board is no longer necessary. The printed circuit board can therefore be manufactured cost-effectively. In addition, the weight of the printed circuit board can be reduced because connecting wires can be omitted and the sensor can be compact.

[0016] The spring element can be designed as a spiral spring or a leaf spring. The spring element can have a rectangular cross-section. Leaf springs can have a high load capacity and can be manufactured cost-effectively. Spiral springs can also be manufactured cost-effectively.

[0017] The spring element can be attached to the support element. For example, the spring element can be attached to the support element via a snap connection. This can enable a reliable arrangement of the spring element on the support element.

[0018] The spring element can form at least one wing, which can be connected to the support element via a snap connection. The support element can form a locking lug or a locking hook, wherein the wing can engage or snap into the locking lug or the locking hook. This enables a reliable arrangement of the spring element on the support element. The spring element can also form another wing, and the support element can form another locking lug or another locking hook.

[0019] The spring element can have at least one through-opening. The through-opening can be configured to allow electrical connections for the at least one sensor to pass through. This can facilitate electrical contact, particularly with the at least one sensor.

[0020] The support element can have at least one receiving opening. The receiving opening can be formed in the region of the sensor as a through-opening from the arrangement side to the detection side in order to at least partially accommodate the at least one sensor. The at least one receiving opening can also be referred to as a sensor window. This enables a protected and reliable arrangement of the sensor on the sensor device. Furthermore, the sensor can accurately and reliably sense a measured variable to be sensed on the detection side through the receiving opening.

[0021] The sensor can be designed as a temperature sensor. This allows the sensor to reliably, accurately, and quickly measure the temperature of the electronic functional unit, even under temperature-related component stresses.

[0022] The support element can form at least one leg on the detection side for supporting the sensor device on the power converter. The leg can, for example, be inserted into a support element of the power converter to arrange the sensor device reliably, stably, and precisely on the power converter. The support element can form another leg for supporting the sensor device on the power converter to arrange the sensor device even more reliably and stably on the power converter.

[0023] The support element can be shaped as a trough or a rectangular trough. The mounting side can have a recessed portion of the support element. This shape can enable secure accommodation of the circuit board, the spring element, and additionally or alternatively the at least one sensor.

[0024] A method for producing an embodiment of a sensor device mentioned herein comprises a providing step and an arranging step. In the providing step, the at least one sensor, the spring element, and the support element are provided. In the arranging step, the sensor and the spring element are arranged on the arrangement side of the support element to produce the sensor device. More specifically, in the arranging step, the sensor and the spring element are arranged on the support element from the arrangement side. Such an embodiment also allows the advantages of the approach described here to be realized very efficiently.

[0025] A power converter, in particular an inverter, comprises an embodiment of a sensor device mentioned herein and at least one electronic functional unit. The power converter can comprise a plurality of electronic functional units.

[0026] The spring element can be preloaded when the sensor device is mounted in the power converter. If components of the power converter and, additionally or alternatively, the sensor device heat up, the spring element can thus reliably compensate or reduce any resulting tolerances.

[0027] An electric axle drive for a motor vehicle comprises an electric machine, a transmission device, and an embodiment of a power converter mentioned herein. Using the power converter, an electric current required to operate the electric machine can be provided. Using the transmission device, a torque provided by the electric machine can be converted into a drive torque for driving at least one wheel of the motor vehicle. The transmission device can have a gearbox for reducing the speed of the electric machine and optionally a differential.

[0028] A motor vehicle has an embodiment of an electric axle drive mentioned herein and additionally or alternatively an embodiment of a power converter mentioned herein and additionally or alternatively an embodiment of a sensor device mentioned herein.

[0029] The invention is explained in more detail by way of example with reference to the accompanying drawings. They show: Fig. 1 a sectional view of an embodiment of a power converter; Fig. 2 shows an illustration of an embodiment of a sensor device; Fig. 3 shows an illustration of an embodiment of a sensor device; Fig. 4 is a flowchart of an embodiment of a method for manufacturing a sensor device; and Fig. 5 a schematic representation of an embodiment of a motor vehicle.

[0030] In the following description of preferred embodiments of the present invention, the same or similar reference numerals are used for the elements shown in the various figures and having a similar effect, whereby a repeated description of these elements is omitted.

[0031] Fig. 1 shows a sectional view of an exemplary embodiment of a power converter 105 with a sensor device 100 and at least one electronic functional unit 108. More specifically, a section of the power converter 105 is shown, with the power converter 105 and the sensor device 100 shown in section. With respect to the sensor device 100, the sectional view represents a longitudinal section through the sensor device. The power converter 105 is intended, for example, for use in a motor vehicle.

[0032] The sensor device 100 is shown in a state mounted in the power converter 105. The sensor device 100 is arranged adjacent to or in contact with the electronic functional unit 108. The sensor device 100 has at least one sensor 110, a spring element 115, and a support element 120. Optionally, and as shown in the exemplary embodiment presented here, the sensor device 100 has a printed circuit board 125.

[0033] The carrier element 120, which can also be referred to as a carrier, forms an arrangement side 130 and a detection side 135 or has an arrangement side 130 and a detection side 135. The sensor 110 and the spring element 115 are arranged on the arrangement side 130 of the carrier element 120. The sensor 110 and the spring element 115 are mounted on the carrier element 120 from the arrangement side 130 of the carrier element 120. In the assembled state of the sensor device 100 shown here, the arrangement side 130 of the carrier element 120 faces away from the at least one electronic functional unit 108. In the assembled state of the sensor device 100 shown here, the detection side 135 of the carrier element 120 faces the at least one electronic functional unit 108.

[0034] According to one exemplary embodiment, the support element 120 has, for example, a leg 140 and another leg 145 on the detection side 135 in order to support the sensor device 100 on the power converter 105. For example, the legs 140, 145 are plugged onto a support element 150 of the power converter 105 by means of a plug connection. The power converter 105 has, for example, a plurality of the electronic functional units 108, 155, 160. By way of example, only three of the electronic functional units 108, 155, 160 are arranged between the legs 140, 145, with the sensor 110 or one of an optionally provided plurality of sensors 110 being arranged, for example, centrally between the legs 140, 145, above the electronic functional unit 108, on the detection side 135.

[0035] The at least one sensor 110 is configured to sense a temperature of the at least one electronic functional unit 108. For this purpose, the sensor 110 is configured as a temperature sensor. According to one embodiment, the at least one sensor 110 is configured to sense the temperature of the plurality of electronic functional units 108, 155, 160.

[0036] According to one embodiment, the circuit board 125 is arranged on the arrangement side 130 of the carrier element 120. The sensor 110 is designed, for example, as a sensor for surface mounting on the circuit board 125. The at least one sensor 110 is mounted on the circuit board 125, in particular by means of surface mounting. At least a partial section of the circuit board 125 is arranged between the carrier element 120 and the spring element 115.

[0037] The spring element 115 is, for example, arranged at least partially on the circuit board 125. The spring element 115 is designed, for example, as a spiral spring or a leaf spring. The spring element 115 is configured to resiliently mount the sensor device 100 relative to the power converter 105.

[0038] When the power converter 105 is in an operational state, at least one of the electronic functional units 108, 155, 160, which may be DDPs (Double Die Packages), for example, heats up. The radiated heat is sensed as temperature by the sensor 110. Components of the power converter 105 and / or the sensor device 100, such as the electronic functional unit 108, expand, for example, when they heat up, which can lead to tolerance chains that are compensated for or reduced by the spring element 115. In the exemplary embodiment shown here, i.e., when the sensor device 100 is mounted in the power converter 105, the spring element 115 is installed preloaded, so that the tolerance chain is reduced, since the spring element 115 holds the sensor device 100 in position and, if necessary, can deflect further against the spring force of the spring element 115.

[0039] Fig. 2 shows an illustration of an embodiment of a sensor device 100. The sensor device 100 is similar or corresponds to the sensor device of Fig. 1. More specifically, a view, in particular an oblique plan view, of the receiving area 130 of the carrier element 120 is shown.

[0040] The carrier element 120 is formed, for example, as a rectangular trough. The circuit board 125 is arranged in the receiving area 130 of the carrier element 120. The circuit board 125 comprises, for example, a plurality of contact openings 200 for receiving electrical connections 205, which can also be referred to as contacts. According to one embodiment, the circuit board 125 has two of the contact openings 200 in a first edge area 210 of the circuit board 125, wherein the circuit board 125 has two further contact openings 200 in a second edge area 215 of the circuit board 125. The circuit board 125 also comprises two further contact openings 200 in a central area of ​​the circuit board 125, which is shown in the illustration of Fig. 2 is covered by the spring element 115. Each contact opening 200 is designed, for example, to at least partially accommodate an electrical connection 205 or to allow the same to be inserted through. According to the exemplary embodiment shown here, six electrical connections 205 are at least partially passed through the contact openings 200 of the printed circuit board 125.

[0041] The circuit board 125 is, for example, at least partially covered by the spring element 115. According to one embodiment, the spring element 115 is attached to the carrier element 120.

[0042] The spring element 115 is, for example, formed in one piece, wherein the spring element 115 forms or has, for example, only three sections 220, 225, 230. The first section 220 and the second section 225 are, for example, formed identically and at least partially cover the circuit board 125. The third section 230 is formed or arranged between the first section 220 and the second section 225, wherein the third section 230 is at least partially wider than the first section 220 and the second section 225.

[0043] The spring element 115 forms, for example, a wing 235 in the third section 230. According to one embodiment, the wing 235 is snapped and / or engaged into a locking lug 240 of the carrier element 120, thereby creating, for example, a snap connection between the spring element 115 and the carrier element 120. According to one embodiment, the spring element 115 also has a further wing, which is arranged opposite the wing 235 and is shaped identically to the same. The further wing is snapped and / or engaged into a further locking lug of the carrier element 120. The spring element 115 is thus snapped on.

[0044] The leg 140 of the support element 120 is formed, for example, in the region of the first section 220 of the spring element 115, wherein the further leg 145 of the support element 120 is formed, for example, in the region of the second section 225 of the spring element 115.

[0045] According to one embodiment, the spring element 115 has a passage opening 245 and a further passage opening 250. The passage openings 245, 250 are formed, for example, in the third section 230 of the spring element 115. The at least one wing 235 is formed, for example, in the region between the passage openings 245, 250. At least one of the passage openings 245, 250 is designed to allow further electrical connections 255 for the at least one sensor 110 to pass through. According to the embodiment shown here, two electrical connections 255 are at least partially passed through the passage opening 245.

[0046] Fig. 3 shows an illustration of an embodiment of a sensor device 100. The sensor device 100 is similar or corresponds to the sensor device of Fig. 2, where in the representation of Fig. 3 the detection side 135 of the carrier element 120 is shown in an oblique plan view.

[0047] The support element 120 forms the legs 145, 150 on the detection side 135. Additionally or alternatively, the support element 120 has a plurality of receiving openings 300, 305, 310. The receiving openings 300, 305, 310 are formed as through-openings from the arrangement side to the detection side 135, each at least partially accommodating a sensor 110, 315, 320.

[0048] For example, the sensor 110 is at least partially received by the receiving opening 300, wherein a further sensor 315 is at least partially received by the further receiving opening 305, and wherein an additional sensor 320 is at least partially received by the additional receiving opening 310.

[0049] According to one embodiment, the carrier element 120 has further openings 325, 330 formed from the arrangement side to the detection side 135 to allow the electrical connections 205, 255 to pass through. For example, the openings 325, 330 are designed to allow the electrical connections 205 to pass through. The further opening 330 is designed, for example, to allow the further electrical connections 255 to pass through.

[0050] According to one embodiment, the spring element 150 forms the further wing 335, which is latched or snapped onto the further locking lug 340 of the carrier element 120. The sensor 110 is arranged, merely by way of example, between the wings 235, 335 and / or the locking lugs 240, 340 in the receiving opening 300.

[0051] Fig. 4 shows a flowchart of an embodiment of a method 400 for manufacturing a sensor device. The sensor device is similar or corresponds to the sensor device from one of the figures described above. The manufacturing method 400 can thus be implemented to manufacture the sensor device from one of the figures described above or a similar sensor device.

[0052] The method 400 comprises a provision step 405 and an arrangement step 410. In provision step 405, the at least one sensor, the spring element, and the support element are provided. Subsequently, in arrangement step 410, the sensor and the spring element are arranged on the arrangement side of the support element to produce the sensor device.

[0053] Fig.5 shows a schematic representation of an embodiment of a motor vehicle 500. The motor vehicle 500 has the power converter 105 from one of the figures described above or a similar power converter. The power converter 105 has the sensor device 100 described in the previous figures or a similar sensor device.

[0054] The motor vehicle 500 has an electric axle drive 510 with an electric machine 505. Electrical energy for operating the electric machine 505 is provided by a power supply device 502, for example, a battery. For example, the power supply device 502 provides a direct current, which is converted into an alternating current, for example, a three-phase alternating current, using a power converter 105 of the transmission device and supplied to the electric machine 505. A shaft driven by the electric machine 505 is coupled directly or using a transmission device 506 to at least one wheel 508 of the motor vehicle 500. Thus, the motor vehicle 500 can be moved using the electric machine 505.According to one embodiment, the electric axle drive 510 comprises a housing in which the power converter 105, the electric machine 505 and the transmission device 506 are arranged in an integrated manner.

[0055] The exemplary embodiments described and shown in the figures are selected only as examples. Different exemplary embodiments can be combined with one another in their entirety or with regard to individual features. Furthermore, one exemplary embodiment can be supplemented by features of another exemplary embodiment.

[0056] Furthermore, method steps according to the invention can be repeated and carried out in a different order than that described.

[0057] If an embodiment comprises an “and / or” link between a first feature and a second feature, this can be read such that the embodiment according to one embodiment has both the first feature and the second feature and according to another embodiment has either only the first feature or only the second feature. Reference symbol 100 sensor device 105 power converters 108 electronic functional unit 110 Sensor 115 spring element 120 support element 125 circuit board 130 Layout page 135 Capture page 140 Leg 145 additional leg 150 support element 155 second electronic functional unit 160 third electronic functional unit 200 contact opening 205 electrical connection 210 first edge area 215 second edge area 220 first section 225 second section 230 third section 235 wings 240 locking lug 245 passage opening 250 additional passage opening 255 additional electrical connection 300 recording opening 305 additional recording opening 310 additional mounting opening 315 additional sensors 320 additional sensor 325 Opening 330 further opening 335 additional wings 340 additional locking lugs 400 Method for manufacturing a sensor device 405 Deployment Step 410 Step of arranging 500 motor vehicles 502 Energy supply facility 505 electric machine 506 Gearbox device 508 wheel 510 electric axle drive

Claims

[1] Sensor device (100) for a power converter (105), the sensor device (100) having the following features: at least one sensor (110) designed to sense a temperature of at least one electronic functional unit (108) of the power converter (105); a spring element (115) designed to resiliently mount the sensor device (100) relative to the power converter (105); and a carrier element (120) forming an arrangement side (130) and a detection side (135), wherein the at least one sensor (110) and the spring element (115) are arranged on the arrangement side (130), wherein the detection side (135) faces the at least one electronic functional unit (108) in a state of the sensor device (100) mounted in the power converter (105), with a printed circuit board (125) which is arranged or can be arranged on the arrangement side (130) of the carrier element (120), wherein the at least one sensor (110) is designed as a sensor (110) for surface mounting on the printed circuit board (125). [2] Sensor device (100) according to claim 1, wherein the spring element (115) is formed as a bending spring or a leaf spring. [3] Sensor device (100) according to one of the preceding claims, wherein the spring element (115) is attached to the support element (120). [4] Sensor device (100) according to one of the preceding claims, wherein the spring element (115) forms at least one wing (235; 335) which is connected to the carrier element (120) via a snap connection. [5] Sensor device (100) according to one of the preceding claims, wherein the spring element (115) has at least one passage opening (245), wherein the passage opening is designed to allow electrical connections (255) for the at least one sensor (110) to pass through. [6] Sensor device (100) according to one of the preceding claims, wherein the carrier element (120) has at least one receiving opening (200) which is formed in the region of the sensor (110) as a through-opening from the arrangement side (130) to the detection side (135) in order to at least partially receive the at least one sensor (110). [7] Sensor device (100) according to one of the preceding claims, wherein the sensor (110) is designed as a temperature sensor. [8] Sensor device (100) according to one of the preceding claims, wherein the support element (120) on the detection side (135) forms at least one leg (140) for supporting the sensor device (100) on the power converter (105). [9] Sensor device (100) according to one of the preceding claims, wherein the support element (120) is formed as a trough or a rectangular trough. [10] Method (400) for manufacturing a sensor device (100) according to one of claims 1 to 9, wherein the method (400) comprises the following steps: Providing (405) the at least one sensor (110), the spring element (115) and the carrier element (120); and Arranging (410) the sensor (110) and the spring element (115) on the arrangement side (130) of the support element (120) in order to produce the sensor device (100). [11] Power converter (105), in particular inverter, with a sensor device (100) according to one of claims 1 to 9 and with at least one electronic functional unit (108). [12] Power converter (105) according to claim 11, wherein the spring element (115) is prestressed in the state of the sensor device (100) mounted in the power converter (105). [13] Electric axle drive (510) for a motor vehicle (500) with at least one electric machine (505), a transmission device (506) and a power converter (105), characterized by that the power converter (105) is designed according to one of claims 11 to 12. [14] Motor vehicle (500) comprising an electric axle drive (510) according to claim 13 and / or a power converter (105) according to one of claims 11 to 12 and / or a sensor device (100) according to one of claims 1 to 9.

Images